ctia 2013 qualcomm lte band frangmentation

1 Qualcomm Technologies, Incorporated. All Rights Reserved.

LTE Band Fragmentation

Sunil Patil

Director, Product Management

Qualcomm Technologies, Inc.


1:00pm - 1:30pm The 1000x mobile data challenge Innovations in small cells, spectrum and higher efficiency

1:30pm - 2:00pm What is next for HSPA+? And related evolutions; WCDMA+ and S-UMTS

2:00pm - 2:30pm What is next for LTE? LTE Advanced, opportunistic HetNets and LTE Direct

2:30pm - 3:00pm What is next for Wi-Fi? The Wi-Fi evolution, its role in 1000x, connected home and new frontiers

3:00pm - 3:15pm Break

3:15pm - 4:00pm How do we access more spectrum for 1000x? Cleared, Licensed Spectrum (Voluntary Incentive Auction)/Authorized Shared Access (3.5 GHz)/Unlicensed

Spectrum (5 GHz)

4:00pm - 4:30pm Addressing LTE Band Fragmentation RF360 progress, carrier aggregation and more

4:30pm - 5:00pm The 3G/4G multimode roadmap Including LTE Broadcast, VoLTE and voice interworking

1000x, Spectrum Innovation & Chipset Evolution

Speaker: Rasmus Hellberg,

Sr Director, Technical Marketing

Speaker: Prakash Sangam,

Director, Technical Marketing

Speaker: Dean Brenner,

Sr VP, Government Affairs

Speaker: Sunil Patil,

Director, Product Management


Supporting LTE multimode activities globally

Support for over 40 RF bands required

Japan • CDMA/UMTS850

• UMTS/CDMA2100

• UMTS1700

• UMTS/LTE1500 (B11)

• LTE1500 (B21)

• LTE-FDD850

• LTE-FDD900

• LTE-TDD2600 (Bxx)

South Korea • UMTS850

• LTE-FDD850

• UMTS2100

• CDMA1700

• LTE-FDD1800

Australia • UMTS2100

• UMTS850

• UMTS900

• LTE-FDD1800

• LTE-TDD2300

North America • UMTS/CDMA AWS

• UMTS/CDMA1900

• UMTS/CDMA850

• Extended AWS

• LTE-FDD700

• LTE-TDD2600 (B41)

• MSS 1500 (L-Band)

• MSS2100 (S-Band) South America • UMTS2100

• UMTS1800

• UMTS1900

• UMTS850

• LTE-FDD2600

India • CDMA850

• UMTS2100

• UMTS900

• LTE-TDD2300

Europe • UMTS2100

• UMTS900

• CDMA450

• LTE-FDD1800

• UMTS1800

• UMTS2600

• LTE-FDD800

• LTE-FDD2600

• LTE-TDD2100 (B34)

China • UMTS/CDMA2100

• CDMA850

• CDMA450

• TD-SCDMA1900

• TD-SCDMA2000

• LTE-TDD2300

• LTE-TDD2600 (B38)

• LTE-FDD2600


LTE & HSDPA carrier aggregation

LTE CA will allow operators to combine LTE spectrum

− Higher peak and average user data rates

HSDPA carrier aggregation will expand coverage of 42 Mbps

− Takes advantage of expanding UMTS900 footprint

Increased data rates

and lower latencies

for all users in the cell

Utilizes all

spectrum assets

Can more than double

capacity for bursty

applications, e.g., Web apps

MDM 9x25 LTE CA

DC-HSPA +

MSM8974 LTE CA

DC-HSPA+


CA key to high data rates while maximizing use of fragmented spectrum

45+ CA band combinations have been identified in 3GPP

Positioned to lead in LTE carrier aggregation (CA)

Q2 2012 Q1 2013 Future

33 CA combinations

45 CA combinations

60+ CA combinations?

More spectrum

> 20 MHz CA

3 carrier DL aggregation

2 carrier UL aggregation

TDD + FDD CA

24 34 9 11 Inter-band Intra-band Inter-band Intra-band


Connectivity Wi-Fi BT GPS

Our unique advantage Hiding the complexity underneath the most seamless mobile connectivity

22 33

27

35 36 37 38

39 40 41 42 43 1 2 8 3 4 5 6 9

28

34

7 10 11 12

13 14 17 44 18

19

20

21

23 24

25

26 Radio Frequency Bands

GERAN CDMA 1x UMTS TD-SCDMA LTE TDD/FDD EV-DO

LTE

2G/3G

System Selection

Blind Redirection

Redirection w/ Measurements

Reselection

PS Handover

CS Fallback

CSFB w/ SI Tunneling

Single Radio VCC

Handover Techniques (Multiple Can Apply in Each Case) Handover Combinations (Hypothetical Examples)


RF360 : Addressing cellular radio band fragmentation:

40 bands and counting

All-RF CMOS front end example

*As compared to the previous Qualcomm RF solution.

Single SKU Power reduction Improved RF performance PCB area reduction Reduced development time

Goals Multiband, Multimode

Antenna

matching

tuner

Envelope

power

tracker

Power amp

& antenna

switch

RF POP

One solution

Designed for: all

modes all bands

Processor

Modem

RFIC

PMIC

Enabled by:

• System-level solution and performance enhancements

• RF CMOS integration advantages

• Innovative 3D packaging – RF POP™


Summary of Qualcomm RF360 advantages

Global LTE

coverage

Performance Design Efficiency

Reduced

power

Improved

throughput Reduced size

Time to

market

Antenna

matching tuner

Envelope power

tracker

Power amp &

antenna switch

RF POP

Optimized system solution for worldmode LTE


For more information on Qualcomm, visit us at:

www.qualcomm.com & www.qualcomm.com/blog

© 2013 Qualcomm Technologies, Inc. All rights reserved. Qualcomm, Snapdragon, and Gobi are trademarks of

Qualcomm Incorporated, registered in the United States and other countries. Trademarks of Qualcomm

Incorporated are used with permission. Other products and brand names may be trademarks or registered

trademarks of their respective owners.

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ctia 2013 qualcomm lte band frangmentation

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