MITA (P) NO 076/05/2000 A Quarterly Publ ication By Universal Instruments Corporation ISSUE 11 January 2003

Automation in Electronic Assembly 1

CORPORATE/EXECUTIVE MESSAGE

with all our customers here. May 2003 bring prosperityand success to your organizations.

Yours truly,Ian McEvoyPresident, Universal Instruments

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2 0 0 2 h a s b e e n v e r yc h a l l e n g i n g f o r

v i r t u a l l y a l l c o m p a n i e sinvolved in technology. As wemove into 2003, I would liketo reflect on how far we havecome in the last 12 months,both as a company and as anindustry as a whole.

Last year saw us pushing manystrategies forward to offers u p e r i o r v a l u e t o o u rcustomers. In response tom a ny o f o u r c u s t o m e r sestablishing manufacturingcenters in China, and as ademonstration of Universal’s

long-term commitment to the China and Asia market, we set up our ownassembly, logistics, and sales operations there. We officially opened the UniversalTechnology Excellence Center in Suzhou, Jiangsu Province, in May 2002. Inaddition to that, we will be opening a new assembly plant in Shekou, GuangdongProvince, in the first quarter of 2003.

These operations will benefit Universal’s customers in the long term, as theywill shorten delivery lead times, maximize productivity, and enable our Asiacustomers to develop their processes and products much more efficiently thanbefore. Universal is currently one of the few equipment companies actuallymanufacturing electronics production machines in China.

We, at Universal, constantly strive to help our customers through processpartnerships. We ensure that users of our equipment are comfortable with theassembly processes involved in their designs, including adoption of the latestboard and component assembly technologies such as flip chip. The establishmentof laboratory and applications engineering facilities across Asia, including thetechnology center in Suzhou, is one way we can add value to your business.

Globally, Universal Instruments continues to be a force in both through holeand SMT assembly equipment and technology. We continue to innovate acrossall parts of the electronics assembly process, working closely with our customersto produce manufacturing solutions for the latest electronics packaging, PCB,and substrate assembly trends. Regionally, Asia continues to be at the heart ofthese global trends, where innovation originates. We see Asia as the engine ofthe electronics industry’s future growth, and long may this continue.

With the latest investments we are making in Asia, along with ongoing expansionand enhancement to our operations in Singapore, Hong Kong, Korea, and Taiwan,at Universal we are fully committed to Asia. We look forward to working closely

Automation in Electronic Assembly2

WHAT’s NEW

2003 looks to be the start of new businessopportunities, challenges, and success. We lookforward to growing as your long-term partner,and would like to wish you and your employees aprosperous 2003!

Universal Taiwan Team

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As we enter the new year, we would like to expressour deep appreciation for your support over theyears. We will continue to provide innovative andcutting-edge technology to serve you better andto build our position in the industry.

Universal Korea Team

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GreetingsGREETINGS from the Universal

It is that time again when businesses begintheir review of the year and prepare for bettersuccess in the new year. 2002 has certainlyb e e n ex t re m e l y c h a l l e n g i n g fo r m o s tbusinesses, and it is no different at Universal.Many changes have taken place over the past12 months at Universal China. 2003 will see amuch stronger, matured, and competent team,all geared toward delivering our best to meetand even exceed customer expectations.

I would like to thank all our customers, partners,suppliers, and the team in China and Asia for thecontinuous suppor t and trust that hascontributed to our success. We are confident that2003 will be even better for all of us. Wishing alla prosperous, Happy New Year and the best ofhealth to both you and your families!

KH Ong, Universal China

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Wishing all a Happy New Year! We look forwardto working with you again in 2003.

Universal Japan Team

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WHAT’s NEW

Automation in Electronic Assembly 3

Thanks to all our valued clients for yourcontinued support throughout the year.While it has been a difficult year for many,the team at VEMA and our partners atUniversal remain committed to setting thestandard for innovative products, service, andsupport. From all at VEMA we wish you andyour families a Merry Christmas and a HappyNew Year.

Vema Australia

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A heartfelt greeting to all our valued customers.We appreciate your continual businesspartnership and the confidence you have placedin us. We wish you the best of health and aprosperous New Year!

