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Fico AMS-WThe Art of Substrate Molding
Molding is a process where micro chips are encapsulated in plastic.
Dedicated to the latest trend in single sided packages, the
Fico AMS-W is the most economic and flexible molding system. It
is the proven molding solution for products like QFN, BGA, BOC and
BGA-MAP, including high end applications such as flip chip, multi
array and stacked die.
The Fico AMS-W has a high output, an exceptional performance and
an extremely high yield. Together with the low cost of ownership of
machine and product related set, the Fico AMS-W is the optimal
solution to mold your package.
Future Proof Equipment
Conventional
Rigid moving blocks
Complex handling
Large and heavy mold
Expensive PR-set
Fico AMS-W
Individually moving blocks
35% less moving parts
Modular mold design
Low cost PR-set
The Fico Approach
MOLDINGPRESS
PELLETSUPPLY
CASSETTEHANDLER
VISION
LEADFRAMEHANDLER
Fico AMS-WThe Art of Substrate Molding
Molding is a process where micro chips are encapsulated in plastic.
Dedicated to the latest trend in single sided packages, the
Fico AMS-W is the most economic and flexible molding system. It
is the proven molding solution for products like QFN, BGA, BOC and
BGA-MAP, including high end applications such as flip chip, multi
array and stacked die.
The Fico AMS-W has a high output, an exceptional performance and
an extremely high yield. Together with the low cost of ownership of
machine and product related set, the Fico AMS-W is the optimal
solution to mold your package.
Future Proof Equipment
Conventional
Rigid moving blocks
Complex handling
Large and heavy mold
Expensive PR-set
Fico AMS-W
Individually moving blocks
35% less moving parts
Modular mold design
Low cost PR-set
The Fico Approach
OptticsLEDL
Medical
Autom
otiv
e
Memory
Elleecctronics
Mobile
Su
bstrate Copper
Ceramic
Fi
lm
MOLDINGPRESS
PELLETSUPPLY
CASSETTEHANDLER
VISION
LEADFRAMEHANDLER
www.besi.com
Machine Dimensions
WxDxH: 2273 x 1490 x 1976 mm
Weight: approx. 2600 kg
Leadframe Size
Width: 45 - 79 mm
Length: 180 - 280 mm
Thickness: 0.1 - 1.5 mm
Max. height: 2 mm
Cassette Dimensions
Width: 45 - 85 mm
Length: 180 - 300 mm
Height: 100 - 165 mm
Storage cap.: 400 or 800 mm
Supply Requirements
Voltage: 208 - 480 VAC
Frequency: 50 / 60 Hz
Power rating: 9 kVA
Compressed air: 5 - 10 bar
Average air cons.: 6 m3 at 6 bar
Factory exhaust: 300 m3 at 50 Hz
Performance
Uptime: 98%
MTBF: > 200h for a MTTR of 1 h
MTBA: > 3 h
MTTR: > 1 h
MTTA: < 3 min
Press & Mold
Max. clamp force: 450 kN
Max. mold opening: 90 mm
Max. transfer pressure: 180 bar
Pellet diameter: 11, 14, 14.3 mm
Max. number of plungers: 10
Max. cavity temp. diff.: 2°C
Cassette HandlerFreely accessible
Slot to slot copy
Two or four deck version
High capacity (400 & 800 mm)
Bar code and RFID reader (optional)
VisionLeadframe orientation check
Mark inspection
Optical Character Verification (OCV)
Leadframe HandlerAutomatic orientation correction
Leadframe pre-heating
Anti warpage leadframe cooling
Air cushion transport
Pellet SupplyRemote pellet feed (up to 40 m)
Pellet length check
Pellet cooling
Pellet age control
Molding PressTopedge molding (low viscosity compounds)
Adjustable high clamping force
Dynamic Clamping Control (Flip Chip)
17 process patents
Board and cavity vacuum
Individual, equal board clamping
Machine Dimensions
WxDxH: 2273 x 1490 x 1976 mm
Weight: approx. 2600 kg
Leadframe Size
Width: 45 - 79 mm
Length: 180 - 280 mm
Thickness: 0.1 - 1.5 mm
Max. height: 2 mm
Cassette Dimensions
Width: 45 - 85 mm
Length: 180 - 300 mm
Height: 100 - 165 mm
Storage cap.: 400 or 800 mm
Supply Requirements
Voltage: 208 - 480 VAC
Frequency: 50 / 60 Hz
Power rating: 9 kVA
Compressed air: 5 - 10 bar
Average air cons.: 6 m3 at 6 bar
Factory exhaust: 300 m3 at 50 Hz
Performance
Uptime: 98%
MTBF: > 200h for a MTTR of 1 h
MTBA: > 3 h
MTTR: > 1 h
MTTA: < 3 min
Press & Mold
Max. clamp force: 450 kN
Max. mold opening: 90 mm
Max. transfer pressure: 180 bar
Pellet diameter: 11, 14, 14.3 mm
Max. number of plungers: 10
Max. cavity temp. diff.: 2°C
Cassette HandlerFreely accessible
Slot to slot copy
Two or four deck version
High capacity (400 & 800 mm)
Bar code and RFID reader (optional)
VisionLeadframe orientation check
Mark inspection
Optical Character Verification (OCV)
Leadframe HandlerAutomatic orientation correction
Leadframe pre-heating
Anti warpage leadframe cooling
Air cushion transport
Pellet SupplyRemote pellet feed (up to 40 m)
Pellet length check
Pellet cooling
Pellet age control
Molding PressTopedge molding (low viscosity compounds)
Adjustable high clamping force
Dynamic Clamping Control (Flip Chip)
17 process patents
Board and cavity vacuum
Individual, equal board clamping
www.besi.com - [email protected]