butterfly network iq cmut sensor - system plus consulting€¦ · ©2020 by system plus consulting...

©2020 by System Plus Consulting | SP20545 Butterfly Network iQ CMUT Die | Sample 1

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Butterfly Network iQ CMUT SensorFirst CMUT on Silicon Bonded on ASIC Die for Medical Ultrasound

SP20545 - MEMS report by Sylvain HALLEREAUPhysical Analyis done by Veronique Le TROADEC

April 2020 – SAMPLE

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/



Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o Butterfly

o Butterfly iQ

Physical Analysis 14

o Summary of the Physical Analysis 15

Module Views

Module Cross-Section

o CMUT Die 28

CMUT Die Views & Dimensions

CMUT Die Process

CMUT Die Cross-Section

CMUT Die Process Characteristics

o ASIC Die 58

ASIC Die Views & Dimensions

ASIC Delayering & Main Blocs

ASIC Die Process

ASIC Die Cross-Section

ASIC Die Process Characteristics

Sensor Manufacturing Process 72

o ASIC Die Front-End Process

o CMUT Die Front-End Process

o CMUT and ASIC Die Fabrication Unit

o Probe test Unit

Cost Analysis 82

o Summary of the Cost Analysis 83

o Yields Explanation & Hypotheses 85

o ASIC Wafer Cost 87

ASIC Wafer Front-End Cost

o CMUT Die Cost 90

CMUT Die Front-End Cost

CMUT Die Probe Test, Thinning & Dicing

CMUT Die Wafer Cost

o Complete Die 97

Summary of the Assembling

CMUT Die Cost

Feedbacks 99

SystemPlus Consulting Services 101




Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Feedbacks

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About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insights on technology data, manufacturing cost and selling price of theCMUT from the Butterfly iQ from Butterfly Network.

Butterfly Network have developed a large Capacitive Micromachined Ultrasonic Transducer (CMUT) die to be integrated in a handledmedical ultrasound. The iQ is based on semiconductor technology and it is manufactured by a semiconductor supply chain. This solutionallows to reduce the manufacturing cost and produce very small CMUT elements.

The Butterfly Network CMUT die is a phased array transducer, a large matrix of 8,960 transducers (140 x 64 transducers). They emit theultrasonic signal and receive the echo (acoustic waves). The large matrix, 8,960 transducers and the large ASIC die, allow to perform anefficient 2D phased array sensor. Thanks to the miniaturization of the CMUT, it is possible to perform with one probe, curved, linear andphased analyzes. In other case with conventional equipment, three different probes are necessary to enable same procedures.

The CMUT cells are manufactured with MEMS technology in silicon. Bulk and thin film micromachining technologies are used toperform the electrodes and the cavity. The secret of the first CMUT semiconductor is not only in the MEMS die but also in theintegration with the ASIC die. The ASIC die has all the function to drive the pulse generation, measure the echo, runs Butterfly Networkalgorithms and communicate with the processor on the PCB. Each CMUT is driven by a block with CMOS logic, analogic reading circuitand LDMOS transistors for the emission. The ASIC die and the CMUT die are bonded together in wafer-level and a part of the process iscommon at the two wafers after the bonding for TSV connection.

This report is focused on the analysis of the CMUT semiconductor. It includes an ultrasonic MEMS transducer and the ASIC diedeveloped by Butterfly Network. Some pictures of the disassembly of the iQ probe is displayed in the report.

Along with the complete ultrasonic CMUT MEMS teardown, this report goes with cost analysis for the die.




