project transmitter (car)-2012
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BHARAT
ELECTRONICS
PROJECT
REPORT
SUBMITTED BY:DIVANSHU SHARMA
ROLL NO: 1050731003
R.D. FOUNDATION GROUP OF INSTITUTIONS, KADRABAD,
MODINAGAR (U.P.)
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CONTENTS
1 : CERTIFICATE
2 : ACKNOWLEDGEMENT
3 : PREFACE
4 : BHARAT ELECTRONICS INDUSTRY5 : B E: SALES ANS SERVICES
6 : FORMATION OF UNIT
7 : PROJECT : ROTATION8 : PROJECT : RADAR
9 : TRANSMITTER
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TO WHOM SO EVER IT MAY CONCERN
I certify that DIVANSHU SHARMA, student of B. Tech (Electronics and
Communication), R.D. FOUNDATION GROUP OF INSTITUTIONS,
KADRABAD, MODINAGAR (U.P.) has joined BEL, Ghaziabad for six weeks
industrial training and she has been constantly working under my acknowledgement on
the project assigned to her. She has worked on project RADAR TRANSMITTER. Her
contribution was in Study & Testing of Transmitter.
This report accounts her experience and knowledge of the field she worked in. I have
verified the report and sanction it.
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ACKNOWLEDGEMENT
I take this opportunity to express my sincere gratitude towards Training and placementofficer of my college for forwarding my training letter to Bharat Electronics, Ghaziabad
and also to Mr.B.K.Pant (Mgr.) HRD, Bharat Electronics, Ghaziabad for accepting my
letter and allowing me to complete my training in Bharat Electronics Limited.
I am extremely grateful to Mr. Jagdish Chand, (AGM, RADAR SBU), Mr. Dhyan Singh,
(Sr.DGM, RADAR SBU), Bharat Electronics, for permitting me to join CAR- RADAR
SBU.Further I would like to thank Ms Laxmi Chauhan, Mr. Ankur kumar for their timeto time guidance and help extended during each stage our project.
I am grateful to Mr. R.N. Tyagi, HRD to guide and help me throughout my project. It isnot without his help I could have been able to complete my training here. I would like to
express my deep satisfaction and gratitude for their support for their kind help extended
during the entire period of training.
Finally, I would like to thanks each and every member of BEL family for making me feel
comfortable and helping me in every possible manner.
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PREFACE
The six month training is a part of our B.Tech, Electronics and Communication. PracticalIndustrial Training mainly aims at making one aware of industrial environment; which
means that one gets to know the limitation, constraint and freedom under which an
engineer works. One also gets an opportunity to watch from close quarter that indicates
manager relation. This training mainly involves industrial and complete knowledge aboutdesigning, assembling and manufacturing process of various equipments manufactured
by an industry.
During this six month period, as a student, there is a great opportunity of understanding
Industrial practices. Most of the theoretical knowledge that has been gained during our
course is useful only if it can be applied to production and services in the industry. Thelearnt is applied, tested, verified and rectified. Apart from this the student gets an
opportunity to learn latest technology and is upgraded of the new trends immersing in the
industry of interest.
I had the opportunity to utilize my six month summer internship in BHARAT
ELECTRONICS LIMITED, GHAZIABAD [U.P.]. I was a part of the companys new
venture CAR, which provided me a great deal of learning. My sphere of knowledge wasexpanded both at technical and personal level. I not only got chance to work on Live
Project but also witnessed the related industrial processes and got acquainted to many of
the prevalent technologies.
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INTRODUCTION
OF BEL
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BHARAT ELECTRONICSLIMITED
INDUSTRY
Bharat Electronics Limited (BEL) was established in 1954 as a Public SectorEnterprise under the administrative control of Ministry of Defence as the fountain head tomanufacture and supply electronics components and equipment. BEL, with a noteworthy
history of pioneering achievements, has met the requirement of state-of-art professional
electronic equipment for Defence, broadcasting, civil Defence and telecommunications as
well as the component requirement of entertainment and medical X-ray industry. Overthe years, BEL has grown to a multi-product, multi-unit, and technology driven company
with track record of a profit earning PSU.
The company has a unique position in India of having dealt with all the generations
of electronic component and equipment. Having started with a HF receiver incollaboration with T-CSF of France, the company's equipment designs have had a long
voyage through the hybrid, solid state discrete component to the state of art integrated
circuit technology. In the component arena also, the company established its own electronvalve manufacturing facility. It moved on to semiconductors with the manufacture of
germanium and silicon devices and then to the manufacture of Integrated circuits. To
keep in pace with the component and equipment technology, its manufacturing andproduct assurance facilities have also undergone sea change. The design groups have
CADDs facility, the manufacturing has CNC machines and a Mass Manufacture Facility,
and Quality Control (QC) checks are preformed with multi-dimensional profilemeasurement machines, Automatic testing machines, environmental labs to check
extreme weather and other operational conditions. All these facilities have been
established to meet the stringent requirements of MIL grade systems.
