Innovative Material Solutions for Communications and Consumer Electronics
More performance, reliability and style. Less compromise.
IMAGINE
Electronics
2
Table of Contents
4-5 Introduction to Dow Corning’s solutions for communications and consumer electronics
6-7 Solutions for hand-held devices
8-9 Solutions for computers
10-11 Solutions for displays
12-13 Solutions for telecommunications equipment
14-15 Solutions for home appliances
16-17 Solutions for wearable/portable devices
18-20 Typical properties: Adhesives/sealants
21-23 Typical properties: Thermally conductive materials
24-25 Typical properties: Conformal coatings
3
26 Features and characteristics of silicones
27 Glossary and common properties
28 Contact information
ABOUT THIS GUIDEProduct recommendations in this guide are based on test results and successful applications under certain conditions. Due to the many variable influences, we cannot guarantee a positive result with our products in every case. Performance and compatibility tests should be carried out prior to final use. For specific application needs, contact your Dow Corning representative.
Specification writers: Values presented in this guide are not intended for use in preparing specifications. Please contact your local Dow Corning sales office or your Global Dow Corning Connection before writing specifications on these products.
D O W C O R N I N G ’ S
SOLUTIONSIn just two decades, communications and consumer electronics have rapidly evolved from devices that fit on the desktop to the backpack to the back pocket. That evolution is only accelerating with each new generation of sleek, wearable devices that integrate seamlessly with our ever more productive and connected lifestyles. These emerging devices present new challenges for designers – over and above the challenges they already face in other applications, from displays to data servers to intelligent kitchen appliances.
Dow Corning, a wholly owned subsidiary of The Dow Chemical Company, offers proven material solutions in bonding, sealing, thermal management and other applications where we can help address challenges across the industry’s supply chain. Furthermore, many of our electronics-grade materials have been UL recognized. Contact us today to learn how we can help you optimize the reliability, protection, safety and aesthetics of your next generation of communications and consumer devices.
for Communications and Consumer Electronics
4
DOW CORNING CORPORATION FAST FACTS*
• 7,000 products and services• 25,000 customers worldwide• 11,000 employees worldwide• 60 offices and manufacturinglocations worldwide
• 3-4 percent investment ofsales into R&D
• 3,059 active patents worldwide*Approximate numbers as of Dec. 31, 2015
5
IMAGINE: More performance, reliability and style. Less compromise.
We rely on our electronics to help us be more productive, smarter and increasingly connected to each other as well as to the Internet of Things (IoT). So, we expect these products – from smartwatches to tablets todishwashers – to be more functional,user-friendly, stylish and dependable.
For more than 70 years, Dow Corning’s versatile materials and expert collab-oration have helped designers of consumer, computing and telecommu-nications electronics bridge the gap between cutting-edge innovation and proven performance.
In addition to simplifying manufacturing and assembly, our versatile silicone adhesives, encapsulants and coatings protect against moisture, vibration and shock to enable more reliable, high-functioning portable electronics and computers and more durable home appliances. Thermal interface materials from Dow Corning deliver further protection against damaging heat to enhance reliability for these products, as well as even higher-performing telecommunications components.
touch-screen displays, while our colorable TPSiV® thermoplastic elastomer materials deliver tough yet silky options for wearable electronics that demand proven performance for safe contact with skin.
As an established global leader in silicone materials and expertise, Dow Corning delivers reliable and consistent supply and support along the entire value chain and for its electronics customers worldwide.
Contact us to learn how we can help your next design raise the standard for consumer electronics, computing and telecommunication electronics.
Our silicone-based solutions can help make device designs look and feel as smart on the outside as they are on the inside. Our easy-to-apply functional surface coatings enable easy-to-clean
Innovative Solutions for Consumer, Computer and Telecommunications Electronics
The new hot-melt adhesiveIMAGINE: Slimmer smart devices manufactured more effectively and efficiently.
Better reliability, protection, aestheticsSilicone solutions for communications and consumer electronics.
Ask an expertHave a question about how Dow Corning can help with your specific business needs or materials for electronics applications? Email us at [email protected].
Hand-Held DevicesMOBILE PHONES, TABLET PCs
Applications: Display module assembly bonding, home key bonding, earphone and speaker bonding
Product: Dow Corning® EA-4600 Hot Melt Adhesive
Benefits: • Instant green strength (high initial strength
instantly after joining the parts)• Good reworkability• Primerless bonding to glass, plastics and metals• Long open time and pot life • Allows for precision micro-beading• Provides environmental sealing, such as
waterproofing – IP67 ingress protection
Application: Electronic device accessories (earbuds, etc.)
Product:TPSiV® thermoplastic elastomer materials
Benefits: • Soft touch and comfort• UV and chemical resistance • Proven skin safety• Bonding to ABS and polycarbonate (PC),
colorability, over-molding capability
Application:Durable and easy-to-clean cover glass coating
Product:Dow Corning® 2634 Coating
Benefits: • Excellent oil and water repellency • Durable surface and reduced-staining properties• Easy-to-clean surface
Application: Printed circuit board (PCB) protection coating
Products: Dow Corning® 1-2577 Conformal Coating Dow Corning® 3-1953 Conformal Coating Dow Corning® 3-1965 Conformal Coating
Benefits: • Ease of application by spraying, dipping
or brushing• Room temperature cure or can be
accelerated with mild heat• Reworkability• Stable and flexible at high temperature• Protection from environmental particulates,
moisture (corrosion) and contaminants• Stress buffer with insulation resistance
6
Application: Waterproof and dustproof sealing
Product:Dow Corning® EA-4600 Hot Melt Adhesive
