Download - Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole Developpement
© 2017
Publication date: February 2017
From Technologies to Market
Advanced Substrates Overview:
From IC package to board
2
THE ADVANCED SUBSTRATE ACTIVITY
Standalone activity focused on the analysis of PCBs, IC substrates and RDLs
• From 2017, Yole Développement is starting a separate and standalone “Advanced Substrate” activity, dedicated to exploring the
market and technologies of PCBs, IC substrates and RDLs
• The “Advanced Substrate” activity will aim to connect the landscapes of boards, IC substrates and RDLs and provide analysis on these
topics “under one roof”
• The objectives of the “Advanced Substrate” activity will be to:
• Propose a common terminology framework
• Identify and analyze competitive and overlapping “advanced substrate” technologies
• Analyze the supply chain and business model shifts
• Provide substrate related market forecasts
• Provide substrate related technology roadmaps
• Provide an outlook on market dynamics and disruptions
• Identify market shares
• Provide analysis on substrate architectures, equipment and materials
Start of the Advanced Substrates
activity
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
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OBJECTIVES OF THE FIRST REPORT
• To provide an overview of board, substrate and RDL interconnects
o Terminology definition
o Segmentation by types of substrates
o Segmentation by players and respective business models• To provide analysis of technology trends
o Competition zones and overlaps
o Board vs. FC substrate
o FC substrate vs. WLP RDL
o High Level Technology comparison
o Technology roadmaps
• To assess the future development of the advanced substrate marketo Identification of main players
o Supply chain analysis and shifting business models
o Market forecasts for IC substrates and WLP RDL
o Outlook on new market drivers and emerging applications
This report, the first report of the “Advanced Substrate” activity, will act as an overview report thatwill be followed by further in-depth reports.The objectives of the first report are as follows:
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
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REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
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REPORT METHODOLOGY
Technology analysis methodology Information collection
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
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TABLE OF CONTENTS
o Introduction 3
• Report Synergies
• Advanced Substrate activity
• Objectives
o Advanced substrate segmentation 10
• PCB/Substrate/RDL segmentation
• Report Scope
o Executive summary 20
o Market drivers 68
• Advanced packaging drivers
• Board and advanced substrate drivers
• Players and supply chain 163
• Player landscape and positioning
• Overview of business models and strategies
• Market forecasts 194
• Adv. FC substrates vs. WLP
• Unit count
• Revenue
• FC CSP vs. FC BGA
o Conclusions 208
o Yole Développement presentation 215
o Market dynamics 89
o Competing platforms (board vs. IC substrate, ICsubstrate vs.WLP)
o Disruptions and opportunities
o IoT segmentation scenario
o Board vs. FC substrate 100
• Market segments
• Applications
• Technology competition
o FC substrate vs. WLP 106
• Market segments
• Applications
• Substrate Technology comparison
• Accessible markets
o Substrate technology 141
o Technology comparison and overview by key players
o Technology roadmaps
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Biography & contact
ABOUT THE AUTHOR
Andrej Ivankovic
Andrej Ivankovic is a Technology & Market Analyst on the Advanced Packaging and Semiconductor Manufacturing team at Yole Développement, the "More thanMoore" market research and strategy consulting company. Andrej holds a master’s degree in Electrical Engineering with specialization in Industrial Electronics fromthe University of Zagreb, Croatia, and a PhD in Mechanical Engineering from KU Leuven, Belgium. He started at ON Semiconductor, performing reliability tests,failure analysis, and characterization of power electronics and packages. He then worked for several years as an R&D engineer at IMEC Belgium on thedevelopment of 3D IC technology, focused on electrical and thermo-mechanical issues of 3D stacking and packaging. During this time he also worked atGLOBALFOUNDRIES as an external researcher. Andrej regularly presents at international conferences and has authored or co-authored >20 papers and onepatent.
