samsung ht-e5530k.pdf
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Blu-ray Home TheaterSystemModel Name HT-E5530K
Model Code HT-E5530K/RU
SERVICE MANUALBlu-ray Home Theater System
HT-E5530K
Contents
1. Precaution
2. Product Specification
3. Disassembly and Reassembly
4. Troubleshooting
5. PCB Diagram
6. Schematic Diagram
Refer to the service manual in the GSPN (see the rear cover) for more information.
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Contents
Contents
1. Precaution........................................................................................................................................ 1 1
1.1. Safety Precautions ................................................................................................................... 1 1
1.2. Servicing Precautions ............................................................................................................... 1 3
1.3. Precautions for Electrostatically Sensitive Devices (ESDs) .............................................................. 1 4
2. Product Specification ......................................................................................................................... 2 1
2.1. Product Feature ....................................................................................................................... 2 1
2.2. Specifications.......................................................................................................................... 2 2
2.2.1. HT-E5200 Specifications............................................................................................... 2 2
2.2.2. HT-E5xxx Specifications............................................................................................... 2 4
2.3. Specifications Analysis ............................................................................................................. 2 7
2.4. Disk and Format Compatibility................................................................................................... 2 8
2.4.1. Disc types and contents your product can play .................................................................. 2 8
2.4.2. Disc types your product cannot play................................................................................ 2 9
2.4.3. Region Code............................................................................................................... 2 10
2.5. Logos of Discs the product can play ............................................................................................ 2 11
2.5.1. Supported Formats....................................................................................................... 2 12
2.6. Accessories ............................................................................................................................ 2 14
2.6.1. Supplied Accessories ................................................................................................... 2 14
3. Disassembly and Reassembly .............................................................................................................. 3 1
3.1. Overall Disassembly and Reassembly .......................................................................................... 3 1
4. Troubleshooting ................................................................................................................................ 4 1
4.1. Checkpoints by Error Mode ....................................................................................................... 4 1
4.1.1. No Power................................................................................................................... 4 2
4.1.2. No Sound................................................................................................................... 4 7
4.1.3. Disc Loading Error ...................................................................................................... 4 8
4.1.4. Remote doesnt work ................................................................................................... 4 10
4.1.5. No Picture (HDMI)...................................................................................................... 4 12
4.1.6. No Logo (HDMI) ........................................................................................................ 4 16
4.1.7. No Logo (Composite)................................................................................................... 4 19
4.1.8. Disc skips or freezing ................................................................................................... 4 22
4.1.9. No Disc Reading Error ................................................................................................. 4 23
4.1.10. Network Error............................................................................................................. 4 24
4.2. Initialization & Upgrade Methods ............................................................................................... 4 25
4.2.1. How to check F/W version ............................................................................................ 4 25
4.2.2. How to update firmware................................................................................................ 4 26
4.2.3. Cold Start Method (Initialize Setup) ................................................................................ 4 29
4.3. Buyer-Region Code Setting Method ............................................................................................ 4 30
4.3.1. Inserting the Region Code after replacing the Main PCB..................................................... 4 30
i Copyright 1995-2012 SAMSUNG. All rights reserved.
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Contents
5. PCB Diagram ................................................................................................................................... 5 1
5.1. Wiring Diagram....................................................................................................................... 5 1
5.2. FRONT PCB Top .................................................................................................................... 5 2
5.2.1. Pin Connection ........................................................................................................... 5 3
5.2.2. Test Point Wave Form .................................................................................................. 5 4
5.3. FRONT PCB Bottom ............................................................................................................... 5 5
5.4. MAIN PCB Top ...................................................................................................................... 5 6
5.4.1. Pin Connection ........................................................................................................... 5 7
5.4.2. Test Point Wave Form .................................................................................................. 5 9
5.5. MAIN PCB Bottom.................................................................................................................. 5 10
5.6. SMPS PCB Top....................................................................................................................... 5 11
5.7. SMPS PCB Bottom.................................................................................................................. 5 12
6. Schematic Diagram ........................................................................................................................... 6 1
6.1. Overall Block Diagram ............................................................................................................. 6 1
6.2. FRONT ................................................................................................................................. 6 2
6.2.1. Test Point Wave Form .................................................................................................. 6 3
6.3. PWM_VARIABLE_FAN .......................................................................................................... 6 4
6.4. POWER_AMP........................................................................................................................ 6 5
6.5. DC-DC POWER...................................................................................................................... 6 6
6.6. AUDIO/VIDEO/IPOD OUT CEC............................................................................................... 6 7
6.6.1. Test Point Wave Form .................................................................................................. 6 8
6.7. USB/ETHERNET.................................................................................................................... 6 9
6.8. USB HUB_IPOD CERTI .......................................................................................................... 6 10
6.9. FRONT MICOM..................................................................................................................... 6 11
6.10. DIR/ADC/RX SWITCHING/D.IN.............................................................................................. 6 12
6.11. HDMI OUT_RX...................................................................................................................... 6 13
6.11.1. Test Point Wave Form .................................................................................................. 6 14
6.12. DDR3 INTERFACE................................................................................................................. 6 15
6.13. INTERFACE/SATA BLOCK ..................................................................................................... 6 16
6.14. FLASH MEMORY .................................................................................................................. 6 17
6.15. FIRENCE POWER JTAG DEBUG............................................................................................. 6 18
6.16. F_END_MORTOR DRIVER ..................................................................................................... 6 19
6.17. F_END_SC7300...................................................................................................................... 6 20
6.18. SMPS.................................................................................................................................... 6 21
Copyright 1995-2012 SAMSUNG. All rights reserved. ii
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1. Precaution
1. Precaution
Follow these safety instructions while servicing the ESD to prevent damage and to protect against potential hazardssuch as electrical shock and X-rays.
1.1. Safety Precautions
1) When reinstalling the chassis and its assemblies, be sure to restore all of the protective devices, including the controlknobs and the compartment covers.
2) Make sure that there are no cabinet openings through which people (particularly children) can make contact withdangerous internal components.
3) Design Alteration Warning:
Never alter or add to the mechanical or electrical design of the unit.
Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard.
Also, any design changes or additions will void the manufacturers warranty.
4) Leakage Current Hot Check Figure 1.1 AC Leakage Test:
WARNING
Do not use an isolation transformer during this test. Use a leakage-current tester or a metering system that complieswith American National Standards Institute (ANSI C101.1, Leakage Current for Appliances), and UnderwritersLaboratories (UL Publication UL1410, 59.7).
With the unit completely reassembled, plug the AC cord directly into a 120V AC outlet. With the units power switchedfrom the ON to the OFF position, measure the current between a known ground and all exposed metal parts.
Known Grounds - Earth
Known Metal parts - screwheads, metal cabinets, etc.
DEVICEUNDER
TEST
LEAKAGECURRENT TESTER
TEST ALL EXPO SED METAL
SURFACES
2-WIRE CORD
ALSO TEST WITH PLUG REVERSED
(USING AC ADAPTER PLUG AS R EQUIRED)
EARTH GROUND
(READINGSHOULD NOT BE ABOVE 0.5mA)
Figure 1.1 AC Leakage Test
1-1 Copyright 1995-2012 SAMSUNG. All rights reserved.
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1. Precaution
5) Insulation Resistance Cold Check:
(1) With the units AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs.(2) Set the power switch to ON. (3) Measure the resistance between the shorted AC plug and any exposed metallic parts.
Example: screwheads, metal cabinets, antenna port, etc. If any of the exposed metallic parts has a return path to thechassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the measuredresistance should be infinite. If the resistance is outside these limits, a shock hazard might exist. See Figure 1.2Insulation Resistance Test
AntennaTerm inal
ohm
Expo sedMeta l Part
Ohmmet er
Figure 1.2 Insulation Resistance Test
6) Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced withparts that meet the original specifications. Always determine the cause of damage or overheating, and correct anypotential hazards.
7) Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the ACand high voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring.
Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage.Make sure that no wires or components touch thermally hot parts.
8) Product Safety Notice:
Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visualinspection. These safety features and the protection they give might be lost if the replacement component differs fromthe originaleven if the replacement is rated for higher voltage, wattage, etc.
9) Components that are critical for safety are indicated in the circuit diagram by shading, or . Use replacementcomponents that have the same ratings, especially for flame resistance and dielectric strength specifications. Areplacement part that does not have the same safety characteristics as the original might create shock, fire or otherhazards.
Copyright 1995-2012 SAMSUNG. All rights reserved. 1-2
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1. Precaution
1.2. Servicing Precautions
1) Servicing precautions are printed on the cabinet. Follow them.
2) Always unplug the units AC power cord from the AC power source before attempting to: (a) Remove or reinstall anycomponent or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in parallel withan electrolytic capacitor.
3) Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used.The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elementsto their original position.
4) After servicing, always check that the screws, components and wiring have been correctly reinstalled.
Make sure that the portion around the serviced part has not been damaged.
5) Check the insulation between the blades of the AC plug and accessible conductive parts (examples: metal panels,input terminals and earphone jacks).
6) Insulation Checking Procedure: Disconnect the power cord from the AC source. Connect an insulation resistancemeter (500V) to the blades of the AC plug.
The insulation resistance between each blade of the AC plug and accessible conductive parts (see above) should begreater than 1 megohm.
7) Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless allsolid-state heat sinks are correctly installed.
8) Always connect a test instruments ground lead to the instrument chassis ground before connecting the positive lead;always remove the instruments ground lead last.
CAUTION
First read the Safety Precautions section of this manual. If some unforeseen circumstance creates a conflict between theservicing and safety precautions, always follow the safety precautions.
1-3 Copyright 1995-2012 SAMSUNG. All rights reserved.
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1. Precaution
1.3. Precautions for Electrostatically Sensitive Devices (ESDs)
Some semiconductor (solid state) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs).
Examples include integrated circuits and some field-effect transistors. The following techniques will reduce the occurrenceof component damage caused by static electricity:
1) Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from yourbody by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove itprior to applying powerthis is an electric shock precaution.)
2) After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to preventaccumulation of electrostatic charge.
3) Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.
4) Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.
5) Use only an anti-static solder removal device. Many solder removal devices are not rated as anti-static (these canaccumulate sufficient electrical charge to damage ESDs).
6) Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminumfoil or other conductive materials.
7) Immediately before removing the protective material from the leads of a replacement ESD, touch the protective materialto the chassis or circuit assembly into which the device will be installed.
8) Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, orlifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.
Copyright 1995-2012 SAMSUNG. All rights reserved. 1-4
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2. Product Specification
2. Product Specification
2.1. Product Feature
Features for 2012 model BD HTS
BD-LIVE from the beginning of the Mass Production
DTS-HD Master Audio decoding from the beginning of the Mass Production
MP3, MKV, MP4, WMA, WMV, Divx-HD (exclude ZA, ZC buyers)
Block-Buster, Netflix, Pandora, Youtube, Widget, VUDU
1 USB port (Front USB / iPod / iPhone)
Supporting iPod / iPhone
Wireless Ready / Included
Various Video Setups- Progressive Mode- Still Mode- BD Wise- Picture Control
3D Sound
HDMI 1.4 with ARC (support HDMI 2 In )
2 HDMI In
DLNA
Smart Hub
Allshare
Disc to Digital
2-1 Copyright 1995-2012 SAMSUNG. All rights reserved.