Benefits: • Allows for precision micro-beading• Instant green strength (high initial strength
instantly after joining the parts)• Good reworkability• Primerless bonding to glass, plastics and
metals• Long open time and pot life• Provides environmental sealing, such as
waterproofing – IP67 ingress protection
Product:Dow Corning® SE-9100 Black Adhesive
Benefits: • More flowable than Dow Corning® EA-4600 Hot
Melt Adhesive• Fast tack-free (fast surface drying)• Good reworkability• Primerless bonding to glass, plastics and
metals• Long open time and pot life• Provides environmental sealing, such as
waterproofing – IP68 ingress protection
Application: Power connector potting
Products:Dow Corning® 3-6876 Adhesive Dow Corning® Q3-6611 Adhesive
Benefits: • Good flowing, filling or self-leveling after
dispensing• Good adhesion to metals by one-part heat cure• Waterproof and dustproof sealing• Stress buffer against shock and drop test• High heat stability against reflow process
Application:Phone bumper
Product:TPSiV® thermoplastic elastomer materials
Benefits: • Soft, silky touch • Excellent sealing • Excellent colorability• Superior UV resistance and chemical resistance;
outstanding durability• Proven skin safety• Bonding to plastic substrates such as PC, ABS;
over-molding capability
Application:Panel gap sealing
Products:Dow Corning® SE-9100 Black Adhesive (reworkable)Dow Corning® SE 9186 Clear or White Adhesive
Benefits: • Room temperature cure; no mixing or oven required• Good flowing, filling or self-leveling after dispensing• Stress buffer against shock and drop test
Application:Speaker module bonding and sealing (sound leakage prevention)
Products:Dow Corning® SE-9100 Black AdhesiveDow Corning® EA-4600 Hot Melt Adhesive
Benefits: • Reworkability• Sound leakage prevention• No mixing or oven required
Product:Dow Corning® SE 9186 Clear or White Adhesive
Benefits: • Sound leakage prevention• Excellent adhesion on plastics (PC housing)• Excellent reliability performance
Application: Mobile phone vibration motor damping (potting)
Product:Dow Corning® SE 9186 Clear or White Adhesive
Benefits: • Room temperature cure; no ovens required• Good flowing, filling or self-leveling after dispensing• Stress buffer against shock and drop test• Excellent adhesion on plastics (PC housing)• Excellent reliability performance
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ComputersDESKTOP PCs, LAPTOPS, AIO PCs
Application: Thermal management of central processing unit (CPU)
Products: Dow Corning® TC-5121C Thermally Conductive CompoundDow Corning® TC-5622 Thermally Conductive CompoundDow Corning® TC-5026 Thermally Conductive CompoundDow Corning® TC-5022 Thermally Conductive Compound
Benefits: • Noncurable (paste type); no oven required
for curing• Easy control of thin bond line thickness (BLT)
for optimum performance• Very low thermal resistivity• Excellent wettability
Application: Thermal management for heat sink module
Products:Dow Corning® 1-4173 Thermally Conductive AdhesiveDow Corning® SE 4450 Thermally Conductive Adhesive
Benefits: • No mixing required• Versatile cure processing controlled by temperature• Able to flow, fill or self-level after dispensing
Application:PCB protection coating
Products:Dow Corning® 1-2577 Conformal Coating Dow Corning® 3-1953 Conformal Coating Dow Corning® 3-1965 Conformal Coating
Benefits: • Ease of application by spraying, dipping
or brushing• Room temperature cure or can be accelerated
with mild heat• Protection from environmental particulates,
moisture (corrosion) and contaminants• Stress buffer with insulation resistance• Repairable• Stable and flexible at high temperature
8
Application: Durable and easy-to-clean cover glass coating
Product: Dow Corning® 2634 Coating
Benefits: • Fingerprint reduction• Easy to clean• Oil and water repellency• Less staining from contaminants
Application: Laptop structural bonding
Product:Dow Corning® EA-4600 Hot Melt Adhesive
Benefits: • Instant green strength (high initial strength
instantly after joining the parts)• Good reworkability• Primerless bonding to glass, plastics and metals• Long open time and pot life• Allows for precision micro-beading• Can provide environmental sealing, such as
waterproofing
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Displays
Application:ITO protection for mid-size display (tablet PC)
Products:Dow Corning® SE 9187 L AdhesiveDow Corning® EA-3000 RTV Black or WhiteDow Corning® EA-2000 Silicone Adhesive
Benefits: • Fast tack-free (fast surface drying)• Low viscosity (flowable for narrow gap or low
thickness)• Noncorrosive cure (alcohol type)• Excellent primerless adhesion to many substrates• Low volatility
Application: ITO protection for small-size display (smartphone)
Products: Dow Corning® EA-3342 Terminal SealantDow Corning® EA-3342HV Terminal SealantDow Corning® EA-3342LV Terminal Sealant1
Benefits: • Low viscosity with controlled flowability• Ultrathin film achievable for electrode and
IC protection• Partially reworkable
Application: Bezel-less TV/monitor frame bonding
Products:Dow Corning® SE 9186 Clear or White AdhesiveDow Corning® SE 9186 L Silicone Adhesive Clear Dow Corning® EA-4600 Hot Melt Adhesive
Benefits: • Room temperature cure; no ovens required• Good flowing, filling or self-leveling after dispensing
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1Dow Corning® EA-3342LV Terminal Sealant cannot be shipped by air.
Application:Bezel-less TV/monitor frame sealing
Product:Dow Corning® SE 9001L Black Adhesive
Benefits: • Good dispensability• Good gap filling after dispensing• Good visual appearance to the naked eye• Improves module reliability
Application:Part fixing
Products:Dow Corning® SE 9186 Clear or White AdhesiveDow Corning® SE 9186 L Silicone Adhesive Clear Dow Corning® EA-4600 Hot Melt Adhesive
Benefits: • Room temperature cure; no ovens required• Good adhesion to many substrates
Application: Gap filler
Products: Dow Corning® SE 9189 L Gray or White RTV AdhesiveDow Corning® SE 9186L Coating
Benefits: • Good flowability/wetting• Adequate adhesion to many substrates• Good appearance after cure• Tack-free time (fast surface drying): 5-8 minutes
Application: Light diffuser for backlight module
Product:Dow Corning Toray EP-2720 Powder
Benefit: • Provides good balance of transmittance and
haze as well as diffusion effect
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Telecommunications
Application:Thermal management for amplifier model
Products:Dow Corning® TC-5121C Thermally Conductive CompoundDow Corning® TC-5021 Thermally Conductive Compound
Benefits: • Low thermal resistance• High thermal conductivity• Thin bond line thickness (BLT)
