andreas weisshaar professor school of electrical...

Andreas Weisshaar Professor

School of Electrical Engineering and Computer Science OREGON STATE UNIVERSITY

Education

March 1991 Ph.D. in Electrical and Computer Engineering Oregon State University

July 1987 Diplom-Ingenieur in Electrical Engineering University of Stuttgart, Germany

July 1986 M.S. in Electrical and Computer Engineering Oregon State University

Sept. 1981 Vordiplom in Electrical Engineering University of Stuttgart, Germany

Positions

Sept. 2004 - present

April 2008 – Aug. 2011

Professor Electrical Engineering and Computer Science Oregon State University Program Director National Science Foundation (Division of ECCS)

Dec. 2001 Visiting Professor

Institute for Communications and Information Engineering Johannes Kepler University Linz, Austria

Sept. 1998 – Sept. 2004 Associate Professor Electrical and Computer Engineering Oregon State University

Sept. 1992 - Sept. 1998 Assistant Professor Electrical and Computer Engineering Oregon State University

July 1991 – June 1992 Post-doctoral Research Associate and Lecturer Electrical and Computer Engineering Oregon State University

Sept. 1987 – June 1991 Graduate Research/Teaching Assistant Electrical and Computer Engineering Oregon State University

Nov. 1986 - April 1987 Research Assistant University of Stuttgart, Germany

Jan. 1985 – June 1986 Graduate Teaching Assistant Electrical and Computer Engineering Oregon State University

Dec. 1984 – Dec. 1987 Technical Translations (part-time) Hewlett-Packard Co. Corvallis, Oregon

May 1984 - July 1984 Intern Daimler-Benz AG Stuttgart, Germany

Feb. 1980 - March 1980 Intern Richard Hirschmann Radiotechnisches Werk Esslingen, Germany

Aug. 1979 – Oct. 1979 Intern Electrostar Schöttle GmbH & Co. Reichenbach/Fils, Germany

External Collaborations

Industry

• Agilent • Analog Devices • Analogy • Blue Road Research • Cascade Microtech • EDX Engineering • Hewlett-Packard • Intel • National Semiconductor • Tektronix • Texas Instruments

Universities • Arizona State University • Georgia Institute of Technology - Packaging Research Center • IIT Delhi (India) • University of Hannover (Germany) • University of Linz (Austria) • University of Offenburg (Germany) • University of Oregon • University of Perugia (Italy) • Carleton University (Canada) • Politecnico di Torino (Italy)

Research Labs/ Government

• European Space Agency (ESA) • NASA • National Institute of Standards and Technology (NIST) • National Science Foundation • Oregon Department of Transportation (ODOT) • Physikalisch-Technische Bundesanstalt Braunschweig (PTB), Germany • VTT Technical Research Center of Finland

Publications 1 book, 4 book chapters

43 journal papers 76 peer reviewed conference papers 15 invited conference papers 2 editorials

Books and Book Chapters

• W. Yindeepol, A. Chin, A. Weisshaar, S. M. Goodnick, J. C. Wu, and M. N. Wybourne, “Interference Phenomena Due to Bend Discontinuities in Point Contact Structures,” in Nanostructures: Physics and Fabrication (W. P. Kirk and M. A. Reed, Eds.), pp. 139-149, 1992.

• A. Weisshaar, J. Lary, S. M. Goodnick, and V. K. Tripathi, "Negative Differential Resistance in a Double Constriction Quantum Waveguide Structure," in Granular Nanoelectronics (D.K. Ferry, J.R. Barker, and C. Jacobini, Eds.), NATO ASI Series, Series B: vol. 251, pp. 543-546, New York: Plenum, 1991.

• P. C. Magnusson, G. C. Alexander, V. K. Tripathi, A. Weisshaar, Transmission Lines and Wave Propagation, 4th Edition, CRC Press, 2001.

• A. Weisshaar, "Transmission Lines," pp. 185-226, Chapter 6 in Handbook of Engineering Electromagnetics, edited by R. Bansal, Marcel Dekker, NY, 2004.

• A. Weisshaar, “Transmission Lines,” pp. 185-226, Chapter 6 in Fundamentals of Engineering Electromagnetics, edited by R. Bansal, CRC Press, Boca Raton, 2006.

Refereed Journal Papers

• A. Weisshaar and V. K. Tripathi, “Frequency-Dependent Transmission

Characteristics of Curved Microstrip Bends,” Electron. Lett., vol. 25, pp. 1138-1139, Aug. 1989.

• A. Weisshaar, J. Lary, S. M. Goodnick, and V. K. Tripathi, “Analysis of Discontinuities in Quantum Waveguide Structures,” Appl. Phys. Lett., vol. 55, pp. 2114-2116, Nov. 1989.

• A. Weisshaar and V. K. Tripathi, “Perturbation Analysis and Modeling of Curved Microstrip Bends,” IEEE Trans. Microwave Theory Tech., vol. MTT-38, pp. 1449-1454, Oct. 1990.

• A. Weisshaar, J. Lary, S. M. Goodnick, and V. K. Tripathi, “Negative Differential Resistance in a Resonant Quantum Wire Structure,” IEEE Electron Device Lett., vol. EDL-12, pp. 2-4, Jan. 1991.

• J. C. Wu, M. N. Wybourne, W. Yindeepol, A. Weisshaar, and S. M. Goodnick, “Interference Phenomena Due to a Double Bend in a Quantum Wire,” Appl. Phys. Lett., vol. 59, pp. 102-104, July 1991.

• A. Weisshaar, J. Lary, S. M. Goodnick, and V. K. Tripathi, “Analysis and Modeling of Quantum Waveguide Structures and Devices,” J. Appl. Phys.,

vol. 70, pp. 355-366, July 1991. • A. Weisshaar, S. M. Goodnick, and V. K. Tripathi, “Modal Analysis Applied to

Quantum Waveguide Structures and Discontinuities,” Superlattices and Microstructures, vol. 12, No. 1, pp. 37-41, 1992.

• A. Weisshaar and V. K. Tripathi, “Modal Analysis of Step Discontinuities in Graded-Index Dielectric Slab Waveguides,” IEEE /OSA J. Lightwave Technol., vol. 10, pp. 593-602, May 1992.

• A. Weisshaar, S. M. Goodnick, and V. K. Tripathi, “A Rigorous and Efficient Method of Moments Solution for Curved Waveguide Bends,” IEEE Trans. Microwave Theory Tech., vol. 40, pp. 2200-2206, Dec. 1992.

• J. C. Wu, M. N. Wybourne, A. Weisshaar, and S. M. Goodnick, “Waveguide effects in quantum wires with double-bend discontinuities,” J. Appl. Phys., vol. 74, pp. 4590-4597, Oct. 1993.

• R. L. Gallawa, A. Kumar, and A. Weisshaar, “Fiber Splice Loss: A Simple Method of Calculation,” Optical and Quantum Electronics (special issue on optical waveguide modeling), vol. 26, pp. S165-S172, March 1994.

• A. Weisshaar, “Impedance Boundary Method of Moments for Accurate and Efficient Analysis of Planar Graded-Index Optical Waveguides,” IEEE /OSA J. Lightwave Technol., vol. 12, pp. 1943-1951, Nov. 1994.

• A. Weisshaar, J. Li, R. L. Gallawa, and I. C. Goyal, “Vector and Quasi-Vector Solutions for Optical Waveguide Modes using Efficient Galerkin’s Method with Hermite-Gauss Basis Functions,” IEEE /OSA J. Lightwave Technol., vol. 13, pp. 1795-1800, Aug. 1995.

• K. A. Remley and A. Weisshaar, “Impedance Boundary Method of Moments with Extended Boundary Conditions,” IEEE /OSA J. Lightwave Technol., vol. 13, no. 12, pp. 2372-2377, Dec. 1995.

• A. Weisshaar, M. Mongiardo, and V. K. Tripathi, “CAD-Oriented Equivalent Circuit Modeling of Step Discontinuities in Rectangular Waveguides,” IEEE Microwave Guided Wave Lett., vol. 6, no. 4, pp. 171-173, April 1996.

• J. Li and A. Weisshaar, “Generalised Impedance Boundary Method of Moments for Multilayer Graded-Index Dielectric Waveguide Structures,” IEE Proc. Optoelectronics, vol. 143, no. 3, pp. 167-172, June 1996.

• K. A. Remley and A. Weisshaar, “Impedance Boundary Method of Moments for Efficient Analysis of Lossy and Leaky Planar Optical Waveguide Structures,” Opt. Commun., vol 129/1-2, pp. 33-37, Aug. 1996.

• K. A. Remley and A. Weisshaar, “Design and Analysis of a Silicon-Based ARROW Chemical Sensor,” Opt. Lett., vol. 21, no. 16, pp. 1241-1243, Aug. 1996.

• A. Weisshaar, M. Mongiardo, A. Tripathi, and V. K. Tripathi, “CAD-Oriented Fullwave Equivalent Circuit Models for Waveguide Components and Circuits,” IEEE Trans. Microwave Theory Tech., vol. 44, no. 12, pp. 2564-2570, Dec. 1996.

• K. A. Remley, A. Weisshaar, S. M. Goodnick, and V. K. Tripathi, “Modeling of Radiation Fields in a Sub-Picosecond Photo-Conducting System,” VLSI Design, vol. 8, nos. 1-4, pp. 407-412, 1998.

• A. Weisshaar, M. Mongiardo, and V. K. Tripathi, “Full-Wave Computer-Aided Design of Waveguide Components by Circuit Simulation,” Int. J. RF and Microwave Computer-Aided Engineering (Special Issue: CAD of Waveguide Components and Antennas), vol. 8, no. 3, pp. 236-247, May 1998.

• A. Tripathi, Y.-C. Hahm, A. Weisshaar, and V. K. Tripathi, “A Quasi-TEM Spectral Domain Approach for Calculating Distributed Inductance and

Resistance of Microstrip on Si-SiO2 Substrate,” Electron. Lett., vol. 34, no. 13, pp. 1330-1331, June 1998.

• K. A. Remley and A. Weisshaar, “A Versatile Impedance Boundary Method of Moments Computational Technique for Solving the One-Dimensional Schrödinger Equation with Application to Quantum-Well and Quantum-Wire Problems,” IEEE J. Quantum Electron., vol. 34, no. 7, pp. 1171-1179, July 1998.

• K. A. Remley, A. Weisshaar, S. M. Goodnick, and V. K. Tripathi, “Near and Far Field Characterization of Radiation from Ultra-Fast Electronic Systems,” IEEE Trans. Microwave Theory Tech., vol. 46, no. 12, pp. 2476-2483, Dec. 1998.

• K. A. Remley, A. Weisshaar, and H. R. Anderson, “Improved Diffraction Coefficients for Lossy Dielectric Wedges for Site-Specific Propagation Modeling,” Electron. Lett., vol. 35, no. 21, pp. 1826-1827, Oct. 1999.

• R. K. Settaluri, A. Weisshaar, C. Lim, and V. K. Tripathi, “Design of Compact Multi-Level Folded Line RF Couplers,” IEEE Trans. Microwave Theory Tech., vol. 47, no. 12, pp. 2331-2339, Dec. 1999.

• Y. Kim, A. Tripathi, R. K. Settaluri, A. Weisshaar, and V. K. Tripathi, “Extraction of Multiple Coupled Line Parameters using FDTD Simulation,” IEE Proc. Microwaves, Antennas and Propagation, vol. 146, no. 6, pp. 443-446, Dec. 1999.

