Chapter 1-

CHEM 201: An Introduction to Materials Science & EngineeringCourse Objective...

Introduce fundamental concepts in MSEYou will learn about:• material structure

• how structure dictates properties• how processing can change structure

This course will help you to:• use materials properly• realize new design opportunities

with materials

a

Chapter 1-

Lecturer: Üner ÇolakTime: Tuesday 13:40-15:30,

Thursday 15:40-16:30

Location: BZ-04 Activities:

• Present new material• Announce reading and homework• Take quizzes and midterms*

*Make-ups given only for emergencies.*Discuss potential conflicts beforehand.

b

LECTURES

PLEASE BE ON TIME

Chapter 1-

About me !• Education:

– B.Sc.: Istanbul Technical University, Materials and Metallurgical Engineering

– M.Sc.: Iowa State University, Nuclear and Materials Engineering

– Ph.D.: Iowa State University, Nuclear and Materials Engineering

• Current Position: Professor, Hacettepe University, Nuclear Engineering

• Research Interests: Electrospinning, nanofiber production, advanced ceramics, coating materials

Chapter 1-

Purpose:• Discuss homework, quizzes, exams• Hand back graded quizzes, exams• Discuss concepts from lecture

Instructor: TBDTimes and Places:

___.___.___.___.___.

X:XXamX:XXpmX:XXpmX:XXamX:XXpm

_____ XXX_____ XXX_____ XXX_____ XXX_____ XXX

Recitations start ??? week. If necessary, open more recitation sections.

c

RECITATIONS (If needed !)

Chapter 1-

Teaching Assistants will• participate in recitation sessions,

• have office hours to help you with course material and problem sets.

Name_TBD_______________________

Office_____ XXX_____ XXX_____ XXX_____ XXX_____ XXX

Tel.X-XXXXX-XXXXX-XXXXX-XXXXX-XXXX

E-mail_________________________

d

TEACHING AND GRADING ASSISTANTS

Chapter 1-

Activities:• Discuss homework, quizzes, exams• Discuss lectures, book• Pick up missed handouts

Contact me for special arrangements!

e

OFFICE HOURS

• Any materials science related discussions

Chapter 1-

Required text:• Materials Science and Engineering: An Introduction

W.D. Callister, Jr., 7th edition, John Wiley and Sons, Inc. (2006). Both book and accompanying CD-ROM (material on the publisher’s web page) are needed.

Online Material:• Web site : http://www.fen.bilkent.edu.tr/~uner/chem201/fenis.html

•Reference material• Presentations, links, papers, course-work

• HW questions:• Solutions to HW

• Solutions for Quiz, Midterm, Final questionsf

COURSE MATERIAL

Chapter 1-

Midterm #1 20%Midterm #2 20%Final 40%

g

GRADING

Homework 10%

Term paper, attendance, and participation to in-class discussions 10%

Chapter 1-

Materials Science in Industry

• INTEL• SONY• TOSHIBA• ELPIDA• SAMSUNG• GE• IBM• SEAGATE• APPLIED

MATERIALS

• HONDA• TOYOTA• HYUNDAI• GM• FORD• 3M• CHRYSLER• SEAGATE

• BOEING• LOCKHEED• TSMC• UMC• HP• HITACHI• MOTOROLA• In TURKEY ?

Chapter 1-

Materials are... engineered structures...not blackboxes!

Structure...has many dimensions...

Structural feature Dimension (m)atomic bondingmissing/extra atomscrystals (ordered atoms)second phase particlescrystal texturing

< 10-10 10-10

10-8-10-110-8-10-4> 10-6

1

CHAPTER 1: MATERIALS SCIENCE & ENGINEERING

Chapter 1-

ex: hardness vs structure of steel • Properties depend on structure

Data obtained from Figs. 10.21(a)and 10.23 with 4wt%C composition,and from Fig. 11.13 and associateddiscussion, Callister 6e.Micrographs adapted from (a) Fig.10.10; (b) Fig. 9.27;(c) Fig. 10.24;and (d) Fig. 10.12, Callister 6e.

ex: structure vs cooling rate of steel • Processing can change structure

2

Structure, Processing, & Properties

Cooling Rate (C/s)100200300400500600

0.01 0.1 1 10 100 1000

(a)

30m

(b)

30m

(d)

30m(c)

4m

Hard

ness

(BHN

)

Chapter 1-

1. Pick Application Determine required Properties

2. Properties Identify candidate Material(s)

3. Material Identify required ProcessingProcessing: changes structure and overall shapeex: casting, sintering, vapor deposition, doping forming, joining, annealing.

Properties: mechanical, electrical, thermal,magnetic, optical, deteriorative.

Material: structure, composition.

3

The Materials Selection Process

Chapter 1-

T (°C)-200 -100 0

Cu + 3.32 at%Ni

Cu + 2.16 at%Ni

deformed Cu + 1.12 at%Ni

123456

Resis

tivity

,

(10-

8 Oh

m-m

)

0

Cu + 1.12 at%Ni

“Pure” Cu

• Electrical Resistivity of Copper:

• Adding “impurity” atoms to Cu increases resistivity.• Deforming Cu increases resistivity.