Today BEL's infrastructure is spread over nine locations with 29 productiondivisions having ISO-9001/9002 accreditation. Product mix of the company is spread
over the entire Electro-magnetic (EM) spectrum ranging from tiny audio frequency
semiconductor to huge radar systems and X-ray tubes on the upper edge of the spectrum.
Its manufacturing units have special focus towards the product ranges like DefenceCommunication, Radar's, Optical & Opto-electronics, Telecommunications, Sound and
Vision Broadcasting, Electronic Components, etc.Besides manufacturing and supply of a wide variety of products, BEL offers a
variety of services like Telecom and Radar Systems Consultancy, ContractManufacturing, Calibration of Test & Measuring Instruments, etc. At the moment, the
company is installing MSSR radar at important airports under the modernization of
airports plan of National Airport Authority (NAA).
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BEL has nurtured and built a strong in-house R&D base by absorbing technologies
from more than 50 leading companies worldwide and DRDO Labs for a wide range ofproducts. A team of more than 800 engineers is working in R&D. Each unit has its own
R&D Division to bring out new products to the production lines. Central Research
Laboratory (CRL) at Bangalore and Ghaziabad works as independent agency toundertake contemporary design work on state-of-art and futuristic technologies. About
70% of BEL's products are of in-house design.
BEL was among the first Indian companies to manufacture computer parts and
peripherals under arrangement with International Computers India Limited (ICIL) in1970s. BEL assembled a limited number of 1901 systems under the arrangement with
ICIL. However, following Government's decision to restrict the computer manufacture to
ECIL, BEL could not progress in its computer manufacturing plans. As many of itsequipment were microprocessor based, the company continued to develop computers
based application, both hardware and software. Most of its software requirements are in
real time. EMCCA, software intensive naval ships control and command system is
probably one of the first projects of its nature in India and Asia.
BEL has won a number of national and international awards for Import Substitution,
Productivity, Quality, Safety Standardization etc. BEL was ranked no.1 in the field ofElectronics and 46th overall among the top 1000 private and public sector undertakings in
India by the Business Standard in its special supplement "The BS 1000 (1997-98)". BELwas listed 3rd among the Mini Ratanas (category II) by the Government of India, 49 th
among Asia's top 100 Electronic Companies by the Electronic Business Asia and within
the top 100 worldwide Defence Companies by the Defence News, USA.
BEL has production units established at different parts of the country. The year of
establishment and location are as follows:
Serialno. Year of establishment Location
1.
2.
3.
4.
5.
6.
7.
8.
9.
1954
1972
1979
1979
1984
1984
1985
19851986
Bangalore
Ghaziabad
Pune
Taloja (Maharashtra)
Hyderabad
Panchkula (Haryana)
Chennai
Machhilipathnam(A.P.)
Kotdwara (U.K.)
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Motto Mission and Objectives
The passionate pursuit of excellence at BEL is reflected in a reputation with itscustomers that can be described in its motto, mission and objectives:
CORPORATE MOTTO
"Quality, Technology and Innovation."
CORPORATE MISSION
To be the market leader in Defence Electronics and in other chosen fields and
products.
CORPORATE OBJECTIVES
To become a customer-driven company supplying quality products at
competitive prices at the expected time and providing excellent customersupport.
To achieve growth in the operations commensurate with the growth of
professional electronics industry in the country.
To generate internal resources for financing the investments required for
modernization, expansion and growth for ensuring a fair return to theinvestor.
In order to meet the nation's strategic needs, to strive for self-reliance by
indigenization of materials and components.
To retain the technological leadership of the company in Defence and other
chosen fields of electronics through in-house Research and development aswell as through Collaboration/Co-operation with Defence/National Research
Laboratories, International Companies, Universities and Academic
Institutions.
To progressively increase overseas sales of its products and services.
To create an organizational culture which encourages members of the
organization to realize their full potential through continuous learning on thejob and through other HRD initiatives?
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Manufacturing Units
Bangalore (Karnataka)
BEL started its production activities in Bangalore in 1954 with 400W highfrequency (HF) transmitter and communication receiver for the Army. Since then, the
Bangalore Complex has grown to specialize in communication and Radar/Sonar Systems
for the Army, Navy and Air Force. BEL's in-house R&D and successful tie-ups withforeign Defence companies and Indian Defence Laboratories has seen the development
and production of over 300 products in Bangalore alone. The Unit has now diversified
into manufacturing of electronic products for the civilian customers such as D.O.T.,V.S.N.L., A.I.R. and Doordarshan, Meteorological Dept., I.S.R.O., Police, Civil
Aviation, and Railways. As an aid to Electorate, the unit has developed Electronic Voting
Machines that are produced at its Mass Manufacturing Facility (MMF).
Ghaziabad (Uttar Pradesh)
The second largest Unit at Ghaziabad was set up in 1974 to manufacture specialtypes of radar for the Air Defence Ground Environment Systems (Plan ADGES). The
Unit provides Communication Systems to the Defence Forces and Microwave
Communication Links to the various departments of the State and Central Govt. and otherusers. The Unit's product range included Static and Mobile Radar, Tropo scatter
equipment, professional grade Antennae and Microwave components.
