disassembly monito 200811115115

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Product End-of-Life Disassembly InstructionsProduct Category: Monitors and Displays

Marketing Name / Model[List multiple models if applicable.]

HP w2338h

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructionsfor the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EUdirective 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, asapplicable.

Item Description Notes

Quantityof itemsincludedin product

Printed Circuit Boards (PCB) or Printed CircuitAssemblies (PCA)

With a surface greater than 10 sq cm 3

B tt i All t i l di t d d lk li d lithi i 0


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B tt i All t i l di t d d lk li d lithi i 0

Components, parts and materials containingrefractory ceramic fibers

0

Components, parts and materials containingradioactive substances

0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where componentsand materials requiring selective treatment can be removed.

Tool Description Tool Size (if applicable)

ESD wrist ring Wrist which forfend static 1

ESD glove Glove which forfend static 1

Screwdriver type:3220/5200shank type2#=5mmL=85mm 1

Screwdriver type:3220/5200shank type hexagram=5mmL=85mm 1

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Dismantle the screws of standget down the stand

2. Dismantle BEZEL

3. Dismantle the buttonpull out the pin of KEPC board ,get down the KEPC board

4. Pull out the PIN of power of key board ,and get down it5. Rdismantle REAR COVER6. Dismantle the D-SUB screws and HDMI screws7. Pull out the pin of speaker , get down the right and left speaker .8. Pull out the PIN of lamp9. Dismantle the screws of PANEL

10. Pull out the PIN of FFC cabel separate the mainframe and PANEL

11. Dismantle the screws of main board and PWPC board12. First :tear off the black tape ;Second: pull out the connector PIN which connect PWPC and main board;Third: take off

both boards


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1

HP w2338h disassembly SOP

FROMIE/NPI/huijuan.ye

DATESEP-17-08


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1. dismantle the screws of standget down the stand


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2. dismantle BEZEL


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3. dismantle the buttonpull out the pin of KEPC board ,getdown the KEPC board


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4.pull out the PIN of power of key board ,and get down it


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5. dismantle REAR COVER


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6. dismantle the D-SUB screws and HDMI screws


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7. pull out the pin of speaker , get down the right and left speaker


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8.pull out the PIN of lamp


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9. dismantle the screws of PANEL


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10.pull out the PIN of FFC cabel separate themainframe and PANEL


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11. dismantle the screws of main board and PWPC board


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12. First :tear off the black tape

Second: pull out the connector PIN which connect

PWPC and main board

Third: take off both boards


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13.pull out the pin of KEPC cable and FFC cable

disassembly monito 200811115115

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