SOIC8 / SO8 BOARD ADAPTER

1. Package SOIC8 dimensions

2. Other packages that have the same pad layout: SOIC8 = SO8 = SOT96 ; SOP8 Links:

http://www.nxp.com/documents/other/Package_x-ref_packing_outlines.pdf http://www.analog.com/en/pcb-design-resources/content/pcb_design_resources/fca.html http://www.onsemi.com/pub_link/Collateral/751-07.PDF http://www.microchip.com/stellent/groups/techpub_sg/documents/packagingspec/en012702.pdf

3. Our PCB board DIL compatible

Pitch Spacing: 2.54mmDistance between connectors 7,61 mmBoard Material: FR4 Epoxy FibreglassHole Diameter: 0,95 mmBoard Height: 11mmBoard Width: 11mmBoard Thickness: 1.5mmCopper Coating : chem. Niquel Gold Copper Thickness: 35mNo. of Copper Sides: 2Solder mask yesROHS Conform

SOIC8p (pitch) 1,27 mmHE 5,8 6,2 mmE 3,8 4 mmD 4,8 - 5 mmb (pad width) 0,36 0,5 mm

CAD drawing of top and bottom layers Bottom copper layer have a pad for easy ground connection

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