carmelo papa.ppt

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    Materials for the 2020 Challenges:

    The view of industry

    1

    Materials for the 2020 ChallengesEuropean Parliament Brussels. July 10 2012

    Carmelo Papa

    Executive ice President!

    "ndustrial and Multisegment #eneral Manager

    $TMicroelectronics

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    %utline 2New materials can address societal challenges by:

    &oosting performances of 'ey ena&ling technologies

    introducing entirely new functions in systems and changing

    manufacturing flow

    Examples of new materials in semiconductor industry:

    $iC and #a( for the new wave of power electronics

    Polymers and flexi&le electronics for healthcare

    Keep looking at advanced materials: e.g. graphene

    Bridging the gap between material science and market

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    From Materials todei!es to systems"

    ".andi!eersa# pro$lems

    from appli!ations leadingto applied and fundamental %&'FundamentalMaterial studies

    Early dei!eprototypes

    'ei!e engineering

    and industrialisation

    (ppli!ations

    ( long path from materials to appli!ations

    ele!tri!)hy$rid !ar

    (l

    *+,-iC

    i/-iC2

    0.0 0.5 1.0 1.5 2.0

    10-12

    10-11

    10-10

    10-9

    10-8

    10-7

    10-6

    10-5

    10-4

    10-3

    10-2

    10-1

    Ni2Si/4H-SiC

    T=25 K

    473 K

    98 K I(A)

    Forward bias (V)

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    4

    $ocietal challenges calling for &etter power

    actuators: energy efficiency and)

    12

    il pri!e in!rease

    3 456 of produ!ed energypresently deried fromhydro!ar$ons

    7yoto proto!ol on redu!inggreenhouse gas emissions

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    )*people concentration in megacities

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    +

    Healthcare spending is growing fast : currently !" of #$% for &'()

    *" of #$% for Europe

    #lobal Healthcare spending is more than ! +rillion $ollars per year

    +his spending trend is unsustainable for the future economy

    +o counter this trends) the Healthcare industry must change

    ( move towards %ersonal Home $iagnostic

    'ocietal ,hallenges in Healthcare

    Sensors around the body

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    Emerging ,pplications re-uire $mart "ntegration :Moores Law and More than MooreMoores Law and More than Moore

    More than Moore # 'iersifi!ation

    Moore8s

    9a:

    #Miniaturi;ation

    -oCand-iPmi

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    8

    From -i Po:er 'ei!es"".

    he most re!ent -i M-FEat - Mi!roele!troni!s

    0 um -i :afer pro!essingfor adan!ed >?Bs dei!es

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    =.to 'i, and #aN power devices

    /

    $ource: ole veloppement!

    3Better power density3/ower losses3Higher operation temperature3Higher operation fre>uency

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    95! 'i, and #aN power device +(-:

    ?5.!B

    10

    'i, and #aN power devices

    $ource: ole veloppement! $TMicroelectronics

    #aN %rogram#aN %rogram7!50 1 !( HE-+

    7!50 1 955( HE-+

    #aN +ransistor vs. 7!5 0 uency

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    'i, and #aN in 2enewable Energy

    $ource: i$uppli

    %0

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    'i, and #aN in Hybrid G Electric 0ehicles

    $ource: ole veloppement! $TMicroelectronics

    HE0 1 E0 958 'emiconductor +(-:?.6B

    ,(#2 95D958: 9*"

    P7E: Plug8in 7y&rid Electric

    ehicles

    2ectifiers

    %ower'witches@-'3E+)

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    $mart $ystems are everywhere and re-uire

    the introduction of a wealth of new materials

    19

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    Healthcare

    & Fitness Automotive &

    Transportation

    AmbientIntelligence

    WearableElectronics

    Gaming &Leisure

    Portable

    Consumer 'le(i$le Conforma$le

    Self Powered "utonomous

    )ireless islocation

    Cost #ffective isposa$le

    *ight Porta$le

    Human

    Interface

    ecurit! &

    afet!

    1

    ;lexi&le Electronics: a new material for $mart $ystems

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    ***adding material 'nowledge for ;lexi&le < isposa&le Electronics

    BioDmaterials

    -etal=(on ferrose 4,l! Ti! Cu! ,g! Tg! ,u! (i6

    Polimers ((on Metal=%rganics=Thermoplastic6

    3 Polimmide

    3 PC

    3 C%P

    3 PET

    3 PE(

    Cerami!s ((on Metal = "norganics6

    (dvantages tenacity

    low specific weight

    wor'a&ility

    'isadantages low mechanic resistance

    degradation over time

    deformation over time

    Polymers

    (dvantages mechanical characteristics

    higher resistance to the use

    ductility

    'isadantages >ow &iocompati&ility

    ?igidity

    7igh specific height

    Corrosion in physiological environment

    Metals

    (dvantages #ood &iocompati&ility

    Chemical inert

    7igh resistance to compression

    ?esistance to corrosion

    'isadantages >ow resistance to traction

    7igh specific weight ;ragility

    >ow wor'a&ility

    Ceramics

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    The pro@ect challenge is the development of interconnection technologies for

    autonomous! flexi&le and smart system:3"nterconnection technologies &etween flexi&le components and flexi&le foils as well as

