donald e. stephens convention center rosemont, illinois · design and assembly new! 8:30am –...

2015 SMTA International SHOW DIRECTORY >> 1 SMTAssociation @SMTAorg #SMTAI

September 27– October 1, 2015Donald E. Stephens Convention Center

Rosemont, Illinois

SMTAInternational

Be Part of the Solution...Where Leaders Solve Tomorrow’s Challenges Today

PREMIUM SPONSOR

Technical ConferenceSeptember 27 – October 1

Electronics ExhibitionSeptember 29 – 30

www.smta.org/smtai

Co-located with IPC Fall Standards Development Committee Meetings

SHOW DIRECTORY

2015 SMTA International SHOW DIRECTORY >> 3®

www.tri.com.tw

YOUR TESTAND INSPECTION PARTNER

Discover world-class inspection solutions chosen by leading global EMS.

INSPECT WITH CONFIDENCE

ONE STOP SOLUTIONSPI + AOI + AXI + ICT

Meet us at SMTAI Booth 712or join Green Tech Tour 1 & 4

(Tue 10:30 am or Wed 1:30 pm)

TR7600LL SII3D AXI for Your Future Today• High Precision 3D Imaging

with Tomosynthesis Technology

• CT Upgradeable for Real 3D Solder Imaging & Review

• Intelligent assistant for easy CAD-based programming

See youat booth712

SMTAssociation @SMTAorg #SMTAI SMTAssociation @SMTAorg #SMTAI

The Surface Mount Technology Association is proud to present our annual surface mount technology and electronic assembly event. Collaboration is vital to the success of our industry — we are honored to have the IPC join us again this year for their Fall Committee Standards Development Meetings. SMTA International and the IPC meetings provide a unique opportunity to share and learn.

The SMTA International conference is highly regarded because we attract an outstanding group of international authors, speakers and volunteers. The technical program includes technical papers and presentations from subject matter experts covering a wide range of surface mount and electronic assembly subjects. Our technical program includes the Evolving Technologies Summit, the Harsh Environments Symposium and the Lead-Free Soldering Symposium. Our main conference program includes sessions on Electronic Manufacturing Services (EMS), Flux, Solder and Adhesives (FSA), Manufacturing Excellence (MFX), Advanced Packaging Technology (APT), Inspection (INS) and Substrates (SUB). Be sure to check out the Poster Sessions, Tech Tours, the Solder Paste and Solder Joint Automatic Inspection Experience, Robotics Alley and the Listen, Learn, Lead (L3) Series.

Learning is a key element of professional growth and there certainly is a lot to learn at SMTA International. On Tuesday there is a special event for our Executive Administrator and my dear friend, JoAnn Stromberg. She is retiring after 29 years of outstanding service to the SMTA. JoAnn’s leadership transformed the SMTA into the industry leading organization it is today. Please join us at this special event to celebrate JoAnn’s remarkable legacy and wish her well on her retirement.

I am honored to be the Conference Director. It gives me the opportunity to work with the outstanding individuals on the Technical Advisory Committee (TAC). Every TAC member is a highly respected industry professional. Their support, dedication and work ethic makes my job easy. Every TAC member is dedicated to the ongoing success of this conference; the SMTA is truly fortunate to have the support of this exceptional team. I want to extend my personal thanks and gratitude to every member of the TAC. I also want to extend my personal thanks to the all of the individuals and companies that support the SMTA and SMTA International. Their ongoing support and dedication to the SMTA is what makes SMTA International such an outstanding event. My sincere thanks to all of the authors, co-authors, speakers,

session chairs, co-chairs, instructors, volunteers and the SMTA staff and officers. This conference — and the continued success of the SMTA — would not be possible without their unwavering support and dedication.

The mission of SMTA International is education and professional growth. We strive to create a meaningful, beneficial and enjoyable experience for every conference attendee. Your suggestions help us improve SMTA International and other SMTA programs. Please help us by completing and returning your speaker evaluation forms after each session. You can also submit additional comments to the SMTA via our web site at www.smta.org.The Technical Advisory Committee and the SMTA staff and Board sincerely hope that SMTA International is a beneficial and enjoyable experience for you and your company. Thank you for participating in our conference. Enjoy your visit to Chicago!

Best Regards,Rob RowlandSMTAI Conference DirectorAxiom ElectronicsOperations Engineering Manager

Welcome to Chicago for the Surface Mount Technology Association International Conference and Exposition (SMTAI), the world’s leading conference for the electronics assembly industry.

Our Technical Committee has been tireless in the pursuit of the latest and greatest topics and authors and I’m certain even the most experienced professional will be exposed to new and valuable information. Please make sure your calendar includes our opening session and keynote speaker, Rozalia Beica, Chief Technology Officer at Yole Développment.

SMTAI does not only cater to the highly technical and experienced professional. There are options for anyone involved in electronics assembly. There are programs and tutorials aimed at those just beginning in the industry and interested in jump-starting their understanding of critical assembly operations, quality, and optimization. The Technical Committee has continued to refine the event and expand ways to maximize participant value. Some of these include:

• L3 — Listen, Learn, and Lead series of forward looking presentations.

• Postersessionswithmanygreattopicsofferanother avenue for attendees to learn and have direct interaction with the authors.

• Symposiawhichontheirowncouldbeseparateconferences focused on Alternate Alloys, Wearable Technology, Harsh Environments, and our ever popular Lead-Free Soldering program on Thursday.

It is encouraging to see continued interest and growth in the Exhibition portion of SMTAI. Having suppliers of materials, services, and equipment part of the event extends the applicability of the knowledge attendees can obtain. These companies complement our technical sessions with practical experience that will allow participants to get direct

solutions to their real-world issues. The Exhibition Committee has developed a number of ways to enhance your interaction with exhibitors through lunch options, special Automatic Inspection Experience, Tech Tours, Robotics Alley, User Solution Lunch and Beer Tasting. The SMTA is rooted in networking and the non-commercial sharing of knowledge. We are proud of the inclusiveness offered by the Association which is evidenced by the various SMTA Committee meetings and events throughout the week. It is great to see such diversity and expansion in our reach with events like the Women’s Leadership Connection, Fun Run, Golf Outing, and Students and Young Professionals Night Out.

To round out the experience we are pleased to co-locate with IPC Standards Committees for the third year. We are hoping more people take advantage of participating in both events as it is guaranteed to provide a perspective no other venue can offer: Leading edge technology developments, practical supplier solutions, combined with the rigor and hard work to develop what was once new technology into standards.

Lastly, but most importantly, the event will include a special celebration in recognition of JoAnn Stromberg’s remarkable career with the SMTA Tuesday evening. Please join me, the Association, and the Industry, in a once-in-a-lifetime salute to someone who has touched many lives, including mine, and made the SMTA the global, growing, world-leading organization and “family” it is today.The SMTA International Conference and Exhibition is always a highlight of the year but this year simply cannot be missed.

Bill BarthelPresident, SMTAPlexus CorporationManager, Quality Solutions

Welcome to SMTA International 2015 and Our Chicago Venue

Letter from the PresidentContentsConference at a Glance . . . . . . 4

Acknowledgments . . . . . . . . . . 6

General Information . . . . . . . . . 7

Sponsors . . . . . . . . . . . . . . . . . 8

IPC Meetings . . . . . . . . . . . 9-10

Special Events . . . . . . . . . 11-14

Opening/Keynote . . . . . . . . . . 11

Poster Session . . . . . . . . . . . . 12

Inspection Feature . . . . . . . . . 15

L3 Series . . . . . . . . . . . . . . . . . 16

Tutorials . . . . . . . . . . . . . . 17-19

Technical Sessions . . . . . . 20-28

Exhibitor Guide. . . . . . . . . . . . 29

Exhibitor Index . . . . . . . . . . . . 55

Exhibits Floor Plan . . . . . . . . . 62

2015 SMTA International SHOW DIRECTORY >> 3®

www.tri.com.tw

YOUR TESTAND INSPECTION PARTNER

Discover world-class inspection solutions chosen by leading global EMS.

INSPECT WITH CONFIDENCE

ONE STOP SOLUTIONSPI + AOI + AXI + ICT

Meet us at SMTAI Booth 712or join Green Tech Tour 1 & 4

(Tue 10:30 am or Wed 1:30 pm)

TR7600LL SII3D AXI for Your Future Today• High Precision 3D Imaging

with Tomosynthesis Technology

• CT Upgradeable for Real 3D Solder Imaging & Review

• Intelligent assistant for easy CAD-based programming

See youat booth712

4 >> 2015 SMTA International SHOW DIRECTORY 2015 SMTA International SHOW DIRECTORY >> 5

SMTA International Conference at a GlanceSUNDAY, SEPTEMBER 27

TUTORIALS

T1 Advanced Closed Loop Process Control for Selective Soldering NEW!8:30am – 12:00pm (Room 50, Page 17)

T2 It is Time for Low Temperature: Low Temperature Solders, New Developments, and Their Applications NEW!8:30am – 12:00pm (Room 51, Page 17)

T3 Stencil Printing – A Practical Guide to Defect Prevention and Yield Improvement8:30am – 12:00pm (Room 52, Page 17)

T4 0201, 01005 Plus Smaller Chip Component Design and Assembly NEW!8:30am – 12:00pm(Room 53, Page 17)

T5 Solder Reflow Fundamentals — Understanding Thermal Profiles and Defect Mitigation NEW!1:30pm – 5:00pm (Room 52, Page 17)

T6 Manufacturing Wrong: Case Studies in Non-Conformance NEW!1:30pm – 5:00pm (Room 50, Page 17)

T7 SMT Design and Assembly Process Principles for Flexible and Rigid Flex Circuits NEW!1:30pm – 5:00pm (Room 51, Page 18)

T8 High-Temperature Electronics Manufacture Using Selective Laser and Robotic Point Alloys NEW!1:30pm – 5:00pm (Room 53, Page 18)

MONDAY, SEPTEMBER 28

TUTORIALS

T9 Failure Analysis: Analytical Techniques and What They Tell You About Your Failure8:30am – 12:00pm, (Room 53, Page 18)

T10 3D Packaging for the SMT Specialist NEW!8:30am – 12:00pm, (Room 54, Page 18)

T11 Solder Joint Reliability — Principles and Applications NEW!8:30am – 12:00pm, (Room 52, Page 18)

T12 SMT and Through Hole Defect Analysis and Process Troubleshooting – Part 1 NEW!8:30am – 12:00pm, (Room 55, Page 18)

T13 ZEN and Science of Electronic Assembly — Best Practices in Electronic Assembly Processes— Part 1 NEW!8:30am – 12:00pm, (Room 51, Page 18)

T14 Reliability of Electronics — The Role of Intermetallic Compounds NEW!1:30pm – 5:00pm, (Room 52, Page 18)

T15 “Tipping Point” Cleaning and Deflux NEW!1:30pm – 5:00pm, (Room 54, Page 19)

T16 Design for Manufacturing (DFM): Today’s Design Challenges Require New Assembly Methods1:30pm – 5:00pm, (Room 53, Page 19)

T17 SMT and Through Hole Defect Analysis and Process Troubleshooting – Part 2 NEW! 1:30pm – 5:00pm, (Room 55, Page 19)

T18 ZEN and Science of Electronic Assembly — Best Practices in SMT Assembly— Part 2 NEW! 1:30pm – 5:00pm, (Room 51, Page 19)

EVOLVING TECHNOLOGIES SUMMIT ET1 Alternate Alloys9:00am – 10:30am, (Room 48, Page 20)

ET2 Alternate Alloys (continued)11:00am – 12:30pm, (Room 48, Page 20)

ET Keynote Lunch12:30pm – 1:30pm, (Room 48, Page 20)

ET3 Wearable Electronics Technology Development1:30pm – 3:00pm, (Room 48, Page 20)

ET4 Evolving Technologies Panel FREE!3:30pm – 5:00pm, (Room 48, Page 20)

HARSH ENVIRONMENTS SYMPOSIUM HE1 Reliability of Components in Harsh Environments8:00am – 10:00am, (Room 45, Page 21)

HE2 Electronics in Corrosive Environments10:30am – 12:30pm, (Room 45, Page 21)

HE Keynote Lunch12:30pm – 1:30pm, (Room 45, Page 21)

HE3 Materials for Harsh Environments1:30pm – 3:00pm, (Room 45, Page 21)

TUESDAY, SEPTEMBER 29

OPENING KEYNOTE SESSION — FREE

3D Technology Trends and Manufacturing Challenges8:00am – 10:00am, (Room 46, Page 11) TECHNICAL SESSIONS

APT1 3D IC and PoP Assembly11:00am – 12:30pm, (Room 44, Page 22)

EMS1 Taking the Cost Out of EMS: Getting the Best Return for Lean Initiatives11:00am – 12:30pm, (Room 54, Page 22)

FSA1 Improved Area Array Component Solder Reliability Through the Use of Underfills, Edge Bonds and Encapsulants11:00am – 12:30pm, (Room 47, Page 22)

MFX1 Pathways to Prolific Printing11:00am – 12:30pm, (Room 49, Page 22)

HE4 Electronics Ruggedization Through Coating11:00am – 12:30pm, (Room 45, Page 22)

APT2 BGA Reliability2:00pm – 3:30pm, (Room 44, Page 23)

FSA2 New Developments in No Clean Solder Paste and Flux Technology and Reliability2:00pm – 3:30pm, (Room 47, Page 23)

MFX2 Challenges in Advanced Package on Package Applications2:00pm – 3:30pm, (Room 49, Page 23)

HE5 Thermal Management Get the Heat Out2:00pm – 4:00pm, (Room 45, Page 23)

APT3 Advances in WLP and CSP Interconnect Design and Assembly Processes4:00pm – 5:30pm, (Room 44, Page 24)

FSA3 The How’s and Why’s of Fluxes in Electronics Assembly4:00pm – 5:30pm, (Room 47, Page 24)

L3 SESSIONSThe sessions below spotlight some of today’s challenges and their solutions. These sessions are FREE to all SMTA International attendees and will be held in Room 55 (Conference Area).

L31 Come and See Where the Future Is Going11:00am – 12:30pm(Room 55, Page 16)

L32 Environmental Solutions Require Diligence2:00pm – 3:30pm(Room 55, Page 16)

CERTIFICATION

SMT Process Certification8:30am – 5:00pm, (Room 56)

SMT Six Sigma Certification8:30am – 5:00pm, (Room 57)

Career CenterSeptember 29 – 30

Visit the SMTA Booth in the Registration Lobby

Positions posted in the Career Center include: Production, Manufacturing, Process Engineers, Management, Support, Quality Control, Sales and Marketing, R & D.

This is a free service provided to our SMTA members and industry colleagues.

4 >> 2015 SMTA International SHOW DIRECTORY 2015 SMTA International SHOW DIRECTORY >> 5 SMTAssociation @SMTAorg #SMTAI

SMTA International Conference at a GlanceWEDNESDAY, SEPTEMBER 30

TECHNICAL SESSIONS

FSA4 The Influence and Impact of Materials and Process Selection on Reliability8:00am – 9:30am, (Room 47, Page 24)

INS1 X-Ray Inspections: The Growing Complexity Of Applications and Capability Needs for Tomorrow’s PCBs8:00am – 9:30am, (Room 51, Page 24)

MFX3 Cleaning Parameters and Cleanliness Monitoring of Electronic Assemblies8:00am – 9:30am, (Room 49, Page 24)

SUB1 Investigating Surface Finish Reliability And Attributes Outside of Solderability8:00am – 9:30am, (Room 45, Page 25)

APT4 Improvements in Voiding and Reliability of BTCs8:00am – 10:00am, (Room 44, Page 25)

FSA5 Solder Joint Reliability Assessment10:30am – 12:00pm, (Room 47, Page 25)

INS2 PCB Quality Management10:30am – 12:00pm, (Room 51, Page 25)

MFX4 Ruggedization Technologies and Materials to Meet Today’s Electronics Requirements 10:30am – 12:00pm, (Room 49, Page 25)

APT5 Advances in Electronics Failure Analysis10:30am – 12:30pm, (Room 44, Page 26)

SUB2 Emerging Topics on Design and Process Technologies of Printed Circuit Boards10:30am – 12:00pm, (Room 45, Page 26)

APT6 Solder Joint Reliability2:00pm – 3:30pm, (Room 44, Page 26)

FSA6 Test Optimization for Improved Quantification of Material and Assembly Quality2:00pm – 3:30pm, (Room 47, Page 26)

INS3 Advances in Process Controls: From 3D Printing to 3D Inspection to Measuring Thermal Expansion Mismatch2:00pm – 3:30pm, (Room 51, Page 27)

MFX5 Innovation and Process Control for Liquid Soldering Processes2:00pm – 3:30pm, (Room 49, Page 27)

SUB3 Surface Finish Parameters that Impact Interconnect Reliability2:00pm – 3:30pm, (Room 45, Page 27)

APT7 Ceramic Column Grid Arrays-Applications, Materials and Optimization4:00pm – 5:30pm, (Room 44, Page 27)

SUB4 Influence of Finishes on PCB Reliability4:00pm – 5:30pm, (Room 45, Page 27)

L3 SESSIONS The sessions below spotlight some of today’s challenges and their solutions. These sessions are FREE to all SMTAI attendees and will be held in Room 55 (Conference Area).

L33 Factory Automation–Optimizing to Reduce Cost And Increase Reliability and Yield8:00am – 10:00am, (Room 55, Page 16)

L34 Real World SMT Production Problems, Investigations and Solutions10:30am – 11:30am, (Room 55, Page 16)

L35 Product Life Cycle2:00pm – 3:00pm, (Room 55, Page 16)

CERTIFICATION



THURSDAY, OCTOBER 1

TUTORIAL…FREE to SMTA Members! T19 LED, BGA, and QFN Assembly and Inspection NEW!8:30am – 12:00pm, (Room 48, Page 19)

LEAD-FREE SYMPOSIUM LF1 Universal Instruments Consortium Pb-Free Project Update8:30am – 10:00am, (Room 47/49, Page 28)

LF2 Corrosion and Flux Residue Impacts of Lead Free Solders10:30am – 12:00pm, (Room 47/49, Page 28)

LF3 Research Challenges With Tin Whiskers And Mitigation1:00pm – 2:30pm, (Room 47/49, Page 28)

LF4 Lead-Free Solder Joint Reliability: Recent Advances3:00pm – 4:30pm, (Room 47/49, Page 28)

CERTIFICATION



Important SMTA MeetingsMonday, September 28Speaker Breakfast 7:00 am Room 42Marcom Committee 11:30 am BoardroomCertification Committee 2:00 pm BoardroomChapter Leadership Committee 4:00 pm BoardroomWomen’s Leadership Connection 5:00 pm Room 42

Tuesday, September 29Speaker Breakfast 7:00 am Room 42Annual Meeting/Opening Keynote 8:00 am Room 46/48Chapter Officer Meeting 12:30 pm Exhibit Hall Officer LoungeTraining Committee 12:30 pm BoardroomInternational Attendee Meeting 2:00 pm Exhibit Hall Officer LoungeGreat Lakes Chapter Meeting 3:00 pm Exhibit Hall Officer Lounge MSD Council 3:00 pm Room 54Ambassador’s Meeting 4:00 pm Exhibit Hall Officer LoungeJoAnn Stromberg’s 6:00 pm Crowne PlazaRetirement Party

Wednesday, September 30Speaker Breakfast 7:00 am Room 42

Exhibitor Appreciation Breakfast 8:00 am Exhibit Hall Courtyard

Membership Committee/S&YP 10:00 am Boardroom

User Solution Lunch 12:00 pm Chapter Officer Lounge

Technical Committee 5:30 pm Room 42

Thursday, October 1Speaker Breakfast 7:30 am Room 42


SMTA International Technical Advisory Committee The distinguished SMTA International Technical Advisory Committee includes electronics manufacturing and packaging experts representing all facets of the industry. The Committee designed the 2015 conference program to ensure that today’s latest trends and developments are fully addressed.

Rob RowlandAxiom ElectronicsConference Director

Raiyo F. Aspandiar, Ph.D.Intel CorporationOrganized Substrate and

Alternate Alloy Sessions

Elizabeth BenedettoHewlett-Packard CompanyOrganized Lead-Free Sessions

Lars BöttcherFraunhofer IZM BerlinOrganized Substrate Sessions

Mike BuetowCircuits Assembly MagazineOrganized Lean Manufacturing

Session

William Cardoso, Ph.D.Creative ElectronOrganized Inspection Sessions

Srinivas Chada, Ph.D.SchlumbergerOrganized Substrate Sessions

Marie ColeIBM CorporationOrganized Advanced

Packaging Sessions

Richard Coyle, Ph.D.Alcatel-LucentOrganized Alternate Alloy

Sessions

John Evans, Ph.D.Auburn UniversityOrganized Harsh Environment

Sessions

Trevor GalbraithGlobal SMT & PackagingOrganized Factory Automation

Session

Reza Ghaffarian, Ph.D.Jet Propulsion LaboratoryOrganized Evolving

Technologies Sessions

Steve GreathousePlexus Corp.Organized Evolving

Technologies Sessions

Denis JeanKesterOrganized Flux, Solder and

Adhesives Sessions

Matt Kelly, P.Eng., MBAIBM CorporationOrganized Lead-Free Sessions

Jeff KennedyCelestica Inc.Organized Manufacturing

Excellence Sessions

Robert Kinyanjui, Ph.D.John Deere Electronic SolutionsOrganized Harsh Environment

Sessions

Pradeep Lall, Ph.D., MBAAuburn UniversityOrganized Harsh Environment

Sessions

Andrew MawerFreescale SemiconductorOrganized Advanced

Packaging Sessions

Randy Schueller, Ph.D.DfR SolutionsOrganized Advanced

Packaging Sessions

Chrys SheaShea Engineering ServicesOrganized Manufacturing

Excellence Sessions

Lenora ToscanoMacDermid Inc.Organized Substrate Sessions

Paul Vianco, Ph.D.Sandia National LaboratoriesOrganized Lead-Free Sessions

Bob Willisbobwillisonline.comEuropean Support

Charles G. Woychik, Ph.D.Invensas CorporationOrganized Advanced

Packaging Sessions

Bill Barthel, PresidentPlexus Corp.

Raiyo Aspandiar, Ph.D., Vice President Technical ProgramsIntel Corporation

Michelle Ogihara, Vice President CommunicationsSeika Machinery, Inc.

Eileen Hibbler, Vice President MembershipTEK Products

Debbie Carboni, Vice President ExpositionsKYZEN Corporation

Rich Henrick, SecretarySanmina Corporation

Robert Kinyanjui, Ph.D., TreasurerJohn Deere Electronic Solutions

OFFICERS PLANNING COMMITTEEMatt Kelly, P.Eng., MBA,ChairIBM Corporation

Martin Anselm, Ph.D.Rochester Institute of Technology

Richard Coyle, Ph.D.Alcatel-Lucent

Tim JensenIndium Corporation

Scott PrioreCisco Systems Inc.

SMTA Board of Directors

EXHIBITOR COMMITTEE

Debbie Carboni, KYZEN Corporation, Committee Chair

Mick Austin, Vitronics Soltec USA

Jim Baker, Spectra Sales Corporation

Jason Fullerton, Alpha

Adrienne Gerard, Martin (a Finetech Company)

Hal Hendrickson, Nordson DAGE

Jay Hindersman, Accurate Carriers USA

Michelle Ogihara, Seika Machinery Inc.

Verena Salewski, Viscom Inc.

Rick Short, Indium Corporation

Sal Sparacino, ZESTRON America

Sherry Stepp, KYZEN Corporation

Ron Torenko, Torenko and Associates

Thank YouSincere appreciation to the many individuals and companies listed below.

SMTAssociation @SMTAorg #SMTAI6 >> 2015 SMTA International SHOW DIRECTORY 2015 SMTA International SHOW DIRECTORY >> 7

General InformationRegistration Hours Sunday, September 277:00am – 5:00pmHall G (second level)

Monday, September 287:00am – 5:00pmHall G (second level)

Tuesday, September 297:00am – 5:00pmHall G (second level)

Wednesday, September 307:00am – 5:00pmHall G (second level)

Thursday, October 17:00am – 1:00pmHall G (second level)

Conference HoursSunday, September 27 through Thursday, October 18:00am – 5:30pm

Exhibit Hours September 299:00am – 5:00pm September 309:00am – 4:00pm

Cell Phone UsageAs a courtesy to speakers we would ask that all cell phones be shut off while attending any portion of the technical conference. We appreciate your cooperation and respect for our speakers.

First Aid First aid assistance is available by calling 911.

Lost and FoundFor lost and found items please contact the Registration Counter in Hall G on the upper level.

PressCompanies wishing to leave information for media representatives may leave their literature in Room 40/41.

Speaker LoungeConference speakers, chairs, co-chairs and instructors are invited to relax in Room 40/41. There are light refreshments and access to the Internet.

Speaker ReadyConference speakers are invited to use Room 58 to prepare for their presentation.

Speaker BreakfastSpeaker Breakfasts will be held in Room 42/43. They begin promptly at 7:00am Monday-Wednesday, and Thursday at 7:30am.

SMTA Booth and Career CenterBe sure to visit us in the Registration Lobby in Hall G on the upper level to learn about membership benefits and job opportunities.

BookstorePlan to visit the SMTA Bookstore in the Registration Lobby in Hall G on the upper level.

Social ActivitiesThe concierge from the Visitor’s Bureau can be found in the Convention Center Lobby and can be helpful is suggesting local restaurants or activities.

Suitcasing PolicySMTA does not allow solicitation from non-exhibiting companies. This includes attempts to solicit or sell products to event attendees. Please help us by adhering to this policy.

LunchLunch will be offered to all attendees and exhibitors on September 29th and September 30th. Vouchers worth $15 will be distributed in the Food Court in the Exhibit Hall. All food needs to remain in the Exhibit Hall. This is a small thank you from the SMTA for sharing your time with us at SMTA International.

Internet Access For your convenience, meeting rooms, Exhibit Hall, and common areas have complimentary access to the Internet. Connect your Wi-Fi enabled device to the Wi-Fi signal “Boingo Hotspot”. Once connected, launch your web browser. A Boingo splash page will appear. Here you will find a link to connect to “Complimentary WiFi.”

Plan your time at SMTA International by downloading the SMTA International mobile app at tiny.cc/smtai2015

EOS/ESD StandardsDevice Design Certification

Device Stress Testing CertificationESD Program Manager Certification

EOS/ESD Association, Inc. 7900 Turin Rd., Bldg. 3

Rome, NY 13440-2069, USAPH +1-315-339-6937 Email: [email protected]

www.esda.org

Setting the Global Standards for Static Control!

Premium Sponsor

Luggage Tags

Mobile App

Event Bags

2015 SMTA International SHOW DIRECTORY >> 98 >> 2015 SMTA International SHOW DIRECTORY

Media and Association Sponsors

Atlanta

Central Texas

Carolinas

Great Lakes

Guadalajara

LA/OC

Long Island

Michigan

Ohio Valley

Oregon

Rocky Mountain

Silicon Valley

Space Coast

Upper Midwest

Chapter Sponsors

Thank You to Our Sponsors

Notepads/Pens

Women’s Networking

Pocket Guide

Refreshment Breaks

SMTAssociation @SMTAorg #SMTAI 2015 SMTA International SHOW DIRECTORY >> 98 >> 2015 SMTA International SHOW DIRECTORY

Notepads/Pens

Women’s Networking

Pocket Guide

Refreshment Breaks

Assembly & JoiningBase MaterialsCleaning & CoatingElectronic Documentation TechnologyElectronic Product Data DescriptionEmbedded DevicesEnvironment, Health & Safety

Fabrication ProcessesFlexible and Rigid Flex BoardsHigh Speed/High Frequency InterconnectionsManagementMicroelectronic Systems TechnologyPrinted Board Design TechnologyPrinted Electronics

Process ControlProduct AssuranceProduct ReliabilityRigid Printed BoardsTerms and DefinitionsTesting

Saturday, September 268:00 am – 5:00 pm

5-22A J-STD-001 Task Group, Room 2110:00 am – 5:00 pm

2-18B/IEC TC 111 Joint Materials Declaration Task Group and IEC 62474 Committee Work, Room 22

Sunday, September 278:00 am – 9:00 am

2-30 Terms and Definitions Committee, Room 348:00 am – 12:00 pm

2-18B/IEC TC 111 Joint Materials Declaration Task Group and IEC 62474 committee work, Room 32

8:00 am – 3:00 pm 7-31B IPC-A-610 Task Group, Room 21

9:00 am – 4:30 pm 7-31A/D-33A Joint Meeting - IPC-A-600 and Rigid Printed Board Performance Specifications Task Groups, Room 34

1:00 pm – 3:00 pm CMTEMGM Committee Management Session, Room 32

3:00 pm – 4:30 pm 5-20 Assembly & Joining Committee, Room 21

4:30 pm – 6:00 pm CCC Committee Chairman Council (By Invitation), Room 21

6:00 pm – 7:00 pm CHAIRMANREC IPC Committee Chairmen’s Reception, South Ballroom Foyer

Monday, September 288:00 am – 9:00 am

7-30 Product Assurance Committee, Room 218:00 am – 10:00 am

D-35 Printed Board Storage and Handling Subcommittee, Room 32

8:00 am – 10:00 am D-36A IPC-PCQR2 DAUG - By Invitation Only, Room 33

8:00 am – 10:00 am E-21 EMS Intellectual Property Subcommittee, Room 60

8:00 am – 10:00 am 5-23B Component and Wire Solderability Specification Task Group, Room 22

8:00 am – 12:00 pm 2-18 Supplier Declaration Subcommittee, Room 59

8:00 am – 12:00 pm 2-41 Product Data Description Subcommittee, Room 50

8:00 am – 12:00 pm 3-11 Laminate/Prepreg Materials Subcommittee, Room 34

8:00 am – 12:00 pm 5-31G Stencil Cleaning Task Group, Room 23

9:00 am – 10:00 am 5-21E Solder Stencil Task Group, Room 21

10:00 am – 11:00 am 5-22F IPC-HDBK-001 Task Group, North Ballroom Foyer Near Room 21

10:15 am – 12:00 pm 5-22ARR J-STD-001/Conformal Coating Material & Application Industry Assessment Working Group, Room 21

10:15 am – 12:00 pm 5-23A Printed Circuit Board Solderability Specifications Task Group, Room 22

10:15 am – 12:00 pm 7-32C Electrical Continuity Testing Task Group, Room 32

10:15 am – 12:00 pm D-36 Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee, Room 33

10:15 am – 12:00 pm D-64a Printed Electronics Terms and Definitions Task Group, Room 60

11:00 am – 12:00 pm 5-22A/7-31BCELEB Joint Meeting - J-STD-001 & IPC-A-610, North Ballroom Foyer Near Room 21

12:00 pm – 1:30 pm ML IPC Committee Awards Luncheon, Room 46

1:30 pm – 3:00 pm 1-10C Test Coupon and Artwork Generation Task Group, Room 33

1:30 pm – 3:00 pm 2-18F Declaration of Shipping, Pack and Packing Materials Task Group, Room 59

1:30 pm – 3:00 pm 2-19A(MON) Critical Components Traceability Task Group, Room 34

1:30 pm – 3:00 pm 3-12D Woven Glass Reinforcement Task Group, Room 32

1:30 pm – 3:00 pm 5-32B SIR and Electrochemical Migration Task Group, Room 23

1:30 pm – 3:00 pm 5-33G Low Pressure Molding Task Group, Room 47

1:30 pm – 3:00 pm D-61 Printed Electronics Design Subcommittee, Room 60

1:30 pm – 5:00 pm 5-22A/7-31B Joint Meeting - J-STD-001 & IPC-A-610 Task Groups, Room 21

1:30 pm – 5:00 pm 2-16 Product Data Description (Laminar View) Subcommittee, Room 50

1:30 pm – 5:00 pm D-21 High Speed/High Frequency Design Subcommittee, Room 22

3:00 pm – 5:00 pm 7-31AT IPC-A-600 Technical Training Committee, Room 47

3:15 pm – 5:00 pm 2-15F Obsolete and Discontinued Product Task Group, Room 34

3:15 pm – 5:00 pm 2-18J Laboratory Report Declaration Task Group, Room 59

3:15 pm – 5:00 pm 3-12E Base Materials Roundtable Task Group, Room 32

3:15 pm – 5:00 pm 5-31J Cleaning Compatibility Task Group, Room 23

3:15 pm – 5:00 pm D-62 Printed Electronics Base Material/Substrates Subcommittee, Room 60

5:00 pm – 6:30 pm TAEC Technical Activities Executive Committee (By Invitation), Room 21

Tuesday, September 298:00 am – 10:00 am

3-12A Metallic Foil Task Group, Room 238:00 am – 10:00 am

6-10C Plated-Through Via Reliability-Accelerated Test Methods Task Group, Room 32

8:00 am – 10:00 am D-63 Printed Electronics Functional Materials Subcommittee, Room 59

8:00 am – 12:00 pm 2-18H Conflict Minerals Data Exchange Task Group, Room 52

8:00 am – 12:00 pm 2-40 Electronic Documentation Technology Committee, Room 50

8:00 am – 12:00 pm 5-22BT J-STD-001 Technical Training Committee, Room 34

8:00 am – 12:00 pm 5-33A Conformal Coating Task Group, Room 22

8:00 am – 5:00 pm 7-31J IPC-A-630 task group meeting, Room 21

8:00 am – 10:00 amD-24A TDR Test Methods Task Group, Room 33

10:15 am – 12:00 pm 4-33 Halogen-Free Materials Subcommittee, Room 23

10:15 am – 12:00 pm D-24B Bereskin Test Method Task Group, Room 33

10:15 am – 12:00 pm D-32 Thermal Stress Test Methods Subcommittee, Room 32

10:15 am – 12:00 pm D-64 Printed Electronics Final Assembly Subcommittee, Room 59

11:00 am – 12:00 pm 7-23 Assembly Process Effects Handbook Subcommittee, Room 53

1:30 pm – 3:00 pm 5-22AS Space Electronic Assemblies J-STD-001 Addendum Task Group, Room 23

1:30 pm – 3:00 pm E-30 Conflict Minerals Due Diligence Committee, Room 52

1:30 pm – 3:00 pm 5-24A Flux Specifications Task Group, Room 22

1:30 pm – 3:00 pm 7-31BC IPC-A-610 Telecom Addendum, Room 32

1:30 pm – 3:00 pm D-24C High Frequency Test Methods Task Group: Frequency-Domain Methods, Room 53

Topics

Continued on page 10

Fall Standards Development Committee Meetings Contribute to the industry standards and guidelines that your company, customers and suppliers rely on. All SMTAI registrants are welcome to attend IPC committee meetings excluding those designated as By Invitation. Registration is required.


