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IJSRD - International Journal for Scientific Research & Development| Vol. 3, Issue 01, 2015 | ISSN (online): 2321-0613
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Design and Analysis of Different Type Single Bit Adder for ALU
Application Jaswant Singh
1 Gaurav Sharma
2
1Research Scholar M.Tech (VLSI)
2Assistant Professor
1,2Department of Electronics & Communication Engineering
1,2Mewar University, Chittoragarh
Abstract— In these dissertation four types of 1-bit adder has
been designed and simulated using 180nm CMOS
technology in tanner tool at a various supply voltage
from1.0V to 1.8 V & compare their results with respect to
various parameters like delay, area & power consumption.
The adder is the most commonly used arithmetic block of
the Central Processing Unit (CPU) and Digital Signal
Processing (DSP), therefore its performance and power
optimization is of utmost importance. With the technology
scaling to deep sub-micron, the speed of the circuit increases
rapidly. Due to continuous scaling of the transistor size and
reduction of the operating voltage has led to a significant
performance improvement of integrated circuits. Low power
consumption and smaller area are some of the most
important criteria for the fabrication of DSP systems and
high performance systems. At the same time, the power
consumption per chip also increases significantly due to the
increasing density of the chip. Therefore comparison has
been carried out by assuming the circuits with minimum size
transistors, to minimize the power consumption. Power
consumption is a function of load capacitance, frequency of
operation, and supply voltage. A reduction of any one of
these parameter is beneficial. A reduction in power
consumption provides several benefits. Less heat is
generated, which reduces problems associated with high
temperature, such as the need for heat sinks. This provides
the consumer with a product that costs less.
Key words: Central Processing Unit (CPU), Digital Signal
Processing (DSP), CMOS technology
I. INTRODUCTION
Rapid growth in semiconductor technology has led to
shrinking of feature sizes of transistors using deep
submicron (DSM) process. Modern portable battery
operated devices such as cell phones, laptops; PDAs are
particularly affected by this as high power dissipation
reduces battery service life. The adder is the most
commonly used arithmetic block of the Central Processing
Unit (CPU) and Digital Signal Processing (DSP), therefore
its performance and power optimization is of utmost
importance. With the technology scaling to deep sub-
micron, the speed of the circuit increases rapidly. At the
same time, the power consumption per chip also increases
significantly due to the increasing density of the chip.
Therefore, in realizing modern Very Large Scale Integration
(VLSI) circuits, low-power and high-speed are the two
predominant factors which need to be considered. Like any
other circuits' design, the design of high-performance and
low-power adders can be addressed at different levels, such
as architecture, logic style, layout, and the process
technology. As the result, there always exists a trade-off
between the design parameters such as speed, power
consumption, and area. Recently, the requirement of
probability and the moderate improvement in battery
performance indicate power dissipation is one of the most
critical design parameters day by day the demand of
probability and mobility is increasing.
Also the area of chip design is taken into
consideration while talking about probability. Hence three
most widely accepted parameters to measure the quality of a
circuit or to compare various circuit styles are area, delay
and power dissipation. There are three major sources of
power consumption in digital CMOS circuits, which are
summarized in the following equation
LeakageCircuitShortSwitchingTotal PPPP
The first term represents the switching component
of power. The short circuit power dissipation is due to the
direct path from short circuit currents Isc, which arises when
both the NMOS and PMOS transistors are active,
conducting current directly from power supply to ground.
Finally, leakage current power dissipation arises from
substrate injection and sub threshold effects, which is
primarily determined by fabrication technology
considerations. The objective of our dissertation is to design
a low-power and smaller area adder and also compare its
performance parameter with different types of adder
architecture
II. BASIC THEORY AND TYPES OF ADDER
Adders are commonly used in the critical path of many
building blocks of microprocessors and digital signal
processing chips. Adders are critical component not only for
addition, but also for subtraction, multiplication, and
division. Addition is one of the fundamental arithmetic
operations. A fast and accurate operation of a digital system
is greatly influenced by the performance of the resident
adders. The most important parameter for measuring the
quality of adder designs is propagation delay, and area.
