2009NTK Confidential -1-
iNEMI Packaging Substrate Workshop
LICOPTM
Low Inductance Capacitor in Organic Package
2009NTK Confidential -2-
iNEMI Packaging Substrate Workshop
Electrical performance
Fine designFine C4 bump pitch
Thin core
FPPTH
LIVAC (Low Inductance Via Array Capacitor)
Fine Alignment
Fine L/S
Technology Roadmap
Multi layers core
Tight tolerance
High reliability
Via integrity on stacked via
Anti HAST on fine design
Low warpageHybridCore-less
Alternative BU process
CTE matching
2009NTK Confidential -3-
iNEMI Packaging Substrate Workshop
Electrical requirement
Requirement summary
Need enormous cost & time to develop new material system
Low cost substrate
Mechanical requirement
2009NTK Confidential -4-
iNEMI Packaging Substrate Workshop
Concern/Gap
Need low inductance and rigid substrate solution
Need high-C and low-L decoupling capacitorNeed to reduce number of conventional chip capacitor.
Gap #1/Electrical
Gap #2/MechanicalNeed warpage controlCTE matching to low-k die material
2009NTK Confidential -5-
iNEMI Packaging Substrate Workshop
Concept
• Chip capacitor• Organic substrate
Current
BU layerCore layer
Power source
IC chip CC
• Array type ceramic capacitor• Organic substrate
BU layerCore layer
Power source
IC chip
Array type capacitor
HybridOrganic and Ceramic technology combination
Low Inductance Capacitor in Organic PackageLICOPTM
2009NTK Confidential -6-
iNEMI Packaging Substrate Workshop
Diesubstrate
LIVAC
• FeatureArray type capacitor can be located right under the die.
Short distance
Hybrid structure
• Cross section
Capacitor inside
Die
2009NTK Confidential -7-
iNEMI Packaging Substrate Workshop
LIVAC
Low Inductance Via Array CapacitorR
2009NTK Confidential -8-
iNEMI Packaging Substrate Workshop
Via Array type
MLCC
IC ChipSubstrate
NTK had developed the array-type capacitor,“LIVAC”, with low inductance.LIVAC can achieve high speed power delivery.
Array type decoupling capacitor
Power source
Conventional2T type
Peripheralarray type
LW-reversedtype
LIVAC
Current structure
2009NTK Confidential -9-
iNEMI Packaging Substrate Workshop
Electrical featureElectrical property
Low inductance: ~ 1 pH
Structure of LIVAC
- Hundreds of via/termination- Matrix-like arrangement (mutual inductance effect)
Via structure giving extremely low inductance
Multi-layer structure for high capacitance
Via electrode(Ni-based)
Cross-sectional image
-+Ni inner electrode
Dielectrics(BaTiO3)
-+ -+ +
Diesubstrate
2009NTK Confidential -10-
iNEMI Packaging Substrate Workshop
Mechanical features
• Cu plating “Clam-armor” structure• “Peripheral toughening metal layers”
Toughened structure for mechanical reliability
Surface metal structure for adhesion reliability w/ resin material and via connectivity
• Full metal Cu plating surface layer (Roughened w/ chemical etching)
2009NTK Confidential -11-
iNEMI Packaging Substrate Workshop
Young’s modulus
(GPa)
Poisson’s ratio
CTE(10-6/K)
Dielectric material 102 0.35 40 – 120oC: 6.3
140 – 300oC: 11.3
LIVAC 118 0.33 40 – 120oC: 10.1140 – 300oC: 11.9
Item Method Sample size
Young’s modulusPoisson’s ratio
Sing-around(Ultrasonic)
X: 11 mmY: 14 mmt: 0.8 – 0.9 mm
CTE TMAX: 4 mmY: 10 mmt: 0.8 – 0.9 mm
(CTE in Y direction)
t
XY
< Measurement method and sample size >
Mechanical properties of LIVAC
2009NTK Confidential -12-
iNEMI Packaging Substrate Workshop
Electrical Performance
2009NTK Confidential -13-
iNEMI Packaging Substrate Workshop
Electrical characteristicSubstrate ele. characteristic.