1:30 pm – 3:00 pm D-55 Embedded Devices Process Implementation Subcommittee, Room 50

1:30 pm – 3:00 pm D-65 Printed Electronics Test Method Development and Validation Subcommittee, Room 59

1:30 pm – 5:00 pm 7-31FT IPC/WHMA-A-620 Technical Training Task Group, Room 33

1:30 pm – 5:00 pm D-31B IPC-2221/2222 Task Group, Room 34

3:15 pm – 5:00 pm 3-11F UL/CSA Task Group, Room 23

3:15 pm – 5:00 pm 5-21G Flip Chip Mounting Task Group, Room 50

3:15 pm – 5:00 pm 5-24C Solder Alloy Task Group, Room 22

3:15 pm – 5:00 pm 5-32A Ion Chromatography/Ionic Conductivity Task Group, Room 32

3:15 pm – 5:00 pm 7-11 Test Methods Subcommittee, Room 53

Wednesday, September 308:00 am – 10:00 am

4-34B Marking, Symbols and Labels for Identification of Assemblies, Components & Devices Task Group, Room 52

8:00 am – 10:00 am 5-24B Solder Paste Task Group, Room 34

8:00 am – 10:00 am 5-33AWG Conformal Coating Requirements Working Group, Room 22

8:00 am – 10:00 am D-15 Flexible Circuits Test Methods Subcommittee, Room 23

8:00 am – 10:00 am D-22 High Speed/High Frequency Board Performance Subcommittee, Room 33

8:00 am – 12:00 pm 7-31BT IPC-A-610 Technical Training Committee, Room 32

8:00 am – 12:00 pm B-11 3-D Electronic Packages Subcommittee, Room 50

8:00 am – 5:00 pm 2-18B Materials Declaration Task Group, Room 53

8:00 am – 5:00 pm 7-31F IPC/WHMA-A-620 Task Group, Room 21

10:00 am – 12:00 pm 7-34 Repairability Subcommittee, Room 33

10:15 am – 12:00 pm 1-14 DFX Standards Subcommittee, Room 52

10:15 am – 12:00 pm 4-14 Plating Processes Subcommittee, Room 34

10:15 am – 12:00 pm 5-45 Reflow Oven Process Control Subcommittee, Room 22

10:15 am – 12:00 pm D-12 Flexible Circuits Specifications Subcommittee, Room 23

1:30 pm – 2:00 pm 7-31H/7-31K Joint Meeting - IPC-D-620 Wire Harness Design and IPC-HDBK-620, Handbook Task Groups, North Ballroom Foyer Near Room 21

1:30 pm – 3:00 pm D-11 Flexible Circuits Design Subcommittee, Room 23

1:30 pm – 3:00 pm D-33AT IPC-6012 Technical Training Committee, Room 32

1:30 pm – 3:00 pm D-52 Embedded Component Materials Subcommittee, Room 34

1:30 pm – 3:00 pm 5-32E Conductive Anodic Filam –ent (CAF) Task Group, Room 22

1:30 pm – 5:00 pm V-SPVC Solder Products Value Council (SPVC), Room 33

1:30 pm – 5:00 pm 1-13/5-21A Joint Meeting - Land Pattern Subcommittee and IPC-7070 Task Group Meeting, Room 50

1:30 pm – 5:00 pm 7-12 Microsection Subcommittee, Room 52

3:15 pm – 5:00 pm 5-32C Bare Board Cleanliness Assessment Task Group, Room 22

3:15 pm – 5:00 pm 5-11C Electronic Assembly Adhesives Task Group, Room 32

3:15 pm – 5:00 pm D-13 Flexible Circuits Base Materials Subcommittee, Room 23

3:15 pm – 5:00 pm D-54 Embedded Devices Test Methods Subcommittee, Room 34

4:00 pm – 4:45 pm 5-21H Bottom Termination Components (BTC) Task Group, Room 59

4:45 pm – 5:30 pm 5-21F Ball Grid Array Task Group, Room 59

5:30 pm – 6:15 pm 5-22H Thermal Profiling Guide Task Group, Room 59

Thursday, October 18:00 am – 10:00 am

3-11G Corrosion of Metal Finishes Task Group, Room 238:00 am – 12:00 pm

2-18K AEG Data Exchange Task Group, Room 328:00 am – 12:00 pm

7-31H/7-31K Joint Meeting - Wire Harness Design Task Group and Wire Harness Handbook Task Group, Room 22

8:00 am – 12:00 pm 8-41 Technology Roadmap Subcommittee, Room 33

8:00 am – 5:00 pm 5-22AD Requirements for Military Systems Working Group, Room 21

12:00 pm – 1:30 pm RL IPC Luncheon, Room 34

1:30 pm – 5:00 pm 7-24 Printed Board Process Effects Handbook Subcommittee, Room 23

1:30 pm – 5:00 pm 7-31M Fiber Optic Cable Acceptability Task Group, Room 22

1:30 pm – 5:00 pm 8-70 Coalition for Advancement of MicroElectronic Systems Technology (CAMEST), Room 33

Friday, October 28:00 am – 12:00 pm

2-18K AEG Data Exchange Task Group, Room 32

IPC Fall Standards Development Committee Meetings, continued


Evolving Technologies SummitOrganized by Reza Ghaffarian, Ph.D., Jet Propulsion Laboratories; Richard Coyle, Ph.D., Alcatel-Lucent; Steve Greathouse, Plexus Corp.

Monday, September 28 | 9:00am – 5:00pm Room 48

FREE with a VIP or Technical Conference Registration! See page 20 for full details.

Harsh Environments SymposiumOrganized by Robert Kinyanjui, Ph.D., John Deere Electronic Solutions; John Evans, Ph.D. and Pradeep Lall, Ph.D., Auburn University

Monday, September 28 l 8:00am – 3:00pm Tuesday, September 29 | 11:00am – 4:00pm Room 45

FREE With a VIP or Technical Conference Registration. See page 21 for full details.

Women’s Leadership Connection

Monday, September 28 | 5:00pm – 6:00pm Room 42/43

We extend a cordial invitation to all women attending SMTAI to join us for a wine and appetizer reception. This is a great opportunity for you to get together with other women in our industry for networking and socializing. Marie Cole, IBM, will share “Power Up-Ignite Your Career.” We look forward to seeing you!

Keynote Session/SMTA Annual Meeting

Tuesday, September 29 | 8:00am – 10:00am Room 46/48

Join us for coffee and breakfast treats. A terrific presentation from Yole Développement, will kick off SMTA International!FREE to All Attendees!

3D Technology Trends and Manufacturing Challenges

Rozalia BeicaChief Technology Officer,Yole Développement

Rozalia Beica, Chief Technology Officer with Yole Développement, will share the industry’s 3D technology trends and

implications on assembly and manufacturing.

The semiconductor industry continues to be driven by miniaturization, increased performance and functionality as well as further reduction in cost. If leaded packages were, for many years, the primary package of choice, the industry has evolved over the years into a wide range of different packaging technologies, including vertically integrating the devices.

Significant developments have been made in further reducing the pitch size and thickness of both silicon device as well as organic substrates (PCB and IC substrates) to enable higher number of I/Os, shorter connections, therefore faster speeds within smaller and lower profile products. However, this miniaturization trends have raised several challenges, for handling and assembling such devices and substrates. Warpage, higher stresses, solder defects, tighter accuracies, contamination, higher cost due to more challenging processes, etc. — are some of the major challenges that industry has to address.

The presentation will provide an overview of the packaging technologies, highlighting the miniaturization trends and future roadmaps. Impact of new packaging technologies on assembly needs and rework, highlighting new advancements in materials and equipment as well as assembly and manufacturing processes needed to address these challenges will be presented.

Rozalia has 24 years of experience across various industries, from industrial to electronics and semiconductors. For more than 17 years, she was involved in the research, application and strategic marketing of Advanced Packaging and 3D Interconnect, with global leading responsibilities at specialty materials (Rohm and Haas Electronic Materials), equipment (Semitool, Applied Materials, Lam Research), device manufacturing (Maxim IC) and OEM (NCR) organizations. In 2013 she joined Yole Développement to lead and further grow the Advanced Packaging and Semiconductor Manufacturing activities within Yole.

The 2014 SMTA International Conference Award Winners Will Be Recognized:Rich Freiberger Best of Conference Presentation “The Effects of Stencil Alloy, Tension and Cut Quality on Solder Paste Performance” Chrys Shea, Shea Engineering Services and Ray Whittier, Vicor Corporation

Best of Proceedings Paper“Sensitivity of Cooper Dissolution to the Flow Behavior of Molten Sn-Pb Solder”Paul Vianco, Ph.D., Sandia National Laboratories

Best International Paper“Strategic Environmental Research and Development program Tim Whisker Testing and Modeling: Tin Whisker growth on SAC305 Assemblies”Polina Snugovsy, Ph.D., Celestica Inc. and Stephan Meschter, Ph.D., BAE Systems

Best Student Paper“Non-Destructive Evaluation of Solder Bump Quality Under mechanical Bending Using Laser Ultrasonic Technique”Jie Gong, Ph.D., Georgia Institute of Technology (now at KLA-Tencor)

The opportunity to gain new skills and update your technical knowledge is in every session at SMTA International. From the Electronics Exhibition to the Conference to Special Events, you are sure to find valuable information that will prepare you to compete and succeed in today’s highly competitive market. Some events require fees and advance registration. See the registration form for complete information.

Special Events


Poster Session

Tuesday, September 29 | 12:00pm – 2:00pm Perimeter of Exhibit Hall Courtyard

Solder Paste Inspection with Component M03015 PadsChristian Biederman, Flex

Recent Advances In X-Ray TechnologyKeith Bryant, SMT Solutions

Combined Indentation and FEM Analysis to Determine the Crystal Plasticity Constitutive Parameters of Beta-SnAritra Chakraborty and Philip Eisenlohr, Ph.D., Michigan State University

Understand Cleaning ParametersBarbara Kanegsberg, BFK Solutions, LLC

Achieving Higher Speed, Accuracy in Next-Generation SMT PrintersMike Martel, MMC, Inc.

Cyanide Free Immersion Gold Suitable for PCB Surface FinishingJun Nable, Ph.D., Emely Able-Tatis, Ernest Long, Ph.D., John Swanson and Martin Bunce, MacDermid, Inc.

Effects of Board Design Parameters on Failure Mechanisms of PCB/BGA Assemblies under Drop ImpactMathias Nowottnick, University of Rostock

A Three-Dimensional Packaging Platform with Integrated Microfluidic CoolingHanju Oh, Georgia Institute of Technology

Reflow Effect on Immersion Tin Solder WettingCherry Santos, Ph.D., Tyler Banker, Ernest Long, Ph.D., Jun Nable, Ph.D., MacDermid, Inc.

Fracture Mechanics and Stress Based Failure Analysis of BGA Solder Joints: Identifying the Critical Areas of Solder Joint Prone to Cracking.A R Nazmus Sakib, University of Texas at Arlington

Introduce a Girl to Engineering Day: A How-To GuideJulie Silk, Keysight Technologies

Integrated Solution for SMT Assembly InspectionOndrej Simecek, Test Research, Inc.

Retirement Celebration for JoAnn Stromberg

Tuesday, September 29 6:00pm

Please join us for a celebration Tuesday evening as we honor JoAnn Stromberg for her 29 years of SMTA leadership, and wish her well on her retirement as

SMTA Executive Administrator.

This very special celebration will be held Tuesday night, September 29, 2015 during SMTA International. The evening starts with a hosted reception at 6:00pm, followed by dinner and program at 6:45pm. The cost is $35 per person. The party will be held at the Crowne Plaza Hotel in Rosemont.

OFFERED WITH VERY GENEROUS SUPPORT FROM...

Greg and Denyse Evans

Calling All International Attendees!

Tuesday, September 29 | 2:00pm Chapter Officer’s Lounge

Come to a special meeting for our international chapter officers and attendees on Tuesday afternoon at 2:00pm in the Chapter Officer’s Lounge. We are looking for your input on how we can help you gain the most for your chapter and better serve you.

Great Lakes Chapter Meeting

Tuesday, September 29 | 3:00pm Chapter Officer’s Lounge

The Great Lakes Networking/Informational Chapter Meeting at SMTA International will be on Tuesday, Sept 29 at 3:00pm in the Chapter Officer’s Lounge. Anyone from the Great Lakes Chapter area can attend this networking event, which will be a casual environment to meet chapter officers and fellow members. Hear about what the officers are planning for 2016 and offer your opinion on topics, speakers and venues for the upcoming meetings.

“Pick & Taste” Beer Tasting

Tuesday, September 29 3:30pm – 5:00pm Exhibit Hall Courtyard

Come “Pick & Taste” craft beers and root beer from several chapter regions on Tuesday from 3:30pm-5:00pm. Try them all while meeting new friends at the multiple bars in the Exhibit Hall Courtyard.

SMTA Fun Run

Wednesday, September 30 | 7:00am

Get your run on!You don’t have to skip your run just because you are traveling. Join us for a casual run on Wednesday, September 30th at 7:00am. We will be meeting in the lobby of the DoubleTree Hotel which is across the street from the Convention Center. You can choose to take a 2 or 5 mile run.

2015 SMTA International SHOW DIRECTORY >> 13 SMTAssociation @SMTAorg #SMTAI12 >> 2015 SMTA International SHOW DIRECTORY

8th Annual SMTAI Golf TournamentWhite Pines Golf Club | Bensenville, Illinois Thursday, October 1, 2015 | 8:30am shotgun start

Join us for the 8th Annual SMTA International Golf Tournament at the White Pines Golf Club, a favorite among Chicago area golfers since 1928 and just ten minutes from O’Hare Airport and the Convention Center.

GOLF SPONSORS


“USER” Members Solution Lunch

For SMTA “USER” Members only

Wednesday, September 30 | 11:45am Chapter Officer Lounge in the Exhibit Hall

Share a Manufacturing Challenge and What You Are Doing About It!

“Learn what your peers are experiencing”

No presentations necessary… just an open forum networking lunch.

This session is only open to USER Members.

Please order your lunch at the Food Court using your $15 voucher and join us for an open forum discussion.

Students and Young Professionals Night Out

Wednesday, September 30 | 6:00pm – 9:00pm

Open to those 30 and under.

Ready for some fun? This special event offers a great networking opportunity mixed with an evening of entertainment! Dust off your bowling skills and head to Kings Bowling & Entertainment for a chance to connect with fellow students and other “millennial” young professionals in the industry. Food, beverages, bowling and shoe rental is provided at no charge. If you have not yet registered, please do so at the registration counter.

Kings Rosemont5505 Park PlaceRosemont, IL 60018

Lead-Free SymposiumOrganized by Paul Vianco, Ph.D., Sandia National Labs; Matthew Kelly, P.Eng., MBA, IBM Corporation; and Elizabeth Benedetto, Hewlett-Packard Company

Thursday, October 1 l 8:30am – 5:00pm Room 47/49

FREE With a VIP or Technical Conference Registration. See page 28 for full details.

TECH TOURS: Unique to SMTA International

Tuesday, September 29 and Wednesday, September 30

A great chance to meet “as a group” and learn all of the latest technology right on the exhibit floor. Tours related to placement and inspection provides demos and technical application support. There is no cost, no sales pitches, and no obligation. Companies participating on the TOUR are listed below. Tour groups should meet in the registration area at the entrance to the Exhibit Hall 5-10 minutes prior to the start of your tour.

Tour 1 — Inspection Tuesday | 10:30am – 12:00pmTour Guide: Martin Anselm, Ph.D., Rochester Institute of Technology

Tour 2 — Placement Tuesday | 1:30pm – 3:30pmTour Guide: Marie Cole, Ph.D., IBM Corporation

Tour 3 — Placement Wednesday | 10:00am – 12:00pmTour Guide: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions

Tour 4 — Inspection Wednesday | 1:30pm – 3:00pmTour Guide: Scott Priore, Cisco Systems

PLACEMENT COMPANIES

INSPECTION/REWORK COMPANIES

Robotics Alley: Robotics, Sensors, and Advanced Manufacturing

September 29 and 30 | In the Exhibit Hall

This year’s SMTA International Conference and Exhibition will feature a special “Robotics Alley” area that will provide a glimpse into the amazing advances that are occurring in robotics, sensors and advanced manufacturing. This interactive space will feature information on the latest technological developments, hands-on demos and — of course — robots! Industries highlighted will include health care, manufacturing, transportation, agriculture and others. The “Robotics Alley” area is organized by the creators of the Robotics Alley Conference & Expo, an annual gathering in Minnesota’s Twin Cities that is on pace to become one of the world’s leading conferences on robotics and automation.


Meet the Experience Team Right on the Show Floor!September 29 and 30 at the entrance to the Exhibit Hall

This year’s special feature area, supported by SMTA & NPL, will include live printing ultrafine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly. It will also include AOI inspection of printed board assemblies for open joints, lifted leads, partial lifting of passives and other less common defects. A series of test boards have been specially created with known process defects to show machines’ capabilities.

The feature will also include “NPL Defect Database Live,” where you can get free process support on all of theprinting and inspection defects. Bob Willis, feature organizer, will be on hand to inspect and provide feedback on any assembly or soldering issues that you may have to solve at SMTA International.

SPECIAL THANKS TO OUR EQUIPMENT AND MATERIAL SUPPLIERS LISTED BELOW:

Booth 518

Booth 335

Booth 313

Booth 131

Booth 606

Booth 219

Booth 506

Solder Paste and Solder Joint Automated Optical Inspection Experience

Booth 225

Booth 313

Booth 219

Booth 313

Booth 606

Booth 224


L31

Come and See Where the Future is Going!Chair: Steve Greathouse, Plexus Corp.Co-Chair: Eddie Kobeda, Ph.D., IBM Corporation (Retired)

Tuesday, September 29 | 11:00am – 12:30pm Room 55

FREE to All Attendees!When you take a long road trip into unfamiliar territory, you need some type of roadmap to know which highway to travel and which turns to take to get to your final destination. Life in the electronics world is very much the same. None of us have been down this pathway before, so having indicators that show us where to take your future products or capability and what areas to avoid are critical to your personal and companies’ success. This session will address different areas and the forecast for their specific product directions in Aerospace/Defense, Medical, Automotive, Handheld/Wireless, Portable, and High Performance products. Keep in mind that technology roadmaps are a prediction of the technology options that currently exist and how they will change, technologies that will soon exist, and what things to look forward to some years in the future.

>> European Union RoHS Leaded Solder Exemption Update

Curtis Grosskopf, *Marie S. Cole, and Pam Lembke, IBM Systems; Jeff Lagler, IBM Transformation and Operations; Kurt Van der Herten, IBM Corporate Environmental Affairs

>> 2015 iNEMI Roadmap Highlights; Forecasting Business/Technology Gaps Over A Ten Year Horizon

Chuck Richardson, iNEMI >> 2015 IPC International Roadmap:

Changing with the Times Marc Carter, SAIC

L32

Environmental Solutions Require DiligenceChair: Rich Henrick, Sanmina CorporationCo-Chair: Michelle Ogihara, Seika Machinery

Tuesday, September 29 | 2:00pm – 3:30pm Room 55

FREE to All Attendees!In taking efforts to be more environmentally friendly in our manufacturing processes, sometimes unforeseen issues arise and require increased awareness and diligence. Solder recycling is a great idea, but not without pitfalls

that require management. Likewise the quest for environmentally friendly flame retardants in device packaging has once again raised reliability questions and challenges.

>> Solder Waste Revisited: The Compelling Argument for Recycling

Jack Scott, Conecsus, LLC >> In House Dross Recovery- Do You

Know What You Are Putting Back in Your Solder Bath?

Mitch Holtzer and Jason Fullerton, Alpha, an Alent plc Company

>> The Return of the Red Retardant Dock Brown, CRE, DfR Solutions

L33

Factory Automation – Optimizing to Reduce Cost and Increase Reliability and YieldChair: Trevor Galbraith, Global SMT & PackagingCo-Chair: Greg Vance, Rockwell Automation

Wednesday, September 30 | 8:00am – 9:30am Room 55

FREE to All Attendees!Industry 4.0 (Europe), Factory 1.0 (China) and SMLC (USA) all form a backbone from which factories can communicate externally with their vendors and all companies involved in their supply chain. It also communicates internally through the factory MES system and down to a machine level to control inventory and optimize the process. This results in significant cost savings through reduced labor and increased reliability and yield. This session will present a number of case studies and presentations from those companies at the leading edge of this data driven revolution.

>> On the Smart Move: Industry 4.0 in Electronics Production

Günter Schindler, ASM Assembly Systems GmbH & Co. KG

>> Using “Manufacturing Analytics” as a Competitive Strategy

Farid Anani, M.S.E.E., MBA and *Jay Gorajia B.Sc.E.E., MBA, Mentor Graphics

>> Reducing Labor Content as a Strategy to Improve Competitiveness - An Analysis that Addresses the Value of Designing for Automation and an Empirical Analysis That Exploits the Automation Using META Process Control

Tom Borkes, The Jefferson Project and Lawrence Groves, Trans-Tec Yamaha

L34

Real World SMT Production Problems, Investigations and SolutionsChair: Chrys Shea, Shea Engineering ServicesCo-Chair: Greg Wade, Indium Corporation


FREE to All Attendees!Problems occur on a daily basis on an SMT assembly line and it’s often the job of the process engineer to contain them, investigate their root causes and implement solutions. This session presents several case studies of SMT production issues encountered in both CEM and OEM environments, and how they were resolved. Discussions include problem troubleshooting, process improvements, new technology assessments, impacts of material selection, and design considerations.

>> Key Technical Challenges and Process Improvements for an Electronics Manufacturing Service Provider

*Robert Farrell, Bruce Tostevin, Rick Wyman, and Paymon Adl-zarabi, Benchmark Electronics, Inc.

>> Influence of PCB Surface Features on BGA Assembly Yield

Satyajit Walwadkar, Todd Harris, Bite Zhou and Alan McAlister, Intel Corporation

L35

Product Life CycleChair: Roy Starks, LogiSync LLCCo-Chair: Rakesh Kumar, Ph.D., Specialty Coating Systems, Inc.

Wednesday, September 30 | 2:00pm – 3:00pm Room 55

FREE to All Attendees!This session examines two key topics that can give your next project a competitive edge. Learn how to manage the entire life cycle of a product development project using the Agile Scrum methodology, including software and hardware through to manufacturing. Understand the benefits and the value of Unit Level Traceability throughout the supply chain, logistics and your customer’s operations.

>> Agile Scrum Methods for Cross Functional Product Development

Scott Gleason, Plexus Engineering Solutions

>> Are You Leveraging Unit Level Traceability Fully?

James Trego and Kirk Griffin, Trego Integrated Systems

THEL3 Series: Listen, Learn, Lead

Additional technical sessions spotlighting interesting

and timely topics.

COMPLIMENTARY to all SMTA International attendees.


Sunday, September 27 T1 Advanced Closed Loop Process Control for Selective Soldering NEW!Bob Klenke, ITM Consulting

Sunday, September 27 | 8:30am – 12:00pm Room 50

Topics Covered >> Automatic fiducial location >> Automatic board warpage compensation >> Advanced drop-jet flux deposition >> In-process flux verification/

and calibration >> Mitigation of no-clean flux residues >> Combined wave soldering capability

0.5mm ultra-fine pitch selective soldering >> Graphics-based programming and

machine operating software >> Advances in solder nozzle design to

reduce intermetallic buildup >> Striations in solder nozzle design to

ensure laminar molten solder flow >> Selective soldering with high melting

point (HMP) solder alloys

T2 It is Time for Low Temperature: Low Temperature Solders, New Developments, and Their Applications NEW!Ning-Cheng Lee, Ph.D., Indium Corporation


Topics Covered>> Market demand & tentative binary

alloys options >> SnIn >> BiSn >> BiSn + Ag + Proprietary Dopants >> BiSn+In, Ni >> BiSn + Sb, Zn, Ag >> SnInAg and applications

T3 Stencil Printing — A Practical Guide to Defect Prevention and Yield Improvement Chrys Shea, Shea Engineering Services


Topics Covered>> Solder paste >> Mechanics of the printing process >> Troubleshooting process problems >> Stencil design >> Stencil materials and manufacturing

processes >> Automatic Solder Paste Inspection (SPI) >> Stencil underwiping >> Review and Q&A

T4 0201, 01005 Plus Smaller Chip Component Design and Assembly NEW!Bob Willis, bobwillisonline.com


Topics Covered>> Component technology for 0201, 01005

and beyond >> Packaging issues >> Soldering small passives with Lead-Free >> PCB design requirements >> Pad sizes spacing >> Solder joints strength and reliability >> Printing process >> Stencil and paste implications >> Chip component placement requirements >> Packaging tolerances >> Reflow soldering defects & prevention >> Profiling boards >> Advantages and disadvantages

of nitrogen >> Defects caused by reflow using visual and

X-ray inspection >> Rework and repair methods >> Types of tools and procedures

T5 Solder Reflow Fundamentals — Understanding Thermal Profiles and Defect Mitigation NEW!Fred Dimock, BTU International and Karl Seelig, AIM Solder

Sunday, September 27 | 1:30pm – 5:00pm Room 52

Topics Covered>> Recipe and profiles >> Properties of solder paste >> Metals and flux >> Profile shapes >> Defect identification and mitigation >> Solder balls >> Opens >> Voids >> Tombstoning

T6 Manufacturing Wrong: Case Studies in Non-Conformance NEW!David Hillman, Rockwell Collins


Topics Covered>> Case Study 1: But It’s Just Packaging! >> Case Study 2: Look At The Pretty Finish! >> Case Study 3: Stupid Coupons >> Case Study 4: Never Trust the Salesman >> Case Study 5: White Residues >> Case Study 6: Barney Boards >> Case Study 7: Sanitizers, Lotions & Bears

Oh My! >> Case Study 8: What’s a Tin Whisker? >> Case Study 9: The Bigger the Glob, the

Better the Job >> Case Study 10: Fried Connectors >> Case Study 11: I Swear, It’s the

Same Process >> Case Study 12: I Have A

“Secret” Technique

TutorialsHalf day (3.5 hours) educational courses are led by internationally respected professionals with extensive experience in the subject area. Course instructors deliver focused, in-depth presentations on topics of current importance to the industry, based on their research and industry experience. Tutorials are application oriented and structured to combine field experience with scientific research to solve everyday problems. Registration includes breaks, course materials and a Certificate of Attendance.


T7 SMT Design and Assembly Process Principles for Flexible and Rigid Flex Circuits NEW!

Vern Solberg, Solberg Technical Consulting


Topics Covered>> Applications

>> Establishing end use criteria >> Commercial/Consumer >> Industrial/Automotive >> Medical/Aerospace

>> Material and SMT component >> Standards for flex and rigid-flex materials >> Metallization technologies >> Flex and rigid flex fabrication >> Circuit routing design rules

>> Designing flexible and rigid-flex circuits >> Flex circuit outline planning >> Selection criteria for SMT components >> SMT land pattern development >> Surface finish variations

>> Assembly processing of flex and rigid-flex circuits >> Dimensioning and tolerance criteria >> Palletized layout for in-line assembly processing >> SMT assembly process methodologies >> Alternative joining techniques for flexible circuits

T8 High-Temperature Electronics Manufacture Using Selective Laser and Robotic Point Alloys NEW!

Bob Willis, bobwillisonline.com and NPL National Physical Laboratory


Topics Covered>> Oil, gas, space, automotive and

military applications reference books, specification and standards

>> Product temperature range >> Component compatibility >> PCB substrate choices and specifications

and design >> Soldering alloy choices >> Assembly & soldering options >> Setting up and assessment of

soldering systems >> Critical choice in the selection of cored

wire for automated assembly >> Reliability assessment & testing results >> Failure modes >> Inspection of solder joints and new

defect types

Monday, September 28

T9 Failure Analysis: Analytical Techniques and What They Tell You About Your Failure

Martin Anselm, Ph.D., Rochester Institute of Technology


Topics Covered>> Analytical testing techniques >> Root causes of production failures >> Failure analysis studies - analytical

techniques used for determining root cause for defects in fine-pitch printing, PoP, and high Tg laminate failures

T10 3D Packaging for the SMT Specialist NEW!Charles Bauer, Ph.D., TechLead Corporation


Topics Covered>> 3D history, trends, and drivers >> 3D packaging strategies >> Package on package >> PoP failure analysis >> PoP applications >> Economics of 3D >> 3D intellectual property landscape

T11 Solder Joint Reliability — Principles and Applications NEW!Jennie Hwang, Ph.D., H-Technologies Group


Topics Covered>> Solder joint fundamentals & thermo-

mechanical behavior and degradation – fatigue and creep interaction

>> Solder joint failures modes - interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced, surface-crack, and others

>> Solder joint failure mechanisms – ductile, brittle, ductile-brittle transition fracture

>> Solder joint strengthening metallurgy >> Intermetallic compounds – different

types and effects, at-interface vs. in-bulk, Pb-free vs. Sn-Pb

>> Illustration of microstructure evolution vs. strengthening in Sn Cu+x,y,z and SnAgCu+x,y,z systems

>> Solder joint voids vs. reliability — causes, effects, criteria

>> Solder joint surface-crack — causes, effects

>> Distinctions and commonalties between Pb-free and SnPb solder joints

>> Thermal cycling conditions — effects on test results and test results interpretation

>> Testing solder joint reliability – discriminating tests and discerning parameters

>> Life-prediction model vs. reliability >> Solder joint performance in

harsh environments >> What are on the horizon and what impact

will be on reliability? >> Best practices and Ultimate reliability

T12 SMT and Through Hole Defect Analysis and Process

Troubleshooting — Part 1 NEW!S. Manian Ramkumar, Ph.D., Rochester Institute of Technology


Topics Covered>> SMT and THT Process

>> Assembly types and processes >> Process defects and definitions

>> Identifying different defects >> Factors influencing the process defects

>> PCB related >> Component related >> Materials related >> Equipment related >> Process related >> Supplier related >> Employee/Knowledge related >> Environment related

T13 ZEN and Science of Electronic Assembly — Best Practices in Electronic Assembly Processes — Part 1 NEW!

Phil Zarrow and Jim Hall, ITM Consulting


Topics Covered>> Introduction >> Definition of “best practices” >> Best practices in the assembly process >> Solder paste printing process best practices

>> Stencil >> Solder paste >> Printing

>> Pick and place best practices >> Reflow soldering best practices

T14 Reliability of Electronics — The Role of Intermetallic Compounds NEW!

Jennie Hwang, Ph.D., H-Technologies Group

Monday, September 28 | 1:30pm – 5:00pm Room 52

Topics Covered>> Intermetallic compounds — definition,

fundamentals, characteristics >> Phase diagrams of Pb-free solders in

contrast with SnPb


>> Intermetallic compounds in the intrinsic material — Pb-free vs. SnPb

>> Formation and growth during production process and in product service life

>> Different types of intermetallic compounds — effects on solder joint reliability

>> Intermetallic compounds — at-interface vs. in-bulk

>> Effects from substrate compositions (hybrid module thick film pads, PCB surface finish) + component surface coating

>> SAC alloys incorporated with various doping elements — characteristics, performance

>> Effects on failure mode >> Effects on reliability

T15 “Tipping Point” Cleaning and Deflux NEW!Barbara Kanegsberg and Ed Kanegsberg, BFK Solutions


Topics Covered>> Cleaning and defluxing — why you

need both >> How soils stick; how to remove them >> When to use your current cleaning process;

when you need something different >> How to get a problematic supply chain to

support effective cleaning >> Cleaning for high value applications like

medical devices and aerospace/military >> How regulations affect cleaning options >> New developments in cleaning agents

and processes >> Identify important tests for both ionic and

non-ionic residues >> How to use successful cleaning and

defluxing as a marketing tool

T16 Design for Manufacturing (DFM): Today’s Design Challenges Require New Assembly Methods

Dale Lee, Plexus Corp.


Topics Covered>> Elements of Global Product

Design Process >> Printed Circuit Board design impacts on

soldering process/quality >> SMT solder process design impacts:

thermal balance, trace routing, process tooling design, assembly equipment limitation/tolerance, industry standards, PCB finishes, BTC-low stand-off components (LGA, QFN)

>> Through hole component solder process design impacts: thermal connection, hole size, pad design, lead free solder impacts, PCB finishes

>> Cleaning Impacts

T17 SMT and Through Hole Defect Analysis and Process Troubleshooting — Part 2 NEW!S. Manian Ramkumar, Ph.D., Rochester Institute of Technology


Topics Covered>> Creating a problem statement

>> Initial problem definition >> Ideal vs. actual >> Data collection >> Questioning to the void (data collection) >> Process flow mapping >> What? Where? When? Extent? >> Final problem definition (object and defect)

>> Organizing the data related to the problem >> “Is” and “Is Not” comparison >> Differences influencing the “Is” and “Is Not” >> Changes influencing the differences

>> Identifying probable root cause(s) >> Testing the possible root causes >> Selecting the most probable cause >> Verifying the most probable cause

>> Finding a fix for the root cause >> Developing and classifying the objectives (Must and Want) >> Identifying and evaluating the alternatives >> Identify the risks with alternatives >> Final decision for a fix >> Testing the fix

T18 ZEN and Science of Electronic Assembly — Best Practices in Electronic Assembly Processes — Part 2 NEW!Phil Zarrow and Jim Hall, ITM Consulting


Topics Covered>> Best practices in the assembly process —

continued >> Wave and selective soldering best practices

>> Cleaning vs No-Clean considerations and best practices

>> Best Practices concerning “challenging technologies”

>> QFNs >> Ultra-miniature components

(0201s, 01005s, ultra-fine pitch BGAs and CSPs)

>> Q&A

Thursday, October 1

SMTA’s GIFT to YOU!

To thank you for 30 years of support for the SMTA, we are offering SMTA members a FREE half day course! On Thursday, October 1st, Dr. Bill Cardoso from

Creative Electron will teach a course on “LED, BGA and QFN Assembly

and Inspection”. Full details are below. You are required to register to

receive a handout and a Certificate of Completion, but there is no charge for the course. (Non-member rate applies)

T19 LED, BGA, and QFN Assembly and Inspection NEW!

Bill Cardoso, Ph.D., Creative Electron

Thursday, October 1 | 8:30am – 12:00pm Room 48

Topics Covered>> How LED material handling and storage

impact assembly performance >> LED x-ray inspection: How voids cost

you money >> Case study: How lack of quality killed a

successful LED company >> Process design for BGA and QFN

assembly and rework >> BGA and QFN x-ray inspection: How to

see what often goes wrong >> X-Ray as a tool for quality process design

and control


Technical SessionsMonday, September 28

FOCUSED SYMPOSIUM IEvolving Technologies Summit

Organized by Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory; Lars Böttcher, Fraunhofer IZM Berlin; and Steve Greathouse, Plexus Corp.

Monday, September 29 l 8:30am – 5:00pm

FREE with a VIP or Technical Conference Registration!

ET1

Alternate AlloysChair: Richard Coyle, Ph.D., Alcatel-LucentCo-Chair: Keith Sweatman, Nihon Superior Co., Ltd.

Monday, September 28 | 9:00am – 10:30am Room 48

Near-eutectic, high Ag SAC305 solder is the accepted choice for most electronic assembly applications, but some concerns have been raised over the performance of SAC305 in harsh thermal cycling environments, particularly if vibration and shock loading are involved. Additionally, there are problems associated with the high temperature processing required for SAC305, and the cost of high Ag alloys is an issue in some market segments. These recent observations and findings indicate that high Ag alloys are not an optimum or even acceptable solution for other applications. Further, it appears unlikely that a single-alloy solution may not exist across all electronic applications. These sessions share recent process and reliability work done on alloys being considered as alternatives to high Ag SAC305.

>> Comprehensive Report on Low Temperature Solder Alloys for Portable ElectronicsMorgana Ribas, Ph.D., Anil Kumar, Ranjit Pandher, Rahul Raut, Sutapa Mukherjee, Siuli Sarkar and Bawa Singh, Alpha India Research Centre

>> Development and Characterization of Solder Pastes Based on Two Alternative Alloys: Bismuth-Tin-Silver (BiSn42Ag0.4-1%) for Low Temperature and Tin-Antimony (SnSb5-8.5) for High TemperatureEmmanuelle Guene, P.E., Inventec Performance Chemicals

>> Effect of Bi Content on Properties of Low Silver SAC SoldersMehran Maalekian, Ph.D., Yuan Xu, and Karl Seelig, AIM Metals & Alloys

ET2

Alternate Alloys (Continued)Chair: Richard Coyle, Ph.D., Alcatel-LucentCo-Chair: Keith Sweatman, Nihon Superior Co., Ltd.


