dielectric microspacer technology - apre · dms = dielectric microspacer technology • dms solves...

Daniele M. Trucchi - [email protected] Rome, November 20th, 2017

Dielectric MicroSpacer Technology


Production Method of Electrical Energy by Enhanced Thermal Electron Emission by the Use of Superior Semiconductors – ProME3ThE2US2

Grant agreement no.: 308975

Basic Research

Applied Research

High-Tech SMEs

Multinational Industry

ProME3ThE2US2 / FET-ENERGY

Duration: 3 years (May 2013 - Apr 2016) •Total Project Cost: 4.3 M€ •Total EU Funding: 3.0 M€


CATHODE ANODE

Vacuum enclosure (pressure as low as

possible)

ZLOAD

PETE devices utilize both photonic and thermal processes for energy conversion, and are not subject to either the Shockley-Queisser limit or the thermal limit (Carnot): conversion efficiency up to 70% ** **G. Segev, Y. Rosenwaks, A. Kribus, Solar Energy Materials & Solar Cells 140 (2015) 464

PETE* devices can be defined as high-temperature cells for solar concentrating systems, since they avoid the limitations of junction cells and even benefit from high operating temperatures *J. Schwede,et al., Nature Materials 9 (2010) 762

Secondary conversion

system

ProME3ThE2US2 – High-Temperature Solar Cells

CONCENTRATED SOLAR

RADIATION

Applications: • Domestic use • Rural environment use • Solar Towers


Testing under high-flux solar radiation

200 300 400 500 600 700 800

ne / n

ph (

a.u.)

T (°C)

PETE demonstrated for the FIRST TIME

under relevant conditions!

Experiment


More details on www.prometheus-energy.eu

III-V semiconductor photocathodes

Black diamond

films

Diamond photocathodes

Dielectric microspacer technology


Vacuum and Plasma

Technology

Dielectric MicroSpacers

DMS = Dielectric MicroSpacer technology

• DMS solves the technical problem of establishing a fixed and stable physical gap of few micrometers (up to 10 m) between two flat surfaces at very different temperature (i.e. hundreds of Celsius degrees).

• DMS is based on the development of microstructures which can be arranged according to a periodic and/or any desired design.

• Microstructures are dielectric, thus ensuring also: 1) electrical insulation between the surfaces and 2) thermal insulation when surfaces have to operate at different temperatures.

Public Research Centre

SME with the mission to commercialize and transfer

technology developed by the hi-tech SME

Hi-tech SME

DMS / FET-Launchpad

Grant agreement no.: 754568

Duration: 18 months (Apr 2017 - Sep 2018) •Total Project Cost/Funding: 100 k€


Objectives of the action

1. Expanding the potential of the technique by analysing possible improvements at an industrial level (up-scaling, production maximization, etc.);

2. Analysing possible other technologies needing the application of the DMSs in order to enlarge the technological impact;

3. Protecting the developed technology by preparing and submitting at least one international patent application;

4. Analysing the market and business opportunities on the basis of a document prepared by external business advisory services;

5. Drafting an exploitation plan for the specific proposed technology;

6. Individuating and contacting possible large industries for a technology transfer (licence agreement) for future production at large scales.

DMS / FET-Launchpad


Activities of the action

Technology Improvements & Protection

Analysis of the possible improvements

Analysis of the potential applications

Patenting process

Exploitation plan

Study of the DMS technology transfer

Technology Transfer

Market analysis of DMS large production

International Patent Application

Technology transfer to large industry(ies) Project main outputs

DMS / FET-Launchpad


Technical problem to be solved

Dielectric MicroStructures solve the technical problem of establishing a fixed and stable physical gap of few micrometers (up to 10 m) between two flat surfaces at very different temperature (i.e. hundreds of Celsius degrees) with electrical insulation.

Since the 60s, efficiency of thermal-to-electric energy converters was limited to 10-15% throwing away an additional 20-60%

Dielectric MicroSpacers

DMS allows the conversion of heat close to the ideal conditions!

Not only: the application of DMS could solve shortcut problems in microelectronics (like in flat screens)!!!


Advantages with respect to present technology:

• deposition temperature close to room temperature -> standard microtechnology tools;

• high lateral and vertical resolution (down to tens of nanometres);

• the low lateral size reduces drastically the contact area, thus minimizing the thermal flow between the two separated surfaces;

• Made of material with excellent electrical and thermal insulation, as well as able to sustain operations at very high temperature;

• upscaling of the technology on large surfaces (up to squared meters)

The Technology


Applications

Nuclear energy recovery

Heat recovery from high-temperature

reactors

Geothermal energy Industrial furnaces and metallurgic processes

Aerospace energy recovery

Long-term Medium-term Short-term

Automotive & Aeronautical Transport

Concentrated solar energy

Impact

Microelectronics


The Market(s)

Long-term Medium-term Short-term

Nuclear energy recovery

• 444 worldwide + 63 new nuclear plants • 2 M€ cost to the customer per conversion

system (50% of revenue) • 10% of which per DMS technology • Market share = 100 M€ + 20 M€/year

maintainance

Efficiency increases from +50 to +250%: technological competitive advantage

Aerospace energy recovery • Space mission cost = 3 B€ • Space missions: 1/year worldwide • Supposing 1% cost to conversion

system and 10% of which to DMS, • 3 M€/year of market share

Industrial furnaces and metallurgic processes

• Exploitable exhaust heat = 9,000 MW • Conversion efficiency of 25%: • 2,250 MW can be recovered. • Cost of 1 kWh = 0.05 € • Market share of 1 B€/year only for

the USA.

Exhaust heat in US industries

Impact


Project call: FET-Open 7 partners

• 3 Universities • 3 R&D Centers • 1 SME

Budget: 3.270.496,25 € Duration: Jan 2017 – Dec 2019 Coordinator: UPM (Spain)

“Next Generation Materials and Solid State Devices for Ultra High Temperature Energy Storage and Conversion”

AMADEUS / FET-OPEN


http://www.amadeus-project.eu/ https://youtu.be/D7huVnCnK8s

AMADEUS / FET-OPEN

https://youtu.be/D7huVnCnK8s







dielectric microspacer technology - apre · dms = dielectric microspacer technology • dms solves...

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