ams w -hr - homepage | besi · pdf filefico ams-w the art of substrate molding molding is a...

2
Fico AMS-W The Art of Substrate Molding BGA-MAP, including high end applications such as flip chip, multi Future Proof Equipment The Fico Approach PELLET SUPPLY LEADFRAME HANDLER Fico AMS -W The Art of Substrate Mol ding Molding is a process where micro chips are encapsulated in plastic. Dedicated to the latest trend in single sided packages, the Fico AMS-W is the most economic and flexible molding system. It is the proven molding solution for products like QFN, BGA, BOC and BGA - MAP, including high end applications such as flip chip, multi array and stacked die. The Fico AMS-W has a high output, an exceptional perf ormance and an extremely high yield. Together with the low cost of ownership of machine and product related set, the Fico AMS-W is the optimal solution to mold your package. Future Proof Equipment Conventional Rigid moving blocks Complex handling Large and heavy mold Expensive PR-set Fico AMS-W Individually moving blocks 35% less moving parts Modular mold design Low cost PR-set The Fico Approach Opt tics LED L Medical A u t o m o t i v e M e m o r y E l l e e c c t r o n i c s M o b i l e S u b s t r a t e C o p p e r C e r a m i c F i l m MOLDING PRESS PELLET SUPPLY CASSETTE HANDLER VISION LEADFRAME HANDLER www.besi.com

Upload: trantu

Post on 01-Feb-2018

219 views

Category:

Documents


3 download

TRANSCRIPT

Fico AMS-WThe Art of Substrate Molding

Molding is a process where micro chips are encapsulated in plastic.

Dedicated to the latest trend in single sided packages, the

Fico AMS-W is the most economic and flexible molding system. It

is the proven molding solution for products like QFN, BGA, BOC and

BGA-MAP, including high end applications such as flip chip, multi

array and stacked die.

The Fico AMS-W has a high output, an exceptional performance and

an extremely high yield. Together with the low cost of ownership of

machine and product related set, the Fico AMS-W is the optimal

solution to mold your package.

Future Proof Equipment

Conventional

Rigid moving blocks

Complex handling

Large and heavy mold

Expensive PR-set

Fico AMS-W

Individually moving blocks

35% less moving parts

Modular mold design

Low cost PR-set

The Fico Approach

MOLDINGPRESS

PELLETSUPPLY

CASSETTEHANDLER

VISION

LEADFRAMEHANDLER

Fico AMS-WThe Art of Substrate Molding

Molding is a process where micro chips are encapsulated in plastic.

Dedicated to the latest trend in single sided packages, the

Fico AMS-W is the most economic and flexible molding system. It

is the proven molding solution for products like QFN, BGA, BOC and

BGA-MAP, including high end applications such as flip chip, multi

array and stacked die.

The Fico AMS-W has a high output, an exceptional performance and

an extremely high yield. Together with the low cost of ownership of

machine and product related set, the Fico AMS-W is the optimal

solution to mold your package.

Future Proof Equipment

Conventional

Rigid moving blocks

Complex handling

Large and heavy mold

Expensive PR-set

Fico AMS-W

Individually moving blocks

35% less moving parts

Modular mold design

Low cost PR-set

The Fico Approach

OptticsLEDL

Medical

Autom

otiv

e

Memory

Elleecctronics

Mobile

Su

bstrate Copper

Ceramic

Fi

lm

MOLDINGPRESS

PELLETSUPPLY

CASSETTEHANDLER

VISION

LEADFRAMEHANDLER

www.besi.com

Machine Dimensions

WxDxH: 2273 x 1490 x 1976 mm

Weight: approx. 2600 kg

Leadframe Size

Width: 45 - 79 mm

Length: 180 - 280 mm

Thickness: 0.1 - 1.5 mm

Max. height: 2 mm

Cassette Dimensions

Width: 45 - 85 mm

Length: 180 - 300 mm

Height: 100 - 165 mm

Storage cap.: 400 or 800 mm

Supply Requirements

Voltage: 208 - 480 VAC

Frequency: 50 / 60 Hz

Power rating: 9 kVA

Compressed air: 5 - 10 bar

Average air cons.: 6 m3 at 6 bar

Factory exhaust: 300 m3 at 50 Hz

Performance

Uptime: 98%

MTBF: > 200h for a MTTR of 1 h

MTBA: > 3 h

MTTR: > 1 h

MTTA: < 3 min

Press & Mold

Max. clamp force: 450 kN

Max. mold opening: 90 mm

Max. transfer pressure: 180 bar

Pellet diameter: 11, 14, 14.3 mm

Max. number of plungers: 10

Max. cavity temp. diff.: 2°C

Cassette HandlerFreely accessible

Slot to slot copy

Two or four deck version

High capacity (400 & 800 mm)

Bar code and RFID reader (optional)

VisionLeadframe orientation check

Mark inspection

Optical Character Verification (OCV)

Leadframe HandlerAutomatic orientation correction

Leadframe pre-heating

Anti warpage leadframe cooling

Air cushion transport

Pellet SupplyRemote pellet feed (up to 40 m)

Pellet length check

Pellet cooling

Pellet age control

Molding PressTopedge molding (low viscosity compounds)

Adjustable high clamping force

Dynamic Clamping Control (Flip Chip)

17 process patents

Board and cavity vacuum

Individual, equal board clamping

Machine Dimensions

WxDxH: 2273 x 1490 x 1976 mm

Weight: approx. 2600 kg

Leadframe Size

Width: 45 - 79 mm

Length: 180 - 280 mm

Thickness: 0.1 - 1.5 mm

Max. height: 2 mm

Cassette Dimensions

Width: 45 - 85 mm

Length: 180 - 300 mm

Height: 100 - 165 mm

Storage cap.: 400 or 800 mm

Supply Requirements

Voltage: 208 - 480 VAC

Frequency: 50 / 60 Hz

Power rating: 9 kVA

Compressed air: 5 - 10 bar

Average air cons.: 6 m3 at 6 bar

Factory exhaust: 300 m3 at 50 Hz

Performance

Uptime: 98%

MTBF: > 200h for a MTTR of 1 h

MTBA: > 3 h

MTTR: > 1 h

MTTA: < 3 min

Press & Mold

Max. clamp force: 450 kN

Max. mold opening: 90 mm

Max. transfer pressure: 180 bar

Pellet diameter: 11, 14, 14.3 mm

Max. number of plungers: 10

Max. cavity temp. diff.: 2°C

Cassette HandlerFreely accessible

Slot to slot copy

Two or four deck version

High capacity (400 & 800 mm)

Bar code and RFID reader (optional)

VisionLeadframe orientation check

Mark inspection

Optical Character Verification (OCV)

Leadframe HandlerAutomatic orientation correction

Leadframe pre-heating

Anti warpage leadframe cooling

Air cushion transport

Pellet SupplyRemote pellet feed (up to 40 m)

Pellet length check

Pellet cooling

Pellet age control

Molding PressTopedge molding (low viscosity compounds)

Adjustable high clamping force

Dynamic Clamping Control (Flip Chip)

17 process patents

Board and cavity vacuum

Individual, equal board clamping

www.besi.com - [email protected]