>> Long Term Aging Effects on the Reliability of Lead Free Solder Joints In Ball Grid Array Packages With Various Pitch Sizes and Ball Alignments Cong Zhao, Chaobo Shen, Zhou Hai, Jiawei Zhang, M.J. Bozack, and J. L. Evans, Ph.D., Auburn University

>> Factors Impacting the Reliability of Ultra-Low Silver Lead-Free Alloys Neil Poole, Ph.D., *Brian Toleno, Ph.D. and Mark Curie, Ph.D., Henkel Electronic Materials, LLC

>> Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups Formed by Reflow Soldering SAC Solder Balls BGAs with BiSnAg and Resin Reinforced BiSn Based Solder PastesOlivia H. Chen, Al Molina, Ph.D., Kevin Byrd, Scott Mokler, Raiyo Aspandiar, Ph.D. and Kok Kwan Tang, Intel Corporation

ET Keynote LunchChair: Reza Ghaffarian Ph.D., Jet Propulsion Laboratory

Monday, September 29 l 12:30pm – 1:30pm Room 48

>> Wearables Technology - The Next Manufacturing Wave Murad Kurwa, Flex

A new wave of wearables brings with it plenty of manufacturing process development concerns. Kurwa will discuss advances like stretchable conductives, fabrics, interconnects, substrates and the integration of new sensor technology in fabrics. He will also cover assembly methodologies for new stretchable conductives and encapsulation techniques. The presentation will include a manufacturing oriented DOE, FEA and will also address many reliability issues for electronics and sensors on fabrics like acceleration factor (AF), stretchability testing and sweat testing.

ET3

Wearable Electronics Technology DevelopmentChair: Alex Chen, Celestica, Inc.Co-Chair: Brian Toleno, Ph.D., Microsoft Corporation


Wearable electronics devices are expanding from fitness and wellness applications to almost anything, including health-tech and medical industry, automotive industry, security and defense industry. This brave new sector is propelled by technology advances and experiencing some growing pains – technological challenges, such as selecting the right interconnect technology, how to make textiles smart, or how to manufacture new and innovative high-mix products at high volume but low cost. The session on wearable electronics will bring insights on some exciting technological advances and ways of managing the challenges.

>> Smart Textiles for Wearable Technology*Chris Hunt, Ph.D., Roya Ashayer-Soltani and Kathryn Wills, National Physical Laboratory

>> Connector Design for Wearables *Randy Schueller, Ph.D., DfR Solutions

>> Wearable Electronics & Big Data = High Volume, High Mix SMT!*Charles E. Bauer, Ph.D. and Herbert J. Neuhaus, Ph.D., TechLead Corporation

ET4 FREE!

Evolving Technologies Panel: Covering Key Technologies Including: 3D Packaging Technology Trends, Emerging Technologies, Renewable Energy, Optics and Photonics, Wearable Electronics, and Next Generation PCBs for Embedded TechnologiesCOMPLIMENTARY BEER AND PRETZELS!

Chair: Reza Ghaffarian, Ph.D., Jet Propulsion LabCo-Chair: Paul Wang, Ph.D., Mitac International


Panelists include:>> Lars Böttcher, Fraunhofer IZM Berlin >> Richard Coyle, Ph.D., Alcatel-Lucent Steve>> Greathouse, Plexus Corp. >> Irene Sterian, P.E., Celestica, Inc. >> Chuck Woychik, Ph.D., Invensas

Corporation* distinguished speakers


FOCUSED SYMPOSIUM IIHarsh Environments

(Note: this symposium continues on Tuesday)

Organized by John Evans, Ph.D. and Pradeep Lall, Ph.D., Auburn University; Robert Kinyanjui, Ph.D., John DeereElectronic Solutions

Monday, September 28 l 8:00am – 5:00pm


HE1

Reliability of Components in Harsh EnvironmentsChair: Matt Kelly, P.Eng., MBA, IBM CorporationCo-Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions

Monday, September 28 | 8:00am – 10:00am Room 45

Reliability of Lead-Free assembled hardware continues to be a focus item for a variety of harsh environment applications including deep well drilling, automotive under the hood, and avionics. This session examines hardware reliability performance including mirrored memory with underfill configurations, isothermal fatigue of doped lead-free alloys, and mechanical vibration conditions. Application needs, field use simulation conditions, and resulting failure analysis will be discussed.

>> Thermal Shock Reliability Test on Multiple-Doped Low-Creep Lead-Free Solder Paste and Solder Ball Grid Array PackagesAnto Raj, Sivasubramanian Thirugnanasambandam, Thomas Sanders, Sharath Sridhar, John Evans, Ph.D., Michael Bozack, Ph.D. and Wayne Johnson, Ph.D., Auburn University

>> Solder Joint Fatigue Characterization of DDR3 SDRAMs and Other Advanced BGA Packaging Memory TypesArnaud Grivon, Damien Baudet, Michel Brizoux, Aurélien Lecavelier and Wilson Maia, Thales Global Services

>> Avionics Vibration Durability Between Sn-Pb and Lead-Free Solder Interconnects*Joseph Juarez, Ph.D., Honeywell International

>> Isothermal-Fatigue of High-Temperature Solder JointsHarry Schoeller, Ph.D., Universal Instruments Corporation

HE2

Electronics in Corrosive EnvironmentsChair: Marie Cole, IBM CorporationCo-Chair: John Evans, Ph.D., Auburn University


Electronics in data centers that may have harmful environments resulting from the ingress of outdoor particulate and/or gaseous contamination can be at risk for corrosion. Supplying robust hardware for these data centers, mostly in emerging markets, can be a challenge if the risk of corrosion failures is not well understood. In this session, you will learn about the corrosion risk associated with various PCB finishes and memory module components, how to mitigate corrosion risks for electronics. and methods to predict field performance in high sulfur environments through accelerated laboratory testing.

>> Sulfur Corrosion of Printed Circuit Board Surface Finishes in Three Different Sulfur-Rich Environments Matthew Weeks, Ph.D. and David J. Zueck, Western Digital Technologies, Inc.

>> Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber: Phase 2Haley Fu, iNEMI; Prabjit Singh, IBM Corporation; Aamir Kazi and Wallace Ables, Dell Corporation; Dem Lee and Jeffrey Lee, iST-Integrated Service Technology, Inc.; Karlos Guo and Jane Li, Lenovo (Beijing) Limited Corporation; Simon Lee and Geoffrey Tong, The Dow Chemical Company

>> The Corrosion Failure Risk Assessment of Memory Module at Data Center in Harsh Environmental Conditions Sungwon Han and Yuchul Hwang, Samsung Electronics; Biao Cai and Marie Cole, IBM Corporation

>> An Attempt to Study the MFG Test Pollutant Chemistry Effect to Match Filed Data Vasu Vasudevan, Karumbu Meyyappan, Anil Kurella, Karl Pazdernik, and Balu Pathangey, Intel Corporation

HE Keynote LunchChair: Pradeep Lall, Ph.D., Auburn University


>> Extreme Environment Electronics — Where We’ve Been, Where We Are Going and What Could Be Next Jim Springer, John Deere Electronic Solutions

To feed the world population in 2050 it is estimated the current agricultural production must double. Technology is critical to increasing agricultural equipment’s utilization and output leading to more efficient farming methods and improved yields. The quality and reliability of electronics used for precision guidance, sensing, controlling engines and other key technologies is essential to optimizing equipment performance. Improving reliability in electronics used in farming is challenging, both in electronic design and manufacturing as well as material selection. This has become more apparent following the global transition of electronic manufacturing from the conventional leaded component technology to lead-free technology. This presentation will provide a genesis and the evolution of electronics designed for use in harsh physical and electrical environments, particularly those used in farming and automotive industries. Examples of ruggedization protocols will be discussed.

HE3

Materials for Harsh EnvironmentsChair: Raiyo Aspandiar, Ph.D., Intel CorporationCo-Chair: Iulia Muntele, Ph.D., Sanmina Corporation


The requirements and demands placed on heat sinking and soldering materials for applications in aerospace, automotive, defense and telecommunication electronic products are far more stringent than other industries. This session will describe newly developed solder alloys, solder pastes and evaluate promising thermal pastes for use in harsh environments prevalent for these industries.

>> Assessment of Thermal Pastes for Use in Space Electronics Jeffrey Marcus Jennings, Susan M. Marlowe and Peter F. Ruggiero, Harris Corporation

>> Novel Lead-Free Solder Alloys Development for Automotive ApplicationsWeiping Liu, Ph.D. and *Ning-Cheng Lee, Ph.D., Indium Corporation

>> Low Voiding, High Reliability Solder Paste for Automotive, LED and Other Demanding ApplicationsRahul Raut, Westin Bent and Michael Liberatore, Alpha, an Alent plc Company


Tuesday, September 29

APT1

3D IC and PoP AssemblyChair: Lars Böttcher, Fraunhofer IZM Berlin Co-Chair: Vern Solberg, Solberg Technical Consulting


Package on Package and 3DIC has become widely spread in today’s mobile applications. Both need to address reliable and cost efficient technology and assembly. This session will address both PoP and TSV methods and, in addition, will look into the reliability performance of new interconnect materials like copper wire bonds.

>> High-Volume-Manufacturing (HVM) of BVA Enabled Advanced Package-on-Package (PoP)Rajesh Katkar, Ashok S. Prabhu, and *Wael Zohni, Invensas Corporation

>> Assembly Challenges for 2.5D and 3D IC Packaging *Charles G. Woychik, Ph.D., Guilian Gao, Cyprian Uzoh, Hong Shen, Liang Wang, Sangil Lee, Roseann Alatorre, Scott McGrath, Mohamed Elassar and Sitaram Arkalgud, Invensas Corporation

>> Corrosion and Contaminant Diffusion Multi-Physics Model for Copper-Aluminum Wirebonds in High Temperature High Humidity Environments*Pradeep Lall, Ph.D. and Yihua Luo, Auburn University; Luu Nguyen, Ph.D., Texas Instruments, Inc.

EMS1

Taking the Cost out of EMS: Getting the Best Return for Lean InitiativesChair: Susan Mucha, Powell-Mucha Consulting, Inc. Co-Chair: Mike Buetow, Circuits Assembly Magazine


In today’s world of variable demand and higher mix product, electronics manufacturing services (EMS) companies need to be flexible and agile to respond to changing customer needs. At the same time, EMS companies also need to address efficiency and cost reduction in an environment characterized by razor thin margins. Does a more holistic approach to implementing Lean manufacturing philosophy hold the answers to best addressing these challenges? Join us as a regional EMS provider and supplier of manufacturing shop floor control solutions discuss how a Lean, yet agile EMS operation can be created by rethinking

how customers, the supply chain, support functions and manufacturing operations work together in an interconnected Lean environment. Following the presentations, there will be a panel discussion with the audience focused on ways this type of holistic approach can eliminate the common constraints to effective Lean implementation found in the EMS environment.

>> Lean Flow On The SMT Factory FloorMichael Ford, Mentor Graphics

>> Applying Lean Philosophies to Supply Chain Management in EMSWally Johnson, Firstronic, LLC

>> Panel Discussion

FSA1

Improved Area Array Component Solder Reliability Through Use of Underfills, Edge Bonds and EncapsulantsChair: Dale Lee, Plexus Corp. Co-Chair: Morgana Ribas, Ph.D., Alpha India Research Centre


With increased use of area array components in high reliability and harsh environment applications, the need for solder connection reliability enhancement materials has increased. This session will share recent work done to improve reliability of solder connections through use of solder joint encapsulant, edge bond and underfill materials.

>> WLCSP and BGA Reworkable Underfill Evaluation and ReliabilityFei Xie, Ph.D., Han Wu, Daniel F. Baldwin, Ph.D., Swapon Bhattacharya, Ph.D. and Kelley Hodge, Engent, Inc.; Qing Ji, Ph.D. and Ben Bo, H.B. Fuller

>> Evaluation of High Reliability Reworkable Edge Bond Adhesives for BGA ApplicationsFei Xie, Ph.D., Han Wu, *Daniel F. Baldwin, Ph.D., Swapan Bhattacharya, Ph.D. and Kelley Hodge, Engent Inc.; Qing Ji, Ph.D., H.B. Fuller

>> A Lower Temperature Solder Joint Encapsulant for Sn/Bi ApplicationsMary Liu, Ph.D. and Wusheng Yin, Ph.D., YINCAE Advanced Materials, LLC

MFX1

Pathways to Prolific PrintingChair: Jeff Schake, ASM Assembly Systems - DEK Co-Chair: Ray Whittier, Vicor Corporation


Although the SMT stencil printing process is conceptually simple, it is governed by a complicated network of interrelated variables. Detangling these variables leads to different investigation paths that ultimately converge to improve overall printing process understanding. This session explores a diverse range of printing research interests, from managing print process control in unfavorable production conditions to controlled experiments pursuing low area ratio printing characterization and visualization.

>> Evaluation of the Stencil Printing for Highly Miniaturized SMT Components With 03015mm in Size*Stefan Härter and Jörg Franke, Institute for Factory Automation and Production Systems (FAPS), Freidrich-Alexander-University Erlangen-Nürnberg (FAU); Carmina Läntzsch, LaserJob GmbH

>> Video Analysis of Solder Paste Release from Stencils*Chrys Shea, Shea Engineering Services; Mike Bixenman, DBA and Wayne Raney, KYZEN Corporation; Ray Whittier, Vicor Corporation

>> A Different Perspective on Solder Paste Printing: Perfecting the Print Process with Practical SolutionsMichael J. Cieslinski and Brent A. Fischthal, Panasonic Factory Solutions Company of America

HE4

HARSH ENVIRONMENTSContinued from Monday

Electronics Ruggedization Through CoatingChair: Chair: Iulia Muntele, Ph.D., Sanmina CorporationCo-Chair: Pradeep Lall, Ph.D., Auburn University


Whether it is protection from hostile environments (temperature and/or pressure extreme values, humidity, corrosive atmosphere, UV light, shock and/or vibration), or to aid in the electrical design parameters of a PCBA, conformal coating has been the method of choice for designers. Despite a wide range of coating materials availability, ongoing research efforts continue to close gaps and expand the quest for lighter, easier application


and reworkable materials. Both consumer and high-reliability electronics benefit from the results of these research efforts. This session’s presentations bring forth the data acquired in recent investigations of epoxy, silicone, parylene, fluoropolymer coatings, and highlight their applicability in harsh environments with hard to control temperature and moisture levels.

>> Performance, Application and Process Monitoring of Liquid Applied Ultrathin Fluoropolymer Coatings for Protection of Electronics Erik Olson, Molly Smith, Greg Marszalek and Karl Manske, 3M Company; Nikesh Dhar, Google

>> Characterization of Conformal CoatingsPrabjit Singh, Ph.D., IBM Corporation

>> Ensuring Performance and Reliability of High Temperature Electronics Through Thermally Stable Parylene HT at Nano/Micro LevelsRakesh Kumar, Ph.D., Specialty Coating Systems, Inc.

APT2

BGA ReliabilityChair: Randy Schueller, Ph.D., DfR Solutions Co-Chair: Derrick Herron, Indium Corporation


Area Array Packages continue to be pushed to higher levels of reliability to meet the demands of the industry. The papers in this session do an excellent job of determining, through modeling and experimentation, the critical variables of both the package and PCB that most impact the reliability.

>> Solder-Joint Reliability of 0.8mm BGA Packages for Automotive ApplicationsBurton Carpenter, Freescale Semiconductor, Inc.; Thomas Koschmieder, Cirrus Logic, Inc.

>> Board, Package and Die Thickness Effects Under Thermal Cycling Conditions*Jean-Paul Clech, EPSI, Inc.

>> Bending Strength of Solder Joints as a Function of Joint LengthSaeed Akbari, Amir Nourani and Jan K. Spelt, University of Toronto

FSA2

New Developments in No-Clean Solder Paste and Flux Technology and ReliabilityChair: Eric Bastow, Indium Corporation Co-Chair: Renzhe Zhao, Huawei Technologies Co., Ltd.


This session will focus on new developments and reliability challenges in the no-clean solder paste and flux arena. Special attention will be given to electrical reliability challenges associated with partially activated flux residues. This will be incorporated with an overview of the ongoing evolution of flux technology driven by miniaturization and new component designs and soldering challenges.

>> Evolution of the Performance and Reliability Requirements of Soldering FluxesKarl Seelig and Timothy O’Neill, AIM

>> “Partially-Activated” Flux Residue Influence on Surface Insulation Resistance of Electronic AssemblyXiang (Shawn) Wei, Ph.D., Kyle Loomis, Jennifer Allen and Bruno Tolla, Kester, Inc.

>> The Risk and Solution for No-Clean Flux Not Fully Dried Under Component TerminationsFen Chen and *Ning-Cheng Lee, Ph.D., Indium Corporation

MFX2

Challenges in Advanced Package on Package ApplicationsChair: John McMahon, P.E., Celestica, Inc. Co-Chair: Greg Wade, Indium Corporation


“Package on Package” (PoP) is the dominant configuration for mobile processors. It enables processor/cache memory interaction using industry generic packages and represents the lowest cost solution by maintaining supply chain options until final assembly. Continuing miniaturization is driving component height reductions in direct competition to increasing functionality. This session highlights some challenges and solutions associated with the advances in PoP applications.

>> Advanced Analysis of Package-on-Package Interconnect Gaps During Reflow AssemblyKen Chiavone, Akrometrix, LLC

>> Assembly Process Development for a 14mmx14mm Bond Via Array (BVA) Package-on-Package (PoP)Shane M. Lewis, Ph.D. and Tushar Tike, Sanmina Corporation; Charles Woychik, Ph.D. and Ashok Prabhu, Invensas Corporation; Vineeth Bastin, Nordson DAGE

>> Challenges for SMT Assembly of PoP PackagesLilia May, Ph.D., Rajen S. Sidhu, Chang Lin Pubudu Goonetilleke, Huiyang Fei, Satyajit S. Walwadkar and Katherine J. Downes, Intel Corporation

HE5

Thermal Management (Get the Heat Out!)Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions Co-Chair: Raiyo Aspandiar, Ph.D., Intel Corporation


Efficient thermal relief is required in order to obtain expected performance of electronic components, especially those operating in high temperature environments. The Get the Heat Out session presents works on different heat management technologies as well as the unintended consequences of some thermal relief methods to the reliability of electronic components.

>> Design Considerations in the Use of Phase Change Materials in Data Center CoolingJeff Luttrell, Abhishek Guhe and Dereje Agonafer, Ph.D., University of Texas - Arlington

>> Peak Temperature Limitation of Electronic Assemblies with Phase Change MaterialsMathias Nowottnick, Andrej Novikov and Daniel Lexow, University of Rostock

>> High Efficient Heat Dissipation on Printed Circuit Boards Markus Wille, Schoeller-Electronics GmbH

>> Defining Mechanical Load Limits for Thermal Solutions on High Performance FCBGA Packages*Brian Roggeman, Jintao Zheng, Mark Schwarz and Ahmer Syed, Qualcomm Technologies, Inc.


APT3

Advances in WLP and CSP Interconnect Design and Assembly Processes Chair: Chuck Woychik, Ph.D., Invensas Corporation Co-Chair: Mike Bixenman, DBA, KYZEN Corporation


As WLP component pitches decrease, it becomes more difficult to assemble these packages. A systematic approach has been used to develop a robust stencil printing process for 0.3 mm pitch packages. Data will be presented along with conclusions on how the stencil printing process affects the ultimate reliability of 0.3 mm pitch CSP assemblies. Also, in this session the use of polymer cored balls was evaluated on CSP packages which resulted in a 70% improvement in drop testing and 25% improvement in thermal cycle testing. The process used to assemble these polymer core assemblies will be discussed along with the reliability data. Finally, a novel dip encapsulant was evaluated to improve board level reliability on CSP packages. This dip encapsulant is a polymer adhesive which encapsulates the BGA joints after reflow. Thermal cycling was performed using -40 to 125º C temperature range. This work reveals that dip encapsulation can be used as an alternative to solder paste printing, while also improving board level reliability.

>> The Development of a 0.3mm Pitch CSP Assembly Process, Part 2: Assembly & Reliability*Mark Whitmore and Jeff Schake, DEK Printing Solutions, ASM Assembly Systems

>> Development of Low Cost and High Pin Count Wafer Level PackagingKarthik Thambidurai, Viren Khandekar, Tiao Zhou, Ph.D. and Kaysar Rahim, Maxim Integrated

>> Improved SMT and BLR of 0.35mm Pitch Wafer Level Packages*Brian Roggeman and Beth Keser, Qualcomm Technologies, Inc.

FSA3

The How’s and Why’s of Fluxes in Electronics AssemblyChair: Scott Priore, Cisco Systems, Inc. Co-Chair: Rod Howell, Libra Industries


There have been some key advances in the fluxes that are used in electronic assemblies. Fluxes are the most critical element in soldering and these three papers will look at the advances in flux for solder paste, wave solder, and the use of epoxy fluxes for some applications.

>> Rosin vs. Non-Rosin Wave Flux- Which Creates More Reliable Electronic Assemblies?Adam Murling and *Ron Lasky, Ph.D., P.E., Indium Corporation

>> Formulation of a New Liquid Flux for High Temperature Soldering*Tony Lentz, FCT Assembly

>> Epoxy Flux Material and Process for Enhancing Electrical InterconnectionsNeil Poole, Ph.D., Elvira Vasquez and *Brian Toleno, Ph.D., Henkel Electronic Materials, LLC

Wednesday, September 30

FSA4

The Influence and Impact of Materials & Process Selection on ReliabilityChair: David Hillman, Rockwell Collins Co-Chair: Ursula Marquez de Tino, Plexus Corp.


An electronic assembly is the sum of its materials and processes — a detailed balance of material combinations and design parameters which done correctly produces today’s modern electronics or when done incorrectly, causes process engineers headaches. This technical session will provide a deep dive into three distinct materials and process topics: the use of SIR testing to characterize electrochemical reliability; the interaction of component diversity and product reliability; the role of phosphorus in evolution of today’s lead-free solder alloys.

>> SIR and ECM Testing of Soldering Materials vs. Soldering ProcessesKaren Tellefsen, Ph.D., Alpha, an Alent plc Company

>> Reliability Improvements by the Creation of Intermetallic Connections*Joerg Trodler, Dipl.-Ing, Heraeus Deutschland Gmb&Co.KG and Heinz Wohlrabe, Ph.D., Technical University Dresden

>> The Effects of Phosphorus in Lead-Free Solders*Keith Sweatman, Takatoshi Nishimura and Takuro Fukami, Nihon Superior Co., Ltd.

INS1

X-Ray Inspection: The Growing Complexity of Applications and Capability Needs for Tomorrow’s PCBsChair: States Mead, Navitas Systems, LLC Co-Chair: Terry Munson, Foresite, Inc.


This session covers the evolving level of detail inspection requirements being asked of X-Ray equipment. Learn about how this is being achieved through development of enhanced algorithms, optimization techniques, and added capabilities of X-Ray inspection for components like solder charge and press-fit connectors. We will also explore how X-Ray technology is even being pushed to establish measurements of deformation and strain in operational electronics which is currently limited to cut-plane techniques.

>> New X-Ray Algorithms to Improve the Detection of Counterfeit Components*Bill Cardoso, Ph.D., Glen Thomas, Ph.D., Griffin Lemaster, Carlos Valenzuela, Brian Wagner, Tom Gasaway, and Jesse Squire, Creative Electron, Inc.

>> Optimization of X-Ray Inspection for Solder Charge ConnectorsDavid Geiger, Zhen (Jane) Feng, Ph.D., Jennifer Nguyen, Weifeng Liu, Ph.D., Anwar Mohammed, Murad Kurwa, Golden Xu and Lea Su, Flextronics International; George Tint, Ph.D., HDI Solutions, Inc.

>> Deformation and Strain Measurements in Operational Electronics Using X-Ray Micro-CT and Digital Volume Correlation*Pradeep Lall, Ph.D. and Junchao Wei, Auburn University

MFX3

Cleaning Parameters and Cleanliness Monitoring of Electronics AssembliesChair: Barbara Kanegsberg, BFK Solutions, LLC Co-Chair: Mike Havener, Benchmark Electronics, Inc.


Increased complexity and miniaturization of electronic assemblies along with demanding end-use requirements mean that we must clean in situations where cleaning was previously not required. Presenters will explore their studies of how variables in the assembly process impact efficacy of the cleaning process. Attendees will gain tools to increase product reliability.


>> Impact of Multiple Thermal Cycles on the Cleaning Process*Umut Tosun, M.S.Ch.E. and Jigar Patel M.S.Ch.E., ZESTRON Americas

>> Determining the Effect of Water Quality on Cleaning Effectiveness*Eric Camden, Foresite, Inc.

>> Cleanliness Makes a Difference When Miniaturization Kicks In*Mike Bixenman, DBA and David Lober, KYZEN Corporation; Mark McMeen and Jason Tyne, STI Corporation

SUB1

Investigating Surface Finish Reliability and Attributes Outside of Solderability Chair: Lenora Toscano, MacDermid, Inc. Co-Chair: Don Banks, St. Jude Medical


Market needs and environmental changes push the industry for advances in surface finishing. Though solderability is always the primary goal for final finishes, many other critical attributes must also be considered. This session will review alternative surface finishes and speak to performance characteristics for areas left unsoldered. It will also review the latest revisions to the IPC 4552 standard as attention to the core surface finishes is a responsibility of this industry.

>> Final Finish Specifications Overview IPC Plating Subcommittee 4-14George Milad, Uyemura International Corporation

>> Eliminating False Positive ICT Response Through the Use of Organic-Metal Final Finish*Rita Mohanty, Ph.D., John Fudala and Sathiya Narayana, Enthone Inc.

>> Comparing PCB Surface Finishes and Their Assembly Process CompatibilityRob Rowland, Axiom Electronics, LLC; Ray Prasad, Ray Prasad Consultancy Group

APT4

Improvements in Voiding and Reliability of BTCsChair: Brian Roggeman, Qualcomm, Inc. Co-Chair: Fei Xie, Ph.D., Engent, Inc.

Wednesday, September 30 8:00am – 10:00am Room 44

The primary focus on BTCs continues to be voiding, especially on the large thermal pads, while secondary focus is on the field reliability. Improvements in voiding control will be shared using novel preform technology. Finite element modeling and empirical testing investigate the

effects of PCB design, underfills and other types of encapsulants as a means to improve reliability.

>> Voiding Control Beneath Bottom Terminated Components Using Solder Fortification PreformsDerrick Herron, Christopher Nash, Raymond Luo and Andy Wei, Indium Corporation

>> Impact of Layer Thickness of QFN Mounted PCBs During Drop TestingSayalee Sabne, A.R. Nazmus Sakib and Alok Lohia, University of Texas at Arlington

>> Thermal Mechanical Fatigue of a 56 I/O Plastic Quad-Flat No-lead (PQFN) Package*Paul Vianco, Ph.D. and Michael K. Neilsen, Ph.D., Sandia National Laboratories

>> Board Level Reliability Comparison of BGA and LGA Packages Mounted to an LGA Footprint Motherboard*Robert Darveaux, Howard Chen, Shaul Branchevsky and Bhuvaneshwaran Vijayakumar, Skyworks Solutions Inc.; Christopher J. Berry, Wyatt Huddeston and Ben Zarkoob, Amkor Technology, Inc.; Fenimore Chen, Integrated Service Technology, Inc.

FSA5

Solder Joint Reliability AssessmentChair: Tim Jensen, Indium Corporation Co-Chair: Joerg Trodler, Heraeus Deutschland GmbH & Co. KG

Wednesday, September 30 10:30am – 12:00pm Room 47

Assessing the reliability of a finished solder joint can be a complex exercise. With the continued move toward Pb-Free, additional challenges that impact reliability have arisen. In this session, some of these reliability challenges related to Pb-Free transition will be discussed and ways to assess reliability will be reviewed.

>> Assessing Backward Compatible Solder Joint Reliability Under Standard and Mildly Accelerated Test Conditions*Richard Coyle, Ph.D., Peter Read, Richard Popowich and Debra Fleming, Alcatel-Lucent; Vasu Vasudevan, Raiyo Aspandiar and Steve Tisdale, Intel Corporation; Iulia Muntele, Sanmina Corporation

>> Quantifying Qualitative Attributes of Cored Solder Wire in LED Luminaire Soldering — Part 1Amit Patel, Steve Prokopiak, Nicholas Herrick, Bin Mo, Rahul Raut and Ranjit Pandher, Ph.D., Alpha, an Alent plc Company

>> The Quantitative Assessment of Mixed BGA Joint With the Elimination of Low-Melting Point Alloy Re-Melting ProcessHongqin Wang, Guanghui He and Daojun Luo, China Electronic Product Reliability and Environmental Testing Institute

INS2

PCB Quality ManagementChair: Randy Bird, Plexus Corp. Co-Chair: Sang Liu Ph.D., Huawei Technologies Co., Ltd.


Build, Ship, Repeat. That’s what you hope for. Regardless of your manufacturing discipline, you strive to deliver defect-free products to your customers. This session will offer process control solutions to help you do just that.

>> Multi-array PCB Traceability SystemChristoph Wimmer, Microscan

>> Man vs. MachineKeith Bryant, SMT Solutions; Thorsten Rother, YXLON International GmbH

>> There is No Instant Pudding” - Understanding the Roles Test Plays in Managing the Quality of Electronic Printed Circuit Board AssembliesAlan Albee, Teradyne, Inc.

MFX4

Ruggedization Technologies & Materials to Meet Today’s Electronic RequirementsChair: Jason Keeping, P.E., Celestica Inc. Co-Chair: Timothy O’Neill, AIM


Ruggedization is not a new concept; however the materials and processes used to implement these quality improvements are a crucial part of quality developments. Without a viable total ruggedization solution; even your additional processes that are added to increase quality may still not meet the production/field yields and costs objectives of the total project. This session shares recent work done on upstream processes as well as material and application developments for ruggedization.


>> The Future of Nanotechnology in Electronics Assembly and the Investigation of Nano-coating Materials for Water Resistant Applications*Jennifer Nguyen, David Geiger, Anwar Mohammed and Murad Kurwa, Flex

>> Evaluating the Effects of Plasma Treatment Prior to Conformal Coating on Electronic Assemblies to Enhance Conformity of CoverageJohn D. Vanderford, MSEE and Ann E. Paxton, Desich SMART Center; David Selestak, Nordson MARCH

>> The Impact of Improper Conformal Coating Processes on BGA Solder Joint IntegrityRoss Wilcoxon, *Dave Hillman, Doug Pauls and Dan White, Rockwell Collins

APT5

Advances in Electronics Failure AnalysisChair: Andrew Mawer, Freescale Semiconductor Co-Chair: Glen Herzog, Fairfield Industries, Inc. (Retired)


This informative session will cover some of the latest techniques used to analyze a variety of failure modes in electronics assemblies. The first paper outlines a novel method for real-time detection of BGA solder joint opens. Next, a technique to detect cratering during board bending will be described followed by a discussion of an acoustic method to detect pad cratering resulting from PCB bending. Lastly, a review of several improved methods of cross-sectioning will be outlined.

>> Innovative BGA Defect Detection Method for Transient Discontinuity*Steven Perng, Weidong Xie, Tae-Kyu Lee and Cherif Guirguis, Cisco Systems, Inc.

>> Detection of Pad Crater Initiation in Shock Using Acoustic Emission DetectionW. Carter Ralph, Southern Research Institute; Gregory N. Morscher, The University of Akron, Elizabeth Elias Benedetto, Keith Newman and Aileen Allen, Hewlett-Packard; Julie Silk, Keysight Technologies

>> On-Board Package Decapsulation Techniques for Failure AnalysisPriyanka Dobriyal, Ph.D., Anil Kurella, Ph.D., and Suzi Southwick, Intel Corporation

>> Alternative Methods for Cross-Sectioning of SMT and PCB Related ArchitecturesManuel J. “Paco” Solis, Foresite, Inc.

SUB2

Emerging Topics on Design and Process Technologies of Printed Circuit BoardsChair: Raiyo Aspandiar, Ph.D., Intel Corporation Co-Chair: Don Banks, St. Jude Medical


Printed Circuit Board Technology continues to evolve to meet densification, miniaturization and power requirements of new products and new markets. This session will discuss novel PCB design, materials and process technology developments.

>> Development of Advanced Embedded Die Modules for Power Electronics Applications*Lars Boettcher, Stefan Karaszkiewicz and Andreas Ostmann, Fraunhofer Institute for Reliability and Microintegration (IZM); Dionysios Manessis, Technical University Berlin

>> Direct Metallization System for Flexible Printed Circuit Board*Rita Mohanty, Ph.D., Albert Angstenberger, Melanie Rischka and Han Verbunt, Enthone, Inc.

>> Via-In-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware*Matt Kelly, Mark Jeanson, Timothy Younger, Jim Bielick, Theron Lewis and Mitch Ferrill, IBM Corporation

APT6

Solder-Joint ReliabilityChair: Burt Carpenter, Freescale Semiconductor Co-Chair: Jeff Jennings, Harris Corporation


Solder-joint reliability is an important aspect which can determine the useful lifetime of a component mounted to a PCB. This session will explore the effects of a variety of package types (including PBGA, CBGA, and Super-BGA), package sizes and solder alloy composition on the solder-joint lifetime in temperature cycle testing. Data from drop shock, component shear, and vibration tests will also be shown.

>> Development of Lead-Free Alloys With Ultra-High Thermal-Mechanical ReliabilityPritha Choudhury, Ph.D., Morgana Ribas, Ph.D., Ranjit Pandher, Ph.D., Anil Kumar, Sutapa Mukherjee, Siuli Sarkar, Ph.D. and Bawa Singh, Ph.D., Alpha, an Alent plc Company

>> A Selected Comparison from ATC Test: Industry Progress from 2005 to Present Day*John McMahon, P.E., Russell Brush and Brian Standing, Celestica Inc.

>> Component Level Reliability for High Temperature Power Computing With SAC305 and Alternative High Reliability SoldersThomas Sanders, Sivasubramanian Thirugnanasambandam, John Evans, Ph.D., Michael Bozack, Ph.D. and Jeff Suhling, Ph.D., Auburn University; Wayne Johnson, Ph.D., Tennessee Tech University

FSA6

Test Optimization for Improved Quantification of Material and Assembly QualityChair: Martin Anselm, Ph.D., Rochester Institute of Technology Co-Chair: William Capen, SAIC


Defects in manufacturing are inevitable. Incoming device electrical defects, underreported halogen content and Head in Pillow failures are some of the most elusive defects to quantify. This session investigates improvements evaluating these conditions and proposes new methodologies to improve detection.

>> A Packaging Physics of Failure Based Testing Methodology for Semiconductor IC Part Reliability AssessmentJingsong Xie and Ming Sun, Ph.D., RelEng Technologies, Inc.; Fei Xie, Engent, Inc.

>> Determination of Total Halogen Content in Halogen-Free Fluxes by Inductively-Coupled Plasma and Some Limitations of Ion ChromatographyChristopher J. Pontius, George Kraeger and *Ron Lasky, Ph.D., P.E., Indium Corporation

>> Measurement Systems Analysis Techniques for Head in PillowsAyman Fayed and Donna Schnell, Intel Corporation


INS3

Advances in Process Controls, From 3D Printing to 3D Inspection to Measuring Thermal Expansion MismatchChair: Michael Newman, Harris Corporation Co-Chair: Christoph Wimmer, MICROSCAN


Process controls for modeling, manufacturing inspection and electronic assembly reliability can save valuable product development time and money. 3D Printing technology is quickly becoming a necessity in various manufacturing disciplines. The ability to model the process effectively can be a real time saver. With the advent of smaller and smaller electronic components 3D vision systems are becoming the norm and to accomplish this in a timely and reliable manner can add to manufacturing success. Understanding Coefficient of Thermal Expansion (CTE) between SMT components and the substrate is fundamental in understanding the reliability of electronic assemblies whether it be a cell phone or a communication module in a lunar landing module. Using a process to actually measure the differences can provide insight to this phenomena.

>> Digital Image Correlation Using High Magnification Optical MicroscopyW. Carter Ralph, Cheri B. Moss and Kevin B. Connolly, Southern Research Institute

>> Addressing High Precision Automated Optical Inspection Challenges With Unique 3D Technology SolutionTodd Liberty and Tim Skunes, CyberOptics Corporation

>> Thermo-Mechanical Warpage and Stress Simulation for 2.5D and 3D IC PackagingAkash Agrawal, Guilian Gao, Bongsub Lee, Laura Mirkarimi and Sitaram Arkalgud, Invensas Corporation

MFX5

Innovation and Process Control for Liquid Soldering Processes Chair: Ursula Marquez de Tino, Plexus Corp. Co-Chair: Denis Barbini, Ph.D., Universal Instruments


This session addresses implementation of process controls on selective soldering equipment and alternative flux deposition method. All these proposals aim to obtain a repeatable and reliable process. By controlling machine parameters and flux application, it is possible to reduce the number of defects from wave and selective soldering processes.