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2. Product Specification
2.2. Specifications
2.2.1. HT-E5200 Specifications
Basic Specification
Weight2.54 kg
7.7 Ibs
Dimensions430 (W) x 55 (H) x 255.8 (D) mm
16.9 (W) x 2.3 (H) x 10.1 (D) inches
Operating Temperature Range+5 C to +35 C
+41 F to +95 F
General
Operating Humidity Range 10 % to 75 %
Signal/noise ratio 55 dB
Usable sensitivity 12 dBFM Tuner
Total harmonic distortion 0.5 %
BD
(Blu-ray Disc)Reading Speed : 9.834 m/sec
Reading Speed : 6.98 ~ 7.68 m/sec.DVD
(Digital Versatile Disc) Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.
Reading Speed : 4.8 ~ 5.6 m/sec.CD : 12 cm / 5 inches
(COMPACT DISC) Maximum Play Time : 74 min.
Reading Speed : 4.8 ~ 5.6 m/sec.
Disc
CD : 8 cm / 3 1/2 inches
(COMPACT DISC) Maximum Play Time : 20 min.
1 channel : 1.0 Vp-p (75 load)
VideoOutput
Composite Video Blu-ray Disc : 576i/480i (America : 480i)
DVD : 576i/480i (America : 480i)
1080p, 1080i, 720p, 576p/480p (America : 480i)Video/Audio HDMI
PCM multichannel audio, Bitstream audio, PCM audio
Front speaker output 165 W x 2 (3 )
Subwoofer speaker output 170 W (3 )
Analog input 20 Hz ~ 20 kHz ( 3 dB)Frequency response
Digital input 20 Hz ~ 40 kHz ( 4 dB)
S/N Ratio 70 dB
Channel separation 60 dB
Amplifier
Input sensitivity (AUX) 500 mV
Copyright 1995-2012 SAMSUNG. All rights reserved. 2-2
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2. Product Specification
HT-E5200 Speaker Specification
2.1ch speaker systemSpeaker system
Front Subwoofer
Impedance 3 3
Frequency range 140 Hz ~ 20 kHz 40 Hz ~ 160 Hz
Output sound pressure level 87 dB/W/M 88 dB/W/M
Rated input 165 W 170 W
Maximum input 330 W 340 W
Dimensions
(W x H x D)
Front : 90 x 207.5 x 68.5 mm
Subwoofer : 168 x 350 x 285 mm
Speaker
WeightsFront : 0.71 kg
Subwoofer : 2.6 kg
NOTE
Network speeds equal to or below 10 Mbps are not supported.
Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.
Weight and dimensions are approximate.
Design and specifications are subject to change without prior notice.
For the power supply and Power Consumption, refer to the label attached to the product.
2-3 Copyright 1995-2012 SAMSUNG. All rights reserved.
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2. Product Specification
2.2.2. HT-E5xxx Specifications
Basic Specification
Weight2.54 kg
7.7 Ibs
Dimensions430 (W) x 55 (H) x 255.8 (D) mm
16.9 (W) x 2.3 (H) x 10.1 (D) inches
Operating Temperature Range+5 C to +35 C
+41 F to +95 F
General
Operating Humidity Range 10 % to 75 %
Signal/noise ratio 55 dB
Usable sensitivity 12 dBFM Tuner
Total harmonic distortion 0.5 %
BD
(Blu-ray Disc)Reading Speed : 9.834 m/sec
Reading Speed : 6.98 ~ 7.68 m/sec.DVD
(Digital Versatile Disc) Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.
Reading Speed : 4.8 ~ 5.6 m/sec.CD : 12 cm / 5 inches
(COMPACT DISC) Maximum Play Time : 74 min.
Reading Speed : 4.8 ~ 5.6 m/sec.
Disc
CD : 8 cm / 3 1/2 inches
(COMPACT DISC) Maximum Play Time : 20 min.
1 channel : 1.0 Vp-p (75 load)
VideoOutput
Composite Video Blu-ray Disc : 576i/480i (America : 480i)
DVD : 576i/480i (America : 480i)
1080p, 1080i, 720p, 576p/480p (America : 480i)Video/Audio HDMI
PCM multichannel audio, Bitstream audio, PCM audio
Front speaker output 165 W x 2 (3 )
Center speaker output 170 W (3 )
Surround speaker output 165 W x 2 (3 )
Subwoofer speaker output 170 W (3 )
Analog input 20 Hz ~ 20 kHz ( 3 dB)Frequency response
Digital input 20 Hz ~ 40 kHz ( 4 dB)
S/N Ratio 70 dB
Channel separation 60 dB
Amplifier
Input sensitivity (AUX) 500 mV
Copyright 1995-2012 SAMSUNG. All rights reserved. 2-4
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2. Product Specification
HT-E5300 / HT-E5400 / HT-E5500 Speaker Specification
5.1ch speaker systemSpeaker system
Front Surround Center Subwoofer
Impedance 3 3 3 3
Frequency range 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 40 Hz ~ 160 Hz
Output sound pressurelevel
87 dB/W/M 87 dB/W/M 87 dB/W/M 88 dB/W/M
Rated input 165 W 165 W 170 W 170 W
Maximum input 330 W 330 W 340 W 340 W
Dimensions
(W x H x D)
Front : 90 x 141.5 x 68.5 mm / 3.54 x 5.57 x 2.69 inches
Surround : 90 x 141.5 x 68.5 mm / 3.54 x 5.57 x 2.69 inches
Center : 360 x 74.5 x 68.5 mm / 14.17 x 2.93 x 2.69 inches
Subwoofer : 200 x 390 x 350 mm / 6.61 x 13.78 x 11.22 inches
Speaker
Weights
Front : 6.1 kg / 1.37 Ibs
Surround : 6.1 kg / 1.37 Ibs
Center : 8.8 kg / 1.98 Ibs
Subwoofer : 5.5 kg / 8.06 Ibs
HT-E5330 / HT-E5530 Speaker Specification
5.1ch speaker systemSpeaker system
Front Surround Center Subwoofer
Impedance 3 3 3 3
Frequency range 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 40 Hz ~ 160 Hz
Output sound pressurelevel
87 dB/W/M 87 dB/W/M 87 dB/W/M 88 dB/W/M
Rated input 165 W 165 W 170 W 170 W
Maximum input 330 W 330 W 340 W 340 W
Dimensions
(W x H x D)
Front : 90 x 1200 x 70 (Stand base: 240 x 240) mm / 3.54 x 47.24 x 2.75(Stand base : 9.44 x 9.44) inches
Surround : 90 x 141.5 x 68.5 mm / 3.54 x 5.57 x 2.69 inches
Center : 360 x 74.5 x 68.5 mm / 14.17 x 2.93 x 2.69 inches
Subwoofer : 200 x 390 x 350 mm / 6.61 x 13.78 x 11.22 inches
Speaker
Weights
Front : 10.4 kg/ 8.59 Ibs
Surround : 6.1 kg / 1.37 Ibs
Center : 8.8 kg / 1.98 Ibs
Subwoofer : 5.5 kg / 8.06 Ibs
2-5 Copyright 1995-2012 SAMSUNG. All rights reserved.
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2. Product Specification
HT-E5350 / HT-E5550 Speaker Specification
5.1ch speaker systemSpeaker system
Front Surround Center Subwoofer
Impedance 3 3 3 3
Frequency range 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 140 Hz ~ 20 kHz 40 Hz ~ 160 Hz
Output sound pressurelevel
87 dB/W/M 87 dB/W/M 87 dB/W/M 88 dB/W/M
Rated input 165 W 165 W 170 W 170 W
Maximum input 330 W 330 W 340 W 340 W
Dimensions
(W x H x D)
Front : 90 x 1200 x 70 (Stand base: 240 x 240) mm / 3.54 x 47.24 x 2.75(Stand base : 9.44 x 9.44) inches
Surround : 90 x 1200 x 70 (Stand base: 240 x 240) mm / 3.54 x 47.24 x 2.75(Stand base : 9.44 x 9.44) inches
Center : 360 x 74.5 x 68.5 mm / 14.17 x 2.93 x 2.69 inches
Subwoofer : 200 x 390 x 350 mm / 6.61 x 13.78 x 11.22 inches
Speaker
Weights
Front : 10.4 kg/ 8.59 Ibs
Surround : 10.4 kg /8.59 Ibs
Center : 8.8 kg / 1.98 Ibs
Subwoofer : 5.5 kg / 8.06 Ibs
SWA-5000 Specification
Weight1.1 kg
2.52 lbs
Dimensions (W x H x D)76.2 x 228.6 x 152.4 mm
3 x 9 x 6 inches
Operating Temperature Range+5 C to +35 C
+41 F to +95 F
Operating Humidity Range 10 % to 75 %
Output 165 W x 2 CH
Frequency range 20 Hz ~ 20 KHz
S/N Ratio 65 dB
NOTE
Network speeds equal to or below 10 Mbps are not supported.
Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.
Weight and dimensions are approximate.
Design and specifications are subject to change without prior notice.
For the power supply and Power Consumption, refer to the label attached to the product.
Copyright 1995-2012 SAMSUNG. All rights reserved. 2-6
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2. Product Specification
2.3. Specifications Analysis
Model Name HT-E5xxx HT-D5500
Photo
Profile Blu-ray 5 from the beginning. Blu-ray 5 from the beginning.
DVD, CD O O
MP3, JPGO
(MP4, MKV, WMA, WMV)
O
(MP4, MKV, WMA, WMV)
USB HOST O O
iPod / iPhone
O
(Digital USB AUDIO, Composite VideoWith New Cradle)
O
(Digital USB AUDIO, Composite VideoWith New Cradle)
DivX
O
(DivX-HD support)
(not supported for U.S, Canada)
O
(DivX-HD support)
Memory Slot Internal Storage Support Internal Storage Support
DLNA, WidgetO
(Smart Hub)
O
(Smart Hub)
Energy-Star 0.5 W 0.65 W
2D / 3D3D
(2D 3D Convergence)
3D
(2D 3D Convergence)
SMPS1 trans
Stand-By Power Consumption 0.6 W
2 trans
Stand-By Power Consumption 0.6 W
Dual Free Voltage
DECK Tray Type Slot-In type
Pick Up 7G Pickup 6G VE Pickup
Front Micom SANYO SANYO
MAIN CHIP SAMSUNG SOC SAMSUNG SOC
Wireless Rear SpeakerIncluded
(SWA-5000)
Included
(SWA-5000)
Wi-Fi LAN Dongle Built-in Ready (EU) / Built-In (Others)
HDMI IN 2 Inputs 2 Inputs (Exclude U.S., Canada)
Main LoaderBACKEND Firenze
+ Frontend Sunext
BACKEND Firenche
+ Frontend Raptor
TIP
O : Feature Included
X : Not Included
2-7 Copyright 1995-2012 SAMSUNG. All rights reserved.