Pune (Maharashtra)
This Unit was started in 1979 to manufacture Image Converter Tubes.
Subsequently, Magnesium Manganese-dioxide Batteries, Lithium Sulphur Batteries andX-ray Tubes/Cables were added to the product range. At the present the Unit
manufactures Laser Sub-unit for tank fire control systems and Laser Range Finders for
the Defence services.
Machilipatnam (Andhra Pradesh)
The Andhra Scientific Co. at Machilipatnam, manufacturing optics/Opto-
electronic equipment was integrated with BEL in 1983. The product line includes PassiveNight Vision Equipment, Binoculars, Binoculars and Goggles, Periscopes, Gun Sights,
Surgical Microscope and Optical Sights and Mussle Reference Systems for tank firecontrol systems. The Unit has successfully diversified to making the Surgical Microscope
with zoom facilities.
To cater the growing needs of Defence Communications, this Unit was
established in 1985. Professional grade Radio-communication Equipment in VHF and
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UHF ranges entirely developed by BEL and required by the Defence services are being
met from this Unit.
Chennai (Tamil Nadu)
In 1985, BEL established another Unit at Chennai to facilitate manufacture of
Gun Control Equipment required for the integration and installation in the Vijayanta
tanks. The Unit is now manufacturing Stabilizer Systems for T-72 tanks, Infantry CombatVehicles BMP-II; Commander's Panoramic Sights & Tank Laser Sights are among
others.
Kotdwar (Uttarakhand)
In 1986, BEL started a Unit at Kotdwara to manufacture Telecommunication
Equipment for both Defence and civilian
Customers Focus is being given on the requirement of the Department of
Telecommunications to manufacture Transmission and Switching Equipment.
Taloja (Maharashtra)
For the manufacture of B/W TV Glass bulbs, this plant was established in
collaboration with coming, France in 1986. The Unit is now fully mobilized to
manufacture 20" glass bulbs indigenously.
Hyderabad (Andhra Pradesh)
To coordinate with the major Defence R&D Laboratories located in Hyderabad,DLRL, DRDL and DMRL, BEL established a unit at Hyderabad in 1986. Force
Multiplier Systems are manufactured here for the Defence services.
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Joint Ventures
BE-Delft Electronics Limited
BE-Delft Electronics Limited, Pune, the first joint venture of the company with
Delft Instruments, Holland and UTI was established in the year 1990 for conductingresearch, development and manufacture of Image Intensifier Tubes and associated high
voltage power supplies for use in military, security and commercial systems. Its products
include night vision goggles and binoculars, night vision weapon sights and low lightlevel input applications.
GE BE Private Limited
GE BE Private Limited, Bangalore, a JV with General Electric Medical Systems,USA has been established in 1997-98 for manufacture of High End Rotating Anode
Medical Diagnostic X-ray tube called CT MAX, which is used in CT Scanners. The joint
venture unit will also establish a reloading facility for X-ray tubes and will also marketthe conventional X-ray tubes made at Pune Unit of BEL. South East Asia markets are
addressed by this joint venture.
BEL- Multitone Private Limited
A joint venture between Bharat Electronics and Multitone Electronics Plc, UK hasalso been established in Bangalore in 1997-98 to manufacture state-of-art Mobile
Communication for the workplace. Multitone invented paging in 1956 when it developed
the world's first system to serve the "life or death" environment of St. Thomas Hospital,
London. With the strength of Bharat Electronics in the Radio Communications field andthe technology of Multitone, in the field of Radio Paging, the joint venture company is in
a position to offer tailor made solution to the Mobile Communication needs at workplace
in various market segments.
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Customer Profile & BEL Product Range
Equipment
Components
Defence Transmitting Tubes, Microwave Tubes, Lasers, Batteries,
Defence
Army Tactical and Strategic Communication Equipment and
Systems, Secrecy Equipment, Digital Switches, Battlefield
Surveillance Radar, Air Defence and Fire Control Radar,Opto-Electronic Instruments, Tank Fire Control Systems,
Stabilizer Systems, Stimulators and Trainers.
Navy Navigational, Surveillance, Fire Control Radar, IFF,SONAR Systems, Torpedo Decoys, Display Systems, EW
Systems, Simulators, Communication Equipment and
Systems.
Air Force Surveillance and Tracking Raiders, Communication
Equipment and Systems, IFF and EW Systems.
Non-Defence
Para-Military Communication Equipment and Systems.
Space Department Precision Tracking Radar, Ground Electronics, Flight andOn-Board Sub-systems.
All India Radio MW, SW & FM Transmitters.
Doordarshan
(TV Network)
Low, Medium and High Power Transmitters, Studio
Equipment, OB Vans, Cameras, Antennae, Mobile and
Transportable Satellite Uplinks.
NCERT TV Studios on Turnkey Basis for Educational Programs.
Department of
Telecommunications
Transmission Equipment (Microwave and UHF) and PCM
Multiplex, Rural and Main Automatic Exchanges, Flyaway
Satellite Terminals, Solar Panels for Rural Exchanges.