Contact: [email protected]
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COMPANIES CITED IN THE REPORT
3CEMS, 3M, 3Win Group, AMD, Amkor, Amphenol, Aoshikang, Apple, AOI AT&S, ASE, Avago, Benchmark, Boardtek, Career, CCTC, Celestica, Chin Poon, ChipBond, ChipMOS, CMK, Compeq, Cosmotech, Daeduck, Deca Technologies, Dynamic, Eastern, Ellington, Ericsson, Facebook, Fast Print, Flex, Flexium, Founder, Foxconn, Fujikura, Fujitsu, Gold Circuit, Google, HannStar Board, HiSilicon, Hitachi Chemical, Huatian, Huawei, Ibiden, Ichia, Inari Berhad, Infineon, Intel, Isu Petasys, Jabil, JCET, Juniper Networks,
KCE Electronics, Kingboard, Kinsus, Kinwong, KYEC, Kyocera, Kyoden, Lenovo, LG Innotek, Meiko, Mflex, MGC, Micron, Nanium, Nantong Fujitsu, Nan Ya PCB, Nepes, Nippon Mektron, Nitto Denko, NTK, NXP, OKI, Olympic, Oracle, Plexus, Powertech
Technology, Renesas, Samsung, Sanmina, Schweizer, Shennan Circuit, Shinko, Simmtech, SK Hynix, Somacis, SPIL, STATS ChipPAC, Sumitomo Denko, Taiwan PCB Techvest, TDK, Toppan, Tripod, TTM Technologies, Qorvo, Qualcomm, TSMC, Unimicron, Unisem,
Unitech, UTAC, Wus Group, Würth Elektronik, Wuzhou, Xilinx, Yamamoto Manufacturing, Young Poong Group, ZD Tech… and many more
> 120 companies cited in the report
(non-exhaustive list)
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o With the maturing smartphone market as the semiconductor industry driver:
• an abundance of new applications are proposed
• new markets are rising from IoT – infrastructure and smart things, to automotive, industrial and robotics
o Diversification of semiconductor products is reflected into requirements for a variety of architectures from system to package level, subsequently impacting the technology and market of boards, substrates and RDLs
o Two main drivers for advanced substrates can be identified:
• Further scaling of front-end technology nodes continues to drive miniaturization and performance of interconnects from wafer level to substrate and board level
• Growth of multi die System-in-Packages requires more functionality and design flexibility from integration of heterogeneous dies to substrate size, resolution, I/O count, layer count and embedding possibilities
o Scaling on one hand and diversified requirements on the other are causing overlaps of board, substrate and RDL landscapes leading to competing technologies and causing new player competitions
WHAT’S NEW ON THE ADVANCED SUBSTRATE MARKET?
=> Mobile sector is still driving the semiconductor industry, however, diversification of semiconductor products lies
ahead bringing new competition between previously neutral players and board, substrate and RDL technologies
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SYSTEM INTEGRATION LEVELS
iPhone 6
LEVEL 3:
End
Device/Equipment
LEVEL 2:
Device/Equipment
board
iPhone 6 PCB
Qorvo RF SiP
in the iPhone 6s Plus
LEVEL 1:
Semiconductor
Packaging
LEVEL 0:
Semiconductor
Die/Wafer
Power amplifier in
Qorvo RF SiPSemiconductor
wafer
LEVEL 1+2:
Semiconductor Package + Board
Semiconductor
package
Board (PCB)
Si dies
Package Substrate
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BOARD VS. SUBSTRATE VS. THIN FILM RDL
Substrate
Multi-Die FC BGA
Multi-Die Fan-Out WLP/PLP Fan-In WLP
2.5D/3D IC on FC BGA
Thin Film
RDL
Interposer
Board
Board
Board
Board
Die Die
Die DieDie
Die
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Overall board, substrate and RDL
segmentationRigidity
Substrate type
Organic
manufacturing
Si/Ceramic/Glass
manufacturing
Metal basis
Integration Level
IC Package level Rigid • FC/WB
core/coreless
laminate/build up
substrate
• Embedded Die in
Substrate
• Fan-Out PLP
• WB/FC ceramic
substrate
• Thin Film RDL
(Fan-Out, Fan-In
WLP)
• Si/Glass
interposers
• Leadframes
Board Level Rigid Rigid board Rigid ceramic board Rigid board with metal
core
Flexible Flexible board N/A N/A
Rigid-Flexible Rigid-Flexible board Rigid-Flexible board
(Rigid ceramic
connected with
organic flex)
Rigid-Flexible board
(Rigid with metal core
connected with
organic flex)
ADVANCED INTERCONNECT SEGMENTATION N/AFocus of this report
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Rigid board
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Leadframes
QFN,QFP
w/o IC substrates
Fan-in Fan-out
IC substrates-based
Package Substrate
(organic)
W/B BGAFlip Chip
BGA3DIC
Interposer based
(Si, Glass, Org)SiP
Embedded die
(in substrate)
ADVANCED PACKAGING PLATFORMS
Overview of advanced packaging platforms
PCB
(organic board)
Increased functionality, performance…
Interconnect:
Single die
Multiple Dies
Integration:2D 3D
Embedded die
(in substrate or PCB)
Bumping, Pillars, Studs, Through-silicon-via, Bump-less, Embedded Technologies...
Focus of this report
X
X
X
Indicates explored advanced packaging platforms
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DIVERSIFICATION OF SEMICONDUCTOR PRODUCTS
Mainframes
PCs
IoT
Autom
otive
AR&VR
AI
5G connectivity
Servers/Datacenters
IoT infrastructure – the
connectivity and data
processing backbone
Diversification
• No single leading driver, but a fragmented growing market!
