coolrunner ii real digital cpld

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06/11/22 UAH 1 COOLRUNNER II REAL DIGITAL CPLD Ravi Kumar Vommina CPE 695

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COOLRUNNER II REAL DIGITAL CPLD. Ravi Kumar Vommina CPE 695. Contents. Introduction Features Architecture Advanced Features Applications ISE 6.1 Cool Runner II Family parameters. Introduction. Reconfigurable Computing Platforms Implementing algorithms directly in hardware - PowerPoint PPT Presentation

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Page 1: COOLRUNNER II REAL DIGITAL CPLD

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COOLRUNNER IIREAL DIGITAL CPLD

Ravi Kumar Vommina

CPE 695

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Contents

• Introduction

• Features

• Architecture

• Advanced Features

• Applications

• ISE 6.1

• Cool Runner II Family parameters

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Introduction

• Reconfigurable Computing Platforms – Implementing algorithms directly in hardware– Parallelism nature of Hardware– Efficient Implementation

• FPGA (Field Programmable gate Array)– Configurable logic blocks and routing resources– CLB uses LUTs to implement Boolean functions– Inclusion of hard cores

• CPLD (Complex programmable logic device)– PLA , programmable AND plane,fixed OR plane– PAL, both AND and OR planes

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X = A & B # CY = A & B # !C

PLAPLA: Requires only 3 pt’s!B CA

X Y

B CA

X YCan NOT share common logic

PAL: Requires 4 pt’s!

Indicates ‘unused’ junctionIndicates ‘used’ junction

Indicates ‘fixed’ junction

Common logic may be shared in Cool Runner II

Introduction

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Cool Runner II Features

• Real Digital – patented design technology enabling high performance

and ultra low power consumption.– true CMOS both in process technology and design

technique• 1.8 V system, fastest low power CPLD using real digital

technology• 0.18u process technology CMOS CPLD• Static Icc of less than 100 micro amps at all times• 100% CMOS product term generation

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Vin Vout

CL

VDD

VDD VDD

Vin5 VDD Vin5 0

Vout Vout

Rn

Rp

CMOS inverter

CMOS

•In steady state there exist always a finite resistance path between Vout and either VDD or Ground.

•Ideal static power should be zero

•Small static power consumption exists due to leakage currents and sub threshold conduction that is < 100 micro amps

•Total power = dynamic+short circuit +static

•Short circuit current flow is due to the delay in rise and fall times of input.

•Dynamic power = C .VDD2/ 2 . f

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DCBA

D

C

B

A CL

C3

C2

C1

Product term generation

Distributed RC model (Elmore delay)

tpHL = 0.69 Reqn(C1+2C2+3C3+4CL)

Design for speed: Alternative structures

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100% CMOS Product Generation

Delay < 0.3ns

Delay < 0.1ns

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Cool Runner Architecture – High Level View

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Cool Runner II Macro cell view

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Global Clock Signals

• Clock input is buffered that drives multiple internal global signal traces to deliver low skew and reduce loading delays

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Recap

• High level View

– 16 macro cells in a function block

– Function blocks use PLA

– Function blocks interconnect with advanced interconnect matrix

– AIM is highly connected low power rapid switch

• Macro cell View

– 56 product terms

– 4 control terms, 3 product terms

– One flipflop as (D,T or latch) , ( edge or dual edge triggered)

– Xilinx software makes the choice when to choose product or global or control term

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Cool Runner-II I/O Characteristics

Programmable Output capabilities

• performed with software attributes

•Open drain with pull up

•Slew rate

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Cool Runner II input view

Schmitt Trigger Input

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Cool Runner II Input Characteristics

• Termination Options– Bus- Hold (Weak Keeper)

– Pull-Up

– CGND

• During power up device is in Quiescent state

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Advanced Features – Data Gate

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Advanced Features – Clocking Options

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Advanced Features-Cool Clock

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Using the advanced features

• Clock divide– declaration– Instantiation

• Schmitt Trigger input

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Advanced Features-On the fly Configuration

• Initial pattern is loaded into a configuration shifter

• The pattern first transfers into nonvolatile memory

• The pattern is then read from NV to SRAM for actual cell operation

• Leaves ability to reload the NV memory as xilinx says, “On the Fly”

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Impact Menu

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Selecting OTF

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Cool Runner II Features

• Advanced Design Security

• Hot Pluggable

• Wide package availability

• Supports Multi Voltage standards

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Applications

• Ideal for high speed designs:– High performance CPLD– Advanced features– Double data rates

• Target device for portable designs:– Lowest power– Maximum battery life– Lower heat dissipation– Small packaging– Chip scale packaging

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SPI

SMBus

Battery

IrDALED

UART Docking Cradle

TouchscreenKeypad

P

LCD

Flash SRAMCompact

Flash

PDA

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Address

Data

Control

DDRSDRAMP

Interface for DDR SDRAM Interface

• Double data rates

• Address translation

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ISE6.1Design Flow

• An active project space is created.• Existing VHDL modules can be added or new

ones can be created in the project.• A user constraint file is specified that maps the

input and out put signals to the actual pins of the device

• Synthesis of the design is performed by just selecting the implement design option.

• Device is configured by IMPACT.

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Cool Runner II

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Bibliography

• WWW.Xilinx.com

• http://bwrc.eecs.berkeley.edu/IcBook/