Videsh Sanchar
Nigam and other
Corporate Bodies
MCPC VSAT, SCPC VSAT, Flyaway Earth Stations. Hub
Stations, Up/Down Converters, LNA Modems
Civil Aviation Airport Surveillance Radar, Secondary Surveillance Radar.
Meteorological
Department
Cyclone Warning and Multipurpose Meteorological Radar.
Power Sector Satellite Communication Equipment.
Oil Industry Communication Systems, Radar.
Forest Departments,
Irrigation &Electricity Boards
Communication Systems.
Medical &Health Care Clinical and Surgical Microscope with Zoom, LinearAccelerators.
Railways Communication Equipment for Metros, Microwave RadioRelays, And Digital Microwave Radio Relays.
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Semiconductors-Discrete, Hybrid and Integrated Circuits.
Non-Defence
All India Radio,
Doordarshan
(TV Network),Department of Telecommunications
And Civil Industries
Transmitting Tubes, Microwave Tubes, and Vacuum
Tubes.
Entertainment
Industry
B/W TV Tubes, Silicon Transistors, Integrated Circuits,
Bipolar and CMOS, Piezo Electric Crystals, CeramicCapacitors and SAW Filters.
Telephone Industry Integrated Circuits, Crystals.
Switching Industry Vacuum Interrupters.
Instrumentation Industry Liquid Crystal Displays.
Medical &Health Care X-ray Tubes.
Systems/Network
Identity Card Systems Software, Office AutomationSoftware, LCD On-line Public Information DisplaySystems and Communication Networks / VSAT Networks.
Financial Performance
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BEL has a unique history of profit making Public Sector Enterprise right from its
inception. There have been events of decrease in turnover and profit after Tax due toreasons beyond reasonable control of the company. But the company's strength lies in its
capability to combat the threats, for example US Embargo on exports to BEL.
BEL hopes to generate 25 per cent increase in turnover with a 15 per cent rise in
net profit in the current fiscal year over the previous. Corrective measures against westernsanctions have been undertaken, which are likely to translate into higher turnover and
profitability. The company is putting all efforts to minimize the effect of the restrictions
by early establishments of alternative arrangements. The Defence Research Laboratoriesand Academic Institutions are also being persuaded with for indigenization of certain
special category of devices and components. The company is also opening an office in
Singapore to procure components from Asian markets. Thus in the long run therestrictions will prove as blessings resulting in self-dependence and better profit margins.
Also several R&D projects with long gestation periods will go into commercial
production during the current fiscal.
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Product Range
The product ranges today of the company are:
Radar Systems:
3-Dimensional High Power Static and Mobile Radar for the Air Force.
Low Flying Detection Radar for both the Army and the Air force.
Tactical Control Radar Systems for the Army
Battlefield Surveillance Radar for the Army
IFF Mk-X Radar systems for the Defence and Export
ASR/MSSR systems for Civil Aviation.
Radar & allied systems Data Processing Systems.
Communications: Digital Static Tropo scatter Communication Systems for the Air Force.
Digital Mobile Tropo scatter Communication System for the Air Force
and Army.
VHF, UHF & Microwave Communication Equipment.
Bulk Encryption Equipment.
Turnkey Communication Systems Projects for defence & civil users.
Static and Mobile Satellite Communication Systems for Defence
Telemetry/Tele-control Systems.
Antennae:
Antennae for Radar, Terrestrial & Satellite Communication Systems.
Antennae for TV Satellite Receive and Broadcast applications.
Antennae for Line-of-sight Microwave Communication Systems.
Microwave Component:
Active Microwave components like LNAs, Synthesizer, and Receivers
etc. Passive Microwave components like Double Balanced Mixers, etc
Most of these products and systems are the result of a harmonious combination of
technology absorbed under ToT from abroad, Defence R&D Laboratories and BEL's own
design and development efforts.
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Organization
The operations at BEL Ghaziabad are headed by General Manager with
Additional / Deputy General Manager heading various divisions as follows:
Design & Engineering Divisions :
Development and Engineering-R
Development and Engineering-C
Development and Engineering-Antenna.
1. Equipment Manufacturing Divisions :
Radar
Communication
Antenna
Systems
Microwave Components.
2. Support Divisions:
Material Management
Marketing & Customer Co-ordination
Quality Assurance & Torque
Central Services
PCB & Magnetics
Information Systems
Finance & Accounts
Personnel & Administration
Management Services.
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Design & Engineering:
The pace of development and technological obsolescence in their field of
electronics necessitates a strong Research and Development base. This is all the moreimportant in the area of Defence Electronics. BEL Ghaziabad has since its inception laid
a heavy emphasis on indigenous research and development. About 70% of its
manufacture today relate to items developed in-house. For the development and
production of the Mobile Tropo scatter System and the IFF equipment, BEL was awardedthe Gold Shield for Import Substitution.
Design facilities are also constantly being modernized and substantial computer-
aided design facilities are being introduced including installation of mini- and micro-
computers and dedicated design application. About 170 graduate and post-graduateengineers are working on research and development and indication of the importance
R&D has in BEL's growth.
