conquer electronics thin film chip fuse introduction

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Conquer www.conquer.com.tw

Conquer ElectronicsThin Film Chip Fuse Introduction

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Confidential R&D Center.Conquer www.conquer.com.tw

現行市場 SMD fuse製程種類• Thin Film Process

– Ceramic substrate Conquer, Sart, Vishay– PCB substrate Littelfuse

• Thick Film Process– Ceramic substrate Bussmann– Injection molding KOA– LTCC Fuse AEM (SolidMatrix), Conquer

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Thin Film ： Ceramic Type ProcessConquer 12, 06, 04 series Vishay MFU seriesKOA, Sart, AVX

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Thin Film ： PCB Type ProcessLittelfuse 466, 467, 468 series

markingPCB substrateCu elementProtect layer

Drawing Not to Scale

*Element on PCB substrate surface

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Thick Film ： Printing ProcessBussmann

3216FF, 1608FF

*Element on Ceramic substrate surface

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Conquer Electronics

Surface Mount Thin Film Chip Fuse

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薄膜晶片保險絲• 黃光微影製程配合電鍍技術，線路製作精緻。• 產品特性可精準控制。• 特殊開發之防爆隔絕層與聚熱層也可確保熔斷特性。

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Chip Fuse Specifications

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Chip Fuse Dimensions

12060603 0402

L

W

T

Type 1206 0603 0402

L 3.1±0.2 1.6±0.15 0.95±0.1

W 1.6±0.1 0.8±0.1 0.48±0.1

T 0.65±0.2 0.43±0.1 0.33±0.1 Unit : mm

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Electrical Characteristics

Rating Current Electrical Characteristics

100% 4 Hours min

200% 5 Sec max

300% 0.2 Sec max

CF series (Very Fast-Acting Fuse Series)

Rating Current Electrical Characteristics

100% 4Hrs min

200% 120 Sec max

300% 3 Sec max

CT series (Time Lag Fuse Series )

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Temperature De-rating Curve

• Ambient temperature on current-carrying capacity.

• For circuit ,current rating shall be derated in accordance with the figure.

Conquer chip fuse T-Derating chart

80

90

100

110

120

-20 0 20 40 60 80 100 120

Ambient temperature (℃)

Perc

ent o

f rati

ng (%

)

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1206 Applications and Ratings

C F G H K N O P S T U2300 440 250 125 51 36 27 22 15 11 7

C F G H K N O P S T U1750 370 160 100 44 31 24 17 13 8 6

1.5A

Rated Voltage(Open Circuit Voltage)

Interrupting Rating(at Rated Voltage)

32V AC / 63V DC

50 A

Fusing Current/Fusing Time(at 25℃)

Internal R (mΩ) at 25℃ max.

Rated Current × 200% / 5 seconds max. Rated Current × 300% / 0.2 seconds max.

Category Temp. Range(Operating Temp. Range)

Marking Code

2A 2.5A1.5A 5A 7A

4A 5A

Rated Current × 100% / 4 hours min.

4A

0.2A 0.5A 0.75A

Rated Current × 300% / 3 seconds max.

TypeRate Current (A) 0.2A 0.5A 0.75A 1A 3A

12CF Series



TypeRate Current (A)Marking Code




Rated Current × 100% / 4 hours min. Rated Current × 200% / 120 seconds max.

-55℃ to + 125℃

32V AC / 63V DC

50 A

-55℃ to + 125℃

3A

12CT Series1A 7A2A 2.5A

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0603 Applications and Ratings

C F G H K N O P S T2800 460 200 100 55 32 28 20 14 10

C F G H K N N P S T1800 350 120 90 40 29 20 16 10 8

Category Temp. Range(Operating Temp. Range) -55℃ to + 125℃



32V DC

50 A 35 A



Rated Current × 300% / 3 seconds max.


2.5A 3A1.5A 4A 5A

Marking Code

2A

Type4A

06CF Series


06CT Series

Rated Current × 300% / 0.2 seconds max.

