cmos testing-2 - duke electrical and computer...

ECE 261 James Morizio 1

CMOS Testing-2• Design and test• Design for testability (DFT)

– Scan design

• Built-in self-test• IDDQ testing


Design and Test Flow: Old View• Test was merely an afterthought

Specification

DesignDesignerrors

Fabrication

Testing

Randomdefects

Synthesis, full-customsimulation, verification,test generation

Accept Reject

Pass Fail


Design and Test Flow: New ViewDesign and test are tightly coupled

Specification

Design fortestability

Designerrors

Fabrication

Testing

Randomdefects

Accept Reject

Pass Fail

Processimprovements

Designimprovements

Diagnosis


Testing Sequential CircuitsDifficult problem-internal states cannot be directly controlled and observedLong test sequences are necessarySolution: Scan design-simplify to combinational circuit testing

Combinationallogic

Registers

Primaryinputs

Primaryoutputs

(controllable) (observable)

State outputs(not observable)State inputs

(not controllable)


Design for Test

• Design the chip to increase observability and controllability

• If each register could be observed and controlled, test problem reduces to testing combinational logic between registers.

• Better yet, logic blocks could enter test mode where they generate test patterns and report the results automatically.


Scan DesignMake all flip-flops directly controllable and observable by adding multiplexersPopular design-for-test (DFT) technique-circuit is now combinational for testing purposes

Combinationallogic

Primaryinputs

Primaryoutputs

Scan in

Scan out

Scan cells

State inputsState outputs(controllable)(observable)


Scan Design• Convert each flip-flop to a scan register

– Only costs one extra multiplexer

• Normal mode: flip-flops behave as usual• Scan mode: flip-flops behave as shift register

• Contents of flopscan be scannedout and new values scannedin

Flo

p

QD

CLK

SI

SCAN

scan out

scan-in

inputs outputs

Flo

pF

lop

Flo

pF

lop

Flo

pF

lop

Flo

pF

lop

Flo

pF

lop

Flo

pF

lop

LogicCloud

LogicCloud


Scan Cell Design0

1D Q

Scan in(Test data)

Data(Functional)

N/T

N/T = 1: Test mode

N/T = 0: Normal mode

Scanin

ClockD0 D1 D2 D3

Scanout

N/TQ0 Q1 Q2 Q3Clock


Scannable Flip-flops

0

1 Flo

pCLK

D

SI

SCAN

Q

Dφ

φ

φ

φ

X

Q

Qφ

φ

φ

φ

(a)

(b)

SCAN

SI

Dφ

φ

X

Q

Qφ

φ

φ

φ

SI

φs

φs(c)

φ

φd

φd

φd

φs

SCAN


Scan Design• Separate input and output 4-bit scan registers• Test sequence: {01100, 11011}, first 4 bits are for flip-flops

Combinational circuitCombinational circuit

Scan chain/Scan path

Test data

Test responses

01101101

10

Controllableprimaryinput

N/T

N/T


Steps in Scan Testing• N/T = 1: Scan in test pattern, hold appropriate bit

pattern on controllable primary inputs• N/T = 0: Apply test pattern to combinational circuit• N/T=1: Scan out test responses• Scan provides complete controllability and

observability• Testing time? How many cycles? How to test scan

registers?


Long Scan Chains

Test vectors need to be translated to scan format

Nor

mal

dat

a

Scan chainTest data


Built-in Self-test

• Built-in self-test lets blocks test themselves– Generate pseudo-random inputs to comb. logic– Combine outputs into a syndrome– With high probability, block is fault-free if it produces

the expected syndrome


Built-in Self Testing (BIST)

On-chip test generator and response monitor

Testgenerator

(TGC)

Testgenerator

(TGC)

(CUT)

Control

InputsOutputs

Error

0

1

Responsemonitor

(RM)

Responsemonitor

(RM)

Circuitunder test


BIST: Advantages• Lower cost due to elimination of external tester

• Sematech’s projection: 500 MHz tester (400 pins) will cost $50M in 2010, 90% of on-chip testing will be done using BIST

• In-system, at-system, high-quality testing• Faster fault detection, ease of diagnosis• Overcomes pin limitations and related interfacing problems• Reduces maintenance and repair costs at system level


BIST: IssuesTest strategy (random, exhaustive, deterministic)Circuit partitioningTest pattern generation

Exhaustive: countersRandom: Linear-feedback shift registers (LFSRs)Deterministic: ROM, other methods?