>> Plasma Based VOC-free Fluxing for Selective and Wave SolderingAndreas Reinhardt, Ph.D. and Sonja Wege, Ph.D., SEHO Systems GmbH

>> Advanced Closed Loop Process Control for Selective SolderingBob Klenke, ITM Consulting

>> Achieving Repeatable, Consistent Control Over the Selective Production ProcessGerjan Diepstraten, Vitronics Soltec B.V.

SUB3

Surface Finish Parameters that Impact Interconnect ReliabilityChair: Norman Armendariz, Ph.D., Raytheon Systems CompanyCo-Chair: Viswam Puligandla, Ph.D., Nokia (Retired)


Several parameters that are part of the surface finishes on PCBs as well as the choice of surface finish itself have a profound impact on the formation and subsequently the reliability of the interconnect, whether it be on the wire bond or the solder joint. In this session we explore some of these variables from surface finish chemistry vendor perspective. This session investigates solder joint reliability based on the choice of the surface finish and solder alloy combination, the impact of copper roughness on surface finish and the effect of P content on the solder and wire bond reliability.

>> Influence of Surface Finishes and Solder Alloys on Solder Ball Joint ReliabilityYoshinori Ejiri, Takaaki Noudou, Takehisa Sakurai, Yoshinori Arayama, Yoshiaki Tsubomatsu and Kiyoshi Hasegawa, Hitachi Chemical Co., Ltd.

>> Controlling Copper Roughness to Enhance Surface Finish Performance*Lenora Toscano and Ernest Long, Ph.D., MacDermid, Inc.

>> The Impact of P Content in Pd Deposit for Solder Joint Reliability and Wire Bonding Reliability of ENEPIG DepositsTsuyoshi Maeda, Shinsuke Wada, Katsuhisa Tanabe, Yukinori Oda and Shigeo Hashimoto, C. Uyemura & Corporation Co., Ltd. Central Research Laboratory; *Donald Gudeczauskas and George Milad, UIC Technical Center;

APT7

Ceramic Column Grid Arrays — Applications, Materials and OptimizationChair: Marie Cole, IBM Corporation Co-Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory


Ceramic Column Grid Array packages are a good alternative to BGA packages for high I/O, high performance and/or high reliability applications. Learn more about the challenging applications that can benefit from CCGA interconnections and the variety of available CCGA structures. In addition, this session will share best practices for CCGA package and card assembly processes for high yield and reliability.

>> CCGA - Solder Column Attachment for Absorbing Large CTE MismatchMartin Hart, Topline Corporation

>> CGA Trends and Capabilities Marti McCurdy, Silicon Turnkey Solutions, Inc.; Isabel de Sousa, Robert Martel and Alain Lessard, IBM Canada

>> Nickel Hydroxide Corrosion Residues on Metallized Ni/Au Ceramic PackagesMinerva M. Cruz and Russell T. Winslow, Six Sigma

SUB4

Influence of Finishes on Printed Circuit Board (PCB) ReliabilityChair: Norman Armendariz, Ph.D., Raytheon Stystems CompanyCo-Chair: Robert Farrell, Benchmark Electronics, Inc.


Either as plated layers within a through-hole or as thin films on a LTCC, surface finish selection is critical for the survival of PCB. Stresses imparted during exposure to real-life operating conditions create failures within these surface finish layers to eventually lead to loss of interconnectivity in electronics. The two papers in this session deal with TH hole plating impact on PWB reliability and investigation of a thin film material used in LTCC for harsh environments, respectively.

>> Fatigue Life Estimation of Electroplated Through Hole in PWB by FEM with Thin Cu Material PropertiesYoshiyuki Hiroshima, Shunichi Kikuchi and Akiko Matsui, Fujitsu Advanced Technologies Limited; Yoshiharu Kariya, Ph.D., Naoyuki Yajima and Kizuku Obinata, Shibaura Institute of Technology; Hiroshi Shimizu, Hitachi Chemical Co.Ltd; Kazuhiko Nakamura, HDP User Group International, Inc.


>> Establishing a Ti-Cu-Pt-Au Thin Film – on – Low Temperature Co-Fired Ceramic (LTCC) Technology for High-Temperature Electronics*Paul Vianco, Ph.D., J. Rejent, M. Grazier, A. Kilgo, B. McKenzie and A. Allen, Sandia National Laboratories; E. Guerrero and W. Price, Nuclear Security Complex, Honeywell, Inc.

Thursday, October 1

FOCUSED SYMPOSIUM III

Lead-Free Soldering Technology Organized by Paul Vianco, Ph.D., Sandia National Laboratories, Matt Kelly, P.Eng., MBA, IBM Corporation , and Elizabeth Benedetto, Hewlett-Packard Company

Thursday, October 1 l 8:00am — 5:00pm Room 49


LF1

Universal Instruments Consortium Pb-Free Project UpdateChair: Paul Vianco, Ph.D., Sandia National LaboratoriesCo-Chair: Matt Kelly, P.Eng., MBA, IBM Corporation

Thursday, October 1 | 8:30am – 10:00am Room 47/49

Consortia activities continue to fill the gaps in Pb-free technology and, in particular, long term reliability. This session begins with the results of a study to examine the effects of surface finishes on the reliability of Pb-free interconnections used with wafer-level, chip-scale packages (WLCSPs). The second presentation investigates the role of conformal coatings on the survivability of quad flat pack, no lead (QFN) packages when the latter are targeted for harsh environments applications. The session is rounded out with an analysis of new Pb-free die attach materials and their performance in thermo-mechanical conditions.

>> Metallization and Surface Finish Effects on Pb-free WLCSP Thermal Cycle ReliabilityMichael Meilunas and *Jim Wilcox, Universal Instruments Corporation

>> Thermo-Mechanical Evaluation of Alternative Pb-free Die Attach MaterialsHarry Schoeller, Ph.D., Universal Instruments Corporation; Sandeep Mallampati and Junghyun Cho, Ph.D., Binghamton University

>> Harsh Environment Reliability of Micro-Leadframe (QFN) Components and Conformal Coating Effects*Jim Wilcox and Michael Meilunas, Universal Instruments Corporation; Martin Anselm, Ph.D., Rochester Institute of Technology

LF2

Corrosion and Flux Residue Impacts of Lead-Free SoldersChair: Matt Kelly, P.Eng., MBA, IBM CorporationCo-Chair: Richard Coyle, Ph.D., Alcatel-Lucent

Thursday, October 1 | 10:30am – 12:00pm Room 47/49

Today, electronic systems must operate in a wide variety of field conditions. These systems are now generally built using lead-free no-clean solders per EU RoHS regulations. Understanding environmental corrosion and surface electromigration failure mechanisms is critical in ensuring reliable system performance. This session reports the latest research in better understanding corrosion and flux residue impacts relating to surface electromigration failure mechanisms.

>> Electronic Assembly Pitting/Crevice Corrosion Research *Mike Bixenman, DBA, KYZEN Corporation; Wallace Ables, Dell Computer; Richard Kraszewski, Plexus Corporation; Chin Siang Kelvin, Julie Silk, Keysight Technologies; Keith Howell and Takatoshi Nishimura, Nihon Superior; Jim Hartzell, Enthone; Karl Sauter, Oracle; Robert Smith, HDPug

>> Critical Parameters of a No-Clean ProcessTerry Munson, Foresite, Inc.

>> Reactivity of No-Clean Flux Residues in Electronic Assemblies: A Systematic StudyBruno Tolla, Ph.D., Denis Jean, Hemal Bhasvar, Yanrong Shi, Xiang (Shawn) Wei, and Kyle Loomis, Kester, Inc.

LF3

Research Challenges with Tin Whiskers and MitigationChair: Jeff Kennedy, Celestica, Inc. Co-Chair: Elizabeth Benedetto, Hewlett-Packard

Thursday, October 1 | 1:00pm – 2:30pm Room 47/49

This session will explore the latest research initiatives in the areas of Tin Whiskers and mitigation. Continued examination from last year’s presentation of what promotes the Tin Whisker growth and the related risk associated with these fine metallic filaments for products in the high reliability products will be covered. Mitigation of the risk associated with these Tin Whiskers will also be discussed as well as some novel material developments using nano-particles in conformal coating. A presentation of what is required to use coating as a Tin Whisker mitigation method and how to perform the required material study to support this new performance objective for conformal coatings will conclude the session.

>> SERDP Nanoparticle Enhanced Conformal Coating Project: Modeling for Tin Whisker Mitigation*Stephan Meschter, Ph.D. and S. McKeown, BAE Systems; P. Snugovsky, Ph.D., J. Kennedy, Z. Bagheri, J. Keeping, P.E. and E. Kosiba, Celestica Inc.; J. Cho, Binghamton University; David Edwards, Henkel, LLC; K. Elsken, Bayer Material Science

>> Long Term Monitoring and Failure Detection of Tin Whiskers Bridging Adjacent Leads on SOIC ComponentsOwen Thomas, *Chris Hunt, Ph.D., Martin Wickham and Kate Clayton, National Physical Laboratory

>> Innovating the Microstructure of Polyurethane Conformal Coatings for Tin Whisker MitigationJunghyun Cho, Ph.D. and Suraj Maganty, Binghamton University; Stephan J. Meschter, Ph.D., BAE Systems - Electronic Systems

LF4

Lead-Free Solder Joint Reliability: Recent AdvancesChair: Jean-Paul Clech, Ph.D., EPSI, Inc.Co-Chair: Kola Akinade, Ph.D., Cisco Systems, Inc.

Thursday, October 1 | 3:00pm – 4:30pm Room 47/49

Material and reliability experts will share recent findings on lead-free alloys and solder joint reliability characterization. Topics to be discussed include: the impact of test specimens on fracture properties; the effect of bismuth additions to SnCu alloys on solder joint reliability; and the effect of pre-conditioning and thermal cycling profiles on the reliability of test vehicles assembled with varied SAC solder compositions.

>> Effect of Test Specimen on Fracture Behavior of Lead-free Solder JointsAmir Nourani, Saeed Akbari and Jan K. Spelt, University of Toronto

>> A New Method of Increasing the Reliability of Lead-free SolderTakatoshi Nishimura, Keith Sweatman, Akira Kita and Shuhei Sawada, Nihon Superior Co., Ltd.

>> iNEMI Pb-Free Alloy Characterization Project Report: Part IX – Summary of the Effect of Isothermal Preconditioning on Thermal Fatigue Life*Richard Coyle, Ph.D. and Joe Smetana, Alcatel-Lucent; Richard Parker, iNEMI; Elizabeth Benedetto and Aileen Allen, Hewlett Packard; Keith Howell and Keith Sweatman, Nihon Superior Co.; Weiping Liu, Indium Corporation; Michael Osterman, CALCE; Julie Silk, Keysight Technologies; Rafael Padilla and Tomoyasu Yoshikawa, Senju Metal Industry Co.; Mitch Holtzer, Alpha, an Alent plc Company


5N Plus Micro PowdersBooth No: 327Michael Benson 4385 Garand StreetMontreal, QC H4R 2B4 CanadaPHONE: 514-856-0644FAX: 514-856-9611EMAIL: [email protected] WEB: www.5nplus.com

5N Plus Micro Powders, invested significantly in developing a high performance atomizing technology to efficiently manufacture fine metallic powders — down to the 1 to 25 micron range. This proprietary technology allows for the dedicated production of spherical powders with low oxygen content and uniform size distribution. We have recently established a new production facility at our Montreal headquarters to serve the electronic powders markets focusing on Type 5 to Type 8 products. Our parent company, 5N Plus Inc., is the leading producer of high purity specialty metals and chemical products with 11 manufacturing operations globally and 16 sales offices in Europe, Asia and the Americas.

Acculogic, Inc.Booth No: 800Greg LeBlonc 175 Riviera DriveMarkham, ON L3R 5J6 CanadaPHONE: 905-475-5907FAX: 905-475-5415EMAIL: [email protected] WEB: www.acculogic.com

Acculogic manufactures and markets a broad range of systems and instruments for testing electronic devices, circuit boards and systems.

Accurate Carriers USABooth No: 717Jay Hindersman 500 Mitchell RoadGlendale Heights, IL 60139 PHONE: 800-830-3771FAX: 630-790-6105EMAIL: [email protected] WEB: www.accuratecarriersusa.com

Accurate Carriers is a global, one-stop source for electronic packaging media and equipment. With locations in North America and Europe, our staff is experienced in finding expedited solutions for custom and every day Tape and Reel Requirements. Accurate Carriers’ sister company Link Marketing, is the exclusive sales office for Q-Corporation Tape and Reel and parts handling equipment. Whether the requirement is services, supplies, or equipment, Accurate Carriers has you covered for custom turn-key media or equipment.

ACE Production TechnologiesBooth No: 426Alan Cable3010 N. First Street Spokane Valley, WA 99216 PHONE: 509-924-4898EMAIL: [email protected] WEB: www.ace-protech.com

Selective soldering systems ranging from batch mode machines to in-line systems for high-speed selective soldering. All systems feature graphics-based software for easy programming, auto fiducial alignment, board warp compensation and remote machine diagnostics as standard. Multiple preheat options plus interchangeable solder pots and nozzles for tin-lead, lead-free and HMP solders. Options include the world’s only fully maintainable drop-jet fluxer compatible with water- soluble fluxes and high solids content fluxes up to 33%. Selective soldering workshops are taught by independent industry specialists.

ACL, Inc.Booth No: 331Tony Banks840 W. 49th Place Chicago, IL 60609-5151PHONE: 847-981-9212FAX: 847-981-9278EMAIL: [email protected] WEB: www.aclstaticide.com

ACL Staticide® — Specialists in Static Control Products and PCB Cleaning and Repair Chemicals

ACL’s fine family of products includes: • Anti-staticcoatings• DissipativefloorpaintandESDpolishes• Anti-staticworkbenchproductsincluding

dissipative mats• Staticdetectionandmeasurement

instruments PCB cleaning, rework and repair chemicals

• Theseinnovativeproductsaredevelopedand produced to meet and exceed industry standards. Our brand names, Staticide®, Dualmat™, and ESD Safety Shield, in addition to our static detection meters, are distributed and highly regarded throughout the world.

At ACL, Inc. we are dedicated to the highest level of customer satisfaction:• Friendly,knowledgeablesalesstafffor

quick answers to your static control questions

• Largeinventory—mostordersshipwithin24-72 hours Over 40 years of experience in static control and prevention

• ISO9001:2008certificationforourqualitymanagement system

• ACL’stotalcommitmenttoqualityproducts combined with our high performance standards and the integrity of our employees has established us as a world leader in static control products and solutions.

Exhibitor Guide

TT designates Tech Tour Participant | designates Inspection Experience Participant


Aegis Industrial Software CorporationBooth No: 440Lynette Penecale5 Walnut Grove Drive Suite 320Horsham, PA 19044PHONE: 215-773-3571FAX: 215-773-3572EMAIL: [email protected] WEB: www.aiscorp.com

Aegis Software is a leading provider of innovative software solutions to improve speed, control, and visibility throughout manufacturing operations. The Company’s integrated suite of software modules manage the entire manufacturing information environment: from product launch, to material logistics, through manufacturing execution, to operations analytics and real-time dashboard systems. This holistic solution yields unprecedented product, process, and materials traceability as well as the data fulfillment and visibility manufacturers need for competitive improvement.

AGI CorporationBooth No: 738Todd Gilmore177 Nick Fitcheard Road Huntsville, AL 35806PHONE: 256-858-3300FAX: 256-858-3304EMAIL: [email protected] WEB: www.AGIcorp.com

AGI Corporation has ITAR certified locations in Alabama and Florida! Providing state of the art Laser Cut Stencils using a new DEK Fiber Laser. AGI is an internationally known supplier of Wave Solder Pallets and SMT Assembly Pallets from simplest to most complex. We offer Titanium Insert Pallets, Screen Printer Tooling, Wash Baskets, Feeder Carts, Tray Carts, Stencil Carts, Build-to-Print capabilities and many other types of fixtures. We have the most aggressive design/machining techniques available.

AIMBooth No: 413Alana Grear25 Kenney DriveCranston, RI 02920PHONE: 401-463-5605EMAIL: [email protected] WEB: www.aimsolder.com

AIM is a leading global manufacturer of solder assembly materials for the electronics industry. Our full-line of assembly materials includes solder paste, liquid flux bar, wire, preforms, adhesives, cleaners, chemicals, plating anodes, and indium and gold-based specialty alloys. AIM is ISO 9001 and ISO 14001 certified with manufacturing, distribution, and support facilities located throughout the Americas, Asia-Pacific, and Europe.

Akrometrix, LLCBooth No: 134Dorothy Garvey2700 Northeast Expy N.E. Suite B 500Atlanta, GA 30345PHONE: 404-486-0880FAX: 404-486-0890EMAIL: [email protected] WEB: www.akrometrix.com

Akrometrix is the worldwide leader of PCB and component warpage management systems and services for the electronics industry. We measure flatness and strain of electronic components at critical reflow temperatures. Akrometrix equipment is capable of providing graphical, statistical and tubular results to prove compliance to industry standards.

Alltemated, Inc.Booth No: 9403353 N. Ridge Ave. Arlington Heights, IL 60004 PHONE: 847-394-5800FAX: 847-394-5805EMAIL: [email protected] WEB: www.allemated.com

Since 1993, Alltemated has been the electronics industry’s preferred choice for one-stop component- preparation services. Alltemated sets the standard for tape and reel packaging, custom carrier tape design, carrier tape manufacturing, IC programming, bake and dry-pack services, Place N Bond (our trademarked product), and assembly services.

We provide turnkey engineering, documented and managed solutions for our global customer list of top distributors, EMS providers, and OEM’s. These top-tier companies depend on our proven quality and reliability.

We pride ourselves on our commitment to quality, delivery, and price. Our goal is total customer satisfaction. We offer aggressive same day service, on-demand capacity, and superior performance every time.

AlphaBooth No: 321Laurie Kneller 300 Atrium DriveSomerset, NJ 08873PHONE: 908-791-3045EMAIL: [email protected] WEB: www.alpha.alent.com

Alpha, a business unit of Alent plc, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Americas, Europe and Asia Pacific regions, Alpha supplies a full line of ALPHA® electronics assembly material products.

Alpha is a leading materials supplier to various industries, including electronics assembly, power electronics, die

attach, LED lighting, photovoltaics, semiconductor packaging, and automotive. For years, our expert engineering

and process excellence has served our customers well. By providing the most innovative product solutions on

the market today, Alpha is skilled at building powerful partnerships that enable companies to deliver reliable

products in an efficient and sustainable way. alpha.alent.com

Visit us at SMTAIAlpha, Booth #321Alpha Recycling Services, Booth #1006

THE LEADING PROVIDER OF INNOVATIVE MATERIALS & SOLUTIONS FOR ELECTRONICS ASSEMBLY

smtai_full_4.indd 1 7/28/15 4:09 PM

2015 SMTA International SHOW DIRECTORY >> 31 SMTAssociation @SMTAorg #SMTAI30 >> 2014 SMTA International SHOW DIRECTORY

Alpha is a leading materials supplier to various industries, including electronics assembly, power electronics, die

attach, LED lighting, photovoltaics, semiconductor packaging, and automotive. For years, our expert engineering

and process excellence has served our customers well. By providing the most innovative product solutions on

the market today, Alpha is skilled at building powerful partnerships that enable companies to deliver reliable

products in an efficient and sustainable way. alpha.alent.com

Visit us at SMTAIAlpha, Booth #321Alpha Recycling Services, Booth #1006

THE LEADING PROVIDER OF INNOVATIVE MATERIALS & SOLUTIONS FOR ELECTRONICS ASSEMBLY

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Alpha Recycling ServicesBooth No: 1006Laurie Kneller 300 Atrium DriveSomerset, NJ 08873PHONE: 908-791-3000EMAIL: [email protected]: www.alphaalent.com

Alpha, a business unit of Alent plc, provides electronics assemblers safe, efficient solder recycling services which will help them meet environmental and legislative requirements while maximizing the return on their solder dross, scrap and solder paste waste. With facilities located in the Americas and European Regions, Alpha continues to invest and expand their capabilities to take back metal waste streams and responsibly recycle that waste into high purity raw materials for reuse.

American Hakko ProductsBooth No: 534Rick Richards 28920 Ave. WilliamsValencia, CA 91355-4182PHONE: 661-294-0090FAX: 661-294-0096EMAIL: [email protected] WEB: www.HakkoUSA.com

American Hakko Products, Inc. is a manufacturer and supplier of soldering, desoldering, hot air and BGA rework systems, smoke and fume extraction systems, CHP brand hand tools and technical sales training. For more information, including product demonstration videos, please visit: www.HakkoUSA.com

American Standard Circuits, Inc.Booth No: 801Anaya Vardya475 Industrial DriveWest Chicago, IL 60185-1891 PHONE: 630-639-5440FAX: 847-453-4415EMAIL: [email protected] WEB: www.asc-i.com

ASC is a total solutions provider, of manufacturing quality rigid, metal-backed, flex and rigid-flex PCBs, as well as RF/microwave PCBs, to the medical, automotive, industrial, defense, and aerospace markets in volumes from test and prototypes to large production orders. ASC has the expertise to provide all technologies in a time- critical environment. Company qualifications include ISO9001:2008, MIL-PRF 31032, and ITAR registration. It holds a number of key patents for metal bonding processes as well.

Amitron CorporationBooth No: 536Thomas Massman 2001 Landmeier RoadElk Grove Village, IL 60007 PHONE: 847-290-9800 x752FAX: 847-290-9823EMAIL: [email protected] WEB: www.amitroncorp.com

Amitron, located in the Chicago area, is one of the largest privately held circuit board manufacturers in the USA. Capabilities include prototyping, unlimited production quantities, 1 to 20 layers, .003” line and space (inner layer), blind/buried via, FR4, specialty and thermal materials/aluminum, up to 20 oz. copper. Certifications include; ISO9001-2008, Mil-P-55110, ITAR and Minority. Aside from our 72,000 sq. ft. facility in Illinois, we operate a second facility in India, certified to ISO/TS 16949: 2009.

AOI SystemsBooth No: 444Vinny CarriganMinerva Works Miller Street Unit PJohnstone, PA5 8HP United KingdomPHONE: 440-141-416-5113EMAIL: [email protected] WEB: www.aoisystems.com

Automation is the key to success in today’s PCB production environment. With increasing demand to drive down costs and maintain high quality, AOI provides you with the cost effective solution. AOI Systems offer a range of solutions to meet the requirements of every production facility and has put AOI within the reach of all manufacturers.

Apex Factory Automation TTBooth No: 735William Crist 14526 Lee RoadSuite 400Chantilly, VA 20151PHONE: 240-293-2419EMAIL: [email protected] GENERAL INQUIRY: [email protected] AND PARTS: [email protected] WEB: www.apexfa.com

ApexFA is the distributor in USA and North America for the these manufacturers:

1. Mirae Pick and Place2. SJ Inno Tech Stencil Printers3. Xavis X-Ray4. Norsdon-DIMA SMT

Service and parts are all based in USA at Chantilly, VA facility.

We provide turn-key service and installation. Your Peace of Mind is Our Commitment.

Apollo SeikoBooth No: 411Stacey Barajas3969 West Lemon Creek Road Bridgeman, MI 49106PHONE: 269-465-3400FAX: 269-465-3441EMAIL: [email protected] WEB: www.apolloseiko.com

Apollo Seiko is the inventor & world-wide leader of selective soldering solutions. Our technologies include 130 & 200 watt contact soldering systems, laser diode & Micro-Laser machines as well as selective fountain soldering. We offer desktop & In-Line solutions, and four different Apollo controllers to meet both price and capability requirements. Our patented iron tip & solder feeding technologies set us apart from the competition.

ASC International

Booth No: 518Jon Arneson 830 Tower DriveMedina, MN 55340PHONE: 763-479-6210FAX: 763-478-6206EMAIL: [email protected] WEB: www.ascinternational.com

ASC International is a leading supplier of Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) solutions globally. Providing both offline and inline options, ASC International is focused on being the price to performance leader in all categories. The featured product for this year’s SMTA International show will be the recently released LineMaster DM with Dual Mode AOI/SPI capabilities for the most cost effective method for achieving quality assurance. In addition, ASC will be providing hands-on demonstrations of its market leading VisionPro M500 and VisionPro AP500 SPI systems along with the VisionPro AV862 AOI system.


Ascentech, LLC

Booth No: 219Randy Allinson127 Goose Hill Road Chester, CT 06412PHONE: 860-526-8903FAX: 860-526-1003EMAIL: [email protected] WEB: www.ascentechllc.com

Ascentech LLC is North American Distributor for GEN3 SYSTEMS Ltd. and Optilia Instruments AB products.

Distribution Products

GEN3 Systems, Ltd:• Auto-SIR – Surface Insulation Resistance

Test System• CM-Series – Ionic Cleanliness (ROSE) Test

Systems DC- Series - Conformal Coating application, Precision Dip Coaters

• SB2900 – Conformal Coating, Spray Booth Systems Gensonic Ultra Sonic Stencil Cleaner

• MUST III – Solderability Test System (wetting balance) SPA1000 – Solder Paste Analyzer

• SolderSaver – Solder Recovery System• Z-Check – Solder Paste Measurement

Systems

Optilia Instruments AB:• High definition (HD) inspection cameras

used both inline and off-line• Flexia BGA Inspection systems for

inspection of low clearance areas beneath BGA assemblies

• OptiPix Software for image capture, video and image analysis

ASM Assembly Systems

TT(SIPLACE & DEK)Booth No: 225Tom Foley3975 Lakefield CourtSuwanee, GA 30005PHONE: 770-797-3475EMAIL: [email protected] WEB: www.siplace.com

Leading electronics manufacturers around the globe select ASM Assembly Systems for Screen Printing and SMD Placement Solutions.

DEK Screen printers, SIPLACE Placement Machines, Software for fast line changeover, and process expertise are on display at the ASM Assembly Systems booth.

ASYS Group Americas, Inc.Booth No: 835Astrid Wilkens140 Satellite Blvd. NE Suite B1Suwanee, GA 30024PHONE: 770-246-9706FAX: 770-246-9866EMAIL: [email protected] WEB: www.asys-group.com

ASYS Group provides high quality equipment and excellent support worldwide. The product range includes SMD Board Handling, Marking Systems (Laser/Label/Inkjet), Depaneling Systems (In-/Offline), Final Assembly and EKRA Screen Printers for the SMT, Semi-Pack, Solar, and Hybrid markets. Transforming Ideas into Solutions.

ATV Technologie GmbHBooth No: 841Siegfried Kowalsky 85591 Vaterstetten GermanyPHONE: +49-8106-305023WEB: www.atv-tech.de

ATV manufactures:• Batch type VACUUM REFLOW Soldering

OVENS/RTAs: Void free solder joints, IGBT, CSP, Flip Chip, CPV, MMIC

• In Line VACUUM REFLOW Soldering OVENS MEMMS cap/Package lid sealing with GETTER activation

• THERMO COMPRESSION BONDER up to 450°C:

• Transient Liquid Phase Soldering/Bonding QUARTZ TUBE Furnaces: LPCVD, CNT/graphene, oxidation, diffusion

• LTCC SINTERING FURNACE/PRESS/ THERMO

• COMPRESSION BONDER up to 1 100°C:Constrained LTCC sintering/ hot embossing

• Manual DIAMOND SCRIBERS: to 200 mm IR LPCVD/ALD System, 50°C-1050°C,

• temperature/pressure alternation

Aven, Inc.Booth No: 235Tim Nelson4330 Varsity Drive Ann Arbor, MI 48108 PHONE: 734-973-0099EMAIL: [email protected] WEB: www.aveninc.com

Aven specializes in stereo zoom and digital microscopes, video inspection systems, specialty high-resolution digital and video cameras, lenses, illuminated magnifiers, software for image analysis and tools for precision assembly.

BEST, Inc.Booth No: 127Alex Conley3603 Edison PlaceRolling Meadows, IL 60008 PHONE: 847-797-9250FAX: 847-797-9255EMAIL: [email protected] WEB: www.solder.net

BEST Inc. is your BEST resource for PCB rework/repair, solder training, and soldering tools.

Our company is composed of highly trained IPC-certified soldering technicians that can perform the most complex BGA repair/reballing and PCB rework/repair. In addition, our large variety of state-of-the art equipment insures the rework done on your PCBs and BGAs will be completed correctly. 100% guaranteed.

Additionally, BEST is a professional solder training company that certifies technicians in various IPC certification programs. We also offer custom BEST courses that include hand soldering and PCB rework. Our mobile training center is the only solder training center on wheels that can come to your area with a professional instructor and all of the proper training tools. Moreover, several unique PCB repair products have been developed by BEST:

• StencilQuik provides for the fast, simple placement of BGAs.

• StencilMate provides a simple method for the rework of leadless devices

• EzReball is a unique reballing perform system for even the smallest of devices

• HeatShields are flexible, effective materials for shielding components

BOFA AmericasBooth No: 1000John Podwojski303 S. Madison Street Staunton, IL 62088PHONE: 618-205-5007FAX: 866-707-2632EMAIL: [email protected] WEB: www.bofaamericas.com

The World Leader in Fume Extraction Technology Designing and Manufacturing fume extraction solutions for a variety of Industrial Applications. Knowledge of the electronics assemble sector has enabled BOFA to develop product solutions for manual and automated soldering, conformal coating, and potting and gluing applications.



BTU InternationalBooth No: 734Rob DiMatteo 23 Esquire RoadN. Billerica, MA 01862 PHONE: 978-667-4111FAX: 978-667-9068EMAIL: [email protected] WEB: www.btu.com

BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment and processes to the electronics manufacturing and alternative energy markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in the manufacturing of solar cells and nuclear fuel. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.

CalcuQuoteBooth No: 1046Chintan Sutaria414 Englewood DriveMurphy, TX 75094PHONE: 909-278-8233EMAIL: [email protected] WEB: www.calcuquote.com

CalcuQuote is an online quoting tool specifically designed for small-mid sized PCB Assembly companies. It improves the speed and accuracy of your quoting process through a proprietary algorithm and simplified user interface. Talk to us about how to improve your RFQ process!

CIRCUITS ASSEMBLYBooth No: 601Frances Stewart180 Woodsong DriveFayetteville, GA 30214PHONE: 678-817-1286EMAIL: [email protected] WEB: www.circuitsassembly.com

UP Media Group Inc. (UPMG) (upmediagroup.com) serves the global PCB community through print, digital and online products, as well as live and virtual events. UPMG publishes PRINTED CIRCUIT DESIGN & FAB (pcdandf.com) and CIRCUITS ASSEMBLY (circuitsassembly.com), as well as the PCB UPdate (pcbupdate.com) e-newsletter. UPMG also produces trade shows and conferences, including PCB West (pcbwest.com), the CIRCUITS ASSEMBLY Directory of EMS Companies and the annual Service Excellence Awards and NPI Awards.

CMK America CorporationBooth No: 745Tony Spinelli175 Handley RoadSuite 300Tyrone, GA 30290PHONE: 770-632-7174FAX: 770-632-7175EMAIL: [email protected] WEB: www.cmk-corp.com

CMK is a World Class PCB manufacturer.

CogiscanBooth No: 1038Mitch De Caire211 Waterloo Street Winnipeg, MB R3N 0S4 CanadaPHONE: 450-578-1644EMAIL: [email protected] WEB: www.cogiscan.com

Cogiscan is the leading track, trace and control (TTC) solutions provider for the electronics manufacturing industry. The scalable Cogiscan platform perfectly integrates with all major equipment types, and is highly configurable to enable a personalized solution to each customer’s specific production needs. Since 1999 Cogiscan has attained several international patents for TTC hardware and software, and has won multiple awards throughout the years.

Computrol, Inc.Booth No: 938Jeff Yturbe499 East Corporate Drive Meridian, ID 83642PHONE: 208-887-1000 x231EMAIL: [email protected] WEB: www.computrol.com

Computrol Inc. is a full service Electronics Contract Manufacturing Services Provider, specializing in full turnkey, high technology electronic manufacturing and test. We are AS9100/ISO9001, ISO13485, IPC class II and III and J-Std certified company and we are ITAR registered. We also do complete box and system level assembly as well. We utilize AOI, X-Ray, XRF and Selective Soldering.

Conductive Containers, Inc.Booth No: 317Zach Burton4500 Quebec Ave. N. New Hope, MN 55428 PHONE: 763-746-9774EMAIL: [email protected] WEB: www.corstat.com

CCI is the premiere manufacturer of ESD safe packaging solutions. As the only charter member in the ESD Association who deals solely in static protective packaging, CCI has been involved in the protection of static sensitive electronic components for more than 20 years. Our sales engineers have an average of more than 10 years experience in combination with their continuous training, making CCI one of the most knowledgeable companies in the ESD industry.

Conecsus, LLCBooth No: 110Tom Mitchell 106 Tejas DriveTerrell, TX 75160PHONE: 859-250-5847EMAIL: [email protected] WEB: www.conecsusllc.com

Conecsus, LLC recycles solder dross, spent solder pastes, and contaminated trash such as wipes, gloves, and rags. With our world class laboratory, state of the art technology, and the largest rotary furnace of its kind in North America, we’re the best choice in recycling.

Creative Electron, Inc.Booth No: 516Glen Thomas253 Pawnee Street San Marcos, CA 92078 PHONE: 760-212-0170EMAIL: [email protected] WEB: www.creativeelectron.com

Creative Electron is the largest US manufacturer of X-ray inspection systems for electronics. We proudly design and manufacture the award winning TruView™ X-Ray family of products. Powered by proprietary algorithms and state of the art hardware, TruView™ will enable you to rethink x-ray inspection.


Crystal Mark, Inc.Booth No: 319Chris Romero 613 Justin Ave.Glendale, CA 91201PHONE: 818-240-7520FAX: 818-247-3574EMAIL: [email protected] WEB: www.crystalmarkinc.com

Crystal Mark, Inc. specializes in all aspects of micro abrasive processing as automaters, manufacturers and end users. We offer manual, automated and custom micro sandblasting systems, as well as Job Shop services to accommodate a variety of diverse applications. From surface prep and conformal coating removal, to spot cleaning, surface etching, cleaning, deburring, texturing and more. We are the recognized leader and innovator in micro abrasive processing.

CTI SystemsBooth No: 226Daniel Gray5313 Womack RoadSanford, NC 27330PHONE: 919-776-7227EMAIL: [email protected] WEB: www.conveyor-technologies.com

CTI Systems, the Advanced Automation Division of Conveyor Technologies Inc. is a world class manufacturer of PCB Assembly Equipment / Laser Marking / Routers / Automatic Component Inspection / Custom Robotic Automation (Odd Form). In addition we also manufacture state of the art PCB transport equipment with advanced features such as automatic change over management systems and bar code verification. Visit CTI and let us share with you our world class engineering, equipment and support.

CyberOptics CorporationBooth No: 814Sy Creed5900 Golden Hills Drive Minneapolis, MN 55416PHONE: 408-677-1816EMAIL: [email protected] WEB: www.cyberoptics.com

CyberOptics Corporation (NASDAQ: CYBE) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics sensors are being used in general purpose metrology and 3D scanning, surface mount technology (SMT) and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of its key vertical segments. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

Dimation, Inc.Booth No: 934Edward Knutson505 W. Travelers Trail Burnsville, MN 55337PHONE: 952-746-3030EMAIL: [email protected] WEB: www.dimation.com

Design/layout, Quik-turn™ prototype, low volume production, die level services, and custom microelectronic assembly and packaging. At Dimation, we are dedicated to providing our customer with the highest level of service possible. We provide exceptionally quick-turn, walk-in, weekend and evening service to help meet your deadlines. We are AS9100 Certified and ITAR Registered. We are so fast WEFLP4U!

