Company guide2020

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since 1990 for "Sound Power"The 30th anniversary

by Electromagnetism &Quantum mechanics

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How to get to Ultex

National Route 3 Trafic light

［Higashihie 2-chome］

Trafic light［Toko Elementary School］

【 Via Subway 】From Higashihie Station, go out Exit #4.It takes 5 minutes on foot.

【 Via Taxi 】Take a taxi from Fukuoka AirPort Station or Hakata Station,It takes about 15 minutes.

Hyatt Regency Fukuoka

EXIT #4

3N

APA

hotel

Fukuoka City Subway

Cafe

A.R.KBuild.

NISSAN

Hakata Station Shin-kansenfor Tokyo/OsakaHakata gate

Hakata StationChikushi gate

Higashihie Station

Higashihie Intersection

Park

Hyakunenbashidori Ave

Higashi FukuokaHigh School

Elemen-tarySchool

Fukuoka Airport Station

CG-E-0001LTR-2020082501Copyright (C) 2020 ULTEX Corporation, All rights reserved.

ULTEX Corporation 2-9-28 Higashihie Hakata-ku Fukuoka-shi 812-0007, Japan

Phone: +81 92-413-5371 Fax: +81 92-413-5374 https://www.ultex.co.jp/

SPS/SoundPower for Space bonding theoryThis is a line of thinking that one of the confirmation methods of space energy in earth's atmosphere is [Sound bonding], and this method is the important method of construction as an utilization method for environmentMoreover SoundPower Bonding creates new Space. This repeated creation is the cosmic phenomenon itself

Since establishment of the company, Ultex has always applied to R&D laboratory business which is mainly about ［metal bonding technology］ by Sound energy for technical development with the future-oriented

The result of studies over the years is completion of【SoundPower for Space】bonding theory as fundamental technology of metal bonding. Specifically bonding of metals at outer space is not digital phenomenon but analog phenomenon

Therefore the option of pressure method which transmits sound energy is only【air】 for analogResponse speed and flexibility of analog trace physical phenomenon finely during bonding. Parts are not bonded by constant speed. Even if pressure by air which transmits sound energy to bonding parts is too high or too low, energy won’t be fixed at the bonding layer (layer between the parts where you want to bond). Precise load 〈± 0〉is always demanded for bonding process. “Precise air cylinder pressure mechanism” of Ultex is the only solution to trace difference of the velocity between parts and a horn

As indicated in Ultex’s achievement, completion degree of application technology of sound energy could improve so much by SPS bonding theory. In the future, we will expand the area from ［Ultrasonic］ which started in 20th century to 【Sound】 in 21st century. And we will diffuse this new major method as real fundamental technology which is essential for "manufacturing"

Then we will develop innovated technology based on supported theory more to achieve 〈zero〉for mass production defect rate in plant and reduce production cost as 〈zero〉as possible, and we will make history of sound energy and lead the world

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Consulting / We cooperate to embody customers’ specific applications・ We cooperate to embody new applications using existing facilities・ We cooperate to improve existing facilities and applications in mass production

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Entrusted development / We embody requested applications using ［SoundPower］tech. for mass production and we provide 〈Lab. system〉 or 〈engine〉 for production

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Development participation / We participate and cooperate projects for purpose of specific themes for limited time

［Business courses of Ultex］

※ Price of each course depends on term and difficulty※Existing facilities are only things made by Ultex

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Name　　　 ULTEX CORPORATIONEstablishment　　 September 28,1990Location Headquarter, 2-9-28 Higashihie Hakata-ku Fukuoka-shi　　　　　　 　 TEL +81-92-413-5371 FAX +81-92-413-5374 URL https://www.ultex.co.jp/Director Chairperson and President Shigeru Sato Vice President Mayumi KoyaCapital 63 million yenNumber of Employee 25 peopleBusiness Purpose R&D of [SoundPower] technology <Basic tech.・Applied tech.>Theme　　　　 ▶ Sound metal bonding technology 　　　　　　　 ▶ Sound micro bonding technology 　　　　　　　 ▶ Sound rotary (seam) technology 　　　　　　　 ▶ Sound soldering technology　　　　　　　 ▶ Sound cutting technology　　　　　　　 ▶ Application technology 　　　　　　　 ● Consulting (Entrusted development/Participation in development）Cooperation　 　DUKANE IAS LLC, Illinois USABusiness Area　　 Motor Semicon Electrical and Electronic Battery Steel Nonferrous Superconductivity etc.Bank　　 Fukuoka Bank, Head office & Hakataekimae branch MUFG Bank, Fukuoka branch