Smartphones
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BOARD, SUBSTRATE AND RDL DRIVERS
Smaller formfactor and higherperformance at lowercost
Dimensional Board,
Substrate
and RDL
drivers
Electrical
Manufacturing
Higher
frequency
operation
Higher
bandwidth
Ever lower
cost
Shorter
Design and
Manufacturing
time
Lower z-
height
Higher
resolution
(L/S)
• Boards, package substrates and RDL essentially share the same governing drivers, on different scales
Cost
Thermal
Lower
thermal
resistances
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ADVANCED SUBSTRATES IN LATEST SMARTPHONE APPLICATION PROCESSORS
• A selection of latest PoP application processors from high end smartphones – iPhone 7, Samsung Galaxy S7 (2 versions), Huawei P9
• Z refers to the height of the bottom package substrate or RDL (between application processor and board), without solder balls
Inte
grat
ion leve
l
Memory
APU
Board
Memory
APU
Board
Memory
APU
Board
Memory
APU
Board
Source: SystemPlus Consulting
A10
Thin film RDL
Z= 60 µm
XX layers
Snapdragon 820
Coreless Substrate
Z= 140 µm
XX layers
Exynos 8
Substrate with core
Z= 280 µm
XX layers
Kirin 955
Substrate with core
Z= 424 µm
XX layers
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CASE OVERVIEW: INTERNET OF THINGS
Information Flux
Information Flux
HUB / Gateway
Data End device
Cloud
Service
Companies
Third
Party
Statistics
Targeted Ads
Wireless
Sensor
Module
Wireless
Sensor
Module
Wireless
Sensor
Module
Connected
Devices
Network
connectivity
IoT
Market
structure
• End device
• IoT connected end device such
as industrial sensor modules,
wearables, car infotainment
etc.
• Network connectivity
• Wireless networking hardware
(routers, switches etc.)
• Cloud
• Servers and storage
• Data
• Software based data processing
and analytics
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IoT LANDSCAPE SCENARIO
Cloud Network
connectivity
End device
Connected
DevicesHUB / Gateway
Requirements
Applications
Packages
Servers, datacenters Base stations Small area networks
(WiFi)
Smartphones, tabletsWearables,
environmental/control
sensors etc.
Future applications will require a variety of advanced substrates with L/S < 15/15 um
and boards with L/S < 30/30 um!
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ADVANCED SUBSTRATE TECHNOLOGY SEGMENTATION
Wafer processing
100/10010/101/10.1/0.1
L/S [um/um]
2016
Lay
er
Thic
kness
(C
u +
die
lect
ric)
, [um
]
0.1
1
10
100 Board
Semiconductor
Packaging
Semiconductor
Packaging
• Current interconnect
coverage of board,
semiconductor
packaging and Wafer
processing technology
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Cu damasceneWafer BEOL
ADVANCED SUBSTRATE TECHNOLOGY – COMPETITIVE AREAS
100/10010/101/10.1/0.1
L/S [um/um]
Subtractive
2020
Lay
er
Thic
kness
(C
u +
die
lect
ric)
, [um
]
0.1
1
10
100
Semi-additive (thin film RDL)
Semi-additive (substrates)
Fan-In/Fan-Out WLP/PLP
Board
2.5D / 3DIC
vs. Fan-Out
IC substrates
vs. WLP
Board vs. IC
substrate
12
3
3 Competition
areas are
developing,
explored in detail in
the report!
1
2
3
Board vs. IC substrate
IC substrates vs. WLP
2.5D/3D IC vs. Fan-Out
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
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CAN ADVANCED SUBSTRATES REPLACE PCBs in COMPUTING?
DDR4 3D 64GB Dual Inline Memory
Modules (RDIMMs) - SAMSUNGAre we looking at a future with large (>100x100 mm2)
advanced substrates replacing PCBs for the high end? :
3D DDR4
directly on
FC substrate
XXX supply chain
? ? ?
?
?
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HVM EXAMPLES
• Recentproducts
GPU:
AMD Radeon R390
SK Hynix HBM stack
Si interposer on FC substrate Coreless substrate
Front End Module:
iPhone 6s Plus
QorvoTQF6405 BAW filter
WLP thin film based
77GHz radar:
Infineon RRN7745P
& NXP MC33MR2001
14 Layers: 7 Layers:
SiP eWLB & RCP
1 Layer:
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
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L/S (µm/µm)
ADVANCED SUBSTRATE ADDRESABLE MARKETS
24
RF, PMIC,
CODEC, TXVR
BB
APP
CPU/ GPU/
DTV/ STB Servers,
High-end
FPGA,
GPU/CPU
, HBM
IoT, WE(+Display drivers,
ASIC, CIS, LED)
RDL layers
RF SiP
Advanced substrates needed
below L/S < 10/10 um!
Status end 2016
– gap present
Discover current and
future applications,
package architectures and
technologies to scale
below L/S < 10/10 um, by
2020!
Technology distribution
per market segment and
application by 2020 in full
report!
2/2 5/5 10/10 15/15 20/20
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
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FC/FO UNIT FORECAST 2015 - 2021
• Highest unit count CAGR expected
from Fan-Out and 2.5D / 3D IC
Yole Developpement ©
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
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FLIP CHIP SUBSTRATE REVENUE FORECAST 2015 - 2021
Yole Developpement ©
Potential FC loss due to FO
WLP penetration!
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
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CURRENT TECHNOLOGY NODE DISTRIBUTION
• Device distribution per technology node:
• 14nm/16 nm to 28nm/20nm node
• >40 nm node:
• >90 nm node:
XXX
16/14 nm28 nm40 nm65 nm
XXX
XXX
XXX
90 nm110 nm180 nm250 nm350 nm 10 nm
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
>40 nm>90 nmIC type
distribution per
technology node
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
28
ADVANCED SUBSTRATE TECHNOLOGY SEGMENTATION
Tech D
L/S [um/um]
Tech A
2020
Tech C
Tech B
100/10010/101/10.1/0.1
L/S [um/um]
Lay
er
Thic
kness
(C
u +
die
lect
ric)
, [um
]
0.1
1
10
100
Discover
comparative
analysis and
overlaps of boards,
package substrate
and Fan-Out WLP
technologies in
the full report!