4

Adapted from Fig. 18.8, Callister 6e.(Fig. 18.8 adapted from: J.O. Linde,Ann Physik 5, 219 (1932); andC.A. Wert and R.M. Thomson,Physics of Solids, 2nd edition,McGraw-Hill Company, New York,1970.)

ELECTRICAL

Chapter 1-

• Space Shuttle Tiles: --Silica fiber insulation offers low heat conduction.

• Thermal Conductivity of Copper: --It decreases when you add zinc!

Composition (wt%Zinc)Ther

mal

Con

duct

ivity

(W

/m-K

)

400

300200

10000 10 20 30 40

5

Fig. 19.0, Callister 6e.(Courtesy of LockheedMissiles and SpaceCompany, Inc.)

100m

Adapted fromFig. 19.4W, Callister 6e. (Courtesy of Lockheed Aerospace Ceramics Systems, Sunnyvale, CA)(Note: "W" denotes fig. is on CD-ROM.)

Adapted from Fig. 19.4, Callister 6e.(Fig. 19.4 is adapted from Metals Handbook: Properties and Selection: Nonferrous alloys and Pure Metals, Vol. 2, 9th ed., H. Baker, (Managing Editor), American Society for Metals, 1979, p. 315.)

THERMAL

Chapter 1-

• Magnetic Permeability vs. Composition: --Adding 3 atomic % Si makes Fe a better recording medium!

Magnetic FieldMag

netiz

atio

n

Fe+3%SiFe

Adapted from C.R. Barrett, W.D. Nix, andA.S. Tetelman, The Principles ofEngineering Materials, Fig. 1-7(a), p. 9,1973.Electronically reproducedby permission of Pearson Education, Inc.,Upper Saddle River, New Jersey.

6

Fig. 20.18, Callister 6e.(Fig. 20.18 is from J.U. Lemke, MRS Bulletin,Vol. XV, No. 3, p. 31, 1990.)

• Magnetic Storage: --Recording medium is magnetized by recording head.

MAGNETIC

Chapter 1-

• Transmittance: --Aluminum oxide may be transparent, translucent, or opaque depending on the material structure.

7

Adapted from Fig. 1.2,Callister 6e.(Specimen preparation,P.A. Lessing; photo by J. Telford.)

single crystalpolycrystal:low porosity

polycrystal:high porosity

OPTICAL

Chapter 1-

• Stress & Saltwater... --causes cracks!

• Heat treatment: slows crack speed in salt water!

4m--material: 7150-T651 Al "alloy" (Zn,Cu,Mg,Zr)

Adapted from Fig. 11.20(b), R.W. Hertzberg, "Deformation and Fracture Mechanics of Engineering Materials" (4th ed.), p. 505, John Wiley and Sons, 1996. (Original source: Markus O. Speidel, Brown Boveri Co.)

8

Adapted from Fig. 17.0, Callister 6e.(Fig. 17.0 is from Marine Corrosion, Causes, and Prevention, John Wiley and Sons, Inc., 1975.)

Adapted from Fig. 11.24,Callister 6e. (Fig. 11.24 provided courtesy of G.H.Narayanan and A.G. Miller, Boeing CommercialAirplane Company.)

“held at 160C for 1hr before testing”

increasing loadcrac

k sp

eed

(m/s

)

“as-is”

10-10

10-8

Alloy 7178 tested in saturated aqueous NaCl solution at 23C

DETERIORATIVE

Chapter 1-

Materials• Metals :• Ceramics :• Polymers :

• Composites : SPORTS, DEFENSE• Semiconductors : ELECTRONICS• Bio-materials : BIO-MEDICAL APPLICATIONS• Nano technology : FUTURE

– Fullerenes, Nanotubes, etc– MEMS– NANOMACHINES

Chapter 1-

Examples• Semiconductors:

– Prediction– Devices, surfaces, etc

• Structure – Property relationship:– BN

• Nano-materials:– Fullerenes

• Future:– Nano-machines

Chapter 1-

As of 2001

• Semiconductors: minimum feature size 180 nm. • 90 nm (65 nm) in year 2005.• 30 nm in year 2014. (updated est 32 nm in year

2009)• Data storage: largest areal density ~30Gbit/in2.

• ~100 Gbit/in2 in year 2001-2002.• 1Tbit/in2 in year 2015.

• Fullerenes and nanotubes: synthesis 1985 and 1991.

Chapter 1-

• Use the right material for the job.

• Understand the relation between properties, structure, and processing.

• Recognize new design opportunities offered by materials selection.

Course Goals:

9

SUMMARY

Chapter 1-

Reading: Chapter 1 and Chapter 2

Core Problems:

Self-help Problems:

0

ANNOUNCEMENTS