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Structuring and bonding of glass-wafers
Dr. Anke Sanz-Velasco
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 2 13-14.06.2017
• IMT
• Why glass?
• Components for life science
• Good bond – requirements and evaluation
• Wafer bonding
1. Fusion bonding
2. UV-adhesive bonding
• Customer-specific development of UV-adhesive bonding
• Laser dicing
Outline
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 3 13-14.06.2017
Foundation Dr. Rüst AG, Stäfa in 1959
Ownership HEIDENHAIN Group since 1994
Employees 107
Revenue 2016 CHF 25 Mio.
Investment ratio 15% of total revenue
Cleanroom 1500 m2
Substrates 70.000 / year
Components 1.4 Mio. pcs / year
Traceable to METAS, ISO 9001:2000 and NIST certification
Consumables in glass
for
Life Science applications
IMT Masken und Teilungen AG - Keydata
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 4 13-14.06.2017
Development and large scale manufacture of
cost effective glass consumables
• Complete assembled flow cells
• Nano- and micro-patterns on glass
• Nano-wells and channels in glass
• Nanopillars in glass
• Structured electrodes on glass
• Planar or structured Waveguides and phase gratings to guide and couple light
• Structured polymers (photoresists)
• Covalent bond chemistry
• Through-holes
• In-house master manufacture
• Bonding of glass substrates
Services for Life Science industry
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 5 13-14.06.2017
• IMT
• Why glass?
• Components for life science
• Good bond – requirements and evaluation
• Wafer bonding
1. Fusion bonding
2. UV-adhesive bonding
• Customer-specific development of UV-adhesive bonding
• Laser dicing
Outline
![Page 6: Dr. Anke Sanz-Velasco - Fraunhofer ENAS · Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES Structuring and bonding of glass-wafer 4 13-14.06.2017 Development and large scale manufacture](https://reader031.vdocuments.us/reader031/viewer/2022011805/5bb652b409d3f2213f8dc7a0/html5/thumbnails/6.jpg)
Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 6 13-14.06.2017
Why glass?
Excellent physical properties Other benefits
Mechanical:
Homogeneous and isotropic
Good mechanical stability
Light weight (density = 2.5 g/cm3)
Cost efficient
Good process ability (polishing, grinding, dicing, breaking, etc.)
Available in different forms (flat glass, tubes, etc.)
Many variants
(float-, silicate-, flint-glass, glass ceramics, quartz etc.)
Optical:
High transparency (visible to IR)
Low fluorescence
Electrical:
Low thermal expansion
Electrical isolator
Chemical:
High chemical resistance
Chemically inert
MEMpax® Borosilicate glass wafers Schott
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 7 13-14.06.2017
• IMT
• Why glass?
• Components for life science
• Good Bond – requirements and evaluation
• Wafer bonding
1. Fusion bonding
2. UV-adhesive bonding
• Customer-specific development of UV-adhesive bonding
• Laser dicing
Outline
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 8 13-14.06.2017
Etched channels
Micro- and nanostructures
Holes and via holes
Components for life science
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 9 13-14.06.2017
Cleaning Coating Lithography:
resist coating
Lithography:
exposure
Lithography:
developing,
etching and
cleaning
Prozessablauf
Components for life science - automated process line for 200 mm
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 10 13-14.06.2017
Components for life science - microchannels and -wells
Microchannels and -wells in glass using wet etching (HF)
Advantages:
• Cost effective
• Homogeneous etching, i.e. surface roughness <50 nm
• High degree of freedom in the pattern design
Limitations:
• Vertical walls and high aspect ratios not possible
• Isotropic process, i.e. the channels are always broader than deep
and wider than the structures in the etching barrier (Masking).