Application: Thermal management for PCBs
Products: Dow Corning® 3-6652 Thermally Conductive Elastomer Dow Corning® TC-4025 Dispensable Thermal Pad Dow Corning® TC-4015 Dispensable Thermal Pad
Benefits: • Low thermal resistance• High thermal conductivity• Conform to variable level components
Application: Protection for outdoor power units
Products:Dow Corning® 1-2577 Conformal CoatingDow Corning® 3140 RTV Coating
Benefits: • High reliability• Good adhesion• Stable in harsh environments• Very low stress to components
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Application: Thermal management for servers (power units)
Products: Dow Corning® TC-5622 Thermally ConductiveCompoundDow Corning® TC-5026 Thermally ConductiveCompound
Benefits: • Low thermal resistance• High thermal conductivity• Thin bond line thickness (BLT)• Excellent wettability
Application:Thermal management for MOS-SET
Product:Dow Corning® 1-4173 Thermally Conductive Adhesive
Benefits: • Low thermal resistance• High thermal conductivity• High bonding strength
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Home Appliances
Application: Washing machine control unit PCB protection
Products: Dow Corning® 1-2577 Low VOC Conformal CoatingDow Corning® 3-1953 Conformal CoatingDow Corning® 3-1965 Conformal Coating
Benefits: • Excellent dielectric performance• Ease of application by spraying, dipping
or brushing• Protection from environmental particulates,
moisture (corrosion) and contaminants• Stress buffer with insulation resistance• Room temperature cure or can be accelerated
with mild heat• Good adhesion to many substrates• Repairable• Stable and flexible at high temperature
Application: Air conditioner PCB protection
Product: Dow Corning® SE 9187 L Adhesive
Benefits: • Room temperature cure with optional heat
acceleration after solvent flash-off• UV indicator allows for automated inspection• Offers some post-cure abrasion resistance
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Application: Various frequency motor thermal bonding
Product:Dow Corning® TC-1500 Thermally Conductive Adhesive
Benefits: • Short tack-free time• High thermal conductivity• Easy to use without mixing• Room temperature cure without heating
Application: Home appliance housing/surface cover
Product:TPSiV® 4000 Series thermoplastic elastomer materials
Benefits: • Soft and silky-touch feel with slip prevention• Colorful and matte look• Excellent UV resistance• Outstanding scratch resistance
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Wearable & Portable Devices
TPSiV ® in wearable devices Application: Wristbands, watchbands, earbuds, other wearable smart devices
Product: TPSiV ® thermoplastic elastomer materials
Benefits: • Unique silky, soft touch• Excellent colorability and UV stability• Proven skin safety• Excellent bonding to polycarbonate, ABS
and similar polar substrates
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TPSiV® in portable devices, appliances & accessoriesApplication: Enclosure parts and protective covers for portable devices, appliances and accessories to enable aesthetics and hand feel (e.g., smartphones, tablets, laptops, speakers, computer mice, home appliances, robotics)
Product: TPSiV ® thermoplastic elastomer materials
Benefits: • Unique silky, soft touch• Excellent colorability• Matte, patterned or glossy finish• Superior durability• Proven skin safety• Excellent bonding to polycarbonate, ABS
and similar polar substrates
TPSiV® in harsh environmentsApplication: Water-resistant sealing on portable devices
Product: TPSiV® thermoplastic elastomer materials
Benefits: • Superior compression set and mechanical
properties to provide excellent sealing• Excellent bonding to polycarbonate, ABS
and similar polar substrates
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Adhesives/SealantsCategory One part; moisture cure RTV
Product nameDow Corning®
3140 RTV Coating
Dow Corning® 3145 RTV
MIL-A-46146 Adhesive Sealant
Dow Corning® SE 9100 Black
Adhesive
Dow Corning® SE 9120 Clear
Sealant
Dow Corning® SE 9186
Clear or White Adhesive
Dow Corning® SE 9186 L
Silicone Adhesive Clear
Dow Corning® EA-3342 Terminal Sealant
Dow Corning® EA-3342HV
Terminal Sealant
Dow Corning® EA-3342LV
Terminal Sealant
Features MIL-A-46146; noncorrosive Reworkable; fast tack-free
Noncorrosive; fast tack-free Controlled flowability; reworkable within one dayReworkable
Flame retardance UL 94 V-1Low molecular weight of siloxane control grade
• • • •
Potential uses
Rigid andflexible
circuit boards; improved
pin/solder joint coverage
Sealing openings in
modules andhousings;
assembly ofcomponents
on PWB
Assembly of mo-bile modules and display modules; coating of hybrid ICs and PCBs;
encapsulation of electrical devices
LCDmodules
Parts fixing on printed circuit boards
Terminal sealing for ITO protection in small-size displays
Sealing of electronic
equipment and modules
LCD modules
Mixing ratio NA NA NA NA NA NA NA
Appearance
Clear to slightly
hazy; smooth, viscous liquid
Translucent/gray
Black
Translucent(Dow Corning® SE 9120 Clear Sealant)/white (Dow Corning®
SE 9120S White Adhesive)
Translucent,white
Translucent,black Black Blue Black
Viscosity @ 25°C, mPa•S 31,000 Nonflowing 50,000 8,000 64,000 27,000 700 750 370Tack-free time @ 25°C, min 70 55 9 9 8 8 9 8 10
Pot life @ 25°C, hr NA NA NA NA NA NA NA NA NARoom temperature cure time
72 hr @ 25°C/50% RH(1)
48 hr @ 25°C/50% RH(1)
24 hr @ 25°C/50% RH(1) – 24 hr @
25°C/50% RH(1)24 hr @
25°C/50% RH(1) – – –
Physical Properties After CureDensity @ 25°C, g/cm3 1.03 1.10 1.02 1.03 1.03 1.02 1.12 (cured) 1.12 (cured) 1.13 (cured)Durometer – JIS Type A 31 (Shore A) 45 (Shore A) 23 24 20 25 – – 37Tensile strength, MPa 3.0 6.5 2.31 1.5 2.5 1.6 7.4 7.1 6.9Elongation, % 419 660 391 375/400 550 340 400 490 477Linear coefficient of thermal expansion, micron/m °C or ppm
315 370 308 – – – – – –
Thermal conductivity, W/m•K – – – – – – – – –Low-molecular-weight siloxane content, % – – 0.006/0.004 0.0055/0.004 0.0035/0.0045 0.0023/0.0029 – – –
Adhesion Properties After CureLap shear adhesion, N/cm2 – – 30-40/GL 29-40/GL 130/GL 92/GL
Electrical Properties After CureDielectric strength, kV/mm 18 20 23 23 23 23 26 34 28.6Volume resistivity, Ω•cm 2E+14 4E+14 9E+15 7E+15 6E+15 6E+15 5E+15 1E+15 3E+15Dielectric constant @ 1 MHz
2.52 @ 100 kHz
2.83 @ 100 kHz 4.01 2.7 2.7 2.7 2.18
@ 100 kHz2.1
@ 100 kHz2.81
@ 100 kHzDielectric tangent @ 1 MHz
1E-03 @ 100 kHz
<2E-04 @ 100 kHz 1E-03 4E-04 1E-03 1E-03 – – –
(1)3 mm thickness.NA = Not applicable (not measured due to inappropriate test method).– = Not available.