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
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FC SUBSTRATE
Technology roadmap
Organic FC substrate
technology roadmap
2016
Process
2017 2018B
uild
up lay
er
L/S (µm) SAP
2019 20202015 HVM
FC
pitch
(µm
)
Via pad/via (µm)
CTE
Df
CuP+SOP
CuP+BOL
Volume manufacturing
L/S (µm) ETS
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
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FAN-OUT HVM TECHNOLOGY ROADMAP
2010 2015
XXX
20122011 2013 201420092008
Min. Package
thickness
Minimum
Line/space
Bump pitch
< 2007
Max package
sizeXXX
XXX
XXX XXX
XXX
Max
I/O count XXX
202020172016 2018 2019
XXX
XXX >1000
XXXXXX
XXX
Fan-Out is exhibiting
faster scaling than FC
substrates!
XXXXXX XXX XXX
XXX XXX
XXX XXX
Max. RDL
countXXX XXX
Passivation
materialXXX
Min. Die
thickness XXX XXX XXX XXX
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
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ADVANCED SUBSTRATE CHANGING BUSINESS MODELS AND PLAYER DIFFERENTIATION
System /
Product
Sub-Module /
Sub-systemsDesign & Assembly
Design of chip & package
Wafer Level
Packaging« Middle -end »
SiliconManufacturing
« Front-end »
Package Assembly
& Final test« Back-end »
2016 2020
General assembly, module
and packaging area
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
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9 CURRENT BUSINESS MODELS IN PCB/SUBSTRATE MANUFACTURING
XXX
XXX
XXX
XXXXXX
XXX
1
2 4
3
6 7
8
95
XXX
XXX
XXX
XXX XXX XXX
• The following list represents some of the key players in each business model
• The list is non-exhaustive and can be considerably extended
• Manufacturing -> in-house production
• Integration -> assembling a board/substrate/RDL
into a system (package or PCB card/system etc.)
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
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TOP 100 PCB AND SUBSTRATE MANUFACTURERS
By count and revenue per country
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
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TOP 100 PCB AND SUBSTRATE MANUFACTURERS
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
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ADVANCED PACKAGING AND MANUFACTURING RELATED REPORTS
Status of the Advanced
Packaging Industry 2017February 2017
October 2016
November 2015
Equipment and Materials
for Fan-Out PackagingFebruary 2017
Equipment and Materials
for 3D TSV and 2.5D
PackagingFebruary 2017
September 2016
November 2016
August2016
February 2017
©2017 | www.yole.fr | Advanced Substrates Overview: From IC Package to Board | Sample
© 2017
From Technologies to Market
Yole Développement
FromTechnologies to Market
37
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
MEMS & Sensors
Compound
Semi.
Imaging
Photonics
MedTech
Manufacturing
Advanced
Packaging
Batteries / Energy Management
Power Electronics
Displays
RF
Devices &
Techno.
Advanced
Substrates
Solid State
Lighting(LED, OLED, …)
©2017 | www.yole.fr | About Yole Développement
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4 BUSINESS MODELS
o Consulting and Analysis
• Market data & research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering & costing
• Patent analysis
www.yole.fr
o Reports
• Market & technology reports
• Patent Investigation and patent infringement risk analysis
• Teardowns & reverse costing analysis
• Cost simulation tool
www.i-Micronews.com/reports
o Financial services
• M&A (buying and selling)
• Due diligence
• Fundraising
• Maturation of companies
• IP portfolio management & optimization
www.yolefinance.com
www.bmorpho.com
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication & webcast services
• Events
www.i-Micronews.com
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A GROUP OF COMPANIES
Market, technology
and strategy
consulting
www.yole.fr
M&A operations
Due diligences
www.yolefinance.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Test & Measurement
Expertise
Research & Innovationwww.piseo.fr
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OUR GLOBAL ACTIVITY
30%of our business
40%of our business 30%
of our business
Yole Inc.
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Phoenix
Yole Korea
Seoul
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RESEARCH PRODUCTS - CONTENT COMPARISON
Custom analysis scope is defined with
you to meet your information and
budget needs
Breadth of the analysis
Dep
th o
f th
e a
naly
sis
Custom
Analysis
Workshops
Standard Reports
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42
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts provide market
analysis, technology
evaluation, and business plan
along the entire supply
chain
Integrators and
end-users
Device
makers
Suppliers: material,
equipment, OSAT,
foundries…
Financial investors,
R&D centers
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SERVING MULTIPLE INDUSTRIAL FIELDS
We are workingaccrossmultiples industries to understand the impact of More-than-Moore technologies from device to system
From A to Z…
Transportation
makers
Mobile phone
and consumer
electronics
Automotive
Medical
systemsIndustrial and
defense
Energy
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REPORTS COLLECTION
o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:
• MEMS & Sensors
• RF devices & technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Power electronics
• Batteries and Energy management
• Compound semiconductors
• LED
• Displays
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain
The combined team of 50+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identifythe trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape.
