analogfront-end electronics in beam instrumentation
TRANSCRIPT
2005 by A. Boscolo
Analog front-end electronics in beam instrumentation
Basic instrumentation structure
Silicon state of art
Sampling state of art
Instrumentation trend
Comments and example on BPM
Future Beam Position Instrumentation
Conclusions
2005 by A. Boscolo
Basic measurement and control process
Coded targetdescription
Measurement process
Control process
Inputtransducers
sensorsFront_end CODEC Symbolic
processorCoded
information
Output transducersactuators
Driver SymbolicprocessorDECODEC
Physical domain
event Symbols
domain
abstract
2005 by A. Boscolo
Generalized informationcapture process
[information carrier]
[E][D][C][C][C][A] [B]
Input transducer Processing Output transducer
2005 by A. Boscolo
Generalized information capture process
example
[L][V][V][V][R][P] [ε]
Input transducer Processing Output transducer
Elasticdevice
Piezoresistivedevice τs
G+1
( )iu VfV = Magnetoelectricdevice
R/Vconverter
2005 by A. Boscolo
Generalizedinstrumentation architecture
SensorsPhysic
processor(analog)
CODEC(A/D)
Symbolic processor(numeric)
Coded information(measure)
[A] [B] [B] [code] [code] [code]
[information carrier]
2005 by A. Boscolo
Classification criteria
SystemAmplitudeTime
Full digitaldiscretediscrete
Sampledcontinuousdiscrete
Full analogcontinuouscontinuous
2005 by A. Boscolo
Classification criteria
Full analog (Time Continuous) is one must in:
Impedance converterCommon mode rejectionHigh speed comparatorAnti aliasing filterGHz oscillator
2005 by A. Boscolo
Generalizedinstrumentation architecture
Instrument
is an information based device capable to capture and to refine information from the physical word
2005 by A. Boscolo
Generalized instrumentation architecture
sensors cabling protection TCprocessing
TDprocessing coding Symbolic
processing
Rawinformation
Refinedinformation
measureevent
Physical word
Abstract word
The best choice is a synergic mix of the three different approach: analogic, sampled and numeric
2005 by A. Boscolo
Analog front-end electronics in beam instrumentation
Basic instrumentation structure
Silicon state of art
Sampling state of art
Instrumentation trend
Comments and example on BPM
Future Beam Position Instrumentation
Conclusions
2005 by A. Boscolo
Silicon State of artthe MOS
Cross-sectional transmission electron micrograph of 50 nm gate length mosfet
2005 by A. Boscolo
Silicon State of art
This year we are celebrating the40th anniversary of Moore's Law
2005 by A. Boscolo
Silicon State of artNTRS and ITRS National and Internationals
Roadmap for Semiconductors
2005 by A. Boscolo
Silicon State of artMosfets scaling limit
Open problems
Gate insulatorsGate electrodesShallow junctionsJunction contacts
Some solutions
Copper + low εr
SOI silicon on insulatorStrained siliconHigh εr gate insulator
2005 by A. Boscolo
Silicon State of art Driven force
Embedded applications navigator, automotive, medical, consumer
Personal communication one chip systemsHome automation and Digital home
New processorsHigh speed serial bus (10Gb/s) IEEE 802.11,IEEE 1394
2005 by A. Boscolo
Silicon State of art
Current availability
65nm CMOS technologyTHz transistors100Gsp/s electric sampling rate oscilloscope
2005 by A. Boscolo
Analog front-end electronics in beam instrumentation
Basic instrumentation structure
Silicon state of art
Sampling state of art
Instrumentation trend
Comments and example on BPM
Future Beam Position Instrumentation
Conclusions
2005 by A. Boscolo
Sampling State of artthe optoelectronic solution
2005 by A. Boscolo
Sampling State of artthe optoelectronic solution
Time stretcher analog to digital converter
Physical implementation of the time-stretch preprocessing. Single SideBand (SSB) modulation removes the electrical bandwidth limitation imposed by dispersion. The differential Mach-Zehnder (MZ) modulation is used to remove common-mode distortion
Time-stretch Analog-to-Digital Conversion . (a) with a time-limited input signal, and (b) with a continuous-time input signal.
2005 by A. Boscolo
Analog front-end electronics in beam instrumentation
Basic instrumentation structure
Silicon state of art
Sampling state of art
Instrumentation trend
Comments and example on BPM
Future Beam Position Instrumentation
Conclusions
2005 by A. Boscolo
Instrumentation trends
General technological improvement
Large number of components
Availability of good analog switch
Key factors:
2005 by A. Boscolo
Instrumentation trends
New class of device where all the techniques are fused together in
order to optimize the cost performance ratio
Adaptive analogelectronic
Embedded controller
Switched capacitor technique
Tuning methods
Performance evaluation
Testembedded
Measurement methods
2005 by A. Boscolo
Instrumentation trends
event
Physical word
Rawinformation
measure
Abstract word
System on chip (soc)
sensors wiring protection TCprocessing
TDprocessing
coding Symbolicprocessing
Embeddedtest & tuning
Embedded controller
conditioning
Embeddedtest & tuning
Embeddedtest & tuning
Gateway
Refinedinformation
Smart sensor
2005 by A. Boscolo
Instrumentation trends
Mixed Signal Array with On-Chip Controller
Low level differential high speed (>2Gsps) ADC
SSP sensor signal processor
FPAA field programmable analog array
PSoC™ programmable systems-on-chip
2005 by A. Boscolo
Instrumentation trends
Low level differentialhigh speed ADC
(>2Gsps up to10 bit )
2005 by A. Boscolo
Instrumentation trends
SSP sensor signal processor
2005 by A. Boscolo
Instrumentation trends
FPAA field programmable analog array
Configurable Analog Blocks (CABs)Switched capacitor based
2005 by A. Boscolo
Instrumentation trends
Software design environmentSimple implementation of complex functionsRapid prototype and test
FPAA platformAddresses multiple sensorsAllows tuning the data acquisition board for multiple sensorsZoom in on specific portions of the sensor curve
Signal conditioningAdaptive under real time controlAdded precisionLow latency
2005 by A. Boscolo
Instrumentation trends
FPAA Feature/Benefits
On-Chip; DC references, oscillators, custom waveform generatorsTemperature stable, no driftLower cost of goods
Programmable and ReconfigurableFPAA can adapt to different sensor conditioning needsMultiple sensor conditioning circuits can be built on a single FPAA
Dynamic reconfigurabilityAdaptive and preciseAuto frequency and gain controlAuto compensationAuto calibrationCompetitive advantage
2005 by A. Boscolo
Instrumentation trends
PSoC™programmable systems-on-chip
Configurable Analog Blocks (CABs)Switched capacitor based
2005 by A. Boscolo
Instrumentation trends
The PSoC
consists of many Mixed-Signal Array with On-Chip Controller devices.