ADHESIVES/SEALANTS
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Dow Corning® SE 9186 Clear or White Adhesive
Temperature, °C
Tack
-free
tim
e, m
in
Cure time, days
Cure
thick
ness
, mm
Dow Corning® SE 9186 Clear or White Adhesive
Temperature, °C
Tack
-free
tim
e, m
in
Cure time, days
Cure
thick
ness
, mm
Adhesives/Sealants
Category One part; moisture cure RTV One part; heat cureTwo part; addition reaction
Product nameDow Corning® SE 9168 RTV
Adhesive
Dow Corning® SE 9001L
Black Adhesive
Dow Corning® SE 9189 L
Gray orWhite RTV Adhesive
Dow Corning® EA-9189
White RTV
Dow Corning® EA-9189 H White RTV Adhesive
Dow Corning® EA-4900
White RTV Adhesive
Dow Corning® SE 1714 Beige or
Black
Dow Corning® Q3-6611 Adhesive
Dow Corning® 3-6876 Gray
Adhesive
Sylgard® 577 Primerless
Silicone Adhesive
Features Noncorrosive; fast tack-free
Adequately flowable; fast
tack-freeNoncorrosive; fast tack-free Noncorrosive; fast tack-free
High tensile strength; high
adhesion strength
High adhesion
Flowable; heat cure; high
tensile strength
Flame retardance UL94 V-0 UL94 V-0 UL94 V-0 UL 94 V-0Low molecular weight of siloxane control grade
• • • •
Potential usesParts fixing on printed
circuit boards
Assembly of mo-bile modules and display modules; coating of hybrid ICs and PCBs; encapsulation
of electrical devices
Parts fixing on printed
circuit boards of power supply
modules; PDP modules
Parts fixing on printed circuit boards of power supplies and CRT, LCD/LED/PDP
ECU; power modules ECU
Sealing lids and housings;
attaching baseplates; sealing for connectors
Sealing for connectors
Mixing ratio NA NA NA NA NA NA NA NA NA 10:1Appearance Gray Black White, gray White White White Beige, black Black, gray Gray GrayViscosity @ 25°C, mPa•S Nonflowing 12,000 22,000 Paste Paste Paste 59,000 92,400 39,900 98,000Tack-free time @ 25°C, min 6.5 8 8 3 2 6 NA NA NA NAPot life @ 25°C, hr NA NA NA NA NA NA NA NA NA 22
Cure time – 24 hr @ 25°C/50% RH(1)
24 hr @ 25°C/50%
RH(1)– – – 0.5 hr
@ 150°C0.5 hr
@ 150°C1 hr @ 125°C;
30 min @ 150°C
1 hr @ 125°C
Physical Properties After CureDensity @ 25°C, g/cm3 1.32 1.03 1.19 1.78 1.68 1.66 1.30 1.32 1.31 1.29Durometer – JIS Type A 44 23 33 – 80 81 66 60 54 (Shore A) 60Tensile strength, MPa 3.69 1.38 2 – 3.9 3.7 7.1 – 3.71 6.8Elongation, % 363 280 220 – 32 30 230 – 207 224Linear coefficient of thermal expansion, micron/m °C or ppm
– 346 – – – – – 250 238 300
Thermal conductivity, W/m•K – – – – 0.88 – 0.3 – –Low-molecular- weight siloxane content, %
0.0035 0.0035/0.004 0.002 0.019 – <0.003 – – –
Adhesion Properties After CureLap shear adhesion, N/cm2 189/GL 46/GL 123/GL 150/GL 225/AL 110/AL 548/AL 586/AL 384/GL 678/AL
Electrical Properties After CureDielectric strength, kV/mm 26 22 25 28 28 25 30 13/14 30 19Volume resistivity, Ω•cm 8E+15 3E+15 9E+14 1E+15 3.3E+15 1.03E+15 5E+15 1.62E+14 9E+14 1E+15Dielectric constant @ 1 MHz 3.2 3.67 3.1 – 2.59
@ 100 kHz3.71
@ 100 kHz 3.1 3 @ 100 kHz 4.4 2.8 @ 100 kHz
Dielectric tangent @ 1 MHz 2E-03 1.5E-03 4E-03 – 9E-03
@ 100 kHz12E-03
@ 100 kHz 3E-03 3.1E-03 @ 100 kHz 1.6E-03 <4E-04
@ 100 kHz(1)3 mm thickness. NA = Not applicable (not measured due to inappropriate test method).– = Not available.
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Adhesives/Sealants Thermal Potting/EncapsulantsCategory Two part; heat cure elastomer Two part; heat cure elastomer
Product nameDow Corning®
EE-1840 A&B Kit
Sylgard® 160 Silicone
Elastomer
Sylgard® 170 Silicone
ElastomerDow Corning®
SE 1816 CV KitSylgard®
184 Silicone Elastomer
Dow Corning® SE 1740
Sylgard® 567 Primerless
Silicone Encapsulant
Dow Corning® CN 8760 Thermally
Conductive Encapsulant
Dow Corning® CN 8760 G Thermally
Conductive Encapsulant
Features Self-priming adhesion
Room temperature
cure
MIL-PRF-23586F; room temperature
cure
Moderate- temperature
cureTransparent
Moderate- temperature
cure; transparent
Flowable; self-priming adhesion; heat cure
Thermally conductive;
low cost; reworkable
Thermally con-ductive; low cost;
reworkable; higher UL grade than
Dow Corning® CN 8760 Thermally
Conductive Encapsulant
Flame retardance UL 94 V-1 UL 94 V-0 UL 94 V-0 UL 94 V-0Low molecular weight of siloxane control grade
• NA NA
Potential uses LED modules
General potting applications; power supplies; connectors; sensors; industrial controls;
transformers; amplifiers; high-voltage register packs; relays