• R. K. Settaluri, G. Sundberg, A. Weisshaar, and V. K. Tripathi, “Compact Folded Line Rat Race Hybrid Couplers,” IEEE Microwave Guided Wave Lett., vol. 10, no. 2, pp. 61-63, Feb. 2000.

• J. Zheng, Y.-C. Hahm, V.K. Tripathi, and A. Weisshaar, “CAD-Oriented Equivalent Circuit Modeling of On-Chip Interconnects on Lossy Silicon Substrate,” IEEE Trans. Microwave Theory Tech., vol. 48, no. 9, pp. 1443-1451, Sept. 2000.

• K. A. Remley, H. R. Anderson, and A. Weisshaar, “Improving the Accuracy of Ray-Tracing Techniques for Indoor Propagation Modeling,” IEEE Trans. Vehic. Technol., vol. 49, no. 6, pp. 2350-2356, Nov. 2000.

• R. D. Lutz, V. K. Tripathi, and A. Weisshaar, “Design Considerations for Multilevel Spiral Inductors in RFICs” (selected/invited), The International Journal of Microcircuits and Electronic Packaging, vol. 24, no. 1, pp. 37-44, 2001.

• R. D. Lutz, V. K. Tripathi, and A. Weisshaar, “Enhanced Transmission Characteristics of On-Chip Interconnects with Orthogonal Gridded Shield,” IEEE Trans. Adv. Packaging, vol. 24, no. 3, pp. 288-293, Aug. 2001.

• J. Zheng, V. K. Tripathi, and A. Weisshaar, “Characterization and Modeling of Multiple Coupled On-Chip Interconnects on Silicon Substrate,” IEEE Trans. Microwave Theory Tech., vol. 49, no. 10, pp. 1733-1739, Oct. 2001.

• R. K. Settaluri, A. Weisshaar, and V. K. Tripathi, “Design of Compact Multilevel Folded-Line Bandpass Filters,” IEEE Trans. Microwave Theory Tech., vol. 49, no. 10, pp. 1804-1809, Oct. 2001.

• D. Melendy, P. Francis, C. Pichler, K. Hwang, G. Srinivasan, and A. Weisshaar, “A New Wide-Band Compact Model for Spiral Inductors in RFICs,” IEEE Electron Device Lett., Vol. 23, No. 5, pp. 273-275, May 2002.

• A. Weisshaar, H. Lan, and A. Luoh, “Accurate Closed-Form Expressions for the Frequency-Dependent Line Parameters of On-Chip Interconnects on Lossy Silicon Substrate,” IEEE Trans. Adv. Packaging, vol. 25, no. 2, pp. 288-296, May 2002.

• C. Lim, R. K. Settaluri, V. K. Tripathi, and A. Weisshaar, “Compact Single- and Multi-Level Folded-Line RF Power Dividers,” Microwave and Optical Technology Letters, Vol. 39, Issue 3, pp. 187-189, Nov. 2003.

• A. Weisshaar and A. Luoh, "Closed-form Expressions for the Series Impedance Parameters of On-Chip Interconnects on Multilayer Silicon Substrates," IEEE Trans. Adv. Packaging, vol. 27, no. 1, pp. 127-134, Feb. 2004.

• A. Watson, D. Melendy, P. Francis, K. Hwang, and A. Weisshaar, "A Comprehensive Compact Modeling Methodology for Spiral Inductors in Silicon-Based RFICs," IEEE Trans. Microwave Theory Tech., vol. 52, no. 3, pp. 849-857, March 2004.

• Y. Mayevskiy, A. Watson, Pascale Francis, Kyuwoon Hwang, and Andreas Weisshaar, “A New Compact Model for Monolithic Transformers in Silicon-Based RFICs,” IEEE Microwave Wireless Comp. Lett., June 2005.

• J. Kolstad, C. Blevins, J. M. Dunn, and A. Weisshaar, “A New Circuit Augmentation Method for Modeling of Interconnects and Passive Components,” IEEE Transactions on Advanced Packaging, vol. 29, no. 1, pp. 67 – 77, Feb. 2006.

• I. Orhanovic, R. J. Crinon, F. W. R. Chaplen, and A. Weisshaar, “Signal Transduction Pathway Modeling Using Sequences of Chromatophore Images,” IEEE Trans. Nanobioscience. Vol. 6, no. 3, pp. 210-218, Sept. 2007.

• D. Paul, M. S. Nakhla, R. Achar, and A. Weisshaar, “Broadband Modeling of High-Frequency Microwave Devices,” IEEE Trans. Microwave Theory Tech., vol. 57, no. 2, pp. 361-373, Feb. 2009.

Refereed Conference Papers

• R. S. Engelbrecht and A. Weisshaar, “The Effect of Cross-Rate Interference

on LORAN-C Performance,” in Pre-Printed Technical Papers, 15th Annual Technical Symposium of The Wild Goose Association, pp. 151-160, New Orleans, LA, 1986.

• A. Weisshaar, J. Lary, S. M. Goodnick, and V. K. Tripathi, “Application of a Mode-Matching Technique to Quantum Wire Transitions and Discontinuities,” SPIE Proceedings, vol. 1284, pp. 45-56, 1990.

• A. Weisshaar, S. Luo, M. Thorburn, V. K. Tripathi, M. Goldfarb, J. L. Lee, and E. Reese, “Modeling of Radial Microstrip Bends,” IEEE MTT-S International Microwave Symposium Digest, pp. 1051-1054, 1990.

• A. Weisshaar, J. Lary, S. M. Goodnick, and V. K. Tripathi, “Negative Differential Resistance in a Double Constriction Quantum Waveguide Structure,” NATO Advanced Study Institute on Granular Nanoelectronics, Il Ciocco, Italy, 1990.

• A. Weisshaar, S. M. Goodnick, and V. K. Tripathi, “Modal Analysis Applied to Quantum Waveguide Structures and Discontinuities,” Workshop on Granular Electronics, Urbana, IL, 1991.

• A. Weisshaar, J. Lary, S. M. Goodnick, and V. K. Tripathi, “Application of Microwave Techniques in the Analysis of Quantum Waveguide Structures and Devices,” IEEE MTT-S International Microwave Symposium Digest, pp. 481-484, 1991.

• A. Weisshaar and V. K. Tripathi, “Modeling of Notch Compensated Right-Angle Microstrip Bends and Microstrip T Junctions,” Proceedings of the International Microwave Conference/Brazil SBMO 91, pp. 302-307, 1991.

• A. Weisshaar and V. K. Tripathi, “Modal Analysis of Discontinuities in Diffused Optical Waveguides,” Emerging Optoelectronic Technologies, pp. 242-246, New Delhi: Tata McGraw-Hill, 1992.

• J. C. Wu, M. N. Wybourne, A. Weisshaar, and S. M. Goodnick, “Resonance Phenomenon in Double Bend Point Contact Structures,” SPIE Proceedings, vol. 1676, 1992.

• A. Weisshaar, S. M. Goodnick, and V. K. Tripathi, “A Rigorous and Efficient Method of Moments Solution for Curved Waveguide Bends and its Applications,” IEEE MTT-S International Microwave Symposium Digest, pp. 975-978, 1992.

• S.M. Goodnick, A. Weisshaar, J. Wu, M. Wybourne, and C. Berven, “Modeling of Nonequilibrium Transport in Lateral Hot Electron Devices,” American Physical Society March Meeting, Seattle, WA, 1993.

• A. Weisshaar, “Accurate Method of Moments Analysis of Single- and Multi-Layered Graded-Index Dielectric Slab Waveguide Structures,” PIERS 1993, Progress in Electromagnetics Research Symposium, Jet Propulsion Laboratory, California Institute of Technology, 1993; PIERS'93 Proceedings, p. 752.

• H. Chang, A. Weisshaar, and V. K. Tripathi, “Applications of Matrix Method to the Analysis of Asymmetric Coupled Nonlinear Optical Waveguides,” PIERS 1993, Progress in Electromagnetics Research Symposium, Jet Propulsion Laboratory, California Institute of Technology, 1993; PIERS'93 Proceedings, p. 838.

• J. Li, A. Weisshaar, and V. K. Tripathi, “An Axially Symmetrical Four Waveguide Coupler,” IEEE LEOS '93 Conference Proceedings, pp. 161-162, 1993.

• R. L. Gallawa, A. Kumar, and A. Weisshaar, “Mode Coupling and Loss on Tapered Optical Waveguides,” Integrated Photonics Research 1994 Technical Digest Series, pp. 57-59, 1994.

• R. L. Gallawa, A. Kumar, and A. Weisshaar, “Symbolic Language Programming with Series Expansions: Applications to Optical Waveguides,” Applied Computational Electromagnetics 1994 Conference Proceedings, pp. 475-481, 1994.

• K. Remley, J. J. Marlia, T. K. Plant, A. Weisshaar, J. C. Wu, and M. N. Wybourne, “Graded-Index Silicon Oxynitride Optical Waveguides,” 1994 URSI Radio Science Meeting, Seattle, WA, 1994; Abstracts, p. 352.

• J. Li, A. Weisshaar, and V. K. Tripathi, “Normal Mode Analysis of General Asymmetric Multiple Coupled Dielectric Waveguides,” PIERS 1994, Progress in Electromagnetics Research Symposium, European Space Research and Technology Centre, Noordwijk, The Netherlands, 1994; PIERS'94 Proceedings, p. 64.

• S. M. Goodnick, A. Weisshaar, A. Ecker, and V. K. Tripathi, “Quantum Waveguide Structures and Devices,” Proc. Workshop on Physics and Computation PhysComp'94, p. ix+283, 169-76, 1994.

• M. L. Tuma, A. Weisshaar, J. Li, and G. Beheim, “Calculated Coupling Efficiency Between an Elliptical-Core Optical Fiber and an Optical Waveguide Over Temperature,” SPIE Proceedings, vol. 2535, pp. 147-158, 1995.

• K. Remley and A. Weisshaar, “Leaky Planar Optical Waveguide Structures,” PIERS 1995, Progress in Electromagnetics Research Symposium, Seattle, WA, 1995; Proceedings, p. 664.

• A. Weisshaar and K. A. Remley, “Efficient Modeling of Optical Waveguides and Fibers with Chemical Sensing Applications,” Second Pacific Northwest Fiber Optic Sensor Workshop, SPIE Proceedings, vol. 2872, pp. 98-109, 1996.

• A. Weisshaar, M. Mongiardo, A. Tripathi, and V. K. Tripathi, “CAD Oriented Equivalent Circuit Models for Rigorous Full-Wave Analysis and Design of Waveguide Components and Circuits,” IEEE MTT-S International Microwave Symposium Digest, pp. 1455-1458, 1996.

• F. Masot, K. A. Remley, R. T. Kollipara, A. Weisshaar, and V. K. Tripathi, “Velocity Matching for Field-Induced Electrooptic Modulators,” IEEE MTT-S International Microwave Symposium Digest, pp. 1441-1444, 1996.

• K. A. Remley, A. Weisshaar, S. M. Goodnick, and V. K. Tripathi, “Modeling of Radiation Fields in a Sub-Picosecond Photo-Conducting System,” 5th Annual International Workshop on Computational Electronics, Notre Dame, IN, 1997.

