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Fico MMS-LM The Art of Manual Large Substrate Molding Molding is a process where micro chips are encapsulated in plastic. introduced a new large substrate manual molding machine. The all current single sided packages. Using the original molds, new products can be developed and optimized prior to large scale production. Besides that, the Future Proof Equipment Conventional Moving blocks Complex handling Large and heavy mold Fico MMS-LM 102 x 280 mm substrates Individually moving blocks 35% less moving parts Modular mold design The Fico Approach VACUUM = Fico MMS -L M The Art of Manual Large Substrate Mol ding Molding is a process where micro chips are encapsulated in plastic. In line with the market trend of larger substrates, Fico has introduced a new large substrate manual molding machine. The MMS-LM can mold substrates of up to 102 x 280 mm and handles all current single sided packages. The MMS-LM is used for molding process parameter optimization. Using the original molds, new products can be developed and optimized prior to large scale production. Besides that, the MMS-LM can be used for small production batches or offline cleaning of AMS-LM molds. Future Proof Equipment Opt tics LED L Medical A u t o m o t i v e M e m o r y E E l l e e c t r o n i c s M o b i l e S u b s t r a t e C o p p e r C e r a m i c F i l m Conventional Moving blocks Complex handling Large and heavy mold Fico MMS-LM 102 x 280 mm substr ates Individually moving blocks 35% less moving parts Modular mold design The Fico Approach MOLDING PRESS MOLD VACUUM COMPATIBLE EASY OPERATION VAC = www.besi.com

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Page 1: Fico MMS-LM - Homepage | Besi · PDF fileFico MMS-LM The Art of Manual Large Substrate Molding Molding is a process where micro chips are encapsulated in plastic. In line with the

Fico MMS-LMThe Art of Manual Large Substrate Molding

Molding is a process where micro chips are encapsulated in plastic.

In line with the market trend of larger substrates, Fico has

introduced a new large substrate manual molding machine. The

MMS-LM can mold substrates of up to 102 x 280 mm and handles

all current single sided packages.

The MMS-LM is used for molding process parameter optimization.

Using the original molds, new products can be developed and

optimized prior to large scale production. Besides that, the

MMS-LM can be used for small production batches or offline

cleaning of AMS-LM molds.

Future Proof Equipment

Conventional

Moving blocks

Complex handling

Large and heavy mold

Fico MMS-LM

102 x 280 mm substrates

Individually moving blocks

35% less moving parts

Modular mold design

The Fico Approach

MOLDINGPRESS

MOLD

VACUUM

COMPATIBLE

EASY OPERATION

=

www.besi.com

Fico MMS-LMThe Art of Manual Large Substrate Molding

Molding is a process where micro chips are encapsulated in plastic.

In line with the market trend of larger substrates, Fico has

introduced a new large substrate manual molding machine. The

MMS-LM can mold substrates of up to 102 x 280 mm and handles

all current single sided packages.

The MMS-LM is used for molding process parameter optimization.

Using the original molds, new products can be developed and

optimized prior to large scale production. Besides that, the

MMS-LM can be used for small production batches or offline

cleaning of AMS-LM molds.

Future Proof Equipment

OptticsLEDL

Medical

Autom

otiv

e

Memory

EElleectronics

Mobile

Su

bstrate Copper

Ceramic

Fi

lm

Conventional

Moving blocks

Complex handling

Large and heavy mold

Fico MMS-LM

102 x 280 mm substrates

Individually moving blocks

35% less moving parts

Modular mold design

The Fico Approach

MOLDINGPRESS

MOLD

VACUUM

COMPATIBLE

EASYOPERATION

VAC

=

www.besi.com

Page 2: Fico MMS-LM - Homepage | Besi · PDF fileFico MMS-LM The Art of Manual Large Substrate Molding Molding is a process where micro chips are encapsulated in plastic. In line with the

VacuumBoard vacuum

Cavity vacuum

Void free end product

V-pin vacuum control

Suited for complex molded underfill packages

MoldSolid mold design

Laminated mold design

Vacuum mold

V-pin vacuum control

High precision Fico quality

Molding PressLarge substrate molding

Topedge molding (low viscosity compounds)

Adjustable high clamping force

Dynamic Clamping Control (Flip Chip Bare Die)

17 process patents

Board and cavity vacuum

Individual, equal board clamping

Easy operationUser friendly

Touch screen operation

Low maintenance

Easy process optimization

Ergonomic design

Built in cleaning exhaust

=CompatibleFully compatible automatic and manual machine

Mold exchange to different systems

Compatible with AMS-W molds

Process parameter exchange

Universal parts

Machine Dimensions

WxDxH: 1210 x 1020 x 2012 mm

Weight: approx. 850 kg

Leadframe Size

Width: 65 - 102 mm

Length: 100 - 280 mm

Thickness: 0.1 - 1.5 mm

Max. height: 2 mm

Supply Requirements

Voltage: 208 - 480 VAC

Frequency: 50 / 60 Hz

Power rating: 7.5 kVA

Compressed air: 5 - 10 bar

Average air cons.: 1.5 m3 at 6 bar

Factory exhaust: 300m3 at 50 Hz

Press & Mold

Max. clamp force: 600 kN

Max. mold opening: 90 mm

Max. transfer pressure: 180 bar

Pellet diameter: 11, 14, 14.3 mm

Max. number of plungers: 10

Max. cavity temp. diff.: 2°C

Built in cleaning exhaust

Easy installation

VacuumBoard vacuum

Cavity vacuum

Void free end product

V-pin vacuum control

Suited for complex molded underfill packages

MoldSolid mold design

Laminated mold design

Vacuum mold

V-pin vacuum control

High precision Fico quality

VAC

Molding PressLarge substrate molding

Topedge molding (low viscosity compounds)

Adjustable high clamping force

Dynamic Clamping Control (Flip Chip Bare Die)

17 process patents

Board and cavity vacuum

Individual, equal board clamping

Easy operationUser friendly

Touch screen operation

Low maintenance

Easy process optimization

Ergonomic design

Built in cleaning exhaust

=CompatibleFully compatible automatic and manual machine

Mold exchange to different systems

Compatible with AMS-W molds

Process parameter exchange

Universal parts

Machine Dimensions

WxDxH: 1210 x 1020 x 2012 mm

Weight: approx. 850 kg

Leadframe Size

Width: 65 - 102 mm

Length: 100 - 280 mm

Thickness: 0.1 - 1.5 mm

Max. height: 2 mm

Supply Requirements

Voltage: 208 - 480 VAC

Frequency: 50 / 60 Hz

Power rating: 7.5 kVA

Compressed air: 5 - 10 bar

Average air cons.: 1.5 m3 at 6 bar

Factory exhaust: 300m3 at 50 Hz

Press & Mold

Max. clamp force: 600 kN

Max. mold opening: 90 mm

Max. transfer pressure: 180 bar

Pellet diameter: 11, 14, 14.3 mm

Max. number of plungers: 10

Max. cavity temp. diff.: 2°C

Built in cleaning exhaust

Easy installation

www.besi.com - [email protected]