Flyback transformers; power supply
modules
Sensor potting; PDMS
moldsLED modules LED drivers; parking systems
Mixing ratio 1:1 1:1 1:1 1:1 10:1 1:1 1:1 1:1 1:1Appearance Black Dark gray to
black Black Black Transparent Transparent Black Black BlackViscosity @ 25°C, mPa•S(1) 1,125 Part A: 6,000;
Part B: 3,730 2,135 2,600 3,500 925 Part A: 2,060; Part B: 570 2,850 3,200
Pot life @ 25°C, hr(2) 0.2 0.33 0.25 >24 1.5 >24 – 2 1.67
Cure time 168 hr @ 25°C 24 hr @ 25°C; 4 min @ 100°C
24 hr @ 25°C; 10 min
@ 100°C1 hr @ 100°C 0.33 hr
@ 125°C 0.5 hr @ 80°C 0.25 hr @ 150°C
40 min @ 50°C
24 hr @ 25°C; 30 min @ 60°C
Physical Properties After CureDensity @ 25°C, g/cm3 1.01 Part A: 1.61;
Part B: 1.60Part A: 1.37; Part B: 1.37 1.35 1.03 1.00 1.24 1.6 1.58
Durometer – JIS Type A 22 56 47 35 43 35 (Shore 00) 40 52 45Penetration – JIS K2220, mm/10 – – – – – – – – –Tensile strength, MPa 0.6 4.2 – 2.9 – – – 1.83 1.8Elongation, % 185 104 – 230 – – – 95 85Linear coefficient of thermal expan-sion, micron/m °C or ppm
– 200 275 – 340 – – 300 –
Thermal conductivity, W/m•K – 0.62 – 0.42 – – 0.29 0.66 0.67Low-molecular- weight siloxane content, %
– – – 0.05 – – – – –
Adhesion Properties After CureLap shear adhesion, N/cm2 35/AL NA NA 150/AL – 20/GL 100/AL NA NA
Electrical Properties After CureDielectric strength, kV/mm 17 19 18 26 19 17 21 32 24Volume resistivity, Ω•cm 3.2E+15 6E+14 3E+15 2E+15 3E+14 1E+15 2.1E+15 1E+17 1E+17Dielectric constant @ 1 MHz 3.1 3.45 @ 100
kHz3.16 @ 100
kHz 4.3 2.7 @ 100 kHz 2.8 2.8 @ 100 kHz 2.69 2.66Dielectric tangent @ 1 MHz 2.7E-03 1E-03 @ 100
kHz8E-04 @ 100
kHz 1E-03 1E-03 @ 100 kHz 1E-05 2E-03 @ 100
kHz 3E-03 6E-02(1)Mixed viscosity.(2)Pot life after mixing.NA = Not applicable (not measured due to inappropriate test method).– = Not available.
ADHESIVES/SEALANTS
20
THERMALLY CONDUCTIVE MATERIALS
21
Thermal Interface Materials Thermally Conductive MaterialsCategory Thermal grease compound Thermal grease compound
Product name
Dow Corning® SE 4490 CV
Thermally Conductive Compound
Dow Corning® TC-5022 Thermally
Conductive Compound
Dow Corning® TC-5026 Thermally
Conductive
Dow Corning® TC-5121C Thermally
Conductive Compound
Dow Corning®
TC-5622 Thermally
ConductiveCompound
Dow Corning® CN-8880 Thermal Grease
Dow Corning® SC 102
Compound
Dow Corning® 340 Heat Sink
Compound
Features High thermal conductivity Low thermal resistance; high thermal conductivity
Medium thermal conductivity; low oil penetration
Low oil penetration
Flame retardance UL 94 V-0
Low molecular weight of siloxane control grade
•
Potential usesThermistors;
power IC; power modules; CPU
peripherals
Thermal management
of CPUsThermal interface material for CPUs
Thermal coupling of medium-voltage electrical/electronic
devices to heat sinks
Thermal interface material for CPUs
Transistors; diodes; rectifiers
Thermal coupling of electrical/
electronic devices to heat sinks
Mixing ratio NA NA NA NA NA NA NA NAAppearance White Gray Gray Greenish yellow Gray White White WhiteViscosity @ 25°C, mPa•S 520 77 102 85.7 95 836 29,000 542,000Oil separation – JIS K2220, % 0.00 – – – – <0.01 0.144(1) 0.35(1)
Volatile contents, % 0.04 0.05 0.05 0.30 – 0.14 0.3 0.27Tack-free time, min NA NA NA NA NA NA NA –Pot life @ 25°C, hr NA NA NA NA NA NA NA –Cure time NA NA NA NA NA NA NA NA
Physical Properties After CureDensity @ 25°C, g/cm3 2.63 3.23 3.53 4.00 2.53 2.15 2.45 2.13Durometer – JIS Type A NA NA NA NA NA NA NA NAPenetration – JIS K2207, mm/10 NA NA NA NA NA NA NA –Tensile strength, MPa NA NA NA NA NA NA NA NAElongation, % NA NA NA NA NA NA NA NALinear coefficient of thermal expansion,micron/m °C or ppm
– – – – – – – –
Thermal conductivity, W/m•K 1.91 4.4 2.87 2.9 4.3 1 0.9 0.68Low-molecular-weight siloxane content, % 0.025 – – – – – NA –
Adhesion Properties After CureLap shear adhesion, N/cm2 NA NA NA NA NA NA NA NA
Electrical Properties After CureThermal resistance @ 40 psi, °C*cm2/W 0.77 0.061 0.03 0.09 0.06 – 0.62 –Dielectric strength, kV/mm – 3 8.94 5 – 8.7 2 –Volume resistivity, Ω•cm 2E+14 5E+10 5.9E+11 – – 3E+15 2E+16 –Dielectric constant @ 1 MHz 4.8 @ 50 Hz 18 @ 1 kHz 7.4 @ 1 kHz – – – 4.0 @ 50 Hz –Dielectric tangent @ 1 MHz 1E-03 @ 50 Hz 0.562 @ 1 kHz 0.0003 @ 1 kHz – – – 2E-02 @ 50 Hz –
(1)24 hr @ 120°C. NA = Not applicable (not measured due to inappropriate test method).– = Not available.