Three Design and Engineering groups are product based viz. Communication,
Radar and Antenna. These divisions are further divided into different departments to lookafter products of a particular nature. Each of them has a drawing office attached to them,
which are equipped with latest drafting and engineering software. The PCB layout andPCB master making is done at CADDs Center. A central Records & Printing section takescare of the preserving the engineering documents and distribution thereof. Most of the
engineering documents are available online.
Equipment Manufacturing Divisions:
As a supplier of equipment to the Defence services and professional user, strictadherence to specifications and tolerances has to be in-built into the design and
manufacturing process. For this BEL Ghaziabad has well defined standards and processes
for as well as manufacturing and testing activities. Activities are divided into variousdepartments like Production Control, Works Assembly, and QC WORKS. The
manufacture and control of production is through a central system, BELMAC, BEL'sown homegrown ERP system.
Apart from conventional machines, BEL Ghaziabad has been equipped withseveral Computer Numerical Control (CNC) machines for ensuring repeat occurrences
and increased throughput. A separate NC programming cell has been set up to develop
the programs for execution on the CNC machines.
Microwave Component Group:
Frequencies greater than 1 GHz is termed as Microwaves. Microwaves Integrated
Circuits (MIC) used extensively in the production of subsystems for Radar andCommunication equipment constitutes a very vital part of the technology for these
systems and is generally imported. Owing to the crucial and building block nature of thetechnology involved, BEL is currently setting up a modern MIC manufacturing facility ata planned expenditure of Rs. 2 crore. When in full operation, this facility will be the main
center for the MIC requirements of all the units of the company.
The manufacturing facilities of hybrid microwave components available at BEL,
Ghaziabad includes facility for preparation of substrates, assembly of miniaturizedcomponent viz. directional couplers, low noise amplifiers, phase shiftier, synthesizers etc.
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involves scalar as well as vector measurements. For this state of the network analysis are
used.
Material Management:
Material Management division is responsible for procurement, storage handling,
issue of purchased parts as well as raw materials required to manufacture various
equipment and spares. It also takes care of disposal of unused or waste material.
The division is divided into Purchase, Component store, Raw material store,Chemical store, Inwards good store, Custom clearance Cell, Inventory management &
disposal.
Marketing and Customer Co-ordination:
This division is responsible for acquisition and execution of customer orders and
customer services. Marketing department looks after order acquisition. Commercialdepartment looks after order execution. Shipping takes care of packing and dispatch of
material to customer.
Quality Assurance & Torque:
In the area of professional Defence electronics, the importance of Quality andReliability is of utmost importance. BEL has therefore established stringent processes andmodern facilities and systems to ensure product quality- from the raw material to the
finished product. IGQA, Environmental Labs, Test Equipment Support and QA
departments are grouped under this division.
All material for consumption in the factory passes through stringent inward goodsscreening in IGQA department before being accepted for use.
Subsequent to manufacture and inspection, the end product is again put through a
rigorous cycle of performance and environmental checks in Environmental Labs.
The testing, calibration and repair facility of test Instruments used in the factory isunder the control of Test Equipment Support. All the instruments come to this department
for periodic calibration.
Quality Assurance department facilitates ISO 9000 certification of various
divisions. All production divisions of BEL Ghaziabad are ISO9000 certified. Themicrowave division is ISO9001 certified whereas the remaining three division viz. Radar,
Communication and Antennae are also ISO9002 certified.
Central Services:
Central services Division looks after plant and maintenance of the estate including
electrical distribution, captive power generation, telephones, transport etc.
PCB Fabrication & Magnetics:
PCB Fabrication, Coil and Magnetics, Technical Literature, Printing Press and
Finished Goods are the areas under this division.
Single sided PCB blanks- having circuit pattern only on one side of the board and
double sided - having circuit pattern on both sides of the board are manufactured in
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house. However, Multi-layered PCBs, having many layers of circuit, are obtained from
other sources.
Magnetic department makes all types of transformers & coils that are used in
different equipment. Coils and transformers are manufactured as per various
specifications such as number of layers, number of turns, types of windings, gap in core,
dielectric strength, insulation between layers, electrical parameters, impedance etc. laiddown in the documents released by the D&E department.
Information Systems:
IS Department is responsible for BEL's own home grown manufacturing and
control system called BELMAC. It comprises of almost all modules a modern
ERP system but is Host and dumb terminal based.
Finance & Accounts:
The F&A division is divided into Budget & Compilation, Cost and Material
Accounts, Bills Payable, Bill Receivable, Payrolls, Provident Fund, Cash Sections
Personnel & Administration:
There are at present about 2300 employees at BEL Ghaziabad, of which morethan 400 are graduate and post graduate engineers.
P&A Division is divided into various departments like Recruitment,
Establishment, HRD, Welfare, Industrial Relations, Security and MI Room.
Management Services:
This department deals with the flow of information to or from the company. It is
broadly classified into three major sub-sections - Management Information System,
Industrial engineering department and Safety.