320m
150m
Smallest feature size 10µmGlass micro-reactor
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 11 13-14.06.2017
Components for life science - glass etching - HF spray
Etching of microstructures in glass 16 x Ø 200mm wafer / batch with excellent homogeneity (± 1% within the batch)
Complete processing dry-in – dry-out
Use of different
- Chemistries and concentration (HF, HNO3, HCl,…) and
- Glass types (B270, D263, Borofloat, Mempax)
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 12 13-14.06.2017
Reaction
SiO2 + 6 HF H2SiF6 + 2H2O
Spray acid process
Chemistry (temperature variable)
Circulation (defined flow) garanties homogenity
Masking
Stressfree Layer thickness
Pinholefree Layer composition
Free from scratches Cleanliness
Good adhesion Chemical binding, surface
Etch quality
– Adaquate etch rate
– No crystallites HF-concentration & mixing ratio
– Surface roughness
F-
SiO
O
O
O
Components for life science - glass etching - HF spray
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 13 13-14.06.2017
Components for life science - glass etching - HF spray
(1-5) Microfluidic structures
1
2
3
4
5
6
(6) Overetched grid
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 14 13-14.06.2017
• IMT
• Why glass?
• Components for life science
• Good Bond – requirements and evaluation
• Wafer bonding
1. Fusion bonding
2. UV-adhesive bonding
• Customer-specific development of UV-adhesive bonding
• Laser dicing
Outline
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 15 13-14.06.2017
Requirements
• Contaminant free surfaces
• Surface roughness
• Wafer bow
• Surface conditioning
• Total thickness variation
• Atmosphere; e.g. pressure,
temperature, humidity
Requirements for a good bond
Evaluation
• Voids
• Bond strength
• Leak tightness
• Adhesive profile
• Uniform bond interface
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 16 13-14.06.2017
• IMT
• Why glass?
• Components for life science
• Good Bond – requirements and evaluation
• Wafer bonding
1. Fusion bonding
2. UV-adhesive bonding
• Customer-specific development of UV-adhesive bonding
• Laser dicing
Outline
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 17 13-14.06.2017
Wafer bonding
ISO class 4
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 18 13-14.06.2017
1. Fusion bonding:
MetalGlass Laminate Adhesive
Wafer bonding
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 19 13-14.06.2017
1. Fusion bonding:
2. UV-adhesive bonding:
MetalGlass Laminate Adhesive
Wafer bonding
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 20 13-14.06.2017
Wafer bonding - Fusion bonding
Cleaning Alignment Bonding Annealing
Process flow
@300°C
@500°C
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 21 13-14.06.2017
Advantages
• Room-temperature processes allowing for encapsulation of bio-
materials
• Compatible with a wide range of materials
• Insensitive to surface roughness
• Ultra-thin selective adhesive transfer technology with excellent
uniformity over large areas
Wafer bonden - UV-adhesive bonding
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 22 13-14.06.2017
Wafer bonding - UV-adhesive bonding
Process flow
Cleaning Coating Adhesive transfer BondingAlignment Curing
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 23 13-14.06.2017
Wafer bonding - UV-adhesive bonding
Adhäsiv übertragen
Wafer mit Adhäsiv
Gebondeter Wafer
Spin on adhesive
onto foil
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 24 13-14.06.2017
Wafer bonding - UV-adhesive bonding
Spin on adhesive
onto foil
Adhesive transfer
Wafer mit Adhäsiv
Gebondeter Wafer
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 25 13-14.06.2017
Wafer bonding - UV-adhesive bonding
Spin on adhesive
onto foil
Adhesive transfer
Wafer with adhesive
Gebondeter Wafer
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 26 13-14.06.2017
Wafer bonding - UV-adhesive bonding
Spin on adhesive
onto foil
Adhesive transfer
Wafer with adhesive
Bonded wafer
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 27 13-14.06.2017
• IMT
• Why glass?