Thermally Conductive MaterialsCategory One part; moisture cure thermally conductive adhesive
Product nameDow Corning® SE 4420 Thermally Conductive
Adhesive
Dow Corning® SE 4486 Thermally Conductive
Adhesive
Dow Corning® SE 4485 Thermally Conductive
AdhesiveDow Corning® SE 9184
White RTVDow Corning® TC-1500 Thermally Conductive
AdhesiveFeatures High thermal conductivity High thermal conductivity;
short tack-free timeFlame retardance UL 94 V-0Low molecular weight of siloxane control grade • • •
Potential uses Power supply parts; inkjets; dot printer heads; ECU; adhesion to heat sink of driver IC PDP modules
Parts fixing on printed circuit board power supply
modules
AC variable-frequency motors; adhesion between motor driver modules and
motor shellsMixing ratio NA NA NA NA NAAppearance White White White White WhiteViscosity @ 25°C, mPa•S 108,000 19,600 230,000 Nonflowing NonflowingPenetration – JIS K2220, mm/10 (worked 60 times) NA NA NA NA NAOil separation – JIS K2220, % NA NA NA NA NAVolatile contents, % NA NA NA NA NATack-free time, min 8.11 4 9.78 3 2Pot life @ 25°C, hr NA NA NA NA NACure time – – – – –
Physical Properties After CureDensity @ 25°C, g/cm3 2.26 2.59 2.90 2.22 2.32Durometer – JIS Type A 76 81 90.4 74 82Penetration – JIS K2207, mm/10 NA NA NA NA NATensile strength, MPa 4.14 3.94 3.39 3.17 2.7Elongation, % 77.5 43 – 60 –Linear coefficient of thermal expansion, micron/m °C or ppm
– – – – –
Thermal conductivity, W/m•K 0.92 1.59 2.8 0.84 1.55Low-molecular-weight siloxane content, % – 0.0008 0.0007 0.0022 –
Adhesion Properties After CureLap shear adhesion, N/cm2 267/AL 165/GL 116/GL 170/GL 140/AL
Electrical Properties After CureDielectric strength, kV/mm 28 20 19 20 18Volume resistivity, Ω•cm 1E+15 2E+14 8E+14 2E+15 5E+15Dielectric constant @ 1 MHz 4.1 4.8 5.6 3.9 3.5 @ 100 kHzDielectric tangent @ 1 MHz 2E-03 3E-03 5E-03 2E-03 –
NA = Not applicable (not measured due to inappropriate test method).– = Not available.
THERMAL CONDUCTIVITY UNIT CONVERSION CHARTW/m•K cal/cm•sec•°C kcal/m•h•k Btu/ft•h•°F Btu/in•h•°F
1 W/m•K 1.0 2.388x10-3 0.8598 0.5778 6.9331 cal/cm•sec•°C 418.7 1.0x10-3 60.0 241.9 2,9031 kcal/m•h•k 1.163 2.778x10-3 1.0 0.6720 8.0641 Btu/ft•h•°F 1.731 4.134x10-3 1.448 1.0 12.001 Btu/in•h•°F 0.1442 3.445x10-4 0.124 8.333x10-2 1.0
THERMALLY CONDUCTIVE MATERIALS
22
Thermally Conductive MaterialsCategory One part; heat cure thermally conductive adhesive Two part; moisture cure/heat
cure printable or dispensable pad
Product nameDow Corning® SE 4450 Thermally Conductive
Adhesive
Dow Corning® 1-4173 Thermally Conductive
Adhesive
Dow Corning® 3-1818 Thermally Conductive
Adhesive
Dow Corning® 3-6752 Thermally Conductive
AdhesiveDow Corning® TC-4025
Dispensable Thermal Pad
Features High thermal conductivity Primerless adhesion, includ-ing 0.178 mm glass bead
Primerless adhesion; fast cure
High thermal conductivity; low stress;
reworkableFlame retardance UL 94 V-0 UL 94 V-0Low molecular weight of siloxane control grade
Potential uses Power supply parts; inkjets; dot printer heads; ECU; adhesion to heat sink of driver IC
LED lamps and luminaires; automotive and
consumer applications
Mixing ratio NA NA NA NA 1:1Appearance Gray Gray Gray Gray BlueViscosity @ 25°C, mPa•S 66,400 61,372 75,854 83,300 Part A: 72,667; Part B: 73,600Penetration – JIS K2220, mm/10 (worked 60 times)
NA NA NA NA NA
Oil separation – JIS K2220, % (24 hr @ 120°C)
NA NA NA NA NA
Volatile contents, % NA NA NA NA NATack-free time, min NA NA NA NA NAPot life @ 25°C, hr NA NA NA NA 4
Cure time 0.5 hr @ 150°C 20 min @ 150°C 10 min @ 150°C 3 min @ 150°C24 hr @ 25°C; 145 min @
40°C; 42 min @ 75°C; 15 min @ 100°C; 11 min @ 125°C
Physical Properties After CureDensity @ 25°C, g/cm3 2.73 2.70 2.63 2.61 2.83Durometer – JIS Type A 95 92 88 87 49 (Shore 00)Penetration – JIS K2207, mm/10 NA – – – NATensile strength, MPa 6.65 6.2 4.3 3.76 0.16Elongation, % 45.6 22 20 15 209Linear coefficient of thermal expansion, micron/m °C or ppm
– – – – –
Thermal conductivity, W/m•K 1.92 1.81 1.68 1.69 2.5Low-molecular-weight siloxane content, % – – – – NA
Adhesion Properties After CureLap shear adhesion, N/cm2 345/AL 448/AL 386 357 NA
Electrical Properties After CureDielectric strength, kV/mm 22.2 18 16 15.59 18Volume resistivity, Ω•cm 7E+15 2E+14 6.85E+13 7.10E+13 3.90E+12Dielectric constant @ 1 MHz 5.9 4.9 @ 100 kHz 5.5 @ 100 kHz 5.5 @ 100 kHz 6.4Dielectric tangent @ 1 MHz 3E-03 <3E-03 @ 100 kHz <2.2E-04 @ 100 kHz <1E-04 @ 100 kHz 5E-03
NA = Not applicable (not measured due to inappropriate test method).– = Not available.