Production Control
The main goals of the production control are:
To improve the profits of the company by better resource management
To ensure on-time delivery products
To improve the quality of product
To reduce the capital investment
To reduce working capital needs by better inventory management
Production control is responsible for producing the products, right from the stage
engineering.
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Drawings are received to the stage where it is store credited as finished product. Its
basic function is to identify the parts/operations to be made, the best way of makingthem, the time when they have to be made and to arrange the production resources to the
optimum.
The commercial department obtains orders from equipments through quotations. The
equipment stock order (ESO) is released by commercial department. Then the
management services department issues work order for the quantity of equipment to bemade. This is for the calculation for the cost of the project then D&E department
develops the equipment and releases the following engineering documents:
KS : Key Sheet
PL : Part List
GA : General Assembly Diagram
CL : Connection List
WL : Wiring Diagram
Now the production control takes the responsibility of manufacturing the equipment.
PC decides for items to be purchased from outside, for items to be manufactured by other
companies and prepares documents for items to be made inside the company.
Documents issued by the PC:
I. Process sheet (fabrication): This process sheet indicates the process and thesequence of operation to be followed in various work cells and work centers. Every
item is timed by productivity services.
II. Process sheet (Assembly): This is similar to PS (fabrication) except that it is
used in electronics assembly, PCB assemblies, cable form and cable assemblies.
III.Process sheet (coils): This indicates operation analysis for transformer and coils.
IV. Schedule for RM, fasteners and PPs: This gives the gross requirements for raw
materials, purchased parts, fasteners etc. Based on this material control department
initiates procurement action and store requisitions are released with reference to thisschedule.
Tool Planning
1. Some of the items while under fabrication require the use of some jigs and
fixtures.
2. The cost estimation, revenue and budget plans are got approved by the board of
management
3. Standard hour is approved by the department. This is the time, which is decided tocomplete the job by a worker in a stipulated time, which is decided on the
previous records of the shop, type of machine used and the nature of work.
4. Report on production value is evaluated for each unit.
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My Training in BEL, was attended in two phases. In first phase, I was given a
schedule to visit all the departments in BEL, relevant to my field of Electronics andCommunication. In this period of orientation, I visited different departments and was
introduced to the current technology used and the various industrial processes under
practice. In the second phase I was allotted a Project under Project Manager, Mr.
Chaturvedi (CAR- RADAR).
I am briefing my experience and observation about various departments of thecompany in next paragraphs.
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ROTATION
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ABOUT VARIOUS DEPARTMENTS
MICROWAVE INTEGRATED CIRCUITS
Frequencies greater than 1 GHz are termed as Microwaves. Microwave Integrated
Circuit used extensively in production of subsystems for Radar and Communicationequipment constitutes a very important part of technology for these systems are
generally imported. Owing to the crucial and building block nature of the technologyinvolved, BEL is currently setting up a modern MIC manufacturing facility at a planned
expenditure of Rs. 2 crore. When in full operation this facility will be the main center
for the MIC requirements of all the units of the company.
The manufacturing facility of hybrid microwave components available at BELGhaziabad includes facility for preparation of substrates, assembly of miniaturized
components on substrates, bonding and testing. Testing of these microwave
components viz. Directional couplers, Waveguides, low noise amplifiers, phaseshifters, synthesis etc. involve scalar as well as vector measurements. For this state of
the network, analyses are used. Various losses such as return loss, bending loss,
insertion loss are measured and testing is done in a way to minimize these losses.
MICROWAVE LAB
This section undertakes:
1. Manufacturing of films and microwave components to meet internal
requirements.
2. Testing of low power antenna for which test-site is about 100 Km from thefactory at sohna.
The main component testing in this department is:
Oscillators
Amplifiers
Mixers
Radiation elements (e.g. Feeders)
Microwave components (e.g. Isolators, circulators, waveguides etc.)
Filters (e.g. LPF, BPF, Uniplexers, and Multiplexers etc.)
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Functioning of component is listed below:
Frequency response
Noise figure
VSWR Directivity and coupling
Power measurements
Various instruments in the lab are:
Adaptor
Attenuator
Coupler
Mixer
Detector
ENVIRONMENTAL LAB
Various tests conducted in the environmental lab in BEL in order to ensure
reliability. Reliability is defined as the probability of a device performing itspurpose adequately for the period intended under the given operating conditions.
In a given system reliability is given as
R = R1 * R2 * R3
The standards available here are:
JSS55555 - Joint Services Specifications (Military Standard of India)
Mil Standards - U.S. Military standards
QM333 - Civil Aviation and Police
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TYPES OF TESTS
1. FIRST ARTICLE TEST (FAT)
These tests are performed on the prototype. If these tests are successful then the mass
production is taken up.
The tests are:
1. Vibration Test System2. High Temperature Operate and Storage
3. Low Temperature Operate and Storage
4. Damp Heat Operate and Storage
5. Altitude Chamber6. Bump Test Machine
7. Salt Fog Chamber
8. Tropical Storage9. Mould Growth Chamber
VARIOUS TESTS IN DETAIL:
1. Vibration Test SystemThe item is vibrated when kept over the plate of the machine. The frequency
Range is 1 to 2,000 Hz.