Response analysisTest control and scheduling


BIST Logic Circuits

Test patterns

• Linear-feedback shift-register (LFSR)

• Multiple-input signature register (MISR) Test responses

Signature


BIST Pattern Generation• Linear Feedback Shift Register

– Shift register with input taken from XOR of state– Pseudo-Random Sequence Generator

Flo

p

Flo

p

Flo

pQ[0] Q[1] Q[2]

CLK

D D D

7654321

1110QStep


BIST Pattern Generation• Linear Feedback Shift Register


Flo

p

Flo

p

Flo

pQ[0] Q[1] Q[2]

CLK

D D D

765432

11011110QStep


PRSG• Linear Feedback Shift Register


Flo

p

Flo

p

Flo

pQ[0] Q[1] Q[2]

CLK

D D D

76543

101211011110QStep




Flo

p

Flo

p

Flo

pQ[0] Q[1] Q[2]

CLK

D D D

7654

0103101211011110QStep




Flo

p

Flo

p

Flo

pQ[0] Q[1] Q[2]

CLK

D D D

765

10040103101211011110QStep




Flo

p

Flo

p

Flo

pQ[0] Q[1] Q[2]

CLK

D D D

76

001510040103101211011110QStep


PRSG

• Linear Feedback Shift Register– Shift register with input taken from XOR of state– Pseudo-Random Sequence Generator

Flo

p

Flo

p

Flo

pQ[0] Q[1] Q[2]

CLK

D D D

70116001510040103101211011110QStep


PRSG

• Linear Feedback Shift Register– Shift register with input taken from XOR of state– Pseudo-Random Sequence Generator

Flo

p

Flo

p

Flo

pQ[0] Q[1] Q[2]

CLK

D D D

111 (repeats)70116001510040103101211011110QStep


BILBO• Built-in Logic Block Observer

– Combine scan with PRSG & signature analysis

MODE C[1] C[0]Scan 0 0Test 0 1Reset 1 0Normal 1 1

Flo

p

Flo

p

Flo

p

1

0

D[0] D[1] D[2]

Q[0]Q[1]

Q[2] / SOSI

C[1]C[0]

PRSGLogicCloud

SignatureAnalyzer


Boundary Scan

• Testing boards is also difficult– Need to verify solder joints are good

• Drive a pin to 0, then to 1• Check that all connected pins get the values

• Through-hold boards used “bed of nails”• SMT and BGA boards cannot easily contact pins• Build capability of observing and controlling pins

into each chip to make board test easier


Boundary Scan Example

Serial Data In

Serial Data Out

Package Interconnect

IO pad and Boundary ScanCell

CHIP A

CHIP B CHIP C

CHIP D


Boundary Scan InterfaceIEEE 1149.1 JTAG standard

• Boundary scan is accessed through five pins– TCK: test clock– TMS: test mode select– TDI: test data in– TDO: test data out– TRST*: test reset (optional)

• Chips with internal scan chains can access the chains through boundary scan for unified test strategy.


BIST in IndustryEarly days: AT&T (Lucent) incorporated BIST in hundreds of commercial chips

Intel: 80386, Pentium, Pentium ProHardware overhead typically 15% of self-tested portion (around 5% for entire chip, e.g. 6% for the Pentium Pro)Regular embedded arrays (RAMs, PLAs) almost always tested using BIST: DEC Alpha, PowerPCBIST for irregular logic not so widespread


IDDQ Testing• Based on current measurements, not voltage

– IDDQ = IDD quiescent

• In CMOS technology, quiescent current is very low

• Testing idea: check for faults by detecting current spikes– Advantage: Massive observability, good for detecting shorts– Disadvantage: slow, leakage current closer to quiescent current for

deep submicron

cmos testing-2 - duke electrical and computer...

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