Singapore Team

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“The Marketing and Communications Team inAsia would like to express our gratitude to ourcustomers and business partners for thesupport shown to us this year. We look forwardto working and serving you better in 2003, andwe wish you and your families a Prosperous andHappy New Year.”

Jeffrey Kuah

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We would like to wish all our customers a veryHappy and Prosperous New Year. Each year bringsnew challenges, and we are committed toproviding the best support to our customers inproduct, services, and technology. We intend toprovide only the best to our customers.

Universal Thailand Team

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NORTH & SOUTH EAST ASIA

Automation in Electronic Assembly4

Flip Chip Workshop Held at SIMT

Three companies participated in the Flip Chip Workshop held in November.Attending were staff from Arima Taiwan, Compal Taiwan, and Fabrinet

Thailand. The small group allowed the session to be more tailored to the attendees’needs. The wafer-bumping module gave participants the opportunity to visit thewafer-bumping lab at SIMT. Being at the lab gave the class a better understandingof how the bumps are formed — either by electroplating or through a screenprinting process on the bare die — as a prerequisite of the flip chip assemblytechnology.

The Flip Chip Workshop also allowed participants to assemble flip chips using thedemo kits, including the placement, reflow, underfill, and curing processes.Advanced topics like no-flow underfill were demonstrated, and C-SAM was carriedout to examine the voiding or delamination between the flip chip and thesubstrate. The participants walked away with a more in-depth understanding offlip chip technology.

Universal Wins

4th SeaERP Award

Universal Instruments recently wonthe SeaERP award from Seagate. The

2002 award marks the fourth consecutiveyear we have been honored with this award.

The aim of the SeaERP awards is toestablish an objective tracking and ratingsystem on equipment suppl iers ’performance in meeting Seagate EAO(elec tronics assembly operation)r e q u i r e m e n t s . T h e a r e a s u n d e rassessment for the awards include:

• Equipment uptime• Spare part expenses• Service responsiveness• Stock out situations• Outstanding issues• Failure analysis tracking• After sale support

Dennis Mah, Regional Sales Manager,accepted the award on behalf ofUniversal Instruments. “This is truly anhonor. Winning the award for the fourthyear running is a testament to theunsurpassed service we provide for ourcustomers’ production needs,” said Mah.

UPS+ 2.0 Training

in Singapore

Several of Universal’s field serviceengineers from Singapore, Malaysia,Thailand, Korea, and Taiwan recentlyparticipated in a four-day trainingworkshop on the latest version ofUniversal Platform Software, UPS+ 2.0upgrade. Held at the Singapore Instituteof Manufacturing Technology (SIMT),the session was taught by Br ianKo va l c h i c k , U n i v e r s a l Te c h n i c a lSpecialist, from Binghamton.

During the session, attendees wentthrough the upgrading procedure anddiscussed improvement opportunities.The aim of this training was to equip fieldservice engineers with the additionalknowledge and skills to allow them tomeet customers’ needs more effectively.

Universal Attends

Electronics Packaging

Technology Conference

( EPTC )

The Electronics PackagingTechnology Conference

(EPTC) is an internationalconference dedicated to advances, research,development, and application of electroniccomponents, assemblies, and systems.

This year’s conference saw more than 80 high-quality technical papers presentedin 19 sessions by engineers and scientists from 16 countries. These papersaddressed key issues on lead free solders, electrical and thermal modeling, designfor high performance electronics, MEMS (an optical component packaging),materials and processes, interconnection technologies, and reliability.

Universal was one of 14 companies that participated inthe one-day tabletop exhibition. This conference gaveus the opportunity to showcase our latest products andservices, as well as provide information on our solutionsfor the semiconductor assembly industry.

EPTC is organized by the Reliability/CPMT/ED Chapterof the IEEE Singapore Section, and technically co-sponsored by the IEEE CPMT Society and IMAPS. It is organized in cooperationwith ASME Singapore Section, Institute of Materials Research and Engineering,Institute of Microelectronics, Nanyang Technology University, National Universityof Singapore, and Singapore Institute of Manufacturing Technology.

Automation in Electronic Assembly 5

HONG KONG / CHINA

Universal Instruments participated in a seminar organized by ChinaWestern Region SMT Association. The third in a series of seminars was

held in Chengdu, the capital of Xichang in Sichuan Province, from 12-14November 2002.