In the past 18 years, we worked on more than 1 500 projects, interacting with technology professional and high level opinion makers from the main players of theindustry.
o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers.
www.i-Micronews.com
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OUR 2017 REPORTS PLANNING (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017
− MEMS Microphones, Speakers and Audio Solutions 2017
− Status of the MEMS Industry 2017
− MEMS & Sensors for Automotive 2017
− High End Inertial Sensors for Defense and Industrial Applications 2017
− Sensor Modules for Smart Building 2017
− Sensing and Display for AR/VR/MR 2017 (Vol 1)
− MEMS Packaging 2017
− Magnetic Sensors Market and Technologies 2017**
− Microspectrometers Markets and Applications 2017**
o RF DEVICES AND TECHNOLOGIES
− RF Components and Modules for Cellphones 2017
− Advanced RF SiP for Cellphones 2017
− 5G and Beyond (Vol 1): Impact on RF Industry, from Infrastructure to Terminals
2017
− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals
2017
− RF Technologies for Automotive Applications 2017
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
o IMAGING & OPTOELECTRONICS
− 3D Imaging & Sensing 2017
− Status of the CMOS Image Sensor Industry 2017
− Camera Module for Consumer and Automotive Applications 2017
− Uncooled Infrared Imaging Technology & Market Trends 2017
− Active Imaging and Lidars 2017 (vol 1)
o MEDTECH
− Status of the Microfluidics Industry 2017
− Solid State Medical Imaging 2017
− Sensors for HomeCare 2017
− Sensors for Medical Robotics 2017
− Organs-on-a Chip 2017
o ADVANCED PACKAGING
− Advanced Substrates Overview 2017
− Status of the Advanced Packaging Industry 2017
− Fan Out Packaging: Market & Technology Trends 2017
− 3D Business Update: Market & Technology Trends 2017
− Advanced QFN: Market & Technology Trends 2017**
− Inspection and Metrology for Advanced Packaging Platform 2017**
− Advanced Packaging for Memories 2017
− Embedded Die Packaging: Technologies and Markets Trends 2017
o MANUFACTURING
− Glass Substrate Manufacturing 2017
− Equipment & Materials for Fan Out Technology 2017
− Equipment & Materials for 3D T(X)V Technology 2017
− Emerging Non Volatile Memories 2017
** To be confirmed
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OUR 2017 REPORTS PLANNING (2/2)
o POWER ELECTRONICS
− Status of Power Electronics Industry 2017
− Power Mosfets Market and Technology Trends 2017
− IGBT Market and Technology Trends 2017
− Power Packaging Market and Technology Trends 2017
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications
− Materials Market Opportunities for Cellphone Thermal Management (Battery
Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017
− Gate Driver Market and Technology Trends in Power Electronics 2017
− Power Management ICs Market Quarterly Update 2017
− Power Electronics for Electrical Aircraft, Rail and Buses 2017
− Thermal Management for LED and Power 2017
o BATTERY AND ENERGY MANAGEMENT
− Status of Battery Industry for Stationary, Automotive and Consumer Applications
2017
o COMPOUND SEMICONDUCTORS
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
− Bulk GaN Technology Status and Market Expectations (Power, LED, Lasers) 2017
o DISPLAYS
− Microdisplays and MicroLEDs 2017
− Display for Augmented Reality, Virtual Reality and Mixed Reality 2017
− QD for Display Applications 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− Emerging Display Technologies 2017**
o LED
− UV LEDs 2017 - Technology, Manufacturing and Application Trends
− Agricultural Lighting 2017 - Technology, Industry and Market Trends
− Automotive Lighting 2017 - Technology, Industry and Market Trends
− Active Imaging and Lidar 2017 (Vol 2) - IR Lighting**
− LED Lighting Module 2017 - Technology, Industry and Market Trends
− IR LEDs 2017 - Technology, Manufacturing and Application Trends
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− CSP LED Module 2017
− LED Packaging 2017
PATENT ANALYSIS by Knowmade
− 3D Monolithic Memory: Patent Landscape Analysis
− Microfluidic Diagnostic: Patent Landscape Analysis
− GaN Technology: Top-100 IP profiles**
− Uncooled Infrared Imaging: Patent Landscape Analysis**
− MEMS Microphone: Patent Landscape Analysis**
− MEMS Microphone: Knowles' Patent Portfolio Analysis**
− MicroLEDs: Patent Landscape Analysis**
− Microbolometer: Patents used in products**
− Micropumps: Patent Landscape Analysis**
− Flexible batteries: Patent Landscape Analysis**
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.