32V DC

1A0.5A 0.75ARate Current (A) 0.2A

Type

Rate Current (A)Marking Code

Internal R (mΩ) at 25℃ max.Fusing Current/Fusing Time

(at 25℃)

1A 5A2A 2.5A 3A




50 A 35 A

-55℃ to + 125℃

1.5A0.2A 0.5A 0.75A

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薄膜晶片保險絲生產作業流程圖 Thin Film Chip Fuse Production Process Flow Chart

Start正面印刷矽膠平坦層

Silicon Printing背面印刷低溫銀膠

Backside Silver Resin Printing

濺鍍鈦鎢與銅Sputtering TiW/Cu

壓膜光阻與曝光與顯影Press Photoresist & Optical Lithography

電鍍銅 ,錫與蝕刻Electroplate Copper,

Tin & Etching

印保護層 ,印字 ,折條與折粒Marking Printing,

Snap wicker & granule

滾鍍銅 , 鎳 ,錫Roll electroplate Copper,

Nickel & Tin

測試與包裝IPQC & Packing

此二層為功得開發之防爆材料

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Chip Fuse Materials

Inner electrode

Outside electrode

Tin layer

Nickel layerCopper layer

Ceramic substrate & Silicon layer

Insulating layer

Marking layer

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Chip Fuse Multi-Layer Structure

Ceramic Substrate

Electrode

Silicon layerElement layerEpoxy layerMarking layer

*Drawing Not to Scale

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Taping Diameter

Unit : mm

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Reel Dimensions

Unit : mm

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CF & CT Label

Product name & number Product name & number

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Reflow Profile

Reference : IPC-JEDEC J-STD 002B

Temperature Min（Ts（min））Temperature Max（Ts（max））Time （Min to Max ）（ts） Temperature（TL）（Liquidus）

60-150 seconds

Pb-free assembly

60-180 seconds217℃

10 seconds

150℃200℃

260℃,10seconds max

260＋0/-5℃Peak Temperature（Tp)

Reflow Condition

Wave Soldering

Reflow Time（tL）

Pre Heat

Time within 5℃ of actual peak Temperature (tp)

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Test Circuit Board

Unit : mm

Test Circuit Board Reference Dimensions

12060603

Reflow solder Reflow solder Reflow solder

L1 L2 W

1.1 1.52 1.78

0.66 0.76 1.0

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Peeling Force (EIA-481-1A)•Peel-off forces are 0.1 N to 1.0 N (10 grams to 100 grams

calibrated scale reading) for 8 mm tape at a peel-off

speed of 300 mm ± 10 mm/minute.

•The peel-off angle should be between 165° and 180°.

Angle: 0~15∘

Standard: 10 ~100 grams

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Product Characteristics & Reliability TestsSolderability

ANSI/J-STD 002C Test G1Wetting balance globule test lead-free solder, timeto buoyancy corrected zero, Criteria ≦ 1 second.

Bending test

IEC 60127-490mm Between holding points.Bending 3mm,3times.Continue holding 30sec/time. Nomechanical damages.

Resistance to Solder Heat MIL-STD-202, Method 210Max 260±5℃, 10 ± 1 Sec, ΔR<15%

Moisture ResistanceMIL-STD-202, Method 106High Humidity (95±1% RH), Heat (40±0.5°C)10days, ΔR<15%

ON /OFF Cycle TestRefer to Conquer FileSurge current and 60% rated current; 1min ON,2min OFF, 1000 Cycles, tolerance ΔR<20%

Salt sprayMIL-STD-202 Method 101ΔR<15%, No excessive corrosion, 48 hoursexposure.

Thermal Shock MIL-STD-202, Method 107-40°C~125°C, 100 cycles, ΔR<15%

VibrationMIL-STD-202, Method 201A10~55~10 Hz 1Min/cycle, X Y Z 120 cycles,6 hours ΔR<15%

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Storage Conditions & Shelf Life

• The Maximum ambient temperature shall not exceed 40°C.

• The Maximum relative humidity recommended for storage is 70%.

• 1 years from manufacturing date

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Approval by

• UL JDYX8. E82636Fuses, Supplemental Certified for Canada - Component

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Interrupting Rating Photograph (X-ray)

200% rating current 1000% rating current

DC 50A 63V AC 50A 32V

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Consumer Electronics

Personal & Portable Computing

Office Machines

Network Communications

Industry System

ApplicationApplication

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Manufacturing Country & City

• CONQUER ELECTRONICS CO., LTD.

( Taiwan – WuGu )

• Tel: 886-2-89902189• Fax : 886-2-89902577

• RD Center

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Thanks for your attention!!

conquer electronics thin film chip fuse introduction

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ratings confidential