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Sharif University of Technology 2
Table of Contents
Microelectronic IndustryRapid PrototypingASIC Design
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Sharif University of Technology 3
Microelectronics Market
Primary MarketInformation SystemsTelecommunicationsConsumer
Secondary MarketSystems (e.g. Transportation)Manufacturing (e.g. Robots)
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Sharif University of Technology 4
Electronic MarketSystems
Electronic Sub-Systems
Integrates Circuits
EDA
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Sharif University of Technology 5
Trends in Microelectronics
Improvement in Device TechnologySmaller CircuitsHigher PerformanceMore Devices on a Chip
Higher Degree of IntegrationMore Complex SystemsLower CostHigher Reliability
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Sharif University of Technology 6
Moore’s LawEvery 18 Months:
Gate Count DoublesFrequency Increases 50%
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Sharif University of Technology 7
Integration-Scale Limitations
Intrinsic physical scaling limitsCapital investment for fabrication
Use of appropriate design styles
Large-scale design managementUse of CAD tools for design
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Sharif University of Technology 8
Microelectronic Design Problems
Use most recent technologiesHigher performance
Reduce design costLower price
Speedup design timeShorten time-to-market
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Sharif University of Technology 9
Rapid Prototyping
Prototype:The original or model on which something is based or formedSomething that serves as an example of its kind
Rapid:Occurring within a short timeHappening Speedily
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Sharif University of Technology 10
Why Rapid Prototyping?Avoid high non-recurring engineering (NRE) costsAvoid long construction time for "real" systemReduced time allowed from concept to productCan quickly react to changing customer environment or requirementsSystems are too complex to simulate real-world operation in "bounded" time (need to build to test)Customers won’t put up with unreliable productsSometimes the prototype is the product
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Sharif University of Technology 11
Why Not Rapid Prototyping?Not the same performance as final product (slower)Not the same size as final product (bigger or more ICs required)Prototype more expensive than final production unitMore design time required to complete engineering of both prototype and final system
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Sharif University of Technology 12
VLSI Market
ASIC
Application Specific
Integrated Circuits
ASSP
Application Specific
Standard Part
Standard (Commodity) Part
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Sharif University of Technology 13
Implementation Technologies
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Sharif University of Technology 14
ASIC
Dedicated to single function, or limited range of functionsNot ASIC:
CPUs, MicroprocessorsMemories: DRAM, SRAM, ROM, …Standard Components (e.g. 74 Series)
ASIC:Toy ChipsMpeg Decoder/Encoder ICsDSP Processors
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Sharif University of Technology 15
Design Aspects
Shorter product life-timeShorter time-to-marketMore parallel design flowBetter communication between different design groups
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Sharif University of Technology 16
Design Aspects (cont.)
More complex systemsMore efficient design methods need to be usedDesign automation is a necessityMore tool-dependant design and optimizationMore difficult to ensure correct functionality
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Sharif University of Technology 17
Design Aspects (cont.)
Not fixed system specification when starting the design entry
More emphasis on high level design aspectsFlexible and very rapid design flowEasy testability through the whole design flow
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Sharif University of Technology 18
Structures ASIC Design
Hierarchy: Subdivide the design into many levels of sub-modulesRegularity: Subdivide to max number of similar sub-modules at each levelModularity: Define sub-modules unambiguously & well defined interfacesLocality: Max local connections, keeping critical paths within module boundaries
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Sharif University of Technology 19
ASIC vs. Standard ICStandard IC
Typically low component costParts available off the shelfLow or insignificant IC design costProven component reliabilityMultiple sourcingSystem house not required to have in-house experts in chip design
ASICGood security of intellectual propertyOptimum system designRelatively efficient use of board space (smaller systems)Reliability enhanced at system level (fewer components)Performance may be better than comparable standard ICs (unique features and lower power consumption)Possibility to optimize component costDesign cost is high and design cycle is long
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Sharif University of Technology 20
ASICs
AdvantagesEfficient use of board space (lower final system cost)Product securityUnique features and fine-tuning the productOptimized system performance
DisadvantagesPotential for design failureNot off-the-shelf available (specification, design, testing and documentation phases are needed)High unit cost of IC (higher initial costs of development)
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Sharif University of Technology 21
Types of ASIC
Full CustomSemi Custom
Cell basedGate Array
Programmable LogicFPGA (Field Programmable Gate Array)PLD (Programmable Logic Device)
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Sharif University of Technology 22
Full Custom ASICs
Some (or all) logic cells are customizedDemands longer design cycle
All mask layers are customizedInvolves an implementation of a completely new chipDesigner must be an expert in VLSI designIt is used when:
existing cell libraries are not fast enoughlogic cells not small enough or consume too much powertechnology migration (mixed-mode design)
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Sharif University of Technology 23
Examples of Full Custom ICs
Analog (e.g. Sensor, Actuator)Mixed Analog/Digital (e.g. Telecommunication)High Voltage (e.g. Automobile)Low Power (e.g. PDA, Mobile)
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Sharif University of Technology 24
Cell Based ASICsUse predesigned logic cells (standard cells) in combination with larger cells (megacells)Standard Cells
Primitive Gates (and, or, …)MultiplexersRegisters
Mega cells (full-custom blocks, system-level macros, fixed blocks, cores, functional standard blocks, or IP)
Microcontrollers, Microprocessor, MPEG decoderRAM, ROM
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Sharif University of Technology 25
Cell Based ASICs (cont.)
Designers save time, money, and reduce riskEach standard cell can be optimized individuallyAll mask layers are customizedCustom blocks can be embedded
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Sharif University of Technology 26
Gate Array Based ASICs
Gate array (or prediffused array)Transistors are predefined on the silicon waferBase array: the predefined pattern of transistorsBase cell: the smallest element that is replicated to make the base array
Masked gate array (MGA)Only the top few layers of metal are defined by the designer using custom masksThe designer chooses from a gate-array library of predesigned logic cells (macros)
Types of MGA ASICsChanneled gate arraysChannel-less gate arraysStructured gate arrays
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Sharif University of Technology 27
Channeled Gate Array
Only the interconnect is customizedThe interconnect uses predefined spaces between rows of base cells
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Sharif University of Technology 28
Channel-less Gate Arrays
Also known as sea-of-gate (SOG)only some mask layers are customized- the interconnect
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Sharif University of Technology 29
Structured Gate Array
Combine some of the features of CBICs (Cell-Based ICs) and MGAsOnly the interconnect is customizedCustom blocks can be embedded