DIVSYS InternationalBooth No: 1008Nicholas Mates8110 Zionsville RoadIndianapolis, IN 46268PHONE: 317-405-9427FAX: 317-663-0729EMAIL: [email protected] WEB: www.divsys.com

DIVSYS International is a woman-owned company in the business of selling Printed Circuit Boards and verifying them in our in-house Product Assurance Lab. DIVSYS is made up of Engineers and Technicians who all came from PCB fabrication and assembly facilities. Knowledge and hands-on experience of both worlds gives DIVSYS the advantage in assisting customers in the OEM and CM arenas with PCB issues. Our laboratory is used by companies in many industries to understand board and assembly related problems that they are experiencing. Our Engineers work with your engineers to solve problems.

DIVSYS is not a broker. DIVSYS is the front end of a fabricator, the engineering support for your company, your check and balance for product assurance (in-house lab), and your supply chain manager for PC Boards that meet your expectations and specifications. We are data-driven technical resources for Printed Circuit Boards. We review every lot that we order before it is shipped to our customer. We do not sort bad product. We reject it. Our suppliers are audited by experts in PCB fabrication. Anyone can attain a quality certification… we audit their processes, equipment, materials, review their SPC charts and watch the product on the lines. Each supplier is given only the technology of product that we qualify them to make, and nothing else. We then bring everything back to Indianapolis for our own product assurance testing. We do not take chances with your business.Laboratory services for hire include XRF, BBT, cleanliness, thermal shock, environmental stress, complex routing, non-contact CMM, delamination and cross-sectioning.



ELANTAS PDGBooth No: 318Dana Roschnafsky 5200 N. Second Street St. Louis, MO 63417 PHONE: 314-622-8748FAX: 314-436-1030EMAIL: [email protected] WEB: www.elantas.com

A premier global manufacturer of liquid electrical insulation products including potting compounds, conformal coatings, adhesives, specialty epoxy products used in hi-temp applications. The Epoxylite®, ELAN- Tron®, ELAN-Cast®, Pedigree®, and Sterling® brands are used for coating, sealing and potting electronic components, sensors, PCBs and other applications. Registered ISO 9001:2000 and ISO/TS 16949.

Electronic Assembly Products, Ltd.Booth No: 807John Johnson1220 Runnymede RoadDayton, OH 45419PHONE: 937-414-6652FAX: 408-228-0665EMAIL: [email protected] WEB: www.electronic-assembly-products.com

Fancort Industries, Japan Unix, Depaneling equipment, PCB routers, Soldering robots, TechWear ESD garments.

Electronics World PublishingBooth No: 929Donal McDonald#3 Inishkeen Kilcoole WicklowIrelandPHONE: 353-086-2485842EMAIL: [email protected] WEB: www.electronicsproductionworld.com

Electronic World Publishing is one of the largest online publishers for the electronics manufacturing sector. Between its various publications, it strives to cover the entire of the market. Our outbound product is the EPW weekly report, bringing news and product information along with technical articles to the reader. To round all of this out there is also Electronics Industry Update, with a digital circulation of over 100,000 copies each month, this magazine is available on PC in a flash based format, or by iPad or Android App.

Electrotek CorporationBooth No: 420Larry Robinson 7745 S. 10th StreetOak Creek, WI 53154 PHONE: 317-753-3606FAX: 414-762-1390EMAIL: [email protected] WEB: www.boards4u.com

Electrotek is a bare board manufacturer focused on the high reliability and high technology markets. Electrotek is ITAR and ISO 9001-2008 registered, AS9100 certified as well as MIL-PRF-31032 / 55110 qualified. Electrotek manufactures a wide range of technologies including blind and buried vias, high layer count, mixed material constructions, heavy copper and controlled impedance boards. Electrotek caters to the medical, military, aerospace, planar transformer, communications and memory marketplaces as well as others. Electrotek supports proto and quick turn requirements down to three days as well as volume production in three weeks.

ELTEK, Ltd.Booth No: 140Jim Barry25 Orchard View Drive Unit 207Londonderry, NH 03053PHONE: 603-421-0020FAX: 603-421-0023EMAIL: [email protected] WEB: www.eltekglobal.com

Eltek is a global supplier of High-Density Rigidflex and PCB Technologies. Established in 1970, the company’s primary facility located in Israel is known for its innovative high technology manufacturing solutions and its commitment to exceptional customer service. Eltek’s products support some of the most demanding application around the world.

EPTAC CorporationBooth No: 746Cheryl Fisher8025 S. Willow Street Suite 207Manchester, NH 03103-2311PHONE: 603-296-0887FAX: 603-296-2377EMAIL: [email protected] WEB: www.eptac.com

EPTAC provides IPC Certification along with comprehensive training and consulting to the electronics manufacturing industry. We certify industry professionals to IPC-A-610, J-STD-001, IPC-A-600, IPC-WHMA-620,IPC-7711/7721 as well as offer exclusive training in Counterfeit Component Inspection & Mitigation to the IDEA-STD-1010 for OEM’s and Component Brokers. Additional training offerings include J-STD-002/003 Solderability Testing, Wires/Terminals, Through Hole, SMT, Rework/Repair, ESD, Component Identification, Defect Prevention, and more… Training can be conducted on-site, and can be customized and performed within your production constraints; satisfies ISO 9000 requirements or, classes are available in over 30 cities in the United States and Canada.

ERSA North AmericaBooth No: 539Lance Larrabee 1779 Pilgrim RoadPlymouth, WI 53073PHONE: 920-892-9263FAX: 920-893-1562EMAIL: [email protected] WEB: www.ersa.com

ERSA is a leading global supplier of selective solder systems, reflow ovens, wave solder systems, rework systems, inspection and hand soldering stations and more. ERSA has global locations in Germany, USA, Mexico, France, Korea and China.


ESSEMTEC

TTBooth No: 335Steve Pollock 816N Delsea Drive Suite 308Glassboro, NJ 08028PHONE: 856-218-1131FAX: 856-218-1134EMAIL: [email protected] WEB: www.essemtec-usa.com

Essemtec is a leading designer, manufacturer & distributor of electronic manufacturing equipment for electro-mechanical assembly and semiconductor packaging with production facilities in Switzerland.

We specialize in high speed fluid dispensing equipment as well as flexible high-mix SMT assembly solutions. Essemtec has had the privilege to serve our loyal customer base since 1991.

Europlacer Americas TTBooth No: 637John Perrotta519 US Highway 301 SouthTampa, FL 33619PHONE: 267-884-6560OFFICE: 813-246-9500FAX: 813-246-9595EMAIL: [email protected] WEB: www.europlacer.com

A manufacturer of market-leading flexible SMT placement machines will showcase the IINEO-II in Booth# 637 at SMTA Int’l 2015. We are demonstrating the award-winning IINEO-II. This multifunctional assembler is widely configurable for numerous assembly requirements, including item level traceability, electrical test and much more. The IINEO platform offers the industry’s largest board size (24”W x 63”L) along with expansive feeder capacity up to 264 x 8 mm + trays, 2- placement heads, 24 nozzles active/120 nozzle storage, odd-form capability and enough capacity for a broad range of presentation media including tape-and-reel, trays, tubes, cut tapes and POP.

EVS International Sales LimitedBooth No: 142Helen NormanUnit 17 Broadfield ParkSeaview RoadCowes, Isle of WrightUnited KingdomP0317USEMAIL: [email protected] WEB: www.solderrecovery.com

World Leaders in Solder Recovery, EVS provide cost effective solutions for onsite recovery of solder from wave solder dross. Our system supports both lead and lead free solder. The technology built into the range of EVS machines is based upon world-wide patents. The EVS Systems are simple to use, ISO14001 compatible, and provide rapid payback. Our new EVS500, is smaller footprint with new unique technology, but with the same rapid payback.

FCT Assembly Booth No: 313Jeremy Glanzer 1309 N. 17th Ave.Greeley, CO 80631PHONE: 970-214-4854EMAIL: [email protected] WEB: www.fctassembly.com

FCT Assembly manufactures several core products including leaded and lead-free solder paste, wire solder, bar solder, flux, laser cut SMT Stencils, nano coatings and also offers high precision custom laser cutting services. We are a one stop shop for Contract Manufacturers and Original Equipment Manufacturers who are seeking high quality chemistry that performs in the market.

Finetech/MartinBooth No: 417Adrienne Gerard560 E. Germann Road#103Gilbert, AZ 85297PHONE: 480-893-1630EMAIL: [email protected] WEB: www.finetechusa.com

Finetech and Martin supply rework equipment for a wide range of applications: 01005s, BGAs, shields, LEDs, connectors, flip chip, PoP, memory devices, chip-on- flex. The Core provides precise temperature and convection flow control, outstanding placement accuracy, and robust process development including extensive recipe libraries. The Expert 10.6 delivers automated component alignment, large board handling, and productivity features including non-contact residual solder removal and solder paste/flux dispensing. A standalone BGA-CSP reballing unit is available to compliment these systems. Finetech also supplies high-accuracy bonders for microelectronics packaging.

FKN SystekBooth No: 933Klaus Heimann115 Pleasant StreetMillis, MA 02054PHONE: 508-935-2282FAX: 508-935-2286EMAIL: [email protected] WEB: www.fknsystek.com

FKN Systek is a US manufacturer of Depanelizers used for singulating pre-scored and tab routed Printed Circuit Cards. Our broad line of depaneling equipment ranges from low cost benchtop tools such as the N100 PCB Nibbler for singulating tab routed panels, to high volume production systems such as the K5000 In-line Multiple Blade Depanelizer for singulating pre-scored boards. We also supply PCB racks and crimp tools and equipment.



FlexLink Systems, Inc.Booth No: 107Emily Travis6580 Snowdrift RoadAllentown, PA 18106PHONE: 610-973-8268FAX: 610-973-8345EMAIL: [email protected] WEB: www.flexlink.com

Based on our unique application experience and global network, we provide innovative, profitable, and quality automation solutions to demanding world-leading customers. FlexLink’s specialty is Production Logistics, defined as ensuring that each machine and workstation is fed with the right product, quantity, and quality at the right time. The solution considers intelligent value adding processes and elimination of non-value adding ones. We offer custom solutions, standard modules, and software that allows for efficient, variable, and progressive production flow throughout the process. See more at: www.flexlink.com.

FSInspectionBooth No: 946Pauline Damery 11800 31st Court N.St. Petersburg, FL 33716 PHONE: 877-256-9847FAX: 727-471-7931EMAIL: [email protected] WEB: www.fsinspection.com

FSInspection offers high-magnification visual inspection systems for industrial market. Our high-quality visual work stations are easy to use and more ergonomic and cost-effective than traditional microscopes.

Fuji America Corporation TTBooth No: 107Scott Wischoffer171 Corporate Woods Pkwy. Vernon Hills, IL 60061 PHONE: 847-913-0162FAX: 847-913-0186EMAIL: [email protected] WEB: www.fujiamerica.com

The innovative world leader in surface mount technology. Our modular, flexible and easy to use placement systems are configured to support any production environment from high mix/low volume to ultra-high volume. Easy to program, simple to maintain and unsurpassed quality make Fuji the perfect choice for all your PCB assembly needs.

Geib Refining Corp.Booth No: 1033Laura Soper399 Kilvert StreetWarwick, RI 02886PHONE: 516-768-5747FAX: 401-732-2841EMAIL: [email protected] WEB: www.geibrefining.com

Refiner of precious metals from thin & thick film production scrap, i.e. solder paste jars, wipes, gold wire, solder dross,chamber scrapings,gold targets & shields.Geib Refining Corp. reclaims Gold, Platinum, Palladium, Iridium, Rhodium & Silver.We are EPA & ITAR compliant, therefore all scrap is destroyed and disposed of accordingly.

Glenbrook Technologies, Inc.Booth No: 819Steven Zweig 11 Emery Ave.Randolph, NJ 07869PHONE: 973-361-8866FAX: 973-361-9286EMAIL: [email protected] WEB: www.glenbrooktech.com

Glenbrook Technologies introduces the Jewel Box Ultra Compact X-ray System. A full featured microfocus X-ray system small enough to fit on a desk.

Global SMT & PackagingBooth No: 919Trevor Galbraith PO Box 7579Naples, FL 34102PHONE: 239-245-9264FAX: 239-245-9268EMAIL: [email protected] WEB: www.trafalgarmedia.com

Global SMT & Packaging is the world’s leading B2B magazine for the EMS industry. Featuring solution led technical and market information, it is published as US, European, China and SE Asia editions.

The magazines are supported by international daily newsletters and weekly regional newsletters to China, SE Asia, Germany, UK/Ireland and Latin America.

GlobalSMT TV is the industry’s most viewed video channel featuring new products, how-to’s and corporate videos related to electronics manufacturing.

Trafalgar Business Solutions (TBS) is the consultancy division, specializing in mergers, acquisitions, market research and development.

GPD GlobalBooth No: 305Christian Vega611 Hollingsworth Street Grand Junction, CO 81505 PHONE: 970-245-0408FAX: 970-245-9674EMAIL: [email protected] WEB: www.gpd-global.com

Manufacturer of automated and semi-automated fluid dispensing equipment for solderpaste, conductive epoxy, underfills, encapsulation (COB), SMT Adhesive for double-sided pc boards, thermal and UV materials. Pumps/ Valves include NCM5000 Jet; PCD Volumetric Series; Precision Servo Controlled Augers; Nano-Piston for micro volumes and Time Pressure. Witness our patent-pending FPC Fluid Pressure Control system for real-time control of fluids over the entire level of a syringe.

Heller IndustriesBooth No: 107Keith Virden8307 High Oak Drive Austin, TX 78759-8132PHONE: 512-454-4057EMAIL: [email protected] WEB: www.hellerindustries.com

Heller Industries is a manufacturer of convection reflow & IR curing ovens. Heller’s new heating and cooling advances delivery up to 40% reduction in nitrogen and electrical consumption. This makes the Heller ovens not only the premier reflow soldering system, but the best overall value in the industry.

Henkel Electronic Materials, LLCBooth No: 701Elaine Kyle14000 Jamboree RoadIrvine, CA 92606PHONE: 714-368-8000EMAIL: [email protected] WEB: www.henkel.com/electronics

Henkel is focused on developing next-generation materials for electronics assembly applications. A broad portfolio of materials including potting materials, sealants, low pressure molding systems and conformal coatings that span through multiple markets, including automotive, industrial, medical, lighting and consumer electronics. A leader in die attach, underfill, solder, molding, printable ink and thermal management materials, Henkel has developed some of the industry’s most innovative and enabling electronic material solutions. Learn more at www.henkel.com/electronics.


HEPCO, Inc. Booth No: 416Tim Hoffman150 San Lazaro Ave. Sunnyvale, CA 94086PHONE: 408-738-1880FAX: 408-732-4456EMAIL: [email protected] WEB: www.hepcoblue.com

Manufacturer of Equipment and Tooling for BGA Reballing and Component Lead Trimming and Forming Equipment.

Heraeus ElectronicsBooth No: 845Ryan Herrmann 24 Union Hill RoadConshohocken, PA 19428PHONE: 610-825-6050EMAIL: [email protected] WEB: www.heraeus.com/en/home.html

Heraeus Electronics – a Global Business Unit of the Heraeus Group – is one of the leading R&D partners and manufacturers of materials in the electronics industry. The company deals with sophisticated material solutions and sub-systems for the semiconductor and automotive industry, the communications and telecommunications industry, energy and power electronics, industrial electronics, and consumer goods. Heraeus Electronics’ core capabilities include bonding wires, thick film pastes, DBC substrates, roll clad strips, stamped lead frames, and assembly materials (such as solder pastes, fluxes, sinter pastes, solder powders, and conductive/non-conductive adhesives).

Hi-Rel LaboratoriesBooth No: 909Adam Mortensen 6116 N. FreyaSpokane, WA 99217PHONE: 509-325-5800EMAIL: [email protected] WEB: www.hrlabs.com

Hi-Rel Laboratories is an independently owned and operated corporation whose main concentration of activity is in the materials evaluation of the micro-electronic aspects of commercial, aerospace and defense industries. We specialize in solutions for process, production and application problems requiring knowledge and experience in microelectronics and materials technology. Using techniques such as metallography, light and scanning electron optics coupled with energy dispersive spectroscopy, and FTIR, we are able to isolate and solve your materials issues.

I-Connect007Booth No: 104Barbra Hockaday PO Box 50Seaside, OR 97138PHONE: 916-608-0660EMAIL: [email protected] WEB: www.iconnect007.com

Watch video interviews with industry leaders, read show articles, view our extensive photo gallery and more. Real Time with…SMTA International is produced by I-Connect007, home of SMT Magazine, SMT Week, SMT Online, Flex007, MilAero007, PCBDesign007, The PCB Magazine and PCB007. Produced by the industry’s most experienced digital media publisher, these global online resources are the electronics manufacturing industry’s most comprehensive source for news, articles and original content.

IDENTCOBooth No: 1030Dave Mondek28164 W. Concrete Drive Ingleside, IL 60041PHONE: 815-385-0011EMAIL: [email protected] WEB: www.identco.com

With over 29 years of experience, IDENTCO is your preferred global source for high performance UL/CSA electronic component & circuit board labels. IDENTCO’s durable labels endure harsh environments such as high heat, aggressive fluxes and caustic cleaners commonly used in the PCB manufacturing process. IDENTCO’s TT433 Ultra Durable Polyimide labels are the most versatile on the market performing equally well in both reflowed and non-reflowed environments. TT433 performs where others fail.

IKEUCHI USA, INC.Booth No: 902Shogo Yamaguchi8110 Beckett Center Drive West Chester, OH 45069 PHONE: 513-942-3060EMAIL: [email protected] WEB: www.ikeuchiusa.com

Ikeuchi USA provides a versatile system that can achieve ideal humidity in any environment with our patented technology, “Dry Fog” (non-wetting fog). Our advantages are non-wetting fog, low-pressure system, very low maintenance. IKEUCHI’s FogEngineers can help you avoid the pitfalls that occur after installation of other ‘mindless’ humidifiers. Please visit our booth and feel the Dry Fog!

iLink Electronics, Inc.Booth No: 1041Ismael Pulido28120 Ridgethorne Court Rancho Palos Verdes, CA 90275 PHONE: 310-318-4428EMAIL: [email protected] WEB: www.ilinkae.com

Making a Difference in the Automation, Design, Manufacture of FA Equipment, BHU & Facilities for SMT& SMD Lines.

Indium CorporationBooth No: 430Colleen Bierstine 34 Robinson RoadClinton, NY 13323PHONE: 315-853-2052EMAIL: [email protected] WEB: www.indium.com

Indium Corporation is a premier materials supplier to the global electronics assembly, semiconductor fabrication and packaging, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. Factories are located in the PRC, Singapore, South Korea, the United Kingdom, and the USA.

Infinite GraphicsBooth No: 925Suzi McDonough 4611 E. Lake StreetMinneapolis, MN 55406PHONE: 612-728-1321FAX: 612-721-3802EMAIL: [email protected] WEB: www.igi.com

Infinite Graphics’ game-changing Generate Solder Paste Stencil software advances the process of editing geometry for stencils from hours to minutes. Identification of a component is done once and applied to every angled component globally. Components are then automatically recognized for all future jobs, saving time and increasing throughput. Rules can be set up to edit solder paste geometry to create the desired stencil apertures instantly upon recognition of components, based on customer or engineering specifications. Infinite Graphics Incorporated (www.IGI.com) is a photolithography solutions provider with over 40 years experience in solving challenges with precision phototools, editing software, photomasks, and 3D/sculptured microstructures. Stop by booth #925 to see how IGI can help you.



Inovaxe CorporationBooth No: 713Margy Khoshnood 260 SW 12th Ave.Deerfield Beach, FL 33442 PHONE: 954-531-1363FAX: 954-697-2362EMAIL: [email protected] WEB: www.inovaxe.com

Inovaxe is a provider of innovative SMART and PASSIVE material storage and handling systems. Our Ultra Lean Total Material Handling and Storage Solutions address the challenges of dealing with SMT components and kits within the manufacturing stockroom and WIP locations. The product offering includes SMART & PASSIVE Two Bay and One Bay Storage Carts (InoAuto), ambient air (InoCarts and InoKits), Moisture Sensitive Device Material Storage System (InoMSD), a stockroom management software tool (InoView), and an inventory locator software tool (InoAuto Locator).

InsulFab PCB ToolingBooth No: 512Candice Simpkins 834 Hayne StreetSpartanburg, SC 29301PHONE: 864-582-7506FAX: 864-527-1066EMAIL: [email protected] WEB: www.insulfabtools.com

InsulFab is your primary source for all types of tooling in the PCB industry, including engineering solutions for your most complicated tooling and process issues. We would welcome the opportunity to earn your business with quick turnaround, innovative design, quality products, competitive pricing and a sincere desire to provide the best customer service available. We look forward to demonstrating our experience and knowledge by assisting you with your PCB Tooling needs.

Inspection Feature AreaBooth 1050

This year’s special feature area will focus on Solder Paste and Solder Joint Automated Optical Inspection. Be sure to stop by to view live printing of ultrafine pitch components, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus key in-process inspection steps to make a process perform correctly.

Inventec Performance ChemicalsBooth No: 230Rodrigo Aguilar26 Avenue du Petit Parc94683 Vincennes Cedex FrancePHONE: +33143987540EMAIL: [email protected]: www.inventec.dehon.com

More than 40 years of leadership supporting high reliability applications with soldering, cleaning and coating materials for electronics assembly and semiconductor packaging.

Since December 2014, AMTECH materials is now part of Inventec.

Solder paste for SMT, Package on Package, Jet Printing, wafer Bumping and die attach.Solder fluxes for Wave Soldering, Package on Package and flip chip. Cleaning chemistries for PCBA defluxing and maintenance cleaning. Coatings for protection of PCBA.

IPCBooth No: 744Susan Storck3000 Lakeside DriveBannockburn, IL 60015PHONE: 847-597-2872EMAIL: [email protected] WEB: www.ipc.org

IPC (www.IPC.org) is a global industry association based in Bannockburn, IL., dedicated to the competitive excellence and financial success of its 3,500 member companies which represent all facets of the electronics industry, including printed board design and manufacturing, electronics assembly and test.

Ironwood ElectronicsBooth No: 818Ila Pal1335 Eagandale Court St. Paul, MN 55121-1353 PHONE: 952-229-8212FAX: 952-229-8201EMAIL: [email protected] WEB: www.ironwoodelectronics.com

Ironwood Electronics offers high performance test sockets and adapters for both engineering and production use. IC packages covered include QFN, BGA, SOIC, QFP, and other SMT packages. Our GHz line of sockets supports up to 75 GHz bandwidth and the smallest footprint in the industry. We also provide customized adapters to the semi industry requiring intricate SMT interfaces for emulation, test, and prototype functions.

iTAC Software, AGBooth No: 1027Michael Fischer Aubachstr. 24Montabaur 56410 GermanyPHONE: +49-2602-1065EMAIL: [email protected] WEB: www.itacsoftware.com

iTAC Software, AG is a leading provider of enterprise MES solutions, specializing in the electronics, automotive, and medical markets. Our modular product portfolio includes solutions for delivering traceability, quality control, production management, planning and scheduling, and real-time business intelligence. Headquartered in Germany, iTAC Software has a global support organization and worldwide customer base that includes several top-tier multinational manufacturers. Our cloud-based enterprise MES offering is a leading enabler of Industry 4.0 and the industrial internet.

JBC Tools USA, Inc.Booth No: 636Kathy Morrow9296 Dielman Industrial Drive St. Louis, MO 63132PHONE: 866-429-5753EMAIL: [email protected] WEB: www.jbctools.com

More than 80 years experience has placed JBC at the technological forefront of tools for soldering and rework operations in electronics. Innovation, efficiency and reliability are the key features of a wide range of products that have been designed to satisfy the most demanding requirements. JBC’s global organization of local offices and a distributor network spanning five continents enables the company to provide quick and efficient service.

Jovy Systems LimitedBooth No: 646Moataz Munier ElRaddaf1B Area on 2nd Fl., # 48 FactoryWorkshop, Hexi Village Concept Of Ring Rd. Guan Lan Town 518110Guangdong, Shenzhen ChinaPHONE: 86-755-26068658FAX: 86-755-26068658EMAIL: [email protected] WEB: www.jovy-systems.com

Jovy Systems is a global Manufacturer of BGA Rework stations, soldering stations, bench Tools and a wide range of soldering consumables that are specially designed for the electronics industry, and a stellar distribution network that covers more than 30 countries across all five continents.


JTAG TechnologiesBooth No: 939Grover Craig111 West Street N. Suite AEaston, MD 21601PHONE: 410-770-4415EMAIL: [email protected]: www.jtag.com

With our products, customers world-wide have increased the quality of their products, reduced costs and improved time-to-market. With more than 8,000 installations, a continuous track record of product breakthroughs, and the industry’s largest network of providers, JTAG Technologies is proud to lead the industry in boundary-scan solutions and services. Boundary-scan technology helps overcome the test and programming challenges of comples PCBs.

Juki Automation Systems TTBooth No: 716Geron Ryden 507 Airport Blvd.Suite 101Morrisville, NC 27560PHONE: 919-460-0111FAX: 919-469-0480EMAIL: [email protected] WEB: www.jukiamericas.com

Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, recently celebrated their 76th anniversary. Having shipped more than 29,000 machines worldwide, Juki continues to be an industry leader, promoting a global image that combines top-quality and high-reliability machines with a reputation for world-class service and support that result in the lowest production costs for its customers.

The pioneer of the modular assembly system in 1993, Juki offers flexible solutions designed for both high-volume and high-mix environments and has offices in Morrisville, NC and Fremont, CA.

Additionally, JAS, Inc. offers selective solder and stamp soldering machines backed by the largest field service group in the industry. The company recently introduced a complete line solution to include screen printers, reflow ovens and wave solder systems. For more information, visit www.jukiamericas.com.

Kester

Booth No: 131Michelle O’Brien800 W. Thorndale Ave.Itasca, IL 60143PHONE: 630-616-6806EMAIL: [email protected] WEB: www.kester.com

Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces. Our products include an array of basic and high-tech attachment materials including traditional soldering chemicals, bar and wire solder, and paste products. We serve a worldwide customer base with facilities in North America, Germany and Singapore. We are an Illinois Tool Works (ITW) Company. ITW is a leading diversified manufacturing company with more than 100 years of history and over 800 decentralized business units in nearly 60 countries.

Kester offers the following solutions: Lead-Free Solutions, Solder Paste, Liquid Solder Flux, Solder Wire, Bar Solder, Tacky Solder Flux (TSF), Preforms, SECURE® advanced materials and a full spectrum of global customer technical support.

Throughout the world, Kester’s products are known for their high quality and advanced technology. Kester’s ISO-14001 and ISO-9001 certifications ensure Kester’s partners of this dedication to quality and environmental responsibility. Our goal is to provide product solutions for the electronics assembly, semiconductor and automotive industries across the world.

KIC Booth No: 338MB Allen16120 W. Bernardo Drive San Diego, CA 92127 PHONE: 858-673-6050FAX: 858-673-0085EMAIL: [email protected] WEB: www.kicthermal.com

Discover efficient oven setup with KIC’s Auto-Focus Power. Auto-Focus Power leads to much faster oven setup for new assemblies and it lowers the risk of damaging the PCB during the first profile run. A manual profile can still be performed to verify an in-spec profile or for further fine-tuning.

This easy-to-use product enables technicians of all levels to achieve expert process results and quickly solve that oven setup puzzle.

Koh Young America, Inc.Booth No: 307Ashley Hughes6150 W. Chandler Blvd. Suite 39Chandler, AZ 85226PHONE: 480-403-5000EMAIL: [email protected] WEB: www.kohyoungamerica.com

What we do: Design, manufacture, sales and service of industry leading 3D measurement & inspection solutions for process optimization on highly innovative manufacturing environment.

Koh Young Applications:• In-line/off-line Solder Paste Inspection

In-line Pre-reflow/Post-reflow AOI• Inspection Solutions for Semiconductor

Flip-Chip Packaging• Inspection Solutions for Semiconductor

3D Packaging

KOKI Solder AmericaBooth No: 135Shantanu Joshi4916 Strathmore DriveUnit 4Cincinnati, OH 45227PHONE: 760-504-2544EMAIL: [email protected]

Roberto Segura18510 Pasadena Street Unit ELake Elsinore, CA 92530 PHONE: 951-245-8755EMAIL: [email protected] WEB: www.ko-ki.co.jp

Established in 1964, KOKI have developed and introduced numbers of cutting edge soldering materials ever since.

Today, amid rapidly the evolving electronics industry, we, as a manufacturer of soldering materials, are requested of technological advancement, environmental friendliness, and compliance.

With that in mind, we are actively advancing soldering technologies of next generation, such as halogen-free flux, anti-cracking, and low melting point solder alloy, in addition to existing high quality soldering materials. We KOKI, as a group of professionals specialized in soldering technologies, are eager to contribute to the development and advancement of the global soldering industry with latest technologies, quality excellence, and valuable services to provide.



Krayden, Inc.Booth No: 931Patrick Gurak1491 W. 124th Ave.Denver, CO 80234PHONE: 303-280-2800FAX: 303-280-0178EMAIL: [email protected] WEB: www.krayden.com

Krayden is a stocking distributor of adhesives and sealants for North America, including the USA, Canada, and Mexico. Dow Corning Distributor of Year 2011 (4th yr in row), Certs- AS9120, ISO9001:2008

Kulicke & Soffa Industries, Inc.Booth No: 136Sheila Frese1821 E. Dyer Road#200Santa Ana, CA 92705 PHONE: 949-660-0440FAX: 949-660-0444EMAIL: [email protected] WEB: www.kns.com

Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacturing of semiconductor, LED and electronic assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, advanced SMT (acquired from Assembléon Netherlands B.V.), wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor, LED devices and high quality printed circuit board assembly.

KwikTic, Ltd.Booth No: 445Dave PickavanceSuite 5, Northern Diver Building Appley BridgeWigan, WN6 9AE United KingdomPHONE: 44-0-1257-369320EMAIL: [email protected] WEB: www.kwiktic.com

KwikTic is a scalable MES, Work Instruction and Quality Software Suite.

Within manufacturing environments controlling and monitoring data on the shop floor efficiently is critical to producing high quality product on time and to budget. Using paper documents, basic office tools and verbal communication inevitably leads to delays, errors and is costly. With KwikTic the entire process, including Test, Inspection, AOI, Assembly, shipping, can be easily controlled and monitored through simple interfaces and comprehensive reporting.

KYZEN CorporationBooth No: 117Sherry Stepp430 Harding Industrial Drive Nashville, TN 37211PHONE: 615-983-4562EMAIL: [email protected] WEB: www.kyzen.com

KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Celebrating 25 years in 2015, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards.

LaserJob, Inc.Booth No: 125Carmina Laentzsch Liebigstrasse 14 Fuerstenfeldbruck, DE 82256 GermanyPHONE: 49-8141-52778 22FAX: 49-8141-52778-69EMAIL: [email protected] WEB: www.laserjob.de

Specialist for lasercut SMD-stencils for more than 20 years. We offer step sencils, nano-coated stencils (NanoWork) since 2008, repair- and reballing stencils, wafer bumping stencils, via fill stencils, and stencils for all tensioning systems. Our stencils show a tensioning force >40N/cm, with an aperture size accuracy of +-3µm and an aperture position accuracy of +-10µm.

MacDermidBooth No: 927Deanna Cullen 245 Freight StreetWaterbury, CT 06702PHONE: 203-575-5743FAX: 203-575-7916EMAIL: [email protected] WEB: www.electronics.macdermid.com

MacDermid Electronics Solutions is a leading supplier of specialty chemicals for PCB fabricators, assemblers, and original equipment manufacturers and supplies innovative, environmentally sound products to a rapidly changing electronics marketplace. We specialize in the areas of final finishes, through-hole metallization, and circuit formation providing a critical component for maintaining the finished product’s overall performance. We are a proven innovator in the field of chemical processing, providing application-specific solutions and unsurpassed technical support.

MANEX ERP, Inc.Booth No: 339David Sharp7026 Sitio CorazonCarlsbad, CA 92009PHONE: 814-806-1261EMAIL: [email protected] WEB: www.manex.com

Custom ERP system designed for the Electronic Manufacturing Services (EMS) industry. Designed by and for EMS companies to meet the current and future needs of the evolving industry. Come experience the difference the right tool makes when running your business.

Materials Evaluation and Engineering, Inc.Booth No: 1023Dieter Scholz 13805 1st Ave. N.Suite 400Plymouth, MN 55441PHONE: 763-449-8870FAX: 763-449-8699EMAIL: [email protected] WEB: www.mee-inc.com

MEE assists electronics manufacturers with failure analysis, materials characterization, product development, and quality assurance. Available services include precision micro-sectioning, SEM/EDS, Field Emission SEM, light microscopy, and mechanical testing. Please stop by booth #1023 to learn about our latest addition to the lab: broad beam ion milling. Advanced analytical methods combined with sound engineering provide our customers practical, cost effective solutions to materials-related problems.


MekBooth No: 1040John Rider5550 Painted Mirage Road Suite 320Las Vegas, NV 89149 PHONE: 714-402-6031EMAIL: [email protected] WEB: www.marantz-electronics.com

Marantz Electronics, your supplier of Automated Optical Inspection (AOI) technologies for advanced PCB inspection and test and measurement.

Mentor Graphics Corporation, Valor DivisionBooth No: 634Lisa Hartman8005 S. W. Boeckman Road Wilsonville, OR 97070PHONE: 720-494-1246EMAIL: [email protected] WEB: www.mentor.com/vlaor

The Valor PCB Manufacturing Software Division of Mentor Graphics is the leading global provider of software solutions for the fabrication, design, and assembly segments of the printed circuit boards (PCB) manufacturing industry. Our software solutions simulate, optimize, monitor and control the PCB production lifecycle, enabling our customers to manufacture PCBs for electronic products more efficiently, cost effectively and with better quality.

MET StencilBooth No: 329Greg Starrett140 Mount Holly Bypass Unit 10Lumberton, NJ 08048PHONE: 609-261-2670FAX: 609-261-4007EMAIL: [email protected] WEB: www.metassocs.com

MET is ready to meet your stencil requirements. We manufacture Electroformed Stencils, Laser Cut Stencils, and Chemically Etched Stencils for various solder paste and glue printing applications. We have the technology to provide stainless steel, nickel, step down, or step up solder masks. If you’re looking for tube, cast, Vector Guard, Wizard or any other type of stencil mounting system; we have it.

MetcalBooth No: 816Jerry Simmons12151 Monarch Street Garden Grove, CA 92841 PHONE: 714-799-9910EMAIL: [email protected] WEB: www.metcal.com

Since 1982, Metcal has been a recognized worldwide leader in the electronics assembly marketplace. As part of OK International, Metcal’s industry-leading position addressing advanced technology in conduction soldering and rework/repair, has and will continue to broaden to a full electronics bench tool single-source solution. Metcal product lines currently include: hand soldering and desoldering, convection rework products, fume extraction and fluid dispensing tools.

Metro SMT, Ltd.Booth No: 344David Cotton Cherry Tree House Henfield RoadSmall Dole, BN5 9XJ United Kingdom PHONE: 866-789-7841FAX: 44-87-1246-4982EMAIL: [email protected] WEB: www.metrosmt.com

From the start of the Company in 1999 Metro SMT was launched as a specialist nozzle manufacturer and we became one of the leading suppliers of specialist nozzles in the SMT industry.

As the business expanded we became more involved in the supply of consumable parts for SMT lines to the point where this became the mainstay of our business.

The company focus on the sourcing and supply of excellent used SMT machines, and using our team of agents and engineers we set about becoming the one stop facility for all SMT needs.

Now in 2015, we are able to source, supply, install and commission the most popular types of machines as well as supply a 12 month warranty on all parts.