• Components for life science
• Good Bond – requirements and evaluation
• Wafer bonding
1. Fusion bonding
2. UV-adhesive bonding
• Customer-specific development of UV-adhesive bonding
• Laser dicing
Outline
![Page 28: Dr. Anke Sanz-Velasco - Fraunhofer ENAS · Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES Structuring and bonding of glass-wafer 4 13-14.06.2017 Development and large scale manufacture](https://reader031.vdocuments.us/reader031/viewer/2022011805/5bb652b409d3f2213f8dc7a0/html5/thumbnails/28.jpg)
Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 28 13-14.06.2017
Adhesive 1
•UV-hardening urethan acryl
adhesive
Customer-specific development of UV-adhesive bonding
Adhesive 2
•UV-/ thermal hardening epoxy
adhesive
Requirements on UV-adhesive
• Non fluorescent
• Moisture resistant
• Chemical inert
• Mechanical stable
100 µm
50 µm
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 29 13-14.06.2017
Adhesive
Thickness adhesive
300 nm
Customer-specific development of UV-adhesive bonding
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 30 13-14.06.2017
Customer-specific development of UV-adhesive bonding
Aim: Adhesive layer thickness 3.5 µm
Variation target value ±1.0 µm
Wafer uniformity ±1.5 µm
CavitySmall distance
between cavities
Wide distance
between cavities
100 µm
Cavity Small distance between cavities
Wide distance between cavities
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 31 13-14.06.2017
Customer-specific development of UV-adhesive bonding
No adhesiveNo adhesiveNo adhesive
Adehsive-1.1
4500 rpm
0 N
Adehsive-1.2
4500 rpm
0 N
Adehsive-1.3
4500 rpm
0 N
Adehsive-1.4
4000 rpm
0 N
Adehsive-1.5
4000 rpm
0 N
Adehsive-1.6
4000 rpm
2 kN
No adhesive No adhesive No adhesive
100 µm
Cavity Small distance between cavities
Wide distance between cavities
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 32 13-14.06.2017
ca. 0.8 µmca. 0.9 µmca. 1.7 µmAdehsive-1.4
4000 rpm
0 N
Adehsive-1.5
4000 rpm
0 N
Adehsive-1.6
4000 rpm
2 kN
Customer-specific development of UV-adhesive bonding
100 µm
Cavity Small distance between cavities
Wide distance between cavities
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 33 13-14.06.2017
Adhesive 1: D263; 4500 rpm; 0 kN
Customer-specific development of UV-adhesive bonding
100 µm
Cavity Small distance between cavities
Wide distance between cavities
Adhesive layer thickness as function of distance to cavity
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 34 13-14.06.2017
Adhesive 2
blends into cavities
Customer-specific development of UV-adhesive bonding
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 35 13-14.06.2017
Adehsive 2: D263; 4500 rpm; 0 kN
• Kleber-Schichtdicke in Abhängigkeit vom Abstand zum Kanal
Customer-specific development of UV-adhesive bonding
Adhesive layer thickness as function of distance to cavity
100 µm
Cavity Small distance between cavities
Wide distance between cavities
0 mm
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 36 13-14.06.2017
Customer-specific development of UV-adhesive bonding
ParameterPre-treatment
• Wafer
• Foil
Adhesive transfer
• Volumen adhesive
• Acceleration speed
• Revolution speed
Adhesive transfer
• Contact pressure
• Speed
• Mechanical adjustments
Bonden
• Mechanical adjustments
• Atmosphere
• Contact pressure
Curing
• Intensity
• Duration
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Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 37 13-14.06.2017
• IMT
• Why glass?
• Components for life science
• Good Bond – requirements and evaluation
• Wafer bonding
1. Fusion bonding
2. Adhesive bonding
• Customer-specific development of UV-adhesive bonding
• Laser dicing
Outline
![Page 38: Dr. Anke Sanz-Velasco - Fraunhofer ENAS · Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES Structuring and bonding of glass-wafer 4 13-14.06.2017 Development and large scale manufacture](https://reader031.vdocuments.us/reader031/viewer/2022011805/5bb652b409d3f2213f8dc7a0/html5/thumbnails/38.jpg)
Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 38 13-14.06.2017
Laser dicing
• High dicing accuracy
• Minimal chipping
• No material waste
• Cut through metallic & DE coatings
![Page 39: Dr. Anke Sanz-Velasco - Fraunhofer ENAS · Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES Structuring and bonding of glass-wafer 4 13-14.06.2017 Development and large scale manufacture](https://reader031.vdocuments.us/reader031/viewer/2022011805/5bb652b409d3f2213f8dc7a0/html5/thumbnails/39.jpg)
Chemnitzer Seminar SYSTEM INTEGRATION TECHNOLOGIES
Structuring and bonding of glass-wafer 39 13-14.06.2017
Structuring and bonding of glass-wafers
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