Adder or summer is a digital circuit that performs
addition of numbers. In modern computers adders reside in
the arithmetic logic unit (ALU) where other operations are
performed. Although adders can be constructed for many
numerical representations, such as Binary-coded decimal or
excess-3, the most common adders operate on binary
numbers.
A. Application of Adders:
Used in CPU side
Used in networking side
Used in DSP oriented system
In application-specific processors
In biomedical applications
In image processing and video processing.
Design and Analysis of Different Type Single Bit Adder for ALU Application
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B. DGTAL Adder:
20 transistor full adder based on transmission gate produces
buffered outputs of proper polarity for both sum and carry.
In this circuit 2 inverters are followed by two transmission
gates which act as 8-T XOR. Subsequently 8-T XNOR
module follows. To has 4 transistors XOR which in the next
stage is inverted to produce XNOR. These XOR and XNOR
are used generate sum; Cin and inC are multiplexed which
can simultaneously to generate sum. The signals cin is
controlled either by (a. b) or (a ⊗ b). Similarly the cout can
be calculated by multiplexing a and cin controlled by (a b).
The power dissipation in this circuit is more than the 28
transistor. Schematic diagram of DGTAL based adder is
shown in fig 1
Fig. 1: Schematic Diagram of DGTAL Adder
Fig. 2: Layout Diagram of DGTAL Adder
C. CMOS Adder:
The conventional CMOS adder cell using 28 transistors is
based on standard CMOS topology which is shown below in
fig 3. Due to large number of transistors, its power
consumption is high. Large PMOS transistor in pull up
network result in high input capacitances, which cause high
delay and dynamic power consumption. One of the most
significant advantages of this full adder was its high noise
margins and thus reliable operation at low voltages.
Design and Analysis of Different Type Single Bit Adder for ALU Application
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Fig. 3: Schematic Diagram of conventional CMOS Adder
Layout diagram of conventional CMOS adder is shown
below in fig 4, which consume 728µm2 area.
Fig. 4: Layout Diagram of conventional CMOS Adder
D. GDI Adder:
A new low power design technique that solves most of the
problems is known as Gate-Diffusion-Input (GDI) method.
This technique reduces power consumption, propagation
delay, and area of digital circuits. GDI method is based on
the use of a simple cell as shown in below figure. At the first
look the design seems to be like an inverter, but the main
differences are
GDI consist of three inputs- G (gate input to
NMOS/PMOS), P (input to source of PMOS) and
N (input to source of NMOS).
Bulks of both NMOS and PMOS are connected to
N or P (respectively), so it can be arbitrarily biased
at contrast with CMOS inverter.
By using this method a wide variety of logic functions can
be implemented using only two transistors. Schematic
diagram of GDI based adder is shown in fig 5.
Design and Analysis of Different Type Single Bit Adder for ALU Application
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Fig. 5: Schematic Diagram of GDI Adder
This method is also suitable for designing fast, low-
power circuits, using a less number of transistors, while
improving logic level swing and static power characteristics
and allowing simple top down design by using small cell
library. Schematic and layout diagram of GDI adder is
shown in fig and fig respectively. GDI adder consumes total
360 µm2 area.
Fig. 6: Layout Diagram of GDI Adder
E. RBSD Adder:
RBSD numbers can be represented using the digit set (
1,0,1 ) unlike binary number system, which is represented
using binary digit set (0, 1). The decimal value of RBSD
number can be calculated by following relation
1
0
2n
i
i
ixD
Let the number (4)10 can be represented in binary
as 0100.The same number in RBSD may be represented by
more than one representation i.e. 0011 or 00111 . Hence
in this number system, a number can be represented by more
than one way, so called redundant system. Three steps are
used in RBSD system in which first and second step
generates intermediate data (carry and sum) and third step
gives the final result. Therefore the input numbers can be
added simultaneously in parallel, as there is no rippling of
carry from LSB to MSB. So its speed is fast as compared to
other adders. Schematic diagram & layout diagram of RBSD
adder is shown below in fig 7 & fig 8 respectively. Total
area required for 1-bit RBSD adder is 450 µm2.