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2. Product Specification
2.4. Disk and Format Compatibility
2.4.1. Disc types and contents your product can play
Media Disc Type Details
Blu-ray Disc,3D Blu-ray Disc
BD-ROM or BD-RE/-R disc recorded in the BD-RE format.
VIDEO DVD-VIDEO, DVD-RW,DVD-R, DVD+RW,
DVD+R
DVD-VIDEO, recorded DVD+RW/DVD-RW(V)/DVDR/+R discs that havebeen recorded and finalized, or a USB storage media containing DivX, MKV,MP4 contents.
MUSICCD-RW/-R, DVD-RW/-R,
BD-RE/-RMusic recorded on CD-RW/-R, DVD-RW/-R, BD-RE/-R discs or a USBstorage media containing MP3 or WMA contents.
PHOTOCD-RW/-R, DVD-RW/-R,
BD-RE/-RPhotos recorded on CD-RW/-R, DVD-RW/-R, BD-RE/-R discs or a USBstorage media containing JPEG contents.
NOTE
The product may not play certain CD-RW/-R and DVD-R because of the disc type or recording conditions.
If a DVD-RW/-R disc has not been recorded properly in DVD video format, it will not be playable.
Your product will not play content that has been recorded on a DVD-R at a bit rate that exceeds 10 Mbps.
Your product will not play content that has been recorded on a BD-R or USB device at a bit rate that exceeds 30 Mbps.
Playback may not work for some types of discs, or when you use specific operations, such as angle change and aspect ratioadjustment. Information about the discs is written in detail on the disc box. Please refer to this if necessary.
When you play a BD-J title, loading may take longer than a normal title or some functions may perform slowly.
Copyright 1995-2012 SAMSUNG. All rights reserved. 2-8
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2. Product Specification
2.4.2. Disc types your product cannot play
HD DVD
DVD-ROM/PD/MV-Disc,etc
DVD-RAM
Super Audio CD(except CD layer)
DVD-RW (VR mode)
CVD/CD-ROM/CDV/CD-G/CD-I/LD(CD-Gs play audio only,not graphics.)
3.9 GB DVD-R Disc forAuthoring.
NOTE
This product may not respond to all operating commands because some Blu-ray Disc, DVD, and CD discs allow specific orlimited operation and provide only certain features during playback. Please note that this is not a defect in the product.
Samsung cannot guarantee that this product will play every disc bearing the Blu-ray Disc, DVD or CD logo because discformats evolve, and problems and errors may occur during the creation of Blu-ray Disc, DVD, and CD software and/orthe manufacture of discs.
Please contact the SAMSUNG Customer Care Centre, if you have questions or encounter difficulty when playing Blu-rayDisc, DVD, or CD discs in this product. Also, refer to rest of this user manual for additional information on playbackrestrictions.
Some commercial discs and DVD discs purchased outside your region may not play on this product.
2-9 Copyright 1995-2012 SAMSUNG. All rights reserved.
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2. Product Specification
2.4.3. Region Code
Both products and discs are coded by region.These regional codes must match for a disc to play. If the codes do not match, the disc will not play.The Region Number for this product is displayed on the rear panel of the product.
Disc Type Region Code Area
North America, Central America, South America, Korea, Japan, Taiwan, Hong Kongand South East Asia
Europe, Greenland, French territories, Middle East, Africa, Australia and NewZealand
Blu-ray Disc
India, China, Russia, Central and South Asia
The U.S., U.S. territories and Canada
Europe, Japan, the Middle East, Egypt, South Africa, Greenland
Taiwan, Korea, the Philippines, Indonesia, Hong Kong
Mexico, South America, Central America, Australia, New Zealand, Pacific Islands,Caribbean
Russia, Eastern Europe, India, most of Africa, North Korea, Mongolia
DVD-VIDEO
China
NOTE
If the Region number of a Blu-ray Disc/DVDs does not correspond to the Region number of this product, the productcannot play the disc.
Copyright 1995-2012 SAMSUNG. All rights reserved. 2-10
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2. Product Specification
2.5. Logos of Discs the product can play
Blu-ray Disc 3D Blu-ray Disc
BD-LIVE Dolby
DTS DivX
NTSC broadcast system inU.S.A, Canada, Korea, Japan
PAL broadcast system inU.K, France, Germany, etc.
Java
2-11 Copyright 1995-2012 SAMSUNG. All rights reserved.
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2. Product Specification
2.5.1. Supported Formats
Music File Support
File Extension Container Audio Codec Support Range
*.mp3 MP3 MP3 -
*.wma WMA WMA
Compliant with WMA version 10
* Sampling rates (in kHz) - 8, 11, 16, 22, 32, 44.1, 48
* Bitrates - All bitrates in the range 5 kbps to 384 kbps
Video File Support
File Extension Container Video Codec ResolutionFrame rate
(fps)Bitrate(Mbps)
Audio Codec
DivX 3.11/4.x/5.1/6.0
1920 x 1080 6 ~ 30 8
H.264BP/MP/HP
1920 x 1080 6 ~ 30 25*.avi AVI
MPEG4SP/ASP
1920 x 1080 6 ~ 30 8
MP3
AC3
LPCM
DTS Core
DivX 3.11/4.x/5.1/6.0
1920 x 1080 6 ~ 30 8
H.264BP/MP/HP
1920 x 1080 6 ~ 30 25*.mkv MKV
MPEG4SP/ASP
1920 x 1080 6 ~ 30 8
MP3
AC3
LPCM
DTS Core
DivX 3.11/4.x/5.1/6.0
1920 x 1080 6 ~ 30 8
H.264BP/MP/HP
1920 x 1080 6 ~ 30 25*.asf ASF
MPEG4SP/ASP
1920 x 1080 6 ~ 30 8
MP3
AC3
LPCM
WMA
*.wmv ASFWindow Media
Video v91920 x 1080 6 ~ 30 25 WMA
H.264BP/MP/HP
1920 x 1080 6 ~ 30 25
*.mp4 MP4MPEG4SP/ASP
1920 x 1080 6 ~ 30 8
MP3
AAC
H.264BP/MP/HP
1920 x 1080 6 ~ 30 25
*.3gp 3GPPMPEG4SP/ASP
1920 x 1080 6 ~ 30 8
AAC
MPEG2 1920 x 1080 24/25/30 25
*.vroVRO
VOB MPEG1 1920 x 1080 24/25/30 25
AC3
MPEG
LPCM
Copyright 1995-2012 SAMSUNG. All rights reserved. 2-12
-
2. Product Specification
File Extension Container Video Codec ResolutionFrame rate
(fps)Bitrate(Mbps)
Audio Codec
MPEG1 1920 x 1080 24/25/30 25
MPEG2 1920 x 1080 24/25/30 25*.mpg
*.mpegPS
H.264 1920 x 1080 6 ~ 30 25
AC3
MPEG
LPCM
AAC
MPEG2 1920 x 1080 24/25/30 25
H.264 1920 x 1080 6 ~ 30 25*.ts
*.tp
*.trp
TS
VC1 1920 x 1080 6 ~ 30 25
AC3
AAC
MP3
DD+
Limitations
Even when a file is encoded by a supported codes listed above, the file might not be played if its content has a problem.
Normal playback is not guaranteed if the files container information is wrong or the file itself is corrupted.
Files having higher bit or frame rates than standard may stutter when played back.
2-13 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
2. Product Specification
2.6. Accessories
2.6.1. Supplied Accessories
Accessories Item Item code Remark
Remote Control AH59-02407A
Ferrite Core 3301-000144
Batteries (AAA size) 4301-000116
Video Cable AH39-40001V
FM Antenna AH42-00021A
User Manual AH68-02438H
Local Samsung Dealer
Copyright 1995-2012 SAMSUNG. All rights reserved. 2-14
-
3. Disassembly and Reassembly
3. Disassembly and Reassembly
3.1. Overall Disassembly and Reassembly
CAUTION
Be careful to follow the disassembly sequence described in the manual. Otherwise, the product may be damaged.
Be sure to carefully read and understand the safety instructions before performing any work as the IC chips onthe PCB are vulnerable to static electricity.
In order to assemble reverse the order of disassembly.
Description Description Photo
1. Unfasten 4 screws on the rear side.: BH,+,B,M3,L10,ZPC(BLK),SWRCH18A
2. Slide the COVER-TOP back to remove.Pull and lift up COVER-TOP rear side.
CAUTION
Be careful not to make any scratches as you remove them.
3. Disconnect the FPC cable between the COVER-FRONT ASSYand the MAIN PCB.
3-1 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
3. Disassembly and Reassembly
Description Description Photo
1) Loosen the bottom and side clips and tilt up.
2) Lift the COVER-FRONT at a 45 degree angle upward. then thehooks on the top side can be automatically removed.
(1) (1) (1)
(1)
(2)
(2) (2) (2)
Copyright 1995-2012 SAMSUNG. All rights reserved. 3-2
-
3. Disassembly and Reassembly
Description Description Photo
4. Disconnect the DECK cable from the MAIN-PCB.
Unfasten the screws of 4 points around the.: BH,+,-,B,M3,L6,ZPC(WHT),SWRCH18A,RF
Remove the DECK from the COVER-BOTTOM.
5. For WiI-Fi, unfasten 1 connector to MAIN ASSY and 1 screw.: BH,+,-,B,M3,L6,ZPC(WHT),SWRCH18A,RF
3-3 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
3. Disassembly and Reassembly
Description Description Photo
6. To remove the MAIN+AMP ASSY, PCB unfasten 5 screws on theboard and 2 on the rear.: BH,+,-,B,M3,L6,ZPC(WHT),SWRCH18A,RF
Remove the bridge connection between the main and power,remove the fan cable connection and remove the metal supportpost in the center.
Remove the MAIN from the case.
7. Unplug the FAN cable connected to the main board and thenremove the main board from the case.
8. Before pull out the SMPS PCB, Unplug the connector.
9. For SMPS, PCB unfasten 4 screws on bottom-side.: BH,+,-,B,M3,L6,ZPC(WHT),SWRCH18A,RF
Copyright 1995-2012 SAMSUNG. All rights reserved. 3-4
-
4. Troubleshooting
4. Troubleshooting
4.1. Checkpoints by Error Mode
Oscilloscope Setting Values Normal Voltage 24 MHz 32.768 KHz
Voltage/DIV 1 V/div 200 mV/div 500 mV/div
TIME/DIV 100 ms/div 100 ns/div 100 us/div
4-1 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
4. Troubleshooting
4.1.1. No Power
Yes
Yes
Replace Fuse (FP801S)or SMPS PCB.