C = 37.1 uFL = 2.0 pH
Current Substrate(CC mounted)
Concept
C = 3.5 uFL = 42.1 pH
Schematic comparison
LICOP substrate by embedded ceramic array type capacitor achieves lower inductance and higher capacitance.
DieSubstrate
Low Inductance Via Array Capacitor
Die
Conventional C/Cx 16pcs
37.1 uF1.0 pH
0.22 uF / pc300 pH / pc
Low InductanceCapacitor inOrganic PKG
LICOPTM
LIVACR
2009NTK Confidential -14-
iNEMI Packaging Substrate Workshop
AC voltage drop simulation
Die
Main Board
V.R. LICOPDecuplingCapacitor
LICOP
LIVAC
DieV.R.
Current Substrate
Current SubstrateC/C
Main Board
DecuplingCapacitor
2009NTK Confidential -15-
iNEMI Packaging Substrate Workshop
AC voltage drop simulation
Iload [A]
t0.55 nsec0
8
Vcc : Tr :
Max current : dI/dt :
NTK assumption
1 V0.55 nsec8 A14.5 A/nsec
Simulation input : die load current
2009NTK Confidential -16-
iNEMI Packaging Substrate Workshop
Current Substrate(Inductance : 42.1pH)
AC voltage drop : 96mV AC voltage drop : 29mV
AC voltage drop waveform
Simulation software : Ansoft Designer
LICOP(Inductance : 2.0pH)
LICOP shows much lower AC voltage drop than current substrate due to its lower inductance. (ratio is about 30%)
Volta
ge
1.0
0.8
1.2
[nsec]40 800 20 60
[V]
100
1st drop = 96 mV
Volta
ge
1.0
0.8
1.2
[nsec]40 800 20 60
[V]
100
1st drop = 29 mV
2009NTK Confidential -17-
iNEMI Packaging Substrate Workshop
100
50
0
150
200
250
Current Substrate(Inductance : 42.1pH)
LICOP(Inductance : 2.0pH)
Impedance profile simulation result
LICOP shows much lower Impedance peak than current substrate due to its lower inductance. (ratio is about 23%)
Simulation software : Ansoft Designer
|Z|
100
50
01 10 100 1000
Freq [MHz]
[mΩ]
150
|Z|
01 10 100 1000
Freq [MHz]
Impedance peak43mΩ @ 302MHz
[mΩ]Impedance peak
187mΩ @ 135MHz
200
250
2009NTK Confidential -18-
iNEMI Packaging Substrate Workshop
Electrical performance summary
LICOP Current Substrate
Capacitance 37.1 uF 3.5uF
Inductance 2.0pH 42.1pH
AC voltage drop(dI/dt = 14.5 A/nsec , VDD = 1 V) 29mV 96mV
Impedance peak 43mΩ(@302MHz)
187mΩ(@132MHz)
We confirmed that LICOP shows much better electrical performance due to its lower inductance.
2009NTK Confidential -19-
iNEMI Packaging Substrate Workshop
Mechanical Performance
2009NTK Confidential -20-
iNEMI Packaging Substrate Workshop
Mechanical warpage
-0.080-0.070-0.060-0.050-0.040-0.030-0.020-0.0100.000
0 6 12 18Diagonal distance from Center [mm]
War
page
[mm
]
-0.080
-0.060
-0.040
-0.020
0.000
0.020
0.040
0.060
0 6 12 18
War
page
[mm
]w/array capacitor : 18um
current: 30um
Warpage - Top of Die Warpage - Bottom of Substrate
Warpage of substrate is reduced by LICOP structure.