Bill Xia, Application Engineer from Universal Shanghai, gave a presentationof pin-in-paste technology and focused on the flexibility of the GSM®Platform. The presentation was well received by the 95 participants from morethan 33 companies across the country. Universal looks forward toparticipating in future seminars in the region to help companies keep abreastof the latest PCBA technology.

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Universal held its second sales training session at Universal Instruments’ Suzhouoffice from 18-19 October 2002. Sales staff from Korea, Taiwan, Thailand, Shenzhen,

Shanghai, and Beijing attended the two-day session.

The training focused primarily on products, namely HSPs, GSM® Platforms, through holemachines, ASA equipment, and the Polaris machines. Mr. Y.J Lee, Regional Sales Manager,DEK China, and Mr. H.K Lee, Vice President, Vitronics-Soltec, Asia-Pacific, conductedproduct training sessions. The various post-lecture dialogue sessions helped facilitatethe attendees’ understanding of the sale procedures of existing products, as well asupcoming new launches.

We would like to express our appreciation to both DEK and Vitronics-Soltec for takingtime to conduct the training and for their active involvement and participation in ourtraining efforts.

SMT Seminar in Chengdu, China

Sales Training – Part 2

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PRODUCT & TECHNOLOGY

Automation in Electronic Assembly6

Traceability has become an increasingly important requirement to identify and record whichcomponents are assembled on which printed circuit boards. Once an exclusive concern of

automotive and medical product assemblers, now producers of telecommunications (routers,servers) and other costly electronics commodities are concerned about how to determine wherea specific component came from, how it was assembled, when it was assembled, and where itwas shipped. If properly recorded, manufacturing records can be used to minimize the cost ofproduct recalls and promote early and efficient error detection.

Universal Instruments accommodates traceability requirements by using standard GSM®Platform and HSP bar code tracking options along with Dimensions™ software. The bar codetracking options available for GSM Platforms are bar code changeover, platform setup validation,and generic equipment model (GEM). For the HSP, bar code product change, bar code validationsystem, and GEM are available. Printer and oven products may also provide a limited set of datathat can be analyzed, reported, and recorded to identify defective or suspect product for recalls,build process quality issues, and defect trend analysis.

Traceability is typically accomplished by incorporating a serialized bar code label on each circuitboard. Input media (component reels, tubes, matrix trays) may also receive unique identificationfrom bar code labels. The circuit board bar code label uniquely identifies the circuit board andprovides the product name and a serial number that all component-related data is subsequentlylogged against. The bar code label on component reels or trays contains component vendorinformation. Vendor information contained within the component reel or tray bar code labelmay include part number, vendor number, lot number, etc.

In a typical system approach, circuit board bar code labels are automatically scanned usingconveyor-mounted bar code readers directly upline from each surface mount placementmachine. Component reel or tray bar code labels are scanned into the system at the beginningof a production run, as well as each time a component is replenished. The machineidentification, circuit board serial number, and component information are sent to theDimensions line host via a series of GEM date/time stamped event messages. The DimensionsManufacturing Monitoring line host “links” these critical data points together and stores themfor future retrieval.

Standard database query tools allow the logged data to be retrieved when known parametersare entered into a form and submitted as a query to the database. A typical recall scenario mightinclude a query of all boards assembled using a particular supplier’s component part number orreel number. Data logged in the Dimensions line host would allow traceability of the assembliesbuilt, the machines they were built on, date and time stamp information, and more.

Implementing Traceability

What You Need to Know to Get Started

Automation in Electronic Assembly 7

Universal Instruments is helping small-to-medium sized enterprises in China andthroughout Asia to gain a competitive advantage by providing high-quality, lower-than-new cost, Universal-certified assembly equipment solutions through itsRemanufactured Machine Division.

“Universal has offered it customers this option for nearly 20 years, but it is only recentlythat we have been able to deliver the service across Asia,” said Lou Pixley, ProductManager, Remanufactured Machine Division. “Asia is the manufacturing engine forthe world and we have seen a huge increase in demand for our solutions there. We areproud to now offer our local customers the flexibility of purchasing completelyoverhauled machines at a lower cost.”

