Company ProfileBusiness Model Presentation

IMPT Ltd.A Michael Pupin Institute Company

http://www.embedded.rs

About Us

Spin-off company of Michael PupinInstitute (IMP), established in 1997

High-tech company, focused on embedded systems design, especially COMs and SBCs

42 employees (27 in core development team)

Own high-tech products

Proven know-how to develop prototypes based on customer’s idea

Close cooperation with Texas Instruments (TI)

Focus on quality and manufacturability

ISO 9001 and CMMI Level 2 company

Business Offering

Contract R&D

Consulting

Conceptual designsand evaluation boards/proofs of concept

Original Design Manufacturer (ODM)business model

Licensing of proprietary IP

Southeastern European R&D offshore destination

Outstanding quality/cost ratio(value for money)

Networks & Associations

TI EMEA Design House NetworkMember since March 2011

Spin off company of the Michael Pupin Institute

Serbian ICT Network Cluster (Board Chairman position)

Currently 14 embedded design companies inthe network

Products

TI OMAP5430 Pico ITX SBCBased on newest TI technology - single board computer – compact size -high performance

TI DaVinci DM8168 Qseven ModuleComputer-on-module, compact size – DSP functionality

EasyDroidAndroid based development platform

uSFPSub-miniature 10 Gbps Fibre Channel/Ethernet transceiver

Pico-ITX single board computer with TI’s OMAP5430 chip

High-performance, dual-core ARM Cortex-A15 foundation

100 mm x 72 mm (palm-of-the-hand size) – Pico ITX standard

Multi-channel HD video processing

Built-in battery charger

Wi-Fi, Bluetooth® and FM technologies

USB 3.0 SuperSpeed connectivity

DVI video out, LVDS dual channel

Serial camera input port

Linux and Android 4.1 BSP

Software compatibility with open source PandaBoard platform

Applications

...and a lot of other applications.

Ultra small and ultra mobile implementations

Intelligent camera solutions

Mobile HMIs e.g. for measuring

Set-top boxes for smart TVs

Gaming

Gesture control devices

Kiosks – POS

Kiosks - POI

TI about our OMAP5430 Pico ITX SBC

“We are proud to work with IMPT to bring the OMAP 5 processor-based EPP-

Pico-OMAP5430 module to market [...]”

“Together with IMPT, we see great promise for the Pico-ITX standard in

enabling next-generation intelligent cameras, smart-home devices and other

applications [...]”

Mike Schoonover

Industrial business development manager

OMAP platform business unit

Texas Instruments Incorporation, USA

QSeven

Why Qseven standard?

To enable the features of latest 45nm mobile chipsets and processors.

To provide the ability to use the successful Computer-On- Module concept for mobile embedded applications.

To support the latest graphic standards such as Display Port and HDMI.

Small form factor for easy integration (70 mm x 70 mm).

What is special about Qseven?

Legacy free – only new serial buses are defined.

Flexibile graphics – current graphic standards are supported.

Embedded API – Software interface for easy Interchangeability.

High-performance TI ARM/DSP solutions

High level of peripherals integration

High-speed DDR3 SDRAM memory

Cutting-edge Sitara/Integra/DaVinci processor

Dramatic BOM cost reduction trough integration

Increase overall system performance

DSP can more efficiently handle complex tasks

ARM is free to process applications

Our TI DaVinci DM8168 Qseven Module

Features:

Texas Instruments’ Netra processors deliver:

ARM Cortex A8 RISC MPU, up to 1.2 GHz

C674x Floating/Fixed point VLIW DSP, up to 1.0 GHz

Rich set of peripherals

1 GB dual-port DDR3 SDRAM memory

3D graphics engine (SGX530, 27 Mpoly/sec)

Video processing subsystem

1080p HD video output

Up to 4 GB NAND Flash

11 W maximum power consumption

5 x USB 2.0 host ports

1 x USB 2.0 client port

1 x PCIe 1.1

1 x Gbit Ethernet port

HDMI video output

LVDS display connection (Open LDI)

Camera port (feature connector)

High definition audio

Dual SATA 2.0 interface

SD/MMC card interface

SPI interface

ACPI power management signals

Qseven - Features and Interfaces

Qseven module – based on DaVinci TI SoC

Interfaces:

Android 2.3 – IMPT – FREE

Full BSP available from March 2012

SysLink (Link between DSP and ARM) availability

Linux, Open Source – IMPT – FREE

BSP available from March 2012

GA available from June 2011

C6EZAccel and C6EZRun – TI – FREE

Includes pre-optimized DSP libraries for digital filtering, complex math and image enhancement and analysis

Qseven - Software

High-end Test and Measurement (Signal/Waveform Generation and Analyses)

Machine/Industrial Vision (Automated Inspection, Identification)

Biological Vision (e.g. Cell-sorting and Analysis)

Tracking and Control (Avionics/Guidance, Radar/Sonar, Solar Tracking)

Multi-channel full HD Video Encode/Decode, Transcode/Transrate (DaVinci)

Qseven – End Applications

The goal of the project:

Implement and sell specific hardware/software development platform for Android community

Optimized for use in home automation, machine control and similar applications

Enabling Android applications to use standard/legacy interfaces like RS232, RS485, CAN, digital I/Os and other.