View of Ultex

1990 ［Ultex Corporation］ is established for developing and spreading the advanced ultrasonic technologies1990 New bonding tech of Aluminum to Ceramics is announced (the World’ s first)1992 First ever adoption of our "Sound Metal Bonding technology" for mass production of the world's first produced Sony’s <Lithium Ion batteries> (the World’ s first)1995 Released the [40M] Sound Metal bonding system with ［Dual Support System］ (the World’ s first)1997 "SoundPower bonding technology" was adopted in the World’s first <power module> assemblies (the World’ s first)1998 Adoption of "DSSR Ultrasonic Rotary technology" for mass production of <Ni-MH batteries> used in hybrid car <PRIUS> (the World’ s first)1998 Released the <Ultrasonic Flip-Chip Bonder> [LAB-SH50MP], with Sound and Heat horn (the World’ s first)2000 At the Internepcon Japan, publication of "Flip-Chip Bonding by Ultrasonic Bonding Machine with DSS Structure" 2000 Flip-Chip tech is adopted by the ［Association of Super-Advanced Electronics Technologies］ ASET/NEDO and "3D mounted device tech" is announced in 20032001 Released the "semi-automatic" Ultrasonic Flip-Chip Bonder with heat [FCB-SH50MP] (the World’ s first)2002 Released high tech Sound Metal Bonding system [40MZ] as "new series" (the World’ s first)2002 A few semi-conductor manufacturers begin <mass production of multi-bump IC packages> with "DSS Sound Flip-Chip Bonding tech" (the World’ s first)2003 Released the DSS Sound Metal Bonding system [20MZ Series] , for large scale applications (the World’ s first)2005 Adoption of the [30MZ] for mass production of <power control unit> used in <hybrid car LEXUS> (the World’ s first)2008 New conception of <CSS> Dip method in Pb-free & Non-flux "Sound Soldering technology", is developed (the World’ s first)2008 Adoption of Sound Soldering system [20CSS] in mass production of power module assembly (the World’ s first)2011 Mass production of <Lithium Ion batteries used in Honda HV> is started by adoption of DSS Sound Metal Bonding system (the World’ s first)2012 Bonding of Aluminum and Copper over 4mm thick becomes a possibility with DSS Sound Metal Bonding system [15MZ] (the World’ s first)2012 SoundBonding of <Cu-Ceramic Substrate to 4 Silicon chips> that 2 solder sheets are sandwiched, becomes a possibility (the World’ s first)2012 SoundBonding of <Copper plate to SiC chip> that Aluminum sheet is sandwiched becomes a possibility (the World’ s first)2013 "SoundBonding ribbon bonder" that bonding of metal ribbon <over 5mm in width> becomes a possibility, is released (the World’ s first)2014 <Bonding of Tin-plated parts> becomes a possibility with SoundBonding system (the World’ s first)2014 Bonding of <Aluminum wiring harness having 100 sqmm> becomes a possibility with SoundBonding system (the World’ s first)2014 In atmosphere at room temperature, bonding of <solder sheets and solder paste> becomes a possibility with SoundBonding system (the World’ s first)2014 In atmosphere at room temperature, bonding of <metal nano paste and metal micro paste> becomes a possibility with SoundBonding system (the World’ s first)2015 Mass production of <Ni-MH batteries> used in Chinese <Collora HV and Levin HV>, is started (First time in China)2015 New bonding technology [Sound Excitation Bonding/SEB] can bond in atmosphere at room temperature, is invented (the World’ s first)2016 [Vertical Vibration Bonding/VVB] can bond materials such as metals and different materials, is invented (the World’ s first)2016 New SoundPower bonding technology [Clip Ingot Bonding/CIB] that bonding marks don't remain to applications, is invented (the World’ s first)2017 <Bonding of SiC elements to heat sink by sandwiching Al foil at 4 points by one shot> becomes a possibility with [SEB] tech (the World’ s first)2017 [MST/Multi-Step Tool] for CIB tech is developed and bonding of 100 foil for LIB at 2 points by one shot becomes a possibility (the World’ s first)2017 [3-dimensional hermetic sealing bonding] tech with VVB・HVB is developed (the World’ s first)2019 [Energy concentration bonding/ECB] tech that there are no damages of tools in also bonding of Steel, is developed (the World’ s first)2019 [DoublePower system] that output 10000 watt is the largest in the world and structure is DSS in SoundBonding, is developed (the World’ s first)2020 Intermittent vibration type [Stitch Rotation structure] which is Rotary bonding tech, is developed (the World’ s first)2020 SoundBonding tech ［PHE/Prevention of Hydrogen Embrittlement］ is developed for steels bonding (the World’ s first)