MicroScreenBooth No: 535Holly Wallace1106 S. High Street South Bend, IN 46601 PHONE: 574-232-4358FAX: 574-234-7496EMAIL: [email protected] WEB: www.microscreen.org

MicroScreen LLC offers laser cut and electroformed stencils for solder paste deposition. All stencils are 100% inspected using ScanCheck AOI. Options include Nano Coating, Fine Grain Metal, Invar Metal, MicroWeld step stencils, and Wizard frame and Space Saver frame systems. MicroScreen also manufactures thick film screens and large format screens, and MicroScreen is ITAR Registered.

Mid-America Taping & ReelingBooth No: 540Barbara Pauls121 Exchange Blvd. Glendale Heights, IL 60139 PHONE: 630-629-6646FAX: 630-871-1502EMAIL: [email protected]: www.matr.com

Mid-America Tape and Reel specializes in Surface Mount, Axial and Radial Taping, Forming, Programming and 3-D Coplinarity Inspection. We design and manufacture thermoformed custom carrier tape pockets and trays. We provide a CAD drawing of the proposed pocket, to the finished product. As well as provide the service to fill the parts into the pockets. We also manufacture injection molded reels used in this process. We distribute cover tape, static and dry pack bags, desiccant, HIC cards and Vacuum Sealing machines. All products are made in the USA, since 1983. ISO- 9001-2008 Certified. We are a Woman Owned and Operated company Certified by the WBNC.



Mirtec CorporationBooth No: 407Robert Horowitz3 Morse RoadUnit 2A Oxford, CT 06478PHONE: 203-881-5559FAX: 203-881-3322EMAIL: [email protected] WEB: www.mirtecusa.com

MIRTEC is a Leading Global Supplier of 3D & 2D Automated Optical Inspection (AOI) and Solder Paste Inspection Systems (SPI) to the Electronics Manufacturing Industry. Our company invests heavily in Research & Development, persistently focused on using state-of-the-art optics, lighting and laser technology to advance the industry.

MYCRONIC, Inc.Booth No: 825John McMahon320 Newburyport TurnpikeRowley, MA 01969-2002PHONE: 978-948-6919FAX: 978-948-6915EMAIL: [email protected] WEB: www.mycronic.com/smt

MYCRONIC designs and builds SMT placement machines and stencil-free jet printers. MYCRONIC solutions are designed with lean manufacturing in mind saving substantial time in your production. With unique machine concepts and advanced software tools, MYCRONIC represent the intelligent factory of the future. Our mission is to always be innovating in order to satisfy the electronic industry’s need for surface mount technology and services that meet the highest demands in terms of productivity and quality.

National Technical SystemsBooth No: 1035Pamela MacDonald 24007 Ventura Blvd.Suite 200Calabasas, CA 91302PHONE: 661-259-8184EMAIL: [email protected] WEB: www.nts.com

NTS provides test, inspection and certification services to help clients build better, stronger, safer, more reliable products. Our engineers and technicians serve a wide range of industries such as aerospace, defense, telecom and energy. With a nationwide network of laboratories, we bring a unified solution to a global market.

Nihon Superior Company, Ltd.Booth No: 419Keith Howell1395 Hawk Island Drive Osage Beach, MO 65065 PHONE: 573-280-2357EMAIL: [email protected] WEB: www.nihonsuperior.co.jp

With the success of its SN100C lead-free solder alloy, now in its 15th year, Nihon Superior Co. Ltd. has become a global player. The company continues its leadership in the development of lead-free solders with the introduction of SN100CV P506 solder paste. The newly developed SN100CV alloy although silver-free matches the strength of SAC305 while maintaining high impact resistance. Alconano Nano-Silver die attach paste for high operating temperature power modules will also be displayed.

Nikon MetrologyBooth No: 340Meghan Meinert12701 Grand River Road Brighten, MI 48116PHONE: 810-220-4360EMAIL: [email protected] WEB: www.nikonmetrology.com

Nikon Metrology offers the broadest range of metrology solutions for applications ranging from miniature electronics to the largest aircraft. Nikon Metrology’s innovative measuring and precision instruments contribute to a high performance design-through- manufacturing process that allows manufacturers to deliver premium quality products in a shorter time.

These products include:• Coordinate Measuring Machines• Laser Scanners• Portable Measuring• Video & Microscope Measuring• Semiconductor Systems• X-Ray and CT Inspection Systems• Microscope Systems• Large Volume Applications with

Laser Radar• Motion Measurement and Robotics• Inspection and Imaging Software

Further information is available on www.nikonmetrology.com.

Nitto Kohki U.S.A., Inc.Booth No: 917Ryoji Takahashi46 Chancellor DriveRoselle, IL 60172EMAIL: [email protected] PHONE: 630-924-9393WEB: www.nittokohki.com

Nitto Kohki U.S.A., Inc. was founded in 1969 to provide sales and services of machine tools and electric screwdrivers and quick-connecting fluid couplings that are designed and manufactured by Nitto Kohki Co., Ltd. located in Tokyo, Japan. Through our products, Nitto Kohki has consistently offered customers advantages in terms of labor savings, improved working environments and efficient manufacturing.

Nordson ASYMTEKBooth No: 706Jerry Frost2747 Loker Avenue West Carlsbad, CA 92010PHONE: 760-431-1919EMAIL: [email protected] WEB: www.nordsonasymtek.com

Automated fluid dispensing, jetting and conformal coating systems from Nordson ASYMTEK are ideal for precision assembly processes for PCBs, LEDs, flat panel displays, automotive products, medical/biotech products, semiconductor packaging, MEMS, and other electro-mechanical devices. Popular dispensing and conformal coating products include the Spectrum™ and Quantum™ dispensers, NexJet® valve, and Select Coat® conformal coating platforms, all supported by an award-winning global support network. The company is ISO 9001:2008 certified.

Nordson DAGE

TTBooth No: 606Hal Hendrickson 2370 Oak Ridge Way Vista, CA 92081PHONE: 949-361-2714EMAIL: [email protected] WEB: www.nordson.com

Nordson DAGE manufactures Industry leading Test and Inspection equipment for the PCBA and Semiconductor industries. The Nordson DAGE XD7600NT Diamond FP X-ray inspection system with Quick View CT, utilizes the latest technology, flat panel detector and proven feature recognition capability to provide the ultimate choice for the highest quality in X-ray imaging on the market today. Nordson EFD, the world’s leading designer and manufacturer of precision dispensing systems will also exhibit in the booth.


Nordson YESTECH

Booth No: 606Hal Hendrickson 2370 Oak Ridge Way Vista, CA 92081PHONE: 949-361-2714EMAIL: [email protected] WEB: www.nordson.com

Nordson YESTECH is a worldwide leader in the design, development and manufacture of automated optical (AOI) inspection solutions for the PCBA and semiconductor packaging industries.

The new FX-940 with advanced megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewing camera, four side viewing cameras and 3D inspection, the FX-940 inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

North Dakota Department of CommerceBooth No: 1028Laura Willard1600 E. Century Ave. Suite 2Bismarck, ND 58503PHONE: 701-328-5337EMAIL: [email protected] WEB: www.NDBusiness.com

The North Dakota Department of Commerce leads the state’s efforts to attract new business to the state. We can assist businesses with financing, incentive packaging and site selection. North Dakota’s favorable position as one of the lowest cost states for operating a business are driving top companies to establish operations here. An opportunity within a HUB zone featuring a regional workforce trained in electronics manufacturing could be the answer your company is looking for. Visit our booth to learn more.

Northern Electronics AutomationBooth No: 708Shannon Allard 19 Park Ave.Hudson, NH 03051PHONE: 603-881-5253FAX: 603-881-5304EMAIL: [email protected] WEB: www.nea-llc.com

NEA LLC is a global leader in PCB assembly and test equipment. We deliver certified re-manufactured equipment with the most comprehensive warranties in the industry. We also offer service contracts, training for your operators or technicians and a well-stocked parts department for your immediate equipment requirements.

O.C. White CompanyBooth No: 1001Richard May4226 Church StreetThorndike, MA 01079-0644PHONE: 413-289-1751EMAIL: [email protected] WEB: www.ocwhite.com

The World Leader in inspection products for the electronic bench.

Easy to use head’s up HD video systems with measurement and archiving of images, allowing easy soldering and re-work along with state of the art LED magnifiers, Microscope systems and all bench top lighting specialized lighting needs. Exclusive UV inspection systems for conformal coated boards. Bonkote ESD Flux dispening pens with New tips displayed also.

These world renown inspection products lead the industry in LED design with ergogenic functionality and ESD safety at the top of the product designs.

Omron Inspection SystemsBooth No: 436Krissy Sorensen2895 Greenspoint Pkwy. Hoffman Estates, IL 60169 PHONE: 847-285-7257FAX: 847-285-8257EMAIL: [email protected] WEB: www.omron247.com

Omron’s PCB inspection systems lead the AOI market with the fastest production speeds, 3D imaging, and patented technology, providing increased productivity and high quality inspection capability. As a company with more than 40 years experience in both factory automation and the printed circuit board production environment, Omron is able to use this knowledge to deliver the right AOI solution for today’s ever demanding market.

Oxford InstrumentsBooth No: 537Jason Pham 300 Baker Ave.Suite 150Concord, MA 01742PHONE: 978-369-9933FAX: 978-369-8287EMAIL: [email protected] WEB: www.oxinst.com

Oxford Instruments is a leading provider of high- technology X-Ray Fluorescence (XRF) instruments used around the world for quality control. These instruments provide critical and non-destructive analysis of metals and coating thickness gauging during all phases of the manufacturing process. Come see Oxford Instruments at booth 537 to speak to one of our specialist about your application needs or email [email protected] to set up an on-site demo.

PACE, IncorporatedBooth No: 945John Romanowicz 255 Air Tool DriveSouthern Pines, NC 28387 PHONE: 910-695-7223EMAIL: [email protected] WEB: www.paceworldwide.com

PACE is recognized as the world leader in the development of solutions for the assembly and repair of highly advanced electronics. Providing innovative solutions, products and training for the rework, repair and inspection of printed circuit boards, PACE offers solder, desolder, rework, fume extraction and BGA rework systems, all made in the U.S.A!



Panasonic Factory TT Solutions of AmericaBooth No: 213Jeff Malek1701 Golf RoadSuite 3-1200 Rolling Meadows, IL 60008 PHONE: 847-637-9689FAX: 847-637-9601EMAIL: [email protected] WEB: www.panasonicfa.com

As a manufacturer, Panasonic understands the evolving demands of today’s electronics assembly manufacturing environment, and that uniquely enables us to provide scalable, integrated, and efficient solutions that help our customers remain viable in a competitive market. No matter if you’re high mix/low volume, low mix/high volume, or anything in between, Panasonic equipment, MES software, and other services can help improve throughput and efficiency while keeping quality reliably high.

Photo Etch TechnologyBooth No: 802Kris Guidi71 Willie StreetLowell, MA 01854PHONE: 978-805-5000EMAIL: [email protected] WEB: www.stencil.com

Photo Etch Technology brings over 35 years of experience and industry excellence to the SMT industry.

Laser cut smt stencils, electroform smt stencils, precision metal etched parts, thick film screens, shadow mask’s

Please visit www.stencil.com for more information.

Pillarhouse USA, Inc.Booth No: 139Adrian De’Ath 635 Touhy Ave.Elk Grove, IL 60007 PHONE: 847-593-9080FAX: 847-593-9084EMAIL: [email protected] WEB: www.pillarhouseusa.com

Pillarhouse are world leaders in selective solder solutions from hand load process to automated high speed lines. Pillarhouse manufacture modular and stand alone equipment to meet the needs of an ever changing market. The new low cost GEM can be configured for wave, rework or selective or the new dual pot inline MPR with board handling capability of 24 x 48. Our customer driven product line includes- Jade-Topaz E Orissa and the High speed Amethyst.

PPG Industries, Semco Packaging & Application SystemsBooth No: 641Jim Enochs12780 San Fernado Road Sylmar, CA 91342PHONE: 818-362-6711EMAIL: [email protected] WEB: www.ppgaerospace.com

PPG Industries, Semco® Packaging & Application Systems manufactures a wide range of plastic packaging systems for single and multi-component assembly materials. Major users include formulators of adhesives, sealants, coatings and soldering materials for a variety of industry sectors including aerospace and electronics.

Precision Placement MachinesBooth No: 736Sharon Breault 326 Main StreetUnit 11Fremont, NH 03044PHONE: 603-895-5112FAX: 603-895-5113EMAIL: [email protected] WEB: www.goppm.com

PPM is a full-service supplier of used and reconditioned automated PCB assembly equipment for the electronics industry. We focus on Quad Pick & Place, Camalot Paste Dispensers & MPM Screen Printers. We offer refurbished machines, parts & service.

Prototron Circuits, Inc.Booth No: 418Russ Adams PO Box 875Redmond, WA 98073PHONE: 425-823-7000FAX: 425-869-2515EMAIL: [email protected] WEB: www.prototron.com

“If it has to be right, and on time call Prototron.”

Prototron has been in business over 20 years as a full service quick turn Printed Circuit Board manufacturer, currently with 2 facilities. One located in Redmond, WA (ISO Certified), and another located in Tucson, AZ (Mil 55110G Certified). Standard lead time on commercial spec boards is 5 days, with expedite service up to 24 Hrs. Services include but are not limited to: IPC 6012Class III builds, Specialty materials including Rogers, Arlon, Polymide, and Metal backed, Controlled impedance modeling, File analysis using Valor Genesis 2000, Blind and buried vias, Silver filled vias, Thin core processing, and RoHS compliant builds. Surface finishes include, ENIG, immersion Silver, White Tin, Full body electrolytic gold, Soft bondable gold, and HASL. Please visit us at Prototron.com for more information.

PurexBooth No: 245Scott Snell2108 Swan LaneRolling Meadows, IL 60008 PHONE: 866-360-5675FAX: 630-876-9898EMAIL: [email protected] WEB: www.purexus.com

Years of cutting edge product development allow Purex to offer a complete line of fume extraction solutions unlike any in the industry. A world expert in its field, Purex is renowned for the quality and reliability of its technology and unrivaled customer support. Purex supplies machines to many industries and manufacturing companies worldwide with applications including: Laser Coding and Marking, Continuous Ink Jet Coding and Marking, Laser Engraving, Wide Format Printing, Dye Sublimation, Reflow and Wave Soldering, Manual Soldering, Laser and Robotic Soldering, Underfill and Conformal Coating, Cleanrooms and Laboratories, Education and Engineering.


Qualitek International, Inc.Booth No: 538Debbie Liguori315 Fairbanks StreetAddison, IL 60101PHONE: 630-628-8083FAX: 630-628-6543EMAIL: [email protected] WEB: www.qualitek.com

Global soldering materials manufacturer founded in 1980 headquartered in Addison, IL. U.S.A.. Products include: RoHS lead free solders and leaded. Halogen Free Materials, Solder Paste, Wire, Flux, Bar, BGA Spheres, Dross Eliminators, Rework Materials, Wave Solder Oil. Sn100E Lead Free Replacement for SAC 305, 1% Low Silver Lead Free SAC 105 Solder, Low Temp. Lead-Free Sn42/Bi58 Solder. Metals Recycling Program includes: Silver & Thermally Conductive Epoxy Scrap, Solder Check-Up Program, Technical Support. ISO 9001:2008 Certified.

Quik-ToolBooth No: 918Jim Bernhard10 Tanglewood RoadPlainville, MA 02762PHONE: 508-699-9077EMAIL: [email protected] WEB: www.quik-tool.com

Quik-Tool sets the “Gold Standard” in automatic compliant SMT Tooling for Printers, Pick and Place, and other SMT assembly equipment. The founders of Quik- Tool invented the entire concept over 13 years ago and now have made Quik-Tool the most cost effective and highest performing tooling in the industry, combining the highest reliability with lowest maintenance with industry leading ease of use. Ask about our Opti-Flow technology and our QT Plus vacuum assist system.

Rehm Thermal Systems, LLCBooth No: 437Paul Handler3080 Northfield PlaceSuite 109Roswell, GA 30076PHONE: 770-442-8913FAX: 770-442-8914EMAIL: [email protected] WEB: www.rehm-group.com

Rehm Thermal Systems produces energy-efficient manufacturing equipment for the electronics and photovoltaics industry. As a manufacturer of reflow soldering systems (convection or condensation) and drying and coating systems, we are today a technological and innovation leader in the economically advantageous area of module production. In the field of solar power Rehm offers high-quality equipment for the metallisation of solar cells. For our clients we tailor-make applications related to soldering, coating and hardening for electronics modules for 25 years.

RPS Automation, LLCBooth No: 807Reid Henry3808 N. Sullivan Road Bldg. 14JSpokane Valley, WA 99216 PHONE: 509-891-1680FAX: 509-891-1681EMAIL: [email protected] WEB: www.rpsautomation.com

RPS Automation designs and manufactures a complete line of high precision selective soldering, lead tinning and component test and steam aging equipment for electronics and circuit board manufacturing and assembly. RPS has over 20 years of automated soldering experience and more than 480 installations. All systems are built in the USA and feature precision robotics, easy to use software, extensive warranty coverage, and exceptional customer service.

RS Simmons Co., LLCBooth No: 936Bob Simmons818 Harmony Hill Road West Chester, PA 19380 PHONE: 610-547-7690FAX: 610-458-0309EMAIL: [email protected] WEB: www.rssimmons.com

SimCAD v1.0 - New Affordable CAD Conversion software. Converts gerber files and component lists (parts lists, bill of materials, XY locations) to files that will run on placement and similar machines.

We are a Microsoft Windows based software development company. Visit us for any custom software solution. Specializing in CAD conversion and machine control applications.

Saki America, Inc.Booth No: 1025Satoshi Ohtake48016 Fremont Blvd.Fremont, CA 94538PHONE: 510-623-7254EMAIL: [email protected] WEB: www.sakicorp.com/en/

Saki is a leading global supplier of superior automated optical and X-ray inspection and measurement systems for the printed circuit board assembly industry, with over 20 years of providing market-leading solutions for 2D AOI, and 3D SPI, AOI, and AXI inspection needs.

Samsung C&T Automation, Inc.Booth No: 739Jessica Kim17835 Sky Park Circle Suite EIrvine, CA 92614PHONE: 949-222-2201FAX: 800-848-6467EMAIL: [email protected] WEB: www.samsungsmt.com

Samsung has developed advanced technology for electronic & mechanical design, process, and production with high speed and accuracy, leveraging the technical expertise of semiconductor equipment and industrial automation system. Based on these technologies, we provide high speed and high precision SMT machines to our valuable customers for them to reach their company production goal.



Schoeller-Electronics GmbHBooth No: 935Jules Limpens Marburger Strasse 65 Wetter D-35083GermanyPHONE: +49 171 315 7727EMAIL: [email protected]

Robert McGarryPHONE: +1 (234) 380-2523EMAIL: [email protected] WEB: www.schoeller-electronics.com

Schoeller-Electronics GmbHA Leader in Precision Engineered Printed Circuit Board Solutions.

Technology: Flex and Rigid-Flex, HDI/Sequential Build- up, RF & Microwave, Thermal Management, Mixed Dielectrics

Target Markets: Medical, Industrial, Civil Avionics, Automotive, Telecommunication

• QA ISO 9001• Automotive ISO TS16949• Avionics EN 9100• IPC-6011 class 3 and 3A• Environment ISO 14001• Workplace Safety OHSAS18001• Energy Management DIN 16247-1• AEO certified• UL File E51209

ScienscopeBooth No: 544Dan Kelsey5751 Schaefer Ave.Chino, CA 91710PHONE: 909-590-7273FAX: 909-590-7020EMAIL: [email protected] WEB: www.scienscope.com

Scienscope International is a manufacturer of Micro-focus cabinet style X-Ray machines for NDT. The X-Scope X-Ray product line is designed for PCB inspection. Scienscope also manufactures Video inspection systems, video measurement systems, microscopes and magnifiers.

SEHO North America, Inc.Booth No: 635Gus Mavrou1420 Jamike DriveErlanger, KY 41018PHONE: 859-371 7346FAX: 859-282 6718EMAIL: [email protected] WEB: www.sehona.com

SEHO is a world class manufacturer of selective, wave and reflow soldering machines that are ideally supplemented with creative handling solutions for automated production lines and automated optical inspection systems. At SEHO we combine innovative engineering and process know how to deliver equipment manufactured to the highest quality standards, ensuring a reliable and repeatable process.

Seica, Inc.Booth No: 406Crystal Meneses50A Northwestern Drive Suite 10Salem, NH 03079PHONE: 603-890-6002FAX: 603-890-6003EMAIL: [email protected] WEB: www.seica-na.com

Seica is a world leader in test & measurement equipment design and services. With offices worldwide, Seica can support you no matter where your NPI centers or production facilities are located. From bare board/substrate testing to traditional in-circuit and functional testing, Seica is the only ATE company that provides solutions to both the substrate and loaded board markets.

Seika Machinery, Inc. TTBooth No: 707Michelle Ogihara 3528 Torrance Blvd.Suite 100Torrance, CA 90503PHONE: 310-540-7310FAX: 310-540-7930EMAIL: [email protected] WEB: www.seikausa.com

Seika is exhibiting the latest advanced BGA/SMT rework station, Den-On RD-500V, capable of reworking 01005 components and large platform PCBs and Hioki Flying Probe ICT with New Easy Gerber-Based Software Programming and Solder Joint Integrity Inspection System. Also showing Malcom RCX Reflow Monitoring Systems including O2 and wind velocity sensors, and profiler with Video Capture. Representing with full sales and technical support on top SMT and ATE solutions from Japan such as the Sawa Nozzle Cleaner; Sawa Low-VOC Fully Automatic Stencil Cleaner; McDry Ultra- Low Humidity Storage Cases - PCB and MSD Storage and Baking Cabinets; Sayaka PCB Routers introducing the New Twin-Table Model, Andes Multi-Point Soldering System and debuting the Eightech Tectron Vacuum Reflow Oven to the U.S. market

Senju Comtek CorporationBooth No: 412Rafael Padilla1999 S. Bascom Ave Suite 340Campbell, CA 95008PHONE: 408-963-5300FAX: 408-963-5399EMAIL: [email protected] WEB: www.senju.com

Senju Metal Industry Co., Ltd. (SMIC) is a global leader in solder materials and related equipment. Solder alloys, available in paste, wire, bar, ball, and preform, are uniquely customized to accommodate various application needs such as low-silver, low-temp, and high reliability. Wave and selective systems incorporate innovative pump technology for the highest and most stable wave pressure. With technical expertise and a world-class support, we deliver a cutting-edge soldering solution.


Shenzhen D.M. Electronic, LimitedBooth No: 900Ryan Wang3F, No. 28, The 2nd Industrial ZoneHeyi village, Shajing town, Bao’ an District Shenzhen, 518104ChinaPHONE: 86-755-27269685-801 MP: 86-13823305510FAX: 86-755-27220690EMAIL: [email protected] OR [email protected] WEB: www.5PCB.com

D.M. Electric International Limited is a professional company dedicating to manufacturing various printed circuit boards. We can offer all kinds of electric products services from PCB design, quick PCB prototypes, small batches PCB productions and PCB assembly.

Simplimatic AutomationBooth No: 1018Kevin Welsch1046 West London Park Drive Forest, VA 24551PHONE: 434-386-7759EMAIL: [email protected] WEB: www.simplimatic.com

Simplimatic Automation designs, manufactures, and integrates material handling and automation systems for the electronics and semiconductor industries. Simplimatic SMT material handling systems have been globally adopted for their superior design and reliability. Simplimatic manufactures a complete line of edge belt conveyor systems including; manual assembly stations, line loaders and unloaders, aisleway systems, buffers, merge and turn units, elevators, board inverters, laser markers, PCB traceability systems, and much more. Simplimatic’s complete line of SMT conveyor is made in the USA and comes standard with 24/7 US based support. Visit Simplimatic.com to learn more about why Simplimatic is the world leader in SMT material handling.

SMT TodayBooth No: 446Lin Ramsay 1 Dow RoadPrestwick International Aerospace Park Prestwick, South Ayrshire KA9 2TU ScotlandPHONE: 44-1292-834-009EMAIL: [email protected] WEB: www.smttoday.com

SMT Today is a high quality publication created for the global electronics industry. This bi-monthly magazine includes technical features, interviews and the latest product announcements with contributions from many of the electronic industry’s leaders and technology experts.

In addition, the team at SMT Today have also created a marketing agency which works exclusively within the electronics industry. This team of experienced and professional individuals work closely with their customers to deliver responsive websites, successful marketing campaigns and effective video productions.

SMTARegistration LobbyKrissy Ohnstad5200 Willson RoadSuite 215Edina, MN 55424PHONE: 952-920-7682FAX: 952-926-1819EMAIL: [email protected] WEB: www.smta.org

A not-for-profit international association of companies and individuals, involved in all aspects of the electronics assembly industry. We are dedicated to the advancement of the electronics industry through member education, training, networking and access to knowledge. Chapters are located in the U.S., Canada, Taiwan, Penang, India, Hong Kong, Mexico, South Brazil and Israel. Educational programs, symposiums, and seminars sponsored by SMTA Headquarters are held throughout the year across the US, Canada, China and Malaysia.

SMTnetBooth No: 132Roland Girouard 98 Elm StreetPortland, ME 04101PHONE: 207-780-0887EMAIL: [email protected] WEB: www.smtnet.com

SMTnet.com is an interactive website for electronics manufacturing professionals with over 500,000 unique visitors in the last year.

SMTnet’s new Power Membership program promotes your company in front of these visitors for only $97/month!

SOMACISBooth No: 911Michele Stampanoni Via Jesina 17Castelfidardo, 60022 ItalyPHONE: 41-79-4011715EMAIL: [email protected] WEB: www.somacis.com

For more than forty years, SOMACIS has been a dynamic company producing high-tech PCBs and delivering innovative solutions.

SOMACIS, headquartered in Italy, is one of the leading PCB manufacturers, with more than 800 employees and production plants in Italy, USA (Hallmark Circuits, Inc.) and China.

SOMACIS is a worldwide partner supplying HDI, rigid, rigid-flex and flex PCBs for time critical and mass production requirements.

Sonoscan, Inc.Booth No: 424Janet Lykowski 2149 E. Pratt Blvd.Elk Grove Village, IL 60007 PHONE: 847-437-6400EMAIL: [email protected] WEB: www.sonoscan.com

Sonoscan® is a leader and innovator in Acoustic Micro Imaging (AMI) technology. Sonoscan manufactures acoustic microscope systems and provides laboratory services to nondestructively inspect and analyze products. Our C-SAM® microscopes provide unmatched accuracy for the inspection of products for hidden internal defects in SMT devices, such as ICs, ceramic capacitors and resistors, hybrids, MEMs, plus PCBs too. Industry standards provide guidelines for determining the reliability of your SMT devices and boards with acoustic microscopes.



Sovella, Inc./The Daylight CompanyBooth No: 907Carissa Harris 156 Bluffs CourtCanton, GA 30114PHONE: 800-437-6772FAX: 770-720-6584EMAIL: [email protected] WEB: www.sovella.us

Sovella® is a leading manufacturer of industrial workstations, furniture and storage solutions, including work benches, shelving and cabinets, drawer units, and manual assembly lines for various industries. We consider the human factor within your workspace and have paid special attention to human physiology and individual operator requirements.

Specialty Coating Systems (Equipment)Booth No: 434Brad Banfill7645 Woodland DriveIndianapolis, IN 46278PHONE: 317-244-1200EMAIL: [email protected] WEB: www.scscoatings.com

With over 40 years of coating and applications experience, SCS is an industry leader in conformal coating services and systems. At SMTAI 2015, SCS is pleased to exhibit its fully-automated Precisioncoat selective spray coating and dispense system, featuring motorized tilt and rotate functionality, fiducial recognition, needle calibration and offline programming, Additionally, SCS offers industry-leading ionic contamination test systems and laboratory coating systems, and is the leader in Parylene coating technologies.

Specialty Coating Systems (Parylene Service)Booth No: 941Heidi Kolby7645 Woodland DriveIndianapolis, IN 46278PHONE: 317-244-1200EMAIL: [email protected]: www.scscoatings.com

Specialty Coating Systems Inc. (SCS) is a leader in Parylene conformal coating services and technologies, with 11 locations throughout the Americas, Europe, and Asia. Ultra-thin and pinhole-free, SCS Parylene coatings are biocompatible and biostable, and offer excellent moisture, chemical, and dielectric barrier properties to protect components in the electronics, automotive, military and medical device industries.

Speedline TechnologiesBooth No: 124Greg Calvo1629 Old South Hwy 5Camdenton, MO 65020PHONE: 573-346-3341FAX: 573-346-5554EMAIL: [email protected] WEB: www.speedlinetech.com

Speedline Technologies, a division of Illinois Tool Works, Inc. (NYSE: ITW), is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries. Based in Franklin, Massachusetts and Camdenton Missouri, the company markets four best-in-class brands: MPM stencil and screen printing systems; CAMALOT dispensing systems; ELECTROVERT wave soldering, reflow soldering and curing, and cleaning equipment; and ACCEL microelectronics cleaning equipment.

Speedprint TechnologyBooth No: 821Mark Brawley5804 Breckenbridge Park Drive Suite ETampa, FL 33610PHONE: 813-664-0686FAX: 847-843-2750EMAIL: [email protected] WEB: www.speedprint-tech.com

The SP710 will be displayed configured with Advanced Dispense Unit (ADu+). The SP710 is the most reliable screen printer on the market backed by a 5 year parts and 2 year labor warranty. Equipped with a long list of standard features the ADu+ dispense option provides provides tremendous flexibility with the most accurate on board dispensing of adhesive, solder paste as well as other materials. Industry leading accuracy and common sense design means extremely low maintenance requirements and lowest cost of ownership.

Stanley Supply & ServicesBooth No: 1024Julie Giordano 335 Willow Street N.Andover, MA 01845 PHONE: 800-225-5370FAX: 978-688-7532EMAIL: [email protected] WEB: www.stanleysupplyservices.com

Stanley Supply & Services is a leading supplier of products and services for assembling, repairing and testing electronic equipment. We are your one-stop- shop for test & measurement, soldering, lighting and magnification, and materials such as adhesives, solder, static protection, chemical solutions and materials for labs and clean rooms.

Our JENSEN® Tool Kits provide solutions for professional field service technicians in virtually any field including: military and commercial aviation, bio-medical device service, networking, and telecom. Each JENSEN® tool kit is carefully assembled at our kitting warehouse in Phoenix, Arizona and most JENSEN® tools are backed by a lifetime guarantee.

We offer a full line of e-business tools, vendor managed inventory solutions, calibration services and equipment audits designed to enhance your productivity lower your procurement costs and improve your profitability. We offer best-in-class customer service, technical support and informed sales representatives all focused on you.

StenTech, Ltd.Booth No: 129Sip Akbar138 Anderson DriveUnit 6Markham, ON l6E 1A4 CanadaPHONE: 603-401-1082FAX: 905-472-7774EMAIL: [email protected] WEB: www.stentech.com

StenTech provides a variety of quality driven products to support our customers in their Surface Mount Technology (SMT) requirements.

Quality. Delivery. Service.


STI Electronics, Inc.Booth No: 609Diana Bradford 261 Palmer RoadMadison, AL 35758-1727PHONE: 256-705-5504FAX: 256-461-9566EMAIL: [email protected] WEB: www.solderingtech.com

STI Electronics offers a full service Microelectronics Lab as well as a state-of-the-art Analytical Lab. STI provides full materials, construction and failure analysis services as well as manufacture prototypes and specialty high- density assemblies for military, aerospace and industrial applications. In addition, STI is an Approved IPC Training Center with locations in Madison, AL, Houston, TX and Crane, IN but is also equipped to bring the training to any customer’s facility. STI also offers a full range of components and solder training kits including lead free.

Stone Mountain Tool, Inc.Booth No: 607Steven Hughes480 Gees Mill Business Court Conyers, GA 30013PHONE: 770-929-0166EMAIL: [email protected] WEB: www.stonemountaintool.com

Creating Custom Tools That Exceed ALL Expectations Every Time.

Wave solder Pallets, Conformal coating fixtures, Reflow fixtures, and Selective solder fixtures are just a few of the electronic manufacturing products that we specialize in. Stone Mountain Tool stands out as one of the leaders in the industry. With over 30 years in supplying tooling for the electronic manufacturing industry, Stone Mountain Tool has the background and experience needed to provide a solution to most tooling problems.

Super DryBooth No: 1034Richard Heimsch 235 Colovista Pkwy.Bastrop, TX 78602PHONE: 312-513-3513EMAIL: [email protected] WEB: www.superdry-totech.com

Super Dry® is a Moisture Sensitive Device (MSD) handling specialist, supplying innovative dry storage and floor life reset solutions including desiccant dry cabinets, ovens,vacuum machines, automated handling systems and component tracking software.

Control of component and PCB conditions is more important than ever as lead free processing causes dangerous increases in vapor pressure – with disastrous results.All Super Dry® products exceed IPC/JEDEC J-Std-033C for moisture sensitivity, as well as EN 61340-5-1:2001 for ESD.

TAGARNO

Booth No: 224Sam Armstrong 111 RunnymeadeGreenwood, SC 29649PHONE: 864-229-9769FAX: 864-229-3710EMAIL: [email protected] WEB: www.tagarno.com

TAGARNO’s digital microscopes are used for visual inspection of printed circuit boards, using high-definition cameras and high-definition monitors combined with user-friendly interfaces, to create excellent image quality and an amazing ease of use. Experience magnification with outstanding live image quality without distortion and with a large field of view, digital auto-focus and auto- exposure functions. Viewing images on a monitor also gives you a great range of ergonomic advantages over traditional microscopes.

Technical Devices CompanyBooth No: 807Julie Fields560 Alaska Ave.Torrance, CA 90503PHONE: 310-618-8437EMAIL: [email protected] WEB: www.TechnicalDev.com

Technical Devices is a US manufacturer of inline aqueous cleaning systems and soldering equipment. Technical Devices now offers the CV line of wave soldering and reflow soldering equipment. The CV line is engineered and designed by Technical Devices to offer our customers the most highly advanced equipment at very competitive price. Our extensive knowledge of production equipment and our customer service network make Technical Devices the smart choice for your production needs. www.TechnicalDev.com

Techni-Tool, Inc.Booth No: 1010Scott Burroughs1547 N. Trooper Road Worcester, PA 19490PHONE: 440-725-7845FAX: 440-543-2266EMAIL: [email protected] WEB: www.techni-tool.com

For more than 50 years Techni-Tool has served the electronics production industry with the finest tools, test equipment, production supplies and more, from top manufacturers around the globe. Headquartered in Worcester, PA, Techni-Tool serves customers in more than 100 countries with a unique combination of world- class customer service, unmatched product selection and added value that has made it the leading full-line distributor in the field.

Technimark, Inc.Booth No: 239Rich Syphers720 Industrial DriveUnit 111Cary, IL 60013PHONE: 847-639-4700FAX: 847-639-4789EMAIL: [email protected] WEB: www.e-technimark-inc.com

Technimark is a full line distributor serving electronic, electrical, industrial, automotive and medical markets. Featuring the ECD SmartDRY Intelligent Dry Storage Cabinet and M.O.L.E. Temperature profiling technology. Technimark Vending and VMI solutionsDEK Magna Print high performance squeegee system. Alent-Alpha Metals Solder products.



Teka Interconnection SystemsBooth No: 325Doug Scott100 Pioneer Ave.Warwick, RI 02888PHONE: 401-785-4110FAX: 401-781-5730EMAIL: [email protected] WEB: www.tekais.com

Self-Soldering Connectors- Reflow Solder with Standard SMT Equipment and Processes without Adding Any Solder, Solder Paste or Flux.

