challenges during design and construction of an underground chip factory (waferfab)

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WTC 2013, Design and Construction of an Underground Chip Factory (Waferfab)

Challenges during Design and Construction of an Underground Chip Factory (Waferfab)

Christoph Rüegg and Helmut Wannenmacher, Amberg Engineering AG

Christian Schönlechner, Jäger Bau GmbH

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Topic

Overview of waferfab

The project idea; from implementation to construction

Design challenges of an underground chip factory

Challenges during construction

Conclusion

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OverviewWhy Underground?

Sensitive industrial process for optoelectronic semiconductor chip production (strict vibration and temperature control)

Best economic solution:Central utility building (CUB) with two shallow caverns for optoelectronic semiconductor chip production

->favorable foundation / constant climate conditions for chip production

PRODUCTION &

LITHO CAVERN

EVACUATION &VENTILATION TUNNEL

ACCESS TUNNEL

MAINTENANCE TUNNEL

CUB

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WTC 2013, Design and construction of an underground chip factory (waferfab)

Overview

View from the access tunnel to the main production cavern with the perpendicularly oriented litho cavern on the left hand side

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The Project Idea - from Implementation to Construction

The project idea was part of the global engineering strategy of Amberg Engineering Ltd. focusing on solutions for underground production and storage facilities.

Presented in spring 2007 to the client, epc

Economical / technical feasibility studies and detailed study in summer 2007

Decision for an underground solution was made in October 2007 (in total, 5 months from project idea to decision)

Another 8 months for approval design, final project and tender documents

->In total, 13 months from project idea to construction start

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Design Challenges for an Underground Chip Factory

Integrative approach of all design parties under •Operational aspects•Constructional aspects•Environmental and safety aspects

Most important challenge:Reconsile contrary aspects of all design parties and work out a cost-effective production facility fab

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Design Challenges for an Underground Chip FactoryExample: General Layout

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Design Challenges for an Underground Chip FactoryExample: Layout of Production Cavern

Roof constructionShotcrete lining

Wafertable

Maintenance / Supply air

Supply / Disposal

Clean room

Access tunnel

Maintenance tunnel

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Design Challenges for an Underground Chip FactoryExample: Dimensions of Access and Maintenance Tunnel

access tunnel

maintenance tunnel

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Design Challenges for an Underground Chip FactoryExample: Escape Path and Ventilation System

S UBFAB

CLE ANROOM

V ENTILA TION

CLE ANROOM

P LE NUM

ROOF

CLE ANROOMV ENTILA TION

PLAN VIEW PLAN VIEW

SECTION A-A SECTION A-A

82.90

8.00 56.90 18.00

99

.15

37

.85

18

.00

42

.30

82.90

8.00 56.90 18.00

16

.80

5.0

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1.8

0

CLE ANROOM

Ma

i nte

na

nc

e T

unn

el

Ac

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ss

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nel

0

SCALE10 m5

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Challenges during ConstructionStability of Cavern

Huge cross-section with low overburden -> low horizontal stress

Simulation of spontaneous

rock instability

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Open joints of up to 1 m

-> hardly any horizontal stress

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Overbreaks

torn out rock bolt

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Measurement Control System

Start excavation middle/left side g

Start excavation right side

max. deformation 7 mm

- extensometer

- 3D survey with anchor

Results- rapidly declinig deformations

- max. deformation of 8 mm, up to 8 m into rock

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Conclusion

Underground space for production facilities with strict limitations on vibration and/or climatic conditions is an economic alternative.

Premises:

Good rock conditions, low water inflow

Direct and short access to the production facility

Integrative approach of all design parties

challenges during design and construction of an underground chip factory (waferfab)

Documents

construction design

underground production

underground solution

design parties

approval design

construction conclusion

project idea

main production cavern