• A. Weisshaar, M. Mongiardo, and V. K. Tripathi, “Accurate and Efficient CAD-Oriented modeling of Circular Waveguide Bends,” IEEE MTT-S International Microwave Symposium Digest, pp. 1591-1594, 1997.

• K. A. Remley, A. Weisshaar, S. M. Goodnick and V. K. Tripathi, “Far Field Radiation in Sub-Picosecond Systems,” IEEE MTT-S International Microwave Symposium, Focused Session on “Electromagnetic Wave Interactions with Electron Devices and Circuits,” Denver, CO, 1997. IEEE MTT-S International Microwave Symposium Digest, pp. 163-166, 1997.

• K. A. Remley and A. Weisshaar, “Efficient Modeling of Quantum Well Structures using the Impedance Boundary Method of Moments,” PIERS 1997, Progress in Electromagnetics Research Symposium, Cambridge, Massachusetts, USA, 1997; Proceedings, p. 279.

• M. Falconer, K. A. Remley, R. D. Lutz, Y.-C. Hahm, A. Weisshaar, and V. K. Tripathi, “Properties and Application of Multilevel Interconnect Structures in Silicon Based Integrated Circuits,” PIERS 1997, Progress in Electromagnetics Research Symposium, Cambridge, Massachusetts, USA, 1997; Proceedings, p. 56.

• K. A. Remley, A. Weisshaar, and H. R. Anderson, “A Comparative Study of Ray Tracing and FDTD for Indoor Propagation Modeling,” IEEE VTC'98 Conference Proceedings, pp. 865-869, 1998.

• K. A. Remley, A. Weisshaar, S. M. Goodnick and V. K. Tripathi, “Near and Far Field Characterization of Radiation from Ultra-Fast Electronic Systems,” IEEE MTT-S International Microwave Symposium Digest, pp. 1073-1076, 1998.

• R. D. Lutz, Y. Hahm, A. Weisshaar, V. K. Tripathi, A. Grzegorek, W. McFarland, and J. Meyer, “Modeling of Spiral Inductors on Lossy Substrates for RFIC Applications,” Jointly published in IEEE MTT-S International Microwave Symposium Digest, pp. 1855-1858, 1998, and 1998 IEEE Radio Frequency Integrated Circuits Symposium Digest of Papers, pp. 313-316, 1998.

• J. Zheng, A. Tripathi, Y.-C. Hahm, T. Ishii, A. Weisshaar, and V. K. Tripathi, “CAD-Oriented Equivalent Circuit Modeling of On-Chip Interconnects in CMOS Technology,” Proc. IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP'98), pp. 227-230, 1998.

• Y. Kim, A. Tripathi, R. K. Settaluri, A. Weisshaar, and V. K. Tripathi, “Modeling and Characterization of Multiple Coupled Lines in Multilayer Structures Using FDTD,” Proc. 31st International Symposium on Microelectronics (IMAPS'98), pp. 364-369, 1998.

• R. D. Lutz, Y. C. Hahm, J. McVeety, A. Weisshaar, and V. K. Tripathi, “CAD-Oriented Modeling of Embedded Passives and Transmission Lines in Multilayer Media,” 31st International Symposium on Microelectronics (IMAPS'98), San Diego, CA, 1998.

• J. Zheng, Y.-C. Hahm, A. Weisshaar, and V. K. Tripathi, “CAD-Oriented Equivalent Circuit Modeling of On-Chip Interconnects for RF Integrated Circuits in CMOS Technology,” IEEE MTT-S International Microwave Symposium Digest, pp. 35-38, 1999.

• R. D. Lutz, Y. Hahm, A. Weisshaar, V. K. Tripathi, H. Wu, and N. Kanaglekar, “Modeling and Analysis of Multilevel Spiral Inductors for RFICs,” IEEE MTT-S International Microwave Symposium Digest, pp. 43-46, 1999.

• R. K. Settaluri, A. Weisshaar, C. Lim, and V. K. Tripathi, “Compact Multi-Level Folded Coupled Line RF Couplers,” IEEE MTT-S International Microwave Symposium Digest, pp. 1721-1724, 1999.

• K. A. Remley, A. Weisshaar, and H. R. Anderson, “Full-Wave Study on the Accuracy of Ray-Tracing for Multipath Environments,” Proceedings of the IEEE Radio and Wireless Conference (RAWCON'99), pp. 203-206, 1999.

• K. A. Remley, A. Weisshaar, V. K. Tripathi, and S. M. Goodnick, “Modeling Terahertz Radiation from a Photoconducting Structure,” in Materials and Electronics for High-Speed and Infrared Detectors, S. M. Goodnick, W. F. Kailey, R. E. Longshore, Y.-H. Zhang, eds., Proceedings of the SPIE, vol. 3794, pp. 25-34, 1999.

• G. Sundberg, R. D. Lutz, Y. C. Hahm, R. K. Settaluri, A. Weisshaar, and V. K. Tripathi, “Modeling of General Non-Uniform On-Chip Interconnect Structures,” Proc. 32nd International Symposium on Microelectronics (IMAPS'99), pp. 396-401, 1999.

• R. D. Lutz, A. Weisshaar, V. K. Tripathi, T. Arabi, and A. Lee, “Modeling of Simultaneous Switching Output by Equivalent Source Impedance,” Proc. IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP'99), pp. 167-170, 1999.

• J. Zheng, Y.-C. Hahm, A. Weisshaar and V.K. Tripathi, “Equivalent Circuit Modeling of Frequency-Dependent On-Chip Interconnects,” Proc. IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP'99), pp. 185-188, 1999.

• J. Zheng, V. K. Tripathi, and A. Weisshaar, “Development of CAD-Oriented Models for On-Chip Interconnects on Silicon,” 4th IEEE Workshop on Signal Propagation on Interconnects, Magdeburg, Germany, 2000; IEEE Workshop Digest of Abstracts, 2000.

• R. K. Settaluri, A. Weisshaar, and V. K. Tripathi, “Compact Multi-Level Folded-Line Bandpass Filters,” IEEE MTT-S International Microwave Symposium Digest, pp. 311-314, 2000.

• J. Zheng, V. K. Tripathi, and A. Weisshaar, “Reduced Order Modeling of Coupled On-Chip Interconnects for Silicon-based RF Integrated Circuits,” IEEE MTT-S International Microwave Symposium Digest, pp. 973-976, 2000.

• R. D. Lutz, V. K. Tripathi, A. Weisshaar, “Design Considerations for Multilevel Spiral Inductors in RFICs,” Proc. 33rd International Symposium on Microelectronics (IMAPS'2000), pp. 414-419, 2000.

• R. D. Lutz, V. K. Tripathi, and A. Weisshaar, “Enhanced Transmission Characteristics of On-Chip Interconnects with Orthogonal Gridded Shield,” Proc. IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP'2000), pp. 329-332, 2000.

• J. Zheng, V. K. Tripathi, and A. Weisshaar, “Characterization and Modeling of Multiple Coupled On-Chip Interconnects on Silicon Substrate,” Proc. IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP'2000), pp. 333-336, 2000.

• A. Weisshaar and H. Lan, “Accurate Closed-Form Expressions for the Frequency-Dependent Line Parameters of On-Chip Interconnects on Lossy Silicon Substrate,” IEEE MTT-S International Microwave Symposium Digest, pp. 1753-1756, 2001.

• J. Zheng, J.P. Li, and A. Weisshaar, “Modeling of 3-D Planar Conducting Structures on Lossy Silicon Substrate in High Frequency Integrated Circuits,” IEEE MTT-S International Microwave Symposium Digest, pp. 1265-1268, 2001.

• C. Y. Lim, R. K. Settaluri, V. K. Tripathi, and A. Weisshaar, “Compact Folded-Line RF Power Dividers,” Proc. 34th International Symposium on Microelectronics (IMAPS'2001), pp. 725-730, 2001.

• H. Lan, A. Luoh, and A. Weisshaar, “Accurate Closed-Form Expressions for the Frequency-Dependent Line Parameters of Coupled On-Chip Interconnects on Silicon Substrate,” Proc. IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP'2001), pp. 335-338, 2001.

• D. Melendy, P. Francis, C. Pichler, K. Hwang, G. Srinivasan, and A. Weisshaar, “Wide-Band Compact Modeling of Spiral Inductors in RFICs,” in IEEE MTT-S International Microwave Symposium Digest, pp. 717-720, 2002.

• A. Luoh and A. Weisshaar, “Closed-Form Expressions for the Line Parameters of Co-Planar On-Chip Interconnects on Lossy Silicon Substrates,” Proc. IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP'2002), pp. 341 -344, 2002.

• A. Luoh, U. Arz, H. Grabinski, D. F. Williams, D. K. Walker, and A. Weisshaar, “Broadband Impedance Parameters of Asymmetric Coupled CMOS Interconnects: New Closed-Form Expressions and Comparison with Measurements,” 7th IEEE Workshop on Signal Propagation on Interconnects, Siena, Italy, 2003; proceedings, pp. 7-10.

• D. Melendy and A. Weisshaar, “A New Scalable Model for Spiral Inductors on Lossy Silicon Substrate,” IEEE MTT-S International Microwave Symposium Digest, pp. 1007-1010, 2003.

• A. Watson, P. Francis, C. Pichler, K. Hwang, and A. Weisshaar, “Wide-Band Distributed Modeling of Spiral Inductors in RFICs,” IEEE MTT-S International Microwave Symposium Digest, pp. 1011-1014, 2003.

• R. K. Settaluri and A. Weisshaar, “A Broadside-Edge-Coupled Vialess Balun” IEEE MTT-S International Microwave Symposium Digest, pp. 1251-1254, 2003.

• R. Senguttuvan, L. Hayden, and A. Weisshaar, “Mode Coupling in Coplanar Waveguide Bends: A simple Four-Port Model,” Proceedings of the 33rd European Microwave Conference, pp. 643-646, 2003.

• A. Watson, Y. Mayevskiy, P. Francis, K. Hwang, G. Srinivasan, and A. Weisshaar, “Compact Modeling of Differential Spiral Inductors in Si-Based RFICs,” IEEE MTT-S International Microwave Symposium Digest, pp. 1007-1010, June 2004.

• D. W. Ferwalt and A. Weisshaar, “A Base Control Doherty Power Amplifier for Improved Efficiency in GSM Handsets,” IEEE MTT-S International Microwave Symposium Digest, pp. 1007-1010, June 2004.

• J. Kolstad, C. Blevins, J. Dunn, and A. Weisshaar, “A New Modeling Methodology for Passive Components Based on Black-Box Augmentation Combined with Equivalent Circuit Perturbation,” Proc. IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP'2004), pp. 259-262, Oct. 2004.

• C. Blevins and A. Weisshaar, “Derivation of a Network Macromodel with Delay Extraction for Efficient Time-Domain Simulation of Lossy Transmission Lines,” Proc. IEEE 14th Topical meeting on Electrical Performance of Electronic Packaging, pp. 341-344, October 24-26, 2005.

• D. Paul, M.S. Nakhla, R. Achar, and A. Weisshaar, “Broadband Macromodelling of High-Speed Passive Modules,” 10th IEEE Workshop on Signal Propagation on Interconnects, Berlin, Germany, May 2006; proceedings, pp. 107-108, 2006.