Diagonal distance from Center [mm]
Current: 71um
Top of Die
Bottom of Substrate
Die
LIVAC Condition: 220 25 deg. CDie Size : 11mm SQ.
(Simulation)
w/array capacitor : 19um
2009NTK Confidential -21-
iNEMI Packaging Substrate Workshop
Warpage after under fill cure
Warpage of substrate is reduced by LICOP structure.It is same as simulation result.
War
page
(um
)
0
0.025
0.05
0.075
0.10
0.125
0.15
LICOP CurrentPKG structure
Warpage16um
Warpage71um
N=20
Warpage measurement results
Warpage
Substrate
Die
PKG Structure•Substrate size: 37.5mmSQ. x 0.8mmt
•Layer count: 4 / 2 / 4*12mmSQ. x 0.8mmt LIVAC embedded
in case of LICOP
2009NTK Confidential -22-
iNEMI Packaging Substrate Workshop
Next step for mechanical investigationWe will conduct 1st level reliability performance comparison..
Input#1 : Substrate structure (LICOP vs control)• Temp cycle killer test • Visual observation• With dummy die attach
Input#2 : Core material properties • Ultra low CTE material effect
2009NTK Confidential -23-
iNEMI Packaging Substrate Workshop
Reliability
2009NTK Confidential -24-
iNEMI Packaging Substrate Workshop
Cond. B -55 - 125 deg.C x 500cycles
Cond. C -65 - 150 deg.C x 90cycles
0/20 unit NGCross sectionCond. A
0 – 100 deg.C x 4000cyclesT/C
(w/ Die)3
0/50 unit NGR shift
0/50 unit NGL shift
0/50 unit NGR shift
0/50 unit NGL shift
T/C(w/ Die)
2
0/50 unit NGIR shift130deg.C、85% R.H.
No bias x 96hr.HAST4
T/S(w/ Die)
1
ResultCheck itemCond.Item#
NTK test vehicle
Summary
Board
Die
PKGBGA ball
UF
LIVAC
Stiffener
Heat spreader
•LICOP 4 / 2 / 4 Structure•LIVAC Size: 12mmSQ. x 0.8mmt
•Core Substrate: 37.5mmSQ. x 0.8mmt
2009NTK Confidential -25-
iNEMI Packaging Substrate Workshop
Board
Die
PKG
BGA ball
UF
LIVAC
Stiffener
Heat spreader
Substrate Structure•LICOP 4 / 2 / 4 Structure•LIVAC Size: 12mmSQ. x 0.8mmt
•PKG Size: 37.5mmSQ.•Core Substrate: 37.5mmSQ. x 0.8mmt
Cross Sectional Observation
Ball integrity
X100
Via integrity on LIVAC pad
LIVAC X1,000
Adhesion b/wLIVAC & molding resin
X500
Bump integrity
X500
LIVAC
2009NTK Confidential -26-
iNEMI Packaging Substrate Workshop
Board
Die
PKG
BGA ball
UF
LIVAC
Stiffener
Heat spreaderSubstrate Structure
•LICOP 4 / 2 / 4 Structure•LIVAC Size: 12mmSQ. x 0.8mmt
•PKG Size: 37.5mmSQ.•Core Substrate: 37.5mmSQ. x 0.8mmt
X500
1st. Level Connection Checkafter T/C-cond.A (0deg.C - 100deg.C) x 4000cycles
X500 X500
Checked 1540 bumps (77 bumps x 20 units) and no issue have been observed.
Left Center Right
2009NTK Confidential -27-
iNEMI Packaging Substrate Workshop
Board
Die
PKG
BGA ball
UF
LIVAC
Stiffener
Heat spreaderSubstrate Structure
•LICOP 4 / 2 / 4 Structure•LIVAC Size: 12mmSQ. x 0.8mmt
•PKG Size: 37.5mmSQ.•Core Substrate: 37.5mmSQ. x 0.8mmt
Via Integrity Checkafter T/C-cond.A (0deg.C - 100deg.C) x 4000cycles
Checked 80 vias (4 vias x 20 units) and no issue have been observed.