Check MAIN ASS'Y- Specia lly check a round
MICOM IC. (Vcc)Check primary side .
Fuse (FP8 01S) OK?
Check D-DC IC(ICM823) sh ort tes t pin 7
to p in 1, 2 , 3, 4 , 5, 6 , 8 OK(me ans not sh ort)?
(1)3.4 V Output Check
(CNA821, P in 10, 11) 3.4 V ~ 3 .6 V
(3)Replace IC (ICA801)
or SMPS PCB.
(4)Replace FET (MA801)
or SMPS PCB.
Check Check FET(MA801) a ll pins a re not shorte d to
each other.
Check Sw itch ing IC (ICA801) short te st p in 8 to
pin 1, 2, 3, 4, 5, 6, 7 OK(means not sh ort)?
YesNo
No
No
No
No
(5)Replace DIODE (DRA821,
DM824) or SMPS PCB.
(2)Replace DC-DC IC (ICM823)
or SMPS PCB.
(6)Replace DC-DC IC (ICM822)
or SMPS PCB.
Replace SMPS PCB.
No
No
Yes
Yes
Yes
Yes
Check D-DC IC (ICM822) short tes t pin 3 to
pin 1, 2, 4, 5 OK(means not sh ort)?
Check DRA821, DM824short test Anode to ca thode .
No Power De tecte d(Stand by LED OFF)
* Refer to wave pa ttern image of Fig. 4-1 . * Refer to wave pa ttern image of Fig. 4-2.
* Refer to wave pa ttern image of Fig. 4-3.
* Refer to wave pa ttern image of Fig. 4-3.
* Refer to wave pa ttern image of Fig. 4-4.
* Refer to wave pa ttern image of Fig. 4-4.
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-2
-
4. Troubleshooting
N11VN11VN11V
3.4V3.4V
R12V
28V_34V
28V_34V28V_34V
28V_34V28V_34V
AH62-30 122AHEATSINK
SS
EN
VIN
BT PH
VSNS
COMP
GND
GND
GND
GNDGND
VPS
GNDGND
GNDGNDGND
R12VP-ON
3.4V_S
TP7
TP8
R12 V_STP5
TP1TP2
20
1817161514
VPS
GND_01_S
1N5819 40VDM830
25V470U FCM836
1N5819 40VDM829
1MF25V
CM828
330KOHM 1/10WRM839
CM827
60V
SB36 0DM821
50VCM825
LM8241/10W18KOHM
RM837
LM822
GND_01_S
1/10W2.1KOH M
RM829
AP1501-T5 RICM822
1
2
3
4
5
1/4W10KOHMRM828
GND_01_S
EY826
EY828
SRC1203STRM821
22NF50V
CM829
RM833
TPS 54331DICM823
1234
5678
100N F50V
CM846
DM831
GND_01_S
10UHLM823
GND_01_ S
10UF10V
CM833
1MF10V
CM834
GND_01_S
16V1UF
CM845
3857S TFBM821
470UF10V
CM835
GDZJ4.3BZDM822
KLG123E
LED851
1.8KOHM1/10W
RM841
TP13
TP14
GND_01_S
TP11 TP1 2
TP6
TP10
TP9
TWG-P23P-A1CNA821
123456789
10111213
19
212223
TP3 TP4
FBGND
OUT
SDVIN
E
BC
VSENSESS
GND
PH
COMPEN
VIN
BOOT
AH62-30 122AHEATSINK
SS
EN
VIN
BT PH
VSNS
COMP
GND
GND
GND
GNDGND
VPS
GNDGND
GNDGNDGND
R12VP-ON
GND_01_S
1N5819 40V
25V470U F
1N5819 40V
1MF25V
330KOHM 1/10W
25V
60V
SB36 0
50V
1/10W18KOHM
GND_01_S
1/10W2.1KOH M
AP1501-T5 R 1/4W10KOHM
GND_01_S
SRC1203S
22NF50V
TPS 54331D
100N F50V
GND_01_S
10UH
GND_01_S
10UF10V
1MF10V
GND_01_S
16V1UF
3857S T
470UF10V
GDZJ4.3B
KLG123E
1.8KOHM1/10W
GND_01_S
TWG-P23P-A1
DM830
CM836
DM829
CM828
RM839
CM827
DM821
CM825
LM824
RM837
LM822
RM829
ICM822RM828
EY826
EY828
TRM821
CM829
RM833
ICM823
CM846
DM831
LM823 CM833
CM834
CM845
FBM821
CM835
ZDM822
LED851
RM841
TP13
TP14
TP11 TP1 2
TP6
TP10
TP9
CNA821
TP3 TP4
VPS
20
1817161514
1
2
3
4
5
1234
5678
123456789
10111213
19
212223
FBGND
OUT
SDVIN
E
BC
VSENSESS
GND
PH
COMPEN
VIN
BOOT
* 6.18. SMPS
* 5.6. SMPS PCB Top
(1)
(1)
4-3 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
4. Troubleshooting
SS
EN
VIN
BT PH
VSNS
COMP
GND
40VDM830
40V
1MF25V
CM828
1UF25V
CM8301/10W62KOHM
RM840
330KOHM 1/10WRM839
GND_0 1_S
22NF50V
CM829
30KOHM1/10W
RM833
TPS54 331DICM823
1234
5678
100NF50V
CM846
50V1NF
CM831
DM831
GND_0 1_S
10UHLM823
GND_0 1_S
10UF10V
CM833
1MF10V
CM834
GND_0 1_S
16V1UF
CM845
3857STFBM821
470UF10V
CM83
GND_0 1_S
VSENSESS
GND
PH
COMPEN
VIN
BOOT
SS
EN
VIN
BT PH
VSNS
COMP
GND
40V
40V
1MF25V
1UF25V
1/10W62KOHM
330KOHM 1/10W
GND_0 1_S
22NF50V
30KOHM1/10W
TPS54 331D
100NF50V
50V1NF
GND_0 1_S
10UH
GND_0 1_S
10UF10V
1MF10V
GND_0 1_S
16V1UF
3857ST
470UF10V
GND_0 1_S
DM830
CM828
CM830RM840
RM839
CM829
RM833
ICM823
CM846
CM831
DM831
LM823 CM833
CM834
CM845
FBM821
CM83
1234
5678
VSENSESS
GND
PH
COMPEN
VIN
BOOT
* 6.18. SMPS
* 5.7. SMPS PCB Bottom
(2)
(2)
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-4
-
4. Troubleshooting
HEAT
SINK
AH62
-00
201H
OPTION
ZC_02_P
CS_04_ P
18V_VCC_03_P
HV_P
GA_03_ P
ZC_01_P
18V_VCC_ 05_P
GA_02_ P
GA_01_P
CS_01_P
18V_VCC_02_
SN_A_01_P
450V_A_02_P
18V_VCC_01_P
450V_A_01_P
UDZSNPTE-17 9.1B
22UFCA806
KTC3875S S-BLTRA801
50V220P FCA813
GND_P
1/10W3.3KOHM
RA810
ICE2QS03ICA801
1234 5
678
1/10W33KOHM
RA813
GDZJ 24BZDM823
50V1NFCA807
1/10W15KOHM
RA808
1KOHM 1/4WRA805
SS1 4DA805
10NF 630VCA811
1N4148WS
33KOHM 2W
SN_A_02_P
RA804
1N4148WS
33KOHM 2WRA803
1N4148WSDA807
220OHM 1/10WRA809
1SR154-400TE25DA806
220OHM1/4W
RA807
4.7OH M 1/4WRA806
5W0.1OHM
RA811
EY825SPA11N80C3
MA801
EY8241000VDA804
1000VDA803
68PF 1KV
1KV560PF
CA810
EY82
3857STFBA801
E
BC
HVHV
VCC
GND
GATECS
FB
ZCS
D
G
HEAT
SINK
AH62
-00
201H
OPTION
UDZSNPTE-17 9.1B
22UF
KTC3875S S-BL
50V220P FGND_P
1/10W3.3KOHM
ICE2QS03
1/10W33KOHM
GDZJ 24B
FN1 V05
1/10W15KOHM
1KOHM 1/4WSS1 4
10NF 630V
1N4148WS
33KOHM 2W
1N4148WS
33KOHM 2W
1N4148WS
220OHM 1/10W
1SR154-400TE25
220OHM1/4W
4.7OH M 1/4W
5W0.1OHM
SPA11N80C3
1000V
1000V
68PF 1KV
1KV560PF
3857ST
CA806
TRA801
CA813
RA810
ICA801
RA813
ZDM823
CA807
RA808
RA805 DA805
CA811
RA804 RA803
DA807
RA809
DA806
RA807
RA806
RA811
EY825
MA801
EY824
DA804
DA803
CA810
EY82
FBA801
ZC_02_P
CS_04_ P
18V_VCC_03_P
HV_P
GA_03_ P
ZC_01_P
18V_VCC_ 05_P
GA_02_ P
GA_01_P
CS_01_P
18V_VCC_02_
SN_A_01_P
450V_A_02_P
18V_VCC_01_P
450V_A_01_PSN_A_02_P
1234 5
678
E
BC
HVHV
VCC
GND
GATECS
FB
ZCS
D
G
* 6.18. SMPS
* 5.6. SMPS PCB Top
(3)
(3)
(4)
(4)
4-5 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
4. Troubleshooting
AH62-30122AHEATSINK
HEAT
SINK
AH62
-00
201H
OP TION
AH62-00201HHEATSINK
11V_S
TP7
TP8
28V_34V_S
R12V_STP5
TP2
VPS
IC_1
18V_VCC_03_ P
GA_02_P
GA_01_P
CS_01_ P
18V_VCC_02_ P
450 V_A_02_ P
18V_VCC_01_ P
450 V_A_01_ P
IC_1
VPS
IC_1 FB_2
3.3 KOHM1/10W
RM823
50V100N F
CM822
GND_P
CA8081SR 154- 400TE2 5DA808
GND_P
3857STLM821
AP1501 -T5RICM822
1
2
3
4
5
1/4W10KOHMRM828
EY826
EY828
SDA807
220OH M 1/10WRA809
1SR 154- 400TE2 5DA806
220OH M1/4W
RA807
4.7OHM 1/4WRA806
5W0.1OHM
RA811
EY825SPA11N 80C 3
MA801
EY8241000VDA804
1000VDA803
68PF 1KVCA812
1/4W2.2OHM
RA812
GND_P
1KV560PF
CA810GND_P
470PF400V
CY805S12
400V 1NFCY803S
EY821
EY827
3857STFBA801
EY818 ER4 220TA801S
1234
56 7
89
101112
EY820
EY822
SF3004 PT 200VDRA821
EY823
50V1MF
CA821
GND_01_S
SHK75-11 100VDM824A
100VSHK75-11
DM824
TP6
TP3 TP4
1MF50V
CA8221MF50V
CA823
50V1MFCA824
GND_01_S
1/4W1OHM
RA822
2.9UHLA821
1/10W33KOHM
RA821
FBGND
OUT
SDVIN
S
D
G
AH62-30122AHEATSINK
HEAT
SINK
AH62
-00
201H
OP TION
AH62-00201HHEATSINK
3.3 KOHM1/10W
50V100N F
GND_P
1SR 154- 400TE2 5
GND_P
3857ST
AP1501 -T5R 1/4W10KOHM
S
220OH M 1/10W
1SR 154- 400TE2 5
220OH M1/4W
4.7OH M 1/4W
5W0.1OHM
SPA11N 80C 3
1000V
1000V
68PF 1KV
1/4W2.2OHM
GND_P
1KV560PF
GND_P
470PF400V
400 V 1NF
3857ST
ER4 220
SF3004 PT 200V
50V1MF
GND_01_S
SHK75-11 100V
100VSHK75-11
1MF50V
1MF50V
50V1MF
GND_01_S
1/4W1OHM
2.9UH
1/10W33KOHM
RM823
CM822
8 DA808
LM821
ICM822RM828
EY826
EY828
DA807
RA809
DA806
RA807
RA806
RA811
EY825
MA801
EY824
DA804
DA803
CA812
RA812
CA810
CY805S
CY803S
EY821
EY827
FBA801
EY818TA801S EY820
EY822
DRA821
EY823
CA821
DM824A
DM824
TP6
TP3 TP4
CA822 CA823CA824
RA822
LA821
RA821
VPS
IC_1
18V_VCC_03_ P
GA_02_P
GA_01_P
CS_01_ P
18V_VCC_02_ P
450 V_A_02_ P
18V_VCC_01_ P
450 V_A_01_ P
IC_1
VPS
IC_1 FB_2
1
2
3
4
5
12
1234
56 7
89
101112
FBGND
OUT
SDVIN
S
D
G
* 6.18. SMPS
* 5.6. SMPS PCB Top
(5)
(5)
(6)
(5)
(5)
(6)
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-6
-
4. Troubleshooting
4.1.2. No Sound
Change speaker cable .No
Yes
Yes
Speaker j ack(including pins) OK?