• D. Paul, M.S. Nakhla, R. Achar, and A. Weisshaar, “An Automated Algorithm for Broadband Modeling of High-Frequency Microwave Devices,” IEEE MTT-S International Microwave Symposium Digest, pp. 1767-1770, June 2006.

• D. Paul, M. S. Nakhla, R. Achar, and A. Weisshaar, “A Passive Algorithm for Modeling Frequency-Dependent Parameters of Coupled Interconnects,” Proc. IEEE 15th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP'2006), pp. 185-188, Oct. 2006.

• C. Walkey, D. Paul, M. S. Nakhla, R. Achar, and A. Weisshaar, “A Novel Passivity Verification and Enforcement Algorithm for Macromodels of Microwave Devices,” IEEE MTT-S International Microwave Symposium Digest, pp. 611-614, June 2008.

• S. Gaskill, V. Shilimkar, and A. Weisshaar, “Noise Suppression in VLSI Circuits Using Dummy Metal Fill,” 12th IEEE Workshop on Signal Propagation on Interconnects, Avignon, France, May 2008; proceedings, pp. 1-4, 2008.

• S. G. Gaskill, V. S. Shilimkar, and A. Weisshaar, “Isolation Enhancement in Integrated Circuits Using Dummy Metal Fill,” 2008 IEEE Radio Frequency Integrated Circuits Symposium Digest of Papers, Atlanta, GA, pp. 483-486, June 2008.

• S. G. Gaskill, V. S. Shilimkar, and A. Weisshaar, “Accurate Closed-Form Capacitance Extraction Formulas for Metal Fill in RFICs,” 2009 IEEE Radio Frequency Integrated Circuits Symposium Digest of Papers, Boston, MA, pp. 611-614, June 2009.

• V. S. Shilimkar, S. G. Gaskill, and A. Weisshaar, “Experimental Characterization of Metal Fill Placement and Size Impact on Spiral Inductors,” Proc. IEEE 18th Topical Meeting on Electrical Performance of Electronic Packaging and Systems (EPEPS'2009), pp. 101-104, Oct. 2009.

• V. S. Shilimkar, S. G. Gaskill, and A. Weisshaar, “Impact of Metal Fill on On-chip Interconnect Performance,” Proc. 42nd International Symposium on Microelectronics (IMAPS'2009), pp. 983-990, 2009.

• S. G. Gaskill, V. S. Shilimkar, and A. Weisshaar, “Wide-range closed-form eddy-current loss formula for metal fill,” IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS’2010), pp.129-132, Oct. 2010.

• V. S. Shilimkar, S. G. Gaskill, and A. Weisshaar, “Closed-form Expressions for Modeling Metal Fill Effects in Interconnects,” IEEE 15th Workshop on Signal Propagation on Interconnects, Italy, pp. 97-100, May 2011.

• V. S. Shilimkar, S. G. Gaskill, and A. Weisshaar, “Efficient Modeling of Metal Fill Parasitic Capacitance in On-Chip Transmission Lines,” IEEE MTT-S 60th

International Microwave Symposium, June 2012.

Invited Conference Papers

• W. Yindeepol, A. Chin, A. Weisshaar, S. M. Goodnick, J. C. Wu, and M. N. Wybourne, “Interference Phenomena Due to Bend Discontinuities in Point Contact Structures,” International Symposium on Nanostructures and Mesoscopic Systems, Santa Fe, NM, May 1991.

• A. Weisshaar, “Step Discontinuities in Optical Waveguides,” invited lecture at the workshop on Computer Modelling of Optical Waveguides, National Institute of Standards and Technology, Boulder, Co, June 29 - July 2, 1993.

• A. Weisshaar, S. M. Goodnick, V. K. Tripathi, J. C. Wu, and M. N. Wybourne, “Quantum Waveguide Structures and Discontinuities,” Seventh International Workshop on Physics of Semiconductor Devices, New Delhi, India, December 14-18, 1993. Published in Physics of Semiconductor Devices (K. Lal, Ed.), pp. 118-125, New Delhi: Narosa, 1994.

• J. F. Wager, S. Lim, J. H. Ryu, J. Marlia, K. Remley, K. Lite, T. K. Plant, and A. Weisshaar, “Compositionally Inhomogeneous Silicon Oxynitride Dielectrics,” Symposium on Silicon Nitride and Silicon Dioxide Thin Insulating Films at the 185th Meeting of The Electrochemical Society, San Francisco, CA, May 22-27, 1994, Conf. Proc., 11 pages.

• A. Weisshaar, J. Li, R. L. Gallawa, and I. C. Goyal, “Efficient Vector Solution for Optical Waveguides using Galerkin's Method with Hermite-Gauss Basis Functions,” Conference on Emerging Optoelectronic Technologies (CEOT-94), Bangalore, India, July 1994. Published in Emerging Optoelectronic Technologies, pp. 207-211, New Delhi: Tata McGraw-Hill, 1994.

• V. K. Tripathi, A. Weisshaar, and H. S. Chang, “Analysis of Coupled Nonlinear Optical Waveguides by Matrix Method,” 1995 Applied Computational Electromagnetics Society (ACES) Conference, Monterey, California, March 20-25, 1995; Proceedings, p. 962.

• A. Weisshaar, S. M. Goodnick, V. K. Tripathi, and M. N. Wybourne, “Network Modeling of Quantum Waveguide Structures and Devices,” workshop on Novel Circuit Concepts for Nanostructure Semiconductor Devices, Seattle, WA, May 4, 1995.

• M. Mongiardo, A. Weisshaar, and V. K. Tripathi, “A New Equivalent Circuit Representation for the Analysis of Waveguide Discontinuities by Circuit Simulators,” PIERS 1996 Progress in Electromagnetics Research Symposium, Innsbruck, Austria, July 8-12, 1996; PIERS'96 Proceedings, p. 144.

• A. Weisshaar, M. Mongiardo, and V. K. Tripathi, “Comparison of the Local Mode and Moment Method Techniques for the Analysis of Curved Waveguide Bends,” PIERS 1996 Progress in Electromagnetics Research Symposium, Innsbruck, Austria, July 8-12, 1996; PIERS'96 Proceedings, p. 58.

• K. A. Remley, F. Masot, A. Weisshaar, and V. K. Tripathi, “Design of Slow and Fast Wave Planar Structures for Electrooptic Modulators,” PIERS 1996 Progress in Electromagnetics Research Symposium, Innsbruck, Austria, July 8-12, 1996; PIERS'96 Proceedings, p. 137.

• M. Falconer, K. A. Remley, S. M. Goodnick, A. Weisshaar, and V. K. Tripathi, “Improved Modeling of Electromagnetic Fields Arising from the Picosecond Pulse Propagation along a Coplanar Microstrip Structure,” PIERS 1996, Progress in Electromagnetics Research Symposium, Innsbruck, Austria, July 8-12, 1996; Proceedings, p. 573.

• Y. Seo, V. K. Tripathi, and A. Weisshaar, “Multilayer Coupled Line Filters,”

IEEE MTT-S International Microwave Symposium Workshop on “State-of-the-Art Filter Design using EM and Circuit Simulation Techniques,” Denver, CO, June, 1997.

• K. A. Remley and A. Weisshaar, “Site-Specific Computational Modeling for Wireless Communications Systems,” PIERS 1998 Progress in Electromagnetics Research Symposium, Nantes, France, July 13-17, 1998.

• K. A. Remley, A. Weisshaar, V. K. Tripathi, and S. M. Goodnick, “Modeling Terahertz Radiation from a Photoconducting Structure using the Kirchhoff Surface Integral Formulation,” PIERS 1998 Progress in Electromagnetics Research Symposium, Nantes, France, July 13-17, 1998.

• J. Zheng, Y.-C. Hahm, A. Tripathi, A. Weisshaar, and V. K. Tripathi, “Electromagnetic Characterization and Equivalent Circuit Modeling of On-Chip Interconnects in CMOS Technology,” special session on Electromagnetic Modeling and Simulation Methodologies for Electronic Package Design, XXVIth General Assembly of the International Union of Radio Science (URSI'99), Toronto, Canada, August 1999; URSI'99 Abstracts, p. 141.

Editorials • A. Weisshaar, G. L. Heiter, W. J. R. Hoefer, “Editors' overview,” IEEE Trans.

Microwave Theory Tech., vol. 50, no. 12, pp. 2660-2663, Dec. 2002. • A. Weisshaar and A. Clegg, “Prolog to Section on Radio Spectrum Access,”

Centennial Issue of Proceedings of the IEEE, vol. 100, pp. 1674-1675, May 2012.

Professional Presentations

Research-related presentations and seminars include: • Research presentation, Litton Data Systems, OSU, March 1993. • Invited lecture, National Institute of Standards and Technology (NIST),

workshop on Computer Modeling of Optical Waveguides, “Step Discontinuities in Optical Waveguides,” Boulder, Colorado, July 1993.

• Research presentation, Analogy Inc., 1994. • Instructor, National Institute of Standards and Technology (NIST), workshop

on “Computer Modeling of Optical Waveguides and Components”, Boulder, Colorado, June 1994.

• Invited seminar, Intel Corporation “Modeling and Design Issues for High-Speed On-Chip Interconnects,” Hillsboro, OR, July 24, 1997.

• Invited talk, 1st International Academic Conference on Next Generation of Packaging Research and Education, “Electronic Packaging Research at Oregon State University,” (with V. K. Tripathi), Georgia Tech, Atlanta, GA, March 1998.

• Talk, 2nd International Academic Conference on Next Generation of Packaging Research and Education, “Multilevel Embedded Passives for RF Modules,” (with V. K. Tripathi and R. K. Settaluri), Georgia Tech, Atlanta, GA, March 1999.

• Invited seminar, Tektronix, Inc., “Modeling of Interconnects and Passive Components on Silicon Substrate,” Beaverton, OR, April 6, 1999.

• Invited seminar, Conexant Systems, Inc., Newport Beach, CA, July 19, 1999. • Invited lecture, Sematech AAF meeting, “Principles and Applications of Time-

Domain Reflectometry in Electronic Packaging,” Scottsdale, Arizona, Dec. 9, 1999.

• Invited seminar, National Semiconductor Corp., “Research Activities in

RF/Microwaves and Electronic Packaging at Oregon State University,” Santa Clara, CA, Aug. 23, 2000.

• Research presentation, Intel, “Research Activities in RF/Microwaves and Electronic Packaging,” OSU, Feb. 2001.

• Invited seminar, Conexant Systems, Inc., “Modeling of Interconnects and Passive Components for RF and Mixed-Signal ICs,” Newport Beach, CA, Nov. 20, 2001.

• Instructor, Special topics course on “Passive Radio Frequency Components” at the Johannes Kepler University in Linz, Austria, Dec. 2001.

• Invited seminar, Teradyne, Inc., “Modeling and Characterization of Interconnects and Passive Components for RF and Mixed-Signal Applications,” Agoura Hills, CA, April 16, 2002.

• Invited research presentation, TriQuint Semiconductor, “Research Overview,” (with R. K. Settaluri), Hillsboro, OR, July 16, 2002.

• Invited research presentation, Tektronix, “Research Overview,” (with R. K. Settaluri), Beaverton, OR, Oct. 17, 2002.

• Invited seminar, Intel Corporation, “Modeling of Interconnects and Passive Components for Silicon ICs,” Hillsboro, OR, Dec. 13, 2002.