Radar PCBs are vibrated at 10 to 50 Hz at 2g (g=9.8m/s 2) for 15.
2. Humidity chamber
Used to test the product under varying humidity conditions.
For Navy instruments conditions for humidity are 95% at +45C for 16 hours.
3. Cold Heat
This chamber has a temperature of 90 to +180. This chamber program is
controlled and has an accuracy of +0.5 and has a graph plotting system.
4.Mould Growth
This chamber is used to test how immune the product is against mould growth.
5. Salt Spray
It is used to check the resistivity of the item produced against salty water.
6. Climatic Chamber
Temperature range of 65C to +200C and relative humidity is from 20%To 98%RH.
7. Walk In Chamber
This is a big chamber of size 2.6m, 2.4m, 3m Temp. range of 60C to
+100C and the humidity is from 20% to 90% RH.
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8. Bump Machine
Item is dropped from a certain height every time it receives bump fromMachine. Maximum capacity of the machine is 11.35 Kg. Drop height is
Around 1 inch.
9. Altitude Chamber
Used to test the item under different temperature and humidity conditions.
The temperature range for this chamber is from -40C to +150C and can createenvironmental conditions as per a height of 50,000 feets.
For airforce equipment the instrument is kept at a temperature of +40C for
30,000 ft and at 0C for 13,500 ft.
2. ACCEPTANCE TEST PROCEDURE
This sets on the extent to which a test is to be conducted and also decides what
tests should be conducted.
There are three types of tests:
a) Class A test: This test includes visual and dimensional checks. Allequipments of regular production go through these checks. These include
quality control and electrical tests.
b) Class B test: These are quality assurance and reliability tests. Only 10%of equipments go through these tests. They include quality control,
electrical tests and some environmental tests.
c) Class C test: These are carried out on 1% of the components. All theenvironmental tests are performed. If any failure is seen, the component
must be redesigned. Also the customer must be supplied with modified
goods. This test comes in picture for bulk production only.
FAILURE RATE GRAPH
Failure rate graph- It is the failure versus time graph.The infant morality is the critical period. It is due to:
Weak component
Manufacturing defect
This is the area where the producer tries to cover in the warranty period.
The repeated failures are detrimental to a companys reputation as these are eliminated byscreening while in manufacturing stage.
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The other screening is the stress screening method. This consists of:
a) HUMIDITY TEST: Humidity is created with the help of boilers and fans in the
chamber. Required temperature and duration of the tests are selected as per the
specified BEL standards.b) ALTITUDE TEST: The conditions such as very low temperature (created with
the help of cooling systems) and very low temperature and pressure (created with
the help of a vacuum pump) are maintained in a chamber. These conditions arecomparable to those at high altitudes where the products have to work.
c) AGEING AND THERMAL SHOCKS: One cycle of ageing is of 7 hours.
Ageing is done to relieve the stresses developed in the PCB due to blazing,
welding, riveting etc. The sample is first kept at ambient temperature (250 degreeCelsius) and then cooled to -400 degree Celsius.
d) BUMP TEST: The sample is given bumps in one direction only, with the help of
machine. The number of bumps to be given is set with the help of proper switches.The sample is operated after giving bumps. If it works properly, it is passed.
e) VIBRATION TEST:The sample is subjected to vibrations. Required frequency
and amplitude for vibrations is selected accordingly.
f) SALT SPRAY TEST: Salt solution is sprayed in a chamber. The specimens arehanged in the chamber. The test helps to decide any corrosion that takes place due
to spraying of solution.g) RAIN TEST: In this test, conditions are created such that the sample is made to
bath in heavy rain, so that if any problem arises in the sample due to rain that can
be sorted accordingly.
h) DROP TEST : The sample is made to survive in such a environment where thereis possibility of snow fall. Such conditions are created in a chamber, to sort out any
problem arises due to this.
i) ROADABILITY TEST: While doing bump test, bumps are given to the samplein unidirectional only. But in the roadability test, bumps are given to the sample in
all the directions. It means that the test is being carried, considering the device tobe moving in a zigzag manner on an uneven road. For e.g. in sand or in water etc.This test helps to make out any fault or loosening of components while moving the
specimen from one place to another.
j) BOMB TEST: This is a test conducted for special types of samples. In this the
samples are exposed to a situation like a bomb blast and it is checked whether thesample is able to bear the bomb explosion.
WALK IN CHAMBER
A very huge used for conducting humidity and temperature tests. The size of the
chamber is such that a person can easily walk into it. It is for large sized specimens.
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PCB FABRICATION
PCB is abbreviated form of printed circuit board. As the name suggests, in a PCBthe electrical circuit is printed on a glass epoxy board. This reduces the complex writing
network whose trouble shooting in case of shorting or misconnection is not easy.
PCB fabrication is mostly done for house requirements. It also takes some external jobs.
Types of PCBs
Single Sided: Having circuit pattern only on one side of the board.
Double Sided: Having circuit pattern on both sides of the board.