In China, there are significant numbers of small-to-medium sized businesses who needaccess to top-of-the-range equipment, but for many reasons may not have the resourcesto make large initial capital purchases. By working with Universal’s RemanufacturedMachines Division, these customers can avoid the “risk” commonly associated withpurchasing second-hand equipment.

“To stay ahead of the competition, we have to manufacture high-quality products involume and deliver them on-time,” said ST Chen, Factory Manager of Hui Yang EastwayElectronics. “Achieving these goals is only possible if you have the most up-to-datemanufacturing equipment and the support needed to keep your line up and running24 hours a day, 7 days a week if necessary.

“By using Universal’s remanufactured equipment, we have been able to harness thelatest technologies and processes at a reduced cost, meaning that we have been ableto stay one step ahead of our competitors.”

All equipment remanufactured by Universal is subject to the highest level of overhaulthat can be performed on a machine. Remanufacturing at Universal includes replacingworn or damaged parts, as well as replacing older revision parts with the latest leveloptions for a particular model. Software is also upgraded and these new features andprocesses enable the customer to take full advantage of the latest technology availablefor that particular product.

In addition, all remanufactured equipment is Universal-certified, proving that themachine has not only passed a rigorous quality assurance process that covers all criticalitems but also that it is backed by the same comprehensive customer support programthat Universal provides all its customers. This includes field service, replacement parts,product training, and technical support.

Universal’s Remanufactured

Machines Help Asian

Manufacturers Gain

Competitive Advantage

For more information about Universal products and services, please call (65) 6485 8343 or email marcomasia@uic.com or check out Universal’s website at www.uic.com

More listings can be found at http://www.uic.com/wcms/WCMS.nsf/index/Tradeshows_4.html

CALENDAR OF EVENTS

CUSTOMER FOCUS

When Foxconn selects production equipment, their key criteriaare service and performance per cost. Jeffrey Chen, managerat the Manufacturing Engineering Department, Foxconn,strongly believes that these are the most important qualitiesrequired when selecting production equipment. Foxconn is aTaiwanese connector and enclosure specialist.

Chen, who is responsible for all aspects of SMT machinery andprocesses, product engineering, industrial engineering, andfacility automation at the company’s Shenzhen manufacturingfactory, also believes that support is equally crucial.

Good service and sustained support are necessary ingredientsfor a win-win partnership between the equipment supplier andcustomers. Foxconn has developed this win-win partnershipwith Universal Instruments. They have been Universals’production equipment for over 2 years and are very pleasedwith the good service and support provided.

EquipmentEquipment quality, reliability, and performance per cost arealso important. Chen strongly feels Universal Instrumentssupplies one of the best SMT machines. Foxconn is running sixSMT double-sided pcba lines at its factories in Shenzhen, S.China, with a seventh line in the pipeline. The company isbuilding an LCD factory in the HsinChu Science Park in HsinChu,Taiwan, equipped with 5th generation technology, and alsohas manufacturing facilities in Shenzhen and Kunshan (JiangsuProvince) in China, plus facilities in Europe and US.

Quality standardsFoxconn aims to achieve zero defect results on itsmanufacturing lines, implementing a three-level strategy tooptimise time to market, time to volume and so-called ‘timeto money’. This includes joint product development withcustomers for shorter product lead-time, fast ramp-up toproduction, low inventory and global logistics capabilities.

Manufacturing technologiesOne particular assembly technology being used is pin-in-paste,which gives low manufacturing defect levels, high quality,

Componex/electronicIndia 2003 21-24 January 2003

SEMICON Korea STS 22 January 2003

Shekou Grand Opening 28 February 2003

Vantis Roadshow (Shekou, China) 3-7 March 2003

Vantis Roadshow (Tianjin, China) 24-27 March 2003

Nepcon Shanghai / EMT China 2003 8-11 April 2003

rel iabil ity, and reducedlabour costs. An advantage isthe ability to process variouscomponent types within asingle process stage, makingi t s u i t a b l e f o r m i x e dtechnolog y substrates .Placement machines fromsuppliers such as Universal

Instruments can insert all of the popular surface mount shapesand odd form parts, removing the need to invest in additionalodd form equipment.

With the help of key equipment and solutions partners suchas Universal Instruments, allied to its sound management andclear business objectives, Foxconn is confident it will maintainsolid growth in the future.

Foxconn Story:

Service and performance per cost are key criteria

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