replaces multiple traditional MCU-based system components with one, low cost single-chip programmable component
includes configurable blocks of analog and digital logic, as well as programmable interconnect
2005 by A. Boscolo
Example
Goals:
Global Accuracy 1%Resolution 0.5 % (8 bit)
( )
elsewhere 0 ;0,0,0,for
,,1
≥>≥≥
⎪⎭
⎪⎬⎫
⎪⎩
⎪⎨⎧
⎟⎠⎞
⎜⎝⎛ −=
⎟⎠⎞
⎜⎝⎛ −−−
γβαγ
αγ
αβγβα
β
αγβ
x
exxx
f
Mapping a voltage ramp in to Weibull function
( )ViVu f=
Vu
Vi
2005 by A. Boscolo
Example
Full digital VCG
+
--
R1
R2
Rm
Rn
OP
+CMOS
No linearity
ANN2 3
4 5
6
1
1 input6 output2÷5 hidden nodes
2005 by A. Boscolo
Example
Attribute Full digital VCA ANN
Overall complexity H M L
Design complexity L M H
Standard tools availability H M L
Latency H L L
Thermal stability M M M
Added noise H M/L L
Testability H M L
Programmability H H M
Bandwidth L H M/H
Device cost M M L
Development time L M M
Ranking 60 68 66
2005 by A. Boscolo
Example
Conclusion:
The proposed solutions are overall similarAll the solution can be implemented by the same device FPAA, PSOC
The choice is aim-cost dependentThe choice is designer knowledge dependent
2005 by A. Boscolo
Analog front-end electronics in beam instrumentationBasic instrumentation structure
Silicon state of art
Sampling state of art
Instrumentation trend
Comments and example on BPM
Future Beam Position Instrumentation
Conclusions
2005 by A. Boscolo
Beam Position Sensor
[E][D][C][C][C][A] [B]
Input transducer Processing Output transducer
2005 by A. Boscolo
Beam Position Sensor
X Position = (Va - Vb) / (Va + Vb)
Y Position = (Vc - Vd) / (Vc + Vd)
Va Vb
Vc
Vd
2005 by A. Boscolo
Beam Position Sensor Analogy
Position = (Va - Vb) / (Va + Vb)
A Basic Linear Variable Displacement TransducersLVDT - Cross Section View
2005 by A. Boscolo
Beam Position Monitoring
High dynamic range
Low beam current dependence
High resolution
Variable bandwidth
Suitable cost
Requirements Goals
Bunch-by-bunch
Multi-bunch
Turn-by turn
2005 by A. Boscolo
Beam Position Monitoring
[E][D][C][C][C][A] [B]
Input transducer Processing Output transducer
2005 by A. Boscolo
Beam Position measurement method
Phase normalizer schematic Time normalizer schematic
Frequency domain Time domain
2005 by A. Boscolo
Beam Position state of art
Based on:Digital Receiver (DRX)Field Programmable Gate Array (FPGA)Digital Signal Processor (DSP)General Purpose Processor (GPP)Suitable Firmware
DRXDown
converterFilter +VCA Filter +VCA ADC DSP
DRXADC DSPFilter +VCAhybrid
Bunch-by-bunchBW 250 MHz
Multi-bunch Turn-by turn BW 1KHz ÷1MHz
2005 by A. Boscolo
2005 by A. Boscolo
Beam Position metrological aspects VGA
Gain/Phase normalized to low frequency value at each Av.
2005 by A. Boscolo
Beam Position example
2005 by A. Boscolo
Beam Position example
2005 by A. Boscolo
Beam Position example
The programmable connectivity is the key factor
2005 by A. Boscolo
Analog front-end electronics in beam instrumentation
Basic instrumentation structure
Silicon state of art
Sampling state of art
Instrumentation trend
Comments and example on BPM
Future Beam Position Instrumentation
Conclusions
2005 by A. Boscolo
Future Beam PositionInstrumentation
BPS Hybriddiff VGA DRX PSOC
PROC
Physical domain Abstract domain
USB
Embedded test and supervisor
Wireless distributed one (few) chip autonomous system
PSOC programmable system on chipPROC programmable receiver on chip
2005 by A. Boscolo
Future Beam PositionInstrumentation
Wireless distributed one (few) chip autonomous system
eventBPS SSP PROC
Physical domainAbstract domain
USB
Embedded test and supervisor
2005 by A. Boscolo
Conclusions
From Module to chipHW practice more easyHigh configurability by programmabilityMore knowledge requirementLow development timeGood cost performance ratioGood development tools