X500 X500 X500
2009NTK Confidential -28-
iNEMI Packaging Substrate Workshop
Board
Die
PKG
BGA ball
UF
LIVAC
Stiffener
Heat spreaderSubstrate Structure
•LICOP 4 / 2 / 4 Structure•LIVAC Size: 12mmSQ. x 0.8mmt
•PKG Size: 37.5mmSQ.•Core Substrate: 37.5mmSQ. x 0.8mmt
Adhesion Check b/w LIVAC & Molding Resinafter T/C-cond.A (0deg.C - 100deg.C) x 4000cycles
Checked 40 corner of LIVAC (2 corner x 20 units) and no issue have been observed.
X1000 X1000 X1000
LIVAC LIVAC LIVAC
Moldingresin
Moldingresin
Moldingresin
2009NTK Confidential -29-
iNEMI Packaging Substrate Workshop
Board
Die
PKG
BGA ball
UF
LIVAC
Stiffener
Heat spreaderSubstrate Structure
•LICOP 4 / 2 / 4 Structure•LIVAC Size: 12mmSQ. x 0.8mmt
•PKG Size: 37.5mmSQ.•Core Substrate: 37.5mmSQ. x 0.8mmt
2nd. Level Connection Checkafter T/C-cond.A (0deg.C - 100deg.C) x 4000cycles
Checked 920 balls (46 balls x 20 units) and no issue have been observed.
X100 X100 X100
Left Center Right
2009NTK Confidential -30-
iNEMI Packaging Substrate Workshop
SummaryDeveloped Hybrid structure organic substrate with ceramic via array capacitor inside.
Electrical investigation1. Confirmed advantage on low-L decoupling capacitor. 2. Simulation indicated system level noise can be reduced significantly. 3. Z peak also could reduced.
Mechanical investigation1. Simulation indicated warpage can be reduced by hybrid structure.2. Confirmed good reliability performance including 1st and 2nd
connection.
2009NTK Confidential -31-
iNEMI Packaging Substrate Workshop
Next stepLICOP is ready for customer evaluation. It has been tested
in various condition, and proven reliability and performance.
Develop low cost solution to utilize LICOP substrate formiddle/low end products. (Ex. Standardize array cap size)
2009NTK Confidential -32-
iNEMI Packaging Substrate Workshop
Back Up
2009NTK Confidential -33-
iNEMI Packaging Substrate Workshop
AC Voltage Drop Wave Form
1st Drop : AC voltage drop(caused by Substrate inductance)
Stable Area(caused by Substrate resistance)
2nd Drop (caused by Substrate capacitance)
Idie
tVdie[ V ]1.0
2009NTK Confidential -34-
iNEMI Packaging Substrate Workshop
Core Die modelMain BoardVR Substrate model
Equivalent Circuit Model for Voltage Drop Analysis
0mΩ
1.0V
Cdie
Rdie Iload
L
vr
Rbrd
Ldecap
Rdecap
Cdecap400uF
0.1mΩ
30pH
60pH 0.2mΩ
V
R
VDD
0pH
1.0V
GNDGND
VSS VSS
VDD VDD
2 portS-parameter
Model( Port2 )( Port1 )
(1.0V)
Simulation software : Ansoft Designer
L
vr
vr
brd
2009NTK Confidential -35-
iNEMI Packaging Substrate Workshop
AC Voltage Noise Analysis
AC voltage drop is proportional to dI/dt up to 100 [A/nsec].In each dI/dt condition, AC voltage drop ratio of LICOP substrate compared to current substrate is the same value such as 30%.