• Co-presenter, tutorial on “VLSI Interconnect Characterization,” IEEE Workshop on Signal Propagation on Interconnects (SPI), Heidelberg (Germany), May 2004.

• Co-presenter, tutorial on “Fundamentals and Trends in Modeling and Simulation of High-Frequency Microwave Circuits, Interconnects and Systems,” IEEE International Microwave Symposium, June 2004.

• Co-presenter, tutorial on “Techniques for the Partial Element Equivalent Circuit Electromagnetic and Circuit Modeling Approach," IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging, Oct. 2004.

• Invited presentation, “High Frequency Interconnect: Modeling & Characterization, ” RF Platform Integration Workshop, Intel, Oct. 2004.

• Invited Tutorial on “Fundamentals and Trends in Modeling and Simulation of High- Frequency/High-Speed Interconnects,” Andreas Weisshaar and Ram Achar, First ITESO-Intel International Workshop on Signal Integrity (I3WSI-2005), Guadalajara, Mexico, April 7-8, 2005.

• Invited talk, “Compact Modeling Methodology for Spiral Inductors in Silicon-Based RFICs,” Orange County IEEE EDS/MTTS chapter meeting, Dec. 16, 2005.

• Invited presentation, “Modeling of Silicon-Level RF Passives and Interconnects,” at workshop “Packaging Solutions for RF/Wireless Microelectronic Systems,” IEEE Radio and Wireless Symposium, San Diego, CA, Jan. 16, 2006.

• Invited presentation, “Modeling of Interconnects and Spiral Inductors in Silicon RFICs,” at workshop WSF: Substrate Effects in Si RFIC Interconnect, IEEE International Microwave Symposium, June 2006.

• Invited presentation, “Broadband Modeling of Interconnects and Passive Components,” Intel High Frequency Measurement Workshop, Intel, Hillsboro, Nov. 2006.

• Research presentation, “Modeling and Design Challenges for On-Chip Interconnects,” National Semiconductor Corp., Santa Clara, CA, Dec. 14, 2007.

• Invited seminar, “Research and Education in RF/Microwaves ⎯ Review and Future Directions,” National Science Foundation, Feb. 23, 2008.

• Research presentation, “Coupling Suppression in Integrated Circuits using Dummy Metal Fill,” (S. Gaskill, V. Shilimkar, and A. Weisshaar), Northwest Labs of Analog Devices, Inc., Beaverton, OR, April 21, 2008.

• Invited presentation, “Modeling of Integrated Passive Components: Challenges and Opportunities for Reliable Design of Microelectronic Systems,” NSVL Distinguished Faculty Seminar, National Semiconductor Corp., Santa Clara, CA, May 4, 2010.

• Presentation, “Research Programs and Emerging Opportunities in Energy-Efficient Electronic Systems,” NSF presentation at the SRC/ATIC/NSF Forum on Minimum Energy Electronic Systems – MEES 2020, Abu Dhabi, May 23 – 24, 2010.

• Invited presentation, “Compact Modeling of Integrated Passive Components,” NSVL Distinguished Faculty Seminar, National Semiconductor Corp., Santa Clara, CA, April 17, 2011.

•

Grants & Gifts

• Oregon State University (Provost's Office), “Interactive Web Pages for

Engineering Courses,” March 1996 - June 1997, $15,500.

• Hewlett Packard Company, “RF Components and Package Modelling and Characterization,” (with V.K. Tripathi), Nov. 1996 – Oct. 1998, $107,000.

• Kelley Foundation (Oregon State University), “Innovative Laboratory Component for Hands-On Learning in ECE112X and ECE113X to Enhance Student Learning, Stimulate Interest, and Improve Retention,” (with D. Allstot), 1996, $10,000.

• Oregon State University, Research and International Programs, Faculty Release Time, Dec. 1996, $5,000.

• NSF Center for Design of Analog-Digital Integrated Circuits (CDADIC), “On-Chip Interconnect Models for High Frequency/Speed Integrated Circuits on Silicon Substrate,” (with V. K. Tripathi) Aug. 1997 - July 1998, $50,000.

• NSF/Georgia Tech University Collaboration Program, “Embedded Passive Components and Circuits,” University Collaboration for Next Generation of Electronic Packaging, (with V. K. Tripathi) Oct. 1997 – July 2001, $100,250.

• EDX Engineering, Inc., “FDTD and Ray-Tracing Modeling for Indoor Propagation Prediction,” Dec. 1997 - Nov. 1998, $12,000.

• Hewlett Packard Company, “RFIC Package and RFIC Passive Models,” (with V.K. Tripathi), Nov. 1998 – Oct. 1999, $58,500.

• NSF Center for Design of Analog-Digital Integrated Circuits (CDADIC), “On-Chip Interconnect Models for High Frequency/Speed Integrated Circuits on Silicon Substrate,” (with V. K. Tripathi) Aug. 1998 - July 1999, $58,000.

• International Microelectronics and Packaging Society (IMAPS), Travel Grant, Nov. 1998, $2,000.

• Oregon State University, College of Engineering, “Interdisciplinary Research Program in Optical Fiber Sensors and Applications,” (with T. K. Plant and D. Kachlakev), Jan. 1999 – Dec. 1999, $35,000.

• Hewlett-Packard Company, University Equipment Grant, “A Digitizing Oscilloscope System to Support Research Work and Graduate Education,”

June 1999, $57,605.

• NSF Center for Design of Analog-Digital Integrated Circuits (CDADIC), “On-Chip Interconnect Models for High Frequency/Speed Integrated Circuits on Silicon Substrate,” Aug. 1999 - July 2000, $60,000.

• International Microelectronics and Packaging Society (IMAPS), Travel Grant, Nov. 1999, $2,000.

• Tektronix, “Spice model synthesis from two-port S-parameter data,” Nov. 1999, $20,000.

• Blue Road Research, “Specialized Fiber Bragg Gratings for Composite Structures,” (with T. K. Plant), subcontract on SBIR Phase II with WPAFB, Aug. 2000 – July 2002, $50,000.


• NSF/CDADIC, REU supplement, Sept. 2000 - Aug. 2001, $5,000.

• International Microelectronics and Packaging Society (IMAPS), Travel Grant, Oct. 2000, $2,000.

• National Semiconductor Corporation, “Testing of Spiral Inductors designed in CMOS,” Dec. 2000, $40,000.


• National Semiconductor Corporation, “Compact solution models for on-chip inductors,” Aug. 2001, $40,000.

• International Microelectronics and Packaging Society (IMAPS), Travel Grant, Oct. 2001, $2,000.

• Cascade Microtech, “Multi-Mode Effects on Single Mode Measurement of CPW Structures,” Oct. 2001 - March 2003, $33,000.

• National Semiconductor Corporation, “Compact solution models for on-chip inductors that extend predictability range,” April 2002, $20,000.


• National Semiconductor Corporation, “Compact solution models for on-chip inductors that extend predictability range,” July 2002, $35,000.

• National Semiconductor Corporation, “Compact solution models for on-chip inductors and transformers,” Dec. 2002, $35,000.

• National Semiconductor Corporation, “Compact solution models for on-chip inductors that extend predictability range,” March 2003, $10,000.


• Oregon State University, College of Engineering, “Alumni Professor Award,” Sept. 2003, $10,000.

• National Semiconductor Corporation, “Compact solution models for on-chip inductors and transformers,” 2003-2005, $100,000.



• National Semiconductor Corporation, “Modeling of Nonlinear Inductors in Silicon Integrated Circuits,” Aug. 2006, $45,000.

• National Science Foundation, “Basic Mechanisms of Radiation Effects in Heterostructure Devices,” PI: Andreas Weisshaar, co-PI: Raghu K. Settaluri. Feb. 2007 – Aug. 2008, $ 84,659 (The original proposal was written by M. Subramanian and he was funded as the sole PI April 2002-2005. The grant balance was first transferred to R. Settaluri when M. Subramanian left the university and then to A. Weisshaar when R. Settaluri left the university. Subsequently, grant was transferred to K. Mayaram, OSU in April 2008 due to A. Weisshaar’s appointment as NSF Program Director.)

• Center for Design of Analog-Digital Integrated Circuits (CDADIC), “Coupling Suppression in Integrated Circuits using Dummy Metal,” Aug. 2007 – Aug. 2008, $45,000.

• National Semiconductor Corporation, “Modeling of Transformers and Inductors,” July 2007, $60,000.

• National Semiconductor Corporation, “Modeling of Transformers and Inductors,” Jan. 2008, $45,000.

• National Semiconductor Corporation, “Modeling of Inductors,” July 2008, $50,000.

• Center for Design of Analog-Digital Integrated Circuits (CDADIC), “Coupling Suppression in Integrated Circuits using Dummy Metal,” Aug. 2008 – Aug. 2009, $45,000.

• National Semiconductor Corporation, “Modeling of Inductors and Transformers,” July 2009, $50,000.

• Center for Design of Analog-Digital Integrated Circuits (CDADIC), “Enabling Metal-Fill-Aware Design of RF/Mixed-Signal Integrated Circuits,” Aug. 2009 – Aug. 2010, $45,000.

• National Semiconductor Corporation, “Modeling of Inductors and Transformers,” July 2010, $50,000.

• NSF Center for Design of Analog-Digital Integrated Circuits (CDADIC), “Enabling Metal-Fill-Aware Design of RF/Mixed-Signal Integrated Circuits,” Aug. 2010 – Aug. 2011, $40,000.

• National Science Foundation, Intergovernmental Personnel Act (IPA) Assignment (Program Director in ECCS Division), Apr. 2008 – Aug. 2011, total award amount: $706,133.

• National Science Foundation, Independent Research/Development (IR/D) Program (during NSF IPA assignment, Apr. 2008 – Aug. 2011), estimated amount: > $100,000.

• National Semiconductor Corporation, “Modeling of Transformers and Inductors,” June 2011, $45,000.


• Texas Instruments, “Modeling of Nonlinear Magnetic Devices Integrated in Silicon,” May 2012, $43,000.

• NSF/CDADIC, REU supplement, Sept. 2012 - Aug. 2013, $8,000.


Direct Student Support

• NSF Graduate Research Fellowship, Kate Remley, Sept. 1994 – Aug. 1997, $70,500.

• Intel Graduate Fellowship, Rick Lutz, AY 1998/9, $26,200.

• ARFTG ‘Silver’ Student Fellowship Award, Vikas Shilimkar, AY 2011/12, $5,000.

Donations

• Tektronix, Equipment Proposal Program (1992, 1994) and OJGSE/College

of Engineering Equipment Proposal (1992), value over $70,000.

• Hewlett Packard Company, Equipment Donation Program, (with V. K. Tripathi), 1995, valued at $88,460.

• EDX Engineering, MCS Software, Nov. 1995, market value $9,995.

• Analogy Inc., SABER license renewal and upgrade, 1996, $1,500; software has an approximate market value of $100,000.

• Hewlett Packard Company, Microwave CAD Software Suite Series IV (later ADS) and High Frequency Structure Simulator, (with V. K. Tripathi), 1997, market value over $100,000.

• Agilent Technologies, ADS software tools, 2000, $1,200 academic fee, estimated market value over $500,000 per year.

• Ansoft Inc., High Frequency Structure Simulator (HFSS), with $1,300 yearly academic service fee; this software (several licenses) has an approximate market value of $97,800 per year; since 2002.