Speaker c able ok?
Check wire less co nnection o rmicom option.
Yes
No so und in a ll ch anne ls?
Change speaker jack.No
Change MAIN PCB.No
There is n o au dio soun d from speaker.
4-7 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
4. Troubleshooting
4.1.3. Disc Loading Error
Change SMPS.
No
No
Reinsert DECK cable correctly.
Yes
Is th e Deck cabl e (be tween MAIN & DECK)
inserted correct ly?
(1)Check Po wer
R12V of MAIN PCB.
Disc Loading Error
Yes
Change the DECK.
* Refer to wave pa ttern image of Fig. 4-5 .
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-8
-
4. Troubleshooting
PVDD (+28V ~ 34V)
D12V
_3D1
2V_2
D12V
_1
- - -
BD1 0.01OHM5000MABD13 0.01OHM5000MABD14 0.01OHM5000MA
D12V_PW
ST3.
4VST
3.4V
_10
--
BD92 5000MA
0.01OHM
BD930.01OHM
5000MA
+35V
P_O N
VARI_SMPS
127301123K2CN2001
1234567891011121314151617181920212223
-
R12V_ 2
-
DGND
_12
-
DGND
_11
-
DGND
_10
-
DGND
_9
-
P_O N
-
PGND
6
-
PGND
8
-
PGND
7
-
PGND
10
- PGND
9-
R12V_ 1
R12V
47K
OHM
R204
5
-PVDD
1
-PVDD
2
-PVDD
3
-PVDD
4
- PVDD
5
8E8>
10UF
10V
C833
10UF
10V
C904
1.5OH
M
R205
5
100N
F
C208
8
- VARI
_SM
PS
2E3>PGND
6.3VC9
05
PVDD (+28V ~ 34V)
- - -
0.01OHM5000MA0.01OHM5000MA0.01OHM5000MA
D12V_PW
--
5000MA
0.01OHM0.01OHM
5000MA
+35V
127301123K2
-
- - --
-
- -
-
-
-
-
R12V
47K
OHM
-
-
- - -
10UF
10V
10UF
10V
-
PGND
6.3V
D12V
_3D1
2V_2
D12V
_1
BD1BD13BD14
ST3.
4VST
3.4V
_10
BD92BD93
CN2001
R12V_ 2
DGND
_12
DGND
_11
DGND
_10
DGND
_9
P_O N
PGND
6
PGND
8PG
ND7
PGND
10PG
ND9
R12V_ 1
R204
5
PVDD
1PV
DD2
PVDD
3PV
DD4
PVDD
5
C833
C904
R205
5C2
088
VARI
_SM
PS
C905
8E8>
2E3>
P_O N
VARI_SMPS
1234567891011121314151617181920212223
* 6.5. DC-DC POWER
CN
20
01
IC2 00 2 IC2 0 01
IC9 1 * 5.6. SMPS PCB Top
(1)
(1)
4-9 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
4. Troubleshooting
4.1.4. Remote doesnt work
Change the Batte ry.
No
No
Re-insert FFC cable correctly.
No Change REYE1 or change the FRONT PANEL PCB.
Yes
Yes
Yes
Remote Battery OK?
(1)REYE1 Pin 1 S igna l OK?
Remote control does not work
Change the power of IC23 Pin 7, change the MAIN PCB.
Is th e FFC Cab le (be tween Fro nt pane l & MAIN)
OK?
* Refer to wave pa ttern image of Fig. 4-6 .
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-10
-
4. Troubleshooting
V5
TP V_5V
ST3 .4
TP
ST3.4V
USB5VTPUSB5V
1/10W
R16
47O HM
ST3. 4V
FUNCSTO P
REMOT_IN
V_GNDDGND
AVGND
40000 OHM*BD2
40000 OHM*BD1
DGND
FCON1
DGND
47NF50V
C70
TPUSB-
TDATP
TCLK
11MLVS-0603-E08
C17
DGND
R96FS1A
REYE1
1
2
3
1/10W220O HM
VR30
220O HMVR29
6.2
UDZS
TE-
17 6
.2B
D12
47O HM1/10W
R76
DGND
GND
VCC
VOUT
TP V_5V
TP
ST3.4V
TPUSB5V
1/10W47O HM
ST3. 4V
V_GNDDGND
AVGND
40000 OHM*
40000 OHM*
DGND
DGND
47NF50V
TPTP
11MLVS-0603-E08
DGND
R96FS1A1/10W220O HM220O HM
6.2
UDZS
TE-
17 6
.2B
47O HM1/10W
DGND
V5
ST3 .4 USB5V
R16
BD2
BD1
FCON1
C70
USB-TDA TCLK
C17
REYE1VR30VR29
D12
R76
FUNCSTO P
REMOT_IN 1
2
3 GND
VCC
VOUT
* 6.2. FRONT
* 5.2. FRONT Top
(1)
(1)
(1)
4-11 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
4. Troubleshooting
4.1.5. No Picture (HDMI)
Select correct TV mode .
No
No
Add some solder creamthrough HD7 ~ 10.
No Check HIC1 prephera l ircuit.If a ll is ok, change HIC1.
Yes
Yes
Yes
Yes
(1)Check HD7 ~ 10 Signa l.
Video se lection accords with ca ble co nnection and
TV mode?
(2)Check HOE5, HOE6 Signa l.
No Picture (HDMI)
HDMI ca ble Erro r.
No Check HIC1 prephera l circuit.If a ll is ok, change HIC1.Check HO1 Soldering sta tus .
* Refer to wave pa ttern image of Fig. 4-9 .
* Refer to wave pa ttern image of Fig. 4-7 an d Fig. 4-8 .
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-12
-
4. Troubleshooting
HD_INPO RT0
HS0_R1+HS0_R1- 10E10 Support > Software Upgrade.
7) Select By USB.
NOTE
The disc tray must be empty when you upgrade the software using the USB Host jack.
When the software upgrade is done, check the software details in the software Upgrade menu.
Do not turn off the product during the software upgrade. It may cause the product to malfunction.
Software upgrades using the USB Host jack must be performed with a USB memory flash stick only.
By Disc
To upgrade by Disc, follow these steps:
1) Visit www.samsung.com/bluraysupport.
2) Download the latest disc software upgrade zip archive to your computer.
3) Unzip the zip archive to your computer. You should have a single folder with the same name as the zip file.
4) Write the folder onto a disc. We recommend a CD-R or DVD-R.
5) Finalize the disc before you remove it from your computer.
6) Insert the disc into product.
7) In the products menu, go to Settings > Support > Software upgrade.
8) Select By Disc.
NOTE
When the system upgrade is done, check the software details in the software Upgrade menu.
Do not turn off the product during the Software Upgrade. It may cause the product malfunction.
4-27 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
4. Troubleshooting
By Downloaded
The By Downloaded option lets you upgrade using a file the product downloaded earlier but you decided not to installimmediately or a file downloaded by the product in Standby Mode (See Download in Standby Mode below).
To upgrade By Downloaded, follow these steps:
1) If upgrade software has been downloaded, you will see the software version number to the right of By Downloaded.
2) Select By Downloaded, and then press the ENTER button.
3) The product displays a message asking if you want to upgrade. Select Yes. The product begins the upgrade.
4) When the update is complete, the product turns off automatically, and then turns on.
NOTE
When the system upgrade is done, check the software details in the software Upgrade menu.
Do not turn off the product during the software Upgrade. It may cause the product to malfunction.
To use the By Downloaded function, your product must be connected to the Internet.
Download in Standby Mode
You can set the Download in Standby Mode function so that the product downloads new upgrade software when it is inStandby mode. In Standby mode, the product is off, but its Internet connection is active. This allows the product todownload upgrade software automatically, when you are not using it.
To set Download in Standby Mode, follow these steps:
1) Press the buttons to select Download in Standby Mode, and then press the ENTER button.
2) Select On or Off.
Off : If you select Off, the product will notify you with a pop up message when new upgrade software is available.
On : If you select On, the product will automatically download new upgrade software when it is in Standbymode with the power off. If it downloads new upgrade software, the product will ask you if you want to install itwhen you turn the product on.
NOTE
To use the Download in Standby Mode function, your product must be connected to the Internet.
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-28
-
4. Troubleshooting
4.2.3. Cold Start Method (Initialize Setup)
1) This is useful for forgotten Parental Lock password.
2) Press button on the front panel for over 5 seconds while no disc status.
3) Then, VFD sign : INIT Power will be turned off automatically.
4) System Micom Cold Start :During Stand-By, just press the Stop Button " of remote-controller for over 5 seconds. Then, VFD sign : "RESET".