** To be confirmed
©2017 | www.yole.fr | About Yole Développement
47
OUR 2016 PUBLISHED REPORTS LIST (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Gas Sensors Technology and Market 2016
− Status of the MEMs Industry 2016
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads 2016
− Sensors for Biometry and Recognition 2016
− Silicon Photonics 2016
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016
− Uncooled Infrared Imaging Technology & Market Trends 2016
− Imaging Technologies for Automotive 2016
− Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016
o MEDTECH
− BioMEMS 2016
− Point of Care Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− Embedded Die Packaging: Technology and Market Trends 2017
− 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016
− Fan-Out: Technologies and Market Trends 2016
− Fan-In Packaging: Business update 2016
− Status and Prospects for the Advanced Packaging Industry in China 2016
o MANUFACTURING
− Thin Wafer Processing and Dicing Equipment Market 2016
− Emerging Non Volatile Memories 2016
o COMPOUND SEMICONDUCTORS
− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
− Power SiC 2016: Materials, Devices, Modules, and Applications
o LED
− UV LED Technology, Manufacturing and Applications Trends 2016
− OLED for Lighting 2016 – Technology, Industry and Market Trends
− Automotive Lighting: Technology, Industry and Market Trends 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
− LED Packaging 2017: Market, Technology and Industry Landscape
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− Status of Power Electronics Industry 2016
− Passive Components Technologies and Market Trends for Power Electronics 2016
− Power SiC 2016: Materials, Devices, Modules, and Applications
− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends
− Inverter Technologies Trends & Market Expectations 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
o BATTERY AND ENERGY MANAGEMENT
− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016
− Stationary Storage and Automotive Li-ion Battery Packs 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016©2017 | www.yole.fr | About Yole Développement
48
OUR 2016 PUBLISHED REPORTS LIST (2/2)
PATENT ANALYSIS by Knowmade
− Microbattery Patent Landscape Analysis
− Miniaturized Gas Sensors Patent Landscape Analysis
− 3D Cell Culture Technologies Patent Landscape
− Phosphors and QDs for LED Applications Patent Landscape 2016 report
− TSV Stacked Memory Patent Landscape
− Fan-Out Wafer Level Packaging Patent Landscape Analysis
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.
MORE INFORMATION
o All the published reports from the Yole Group of Companies are available on our website
www.i-Micronews.com.
o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the
number of reports you are interested in and select the related offer. You then have up to 12
months to select the required reports from the Yole Développement, System Plus Consulting
and KnowMade offering. Pay once and receive the reports automatically (multi-user format).
Contact your sales team according to your location (see the last slide).
©2017 | www.yole.fr | About Yole Développement
49
MICRONEWS MEDIA
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©2017 | www.yole.fr | About Yole Développement
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CONTACT INFORMATION
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o CONSULTING AND SPECIFIC ANALYSIS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected] - +33 4 72 83 01 80
o REPORT BUSINESS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected] - +49 15 123 544 182
• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Japan & Asia: Miho Othake, Account ManagerEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
o FINANCIAL SERVICES
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o GENERAL
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©2017 | www.yole.fr | About Yole Développement
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole Développement has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer
market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
Future higher-end products will require package substrates with L/S < 10/10 um and boards with L/S < 30/30 um. These demands have given rise to three distinct competition areas, as depicted in figure 1:1- Board vs. IC substrate2- IC substrate vs. FOWLP3- FOWLP vs. 2.5D/3D packaging
This overview report proposes a common terminology for diverse substrate architectures and provides an advanced substrate segmentation, followed by in-depth analysis of advanced substrate drivers, markets and dynamics, the three competition areas, current and future substrate technologies and architectures, supply chain, player positioning, business models shifts, and advanced substrate market forecasts (2015 - 2021).
ADVANCED SUBSTRATES OVERVIEW: FROM IC PACKAGE TO BOARDMarket & Technology report - February 2017
ADVANCED SUBSTRATES AS A KEY ENABLER OF FUTURE PRODUCTS AND MARKETS
How can advanced substrates and boards bridge the gap created by front-end scaling?
KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.comOverview of board, substrate and RDL interconnects• Terminology definition• Segmentation by substrate types • Segmentation by players and
respective business models
Analysis of technology trends• Competition zones and overlaps
> Board vs. IC substrate> IC substrate vs. WLP RDL
• High-level technology comparison• Technology roadmaps
Future advanced substrate market development• Identifying the main players• Supply chain analysis and shifting
business models• Market forecasts for IC substrates
and WLP RDL• Outlook on new market drivers
and emerging applications
(Yole Développement, February 2017)
Advanced substrate technology - Competitive areas
Cu damascene Wafer BEOL
100/100 10/10 1/1 0.1/0.1 L/S [um/um]
Laye
r th
ickn
ess
(Cu
+ di
elec
tric
), [u
m]
0.1
1
10
100
Semi-additive (thin film RDL)
Semi-additive (substrates)
Fan-In/Fan-Out WLP/PLP
Board
12
3
IC substrates vs. WLP
Board vs. IC
substrate
2.5D / 3DIC vs. DD Fan-
Out
ADVANCED SUBSTRATES OVERVIEW: FROM IC PACKAGE TO BOARD
The board vs. FC substrate area is characterized by the transition from the subtractive to the mSAP process, and competition between board and substrate manufacturers. Evaluation of “substrate-
like PCBs” is already under way at OEMs, and so too the potential new integration opportunities they could bring. Furthermore, developments in FC substrate, FOWLP, and 2.5D/3D packaging have created an immense competitive arena for L/S < 10/10 um packaging, with a large variety of solutions coming from business models across the supply chain: IDMs, foundries, OSATs, WLP houses, substrate manufacturers, and EMS. As shown in figure 2, the transition to substrates for ICs below L/S < 10/10 um has begun, led by application processors/basebands in FOWLP and advanced FC substrates in mobile, and the first GPUs in 2.5D/3D TSV configuration. The “below L/S < 10/10 um” advanced substrate roadmap is open, with intense R&D underway and each manufacturer developing strategies and targets for their respective solutions.