• Tektronix, Equipment Donation for Electromagnetics Laboratory, Oct. 2003; fair market value $122,802.

• Tektronix, Equipment Donation for Electromagnetics Laboratory, May 2005; fair market value $11,000.

• Intel, HP 4195A Network Analyzer, Oct. 2006; fair market value $4,000.

• Intel, HP 8510C Network Analyzer Rack, Sept. 2007; fair value $10,000.

Patents

• E. Udd and A. Weisshaar, “High-Speed Demodulation Systems For Fiber

Optic Grating Sensors,'' US patent 6,335,524, issued Jan. 1, 2002.

Reviewing

• Applied Optics • Applied Physics • Applied Physics Letters • Electronics Letters • IEE Proceedings - Microwaves, Antennas and Propagation • IEEE Electron Device Letters • IEEE/OSA Journal of Lightwave Technology • IEEE Microwave and Wireless Components Letters • IEEE Microwave and Guided Wave Letters • IEEE Proceedings • IEEE Transactions on Advanced Packaging • IEEE Transactions on Circuits and Systems, Parts 1 & 2 • IEEE Transactions on Components and Packaging Technologies • IEEE Transactions on Computer Aided Design • IEEE Transactions on Electromagnetic Compatibility • IEEE Transactions on Electron Devices • IEEE Transactions on Microwave Theory and Techniques • International Journal on Microwave and Millimeter-Wave Computer Aided

Engineering • Journal of Optical Engineering • Journal of the Optical Society of America, A • Optics Communications • Optics Letters • Reviewer for Addison Wesley Longman Publishing Company • Reviewer for National Science Foundation

Professional Service & Memberships

• Guest Co-Editor, Special Issue on “Future Spectrum Access,” Proceedings of

the IEEE, Sept. 2013.

• Co-developer/co-editor of section on “Radio Spectrum Access” for the Centennial Issue of the Proceedings of the IEEE (with A. Clegg), 2011.

• Moderator, NSF EECS Grantees Conference, Honolulu, Hawai'i, Nov. 30 – Dec. 3, 2010.

• Co-developer and co-sponsor, NSF Solicitation on “Nanoelectronics for 2020 and Beyond (NEB)” (NSF 10-614), 2010/11.

• Member, Wireless Spectrum Research and Development Senior Steering Group (WSRD SSG) (intergovernmental agency group under the auspices of the Networking and Information Technology Research and Development (NITRD) program), 2010-2011.

• Co-sponsor, NSF workshop “Enhancing Access to the Radio Spectrum,” Arlington, VA, Aug. 4-6, 2010; co-developer of NSF solicitation (NSF 12-546).

• Sponsor, NSF workshop “Workshop on Failure and Uncertainty in Mixed-

Signal Circuits and Systems,” Arlington, VA, July 8-9, 2010. Resulted in joint NSF-SRC solicitation (NSF 12-556).

• Member of Organizing Committee, SRC/ATIC/NSF Forum on Minimum Energy Electronic Systems (MEES 2020): The iKNOW Machine, Abu Dhabi, May 23-24, 2010.

• NSF ENG Representative, NSF Faculty Early Career (CAREER) Development Proposal Workshop, Quality Education for Minorities (QEM) Network, Las Vegas, NV, Feb. 19-20, 2010.

• Co-developer and co-sponsor, NSF Solicitation on “Building Engineered Complex Systems (BECS)” (NSF 09-610), 2009/10.

• Co-developer, NSF “Enhancing Access to the Radio Spectrum (EARS)” Program, 2009 – 2011.

• NSF Engineering Directorate Representative for NSF CAREER program and member of NSF CAREER Coordinating Committee (CCC), 2009-2011.

• NSF ECCS Division Representative for NSF CAREER program, 2008 – 2011.

• Cognizant Program Officer, NSF Engineering Research Center for “Wireless Integrated MicroSystems (WIMS)” at the University of Michigan, 2008 – 2011.

• NSF Program Director, “Communications, Circuits, and Sensing-Systems (CCSS)” Program (formerly “Integrative, Hybrid and Complex Systems” (IHCS) Program, April 2008 – Aug. 2011.

• NSF “Complex Systems” working group, 2009-2011.

• General Co-Chair (managing chair), IEEE Conference on Electrical Performance of Electronic Packaging and Systems, Oct. 2009.

• General Co-chair, IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Oct. 2008.

• Associate Editor, IEEE Transactions on Components, Packaging and Manufacturing Technology, Jan. 2011 – present.

• Associate Editor, IEEE Transactions on Advanced Packaging, March 2004 – Dec. 2010.

• Associate Editor, IEEE Microwave and Wireless Components Letters, Aug. 2003 – March 2006.

• Guest Editor, IEEE Transactions on Microwave Theory and Techniques, special Symposium issue, Dec. 2002.

• Member of Editorial Board, IEEE Microwave and Wireless Component Letters.

• Visiting Professor, Johannes Kepler University, Linz, Austria, Dec. 2001.

• Steering Committee, IEEE International Microwave Symposium 2002.

• Steering Committee, IEEE International Microwave Symposium 2013.

• Executive Committee, IEEE EPEPS Conference, 2008-2011.

• Chair, awards committee, IEEE EPEPS Conference, 2011.

• Technical Program Committee, IEEE International Microwave Symposium,

1999-present; subcommittee chair for IMS2006, co-chair for IMS2007 and IMS2012.

• Technical Program Committee, IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2003 - present.

• Technical Program Committee, IEEE Workshop on Signal Propagation on Interconnects (SPI), 2005 - present.

• Technical Program Committee, 2004 International Symposium on Signals, Systems, and Electronics (ISSSE 2004).

• Technical Program Committee, IEEE Radio and Wireless Conference RAWCON 2003.

• Technical Program Committee, IEEE/SPIE Conference on Emerging Optoelectronic Technologies, Bangalore, India, July 1994.

• Technical Program Committee, Photonics’98: International Conference on Fiber Optics and Photonics, New Delhi, India, 1998.

• Technical Program Committee, 6th Pacific Northwest Fiber Optic Sensor Workshop," Troutdale, Oregon, May 14-15, 2003.

• International Advisory Committee: Electrical Design for Advanced Packaging and Systems International Workshop, held annually in Asia, 2002 - 2009.

• IEEE CPMT Technical Committee CPMT-EDMS: Electrical Design, Modeling and Simulation, 1999 - present.

• IEEE MTT Technical Committee MTT-12: Microwave and Millimeter Wave Packaging and Manufacturing, 1998 - present.

• IEEE MTT Technical Committee MTT-1: Computer Aided Design, 2002 - present.

• Lecture Series Co-Organizer, “Signal Processing for Communications,” Oregon Center for Advanced Technology Education (OCATE), 1993/94.

• Instructor, National Institute of Standards and Technology (NIST), workshop on “Computer Modeling of Optical Waveguides and Components”, Boulder, Colorado, June 1994.

• Session Co-Chair, IEEE International Symposium on Antennas and Propagation, Seattle, Washington, June 1994.

• Invited Session Organizer, Progress in Electromagnetics Research Symposium (PIERS'95), Seattle, July 1995.

• Session Co-Chair, Progress in Electromagnetics Research Symposium (PIERS'95), Seattle, July 1995.

• Invited Session Organizer, Progress in Electromagnetics Research Symposium (PIERS'96), Innsbruck, Austria, July 1996.

• Invited Session Organizer, Progress in Electromagnetics Research Symposium (PIERS'97), Cambridge, Massachusetts, July 1997.

• Session Chair, Progress in Electromagnetics Research Symposium (PIERS'97), Cambridge, Massachusetts, USA, July 1997.

• Session Co-Chair, IEEE International Microwave Symposium, June 1999.



• Session Chair, 4th IEEE Workshop on Signal Propagation on Interconnects, May 2000.

• Session Co-Chair, IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP'2000), October 2000.



• Session Co-Chair, IEEE Conference on Electrical Performance of Electronic Packaging and Systems, Oct. 2012.

• Co-organizer, workshop at IEEE International Microwave Symposium, Fort Worth, Texas, June 2004.

• Co-organizer, tutorial at IEEE International Microwave Symposium, Fort Worth, Texas, June 2004.

• Co-organizer, workshop at IEEE International Microwave Symposium, San Francisco, CA, June 2006.

• Evaluator of Habilitation dossier, March 2001.

• External Ph.D. dissertation examiner, University of Victoria, April 2006.

• External Ph.D. dissertation examiner, Carleton University, June 2006.

• External Ph.D. dissertation examiner, IIT Kanpur, India, April 2008.

• External examiner of P&T dossier, 2007.



• External examiner of 3 P&T dossiers, 2012.

• Institute of Electrical and Electronics Engineers (IEEE), Senior Member. 1998.

• Institute of Electrical and Electronics Engineers (IEEE), Fellow, Jan. 2006.

• IEEE Antennas and Propagation Society

• IEEE Circuits and Systems Society

• IEEE Communications Society

• IEEE Components, Packaging, and Manufacturing Technology Society

• IEEE Photonics Society

• IEEE Microwave Theory and Techniques Society

• IEEE Solid-State Circuits Society

• Eta Kappa Nu (HKN) Electrical Engineering Honor Society (also faculty advisor from 1997 – 2008)

• International Microelectronics and Packaging Society, Member, since 1998 (also faculty advisor of OSU student chapter 1998 - 2008)

• Sigma Xi Research Society

University Service

• COE Promotion & Tenure Committee, 2012 – present • Chair, EECS P&T Dossier Committee, 2012 – present • EECS P&T Dossier Committee, 2011 – present • ECE/EECS Promotion & Tenure Committee, 1999 – 2003, 2005 – 2008 • Chair, ECE Faculty Search Committee, 2007 – 2009 • ECE Faculty Search Committee, 1999 – 2000, 2003, 2004 – 2009 • ECE Search Coordination Committee in Communications, 1997 - 1999 • ECE Department Coordinating Council, 1995 – 1999 • EECS Microwaves group, 1992 – present (chair since 1995) • Co-Chair, ECE Undergraduate Curriculum Committee, 2011 – present • ECE Undergraduate Curriculum Committee, 1992 – 1998, 2004 – 2005,

2011 – present • ECE Undergraduate Committee, 1996 – 1998 • ECE Graduate Committee, 1998 – 2003 • ECE GTA Selection Committee, 2007 – 2008 • Ph.D. Qualifying Exam Committee, 1992-1994 • ECE Computing Committee, 1992 – 1994, 2002 – 2003 • ECE IAB Curriculum Task Force, 1992 –1995 • Co-Chair, ECE Awards Committee, 2005 • ECE Graduate Admissions Committee, 1992 - present • Faculty advisor of Eta Kappa Nu (HKN) electrical engineering Honor Society

Pi Chapter at OSU, 1997 – 2008 • Faculty advisor of student chapter of the International Microelectronics and

Packaging Society (IMAPS) at OSU, Fall 1998 – 2008 • ECE UG Student Advisor, 2001, 2006-2007 • ECE Pre-Engineering Student Advisor, 1999 – 2000 • ECE Freshmen Advisor, 1995 – 1996 • ECE Sophomore and Transfer Student Advisor, 1992 – 1995 • ECE SOAP Freshman advising, 1998 • ECE Computer Resources and Security Committee, 1998 – • Coordinating Committee for undergraduate course sequences in Electro-

magnetics, Microwaves & Optics, Communications, 1995 –1996 • ECE department marketing: developed and implemented extensive

departmental PR materials/brochures, 1995/96 Awards & Recognition

• Appointed to Program Director at the National Science Foundation, April

2008 – Aug. 2011 • Elevated to Fellow of the IEEE, Jan. 2006 • Best Project Award, NSF Center for the Design of Analog-Digital Integrated