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［The Policy 1990］when Ultex established in 1990 was to pursue ［spread of ultrasonic technology］in "metal bonding and soldering"

fields as solutions of ［environmental problem and energy problem］

The mission of Ultex innovative technology ” “has been contributing to [De-carbon society] since 1990

In 2015 which is after a quarter of century, the technology reached to level of［SPS/SoundPower for Space］ bonding theory. Through

〈Ultrasonic Laboratory〉, range that we pursued expands to ［SoundPower］which covers general sound energy. Now［The

mission 2020］ is beeing developed

ECB［ECB/Energy Concentration Bonding］ is the technology that we

pursued energy utilization method using SoundPower efficiently　

Sound rotary

Sound soldering

Sound cutting

Sound metal bonding

3D tankAssy

Bonding of Steel ・HTSS

GraphiteSlit processing

Power modulePre-soldering

Ultex has applied many ［International patents］ on the basis of global strategy as 〈SoundPower Laboratory〉

　［DSS］Metal bonding system with Dual Support System（Heavy duty holding method for vibrating horn）　 ［DSSR］Rotary system with Dual Support System（Continuous Seam Bonding with DSS）　［S&H］Heated sound horn（Flip chip bonding method using both Sound & Heat energy at the same time）　［SEB］Sound Excitation Bonding in the atmosphere at room temperature （Bonding method that atoms are excited by sound energy）　［VVB］Vertical Vibrating sound Bonding （3-dimensional metal bonding method with vertical vibration）　［CIB］Clip Ingot sound Bonding（Bonding method that bonding marks don’t remain on metal foil）　［CSS］Cavity vertical Soldering System（With non-flux, and resonant system for efficient soldering）　［MST］Bonding of 100 layers of electrode foil for LIB without bonding marks （Multi-Step Tool）　［ECB］Parts are designed for bonding that enegy can be concentrated（Energy Concentration Bonding） ［SR］Stitch Rotation（High-tech Intermittent type sound rotation mechanism） ［WPS］DoublePower system（DSS/ Output of DSS bonding system doubles. output : 10000watt） ［PHE］Bonding method which prevent hydrogen embrittlement of Galvanized steel plate, etc. (Prevention of Hydrogen Embrittlement)

Organization& Patent strategy

Laboratory & R&D EngineeringProduction

Production div.

Customer

Customer

Lab. and R&D div. Engineering div.

We provide ［application soft] to customer

We provide Ultex’ s original［latest technology] to customer

We provide hardware［Lab. system/engine/tool] to customer

Strategic Insitute of SoundPower

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[The Policy]

The possibilities of Ultrasonic is unlimitedin modern technology.

Ultex has been developing advanced technology in the field of "Ultrasonic Metal Bonding" and "Ultrasonic Soldering" to suit our customer's needs. Ultex steadies and establishes the High-power Ultrasonic as the new major technical method.

We are strongly hoping this new method will innovate in Assembly Technology and contribute to the Prevention of Environmental Destruction as well as Energy Conservation.

since 1990

In （the first ultrasonic bonding boom)in 1960s, ［metal bonding technology and soldering technology］ didn’t evolve and these technologies declined as 〈non available methods〉 in “manufacturing” In 1990,【ULTEX Corporation /ULTRA EXCELLENT COMPANY】 was established as a laboratory to evolve ［metal bonding technol-ogy］ and［soldering technology］ based on physics. Since establishment for 30 years, we have focused on R&D of bonding and soldering technologiesAs a result, the technologies have been adopted for mass-production of “LIB” for the first time in the world, “large-sized Ni-MH bat-teries” used in hybrid cars PRIUS, “flip chip bonding” and “power modules” and these continue up to today. Nowadays, the technol-ogies are adopted for “large-sized LIB” for cars Idea ［Simple Easy Processing］which pursue extremely simple and concise process proves level of completeness of Ultex technol-ogy which leads mass production results as 〈mass production defect rate 0〉In Ultex which developed bonding technology of ［soldered nonferrous parts and Steel・HTSS］, development of innovative tech-nologies such as ［bonding of large applications］ ［bonding of different materials］ ［3D bonding］is in progress. Moreover we are proceeding with supports in fields of superconductivity and fuel cell batteries