    &etween functional foils*3Three dimensional functional foil integration to achieve multi8foil &ased systems! i*e*

    system8in8foil*

    Technical Demonstrator

    Energy autonomous indoor air quality sensing system capable of wirelesscommunication of the measured data

    "ncreasing complexity &y multi8foil 9

    integration on flexi&le su&strates

    1+

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    ;lexi&le Electronics at $TMicroelectronics,pplication fields:

    3 Printed sensors = ;lexi&le "Cs

    3 Multifunctional systems on foil3 $mart disposa&les for healthcare

    and am&ient intelligence

    Technologies:

    3 ;rom litho8&ased on wafer carriers

    ) to printed electronics carrier8less

    3 To 7y&rid system integration 4e*g* multi8foil6

    !ireless Strain "auge Modulesfor pressure and temperature

    Sensors around the body

    Examples:

    3 'ensors on plastic: strain1pressure)temperature) gas and biosensors

    3 'mart obects with 23 harvesting andwireless communication

    3 +ransparent and 3lexible electronics) incl.printed organics and oxides

    3

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    (pplication: Contact >ens for non8invasive earlydiagnosis and personaliAed treatment of #laucoma

    4customer: $E($"ME ,#6 $T $ensor is a strain gauge G antennaem&edded in

    a silicone contact lens

    The $ensor is capa&le of measuring corneadeformations due to

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    Example:Dia!etes Management with implanta!le !iosensors

    ,pplication: Continuous #lucose

    Monitoring 4C#M6

    !or-ing )eference Counter

    Source: $medtronic$com

    .s of /010 about 245 million people around the world2 areaffected by Type / Diabetes Mellitus disease Complicationsarising from diabetes can be both .cute and long term andinclude hypoglycemia2 3etoacidosis2 coma2 renal failure2amputations2 neuropathy2 and retinal damage

    *n the last decade "lucose sensing technology became themaor research focus in diabetes management area2 and 406of $iosensor maret are the glu!ose sensors

    %ver the next 10 years the cost of dia&etes! heart disease!

    and stro'e will ta'e a tremendous toll on the national

    incomes of developing world countries*

    (ccording to IH) diabetes) heart disease) and stroketogether will cost about ?!!!.J billion in lost nationalincome in ,hina) ?454.9 billion in the 2ussian 3ed.?447.7 billion in

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    Example: "iosensors for healthcare # fitness

    ,mperometric sensors: from #lucose to >actate

    monitoring /actate levels are related to the

    anaero&ic meta&olism associated

    with muscle contraction: 0*+ 2 millimoles in resting

    up to 20 or 90 mM during activity

    ,thletes have to stop physical activity when they reach their lactate threshold* (im: to avoid metabolic disorders and inured tissues during sport

    activities* -onitoring of several pathologic conditions! such as the case of patients

    with cardiac disease and diabetes*

    Multisensing of &iological functions Biological chemical sensors associated with other physical

    and mechanical sensors! such as EC#! accelerometers!gyroscopes! temperature! pressure! light! etc*)

    "t re-uires dedicatedelectronics a&le to ac-uire the signalsfrom sensor! process them and transmit to a porta&le remoteunit 20

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    ;rom 7ealthcare to ,m&ient "ntelligence

    3 Multifunctional systems em&edded in

    everyday o&@ects:

    a6 Direless sensor networ's3 Network of sensors em&edded with lowDcost

    electronics with 23 G analog processing capa&ility

    3 %pportunities:3 Multi8sensors integration at each sensor node3 >ow power 4either with &attery or &attery8less! where

    possi&le6

    &6 $mart o&@ects in pac'aging < textile

    3 7igh volume 4existing mar'et for ?;"63 %pportunities:

    3 Electronics on plastics) paper) textile3 #as and chemical sensors in smart obects3 3lexible G streatchable electronics

    associated with other functions and technology drivers:e*g* displays) energy harvesting) &/% radios

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    Thinnest material sheetimaginable5yet the strongest6

    (7 times stronger than steel and much lighter6

    "raphene is a semimetal# it conducts as good (in factbetter6 than the best metals2 yet its electrical properties canbe modulated (it can be switched ,9 and :,;;4$8 m.?m2 e@uivalent to 10A.?cm/

    Superb heat conductor (B'40 than Si

    )ecord electron and hole mobilities (B100 than Si

    #raphene has the potential to revolutioniAe numerous fields:

    Electronics! materials science! chemistry! &io8sensors)

    .pplications# new devices due to ambipolar transport2 e'cellent electrostaticconfinement2 integration with Si andwith fle'ible?transparent substrates

    eep watching new materials! e*g* graphene

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    29

    Market

    Technological

    developmentPilot deployment

    Pilot line

    European three pillars bridge to pass across the valley

    Knowledge

    The valley of death

    +lo$ally competitive

    manufacturing facilities