Design and Analysis of Different Type Single Bit Adder for ALU Application
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Fig. 7: Schematic Diagram of RBSD Adder
Fig. 8: Layout Diagram of RBSD Adder
III. SIMULATION RESULT AND ANALYSIS
A. DGTAL Adder:
1) Working Principle:
In the circuit we have 2 inverters followed by two
transmission gates which act as 8-T XOR. Subsequently 8-T
XNOR module follows. To generate sum, cin and cinb are
multiplexed which can controlled either by (a b) or (a
⊗b).Similarly the cout can be calculated by multiplexing a
and cin which is controlled by (a b). Simulated waveform of
DGTAL full adder is shown in fig 9.
Fig. 9: Simulated waveform of DGTAL Adder
Design and Analysis of Different Type Single Bit Adder for ALU Application
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2) Advantage:
It is the fastest adder. The circuit is simpler than the
conventional adder.
3) Disadvantage:
The power dissipation in this circuit is more than the 28T
adder.
Parameters like delay and power dissipation is
calculated at different VDD and at different VTH, which is
shown in table 1 and 2 respectively.
VDD(V) Power Dissipation (µW) Delay(nS)
Sum Cout
1.8 129.585 4.040 5.211
1.6 109.165 4.948 6.068
1.4 87.255 5.383 6.316
1.2 69.955 6.138 6.968
1.0 40.635 6.954 7.367
Table 1: Parameters of DGTAL adder at different VDD
VTH(V) Power Dissipation (µW) Delay(nS)
Sum Cout
0.17 66.08 1.8710 5.0996
0.27 95.06 2.1715 5.7000
0.37 129.58 3.5799 6.2117
0.47 147.52 3.9199 6.8693
0.57 179.90 5.6646 7.0703
Table 2: Parameters of DGTAL adder at different VTH
B. CMOS Adder:
1) Advantages:
One of the most significant advantages of this full adder is
its high noise margins and thus reliable operation at low
voltages. The layout of CMOS gates was also simplified due
to the complementary transistor pairs.
2) Disadvantages:
Due to large number of transistors, dissipate more power
and require large silicon area.
Fig. 10: Simulated waveform of CMOS Adder
Parameters like delay and power dissipation is
calculated at different VDD and at different VTH, which is
shown in table 3 and 4 respectively.
VDD(V) Power Dissipation(µW) Delay(nS)
Sum Cout
1.8 117.485 0.304 2.843
1.6 101.76 0.378 2.879
1.4 88.13 0.502 3.118
1.2 63.75 0.674 3.341
1.0 38.46 1.101 4.233
Table 3: Parameters of CMOS adder at different VDD
VTH(V)
Power Dissipation(µW)
Delay(nS)
Sum Cout
0.17 57.915 0.242 2.785
0.27 89.672 0.265 2.806
0.37 117.485 0.341 2.943
0.47 139.195 0.387 3.073
0.57 173.165 0.499 3.922
Table 4: Parameters of CMOS adder at different VTH
C. GDI Adder:
Simulated waveform of GDI based full adder is shown in fig
10. Sum bit is obtained from
Design and Analysis of Different Type Single Bit Adder for ALU Application
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Fig 10: Simulated waveform of GDI based Adder
The output of the second stage of XOR circuit
while Carry bit (Cout) is calculated by multiplexing B and
Cin controlled by (A XNOR B). When both inputs (va and
vb) and carry in (vc) is logic „1‟ then both outputs sum and
carry out (Cout). When even number of inputs to the adder
are logic „1‟, then sum is „0‟ and Cout is logic „1‟ & for odd
numbers of input sum output is logic „1‟ and Cout is „0‟as
shown in fig 10.
1) Advantage:
These features give the GDI cell two extra input pins to use
which makes it flexible than usual CMOS design. It is also a
genius design which is very power efficient without using
large amount of transistor count.