Teradyne, Inc.Booth No: 234Jaclyn Wallace700 Riverpark Drive M/S NR7001-1North Reading, MA 01864 PHONE: 978-370-1322EMAIL: [email protected] WEB: www.teradyne.com

Teradyne is a leading supplier of Automatic Test Equipment used to test printed circuit board assemblies found in automotive, consumer, industrial and communications applications. Our TestStation Multi-Site ICT and Inline automation solutions help manufacturers ensure high coverage rates of defect detection without impacting productivity and throughput. Manufacturers can achieve a more lean and agile production test cell with our TestStation platform of in-circuit test systems.

Test Research, Inc. TTBooth No: 712Steve Marks1923 Hartog Drive San Jose, CA 95131 PHONE: 408-567-9898EMAIL: [email protected] WEB: www.tri.com.tw

Established in 1989, TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements.

Texmac Inc (Takaya)Booth No: 320John Oaf3370 Montgomery Drive Santa Clara, CA 95054 PHONE: 408-970-9171EMAIL: [email protected] WEB: www.texmac.com

Takaya is the inventor and world leader in flying probe loaded printed circuit board test systems. Their systems offer unmatched reliability, accuracy, and ease of use for detection of manufacturing defects on loaded printed circuit boards utilizing fixtureless in-circuit test techniques as well as integrated optical inspection, power-on functional, and boundary scan capabilities. Takaya recently introduced its new high-performance Takaya APT-1400F Advanced Flying Probe test system complementing their market-leading Takaya APT-9411 Flying Probe series of test systems. The APT-1400F builds on Takaya’s 25-year history as leader in flying- probe test technology by providing unprecedented performance in speed, accuracy, and test coverage.

TexwipeBooth No: 439Terry Cranfill 1210 S. Park DriveKernersville, NC 27284PHONE: 336-993-7012EMAIL: [email protected] WEB: www.texwipe.com

Texwipe is committed to supplying the highest quality, most consistent cleanroom consumable products. We invest in technology, innovation and quality to create and maintain state-of-the-art systems. The results are new, improved cost-effective products. From Vectra® processed, sealed-border wipers to CleanPak® pre-wetted wipers to CleanTips® swabs, Texwipe achieves superior product quality and consistency by utilizing technological innovations, including quality analysis and intricate test methodologies.

The Test Connection, Inc.Booth No: 410Bert Horner11400 Cronridge Drive Suite HOwings Mills, MD 21117 PHONE: 410-526-2800FAX: 410-526-3547EMAIL: [email protected] WEB: www.ttci.com

The Test Connection, Inc. (TTCI) has been supporting the electronics test arena for over 35 years by offering printed circuit test solutions. Our services range from: In-Circuit Test (ICT) development and board testing services for Agilent 3070 and Teradyne (Formerly GenRad) TestStation/228X test systems, Flying Probe development and board testing services on our Digitaltest MTS500 flying probe test system, Boundary-Scan Test Solutions with the XJTAG system and TTCI is the U.S. sales partner for Feasa LED Analyser and SMH Technologies FlashRunner. TTCI is International Traffic in Arms Regulations (ITAR) registered. Meeting ITAR Certification certifies that TTCI has met requirements pertaining to organization structure, documentation, corporate policy, training and procedures to permit it to handle, use and transfer information controlled by ITAR and the U.S. Munitions list.

Tintronics IndustriesBooth No: 341Thomas Ott PO Box 18335Huntsville, AL 35804PHONE: 256-650-0220FAX: 256-650-0230EMAIL: [email protected] WEB: www.tintronics.com

Component level value add services: Robotic Solder Dip, tin mitigation, gold removal, BGA repair/reball, marking, surface mount/axial/ adial - tape and reel, lead forming, XRF, Cleanliness, Solderability Testing Processes - AS9100 REV C/ISO9001:2008 - ITARregistered.

Small, disabled Veteran owned.

TOPLINEBooth No: 435Jared Wilson95 Highway 22 W.Milledgeville, GA 31061PHONE: 1- 800-776-9888EMAIL: [email protected] WEB: www.topline.tv

CCGA Column Grid Array for military, aerospace and defense. Reduces stress from CTE mismatch of large ceramic modules mounted on PC boards.


TTnS, Inc.Booth No: 638Chris Kim702 A-Building IT Twin Tower442-17, Sangaewon, Jungwon-guSeongnam-city, 462-120 Republic of KoreaPHONE: 82-70-7090-9892FAX: 82-31-736-3117EMAIL: [email protected] WEB: www.ttns-group.com

When it’s time to resolve your conformal and micro coating challenges, and when you need a “true” and “trusted” partner who is willing to share original ideas and experiences in coating technologies and solutions, you will need to invest in more than just equipment. At TTnS, an investment with us is a true investment in a valuable business partnership.

Universal Instruments CorporationBooth No: 306Kristi Schilloff33 Brome Corporate Pkwy. Conklin, NY 13748PHONE: 607-779-5806FAX: 607-772-1878EMAIL: [email protected] WEB: www.uic.com

Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. With a lineage of more than 50 years, Universal is the longest-standing company in the electronics assembly space.

Universal Instruments delivers comprehensive solutions to a global customer base by leveraging exclusive process expertise combined with its innovative portfolio of flexible platforms for surface mount, insertion mount, advanced semiconductor packaging, and end-of-line automation.

US TechBooth No: 901Steve Leberstien 10 Gay StreetPhoenixville, PA 19460PHONE: 610-783-6100FAX: 610-783-0317EMAIL: [email protected] WEB: www.us-tech.com

U.S. Tech, an international hi-tech electronics publication, reaches over 350,000 engineers, buyers, product specifiers & manufacturing & corporate managers each month, on the web and in print & digital editions combined. The newspaper focuses on new innovations in components, distribution & PCB design, manufacturing, assembly & test, renewable energy, as well as the business and regulatory issues facing the electronics manufacturing and distribution sector.

Vi TECHNOLOGY TTBooth No: 807Max Fabiano903 N. Bowser Road Suite 202Richardson, TX 75081PHONE: 603-858-2300FAX: 972-235-1171EMAIL: [email protected] WEB: www.vitechnology.com

In-line 3D Automated Solder Paste Inspection (SPI); Bench-top and in-line Automated Optical Inspection (AOI); Paperless repair, quality monitoring/feedback and SPC software; Professional consulting/support services.

Viscom

TTBooth No: 506Ed Moll1775 Breckinridge Pkwy.Suite 500Duluth, GA 30096PHONE: 678-966-9835FAX: 678-966-9828EMAIL: [email protected] WEB: www.viscom.com

• The S3088 ultra 3D AOI satisfies both Production and Quality Engineers. For the Production Department, the S3088 ultra with the revolutionary vVision interface provides fast, intuitive program generation and the highest inspection speed utilizing the Viscom XM camera module. For the Quality Department, the S3088 ultra provides accurate and reliable inspection down to 03015, and complete fault coverage using 9 views plus 3D, offering height measurement of components up to 25 mm height.

• TrueYield — the most comprehensive toolset for optimal line performance-Viscom introduces its unique approach to maximize yields with best defect detection and lowest false alarms. With the combination of integrated verification to check programs with verified known defects, known good sample data, process uplink with process data analysis from several test gates and TCM, the automatic machine health check tool provides superior true yield improvement capabilities.

Vitronics SoltecBooth No: 913Mick Austin 45054 Corte ValleTemecula, CA 92592PHONE: 603-502-1792EMAIL: [email protected] WEB: www.vitronics-soltec.com

Vitronics Soltec specializes in the design and manufacturing of mass soldering equipment for the global circuit board assembly market. Products are covering the Reflow, Wave and Selective Soldering markets. Vitronics Soltec is designing and manufacturing equipment in three factories; Camdenton, MO in the USA, Oosterhout in The Netherlands and Suzhou in China. Direct sales and support centers are located in the United States, Holland, Germany, Singapore, Malaysia, Korea and Shanghai.




Weller - Apex Tool GroupBooth No: 806Tom Krisulewicz 1000 Lufkin RoadApex, NC 27539PHONE: 919-387-2449FAX: 919-387-2579EMAIL: [email protected] WEB: www.weller-tools.com

Soldering, desoldering, rework, fume extraction, dispensing and hand tools.

XJTAGBooth No: 1020Simon PayneSt. John’s Innovation Centre Cowley RoadCambridge, AA CB4 0DS United KingdomPHONE: 44-0-1223-223007FAX: 44-0-1223-223009EMAIL: [email protected] WEB: www.xjtag.com

XJTAG is a worldwide leading supplier of IEEE Std.1149.x compliant boundary scan tools, which enable you to debug, test and program electronic circuits quickly and easily. XJTAG’s software tools can help you speed up the design process and improve your debug and testing from early prototypes to mass production. Contact us for a demonstration or free board set up and evaluation.

Yamaha - Trans Tec America TTBooth No: 813Michael Foster7301 W. Boston Street Chandler, AZ 85226PHONE: 877-987-2678FAX: 480-772-4344EMAIL: [email protected] WEB: www.trans-tec-america.com

As the leading distributor of Yamaha SMT equipment solutions in North America, Trans-Tec America is one of the longest-standing global partners for integrated modular assembly lines worldwide. With dedicated industry experience spanning from its inception in 1988, Trans-Tec has developed an excellent reputation for delivering exceptional products and services.

YINCAE Advanced Materials, LLCBooth No: 23719 Walker WayAlbany, NY 12205PHONE: 518-452-2880FAX: 518-452-2779EMAIL: [email protected] WEB: www.yincae.com

Founded & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

Products:• Solder Joint Encapsulants• Underfill Materials• Die Attach Adhesives• Conformal Coatings• TIM• Optical Adhesive• Board Level Assembly• Anti-Warpage Materials• Nanofilm

Yole DéveloppementBooth No: 1031Clotilde Fabre Le Quartz75 Cours Emile Zola 69100 Villeurbanne, Lyon FrancePHONE: 33-472-83-01-09EMAIL: [email protected] WEB: www.yole.fr

Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services.

The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

With a strong focus on emerging applications using silicon and/or micro manufacturing, Yole Développement group has expanded to include more than 50 associates worldwide covering:

• MEMS & Sensors, Imaging, Medical Technologies, Compound Semiconductors, LED, Photonics, Power Electronics, Photovoltaics, Advanced Packaging, and Semiconductor Manufacturing.

YXLON FeinFocus TTBooth No: 128Sheri Martin5675 Hudson Industrial Pkwy. Hudson, OH 44236PHONE: 234-284-7881FAX: 234- 284-7886EMAIL: [email protected] WEB: www.yxlon.com

YXLON is a leading supplier of industrial X-Ray inspection and CT solutions for the non-destructive testing of materials and electronics. YXLON product portfolio includes the Y.Cheetah and Y.Cougar which offer effortless high-quality X-Ray imaging for a wide range of continuous inspection tasks. The Y.Cheetah and Y.Cougar are equipped with our new Win 7™OS FGUI release including upgraded reliability, repeatability and traceability for standard and customized automated inspection. With advanced ultra-high-speed flat panel detector technologies, the systems adapt between inspection tasks including failure analysis, research and development, process control and product testing. The standard 2D inspection systems have an upgrade path to 3D Quick Scan µ CT mode.

ZESTRON AmericasBooth No: 616Sal Sparacino 11285 Assett LoopManassas, VA 20109PHONE: 703-393-9880EMAIL: [email protected] WEB: www.zestron.com

Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing and semiconductor industry. With six worldwide technical centers and the largest team of engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal. For more information, visit www.zestron.com.

Zymet, Inc.Booth No: 441Jennifer Gupta7A Great Meadow Lane East Hanover, NJ 07936 PHONE: 973-428-5245FAX: 973-428-5244EMAIL: [email protected] WEB: www.zymet.com

Adhesives and encapsulants for electronics and optoelectronics assembly. Products include electrically conductive and thermally conductive adhesives, ultra-low stress adhesives, ACP’s and NCP’s, UV curable glob top encapsulants, and underfill and reworkable underfill encapsulants for flip chips, WLP’s, CSP’s, BGA’s, and POP’s.


Adhesives and Sealants5N Plus Micro Powders . . . . . . . . . . . . . 327Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940Alpha . . . . . . . . . . . . . . . . . . . . . . . . . . . 321Alpha Recycling Services. . . . . . . . . . . 1006ELANTAS PDG . . . . . . . . . . . . . . . . . . . . 318Henkel Corporation . . . . . . . . . . . . . . . . 701Heraeus Electronics . . . . . . . . . . . . . . . . 845KOKI Solder America . . . . . . . . . . . . . . . 135Krayden Inc. . . . . . . . . . . . . . . . . . . . . . . 931MacDermid. . . . . . . . . . . . . . . . . . . . . . . 927Nordson ASYMTEK . . . . . . . . . . . . . . . . 706Northern Electronics Automation . . . . . . 708PPG Industries, Semco Packaging &

Application Systems . . . . . . . . . . . . . 641Precision Placement Machines . . . . . . . 736Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245Speedline Technologies . . . . . . . . . . . . . 124Stanley Supply & Services . . . . . . . . . . 1024Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010Technimark, Inc . . . . . . . . . . . . . . . . . . . 239YINCAE Advanced Materials, LLC . . . . . 237Zymet, Inc. . . . . . . . . . . . . . . . . . . . . . . . 441

Analytical and LaboratoryAkrometrix, LLC . . . . . . . . . . . . . . . . . . . 134Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219Conecsus, LLC. . . . . . . . . . . . . . . . . . . . 110FCT Assembly . . . . . . . . . . . . . . . . . . . . 313Hi-Rel Laboratories . . . . . . . . . . . . . . . . 909Materials Evaluation and

Engineering, Inc. . . . . . . . . . . . . . . . 1023National Technical Systems . . . . . . . . . 1035Oxford Instruments. . . . . . . . . . . . . . . . . 537RPS Automation, LLC . . . . . . . . . . . . . . 807Scienscope. . . . . . . . . . . . . . . . . . . . . . . 544STI Electronics, Inc. . . . . . . . . . . . . . . . . 609Super Dry . . . . . . . . . . . . . . . . . . . . . . . 1034Texwipe . . . . . . . . . . . . . . . . . . . . . . . . . 439Universal Instruments Corporation. . . . . 306YXLON FeinFocus . . . . . . . . . . . . . . . . . 128ZESTRON Americas . . . . . . . . . . . . . . . . 616

Associations and OrganizationsIPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 744SMTA . . . . . . . . . . . . . . . . . . . . . . . . . Lobby

Barcode, Scanning, RFIDAlltemated Inc. . . . . . . . . . . . . . . . . . . . . 940ASM Assembly Systems

(SIPLACE & DEK) . . . . . . . . . . . . . . . 225Cogiscan . . . . . . . . . . . . . . . . . . . . . . . 1038Europlacer Americas’ . . . . . . . . . . . . . . . 637IDENTCO . . . . . . . . . . . . . . . . . . . . . . . 1030KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825Omron Inspection Systems . . . . . . . . . . 436RPS Automation, LLC . . . . . . . . . . . . . . 807Seika Machinery, Inc. . . . . . . . . . . . . . . . 707Speedline Technologies . . . . . . . . . . . . . 124Stanley Supply & Services . . . . . . . . . . 1024Universal Instruments Corporation. . . . . 306

CAD, CAM, CIM, EDAEuroplacer Americas’ . . . . . . . . . . . . . . . 637FCT Assembly . . . . . . . . . . . . . . . . . . . . 313Infinite Graphics . . . . . . . . . . . . . . . . . . . 925

iTAC Software, AG . . . . . . . . . . . . . . . . 1027KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445Mentor Graphics Corporation,

Valor Division. . . . . . . . . . . . . . . . . . . 634MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825

Chemicals and Treatment5N Plus Micro Powders . . . . . . . . . . . . . 327FCT Assembly . . . . . . . . . . . . . . . . . . . . 313MacDermid. . . . . . . . . . . . . . . . . . . . . . . 927National Technical Systems . . . . . . . . . 1035PPG Industries, Semco Packaging &

Application Systems . . . . . . . . . . . . . 641Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245Speedline Technologies . . . . . . . . . . . . . 124Stanley Supply & Services . . . . . . . . . . 1024Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010YINCAE Advanced Materials, LLC . . . . . 237

Circuit Board HandlingApex Factory Automation. . . . . . . . . . . . 735Conductive Containers, Inc.. . . . . . . . . . 317Crystal Mark, Inc. . . . . . . . . . . . . . . . . . . 319CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335Europlacer Americas’ . . . . . . . . . . . . . . . 637FKN Systek. . . . . . . . . . . . . . . . . . . . . . . 933FlexLink Systems, Inc. . . . . . . . . . . . . . . 107iLink Electronics, Inc. . . . . . . . . . . . . . . 1041InsulFab PCB Tooling . . . . . . . . . . . . . . . 512Kulicke & Soffa Industries, Inc.. . . . . . . . 136Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825National Technical Systems . . . . . . . . . 1035Northern Electronics Automation . . . . . . 708Precision Placement Machines . . . . . . . 736SEHO North America, Inc. . . . . . . . . . . . 635Shenzhen D.M. Electronic, Limited . . . . 900Simplimatic Automation . . . . . . . . . . . . 1018Speedline Technologies . . . . . . . . . . . . . 124Stanley Supply & Services . . . . . . . . . . 1024Super Dry . . . . . . . . . . . . . . . . . . . . . . . 1034Technimark, Inc . . . . . . . . . . . . . . . . . . . 239Universal Instruments Corporation. . . . . 306

Cleaning and SolventsACL, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . 331Alpha . . . . . . . . . . . . . . . . . . . . . . . . . . . 321Alpha Recycling Services. . . . . . . . . . . 1006Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219Crystal Mark, Inc. . . . . . . . . . . . . . . . . . . 319Henkel Corporation . . . . . . . . . . . . . . . . 701Inventec Performance Chemicals . . . . . 230KYZEN Corporation . . . . . . . . . . . . . . . . 117MacDermid. . . . . . . . . . . . . . . . . . . . . . . 927Northern Electronics Automation . . . . . . 708Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245Qualitek International Inc.. . . . . . . . . . . . 538Seika Machinery, Inc. . . . . . . . . . . . . . . . 707Speedline Technologies . . . . . . . . . . . . . 124Stanley Supply & Services . . . . . . . . . . 1024Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010Technical Devices Company . . . . . . . . . 807Technimark, Inc . . . . . . . . . . . . . . . . . . . 239ZESTRON Americas . . . . . . . . . . . . . . . . 616

Coating, Dispensing and MaskingAscentech, LLC . . . . . . . . . . . . . . . . . . . 219Conductive Containers, Inc.. . . . . . . . . . 317ELANTAS PDG . . . . . . . . . . . . . . . . . . . . 318ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335Europlacer Americas’ . . . . . . . . . . . . . . . 637GPD Global . . . . . . . . . . . . . . . . . . . . . . 305Henkel Corporation . . . . . . . . . . . . . . . . 701InsulFab PCB Tooling . . . . . . . . . . . . . . . 512Inventec Performance Chemicals . . . . . 230Krayden, Inc. . . . . . . . . . . . . . . . . . . . . . 931MacDermid. . . . . . . . . . . . . . . . . . . . . . . 927Nordson ASYMTEK . . . . . . . . . . . . . . . . 706Nordson DAGE. . . . . . . . . . . . . . . . . . . . 606Northern Electronics Automation . . . . . . 708O.C. White Company . . . . . . . . . . . . . . 1001Pillarhouse USA, Inc. . . . . . . . . . . . . . . . 139PPG Industries, Semco Packaging &

Application Systems . . . . . . . . . . . . . 641Precision Placement Machines . . . . . . . 736Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245Rehm Thermal Systems, LLC. . . . . . . . . 437Specialty Coating Systems

(Equipment) . . . . . . . . . . . . . . . . . . . . 434Specialty Coating Systems

(Parylene Service) . . . . . . . . . . . . . . . 941Speedline Technologies . . . . . . . . . . . . . 124Stanley Supply & Services . . . . . . . . . . 1024Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010Technimark, Inc . . . . . . . . . . . . . . . . . . . 239TTnS, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 638Viscom . . . . . . . . . . . . . . . . . . . . . . . . . . 506Weller - Apex Tool Group . . . . . . . . . . . . 806YINCAE Advanced Materials, LLC . . . . . 237

Component InsertionApex Factory Automation. . . . . . . . . . . . 735CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335Europlacer Americas’ . . . . . . . . . . . . . . . 637Finetech/Martin . . . . . . . . . . . . . . . . . . . 417Fuji America Corporation . . . . . . . . . . . . 107iLink Electronics, Inc. . . . . . . . . . . . . . . 1041Juki Automation Systems. . . . . . . . . . . . 716KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344Mid-America Taping & Reeling . . . . . . . . 540MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825Northern Electronics Automation . . . . . . 708Panasonic Factory Solutions

of America. . . . . . . . . . . . . . . . . . . . . 213Simplimatic Automation . . . . . . . . . . . . 1018Universal Instruments Corporation. . . . . 306

Component Prep and CountingAlltemated, Inc. . . . . . . . . . . . . . . . . . . . 940Europlacer Americas’ . . . . . . . . . . . . . . . 637GPD Global . . . . . . . . . . . . . . . . . . . . . . 305HEPCO, Inc. . . . . . . . . . . . . . . . . . . . . . . 416Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344Mid-America Taping & Reeling . . . . . . . . 540RPS Automation, LLC . . . . . . . . . . . . . . 807Stanley Supply & Services . . . . . . . . . . 1024Super Dry . . . . . . . . . . . . . . . . . . . . . . . 1034Technimark, Inc . . . . . . . . . . . . . . . . . . . 239

Tintronics Industries . . . . . . . . . . . . . . . . 341

Exhibitors by Classification


Components and HardwareEuroplacer Americas’ . . . . . . . . . . . . . . . 637FKN Systek. . . . . . . . . . . . . . . . . . . . . . . 933Infinite Graphics . . . . . . . . . . . . . . . . . . . 925Omron Inspection Systems . . . . . . . . . . 436Teka Interconnection Systems . . . . . . . . 325TOPLINE. . . . . . . . . . . . . . . . . . . . . . . . . 435

Consulting and Market ResearchMetro SMT Ltd. . . . . . . . . . . . . . . . . . . . 344North Dakota Department

of Commerce . . . . . . . . . . . . . . . . . 1028

Data AcquisitionAkrometrix, LLC . . . . . . . . . . . . . . . . . . . 134ASC International . . . . . . . . . . . . . . . . . . 518Cogiscan . . . . . . . . . . . . . . . . . . . . . . . 1038Heller Industries . . . . . . . . . . . . . . . . . . . 107iTAC Software, AG . . . . . . . . . . . . . . . . 1027KIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 338KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445Speedline Technologies . . . . . . . . . . . . . 124Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010

Die and Wire BondingAlltemated, Inc. . . . . . . . . . . . . . . . . . . . 940Alpha . . . . . . . . . . . . . . . . . . . . . . . . . . . 321Alpha Recycling Services. . . . . . . . . . . 1006ASM Assembly Systems

(SIPLACE and DEK) . . . . . . . . . . . . . 225Finetech/Martin . . . . . . . . . . . . . . . . . . . 417Henkel Corporation . . . . . . . . . . . . . . . . 701Heraeus Electronics . . . . . . . . . . . . . . . . 845Inventec Performance Chemicals . . . . . 230Kulicke & Soffa Industries, Inc.. . . . . . . . 136Nihon Superior Company, Ltd.. . . . . . . . 419Nordson ASYMTEK . . . . . . . . . . . . . . . . 706Panasonic Factory Solutions

of America. . . . . . . . . . . . . . . . . . . . . 213Speedline Technologies . . . . . . . . . . . . . 124TOPLINE. . . . . . . . . . . . . . . . . . . . . . . . . 435Universal Instruments Corporation. . . . . 306YINCAE Advanced Materials, LLC . . . . . 237

Distributor/Manufacturer’s RepresentativeAlltemated Inc. . . . . . . . . . . . . . . . . . . . . 940Apex Factory Automation. . . . . . . . . . . . 735Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226Krayden, Inc. . . . . . . . . . . . . . . . . . . . . . 931Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344Pillarhouse USA, Inc. . . . . . . . . . . . . . . . 139Seika Machinery, Inc. . . . . . . . . . . . . . . . 707Stanley Supply & Services . . . . . . . . . . 1024TAGARNO. . . . . . . . . . . . . . . . . . . . . . . . 224Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010Technimark, Inc . . . . . . . . . . . . . . . . . . . 239Texwipe . . . . . . . . . . . . . . . . . . . . . . . . . 439The Test Connection, Inc.. . . . . . . . . . . . 410

Drilling, Routing and DicingAlltemated, Inc. . . . . . . . . . . . . . . . . . . . 940ASYS Group Americas, Inc. . . . . . . . . . . 835ATV Technologie GmbH . . . . . . . . . . . . . 841CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226FCT Assembly . . . . . . . . . . . . . . . . . . . . 313iLink Electronics, Inc. . . . . . . . . . . . . . . 1041Panasonic Factory Solutions of America 213Precision Placement Machines . . . . . . . 736

Seika Machinery, Inc. . . . . . . . . . . . . . . . 707

Electronics Manufacturing ServicesAlltemated, Inc. . . . . . . . . . . . . . . . . . . . 940Amitron Corporation. . . . . . . . . . . . . . . . 536Cogiscan . . . . . . . . . . . . . . . . . . . . . . . 1038Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938Crystal Mark, Inc. . . . . . . . . . . . . . . . . . . 319CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226DIVSYS International . . . . . . . . . . . . . . 1008Europlacer Americas’ . . . . . . . . . . . . . . . 637Geib Refining Corp. . . . . . . . . . . . . . . . 1033Ironwood Electronics . . . . . . . . . . . . . . . 818Mid-America Taping & Reeling . . . . . . . . 540Nitto Kohki U.S.A., Inc.. . . . . . . . . . . . . . 917Northern Electronics Automation . . . . . . 708Shenzhen D.M. Electronic, Limited . . . . 900STI Electronics, Inc. . . . . . . . . . . . . . . . . 609

ESD and EOSACL, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . 331Conductive Containers, Inc.. . . . . . . . . . 317Crystal Mark, Inc. . . . . . . . . . . . . . . . . . . 319Electronic Assembly Products, Ltd. . . . . 807IKEUCHI USA, INC. . . . . . . . . . . . . . . . . 902Mid-America Taping & Reeling . . . . . . . . 540Nitto Kohki U.S.A., Inc.. . . . . . . . . . . . . . 917Nordson ASYMTEK . . . . . . . . . . . . . . . . 706O.C. White Company . . . . . . . . . . . . . . 1001Sovella Inc/The Daylight Company . . . . 907STI Electronics, Inc. . . . . . . . . . . . . . . . . 609Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010Technimark, Inc . . . . . . . . . . . . . . . . . . . 239

FeedersApex Factory Automation. . . . . . . . . . . . 735ASM Assembly Systems . . . . . . . . . . . . 225CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335Europlacer Americas’ . . . . . . . . . . . . . . . 637IDENTCO . . . . . . . . . . . . . . . . . . . . . . . 1030Juki Automation Systems. . . . . . . . . . . . 716Kulicke & Soffa Industries, Inc.. . . . . . . . 136Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344Northern Electronics Automation . . . . . . 708Panasonic Factory Solutions

of America. . . . . . . . . . . . . . . . . . . . . 213Precision Placement Machines . . . . . . . 736Technimark, Inc . . . . . . . . . . . . . . . . . . . 239Universal Instruments Corporation. . . . . 306

Flexible CircuitsAmerican Standard Circuits, Inc. . . . . . . 801CMK America Corporation . . . . . . . . . . . 745Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938ELTEK, Ltd.. . . . . . . . . . . . . . . . . . . . . . . 140Europlacer Americas’ . . . . . . . . . . . . . . . 637FCT Assembly . . . . . . . . . . . . . . . . . . . . 313InsulFab PCB Tooling . . . . . . . . . . . . . . . 512Kulicke & Soffa Industries, Inc.. . . . . . . . 136RPS Automation, LLC . . . . . . . . . . . . . . 807Schoeller-Electronics GmbH . . . . . . . . . 935Shenzhen D.M. Electronic, Limited . . . . 900SOMACIS . . . . . . . . . . . . . . . . . . . . . . . . 911Speedline Technologies . . . . . . . . . . . . . 124

Flip Chip and MultichipASM Assembly Systems

(SIPLACE and DEK) . . . . . . . . . . . . . 225Europlacer Americas’ . . . . . . . . . . . . . . . 637Finetech/Martin . . . . . . . . . . . . . . . . . . . 417

Fuji America Corporation . . . . . . . . . . . . 107GPD Global . . . . . . . . . . . . . . . . . . . . . . 305Henkel Corporation . . . . . . . . . . . . . . . . 701Inventec Performance Chemicals . . . . . 230Kulicke & Soffa Industries, Inc.. . . . . . . . 136Panasonic Factory Solutions of America 213Sonoscan, Inc. . . . . . . . . . . . . . . . . . . . . 424Speedline Technologies . . . . . . . . . . . . . 124Universal Instruments Corporation. . . . . 306

Foils, Laminates and LaminationNational Technical Systems . . . . . . . . . 1035Shenzhen D.M. Electronic, Limited . . . . 900

Hand Tools and Shop SuppliesAmerican Hakko Products . . . . . . . . . . . 534Aven, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 235FKN Systek. . . . . . . . . . . . . . . . . . . . . . . 933iLink Electronics, Inc. . . . . . . . . . . . . . . 1041Mid-America Taping & Reeling . . . . . . . . 540Nitto Kohki U.S.A., Inc.. . . . . . . . . . . . . . 917O.C. White Company . . . . . . . . . . . . . . 1001PACE Incorporated. . . . . . . . . . . . . . . . . 945Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245Sovella Inc/The Daylight Company . . . . 907Stanley Supply & Services . . . . . . . . . . 1024Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010Technimark, Inc . . . . . . . . . . . . . . . . . . . 239Weller - Apex Tool Group . . . . . . . . . . . . 806

Inspection and MeasurementAcculogic, Inc. . . . . . . . . . . . . . . . . . . . . 800Akrometrix, LLC . . . . . . . . . . . . . . . . . . . 134Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940AOI Systems. . . . . . . . . . . . . . . . . . . . . . 444ASC International . . . . . . . . . . . . . . . . . . 518Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219Aven, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 235Creative Electron, Inc. . . . . . . . . . . . . . . 516CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226CyberOptics Corporation . . . . . . . . . . . . 814ERSA North America . . . . . . . . . . . . . . . 539Europlacer Americas’ . . . . . . . . . . . . . . . 637FKN Systek. . . . . . . . . . . . . . . . . . . . . . . 933FlexLink Systems, Inc. . . . . . . . . . . . . . . 107FSInspection . . . . . . . . . . . . . . . . . . . . . 946Heller Industries . . . . . . . . . . . . . . . . . . . 107JTAG Technologies. . . . . . . . . . . . . . . . . 939Juki Automation Systems. . . . . . . . . . . . 716KIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 338Koh Young America, Inc. . . . . . . . . . . . . 307KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445Mek. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1040Mirtec Corporation . . . . . . . . . . . . . . . . . 407National Technical Systems . . . . . . . . . 1035Nikon Metrology . . . . . . . . . . . . . . . . . . . 340Nordson ASYMTEK . . . . . . . . . . . . . . . . 706Nordson DAGE. . . . . . . . . . . . . . . . . . . . 606Nordson YESTECH . . . . . . . . . . . . . . . . 606Northern Electronics Automation . . . . . . 708O.C. White Company . . . . . . . . . . . . . . 1001Omron Inspection Systems . . . . . . . . . . 436Oxford Instruments. . . . . . . . . . . . . . . . . 537RS Simmons Co., LLC . . . . . . . . . . . . . . 936Saki America, Inc.. . . . . . . . . . . . . . . . . 1025Scienscope. . . . . . . . . . . . . . . . . . . . . . . 544SEHO North America, Inc. . . . . . . . . . . . 635Seika Machinery, Inc. . . . . . . . . . . . . . . . 707Simplimatic Automation . . . . . . . . . . . . 1018Sonoscan, Inc. . . . . . . . . . . . . . . . . . . . . 424Stanley Supply & Services . . . . . . . . . . 1024STI Electronics, Inc. . . . . . . . . . . . . . . . . 609


TAGARNO. . . . . . . . . . . . . . . . . . . . . . . . 224Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010Test Research, Inc. . . . . . . . . . . . . . . . . . 712Texmac Inc (Takaya) . . . . . . . . . . . . . . . . 320Vi TECHNOLOGY. . . . . . . . . . . . . . . . . . 807Viscom . . . . . . . . . . . . . . . . . . . . . . . . . . 506Yamaha-Trans Tec America . . . . . . . . . . 813YXLON FeinFocus . . . . . . . . . . . . . . . . . 128

Labeling, Ink and MarkingAlltemated Inc. . . . . . . . . . . . . . . . . . . . . 940ASYS Group Americas, Inc. . . . . . . . . . . 835CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226Europlacer Americas’ . . . . . . . . . . . . . . . 637FCT Assembly . . . . . . . . . . . . . . . . . . . . 313FlexLink Systems, Inc. . . . . . . . . . . . . . . 107IDENTCO . . . . . . . . . . . . . . . . . . . . . . . 1030iLink Electronics, Inc. . . . . . . . . . . . . . . 1041Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245Simplimatic Automation . . . . . . . . . . . . 1018Speedline Technologies . . . . . . . . . . . . . 124Stanley Supply & Services . . . . . . . . . . 1024Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010Technimark, Inc . . . . . . . . . . . . . . . . . . . 239Universal Instruments Corporation. . . . . 306

Laser SystemsAlltemated, Inc. . . . . . . . . . . . . . . . . . . . 940ASC International . . . . . . . . . . . . . . . . . . 518ASYS Group Americas, Inc. . . . . . . . . . . 835CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226Electronic Assembly Products, Ltd. . . . . 807FCT Assembly . . . . . . . . . . . . . . . . . . . . 313FlexLink Systems, Inc. . . . . . . . . . . . . . . 107iLink Electronics, Inc. . . . . . . . . . . . . . . 1041MET Stencil . . . . . . . . . . . . . . . . . . . . . . 329Nikon Metrology . . . . . . . . . . . . . . . . . . . 340Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245Simplimatic Automation . . . . . . . . . . . . 1018

Lease, Refurbishment and ResaleASC International. . . . . . . . . . . . . . . . . . . 518Europlacer Americas’. . . . . . . . . . . . . . . . 637Metro SMT, Ltd.. . . . . . . . . . . . . . . . . . . . 344Northern Electronics Automation . . . . . . . 708Speedline Technologies . . . . . . . . . . . . . . 124

Materials Handling Equipment/Automation SystemsACE Production Technologies . . . . . . . . 426Apex Factory Automation. . . . . . . . . . . . 735ASYS Group Americas, Inc. . . . . . . . . . . 835Conductive Containers, Inc.. . . . . . . . . . 317Crystal Mark, Inc. . . . . . . . . . . . . . . . . . . 319CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335Europlacer Americas’ . . . . . . . . . . . . . . . 637FlexLink Systems Inc. . . . . . . . . . . . . . . 107Inovaxe Corporation. . . . . . . . . . . . . . . . 713Juki Automation Systems. . . . . . . . . . . . 718Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344National Technical Systems . . . . . . . . . 1035Nordson ASYMTEK . . . . . . . . . . . . . . . . 706Northern Electronics Automation . . . . . . 708PPG Industries, Semco Packaging &

Application Systems . . . . . . . . . . . . . 641Precision Placement Machines . . . . . . . 736Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245RPS Automation, LLC . . . . . . . . . . . . . . 807SEHO North America, Inc. . . . . . . . . . . . 635

Seika Machinery, Inc. . . . . . . . . . . . . . . . 707Simplimatic Automation . . . . . . . . . . . . 1018Sovella Inc/The Daylight Company . . . . 907Speedline Technologies . . . . . . . . . . . . . 124Super Dry . . . . . . . . . . . . . . . . . . . . . . . 1034Teradyne, Inc. . . . . . . . . . . . . . . . . . . . . . 234Universal Instruments Corporation. . . . . 306

Odd Form PlacementAlltemated, Inc. . . . . . . . . . . . . . . . . . . . 940Apex Factory Automation. . . . . . . . . . . . 735ASM Assembly Systems