4-29 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
4. Troubleshooting
4.3. Buyer-Region Code Setting Method
4.3.1. Inserting the Region Code after replacing the Main PCB
NOTE
After replacing the Main PCB and System Micom (IC23), the region code should be inserted.
The unit will not work properly if you do not insert the correct region code.
You must use the remote control.
1) Select the "AUX" mode and then press the "Tuner Memory" button on the remote control for 4-5 seconds.
(1)
(2)
2) You should see the T-MODE message display on the VFD. Press the direction button during this message.
NOTE
The T-MODE indicator on the VFD only appears for a very short time.
T-MODE
3) You can see TEST on the VFD. Insert the number 46 to select the Region Code.
TEST
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-30
-
4. Troubleshooting
4) After step (3), you can see on the VFD.
Insert the Region Code (see Table on next page) corresponding to the model and area in which you reside in using the0-9 buttons on the remote control. And then turn off the power.
5) In order to check if you inputted correctly, please do Number 1, 2, 3 again and then during TEST MODE insertnumber 47. After that, you can check the option code which you inserted. For example, you can see 000US5. It meansthat you inserted region code 000 and the region is USA which supports 5.1CH Audio output. If it is 047EU2, itmeans that you inserted region code 047 and the region is Europe which supports 2.1ch Audio output.
4-31 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
4. Troubleshooting
Table 4.1 HT-E5xxx 5.1CH DECK Option Table
Region Code Area
000 USA(ZA)
001 JAPAN
002 KOREA(KR)
003 TAIWAN(ZW)
004 PHILIPPINES(XP)
005 MAXICO, PANAMA, COLOMBIA(ZL)
006 PERU(PE), CHILE(ZS), ARGENTINA(ZB)
007 EU(ZF), (XN), (XE), (EN), (ZV), (EN), (XU), TURKY(TK)
008 SINGPORE, VIETNAM(XS), INDONESIA(XD), MALAYSIA(XM), THAILAND(XT), INDIA(XL)
009
010 RUSSIA, UKRAINE, KAZAKHSTAN(RU)
011 AUSTRALIA, NEWZILAND(XY)
012ARAB, PAKISTAN, EGYPT, IRAQ, LEBANON, SYLBIA, MOROCCO, TUNIS(ZN), SAUDI(UM),ALGERIA(SH), S.AFRICA(XA), ISRAEL(SQ), NIGERIA(SW), SUDAN(SJ), ETIOPIA, KENYA(KE)
013 CHINA(XZ), HONGKONG(ZK)
014 BRAZIL(ZD)
015 CANADA(ZC)
016 IRAN(HC)
017 ETC1
018 ETC2
019 ETC3
Copyright 1995-2012 SAMSUNG. All rights reserved. 4-32
-
4. Troubleshooting
Table 4.2 HT-E5200 2.1CH DECK Option Table
Region Code Area
020 USA(ZA)
021 JAPAN
022 KOREA(KR)
023 TAIWAN(ZW)
024 PHILIPPINES(XP)
025 MAXICO, PANAMA, COLOMBIA(ZL)
026 PERU(PE), CHILE(ZS), ARGENTINA(ZB)
027 EU(ZF), (XN), (XE), (EN), (ZV), (EN), (XU), TURKY(TK)
028 SINGPORE, VIETNAM(XS), INDONESIA(XD), MALAYSIA(XM), THAILAND(XT), INDIA(XL)
029
030 RUSSIA, UKRAINE, KAZAKHSTAN(RU)
031 AUSTRALIA, NEWZILAND(XY)
032ARAB, PAKISTAN, EGYPT, IRAQ, LEBANON, SYLBIA, MOROCCO, TUNIS(ZN), SAUDI(UM),ALGERIA(SH), S.AFRICA(XA), ISRAEL(SQ), NIGERIA(SW), SUDAN(SJ), ETIOPIA, KENYA(KE)
033 CHINA(XZ), HONGKONG(ZK)
034 BRAZIL(ZD)
035 CANADA(ZC)
036 IRAN(HC)
037 ETC1
038 ETC2
039 ETC3
4-33 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
5. PCB Diagram
5. PCB Diagram
5.1. Wiring Diagram
M_B- 40 M_B-M_B W 15 W M_BM_A V V M_AM_A- U U M_A-GND CM CM GNDCD LD SLO2- SLO2- CD LDBDLD SLO2+ SLO2+ BDLDDVD LD SLO1- SLO1- DVD LDGND SLO1+ SLO1+ GND 23 +35V +35V 23CD_VR NC NC CD_VR +35V +35VDVD_MP D GND GND DVD_MP D +35V +35VDVD_VR OP EN OP EN DVD_VR +35V +35VBD MP D CLOSE CLOSE BD MP D +35V +35VP U_SEL LDO- LDO- P U_SEL P GND P GNDBD_P D_FSW LDO+ LDO+ BD_P D_FSW P GND P GNDDVD_P D_FSW DISCIN 1 DISCIN DVD_P D_FSW P GND P GNDVREF_2.1V VREF_2.1V P GND P GNDVCC_5V VCC_5V P GND P GNDVREF_1.65V VREF_1.65V R12V R12VBD RF+ BD RF+ VARI_SMP S VARI_SMP SBD RF- BD RF- ST3.4V ST3.4VH H ST3.4V ST3.4VG G DGND DGNDF F DGND DGNDE E D12V_P W D12V_P WD D D12V_P W D12V_P WC C D12V_P W D12V_P WB B DGND DGNDA A P _ON P _ONGND GND R12V R12VT- T- 1 DGND DGND 1F2- F2-F2+ F2+F1- F1-F1+ F1+T+ T+GND GNDGND GNDGND GNDBD_HFM 1 BD_HFM
USB5V 28 1 USB5V
USB5V USB5V
USB - USB -
USB+ USB+
Touch Key CLK TOUCH CLK
Touch Key DATA TOUCH DATA
DGND GND
BUZZER BUZZER
REMOT REMOT
V5V D5V
ST3.4V ST3.3V
DGND GND
VGND GND
VFD12V_P W R12V
VFD12V_P W R12V
VGND GND
VFD CE VFD CE
VFD DATA VFD DATA
VFD CLK VFD CLK
T_RES ET T_RESET
MIC SIG MIC IN
AVGND GND
MIC SEN MIC SEN
MIC DATA MIC DATA
MIC CLK MIC CLK
AVGND GND
TACT TACT
DGND 1 28 GND
FRONT
DECK
CN2001
CN22FCON1 SMPS
CN3CN2
MAIN + AMP
Copyright 1995-2012 SAMSUNG. All rights reserved. 5-1
-
5. PCB Diagram
5.2. FRONT PCB Top
FCON1
VCN5
KCN1 KCN2 US CN1
KIC1
(1)
TP1
5-2 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
5. PCB Diagram
5.2.1. Pin Connection
1) FCON1
Touch Key / VFD / USB Interface Connector
Pin No. Signal
1 DGND
2 TACT
3 AVGND
4 MIC CLK
5 MIC DATA
6 MIC SEN
7 AVGND
8 MIC SIG
9 T_RESET
10 VFD CLK
11 VFD DATA
12 VFD CE
13 VGND
14 VFD12V_PW
15 VFD12V_PW
16 VGND
17 DGND
18 ST3.4V
19 V5V
20 REMOT
21 BUZZER
22 DGND
23 Touch Key DATA
24 Touch Key CLK
25 USB+
26 USB -
27 USB5V
28 USB5V
Copyright 1995-2012 SAMSUNG. All rights reserved. 5-3
-
5. PCB Diagram
5.2.2. Test Point Wave Form
TP1
5-4 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
5. PCB Diagram
5.3. FRONT PCB Bottom
IC5 VCN6 VIC1
Copyright 1995-2012 SAMSUNG. All rights reserved. 5-5
-
5. PCB Diagram
5.4. MAIN PCB Top
(1)
TP2
TP3
TP4
TP2
CN95
CN 1
HCN2CN6
CN703
VCN1 HCN2 HCN1PCN1
YCN10 0 5WCN2 CN2 0 0 2 CN2 0 0 3
CN
20
01
CN2 2CN2
CN
3
CN2 5
CN4
BCN1
CN99
WCN1 HC
N7
IC3
IC9
IC2 9
IC13
IC17
IC801
IC14
HIC1
US BIC1
IC23
IC2
ZIC 20 03 IC2002 IC2001
IC8
IC 41
IC7IC9 1
(2)
(3)
(4)
(5)
(6)
5-6 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
5. PCB Diagram
5.4.1. Pin Connection
1) WCN1
Wi-Fi Module
Pin No. Signal
1 WI 5V
2 WIFI-
3 WIFI+
4 GND
5 GND
2) CN3
Deck Pickup Connector
Pin No. Signal
1 BD_HFM
2 GND
3 GND
4 GND
5 T+
6 F1+
7 F1-
8 F2+
9 F2-
10 T-
11 GND
12 A
13 B
14 C
15 D
16 E
17 F
18 G
19 H
20 BD RF-
21 BD RF+
22 VREF_1.65V
23 VCC_5V
24 VREF_2.1V
25 DVD_PD_FSW
26 BD_PD_FSW
27 PU_SEL
28 BD MPD
29 DVD_VR
30 DVD_MPD
31 CD_VR
32 GND
33 DVD LD
Pin No. Signal
34 BDLD
35 CD LD
36 GND
37 M_A-
38 M_A
39 M_B
40 M_B-
3) BCN1
Bluetooth Module (exclude ZA buyer)
Pin No. Signal
1 GND
2 BT+
3 BT-
4 D5V
4) CN2
Deck Motor Connector
Pin No. Signal
1 DISCIN
2 LDO+
3 LDO-
4 CLOSE
5 OPEN
6 GND
7 NC
8 SLO1+
9 SLO1-
10 SLO2+
11 SLO2-
12 CM
13 U
14 V
15 W
5) CN22
Touch Key / VFD / USB Interface Connector
Pin No. Signal
1 USB5V
2 USB5V
3 USB -
4 USB+
5 TOUCH CLK
6 TOUCH DATA
7 GND
8 BUZZER
9 REMOT
10 D5V
11 ST3.3V
12 GND
13 GND
14 R12V
15 R12V
16 GND
17 VFD CE
18 VFD DATA
19 VFD CLK
20 T_RESET
21 MIC IN
22 GND
23 MIC SEN
24 MIC DATA
25 MIC CLK
26 GND
27 TACT
28 GND
Copyright 1995-2012 SAMSUNG. All rights reserved. 5-7
-
5. PCB Diagram
6) CN2001
MAIN Power Connector
Pin No. Signal
1 DGND
2 R12V
3 P_ON
4 DGND
5 D12V_PW
6 D12V_PW
7 D12V_PW
8 DGND
9 DGND
10 ST3.4V
11 ST3.4V
12 VARI_SMPS
13 R12V
14 PGND
15 PGND
16 PGND
17 PGND
18 PGND
19 +35V
20 +35V
21 +35V
22 +35V
23 +35V
5-8 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
5. PCB Diagram
5.4.2. Test Point Wave Form
TP2 TP3 TP4
Copyright 1995-2012 SAMSUNG. All rights reserved. 5-9
-
5. PCB Diagram
5.5. MAIN PCB Bottom
5-10 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
5. PCB Diagram
5.6. SMPS PCB Top
CN802
CN801
Copyright 1995-2012 SAMSUNG. All rights reserved. 5-11
-
5. PCB Diagram
5.7. SMPS PCB Bottom
5-12 Copyright 1995-2012 SAMSUNG. All rights reserved.