2) Disadvantage:
Major problem of GDI method is that twin-tub CMOS or
silicon on insulator (SOI) process is used to fabricate. Thus,
it will be more expensive to realize a GDI chip. Moreover if
only standard p-well CMOS process is used, the GDI
scheme will face the problem of lacking driving capability
which makes it more expensive and difficult to realize as a
feasible chip.
Parameters like delay and power dissipation is
calculated at different VDD and at different VTH, which is
shown in table 5 and table 6 respectively.
VDD(V)
Power
Dissipation(µW)
Delay(nS)
Sum Cout
1.8 38.870 1.917 1.930
1.6 31.165 1.958 1.981
1.4 26.841 1.997 2.231
1.2 21.820 2.092 2.932
1.0 18.525 2.324 3.193
Table 5: Parameters of GDI adder at different VDD
VTH (V) Power Dissipation(mW)
Delay(nS)
Sum Cout
0.17 21.44 1.922 1.933
0.27 36.615 1.919 1.932
0.37 58.165 1.917 1.930
0.47 89.925 1.898 1.924
0.57 101.245 1.859 9.142
Table 6: Parameters of GDI adder at different VTH
D. RBSD Adder:
Simulated waveform of RBSD adder is shown below in fig
11.
Fig. 11: Simulated waveform of RBSD Adder
Design and Analysis of Different Type Single Bit Adder for ALU Application
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Parameters like delay and power dissipation is
calculated at different VDD and at different VTH, which is
shown in table 7 and table 8 respectively.
VDD(V) Power
Dissipation(mW)
Delay(nS)
Sum Cout
1.8 0.989 0.221 0.990
1.6 0.721 0.328 1.303
1.4 0.494 0.350 1.510
1.2 0.288 0.393 1.995
1.0 0.130 0.734 2.621
Table 7: Parameters of RBSD adder at different VDD
VTH(V) Power
Dissipation(mW)
Delay(nS)
Sum Cout
0.17 0.165 0.218 0.939
0.27 0.240 0.246 0.950
0.37 0.389 0.321 0.998
0.47 0.485 0.374 1.247
0.57 0.789 0.420 1.467
Table 8: Parameters of RBSD adder at different VTH
Simulated waveform of RBSD adder which is used
for calculation of average power dissipation is shown in fig
5.11. Formula that is used for average power dissipation is
given below
Average Power Dissipation =2
minmax PP
Fig. 12: Simulated power waveform of RBSD Adder
IV. CONCLUSION AND FUTURE SCOPE
This chapter summarize the conclusion for the proposed
design and also explained about future scope.
A. Conclusion:
In this dissertation adder has been designed and simulated
using 180nm CMOS technology of tanner tool at a various
supply voltage from1.0V to 1.8 V & compare their results
with respect to various parameter. The comparison has been
carried out both assuming circuits with minimum transistors
size, to minimize the power consumption. Power
consumption is a function of load capacitance, frequency of
operation, and supply voltage. A reduction of any one of
these is beneficial. A reduction in power consumption
provides several benefits. Less heat is generated, which
reduces problems associated with high temperature, such as
the need for heat sinks. This provides the consumer with a
product that costs less. In this paper we conclude that
The power consumption of GDI based adder is
50% less from RBSD adder but 26% less speed as
compared to conventional RBSD adder.
Speed & power dissipation of CMOS adder is 10%
& 39% less as compared to RBSD.
Also CMOS adder has high noise margin as
compared to other types of adders.
Layouts of these adders are also designed using
Micro wind. From area comparison we see that
area of GDI based adder is 11% less than RBSD
adder.
B. Future Scope:
However some aspects of the goal have been achieved using
this design, but still a better adder can be made by some
improvement in the circuit design. The adder circuit can be
further extended and modified by the following points.
Delay & power dissipation of RBSD adder can be
further reduced by improving circuit design.
Delay of GDI based adder can be also reduced by
improving circuit design.
More adder circuit can be used for comparison.
In this design we use 180 nm technologies but
latest technology 28nm and more can be used for
batter design and analysis.
The delay and power dissipation can also reduce by
using low power and high speed techniques like VTCMOS,
DTCMOS, and Adaptive CMOS and Adiabatic logic
technology.
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