(SIPLACE and DEK) . . . . . . . . . . . . . 225CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226Europlacer Americas’ . . . . . . . . . . . . . . . 637Fuji America Corporation . . . . . . . . . . . . 107Juki Automation Systems. . . . . . . . . . . . 716Kulicke & Soffa Industries, Inc.. . . . . . . . 136Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344Mid-America Taping & Reeling . . . . . . . . 540MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825Northern Electronics Automation . . . . . . 708Panasonic Factory Solutions of America 213Precision Placement Machines . . . . . . . 736Simplimatic Automation . . . . . . . . . . . . 1018Universal Instruments Corporation. . . . . 306Yamaha - Trans Tec America . . . . . . . . . 813

Ovens, Curing and DryingAlltemated Inc. . . . . . . . . . . . . . . . . . . . . 940Apex Factory Automation. . . . . . . . . . . . 735ATV Technologie GmbH . . . . . . . . . . . . . 841BTU International . . . . . . . . . . . . . . . . . . 734CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226ERSA North America . . . . . . . . . . . . . . . 539ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335Heller Industries . . . . . . . . . . . . . . . . . . . 107Juki Automation Systems. . . . . . . . . . . . 716KIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 338Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344National Technical Systems . . . . . . . . . 1035Nordson ASYMTEK . . . . . . . . . . . . . . . . 706Northern Electronics Automation . . . . . . 708Pillarhouse USA, Inc. . . . . . . . . . . . . . . . 139Rehm Thermal Systems, LLC. . . . . . . . . 437SEHO North America, Inc. . . . . . . . . . . . 635Seika Machinery, Inc. . . . . . . . . . . . . . . . 707Senju Comtek Corporation. . . . . . . . . . . 412Specialty Coating Systems


(Parylene Service) . . . . . . . . . . . . . . . 941Speedline Technologies . . . . . . . . . . . . . 124Super Dry . . . . . . . . . . . . . . . . . . . . . . . 1034TTnS, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 638Universal Instruments Corporation. . . . . 306Vitronics Soltec. . . . . . . . . . . . . . . . . . . . 913

Packaging and Encapsulating5N Plus Micro Powders . . . . . . . . . . . . . 327Accurate Carriers USA . . . . . . . . . . . . . . 717Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940ATV Technologie GmbH . . . . . . . . . . . . . 841BTU International . . . . . . . . . . . . . . . . . . 734Conductive Containers, Inc.. . . . . . . . . . 317GPD Global . . . . . . . . . . . . . . . . . . . . . . 305Inventec Performance Chemicals . . . . . 230Mid-America Taping & Reeling . . . . . . . . 540Nordson ASYMTEK . . . . . . . . . . . . . . . . 706PPG Industries, Semco Packaging &

Application Systems . . . . . . . . . . . . . 641

Simplimatic Automation . . . . . . . . . . . . 1018TOPLINE. . . . . . . . . . . . . . . . . . . . . . . . . 435YINCAE Advanced Materials, LLC . . . . . 237Zymet, Inc. . . . . . . . . . . . . . . . . . . . . . . . 441

PCB FabricationAlltemated, Inc. . . . . . . . . . . . . . . . . . . . 940American Standard Circuits, Inc. . . . . . . 801Amitron Corporation. . . . . . . . . . . . . . . . 536CMK America Corporation . . . . . . . . . . . 745DIVSYS International . . . . . . . . . . . . . . 1008Electrotek Corporation . . . . . . . . . . . . . . 420ELTEK, Ltd.. . . . . . . . . . . . . . . . . . . . . . . 140Prototron Circuits Inc. . . . . . . . . . . . . . . 418RPS Automation, LLC . . . . . . . . . . . . . . 807Schoeller-Electronics GmbH . . . . . . . . . 935Shenzhen D.M. Electronic, Limited . . . . 900SOMACIS . . . . . . . . . . . . . . . . . . . . . . . . 911Speedline Technologies . . . . . . . . . . . . . 124

Pick and PlaceAlltemated, Inc. . . . . . . . . . . . . . . . . . . . 940Apex Factory Automation. . . . . . . . . . . . 735ASM Assembly Systems . . . . . . . . . . . . 225ATV Technologie GmbH . . . . . . . . . . . . . 841Cogiscan . . . . . . . . . . . . . . . . . . . . . . . 1038Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335Europlacer Americas’ . . . . . . . . . . . . . . . 637Fuji America Corporation . . . . . . . . . . . . 107InsulFab PCB Tooling . . . . . . . . . . . . . . . 512Juki Automation Systems. . . . . . . . . . . . 716Kulicke & Soffa Industries, Inc.. . . . . . . . 136Metro SMT ,Ltd. . . . . . . . . . . . . . . . . . . . 344MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825Northern Electronics Automation . . . . . . 708Panasonic Factory Solutions

of America. . . . . . . . . . . . . . . . . . . . . 213Precision Placement Machines . . . . . . . 736Quik-Tool . . . . . . . . . . . . . . . . . . . . . . . . 918Samsung C&T Automation, Inc. . . . . . . . 739Simplimatic Automation . . . . . . . . . . . . 1018Technimark, Inc . . . . . . . . . . . . . . . . . . . 239Universal Instruments Corporation. . . . . 306Yamaha - Trans Tec America . . . . . . . . . 813

Publications and MarketingCIRCUITS ASSEMBLY . . . . . . . . . . . . . . 601Electronics World Publishing . . . . . . . . . 929Global SMT & Packaging . . . . . . . . . . . . 919I-Connect007 . . . . . . . . . . . . . . . . . . . . . 104SMT Today . . . . . . . . . . . . . . . . . . . . . . . 446SMTA . . . . . . . . . . . . . . . . . . . . . . . . . LobbySMTnet . . . . . . . . . . . . . . . . . . . . . . . . . . 132US Tech . . . . . . . . . . . . . . . . . . . . . . . . . 901

RecyclingAlpha . . . . . . . . . . . . . . . . . . . . . . . . . . . 321Alpha Recycling Services. . . . . . . . . . . 1006Conecsus, LLC. . . . . . . . . . . . . . . . . . . . 110EVS International Sales, Limited . . . . . . 142Geib Refining Corp. . . . . . . . . . . . . . . . 1033Qualitek International, Inc. . . . . . . . . . . . 538Senju Comtek Corporation. . . . . . . . . . . 412Technimark, Inc . . . . . . . . . . . . . . . . . . . 239

Repair & ReworkACE Production Technologies . . . . . . . . 426ACL, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . 331AGI Corporation . . . . . . . . . . . . . . . . . . . 738


Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940Alpha . . . . . . . . . . . . . . . . . . . . . . . . . . . 321Alpha Recycling Services. . . . . . . . . . . 1006American Hakko Products . . . . . . . . . . . 534ASC International . . . . . . . . . . . . . . . . . . 518ATV Technologie GmbH . . . . . . . . . . . . . 841BEST, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 127Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938Conductive Containers, Inc.. . . . . . . . . . 317Creative Electron, Inc. . . . . . . . . . . . . . . 516Crystal Mark, Inc. . . . . . . . . . . . . . . . . . . 319ERSA North America . . . . . . . . . . . . . . . 539Europlacer Americas’ . . . . . . . . . . . . . . . 637FCT Assembly . . . . . . . . . . . . . . . . . . . . 313Finetech/Martin . . . . . . . . . . . . . . . . . . . 417HEPCO, Inc. . . . . . . . . . . . . . . . . . . . . . . 416iLink Electronics, Inc. . . . . . . . . . . . . . . 1041Indium Corporation . . . . . . . . . . . . . . . . 430InsulFab PCB Tooling . . . . . . . . . . . . . . . 512Inventec Performance Chemicals . . . . . 230JBC Tools USA, Inc. . . . . . . . . . . . . . . . . 636Jovy Systems, Limited . . . . . . . . . . . . . . 646KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445LaserJob, Inc.. . . . . . . . . . . . . . . . . . . . . 125MET Stencil . . . . . . . . . . . . . . . . . . . . . . 329Metcal. . . . . . . . . . . . . . . . . . . . . . . . . . . 816Mid-America Taping & Reeling . . . . . . . . 540Nihon Superior Company, Ltd.. . . . . . . . 419Nitto Kohki U.S.A., Inc.. . . . . . . . . . . . . . 917Northern Electronics Automation . . . . . . 708O.C. White Company . . . . . . . . . . . . . . 1001PACE Incorporated. . . . . . . . . . . . . . . . . 945Pillarhouse USA, Inc. . . . . . . . . . . . . . . . 139RPS Automation, LLC . . . . . . . . . . . . . . 807SEHO North America, Inc. . . . . . . . . . . . 635Seika Machinery, Inc. . . . . . . . . . . . . . . . 707Sovella Inc/The Daylight Company . . . . 907Speedline Technologies . . . . . . . . . . . . . 124Stanley Supply & Services . . . . . . . . . . 1024STI Electronics, Inc. . . . . . . . . . . . . . . . . 609TAGARNO. . . . . . . . . . . . . . . . . . . . . . . . 224Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010Tintronics Industries . . . . . . . . . . . . . . . . 341TOPLINE. . . . . . . . . . . . . . . . . . . . . . . . . 435Weller - Apex Tool Group . . . . . . . . . . . . 806

Semiconductor Materials5N Plus Micro Powders . . . . . . . . . . . . . 327Henkel Corporation . . . . . . . . . . . . . . . . 701Heraeus Electronics . . . . . . . . . . . . . . . . 845Indium Corporation . . . . . . . . . . . . . . . . 430Infinite Graphics . . . . . . . . . . . . . . . . . . . 925Inventec Performance Chemicals . . . . . 230Kester . . . . . . . . . . . . . . . . . . . . . . . . . . . 131MacDermid. . . . . . . . . . . . . . . . . . . . . . . 927National Technical Systems . . . . . . . . . 1035Nihon Superior Company, Ltd.. . . . . . . . 419Senju Comtek Corporation. . . . . . . . . . . 412Sonoscan, Inc. . . . . . . . . . . . . . . . . . . . . 424Speedline Technologies . . . . . . . . . . . . . 124TOPLINE. . . . . . . . . . . . . . . . . . . . . . . . . 435

Software and ProgrammingAegis Industrial Software Corporation . . 440Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940ASC International . . . . . . . . . . . . . . . . . . 518ASM Assembly Systems

(SIPLACE and DEK) . . . . . . . . . . . . . 225CalcuQuote . . . . . . . . . . . . . . . . . . . . . 1046Cogiscan . . . . . . . . . . . . . . . . . . . . . . . 1038CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226Europlacer Americas’ . . . . . . . . . . . . . . . 637

iLink Electronics, Inc. . . . . . . . . . . . . . . 1041Infinite Graphics . . . . . . . . . . . . . . . . . . . 925Inovaxe Corporation. . . . . . . . . . . . . . . . 713iTAC Software, AG . . . . . . . . . . . . . . . . 1027Kulicke & Soffa Industries, Inc.. . . . . . . . 136KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445MANEX ERP, Inc. . . . . . . . . . . . . . . . . . . 339Mentor Graphics Corporation,

Valor Division. . . . . . . . . . . . . . . . . . . 634MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825Nikon Metrology . . . . . . . . . . . . . . . . . . . 340Northern Electronics Automation . . . . . . 708Omron Inspection Systems . . . . . . . . . . 436Panasonic Factory Solutions

of America. . . . . . . . . . . . . . . . . . . . . 213Speedline Technologies . . . . . . . . . . . . . 124The Test Connection, Inc.. . . . . . . . . . . . 410

Solder and Fluxes5N Plus Micro Powders . . . . . . . . . . . . . 327AIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 413Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940Alpha . . . . . . . . . . . . . . . . . . . . . . . . . . . 321Alpha Recycling Services. . . . . . . . . . . 1006Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219Conecsus, LLC. . . . . . . . . . . . . . . . . . . . 110ERSA North America . . . . . . . . . . . . . . . 539FCT Assembly . . . . . . . . . . . . . . . . . . . . 313Geib Refining Corp. . . . . . . . . . . . . . . . 1033Henkel Corporation . . . . . . . . . . . . . . . . 701Heraeus Electronics . . . . . . . . . . . . . . . . 845Indium Corporation . . . . . . . . . . . . . . . . 430Inventec Performance Chemicals . . . . . 230Jovy Systems, Limited . . . . . . . . . . . . . . 646Kester . . . . . . . . . . . . . . . . . . . . . . . . . . . 131KOKI Solder America . . . . . . . . . . . . . . . 135Krayden, Inc. . . . . . . . . . . . . . . . . . . . . . 931MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825National Technical Systems . . . . . . . . . 1035Nihon Superior Company, Ltd.. . . . . . . . 419Nordson ASYMTEK . . . . . . . . . . . . . . . . 706Northern Electronics Automation . . . . . . 708O.C. White Company . . . . . . . . . . . . . . 1001Pillarhouse USA, Inc. . . . . . . . . . . . . . . . 139Qualitek International, Inc. . . . . . . . . . . . 538SEHO North America, Inc. . . . . . . . . . . . 635Senju Comtek Corporation. . . . . . . . . . . 412Speedline Technologies . . . . . . . . . . . . . 124Stanley Supply & Services . . . . . . . . . . 1024Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010Technimark, Inc . . . . . . . . . . . . . . . . . . . 239YINCAE Advanced Materials, LLC . . . . . 237

Soldering, AutomatedACE Production Technologies . . . . . . . . 426AGI Corporation . . . . . . . . . . . . . . . . . . . 738Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940Apollo Seiko . . . . . . . . . . . . . . . . . . . . . . 411ATV Technologie GmbH . . . . . . . . . . . . . 841Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226Electronic Assembly Products, Ltd. . . . . 807ERSA North America . . . . . . . . . . . . . . . 539ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335EVS International Sales, Limited . . . . . . 142FCT Assembly . . . . . . . . . . . . . . . . . . . . 313Finetech/Martin . . . . . . . . . . . . . . . . . . . 417Heller Industries . . . . . . . . . . . . . . . . . . . 107iLink Electronics, Inc. . . . . . . . . . . . . . . 1041InsulFab PCB Tooling . . . . . . . . . . . . . . . 512Inventec Performance Chemicals . . . . . 230Juki Automation Systems. . . . . . . . . . . . 716

KIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 338Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825Nordson ASYMTEK . . . . . . . . . . . . . . . . 706Northern Electronics Automation . . . . . . 708PACE Incorporated. . . . . . . . . . . . . . . . . 945Pillarhouse USA, Inc. . . . . . . . . . . . . . . . 139Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245Rehm Thermal Systems, LLC. . . . . . . . . 437RPS Automation, LLC . . . . . . . . . . . . . . 807SEHO North America, Inc. . . . . . . . . . . . 635Seica, Inc.. . . . . . . . . . . . . . . . . . . . . . . . 406Seika Machinery, Inc. . . . . . . . . . . . . . . . 707Senju Comtek Corporation. . . . . . . . . . . 412Speedline Technologies . . . . . . . . . . . . . 124STI Electronics, Inc. . . . . . . . . . . . . . . . . 609Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010Vitronics Soltec. . . . . . . . . . . . . . . . . . . . 913

Soldering, ManualAGI Corporation . . . . . . . . . . . . . . . . . . . 738Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940American Hakko Products . . . . . . . . . . . 534Apollo Seiko . . . . . . . . . . . . . . . . . . . . . . 411BEST, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 127Computrol Inc. . . . . . . . . . . . . . . . . . . . . 938ERSA North America . . . . . . . . . . . . . . . 539FCT Assembly . . . . . . . . . . . . . . . . . . . . 313Finetech/Martin . . . . . . . . . . . . . . . . . . . 417InsulFab PCB Tooling . . . . . . . . . . . . . . . 512Inventec Performance Chemicals . . . . . 230JBC Tools USA, Inc. . . . . . . . . . . . . . . . . 636Jovy Systems, Limited . . . . . . . . . . . . . . 646Metcal. . . . . . . . . . . . . . . . . . . . . . . . . . . 816O.C. White Company . . . . . . . . . . . . . . 1001PACE Incorporated. . . . . . . . . . . . . . . . . 945Pillarhouse USA, Inc. . . . . . . . . . . . . . . . 139Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245Qualitek International, Inc. . . . . . . . . . . . 538Senju Comtek Corporation. . . . . . . . . . . 412Stanley Supply & Services . . . . . . . . . . 1024STI Electronics, Inc. . . . . . . . . . . . . . . . . 609Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010Technimark, Inc . . . . . . . . . . . . . . . . . . . 239Weller - Apex Tool Group . . . . . . . . . . . . 806

Stencil and Screen Printing5N Plus Micro Powders . . . . . . . . . . . . . 327AGI Corporation . . . . . . . . . . . . . . . . . . . 738Alpha . . . . . . . . . . . . . . . . . . . . . . . . . . . 321Alpha Recycling Services. . . . . . . . . . . 1006Apex Factory Automation. . . . . . . . . . . . 735ASC International . . . . . . . . . . . . . . . . . . 518Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219ASM Assembly Systems . . . . . . . . . . . . 225ASYS Group Americas, Inc. . . . . . . . . . . 835BEST, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 127ERSA North America . . . . . . . . . . . . . . . 539ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335Europlacer Americas’ . . . . . . . . . . . . . . . 637FCT Assembly . . . . . . . . . . . . . . . . . . . . 313Fuji America Corporation . . . . . . . . . . . . 107iLink Electronics, Inc. . . . . . . . . . . . . . . 1041InsulFab PCB Tooling . . . . . . . . . . . . . . . 512Jovy Systems, Limited . . . . . . . . . . . . . . 646Juki Automation Systems. . . . . . . . . . . . 718Krayden, Inc. . . . . . . . . . . . . . . . . . . . . . 931LaserJob, Inc.. . . . . . . . . . . . . . . . . . . . . 125MET Stencil . . . . . . . . . . . . . . . . . . . . . . 329MicroScreen . . . . . . . . . . . . . . . . . . . . . . 535MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825Northern Electronics Automation . . . . . . 708


Panasonic Factory Solutions of America. . . . . . . . . . . . . . . . . . . . . 213

Photo Etch Technology . . . . . . . . . . . . . 802Precision Placement Machines . . . . . . . 736Quik-Tool . . . . . . . . . . . . . . . . . . . . . . . . 918Speedline Technologies . . . . . . . . . . . . . 124Speedprint Technology. . . . . . . . . . . . . . 821Stanley Supply & Services . . . . . . . . . . 1024StenTech, Ltd. . . . . . . . . . . . . . . . . . . . . 129Technimark, Inc . . . . . . . . . . . . . . . . . . . 239Universal Instruments Corporation. . . . . 306Yamaha-Trans Tec America . . . . . . . . . . 813

Tape and ReelAccurate Carriers USA . . . . . . . . . . . . . . 717Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940Alpha . . . . . . . . . . . . . . . . . . . . . . . . . . . 321Alpha Recycling Services. . . . . . . . . . . 1006Conductive Containers, Inc.. . . . . . . . . . 317Europlacer Americas’ . . . . . . . . . . . . . . . 637GPD Global . . . . . . . . . . . . . . . . . . . . . . 305Mid-America Taping & Reeling . . . . . . . . 540Northern Electronics Automation . . . . . . 708

Test & Measurement Equipment — OtherAcculogic, Inc. . . . . . . . . . . . . . . . . . . . . 800Akrometrix, LLC . . . . . . . . . . . . . . . . . . . 134ASC International . . . . . . . . . . . . . . . . . . 518Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219Aven, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 235Creative Electron, Inc. . . . . . . . . . . . . . . 516CyberOptics Corporation . . . . . . . . . . . . 814FKN Systek. . . . . . . . . . . . . . . . . . . . . . . 933GPD Global . . . . . . . . . . . . . . . . . . . . . . 305iLink Electronics, Inc. . . . . . . . . . . . . . . 1041InsulFab PCB Tooling . . . . . . . . . . . . . . . 512Ironwood Electronics . . . . . . . . . . . . . . . 818JTAG Technologies. . . . . . . . . . . . . . . . . 939KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445Mirtec Corporation . . . . . . . . . . . . . . . . . 407National Technical Systems . . . . . . . . . 1035Nikon Metrology . . . . . . . . . . . . . . . . . . . 340Nordson DAGE. . . . . . . . . . . . . . . . . . . . 606Nordson YESTECH . . . . . . . . . . . . . . . . 606Northern Electronics Automation . . . . . . 708O.C. White Company . . . . . . . . . . . . . . 1001Omron Inspection Systems . . . . . . . . . . 436RPS Automation, LLC . . . . . . . . . . . . . . 807Scienscope. . . . . . . . . . . . . . . . . . . . . . . 544Sonoscan, Inc. . . . . . . . . . . . . . . . . . . . . 424Specialty Coating Systems


(Parylene Service) . . . . . . . . . . . . . . . 941Stanley Supply & Services . . . . . . . . . . 1024TAGARNO. . . . . . . . . . . . . . . . . . . . . . . . 224Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010Teradyne, Inc. . . . . . . . . . . . . . . . . . . . . . 234Test Research, Inc. . . . . . . . . . . . . . . . . . 712Texmac, Inc (Takaya) . . . . . . . . . . . . . . . 320The Test Connection, Inc.. . . . . . . . . . . . 410XJTAG. . . . . . . . . . . . . . . . . . . . . . . . . . 1020

Test, AutomatedAcculogic Inc.. . . . . . . . . . . . . . . . . . . . . 800AGI Corporation . . . . . . . . . . . . . . . . . . . 738ASC International . . . . . . . . . . . . . . . . . . 518Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219Cogiscan . . . . . . . . . . . . . . . . . . . . . . . 1038Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938Creative Electron, Inc. . . . . . . . . . . . . . . 516

CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226CyberOptics Corporation . . . . . . . . . . . . 814iLink Electronics, Inc. . . . . . . . . . . . . . . 1041JTAG Technologies. . . . . . . . . . . . . . . . . 939KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445Mentor Graphics Corporation,

Valor Division. . . . . . . . . . . . . . . . . . . 634National Technical Systems . . . . . . . . . 1035Nikon Metrology . . . . . . . . . . . . . . . . . . . 340Northern Electronics Automation . . . . . . 708Omron Inspection Systems . . . . . . . . . . 436Quik-Tool . . . . . . . . . . . . . . . . . . . . . . . . 918RPS Automation, LLC . . . . . . . . . . . . . . 807Seica, Inc.. . . . . . . . . . . . . . . . . . . . . . . . 406Seika Machinery, Inc. . . . . . . . . . . . . . . . 707Sonoscan, Inc. . . . . . . . . . . . . . . . . . . . . 424Teradyne, Inc. . . . . . . . . . . . . . . . . . . . . . 234Test Research, Inc. . . . . . . . . . . . . . . . . . 712Texmac, Inc (Takaya) . . . . . . . . . . . . . . . 320The Test Connection, Inc.. . . . . . . . . . . . 410Vi TECHNOLOGY. . . . . . . . . . . . . . . . . . 807YXLON FeinFocus . . . . . . . . . . . . . . . . . 128

Test, ManualAGI Corporation . . . . . . . . . . . . . . . . . . . 738Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938Creative Electron, Inc. . . . . . . . . . . . . . . 516Ironwood Electronics . . . . . . . . . . . . . . . 818KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445Mid-America Taping & Reeling . . . . . . . . 540National Technical Systems . . . . . . . . . 1035Omron Inspection Systems . . . . . . . . . . 436Sonoscan, Inc. . . . . . . . . . . . . . . . . . . . . 424Teradyne, Inc. . . . . . . . . . . . . . . . . . . . . . 234Test Research, Inc. . . . . . . . . . . . . . . . . . 712The Test Connection, Inc.. . . . . . . . . . . . 410YXLON FeinFocus . . . . . . . . . . . . . . . . . 128

Tooling and FixturesAccurate Carriers USA . . . . . . . . . . . . . . 717AGI Corporation . . . . . . . . . . . . . . . . . . . 738Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940CMK America Corporation . . . . . . . . . . . 745Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938Europlacer Americas’ . . . . . . . . . . . . . . . 637FKN Systek. . . . . . . . . . . . . . . . . . . . . . . 933iLink Electronics, Inc. . . . . . . . . . . . . . . 1041InsulFab PCB Tooling . . . . . . . . . . . . . . . 512Ironwood Electronics . . . . . . . . . . . . . . . 818Mid-America Taping & Reeling . . . . . . . . 540Precision Placement Machines . . . . . . . 736Quik-Tool . . . . . . . . . . . . . . . . . . . . . . . . 918RPS Automation, LLC . . . . . . . . . . . . . . 807Sovella Inc/The Daylight Company . . . . 907Speedline Technologies . . . . . . . . . . . . . 124StenTech, Ltd. . . . . . . . . . . . . . . . . . . . . 129Stone Mountain Tool, Inc.. . . . . . . . . . . . 607Technimark, Inc . . . . . . . . . . . . . . . . . . . 239The Test Connection, Inc.. . . . . . . . . . . . 410

Tooling Equipment & SuppliesAGI Corporation . . . . . . . . . . . . . . . . . . . 738Europlacer Americas’ . . . . . . . . . . . . . . . 637FKN Systek. . . . . . . . . . . . . . . . . . . . . . . 933InsulFab PCB Tooling . . . . . . . . . . . . . . . 512Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344O.C. White Company . . . . . . . . . . . . . . 1001Sovella Inc/The Daylight Company . . . . 907Speedline Technologies . . . . . . . . . . . . . 124Stanley Supply & Services . . . . . . . . . . 1024Stone Mountain Tool, Inc.. . . . . . . . . . . . 607

Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010TOPLINE. . . . . . . . . . . . . . . . . . . . . . . . . 435

Training, Education, and ComplianceAmerican Hakko Products . . . . . . . . . . . 534BEST, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 127CIRCUITS ASSEMBLY . . . . . . . . . . . . . . 601EPTAC Corporation . . . . . . . . . . . . . . . . 746Europlacer Americas’ . . . . . . . . . . . . . . . 637IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 744iTAC Software, AG . . . . . . . . . . . . . . . . 1027Mentor Graphics Corporation,

Valor Division. . . . . . . . . . . . . . . . . . . 634National Technical Systems . . . . . . . . . 1035Northern Electronics Automation . . . . . . 708PACE Incorporated. . . . . . . . . . . . . . . . . 945RPS Automation, LLC . . . . . . . . . . . . . . 807SEHO North America, Inc. . . . . . . . . . . . 635SMT Today . . . . . . . . . . . . . . . . . . . . . . . 446SMTA . . . . . . . . . . . . . . . . . . . . . . . . . LobbySpeedline Technologies . . . . . . . . . . . . . 124STI Electronics, Inc. . . . . . . . . . . . . . . . . 609Texwipe . . . . . . . . . . . . . . . . . . . . . . . . . 439The Test Connection, Inc.. . . . . . . . . . . . 410Weller - Apex Tool Group . . . . . . . . . . . . 806

Vision SystemsAOI Systems. . . . . . . . . . . . . . . . . . . . . . 444Apex Factory Automation. . . . . . . . . . . . 735ASC International . . . . . . . . . . . . . . . . . . 518CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335FSInspection . . . . . . . . . . . . . . . . . . . . . 946iLink Electronics, Inc. . . . . . . . . . . . . . . 1041Juki Automation Systems. . . . . . . . . . . . 716Mek. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1040National Technical Systems . . . . . . . . . 1035Nikon Metrology . . . . . . . . . . . . . . . . . . . 340Northern Electronics Automation . . . . . . 708O.C. White Company . . . . . . . . . . . . . . 1001Omron Inspection Systems . . . . . . . . . . 436RS Simmons Co., LLC . . . . . . . . . . . . . . 936Scienscope. . . . . . . . . . . . . . . . . . . . . . . 544SEHO North America, Inc. . . . . . . . . . . . 635Simplimatic Automation . . . . . . . . . . . . 1018Stanley Supply & Services . . . . . . . . . . 1024TAGARNO. . . . . . . . . . . . . . . . . . . . . . . . 224Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010Vi TECHNOLOGY. . . . . . . . . . . . . . . . . . 807Viscom . . . . . . . . . . . . . . . . . . . . . . . . . . 506

X-Ray and XRFApex Factory Automation. . . . . . . . . . . . 735Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938Creative Electron, Inc. . . . . . . . . . . . . . . 516Glenbrook Technologies, Inc. . . . . . . . . . 819iLink Electronics Inc. . . . . . . . . . . . . . . 1041National Technical Systems . . . . . . . . . 1035Nikon Metrology . . . . . . . . . . . . . . . . . . . 340Nordson ASYMTEK . . . . . . . . . . . . . . . . 706Nordson DAGE. . . . . . . . . . . . . . . . . . . . 606Northern Electronics Automation . . . . . . 708Omron Inspection Systems . . . . . . . . . . 436Oxford Instruments. . . . . . . . . . . . . . . . . 537PACE Incorporated. . . . . . . . . . . . . . . . . 945Saki America, Inc.. . . . . . . . . . . . . . . . . 1025Scienscope. . . . . . . . . . . . . . . . . . . . . . . 544STI Electronics, Inc. . . . . . . . . . . . . . . . . 609Viscom . . . . . . . . . . . . . . . . . . . . . . . . . . 506YXLON FeinFocus . . . . . . . . . . . . . . . . . 128


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Exhibitors Index

327 5N Plus, Inc. .................................. 327Acculogic, Inc. ..................................... 800Accurate Carriers USA ......................... 717ACE Production Technologies ............. 426ACL Staticide, Inc. ............................... 331Aegis Industrial Software Corporation .................................... 440AGI Corporation .................................. 738AIM Solder ........................................... 413Akrometrix, LLC ................................... 134Alltemated Inc. .................................... 940Alpha ................................................... 321Alpha Recycling Services .................. 1006American Hakko Products, Inc. ........... 534American Standard Circuits, Inc. ......... 801Amitron Corporation ............................ 536AOI Systems ........................................ 444Apex Factory Automation .................... 735Apollo Seiko ........................................ 411ASC International, Inc. ......................... 518Ascentech, LLC ................................... 219ASM Assembly Systems (SIPLACE & DEK) ............................ 225ASYS Group Americas ........................ 835ATV Technologies ................................ 841Aven Inc. .............................................. 235BEST Inc. ............................................. 127BOFA Americas ................................. 1000BTU International ................................. 734CalcuQuote ....................................... 1046Circuits Assembly ................................ 601CMK America Corporation .................. 745Cogiscan ........................................... 1038Computrol, Inc. .................................... 938Conductive Containers, Inc. ................ 317Conecsus, LLC .................................... 110Creative Electron ................................. 516Crystal Mark, Inc. ................................ 319CTI Systems ........................................ 226CyberOptics Corporation .................... 814Dimation, Inc. ...................................... 934DIVSYS, International, LLC ............... 1008ELANTAS PDG, Inc. ............................. 318Electronic Assembly Products, Ltd ..... 807Electronics World Publishing ............... 929Electrotek Corporation ......................... 420Eltek USA, Inc. .................................... 140EPTAC Corporation ............................. 746ERSA North America ........................... 539ESSEMTEC USA ................................. 335Europlacer Americas’ .......................... 637EVS International ................................. 142FCT Assembly ..................................... 313Finetech ............................................... 417FKN Systek .......................................... 933FlexLink Systems, Inc. ........................ 107FSInspection ....................................... 946Fuji America Corporation ..................... 107Geib Refining Corporation ................. 1033Glenbrook Technologies ...................... 819Global SMT .......................................... 919GPD Global, Inc. .................................. 305Heller ................................................... 107

Henkel Electronic Materials, LLC ........ 701HEPCO Inc. ......................................... 416Heraeus Electronics ............................ 845Hi-Rel Laboratories ............................. 909 I-Connect ............................................. 104IDENTCO ........................................... 1030IKEUCHI USA, INC. ............................. 902iLink Electronics Inc. ......................... 1041Indium Corporation ............................. 430Infinite Graphics Incorporated ............. 925Inovaxe Corporation ............................ 713Inspection Feature Area .................... 1050InsulFab PCB Tooling .......................... 512INVENTEC Performance Chemicals .... 230IPC ....................................................... 744Ironwood Electronics ........................... 818iTAC Software, AG ............................. 1027JBC Tools ............................................ 636Jovy Systems ...................................... 646JTAG .................................................... 939Juki Automation Systems .................... 716Kester .................................................. 131KIC ....................................................... 338Koh Young America, Inc. ...................... 307 Koki Solder America ............................ 135Krayden ............................................... 931Kulicke & Soffa Industries, Inc. ............ 136KwikTic ................................................ 445KYZEN Corporation ............................. 117LaserJo,b Inc. ...................................... 125MacDermid Electronics Solutions ....... 927MANEX ERP ........................................ 339Materials Evaluation and Engineering, Inc. ........................... 1023Mek Americas .................................... 1040Mentor Graphics Corporation ............. 634MET Stencil ......................................... 329Metro SMT ........................................... 344MicroScreen ........................................ 535Mid America Taping & Reeling, Inc. ..... 540MIRTEC Corporation ........................... 407MYCRONIC ......................................... 825National Technical Systems .............. 1035Nihon Superior Co. Ltd. ....................... 419Nikon Metrology .................................. 340Nitto Kohki USA Inc. ............................ 917Nordson ASYMTEK ............................. 706Nordson DAGE .................................... 606Nordson YESTECH ............................. 606North Dakota Department of Commerce .................................. 1028Northern Electronics Automation ........ 708O.C. White Company ........................ 1001Metcal .................................................. 816Omron Inspection Systems ................. 436Oxford Instruments .............................. 537PACE Incorporated .............................. 945Panasonic Factory Solutions Company of America ....................... 213Photo Etch Technology ....................... 802Pillarhouse ........................................... 139PPG Industries, Semco® Packaging & Application Systems ....................... 641

Precision Placement Machines ........... 736Prototron Circuits ................................ 418Purex ................................................... 245Qualltek International, Inc. ................... 538Quik-Tool, LLC ..................................... 918Rehm Thermal Systems, LLC .............. 437RPS Automation, LLC ......................... 807RS Simmons ........................................ 936Saki America, Inc. .............................. 1025Samsung C&T Automation, Inc. .......... 739Schoeller-Electronics GmbH ............... 935Scienscope .......................................... 544SEHO North America, Inc. ................... 635Seica .................................................... 406Seika Machinery .................................. 707Senju Comtek Corporation .................. 412Shenzhen D.M. Electronic Limited ...... 900Simplimatic Automation .................... 1018SMTA ............................................... LobbySMT Net .............................................. 132SMT Today .......................................... 446SOMACIS SpA .................................... 911Sonoscan, Inc. ..................................... 424Sovella/Daylight ................................... 907Specialty Coating Systems (Equipment) ..................................... 434Specialty Coating Systems (Parylene Service) ........................... 941Speedline Technologies ....................... 124Speedprint Technology ........................ 821Stanley Supply & Services ................ 1024StenTech .............................................. 129STI Electronics .................................... 609Stone Mountain Tool, Inc. .................... 607Super Dry .......................................... 1034TAGARNO ............................................ 224Technical Devices Company ............... 807Technimark, Inc. .................................. 239Techni-Tool ........................................ 1010Teka Interconnection Systems ............ 325Teradyne, Inc. ...................................... 234Test Research, Inc. .............................. 712Texmac/Takaya Inc. ............................. 320Texwipe ............................................... 439The Test Connection, Inc. .................... 410Tintronics Industries ............................ 341TOPLINE .............................................. 435TTnS, Inc. ............................................ 638Universal Instruments Corporation ...... 306US Tech ............................................... 901Vi Technology ...................................... 807Viscom, Inc. ......................................... 506Vitronics Soltec .................................... 913Weller - Apex Tool Group .................... 806XJTAG ................................................ 1020Yamaha - Trans-Tec America ............... 813YINCAE Advanced Materials, LLC ...... 237Yole Développement ......................... 1031YXLON FeinFocus ............................... 128ZESTRON ............................................ 616Zymet .................................................. 441


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62 >> 2015 SMTA International SHOW DIRECTORY

Donald E. Stephens Convention Center Floor Plan

62 >> 2015 SMTA International SHOW DIRECTORY SMTAssociation @SMTAorg #SMTAI

donald e. stephens convention center rosemont, illinois · design and assembly new! 8:30am –...

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