-
6. Schematic Diagram
6. Schematic Diagram
6.1. Overall Block Diagram
Bac k E ndFIRENZESDP1004
VideoDec oder
AudioDecoder
Ethe rMAC
Ethern et
HDMITX
MotorDriver
SATA
DDR3 DDR3 DDR3
2Gb (128M x 16)
MEM A MEM B
VIDEOAMPMM1756AURE
HDMI TX
TMDS
ADCCS53 46
SPI I/FSys temU-com
LC87F5 WC8A
Pick -up / Loa de r
AUX
Tuner
iPodCP CHIP
USB 1 /2
SMPSPOW ER
PWMModula torTAS5538I2S 5.1ch
WIFI
IiPod CVBS VIDEO
CVBS
Fron t EndSC73 00
iPodExtern e lDOCKING
Wireles s TX Module
I2S RearWireles s RX Module
I2C USB1
Swi tch ICTS5A23159
HDMI RX EP9 2AS
HDMI RX1
HDMI RX2
BUFFERSWITCH
Aud ioDec oder
SPD IF_EXTSPD IF_F
I2S 2 CH
Movi Nand2Gb
HUBAU6259
FRONTUSB
IC- ETHRTL8201E
VFD ITO FILM
TouchCor e
CVBS
SYST EMMain Mico m
I2C
Pow er S ta geTAS5613 5.1CH
H_SP
DIF(S
PD
IF)
I2C
MIC/ASC
I2C
(768) G Byte
Optical In
I2C
ARC
SWITCH
TMDS
Bluet oothModule
(OP TION)
2Gb (128M x 16 ) 2Gb (128M x 16 )
Extern a l WIFI
USB2
From DISC, RF signal is transmitted to BACKEND SDP93.The decoder SDP93 decodes the RF signal to VIDEO and AUDIO DATA. About Digital Video signal, HDMI goes to DSP Boardthough system cable. And HDMI TX jack. in case of supporting HDMI IN, HDMI SOC EP94A2E gets TMDS DATA fromSDP93.And HDMI IN Jack and after packing the data, it sends the data to TX Jack. HT-D7200B supports 2 USB ports.
One is for USB File play like MP3, JPG, DivX and etc. The other is for WiFi dongle, i-POD, i-Phone are also supported.
About SDP93 Audio output, I2S data goes through DSP TMS320DA788 and then DSP IC decodes or bypass the data to PWM IC.
External Audio input also goes through DSP TMS320DA788 and then goes through like SDP93 AUDIO pass.From PWM modulator PS9630B to LPF(Low Pass Filter), Digital Signal is changed to Analog Signal and amplified by OP-AMPand FET IR AMP.
Copyright 1995-2012 SAMSUNG. All rights reserved. 6-1
-
6. Schematic Diagram
6.2. FRONT
VFD12V -> PC -28V,VFD+,VFD-
KARAOKE PART
6514 SERIES USE D -34V6524 SERIES USE D -28V
USB
ITO_FILM
T_RESET
VFD_-28V1
BD17
*
0.01O
HM
VFD12V_PW
ST3. 4V
VFD_-28V1
ST3. 4V
KBD1
0.01O
HM*
V_5V
KBD2*
0.01O HM V_5V
USB5V
VFD12V_P W
V12VTP
ST3.4V
V5
TP V_5V
ST3.4
TP
ST3.4V
USB5VTPUSB5V
1/10W
R16
47O HM
ST3.4V
ST3. 4V
RCLA
MP0
502B
.TC
T
100NF
MIC_IN
MIC_CLK
MIC_DATA
VFD_CE1
VFD_DATA1VFD_CLK1
VGR1
VGR3
VGR4
VGR2
VGR5
VGR6
VP
MIC_SENSE
MIC_IN
VFD-1
VGR2
VGR4
VGR5
VGR3
VGR6
VGR1
VFD+1
TK_CLK1
TK_DATA1
USB_DATA-USB_DATA+
MIC_S ENSEMIC_DATAMIC_CLK
VFD_CE 1
T_RESETMIC_S IG
REMOT_INBUZZER
USB_DATA-
TK_DATA1TK_CLK1USB_DATA+
PLAY
ENTER
OPEN
FUNCSTOP
REMOT_IN
FUNCSTOPPLAYENTEROPEN
2.2KO HM1/10W
KR18
1UF 50V
KC24
AVGND
AVGND
16V100NF
KC8
16V100NF
KC7
50V3.3NF
KC2
16V100NF
KC1
15KOHM1/10W
KR4
1/10W15KOHM
KR3
15KOHM1/10W
KR2
7.5KO HM1/10W
KR1
1/10W4.7KO HM
KR19
33PF
50V
KC25
AVGND
1/10W33KOHM
KR20
2.2KO HM1/10W
KR13
1/10W4.7KO HM
KR14
1UF 50VKC21
33PF
50V
KC22
1/10W33KOHM
KR15
AVGND
16V100NF
KC9
16V100NF
KC6
50V680PF
KC5
25V1UF
KC4
33KOHM1/10W
KR5
25V1UF
KC3
R2A159 06S P
KIC1123456789101112131415
16171819202122232425262728
MIC_SIG
V_GND
11MLVS-0603- E08
VD11
10V10UF
VC18
PT6325
IC5
123456789
101112
13 14 15 16 17 18 19 20 21 22 23 24
252627282930313233343536
373839404142434445464748
MGND1
1/10W100OHM
VR15
1/10W100OHM
VR75
1/10W100OHM
VR14
10KOHM1/10W
VR18
1/10W82KOHM
VR17
V_GND
10V10UF
VC19
1 2 3 4 5 6 7 8 9
22 21 20
1/10W1KOHM
KR17
40000OHM*
KBD5
1/10W1KOHM
KR16
50V
10N
F
KC23
40000OHM*
KBD3
TP
MICIN2
TP
MICIN1
35V4.7U FKC11
10V10UFKC10
AVGND
1/10W10KOHM
KR9
680PF50V
KC1650V1UF
KC151UF 50VKC14
18KOHM1/10W
KR850V100PF
KC13
10NF50V
KC12
1/10W33KOHM
KR7
1/10W51KOHM
KR6
AT12535250C01
KCN21
2345
67
AVGND
*40000OHM
KBD4
AT12535250C01
KCN11
2345
67 AVGND
10UF10V
KC20
V_GND
15KOHM1/10W
KR12
1/10W15KOHM
KR11
15KOHM1/10W
KR103.3NF50V
KC19
AVGND
220NF16V
KC18
10V10UFKC17
10
V_GND
V_GND
50V
1NF
C31
11121314
1516
171819
50V100NF
VC23
50V
1NF
C30
75
1N41
48W
SD1
4
751N
4148
WS
D15
KTC4378Q8
KTC4378Q7
25V100NF
C32
TPV_GND
UNDEFINEDDR126 5
T1
12345 6
78910
1/10W10KOHM
R37
V_GND
50V100NF
VC68
22 21 20 19
006BT35 4NAK_G_03
VCN5
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
TP
F-
TP
P22
TP
P21
TP
P20
TP
P19
TP
P18
18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
TP
P17
TP
P16TP
P15TP
P14TP
P13
TP
P12
TP
P11
TP
P10
TP
P9
TP
P8
TP
TP1
TP
P6
TP
P5
TP
P4
TP
P3
TP
P2
TP
P1
V_GND
50V100NF
VC25
TP
1G
TP
2G
TP
3G
TP
4G
TP
5G
TP
6G
TP
F+
1/10W10KOHM
R38
MLVS-0603- E0811
VD1
0
RCLAMP0502B.TCT
UD1
DGND
MLVS-0603-E0811
D8
TPDN- TPDP+
100NF16V
C20
100NF16V
C22
100NF16V
C21
DGND
10UF10V
C71 16V
47U
F
OP TION
C69
UGND
*40000O HM
BD3
DGND
UGND
DGND
16V100NF
C23
100NF16V
C24
100NF16V
C25
UAS2
1-4K
590A
USCN1
1234
MGND1
MGND2
V_GND
1N4148WS75
D19
1N4148WS75
D18
1/10W4.7OHM
R82
1/10W16KOHM
R83
16KOHM1/10W
R84
1/10W16KOHM
R85
1/10W16KOHM
R86
3.9SDZ3V9GD20
TP-28V
10V10UF
C33
SS1440
D17
SS1440
D16
1/10W4.7OHM
R81
4.7OHM1/10W
R80
TPVFD+
VFD+1
10V10UF
C34
VFD-1
DGND
47UF35V
C35
35V47UF
C80
TP
MIC_SIG
TPVFD-
DGND
6.3V1UF
VC14
V_GNDDGND
AVGND
40000O HM*BD2
40000O HM*BD1
DGND
1/10W33KOHM
R3
UNDEFINEDDHT-1107WP
SW31
2
3
4
DHT-1107WPUNDEFINED
SW21
2
3
4
1/10W10KOHM
R1
1/10W10KOHM
R2
TP
PWRUNDEFINEDDHT-1107WP
SW11
2
3
4
TP
MIC_DATA
TP
MIC_SENSE
DGND
AVGND
V_GND
TP
MIC_CLK
TPAV_GND
TPD_GND
TPVGND
10022HS -28C00FCON1
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VFD_CLK1VFD_DATA1
TP
BU TPREMOTP
TRESET
TPVCE
DGND
47NF50V
C70
TPUSB+
TPUSB-
TP
TDATP
TCLK
11MLVS-0603-E08
C17
DGND
TPVCLK
TPVDA
R96FS1A
REYE1
1
2
3
6.3V1UF
VNC1
16V
VNC1
2
5.6
UDZ5V6B
OP TION
VNCD
3
DGND
6.3V1UF
VC13
VIC1
1234
5 6 7 8
9101112
13141516M
GND
1
0
OPT ION
NCD
10
DGND
1/10W220O HM
VR30
1/10W220O HM
VR29
1/10W220O HM
VR28
1/10W220O HM
VR34
1/10W220O HM
VR35
6.2
UDZS
TE
-17
6.2B
D12
TPFUNC
47O HM1/10W
R76
0500
2HR-
08N2
(G)
VCN6
12345678
MGND1
MG
ND2
DGND
TP
STOP
TPPLAY
TP
OP EN
TP
ENTER
MCLK
BUS/DC
NC/FEEDBAC K_VOL
LPF1_OUT
VREF
MIC_INLPF2_IN
ECHO_VOL _IN
CC1
ALC_TC
VCC
LPF2_OUT
OP1_OUTLPF1_IN
ALC_LC
CC2
OP2_IN
MIX_OUT
MIC_OUT
MICVOL_IN
GND
OP1_IN
SDA/MIC_VOL
SCL_ECHO_V OL
MIX_OUT
OP2_OUTMIC_NFIN
MIX_NFIN
LED2
NC
VDD
OSC
LED4
LED3
LED1
K2
K1
STB
CLK
DIN
DOUT
SG4_
KS4
NCSG3_
KS3
SG2_
KS2
SG1_
KS1
VDD
VSS
SG10_KS10
SG9_
KS9
SG8_
KS8
SG7_
KS7
SG6_
KS6
SG5_
KS5
SG16_KS16
SG15_KS15NC
SG14_KS14
SG13_KS13
SG12_KS12
SG11_KS11
SG24
_G
R5NC
SG23
_G
R6
VSS
GR2
GR1
GR4
GR3
SG22
_G
R7
SG20
_G
R9
SG21
_G
R8
SG19_GR10
SG17_GR12
SG18_GR11
VEE
E
B
C
E
BC
F+6G5G4G3G2G1GP1P2P3P4P5P6P7P8P9P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
F- P22
GND
VCC
VOUT
P2.2
VDDI
O
P1.5
P2.1
PWM
0.4/
P0.4
VSS
P1.3/PWM1.3P1.4
VDDI
NTS
INT3
/P3.
