leading innovation through diversity - qualcomm innovation through diversity. ... gsm wavebands 3g...

© 2015 Toshiba Corporation

Toshiba Electronics Asia Ltd.September 16, 2015

Leading Innovation through Diversity

TOSHIBA Semiconductor and Storage products

© 2015 Toshiba Corporation 2

Evolution of mobile devices

Toshiba Electronics Asia, Ltd.

CellularPhone

Computing

Storage

Smartphone

Cloud Computing

StorageSensing Energy Communication

More Info

Car

Camera

Internet of Things

Wearable, Healthcare

FeaturePhone

More Feature

Diversity

More Integration

MOBILEEVOLUTION

Key Technologies;

Key Trend;

1010

Home

Home hub

© 2015 Toshiba Corporation 3Toshiba Electronics Asia, Ltd.

Key Technologies;Contents1. High Speed Communication

・TransferJet™2. Wireless Power Transfer

・Solutions from 1W to 15W3. RF switching

・SOI RF Switch4. Super Low Drop Out regulator

・and other Discrete devices5. CMOS Image Sensors

・8/13/16/20Mpix6. Interface Bridge ICs

・for diversifying applications Storage

Sensing

Energy

Communication

Communication

Energy

Communication









Sensing

Energy

Communication

Communication

Energy

Communication


TransferJetTM


Click & Go for data transfer Effective 375Mbps max.Short distance minimizes risks

Close Proximity Wireless Transfer Technology

NO congestion, TrasferJet is a device to device communication.


TransferJetTM



TransferJetTM


Street model, 2015ARROWS NX F-04G

MSM8994 MSM8974AC

Bphone


TransferJetTM

Toshiba Electronics Asia Ltd.

TransferJetTM

Adapters / SD Memory CardTransferJetTM

Smartphone

Paperless MTG Educational ICT

Digital KIOSK

Contents Delivery at Concert, Event place

Bi-directionalDigital Signage

Contents Sellwhen cashing

Contents Pushwhen thru Gate

Share Photos & Movies

Contents Sellat Vending machine

Specific Place More usual Place New LIFE Style

差し替え予定

Recorder Tablet PCProducts

ApplicationsServices









Sensing

Energy

Communication

Communication

Energy

Communication


Wireless Power Transfer IC’s


Solutions cover from 1W to 15W




Solutions cover from 1W to 15WPo

wer

(W

)

Low power

High power(Resonance)

Wireless Power Transfer IC´s Roadmap

Mid power

15W

10W

RX:TC7765WBG (MP:OK) TX:TB6865AFG *Enhanced Version (*MP:Q1/2016)

5W

RX: TC7764WBGTX: TB6865AFG *2-device charger

2015~2014 2016 (CY)

RX:TC7766WBG (*MP:Q2/2016)TX:TC7718FTG+M066 (*MP:Q2/2016)

Small form factorfor wearable

1~3W

RX:TC7765WBG (MP:OK) TX:TB6865AFG *Enhanced Version (*MP:Q1/2016)




The top-class System SizeHigh Efficiency;1.0W: ~40% at 1W load 2.5W: ~70% at 2.5W load

Form Factor(coil size) ; 1.0W: TX 24mmΦ, RX 11mmΦ2.5W: TX 28mmΦ, RX 20mmΦ

Applications;1.0W: Active tracker, Wearable, etc.2.5W: Smart watch, Sports camera, etc.

Tx: 30mmΦ

Rx: 11mm x 11mm

Small form factor

1010









Sensing

Energy

Communication

Communication

Energy

Communication


SOI RF Switch

RF bands

GSM wavebands LTE wavebands3G wavebands

Waveband(GHz) 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5

2G (GSM)

3G

LTE

Ref. : Nikkei Electronics

3.5

2G3GLTE

RF frontend System

High performance RF Selector

• Scattered RF bands• Complex RF frontend system



SOI RF Switch


• Low insertion loss• Low distortion (THD and IMD)• High production capacity

& cost effective

TarfSOI™ : Toshiba advanced RF SOI

Market Proven TechnologyInsertion Loss improvement of SP12T switch

2014

0.9

0.8

0.7

0.6

0.5

0.4

0.3

20132011


SOI RF Switch

WCSP Package

SP4TGPIO

SP6TGPIO

SP8TGPIO

SP10TGPIO

SP10Tmipi

SP8Tmipi

SP12Tmipi

Flip chip with bump

SP16Tmipi

Bump pitch：150umBump pitch：400um

SPDTGPIO

SP3TGPIO

SP4TGPIO

SP6TGPIO

Cutting-edge Product line


Upcoming product planUnder Mass production* Studying other packages and antenna tuning applications continuously.