This report offers a detailed analysis of applications that will scale below L/S < 10/10 um by 2020, the limitations and advantages of competing technologies, and links the applications to prospective advanced substrate solutions and their providers. (Yole Développement, February 2017)
Advanced substrate addresable markets
TECHNOLOGY EVOLUTION AND ITS IMPACT ON SUPPLY CHAIN SHIFTS
The competitive areas of boards, substrates, and thin-film RDLs are directly linked to the underlying technologies used. Board manufacturers are representatives of the subtractive process, which is hard to scale beyond L/S 30/30 um. Meanwhile, substrate manufacturers have experience with SAP and mSAP processes that can lead to larger substrates and potentially “substrate-like PCBs”, but at higher cost. On the other side, when competing with FOWLP, FC substrates have a cost advantage but FOWLP scales faster. This report compares the main processes and technologies used, discusses the limitations, advantages, and opportunities for each process, and provides roadmaps for FC substrates
2/2 5/5 10/10 15/15 20/20
RF, PMIC, CODEC, TXVR
BB
APP
CPU/ GPU/ DTV/ STB
Servers, High-end
FPGA, GPU/CPU, HBM
IoT, WE (+Display drivers,
ASIC, CIS, LED)
RDL layers
RF SiP
Advanced substrates needed below L/S < 10/10 um!
L/S [um/um]
THREE DISTINCT COMPETITIVE AREAS, AS A CONSEQUENCE OF SCALING
(Yole Développement, February 2017)
9 current business models in PCB/substrate manufacturing
XXX
XXX
XXX
XXX XXX
XXX
1
2 4
3
6 7
8
95
XXX
XXX
XXX
ADVANCED SUBSTRATE SOLUTIONS - FUELING TOMORROW’S MARKETS
FOWLP and 2.5D/3D platforms are the advanced packaging platforms with the highest growth, boasting revenue CAGRs of 49% and 43% respectively from
2015 - 2021. The Fan-Out platform is forecast to exceed $2.5B in packaging services revenue by 2021, while the 2.5D/3D platform is expected to surpass $1B in the same timeframe. The Flip Chip packaging platform holds 85% of the advanced packaging market, but regardless of its solid 5% CAGR, it is losing market share to FO WLP resulting in a drop to 76% by 2021. The fast-rising FOWLP platform is ambitiously developing higher density solutions while at the same time facing more competition from advanced FC and hybrid FC solutions. Though the FC substrate market exhibited a dip in 2016 due to further adoption of Fan-Out (lead by TSMC inFO, it is expected to bounce back with mild growth at a 1.6% revenue CAGR. This can be split into a 3.6% FC CSP CAGR and a stagnating 0.6% FC BGA CAGR. Overall, FC substrate revenue is expected to exceed $8B by 2021.(Yole Développement, February 2017)
Flip Chip substrate revenue forecast 2015-2021
0
2
4
6
8
10
12
2014 2015 2016 2017 2018 2019 2020 2021
FC s
ubst
rate
rev
enue
($B
)
Potential FC substrate loss due to FO WLP penetration
FC lossFC BGAFC CSP
Find more details about
this report here:
MARKET & TECHNOLOGY REPORT
Introduction 3
> Report synergies> Advanced substrate activity > Objectives
Advanced substrate segmentation 10
> PCB/substrate/RDL segmentation> Report scope
Executive summary 20 Market drivers 68
> Advanced packaging drivers> Board and advanced substrate drivers
Market dynamics 89
> Competing platforms (board vs. IC substrate; IC substrate vs. WLP)
> Disruptions and opportunities> IoT segmentation scenario
Board vs. FC substrate 100
> Market segments> Applications> Technology competition
FC substrate vs. WLP 106
> Market segments> Applications> Substrate technology comparison> Accessible markets
Substrate technology 141
> Technology comparison and overview, by key players
> Technology roadmaps
Players and supply chain 163
> Player landscape and positioning> Business models and strategies - overview
Market forecasts 194
> Adv. FC substrates vs. WLP - Unit count- Revenue
> FC CSP vs. FC BGA
Conclusions 208
Yole Développement presentation 215
TABLE OF CONTENTS (complete content on i-Micronews.com)
COMPANIES CITED IN THE REPORT (non exhaustive list)3CEMS, 3M, 3Win Group, AMD, Amkor, Amphenol, Aoshikang, Apple, AOI AT&S, ASE, Avago, Benchmark, Boardtek, Career, CCTC, Celestica, Chin Poon, ChipBond, ChipMOS, CMK, Compeq, Cosmotech, Daeduck, Deca Technologies, Dynamic, Eastern, Ellington, Ericsson, Facebook, Fast Print, Flex, Flexium, Founder, Foxconn, Fujikura, Fujitsu, Gold Circuit, Google, HannStar Board, HiSilicon, Hitachi Chemical, Huatian, Huawei, Ibiden, Ichia, Inari Berhad, Infineon, Intel, Isu Petasys, Jabil, JCET, Juniper Networks, KCE Electronics, Kingboard, Kinsus, Kinwong, KYEC, Kyocera, Kyoden, Lenovo, LG Innotek, Meiko, Mflex, MGC, Micron, Nanium, Nantong Fujitsu, Nan Ya PCB, Nepes, Nippon Mektron, Nitto Denko, NTK, NXP, OKI, Olympic, Oracle, Plexus, Powertech Technology, Renesas, Samsung, Sanmina, Schweizer, Shennan Circuit, Shinko, Simmtech, SK Hynix, Somacis, SPIL, STATS ChipPAC, Sumitomo Denko, Taiwan PCB Techvest, TDK, Toppan, Tripod, TTM Technologies, Qorvo, Qualcomm, TSMC, Unimicron, Unisem, Unitech, UTAC, Wus Group, Würth Elektronik, Wuzhou, Xilinx, Yamamoto Manufacturing, Young Poong Group, ZD Tech, and many more…