Circuits (CDADIC), Feb. 2005 • Alumni Professor Award, College of Engineering, Oregon State University,

2003 • Best Paper of Session Award at 33rd International Symposium on

Microelectronics (IMAPS'2000), Boston, MA, Sept. 2000 • Best Paper of Session Award, 32nd International Symposium on

Microelectronics (IMAPS'99), Chicago, IL, Oct. 26-28, 1999 • Elevated to Senior Member of IEEE, June 1998 • Review Session Award, HKN (OSU), May 1998

Student Awards & Recognition

• 2nd place, Best Student Poster Award, student research poster presentation

at CDADIC review meeting, Vikas Shilimkar and Steven Gaskill, Feb. 2011 • 1st place, Best Student Poster Award, student research poster presentation

at CDADIC review meeting, Steven Gaskill and Vikas Shilimkar, Feb. 2008 • 1st place, Best Student Poster Award, student research poster presentation

at CDADIC review meeting, Chris Blevins and Joel Kolstad, Feb. 2005 • 2nd place, Best Student Poster Award, student research poster presentation

at CDADIC review meeting, Amy Luoh, Feb. 2003 • 3rd place, Best Student Poster Award, student research poster presentation

at CDADIC review meeting, Dan Melendy, July 2002 • Best Paper of Session Award at 33rd International Symposium on

Microelectronics (IMAPS'2000), Boston, MA, Sept. 2000 • 1st prize, senior design project; ECE-IAB meeting/open house, May 2000 • 2nd prize at student research poster presentation in (System, Design and

Test area), Annual NSF Review Meeting of the NSF-ERC Packaging Research Center at Georgia Tech, Chi-young Lim, Rick Lutz, and Garth Sundberg, Oct. 1999

• Best Paper of Session Award, 32nd International Symposium on Microelectronics (IMAPS'99), Chicago, IL, Oct. 26-28, 1999

• 2nd prize, senior design project; ECE IAB meeting/open house, Spring 1998 • 1st prize, IEEE Northwest Regional student paper competition, Kate Remley,

1993 • 2nd prize, IEEE West Coast Area student paper competition, Kate Remley,

1993 • ARFTG ‘Silver’ Student Fellowship Award, Vikas Shilimkar, AY 2011/12,

$5,000 • College of Engineering Research Assistant Award, Kate Remley, 1998 • Intel Graduate Fellowship, Rick Lutz, AY 1998/9 • NSF Graduate Research Fellowship, Kate Remley, Sept. 1994 – Aug. 1997

Instructional Summary

Credit Courses Taught

Course Number Course Title

ECE 311/ ECE 390

Electric and Magnetic Fields

ECE 312/ ECE 391

Electromagnetic Fields and Transmission Lines/ Transmission Lines and Electromagnetic Waves

ECE 391X Transmission Lines ECE

462/562 Communications I

ECE 484/584 Antennas and Propagation

ECE 485/585

Microwave Design Techniques

ECE 590 Analytical Techniques in Electromagnetic Fields ECE 590 (OCATE) Analytical Techniques in Electromagnetic Fields

ECE 591 Advanced Electromagnetics ECE 679D (OCATE) Digital Systems Engineering

ECE 699 (OCATE) RF Circuit Design for Wireless Communications

ECE 699 Special Topics: Interconnects ECE 699 (OCATE) Special Topics: Interconnects

Uni Linz Passive Radio Frequency Components Undergraduate Projects

• Supervised 30 students on 8 senior design projects, Fall 1995 – present • Supervised 11 students on 10 undergraduate projects, Fall 1992 – present • Supervised 8 students on 6 undergraduate studies, Winter 1993 – present • Supervised 4 undergraduate summer project students from the Johannes

Kepler University in Linz, Austria on two projects, 2000 and 2002

Curriculum Development

Introduction of new Graduate Course on Interconnects at OSU and OCATE

This timely course covers important aspects of electrical modeling, simulation, and design of off-chip and on-chip interconnects for digital, RF, and mixed-signal systems. Topics include electrical characteristics of interconnects, modeling of single and coupled interconnects, crosstalk analysis, interconnect topologies, differential interconnects, principles of signal integrity, power distribution, simultaneous switching noise, signaling techniques, and measurement techniques. Some of the course material is based on a book that I co-authored. Student projects include crosstalk analysis, design of interconnect structure for a data bus, as well as student

proposed team projects. This course was first taught at OSU in Fall 2002 and is currently (Fall 2003) being taught simultaneously at OSU with two-way video link to OCATE in Beaverton, Oregon.

Introduction of two new Graduate Courses at OCATE

Organized and co-taught a new graduate course on “RF Circuits for Wireless Communications” at OCATE in Beaverton, Oregon in Fall 1998. This course was conceived amidst the explosion of growth in the field of RF and wireless electronics applications. It was co-developed and co-taught with two colleagues from industry (Dr. Hayden and Dr. Godshalk) and had a record number of enrolled OCATE students (22 students). Topics covered include: introduction to RF systems and circuit design, RF transceiver architecture, antenna and propagation channel characteristics, receiver dynamic range, power amplifier linearity, synthesizer and phase-lock fundamentals, phase noise and jitter, real components for RF design, quasi-lumped element modeling, and RF/microwave measurements. In Spring 2000, I co-developed and co-taught a new graduate course on “Digital Systems Engineering” at OCATE in Beaverton, Oregon together with my former colleague Dr. Shih-Lien Lu. This course dealt with the major engineering issues and future trends associated with the design of high performance digital systems including signaling, timing, synchronization, noise, and power distribution. Topics covered include: electrical characteristics of packaging and interconnects, high-speed signaling techniques, noise and noise reduction methods, timing conventions and timing noise, synchronization issues, clock and power distribution techniques, and impact of electrical issues on system architecture and design.

Development of new special topics course on Passive Radio Frequency Components

This special topics course focuses on the electrical characteristics and design issues of passive components for RF circuits. I was invited to teach this special topics course at the Johannes Kepler University in Linz, Austria in Dec. 2002 to senior, MS and PhD students. The course included a review of the fundamental characteristics, concepts, and design of lumped and distributed passive components, high frequency effects, packaging parasitics, and discussion of state-of-the-art research results in modeling and design of on-chip and off-chip passive components including incorporation of my own research results.

Redesign and update of required junior-level course on Electric and Magnetic Fields to enhance student learning of electromagnetics concepts

This course was redesigned for better student learning of electromagnetics concepts with significantly updated lecture material. Specific changes to ECE 311/ECE 390 include incorporating detailed review of vector analysis as applied to electromagnetics, emphasizing static electric and magnetic fields, adding numerous examples for better conceptual understanding of concepts, and introducing weekly instructor-taught 1.5 hour long help/review session.

Redesign and update of required junior-level course on Transmission Lines to enhance student learning of transmission-line concepts

Significantly updated lecture and laboratory content and added innovative teaching aids to enhance student learning in ECE 312/ECE 391. Specific changes/additions include pioneering use of the World Wide Web in ECE classes at OSU with extensive interactive web pages with interactive JAVA simulation programs for lecture and lab for enhanced student learning, stronger emphasis on transient response of transmission lines with reactive and nonlinear terminations, three new and two updated laboratory experiments, emphasis on design-oriented problems, and introduction of weekly instructor-taught 1.5 hour long help/review session. During Winter 2007, the course was offered as ECE 391X without the laboratory component. The course material was updated including the addition of more application examples and interconnect signal integrity concepts to the lecture. An additional set of supplemental lecture notes available to the students was developed.

Redesign of senior-level undergraduate course on Communications to update course material and add project component

Specific changes to ECE 462/562 include updating course material to emphasize digital base-band and carrier systems and introducing a substantial project component, which consists of three individual and team design projects that build on each other.

Redesign of senior-level undergraduate course on Antennas and Propagation

ECE 484/584 was redesigned to better reflect practical applications of antennas and include material on wave propagation issues associated with wireless communications in urban areas. Further changes include introducing extensive individual and team project components and introducing regular field trip to two radio transmitter sites and a cell phone transmitter site.

Update of senior-level undergraduate course on Microwave Design Techniques

New lecture notes (over 300 pages) were written for ECE 485/585 in Spring 2007. In the laboratory sessions, students become familiar with the use of industry-standard computer-aided design software for designing microwave circuits. A final design team project leads the students through a complete design cycle of a microwave circuit including measurements in the microwave lab. The students are exposed to the fundamental concepts of microwave measurements using a network analyzer.

Redesign of core graduate-level course on Electromagnetics

Specific changes to this core graduate course in electromagnetics (ECE 590) include redesigning course content and updating lecture material to bring in more practical examples and applications, such as passive components and packaging parasitics, and adding a new project component. In Fall 2006 the lecture notes were completely reworked and updated. Real time simulations were also added to the lectures.

Update of graduate-level course on Advanced Electromagnetics

Specific changes to ECE 591 include revising course content to better reflect commonly used numerical techniques in electromagnetics, and adding a major project component to course consisting of individual and team simulation projects. This course was revised in coordination with ECE 590.

Students Graduated

* Co-advised with Prof. Vijai K. Tripathi † Advised and acted as major professor due to Prof. Vijai K. Tripathi’s illness since Dec. 1997 ** Co-advised with Prof. Raghu Settaluri

Student Thesis/Project Year

Kate Remley, M.S.

Analysis and Modeling of Lossy Planar Optical Waveguides and Application to

Silicon-Based Structures 1995

Jian Li, M.S.

Project: Analysis of General Multiple Coupled Dielectric Waveguides 1995

Rick Lutz, M.S.†

Analysis and Modeling of Planar Microstrip Spiral Inductors on Lossy Substrates 1998

David W. Arnett, M.S. †

Digital Clocks Based upon Dual Side Band Suppressed Carrier Modulation 1998

Ed Godshalk, Ph.D. †

Characterization and Reduction of Local Oscillator Phase Noise Effects in

Communications Systems 1998

Kate Remley, Ph.D.

Time Domain Modeling of Electromagnetic Radiation with Application to Ultrafast

Electronic and Wireless Communication Systems

1999

Alok Tripathi, Ph.D. †

Modeling and Characterization of Multiple Coupled Lines 1999

Yoonsuk Kim, Ph.D. *

Characterization of Coupled Microstrip Structure using FDTD 1999

Joseph McVeety,

M.S. *

Analysis of Planar Multi-Conductor Multilayered Structures by Network Analog

Method 1999

Garth Sundberg, M.S.

Model Extraction of a Paddle in Plastic Surface-Mount RF-IC Packages 2000

Yeon-Chang Hahm, Ph.D. *

Field Theoretic Analysis of a Class of Planar Microwave and Opto-Electronic Structures 2000

Hai Lan, M.S.

Analysis and Modeling of Microstrip On-Chip Interconnects on Silicon Substrate 2001

Martin Cook, M.S.

Project: Power Ampflifier Predistortion in CDMA 2003

Sorwar Hossain, M.S.