ARM Cortex A8 @ 1.5 GHz

1 GB RAM memory

7” Touchscreen display

Ethernet, Wi-Fi, Bluetooth, GSM

4xUSB, SD card

Camera, audio

RS232, RS485

CAN

Digital I/Os

Analog inputs

PWM outputs

EasyDroid - Android with wires

Features:

Open source

Rich and innovate user interface

Easy applications development

Internet access, communications

More than 80.000 available applications

Market share: 40 %

Expansion of Android OS on new vertical markets

Multimedia, smart houses, automotiveindustry, white goods, …

Why Android?

uSFP 10 Gbps Transceiver

Goal: To develop industry’s smallest 10 Gbps LC optical transceiver

Challenge 1: Fit electronic and electro-optical components in such small space

Challenge 2: Design hardware for 10 Gbps performance

Challenge 3: Find suitable high-speed interconnection solution

Challenge 4: Devise robust mechanical design

Challenge 5: Cost optimization

An ODM project done in cooperation with TagOn, UK.

uSFP Transceiver - Solution

Compact design: 13 x 10.5 x 27 mm

Fully SFP compatible on the electrical interface

Six-layer rigid-flex board

Microwave design –signal integrity simulation

The smallest components available (0201 passive, 3x2 mm controller, uBGA)

Thin PCB interposer used as connector solution

10 Gbps test and evaluation boards developed

uSFP - Casing Prototype

Made according to 3D STEPmodel

Electro-mechanicalco-design applied duringentire development cycle

Die-cast metal body

Lid and cage made from0.25 mm tin plate

Precise manufacturing– 20 um tolerance

Electrical connection via 0.5 mm pitch interposer

“Perfection in Embedded Design” Concept

One stop shop (turnkey design)

Electronic products development know-how

Providing COMPLETE, ready for manufacturing solutions to customer

Industrial design and design for EMC

Automated test systems development

Full competence in each phase of device design

Fast prototyping

Network of partner development companies (ICT-Net cluster)

Cooperation with University

“Perfection in Embedded Design” Concept

Commitment to Quality

Certified ISO 9001 quality management system

IT Mark quality assurance certificate

CMMI for development level 2

Agile development methodology (scrum-like)

Proprietary, well-developed design verification check lists

Strict data management and backup procedures

Own state-of-the-art laboratory equipment

Pre-compliance EMC lab

Project Management & QA

Detailed WBS

Transparent procedures

Weekly reporting

Costs tracking

Milestone status meetings

Risk management

Requirements management

Configuration management

Customer

Project Manager QA Manager

System

Design Team

HW Design

Team

Embedded

Software

Team

FPGA Design

Team

Mechanical

Design

Team

Test &

Verification

Team

Design for

Manufacturing

Team

Manufacturing

Technologies

Real-time systems design

High-speed hardware design

DSP algorithms development

Multirate DSP, software-defined radio

Embedded operating systems (Linux)

High-speed/high-density PCB Design

Microwave circuits design

Power supplies & power management

Industrial control systems

Video and multimedia systems

Open-Source Software

Linux kernel

Bootloader for custom boards (U-boot)

Porting Linux kernel for custom boards

Linux drivers developing, maintaining and modifying for exotic peripherals

Full support for our own Linux BSPs

Android

Java middleware libraries for accessing board peripherals directly from Android

Full Java API, no need for low level NDK programmingand cross-compilation

Full support and documentation

Design for EMC

Seven years of experience in the company

Cooperation with Microwave Group atthe University of Belgrade

Recognized international experts with morethan 30 years of experience

World-class 3D EM field simulation experts (developed Wipl-D, Artech House)

Extensive list of international references(DEC, Bosch, Motorola, Philips, DuPont)

Consulting in design phase

Debugging EMC problems

EMC hardening

Product certification and CE marking

Audio and Acoustics

Cooperation with Acoustics Laboratory at the University of Belgrade

Development of high-end audio electronics (preamps, amplifiers, power amplifiers, filters)

Design of loudspeakers

Audio software development (signal processing, filtering, measurement, modeling, calculations)

Room acoustic design(studios, opera halls, theatres, churches)

Research projects (partial discharge in transformers)

Audio/acoustics lab (small anechoic chamber, reverberation chamber, instruments, software)

Industrial design service

Functional, ergonomic and aesthetic aspects of the product

Conceptual ideas, selection of materials, visualization, 3D & physical modeling, mechanical design, prototyping