2009NTK Confidential -36-
iNEMI Packaging Substrate Workshop
Impedance Profile Overview
Z0(f) : On Die Capacitor (only capacitance curve)Z1(f) : On Substrate Capacitor
(Current Substrate : LSC mounted , LICOP : LIVAC embedded)Z2(f) : Mid-Frequency Capacitor on MBZ3(f) : Bulk Cap on MB
|Z|
freq
Z2(f)
Z3(f)
Z1(f)
Z0(f) Impedance peak(cross point of Z0(f) and Z1(f) )
Capacitance curve of die capacitor
Inductance curve of Substrate capacitor
Mag
nitu
de
Board capacitance curve Substrate capacitance
curveDie capacitance
curveOverall PD Impedance (Impedance Profile)
2009NTK Confidential -37-
iNEMI Packaging Substrate Workshop
(Agilent 8753ES)
Measurement ProbeCascade Microtech
ACP40-GS-250,ACP40-SG-250
Measurement Frequencystart : 30kHz , stop : 6GHz
Network Analyzer
Gore cable
Air Coplanar probe
LICOP
Measurement Padprobing one Vdd bump and
one Vss bump
ESL is extracted frommeasured S-parameter
Electrical Measurement System of LICOP Substrate ESL
2009NTK Confidential -38-
iNEMI Packaging Substrate Workshop
@1GHz
Measurement and Simulation Resultsof LICOP Substrate ESL
Simulation2( To probe all VDD bumps
and all VSS bumps )
Simulation1( To probe one VDD bump
and one VSS bump )
Measurement result( To probe one VDD bump
and one VSS bump )
74.9 pH
ESL (pH)
2.0 pH
ESL (pH)
73.8#3
72.7#4
75.6#5
75.3 pH
78.5
75.8
ESL (pH)
Average
#2
#1
Sample #
2009NTK Confidential -39-
iNEMI Packaging Substrate Workshop
LIVAC Back Up
2009NTK Confidential -40-
iNEMI Packaging Substrate Workshop
Cu-post for Reliability on Via Connection
There is thk gap b/w core substrate and LIVAC because of thk variation and warpage of them. This gap causes issue on via process capability and connectivity.
Our LIVAC can have Cu-post on BGA side in order to eliminate the thk gap. Cu via
LIVAC
50um
Cu-post
50um
Void
LIVAC
Cu via
Issue on via connectivity
NTK solution: Cu-post
Cu post
2009NTK Confidential -41-
iNEMI Packaging Substrate Workshop
3 – 15 mm
0.5 – 1.0 mmt
Dielectrics(BaTiO3-based)
Permittivity: ~ 3,000
Ni inner electrode
Ni outer electrode
Cu plating (20 umt)
Ni-based viaDia.: 90 – 110 umResistivity: 14 x 10-6 ohm cm
Min. 350 um
Min. 500 um
< Typical electrical properties >
C: 20 – 40 uF/cm2 (*)L: ~ 1 pH.cm2
* Depending on LIVAC thk.
Typical LIVAC Design and Properties
2009NTK Confidential -42-
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3.6 x 3.6 5 x 5 8 x 8 10 x 10 12 x 12 24 x 24(under development)
Can connect to plural pwr nets.
Taylor-made LIVAC
Various size and design
Plane (pwr) division
LIVAC has flexibledesign capability andcan be customizedindividually.
2009NTK Confidential -43-
iNEMI Packaging Substrate Workshop
+ - + -
In via array type, the loop inductance canceling effect caused by mutual inductance of current flow is much larger.
+ -Current flow
Via Array TypePeripheral Array Type
Mutual inductance effect
2009NTK Confidential -44-
iNEMI Packaging Substrate Workshop
Electrode Peripheral array type Via array type
Size (mm) 3.2 x 1.6 2.0 x 1.25 ~ 10 x 10
Pad # 2 8 265
Out view
L [pH/pcs] 200 110 1.0
C [µF/pcs] 2.2 2.2 10.0
L [pH/cm2] 10.2 2.8 1.0
C [µF/cm2] 43 88 35
Comparison of inductance