Project: Design of a Broadside-Coupled Three-Line Balun

2002

Dan Melendy, M.S.

Modelling of On-Chip Spiral Inductors for Silicon RFICs 2002

Adam Watson, M.S.

Analysis and Modeling of Single-Ended and Differential Spiral Inductors in Silicon-Based

RFICs 2003

Amy Luoh, M.S.

Analysis and Modeling of Coplanar On-Chip Interconnects on Silicon Subtsrates 2003

Darren Ferwalt, M.S.

A Base Control Doherty Power Amplifier Design for Improved Efficiency in GSM

Handsets 2003

Chi-Young Lim, M.S.

Design of Compact Folded-Line RF Power Dividers 2003

Rajarajan Senguttuvan,

M.S.

Analysis and Modeling of Multi-Mode Effects in Coplanar Waveguide Bends 2003

Iva Orhanovic, Ph.D.

Processing Sequences of Chromatophore Images with Application to Signal Transduction Pathway Modeling

2004

Josiah Bartlett, M.S.

Project: Reducing Design Risk and Cost Through Effective Application of Signal

Integrity Tools 2004

Rick Lutz, Ph.D.

Inductors in High-Performance Silicon Radio Frequency Integrated Circuits: Analysis, Modeling, and Design Considerations

2005

Yevgeniy Mayevskiy,

M.S.

Analysis and Modeling of Monolithic On-Chip Transformers on Silicon Substrates 2005

Shruti Mangalmurti,

M.S. **

Project: Analysis and Modeling of Microstrip Interconnects with Lossy Ground Plane of

Finite Width 2006

Joel Kolstad, M.S.

CAM: A New Circuit Augmentation Method for Modeling Interconnects and Passive Components

2007

Kavitha Rapolu M.S.

Broadband Modeling of On-chip Transformers for Silicon RFICs 2008

Vikas Shilimkar M.S.

Metal Fill Considerations for On-chip Interconnects and Spiral Inductors 2009

Chris Blevins M.S.

Model Development Via Delay Extraction for the Time-Domain Simulation of Lossy Transmission Lines

2010

Steven Gaskill M.S.

Electrical Recommendations and Formulas for Metal Fill in Radio-Frequency Integrated Circuits

2010

Current Graduate Students

• Steven Gaskill, Ph.D., exp. Sept. 2013 • Vikas Shilimkar, Ph.D., exp. Sept. 2013 • Dyuti Sengupta, Ph.D., exp. 2016 • Lei Zheng, Ph.D., exp. 2016

Post-docs & Visitors

• Ji Zheng, Post-doctoral Research Associate, March 1998 – Dec. 2000 • Raghu K. Settaluri, Post-doctoral Research Associate, Jan. 1998 – Sept.

1999

Graduate Student Committees

• Maynard Falconer, M.S., 1993 • Diwakar Vishakhadatta, M.S., 1993 • Ahmad Abu-Dayah, M.S., 1993 • Beate Falconer, M.S., 1994 • Cole McCandlish, M.S., 1994 • Quing Zhang, Ph.D., 1995 • Mary F. T. Spilde, Ph.D., 1995 • Yuning Cao, Ph.D., 1996 • Lamine Diedhiou, M.S., 1996 • Jihsheng Wen, M.S., 1996 • Clarissa Thomas, M.S., 1997 • Ralf Wiedmann, M.S., 1997 • Hamidou Sy, M.S., 1997 • Maynard Falconer, Ph.D., 1997 • Hairong Gao, M.S., 1997 • Dan Onu, M.S., 1997 • Jianjun J. Zhou, Ph.D., 1998 • Bo Wang, Ph.D., 1998 • Lei Feng, M.S., 1998 • Takao Inoue, M.S., 1998 • Brian Ballweber, M.S., 1998 • Yung-Jin Gang, Ph.D., 1998 • Tao Shui, Ph.D., 1998 • Berk Sunar, Ph.D., 1998 • Kirstie Finster, M.S., 1999 • David Buck, M.S., 1999 • Matt Anderson, M.S., 1999 • Francisco Rodriguez-Ruiz, Ph.D., 2000 • Brandon Greenley, M.S., 2001 • Tong Liu, Ph.D., 2001

• Cheryl Klipp, Ph.D., 2002 • Dylan D. Righi, M.S., 2002 • Kevin Lai, Ph.D., 2002 • Voranon Kiettrisalpipop, M.S., 2003 • Andre Ramme, Ph.D., 2003 • Fuminao Kinjo, M.S., 2003 • Pooja, M.S., 2003 • Ben Norris, Ph.D., 2003 • David Stoops, M.S., 2004 • Scott Hazenboom, M.S., 2004 • Kala Gururajan, M.S., 2004 • Yan Li, Ph.D., exp. 2005 • Emmanuel Agamloh, Ph.D., 2005 • Michael D Phillips, M.S., 2005 • Kyle Webb, M.S., 2005 • Steven Hsu, Ph.D., 2006 • Harish Peddibhotla, M.S., 2006 • Kavitha Srinivasan, M.S., 2006 • Suma Kapilavai, MEng, 2006 • Wendell Woo, M.S., June 2007 • Ben Flugstad, Ph.D., exp. 2008 (Minor Professor) • Triet Le, Ph.D., Feb. 2008 • Ahmet Ferhat Yildirim, Ph.D., (qual, program committee meeting), 2009 • James Ayers, Ph.D., (qual, program committee meeting), 2010 • Napong Panitantum, Ph.D., (qual, program committee meeting), 2011 • Thomas Brown, Ph.D., (excluding final exam), 2011 • Catherine Forte, Ph.D., 2011 (GCR) • Ming-Hung Kuo, M.S., 2012 • Martin Stoddard, Ph.D., exp. 2012 • Benjamin Jann, Ph.D., exp 2015 • Zachary Thompson, Ph.D., exp 2015 (GCR)

Teaching Evaluations Course

No. Term Year

Enroll-ment

# Re-sponding

Type of Course

Student Evaluation

(Q 12)

College Averages*

(Q 12) Δ

ECE 312 Spring 1992 65 37 required EE,

4 units 3.49 2.76 +0.73

ECE 590 Winter 1993 21 17 core course,

4 units 3.06 3.08 -0.02


4 units 3.18 2.96 +0.22

ECE 311 Fall 1993 60 43 required EE,

4 units 3.05 3.06 -0.01


4 units 3.05 3.06 -0.01

ECE 312 Winter 1994 66 39 required EE,

4 units 3.36 2.75 +0.61

ECE 484/584

Spring 1994 18/2 11/2 elective

4 units 3.45/4.00 3.13/3.19 +0.32/+0.81


4 units 2.67 2.98 -0.31

ECE 462/562

Winter 1995 16/2 15/1 elective

4 units 3.53/4.00 3.12/3.16 +0.41/+0.84


4 units 3.50 3.04 +0.46


4 units 3.41 3.09 +0.32


4 units 3.64 2.96 +0.68

ECE 462/562

Winter 1996 16/9 13/7 elective

4 units 3.25/3.50 3.19/3.42 +0.06/+0.08

ECE 484/584


4 units 3.86/4.00 3.35/3.34 +0.51/+0.66


4 units 3.84 3.29 +0.37


4 units 3.38 3.47 -0.09


4 units 3.93 3.28 +0.65

ECE 591 Spring 1997 8 N/A elective

3 units N/A N/A N/A


4 units 3.30 3.21 +0.09


4 units 3.05 3.09 -0.04

ECE 484/584


4 units 3.50/3.75 3.25/3.45 +0.25/+0.30


4 units 3.21 3.17 +0.04

ECE 699 (OCATE)

Fall 1999 22 N/A elective

3 units N/A N/A N/A


4 units 3.29

(3.84†) 3.44 -0.15 (+0.40†)

ECE 590 (OCATE)

Winter 1999 4 N/A core course,

4 units N/A N/A N/A


4 units 3.61 3.36 +0.25


4 units 3.79 3.21 +0.58

ECE 590 (OCATE)

Winter 2000 5 5 core course,

4 units 4.00 3.80 +0.20

ECE 484/584


4 units 3.87/4.00 3.18/3.49 +0.69/+0.51

ECE 679D

(OCATE)

Spring 2000 19 18** elective

3 units 3.39** 3.39** +0.00**

ECE 590 (OCATE)

Winter 2001 5 3 core course,

4 units 3.67 3.60 +0.07

ECE 590 Winter 2001 10 N/A‡ core course,

4 units N/A‡ N/A‡ N/A‡

ECE 591 Spring 2001 8 8 elective

3 units 3.75 3.49 +0.26


4 units 3.77 3.30 +0.47


4 units 3.23

(3.49†) 3.44 -0.21 (+0.05†)


4 units 3.42 3.09 +0.33

ECE 484/584


4 units 3.71/4.00 3.45/3.43 +0.26/+0.57

ECE 699 Fall 2002 14 13 elective

3 units 3.85 3.49 +0.36


4 units 3.80 3.49 +0.31

ECE 590 (OACTE)

Winter 2003 4 N/A core course,

4 units N/A N/A N/A

* co-taught 20% of course ** co-taught 50% of course; no other 6XX courses in OCATE average † excluding one zero response ‡ no student evaluation results available due to administrative error

A new evaluation system was introduced; listed are median values based on question 2 on the evaluation form (maximum score of 6.0)

Course No.

Term Year

Enroll-ment

# Re-sponding

Type of Course

Student Evaluation

(Q2)

College Averages*

(Q2) Δ


4 units 5.0 5.0 +0.0


3 units 6.0 5.0 +1.0

ECE 699 Fall 2003 28 N/A elective

3 units 5.0 N/A N/A

ECE 590 Winter 2004 13 9 core course

4 units 6.0 5.0 +1.0


4 units 5.0 5.0 +0.0

ECE 484/584


4 units 5.0/5.0 5.0/5.0 +0.0/+0.0


3 units 4.7 5.1 -0.4


4 units 4.3 5.3 -1.0


4 units 4.4 4.5 -0.1


3 units 5.5 5.4 +0.1


3 units 4.7 5.2 -0.5


4 units 4.4 4.6 -0.2


4 units 4.3 5.1 -0.8

ECE 484/584


4 units 5.7/5.5 5.0/5.3 +0.7/+0.2

ECE 590 Fall 2006 6 6 core course

4 units 5.5 5.1 +0.4

ECE 391X

Winter 2007 112 58

required EE/ECE 3 units

4.6 4.7 -0.1

ECE 485/585


4 units 5.0 5.3 -0.3


4 units 5.5 5.1 +0.4


3 units 5.6 5.1 +0.5

ECE 391X

Winter 2008 81 34

required EE/ECE 3 units

5.0 4.8 +0.2

*College averages are shown separately for each level (e.g., 400, 500) taught (as available).

Course No.

Term Year

Enroll-ment

# Re-sponding

Type of Course

Student Evaluation

(#1/#2)

College Averages

(#1/#2) Δ


4 units 5.0/5.6 4.6/4.8 +0.4/+0.8

ECE 484/584

Winter 2012 13 12 elective

4 units 5.7/5.5 4.6/4.8 +1.1/+0.7

ECE 485/585

Spring 2012 6 5 elective

4 units 4.9/5.1 4.7/4.9 +0.2/+0.2

ECE 590 Fall 2012 core course

4 units

andreas weisshaar professor school of electrical...

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