Sensing

Energy

Communication

Communication

Energy

Communication


Toshiba Discrete Devices


Super Low Drop Out regulator

Drop out (Vin-Vout)is only 200mV

Vbatt

Vin=1.3V

Vout=1.1V

for MSM8996 platform

Low Heat

2.5V

1.3V

Vin=1.3V Vout=1.1VPMICPM8996

LDOWi-Fi®

+ Bluetooth®

QCA6174Batt

Direct connection to the 1.3V of PM8996

at 300mA

TCR5AMxx Series




1. Latest Fine Patterning Technology2. New materials continuously (GaN on Si, SiC, SOI) . 3. Continuous Investment to Frontend-Backend Fab.

Small SignalStandard Logic Power Device Photo Coupler

White LED SiC・GaN

-Digital Consumer-Mobile, Network-PC, PC Peripheral

New Area

-Lighting-LCD Backlight

-Railway-Automobile

-Digital Consumer-Mobile, Network-PC, PC Peripheral

-Digital Consumer-Mobile, Network-PC, PC Peripheral-Infrastructure, Automobile

-Digital Consumer-Mobile, Network-Infrastructure, Automobile

SOI-SW

-Smartphone-RF Module

Product Line ~ from Small signal to High power products




PF Name Device Toshiba P/N

MSM8916

RF SBD JDH2S02SCSBD CCS15S30SBD CTS05S40 / CUS10S40

P-ch MOSFET SSM6J501NUESD(TVS) DF2B6.8ACT / DF2B7SLESD(TVS) DF2B6.8M1ACT / DF2B7M2SL

MSM8926

Dual P-ch MOSFET SSM6P49NUDual P-ch MOSFET SSM6N57NU

SBD CTS05S40 / CUS10S40P-ch MOSFET SSM6J501NU

ESD(TVS) DF2B6.8ACT / DF2B7SLESD(TVS) DF2B6.8M1ACT / DF2B7M2SL

MSM8939

RF SBD JDH2S02SCSBD CCS15S30SBD CTS05S40 / CUS10S40SBD DSR01S30

P-ch MOSFET SSM6J501NUESD(TVS) DF2B6.8ACT / DF2B7SLESD(TVS) DF2B6.8M1ACT / DF2B7M2SL

All of those have been selected byChinese End Customers and EMSs

Toshiba Discrete Devices for Qualcomm® platformsPF Name Device Toshiba P/N

MSM8928

SBD CTS05S40 / CUS10S40P-chMOSFET SSM6J501NU

ESD(TVS) DF2B6.8ACT / DF2B7SLESD(TVS) DF2B6.8M1ACT / DF2B7M2SL

MSM8956/76 LDO TCR5AM10 LDO TCR5AM11

MSM8996

LDO TCR5AM10LDO TCR5AM11

RF-SBD JDH2S02SCSBD CCS15S30









Sensing

Energy

Communication

Communication

Energy

Communication


CMOS Image SensorsMobile Camera Evolution with Toshiba Image Sensors

HDR: Dynamic Range Improvement

FRC Plus: Super Slow Motion VideoIris Recognition:

Secure Biometrics Recognition

User Experiences

CNR:Noise ReductionRWB CFA:

Sensitivity ImprovementNew Image Processing Architecture:

SNR Improvement, Resolution Enhancement

High Quality

1.12um Pixel:World Smallest 8MP Image Senor

1.0um Pixel: Next Gen Pixel for Low Z-height Camera Module Design

Slim Design

Bright Mode: High Speed Capture

PDAF: Fast Auto Focus

C-PHY: High Speed Camera Interface

High SpeedToshiba Electronics Asia, Ltd.


CMOS Image Sensors

Iris biometric Recognition

<Total system solution>- 1080p sensor die and camera module

reference design- Specifically designed lens and IR-BPF- Multi-partnership of IP vendors

High Speed Video

<Bright Mode>- 240 fps for 1080i

by High Speed Video capturing;<FRC Plus>- Up to 2100fps for FWVGA

by x10 digital interpolations

New User Experience with Toshiba Image Sensors


CMOS Image Sensors

T4KA71/2.4” 20MP

High resolution

T4KC31/2.78” 16MPHigh resolution

T4KB31/3” 13MPLow power

Small form factor

T4K821/3” 13MPHigh speed

T4K371/3”13MP

T4KA31/4” 8MPLow power

Small form factor

T4K351/4” 8MP

T4K711/7” 1080p

SelfieSmall form factor

MSM8994 ✔ ✔ ✔

MSM8992 ✔ ✔

MSM8974 ✔ ✔ ✔ ✔

MSM8956/76 ✔ ✔ ✔

MSM8939 ✔ ✔

MSM8952 ✔ ✔ ✔

MSM8916 ✔ ✔ ✔ ✔ ✔ ✔

MSM8909 ✔

Toshiba Image Sensor Available on Qualcomm® Platforms









Sensing

Energy

Communication

Communication

Energy

Communication


Interface Bridge ICs


Display Bridge/HubTC358762XBG (DSI to RGB/MPU) SD2xx/SD4xxTC358774/75XBG (DSI to LVDS ) SD2xx/SD4xxTC358767AXBG (DSI/DPI to DisplayPort) SD4xx/SD6xxTC358770XABG (D4DP: Dual DSI to DisplayPort)