Material Thermal Conductivity, W/m•K
Alumina (RT) 21Soda glass (RT) 0.55-0.75Nylon (RT) 0.27Polyethylene (RT) 0.25-0.34Polystyrene (RT) 0.08-0.12
Material Thermal Conductivity, W/m•K
Silicon (0°C) 168Aluminum (0°C) 236Gold (0°C) 319Silver (0°C) 428Iron (0°C) 84Copper (0°C) 403
23
Conformal CoatingsCategory One part; resin One part; modified resin One part; resin One part; elastomer
Product nameDow Corning®
1-2577 Conformal
Coating
Dow Corning® 1-2620
Dispersion RTV Elastoplastic Conformal
Coating
Dow Corning® 1-2577
Conformal Coating Low
VOC
Dow Corning® 1-2620 Low
VOC Conformal Coating
Dow Corning® LDC 2577 D
Silicone Conformal
Coating
Dow Corning® SE 9186L Coating
Dow Corning® EA-2000 Silicone
Adhesive
Dow Corning® EA-3000 RTV Black or White
Dow Corning® EA-9187LH
Features MIL-I-46058C; UL746E; fast TFT; solventborne; low viscosity
MIL-I-46058C; UL746E; fast TFT; solventborne; low viscosity
Fast tack-free; low viscosity
Noncorrosive; fast tack-free Noncorrosive; fast TFT; low
viscosity; UL746E
High viscosity Low viscosity Low viscosity
Flame retardance UL 94 V-0 UL 94 V-0 UL 94 V-0Low molecular weight of siloxane control grade
• • •
Potential uses Coatings for circuit boards and electronic printed wiring boards (PWB)
Coatings for circuit boards and electronic printed wiring boards (PWB)
Coatings for connectors, electronic parts, circuit boards
Coatings for circuit boards and electronic printed wiring boards (PWB)
Appearance Transparent Transparent Transparent Transparent Transparent Translucent, black Black White/black Colorless
Viscosity @ 25°C, mPa•S 950 150 1,094 350 104 27,000 890 1,200 400-700Tack-free time, min 7 5 6 5 5 8 8 8 6-7
Cure timeRTC: 60 min(1); HC: >2 min @ 60°C/15% RH
RTC: 60 min(1); HC: >2 min @ 60°C/15% RH
RTC: 60 min(1); HC: >2 min @ 60°C/15% RH
RTC: 60 min(1); HC: >2 min @ 60°C/15% RH
RTC: 10 min(2); HC: >2 min @ 60°C/15% RH
RTC: 24 hr @ 25°C/50% RH(3)
RTC: 24 hr @ 25°C/50% RH(3)
RTC: 24 hr @ 25°C/50% RH(3)
RTC: 24 hr @ 25°C/50% RH(3)
Physical Properties After CureDensity @ 25°C, g/cm3 1.11 1.11 1.12 1.12 1 1.02 – 1.01 0.977Durometer – JIS Type A 20 (Shore D) 25 (Shore D) 25 (Shore D) 25 (Shore D) 23 (Shore D) 25 24 18 21Low-molecular- weight siloxane content, %
– – – – – 0.0023/0.0029 – 0.0026 –
Electrical Properties After CureDielectric strength, kV/mm 16 22 13 16 26 23 31 19 34Volume resistivity, Ω•cm 5E+13 4.6E+13 2E+14 1E+15 6E+13 6E+15 4E+16 1E+15 1.60E+15Dielectric constant @ 1 MHz
2.7 @ 100 kHz 2.7 @ 100 kHz 2.3 @ 100 kHz 2.5 @ 100 kHz 2.8 @ 100 kHz 2.7 – 2.8 1.73 @ 100 kHz
Dielectric tangent @ 1 MHz
<2E-04 @ 100 kHz
3E-04 @ 100 kHz
3E-04 @ 100 kHz
4E-03 @ 100 kHz
2E-03 @ 100 kHz 1E-03 – 9E-04 1E-03
(1)1 mm thickness.(2)75 μm thickness.(3)3 mm thickness. RTC = Room temperature cure.HC = Heat cure.– = Not available.
CONFORMAL COATINGS
24
Conformal CoatingsCategory One part; elastomer One part; heat cure
Product nameDow Corning®
3-1953 Conformal Coating
Dow Corning® 3-1965 Conformal
Coating
Dow Corning® 3-1944 RTV
Coating
Dow Corning® HC2000 Controlled
Volatility CV Conformal Coating
Dow Corning® SE 9189 L Gray or White RTV
Adhesive
Dow Corning® HC1000
Dow Corning®
1-4105 Conformal Coating
Dow Corning®
Q1-4010 Conformal
Coating
Features Low viscosity; MIL-I-46058C High viscosity Noncorrosive; low viscosity
Noncorrosive; fast tack-free; high viscosity Noncorrosive; low viscosityFast tack-free
Flame retardance UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-1Low molecular weight of siloxane control grade
• • •
Potential usesRigid and flexible circuit boards; electronic printed wiring boards
(PWB); sensitive components and fine-pitch designs
Coatings for connectors,
electronic parts, circuit boards
Coatings for connectors, electronic parts, circuit boardsRigid and flexible circuit boards; electronic printed wiring boards
(PWB); sensitive components and fine-pitch designs
Appearance Translucent Translucent Translucent Translucent White, gray Gray Clear ClearViscosity @ 25°C, mPa•S 353 115 63,775 150 22,000 12,000 450 825Tack-free time, min 8 6 14 18 8 11 – –
Cure timeRTC: 30 min;
HC: 1.5 min @ 60°C/15% RH
RTC: 30 min; HC: 2 min @
60°C/15% RH
RTC: 60 min; HC: 5 min @
60°C/15% RHRTC: 90 min @ 25°C/50% RH(1)
RTC: 24 hr @ 25°C/50% RH(2)
RTC: 300 min @ 25°C/50% RH(3) 5 min @ 100°C 10 min @ 100°C
Physical Properties After CureDensity @ 25°C, g/cm3 0.98 0.99 1.03 1.01 1.19 1.07 0.97 1.00Durometer – JIS Type A 34 33 36 25 33 24 64 (Shore 00) 33Low-molecular- weight siloxane content, %
– – – 0.0025 0.0015 0.005 – –
Electrical Properties After CureDielectric strength, kV/mm 17 17 21 33 25 21 20 23Volume resistivity, Ω•cm 5.5E+15 9E+14 1.6E+15 1E+17 9E+14 2E+15 2.7E+13 2E+14Dielectric con-stant @ 1 MHz – – 2.73 @ 100 kHz 2.7 3.1 3.2 2.6 @ 100 kHz 2.6 @ 100 kHzDielectric tangent @ 1 MHz
<2E-04 @ 100 kHz
<2E-04 @ 100 kHz
<2E-04 @ 100 kHz 5E-03 4E-03 3E-03 <2E-04 @ 100
kHz 3E-4 @ 100 kHz(1)1 mm thickness.(2)3 mm thickness.(3)0.3 mm thickness.RTC = Room temperature cure.HC = Heat cure.– = Not available.
25
Features and Characteristics of Silicone
Chemical features of silicone
Characteristics of silicone
A1.54
Si-Obond
High bondenergy
106kcal/mol
Long bonddistance1.64A
110˚
82.6 kcal/mol
130˚-134˚ wide bond angle
A1.54
Si-Obond
High bondenergy
106kcal/mol
Long bonddistance1.64A
110˚
82.6 kcal/mol
130˚-134˚ wide bond angle
Low modulus
Low moisture absorption
Vapor permeability
Good workability
Cold resistance
Heat resistance
Long Si-O bond distance; wide bond angle
High bond energy
Weak van der Waals force
Covered with CH3 group
Easy rotationof polymer chain
Hydrophobicity
Low viscosity
Less temperature-dependent
Stable bond
26
COMPARED WITH ORGANIC COMPOUND MADE OF CARBON SKELETON
• Long Si-O bond distance• Large bond angle • High bond energy• Weak van der Waals force• Covered with CH3 group
CH3
Si
O
Glossary and Common Properties
About room temperature cure The most common cure type is one-part moisture cure. There are several types, depending on reactive by-products (e.g., deoxime type and dealcohol type). There also are two-part condensation cure types in which curing starts from the surface exposed to air towards the deep section, and its cure speed depends on the absolute moisture. There-fore, although it depends on the size of the substrate, this cure type is not appropriate for bonding larger surfaces.