Andrej Ivankovic is a Technology & Market Analyst on the Advanced Packaging and Semiconductor Manufacturing team at Yole Développement, the “More than Moore” market research and strategy consult ing company. Andrej holds a master’s degree in Electrical Engineering with specialization in Industrial Electronics from the University of Zagreb, Croatia, and a PhD in Mechanical Engineering from KU Leuven, Belgium. He started at ON Semiconductor, performing reliability tests, failure analysis, and characterization of power electronics and packages. He then worked for several years as an R&D engineer at IMEC Belgium on the development of 3D IC technology, focused on electrical and thermo-mechanical issues of 3D stacking and packaging. During this time he also worked at GLOBALFOUNDRIES as an external researcher. Andrej regularly presents at international conferences and has authored or co-authored >20 papers and one patent.
• 3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update
• Embedded Die Packaging: Technology and Market Trends 2017
• Thin Wafer Processing and Dicing Equipment Market
• Status of Panel-Level Packaging & Manufacturing
Find all our reports on www.i-micronews.com
RELATED REPORTSBenef it from our Bundle & Annual Subscription offers and access our analyses at the best available price and with great advantages
and thin-film RDLs (FOWLP). Competitive technologies, scaling, system-level integration (SiP), and market uncertainty are affecting the supply chain and triggering several observable business model shifts and expansions. While the overall semiconductor supply chain is shifting down one tier due to scaling, system-level manufacturers are expanding in both directions. A detailed analysis of main players and their rankings, strategies and business model shifts is provided in this report.
What advanced substrate solutions are present today? Which markets and applications will require advanced substrates below L/S 10/10 um, what solutions are being developed, and how does this also affect boards? What are each advanced substrate technology’s limitations and advantages, which players are taking charge of which solution, and how is the supply chain changing? Discover the answers in the Advanced Substrates Overview, Yole Développement’s latest report!
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Displays, Image Sensors, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho, KnowMade and PISEO support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.
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2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. .
2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as required under article 2.5 shall remain at the Buyer’s risk.
3. PRICE, INVOICING AND PAYMENT 3.1 Prices are given in the orders corresponding to each Product
sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time to time. The effective price is deemed to be the one applicable at the time of the order.
3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange to this uncertainty, the company will get a discount that can vary from 15% to 10%.
3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account: HSBC, 1 place de la Bourse 69002 Lyon France Bank code: 30056 Branch code: 00170 Account n°: 0170 200 1565 87BIC or SWIFT code: CCFRFRPP IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order. 3.4 Payment is due by the Buyer to the Seller within 30 days
from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database, tool...) are delivered only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.
4. LIABILITIES 4.1 The Buyer or any other individual or legal person acting on
its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement
4.3 In no event shall the Seller be liable for: a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products; b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.
4.4 All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot be guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that any Product will be free from infection.
5. FORCE MAJEURE The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties, equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
6. PROTECTION OF THE SELLER’S IPR 6.1 All the IPR attached to the Products are and remain the
property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as: • Information storage and retrieval systems; • Recordings and re-transmittals over any network (including
any local area network); • Use in any timesharing, service bureau, bulletin board or
similar arrangement or public display; • Posting any Product to any other online service (including
bulletin boards or the Internet);• Licensing, leasing, selling, offering for sale or assigning the
Product. 6.3 The Buyer shall be solely responsible towards the Seller of
all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the copyrights and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company, the joint venture done with a third party etc..cannot access the report and should pay a full license price.
7. TERMINATION 7.1 If the Buyer cancels the order in whole or in part or postpones
the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. MISCELLANEOUS All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer. Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party. The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time.
9. GOVERNING LAW AND JURISDICTION 9.1 Any dispute arising out or linked to these Terms and
Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
TERMS AND CONDITIONS OF SALES