Cooperation with award-winning Nikola Knezevic Industrial Design studio

Listed as one of the best 40 European designers under 40 for the year 2010

Awards: IF Design, Braun Design Competition,LG Electronic Design Competition

Client list: HP, Toshiba, Polaroid, B&W

Automated Test Systems

Five years of experience

Reference - own manufacturing line with capacity of 2500 devices/month

Strategic partnership withNational Instruments

Know-how of test methodologies(in-circuit, boundary scan, self-test)

Design for Manufacturing consultancy

Development of test jigs

Tools & environments

Altium Designer

Cadence

Mentor Graphics, HyperLynx

Xilinx ISE, Sysgen

Matlab

Labview

TI’s Code Composer Studio

IAR Workbench, MPLAB IDE, Eclipse

SolidWorks 3D mechanical design

Notable Projects

STOS 3XGAEthernet thin-client enabling three independent video outputs

PECState-of-the-art real-time multichannel DSP controller

TZ-600Mission critical communication device improving safety and security of teleprotection applications in electric power transmission systems

OpCardAdd-on card for expanding capabilities of Motorola GP/GM300 radio

CTU-300Crypto telephone set and data transmission device

STOS DVA - Basic Facts

Ethernet thin-client for digital signage applications

Triple-channel VESA video output (up to WXGA resolution)

Public screen systems, video walls, transportation, control centers, expos, advertising, entertainment

Low power consumption

Compact form factor

Cost-efficient solution

Image decoding and processing

Receiving up to three compressed video streams in overlay via UDP and background images via TCP with active resize and rotate algorithmsComplete system designed

in-house for Finsoft Ltd., UK.

STOS DVA - Challenges

High-speed video hardware design

Optimization of image processing algorithmson DM64x platform

Design of application software to assure maximum utilization of resources

Assuring robust EMC performance

24/7 work cycle

Cost optimization

Design for manufacturing

Establishing of production line and automated test procedures

Specialized test jig design

Mechanical design

PEC System - Basic Facts

Power Electronic Controller

Multi-board configuration

CPU board, Digital IO board, Analog IO board and Power Board

High processing power(4800 MIPS floating-point DSP)

16 optical IO channels (10 Mbps each) on Digital IO board

16 analog channels (100 kSps) on Analog IO board

256 digital channels, 128 analog channels total

1500 pages of documentation

Full design verificationand manufacturing procedures

System concept, design and prototyping done fully in-house under custom

development contract.

PEC System - Basic Facts 2

Packet-based data transfer in the system

10 us processing cycle

6.4 Gbps LVDS communication backbone

FPGA-based communication switches and interfaces

High reliability hardware with automatic hardware malfunction detection and protection mechanisms

Completely separated real-time DSP and system control/management

Fully redundant industrial 150 W power supply

Management and monitoring subsystem

Industrial temperature and EMC environment

TZ-600 - Basic Facts

Communication solution for teleprotection applications in power transmission systems

Hard real-time system

Designed for 24/7 operation

Fast, reliable, and secure

Modular and programmable interfaces including long-range optical

DSP technology

Extremely short command transmission time

Versatile power supply

Own design, manufacturing and sales.

TZ-600 - CPU control unit

Processing board basedon TMS320C5471 dual-core processor

Embedded Linux portedon ARM7 core

DSP/BIOS on C54x core

Separate graphical user interfaceboard based on MSP430

File system and RDBMS

Web server for monitoring and maintenance

Event log function

CTU-300 - Basic Facts

Provides ciphered full-duplex voice and data transmission over analogue telephone lines

Telephone functions: caller ID, call list, phonebook, country settings, ringer settings etc.

Simple and intuitive graphical user interface

Speakerphone option

Power supplies: mains, 9V DC and built-in Ni-MH battery

USB computer interface for programming and data communication

Fast erasure of crypto algorithm

Full protection against tampering

Based on TMS320C5410A DSP

Developed and manufactured for Serbian government.

CTU-300 - Challenges

Providing real-time ciphered voice service over dial-up connection (custom data protocol, synchronization)

Short time required for initialization of crypto connection

Voice coding technology

Acoustic and line echo canceling

Advanced encryption algorithms

Implementing GUI on MSP430

Advanced power management

Mechanical design

OpCard - Basic Facts

Add-on card for expanding capabilities of Motorola GP/GM300 two-way radios (voice scrambler and VHF/UHF radio modem)

Card controls properties of radio channel, transmitter and receiver, audio signal, and user interface (keyboard and display)

Excellent EMC immunity and sound quality

Downloadable firmware (over the air)

Design based on TMS320F206 DSP

OpCard - Challenges

Offensive RF environment

Mechanical design

Robustness

Voice scrambling algorithms

Real-time operating software

PCB requirements:

Six-layered printed circuit board with buried vias

High level of integration

www.embedded.rs/teams

Thanks to our dedicated engineers

Thank you!