Pattern diagram of condensation reaction (an example of dealcohol type)
Storage recommendations Storage requirements differ for each product.• Products to store in a cool, dark place: We recom-mend storing products in a cool, dark place, except forthose that require cold storage or refrigeration.
• Products requiring cold storage or refrigeration: As arule, for one-part addition-cure products requiring coldstorage, store between 0 and 5°C; for one-part addition- cure products requiring refrigeration, store between -25and -15°C.
About low-molecular-weight siloxaneWhen a micro-relay, micro-switch or similar micro-elementis in airtight or semi-airtight conditions, ingredients emitted from silicone materials can insulate contact points fromelectric energy, which may cause continuity or contactfailure. These emitted ingredients, called low-molecular- weight siloxane, are shown below. Low-molecular-weightsiloxane reduction grades contain reduced amounts oflow-molecular-weight siloxane.
Structure of low-molecular siloxane
About heat cure To cure addition-cure products by heating, place them in an oven or on a hot plate set at a specified temperature for a certain duration. The duration must be determined based on the heat capacity of the materials used.
Pattern diagram of addition reaction
About cure inhibition Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition-cure adhesives. Most nota-ble of these include organotin and other organometallic compounds; silicone rubber containing organotin catalyst; sulfur, polysulfides, polysulfones or other sulfur-containing materials; unsaturated hydrocarbon plasticizers; and some solder flux residues (e.g., flux, amines, vinyl chloride and sulfur vulcanization rubber).
Conversion factors of SI units and traditional unitProperty Traditional Unit Conversion Factor
and SI UnitViscosity cSt 1.00 mm2/sViscosity cP 1.00 Pa.sViscosity P 0.100 Pa.sTensile strength, modulus kgf/cm2 0.0981 MPaLap shear adhesion kgf/cm2 9.81 N/cm2
Thermal conductivity cal/cm.s.ºC 419 W/m.kComplex elastic modulus dyne/cm2 0.100 Pa.sTorque kgf.cm 0.0981 N.mTear strength, peel kgf/cm 0.981 N/mm
About UL recognition For further information on UL recognition of each product, please see the online certification directory at ul.com. File numbers of the products listed in this brochure are E55519, E229242, E92494, E177248 and E40195.
About correlation between hardness after cure and complex modulus
Guidelines on viscosity before cure
Correlation between penetration and complex modulus for gel
Correlation between hardness and complex modulus for elastomer
Compound
Conformal coatings
Gel potting materials
Adhesives/sealantsMayonnaise
FlowableEngine oil
Honey
0.01100.1
0.11000.1
11,000
10
100Pa•s (cP)
1,000
10
100
1,000 Pa•s
10,000 PPenetration, mm/10
Com
plex
mod
ulus
, Pa
Com
plex
mod
ulus
, Pa
Hardness
Catalyst(e.g.Pt)
Moislurein the air
27
How Can We Help You Today?Tell us about your performance, design and manufacturing challenges. Let us put our silicon-based materials expertise, application knowledge and processing experience to work for you.For more information about our materials and capabilities, visit dowcorning.com.To discuss how we could work together to meet your specific needs, email [email protected] or go to dowcorning.com/ContactUs for a contact close to your location. Dow Corning has customer service teams, science and technology centers, application support teams, sales offices, and manufacturing sites around the globe.
Cover – AV25549, AV25106, AV21745, AV25108, AV23777, AV23124; Page 1 – AV25555, AV25563, AV25566; Page 2 – AV20649, AV25565, AV21870; Page 4 – AV25553, AV25550, AV25561, AV25556; Page 5 – AV25554, AV21862, AV23760; Page 6 – AV23798, AV25571, AV23798, AV23791, AV23262, AV22828; Page 7 – AV23709, AV23792, AV23772, AV25522; Page 8 – AV05999, AV06068, AV23803, AV25552; Page 9 – AV23496, AV23802; Page 10 – AV23800, AV23096, AV25559; Page 11 – AV25558, AV22155, AV23764, AV23802; Page 12 – AV23430; Page 13 – AV20984, AV16291, AV23429; Page 14 – AV22408, AV23776, AV23773, AV25557, AV23435, AV25031; Page 15 – AV23761, AV23774; Page 16 – AV23523, AV25551, AV23518, AV25560, AV25564; Page 17 – AV23708, AV23515, AV23709, AV25562; Page 18 – AV13227; Page 25 – AV12724, AV03117; Page 26 – AV12518; Page 28 – AV218699
HANDLING PRECAUTIONSPRODUCT SAFETY INFORMATION REQUIRED FOR SAFE USE IS NOT INCLUDED IN THIS DOCUMENT. BEFORE HANDLING, READ PRODUCT AND MATERIAL SAFETY DATA SHEETS AND CONTAINER LABELS FOR SAFE USE, PHYSICAL AND HEALTH HAZARD INFORMATION. THE MATERIAL SAFETY DATA SHEET IS AVAILABLE ON THE DOW CORNING WEBSITE AT DOWCORNING.COM, OR FROM YOUR DOW CORNING SALES APPLICATION ENGINEER, OR DISTRIBUTOR, OR BY CALLING DOW CORNING CUSTOMER SERVICE.
LIMITED WARRANTY INFORMATION – PLEASE READ CAREFULLYThe information contained herein is offered in good faith and is believed to be accurate. However, because conditions and methods of use of our products are beyond our control, this information should not be used in substitution for customers’ tests to ensure that our products are safe, effective and fully satisfactory for the intended end use. Suggestions of use shall not be taken as induce-ments to infringe any patent.
Dow Corning’s sole warranty is that our products will meet the sales specifications in effect at the time of shipment.
Your exclusive remedy for breach of such warranty is limited to refund of purchase price or replacement of any product shown to be other than as warranted.
TO THE FULLEST EXTENT PERMITTED BY APPLICABLE LAW, DOW CORNING SPECIFICALLY DISCLAIMS ANY OTHER EXPRESS OR IMPLIED WARRANTY OF FITNESS FOR A PARTIC-ULAR PURPOSE OR MERCHANTABILITY.
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