Overview / Introduction


Physical Analysis o System Disassembly

o Views & Dimensionso Cross-Section

o CMUT Dieo Views & Dimensionso Delayeringo Die Cross-Sectiono Die Process

o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section


Cost Analysis

Feedbacks

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About System Plus

Module Disassembly

Opening©2020 by System Plus Consulting

Disassembly©2020 by System Plus Consulting

USB cord

Main electronicboard

Head with the CMUT die

Butterfly iQ











Cost Analysis

Feedbacks

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About System Plus

Module Overview Cross-Section

Butterfly iQ Head Cross-Section©2020 by System Plus Consulting











Cost Analysis

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About System Plus

Die Overview & Dimensions

CMUT Die - Overview©2020 by System Plus Consulting

XX

mm

XXmmo Die area: xxmm²

(xx x xx)

o Active area xxmm²(xx x xx mm)

o Nb of PGDW per xx-inch wafer: xx

o Pad number: xx

o Connected: xx











Cost Analysis

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About System Plus

Die Overview Cross-Section

CMUT and ASIC Die cross-section - SEM View©2020 by System Plus Consulting

CMUT die top view - Optical View©2020 by System Plus Consulting











Cost Analysis

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About System Plus

Die Overview - Details

Detail of the top electrode – Optical view©2020 by System Plus Consulting

Detail of the top electrode – Optical view©2020 by System Plus Consulting











Cost Analysis

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About System Plus

Die Delayering – Gold Bump

Bottom silicon electrode removed –SEM view©2020 by System Plus Consulting

XXX

Bottom silicon electrode removed –SEM view©2020 by System Plus Consulting











Cost Analysis

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Die Cross-Section - Capacitor Cavity

Cavity cross-section - SEM View©2020 by System Plus Consulting

Cavity Die cross-section - SEM View©2020 by System Plus Consulting











Cost Analysis

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Die Cross-Section – Doping Revelation

CMUT after doping revelation - SEM View©2020 by System Plus Consulting

CMUT and ASIC after doping revelation - Optical View©2020 by System Plus Consulting






Physical Analysis

Manufacturing Process Flowo ASIC Front-End Processo CMUT Front-End Processo CMUT and ASIC Foundry Unito Probe Test Unit

Cost Analysis

Feedbacks

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About System Plus

CMUT Process Flow






Physical Analysis


Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso ASIC Wafer Costo CMUT Wafer Costo CMUT Die Cost

Feedbacks

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About System Plus

CMUT Front-End Cost






Physical Analysis


Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso ASIC Wafer Costo CMUT Wafer Costo CMUT Die Cost

Feedbacks

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About System Plus

CMUT Die Cost






Physical Analysis


Cost Analysis

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REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

Related Reports

MARKET & TECHNOLOGY REPORTS & MONITORS - YOLE DÉVELOPPEMENT

MEMS, Sensors & Actuators• Status of the MEMS Industry 2019• BioMEMS & Non-Invasive Sensors: Microsystems for Life Sciences

& Healthcare 2018• Status of the Medical Imaging 2020 (coming soon)

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

MEMS• TDK-Chirp Ultrasonic Time of Flight Sensor• USound Achelous UT-P 2016 MEMS Speaker• Piezoelectric Material From Bulk to Thin Film –

Comparison 2019



https://www.i-micronews.com/products/biomems-non-invasive-sensors-microsystems-for-life-sciences-healthcare-2018/


https://www.i-micronews.com/products/status-of-the-mems-industry-2019/


mailto:[email protected]?subject=I am interested in the Status of Medical Imaging 2020 report

https://www.systemplus.fr/reverse-costing-reports/tdk-chirp-ultrasonic-time-of-flight-sensor/

https://www.systemplus.fr/reverse-costing-reports/usound-achelous-ut-p-2016-mems-speaker/

https://www.systemplus.fr/reverse-costing-reports/piezoelectric-material-from-bulk-to-thin-film-comparison-2019/










COMPANYSERVICES




Physical Analysis


Cost Analysis

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About System Pluso Company serviceso Contacto Legal

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>60 reports per year)

Costing Tools

Trainings






Physical Analysis


Cost Analysis

Feedbacks

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About System Pluso Company serviceso Contacto Legal

Contact

Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]

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www.systemplus.fr

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butterfly network iq cmut sensor - system plus consulting€¦ · ©2020 by system plus consulting...

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