SD6xx/SD8xxTC358860XBG (eDP to Dual DSI )

New! 4k2k support

HDMI® BridgeTC358743XBG (HDMI to CSI) SD4xx/SD6xx/SD8xxTC358749XBG (HDMI to CSI with Scaler) SD4xx/SD6xx/SD8xxTC358840XBG (HDMI to CSI) 4k2k support SD8xx

Flexible IO ExpanderTC35892XBG, 893XBG, 894XBG/FG, 895WBG

Camera BridgeTC358746AXBG/748XBG (Parallel to CSI2)SD2xx/SD4xx

Key PWM GPIO LED

* “SDxxx”; adaptable for “snapdragon xxx”


Bridge ICOUTPUT

DPI(RGB)

DBI-B(MPU)

Parallel8bit,16bit MHL® DSI CSI-2 LVDS HDMI®

Display port eDP

INPU

T

DPI(RGB)

DBI-B(MPU-I/F)

Parallel 8bit/16bit

MHL®

DSI

Display PorteDP

CSI-2

HDMI®

ES AvailableMP product

TC358764/65TC358774/75

Under Development

TC358743

TC358746

Parallel 24bit, CSI 4lane

TC358767ADSI 8laneWQXGA

TC358770A

LVDS 1/2linkLow PowerHigher Speed

TC358766

DSI 4lane, wider ball pitch

DSI 3lane

CSI 4lane, Parallel 24bit

DSI 4laneDSI 4lane

CameraBridge

DisplayBridge

DSI 2lane

DSI 4laneTC358771/72Backlight Control

DSI 4lane

TC358777DSI 8lane

WQXGAWider ball pitch

TC358749

TC358xxx

Under Panning

TC358xxx

TC358860

TC358779

TC358xxxeDP Ver. 1.4DSI 8lane 1.5GUp to 4k2k

TC358748CSI 4lane, Parallel 24bit Wider ball Pitch

TC358748 Parallel 24bit, CSI 4laneWider ball pitch

TC358870fHD60fpsScalar de-interlace

4k2k30fps DSI 8lane TC358840 4k2k30fps CSI2 8lane

HD60fps CSI2 4lane Scalar, De-InterlacefHD60fps CSI2 4lane

For Mobile phone Smartphone

For Tablet

For Visual Devices

TC358762TC358766

TC358763

TC358768ATC358778

TC358766TC358767A

TC358746

Toshiba Bridge IC covers diversified sectors





<Dual Screens>

<Small size Screens>

<High resolution Screens>HostA.P.

eDP, DSI MIPI-DSI 1Gbps*4ane*2link

TC358860XBG

eDP2*DSIDSI 4lane* 2link

Video Mode

• ~2560x1600 MIPI-Panel• ~4k2k DSI-Panel

TC358870XBG

HDMI2*DSIHDMI®

I2S

DSIDSI • Head Mount Display

• Dual ScreensLR

HostA.P.

RGB(DPI)

TC358763XBG

RGBDSI MIPI-DSI 500Mbps*3lane

Stream Mode 60fps

• HVGA(320x480)• FWVGA(480x864)• qHD(540x960)• DVGA(640x960)• XGA(1024x768)• DSI-Panel

Recent Example of Display Bridges





LCD

LCD

GPSCAN

InterfaceBridge

USB

Video Decoder

Sensor fusion

Video Encoder

METER

VideoProcessor

CVBS

Rear SheetEntertainment

VehicleInformation

Ether AVB

HUD

Box Image

BluetoothWi-Fi

Video DecoderBluetooth/ Wi-Fi®

Audio Amps

Rear View CamVideo

Encoder Video Encoder

Image Recognition

Processor

3G/LTE

Center stack

solution

ASIL Certified

InstrumentationMCU

For Car Infotainment,

Cameras

Dash BoardCenter Stack TELEMATICS

Advanced Driver Assistance SystemsADAS:


Contents1. High Speed Communication






・for diversifying applications


1010

and beyond!!

TransferJet and TransferJet logos are licensed by the TransferJet Consortium.MIPI® is a registered trademark of MIPI Alliance, Inc.

Wi-Fi is a registered trademark of Wi-Fi Alliance. HDMI is a trademark or a registered trademark of HDMI Licensing, LLC.

Bluetooth® word mark is a registered trademark owned by Bluetooth SIG, Inc. and any use of such mark by Toshiba Corporation is under license. Qualcomm and Snapdragon are trademarks or registered trademarks of Qualcomm Incorporated.

Fujitsu and the Fujitsu logo are trademarks or registered trademarks of Fujitsu Limited.Bkav and the Bkav logo are trademarks or registered trademarks of Bkav Corporation.

MHL is a trademark or registered trademark of the MHL, LLC.TarfSOI is a trademark of Toshiba Corporation.

leading innovation through diversity - qualcomm innovation through diversity. ... gsm wavebands 3g...

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