3
VDDINT
VSSP0.5/PWM0.5
P1.2/PWM1.2I2C1_SCL
I2C1_SDA
VFD12V -> PC -28V,VFD+,VFD-
KARAOKE PART
6514 SERIES USE D -34V6524 SERIES USE D -28V
USB
ITO_FILM
VFD_-28V1
*
0.01O
HM
VFD12V_PW
ST3. 4V
ST3. 4V
0.01O
HM*
V_5V
*
0.01O HM V_5V
USB5V
TP
ST3.4V
TP V_5V
TP
ST3.4V
TPUSB5V
1/10W47O HM
ST3.4V
ST3. 4V
RCLA
MP0
502B
.TC
T
100NF
2.2KO HM1/10 W 1UF 50V
AVGND
AVGND
16V100NF
16V100NF
50V3.3NF
16V100NF
15KOHM1/10W1/10W15KOHM
15KOHM1/10W7.5KO HM1/10W
1/10W4.7KO HM
33PF
50V
AVGND
1/10W33KOHM
2.2KO HM1/10W
1/10W4.7KO HM
1UF 50V
33PF
50V
1/10W33KOHM
AVGND
16V100NF
16V100NF
50V680PF
25V1UF
33KOHM1/10W
25V1UF
R2A159 06S P
V_GND
11MLVS-0603- E0810V
10UF
PT6325
1/10W100OHM
1/10W100OHM
1/10W100OHM10KOHM1/10W
1/10W82KOHM
V_GND
10V10UF
1 2 3 4 5 6 7 8 9
22 21 20
1/10W1KOHM
40000OHM*
1/10W1KOHM
50V
10N
F
40000OHM*
TPTP
35V4.7U F
10V10UF AVGND
1/10W10KOHM
680PF50V 50V
1UF1UF 50V
18KOHM1/10W50V100PF
10NF50V1/10W33KOHM
1/10W51KOHM
AT12535250C01
AVGND
*40000OHM
AT12535250C01
AVGND
10UF10V
V_GND
15KOHM1/10W
1/10W15KOHM15KOHM1/10W
3.3NF50V
AVGND
220NF16V
10V10UF
10
V_GND
V_GND
50V
1NF
11121314
1516
171819
50V100NF
50V
1NF
75
1N41
48W
S75
1N41
48W
S
KTC4378
KTC4378
25V100NF
TP
UNDEFINEDDR126 5
1/10W10KOHM
V_GND
50V100NF
22 21 20 19
006BT35 4NAK_G_03
TP TP TP TP TP TP18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP
V_GND
50V100NF
TP TP TP TP TP TP TP
1/10W10KOHM
MLVS-0603- E0811
0
RCLAMP0502B.TCT
DGND
MLVS-0603-E0811
TP TP
100NF16V 100NF16V
100NF16V
DGND
10UF10V
16V
47U
F
OP TION
UGND
*40000O HM
DGND
UGND
DGND
16V100NF 100NF
16V100NF16V
UAS2
1-4K
590A
V_GND
1N4148WS75
1N4148WS75
1/10W4.7OHM
1/10WMHOK61MHOK61
W01/1W01/116KOHM
1/10W16KOHM
3.9SDZ3V9G
TP
10V10UF
SS1440
SS1440
1/10W4.7OHM
4.7OHM1/10W
TPVFD+1
10V10UF VFD-1
DGND
47UF35V
35V47UF
TP
TP
DGND
6.3V1UF
V_GNDDGND
AVGND
40000O HM*
40000O HM*
DGND
1/10W33KOHM
UNDEFINEDDHT-1107WP
DHT-1107WPUNDEFINED
1/10W10KOHM
1/10W10KOHM
TP
UNDEFINEDDHT-1107WP
TP
TP
DGND
AVGND
V_GND
TP
TP
TP
TP
10022HS -28C00
TP
TP
TPTP
DGND
47NF50V
TP
TP
TP
TP
11MLVS-0603-E08
DGND
TP
TP
R96FS1A
6.3V1UF
16V
5.6
UDZ5V6B
OP TION
DGND
6.3V1UF
0
OPT ION
DGND
1/10W220O HM
1/10W220O HM
1/10W220O HM
1/10W220O HM
1/10W220O HM
6.2
UDZS
TE
-17
6.2B
TP
47O HM1/10W
0500
2HR-
08N2
(G)
DGND
PT PTPTPT
BD17
KBD1
KBD2
V12V
V5
ST3.4 USB5V
R16
KR18 KC24
KC8KC7
KC2
KC1
KR4
KR3
KR2
KR1
KR19
KC25
KR20
KR13
KR14
KC21
KC22
KR15
KC9
KC6
KC5
KC4
KR5
KC3
KIC1
VD11
VC18
IC5
VR15VR75VR14VR18
VR17
VC19
KR17 KBD5
KR16
KC23
KBD3
MICIN2
MICIN1
KC11
KC10
KR9
KC16
KC15KC14
KR8KC13
KC12KR7KR6
KCN2
KBD4
KCN1
KC20
KR12
KR11KR10 KC19
KC18
KC17
C31
VC23
C30
D14
D15
Q8
Q7
C32
V_GND
T1
R37
VC68
VCN5
F-P22P21P20P19P18P17P16P15P14P13P12P11P10P9P8TP1P6P5P4P3P2P1
VC25
1G2G3G4G5G6G F+
R38
VD1
UD1
D8
DN- DP+
C20
C22
C21
C71
C69
BD3
C23
C24
C25
USCN1
D19
D18 R82
R83
R84
R85
R86
D20
-28V
C33
D17
D16
R81
R80
VFD+
C34
C35
C80
MIC_SIG
VFD-
VC14
BD2
BD1
R3
SW3
SW2
R1
R2
PWR
SW1 MIC_DATA
MIC_SENSE
MIC_CLK
AV_GND
D_GND
VGND
FCON1
BU REMO
TRESET
VCE
C70
USB+
USB-TDA TCLK
C17
VCLKVDA
REYE1
VNC1
VNC1
2
VNCD
3
VC13
VIC1
NCD
10
VR30VR29
VR28
VR34
VR35
D12
FUNC
R76
VCN6
STOPPLAY
OP EN
ENTER
T_RESET
VFD_-28V1
VFD12V_P W
MIC_IN
MIC_CLK
MIC_DATA
VFD_CE1
VFD_DATA1VFD_CLK1
VGR1
VGR3
VGR4
VGR2
VGR5
VGR6
VP
MIC_SENSE
MIC_IN
VFD-1
VGR2
VGR4
VGR5
VGR3
VGR6
VGR1
VFD+1
TK_CLK1
TK_DATA1
USB_DATA-USB_DATA+
MIC_S ENSEMIC_DATAMIC_CLK
VFD_CE 1
T_RESETMIC_S IG
REMOT_INBUZZER
USB_DATA-
TK_DATA1TK_CLK1USB_DATA+
PLAY
ENTER
OPEN
FUNCSTOP
REMOT_IN
FUNCSTOPPLAYENTEROPEN
MIC_SIG
VFD_CLK1VFD_DATA1
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16171819202122232425262728
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101112
13 14 15 16 17 18 19 20 21 22 23 24
252627282930313233343536
373839404142434445464748
MGND1
1
2345
67
1
2345
67
12345 6
78910
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
1234
MGND1
MGND2
1
2
3
4
1
2
3
4
1
2
3
4
123456789
10111213141516171819202122232425262728
1
2
3
1234
5 6 7 8
9101112
13141516M
GND
1
12345678
MGND1
MG
ND2
MCLK
BUS/DC
NC/FEEDBAC K_VOL
LPF1_OUT
VREF
MIC_INLPF2_IN
ECHO_VOL _IN
CC1
ALC_TC
VCC
LPF2_OUT
OP1_OUTLPF1_IN
ALC_LC
CC2
OP2_IN
MIX_OUT
MIC_OUT
MICVOL_IN
GND
OP1_IN
SDA/MIC_VOL
SCL_ECHO_V OL
MIX_OUT
OP2_OUTMIC_NFIN
MIX_NFIN
LED2
NC
VDD
OSC
LED4
LED3
LED1
K2
K1
STB
CLK
DIN
DOUT
SG4_
KS4
NCSG3_
KS3
SG2_
KS2
SG1_
KS1
VDD
VSS
SG10_KS10
SG9_
KS9
SG8_
KS8
SG7_
KS7
SG6_
KS6
SG5_
KS5
SG16_KS16
SG15_KS15NC
SG14_KS14
SG13_KS13
SG12_KS12
SG11_KS11
SG24
_G
R5NC
SG23
_G
R6
VSS
GR2
GR1
GR4
GR3
SG22
_G
R7
SG20
_G
R9
SG21
_G
R8
SG19_GR10
SG17_GR12
SG18_GR11
VEE
E
B
C
E
BC
F+6G5G4G3G2G1GP1P2P3P4P5P6P7P8P9P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
F- P22
GND
VCC
VOUT
P2.2
VDDI
O
P1.5
P2.1
PWM
0.4/
P0.4
VSS
P1.3/PWM1.3P1.4
VDDI
NTS
INT3
/P3.
3
VDDINT
VSSP0.5/PWM0.5
P1.2/PWM1.2I2C1_SCL
I
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