Multilayered: Having many layers of circuit.
BEL Ghaziabadproduces only single-sided and double-sided PCBs.
FABRICATION OF SINGLE SIDED PCBs:
1. A copper clad sheet is taken. It is cleaned and scrubbed.2. The sheet is laminated with a photosensitive solution.
3. Positive photo paint of the required circuit is placed over the laminated sheet and
it is subjected to the UV light. As a result the transparent plate gets polymerizedand the opaque part remains unpolymerized.
4. The plate is now dipped in solution in which the non-polymerized part gets
dissolved.5. Tin plating is done on the tracks obtained.
6. Lamination of the plate is removed (stripping).
7. The unwanted copper from the plate is also removed by dipping it in the solutionthat dissolves copper but not tin (etching).
8. Now drilling is done on the paths where the components are to be mounted. Thisprocess fabricates PCB.
P C B MANUFACTURING PROCESS:
1. Copper clad
2. Drill location holes3. Drill holes for T.H.P. (Through Hole Plating)
4. Clean scrub and laminate
5. Photo print
6. Develop7. Copper electroplate
8. Tin electroplate
9. Strip film10. Etch and clean
11. Strip tin
12. L.P.I.S.M. (Liquid Photo Imageable Solder Mask)13. Photo print
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14. Develop
15. Thermal baking16. Hot air level
17. Legend marking/Reverse marking
18. Route and clean
But these PCBs have the following disadvantages:
Due to very narrow spacing between adjacent tracks, there may be a chance
of short circuit if the soldering is done by hands between the components on
opposite side.
Moisture or dust between the gaps may disrupt smooth soldering.
These disadvantages are overcome by soldered mask PCBs. in the later one an additional
film is put on the earlier fabricated PCB, leaving points where components are to be
soldered.
TEST EQUIPMENT & AUTOMATION
TEST EQUIPMENT SUPPORT (TES)
Main functions are:
Develops technical support to other departments.
Repair of equipment in case of failure.
Maintenance of equipments.
Periodic calibration of equipments.
Provide technical support to other departments. This includes:
1. Handling requests from the other department for equipments.2. Storage of rejected equipments.
3. Approval of equipments to be purchased.
This section deals with testing and the calibration of electronic equipments only the
standards of this department are calibrated byNational Physics Laboratory (NPL).
AUTOMATION TEST EQUIPMENT (ATE)
1. Component testing gives faults of various discrete components of a PCB.
2. Integrated circuits tester tests various ICs.
3. Functional testing compares output to decide whether the function is being
performed to the desired level of accuracy.
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WORKS ASSEMBLY
This department plays an important role in the production. Its main function is toassemble various components, equipments and instruments in a particular procedure. It
has two sections, namely:
1. PCB assembly2. Electronic assembly
In PCB assembly, the different types of PCB are assembled as per BEL standards. PCB isreceived from the PCB department on which soldering of component is done either by
hand soldering orwave soldering.
HAND SOLDERING: In case of hand soldering, soldering is done manually.
WAVE SOLDERING: Wave soldering is a procedure in which PCBs are fed to
the wave soldering machine from the opening on one side
and the soldering is done by machine and after the
soldering is done PCBs are collected from the anotheropening of the machine and after that cleaning is done.
The PCBs are than send to testing department for testing according to the product
Test procedure issued by the D&E department. After testing PCBs are lacquered and
Send to the planning store for storage.
In electronic assembly, the cable assemblies, cable forms modules, drawers, racks
and shelters are assembled. Every shelter (e.g. - DMT) is made of racks, racks are madeup of drawers, drawers are made up of modules and modules are made up of PCBs,
cable assembly and cable forms.
Every module or drawer before using in next assembly is sent for testingaccording to their PTP. Shop planning collects the purchase from the IG store, takes
fabricated parts, PCBs etc. from planning stores and issued to the assembly department
as per the part list of the assembly to be made.The documents issued to the assembly are:
KS : Key Sheet
PL : Parts List
CL : Connection List for cable form
WL : Wiring List for modules
WD : Wiring DiagramGA : General Assembly diagram
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This department has been broadly classified as:
1. WORK ASSEMBLY RADAR e.g. : INDRA-2 , REPORTER ,CAR
2. WORK ASSEMBLY COMMUNICATION e.g. : EMCCA , MSSR , MFC
EMCCA: EQUIPMENT MODULAR FOR COMMAND CONTROL APPLICATION
MSSR: MONOPULSE SECONDARY SURVEILLANCE RADAR
MFC: MULTI FUNCTIONAL CONSOLE
The stepwise process followed by work assembly department is:
1) Preparation of part list that is to be assembled.
2) Preparation of general assembly.3) Schematic diagram to depict all connection to be made and brief idea about all
components.
4) Writing list of all components.
METHOD OF PCB PROCESSING
1. Tinning2. Preparation
3. Mounting
4. Wave soldering5. Touch up
6. Quality control
7. Ageing8. Testing
9. lacquering (AV)10. Storing
SURFACE MOUNTING TECHNOLOGY
The works assembly has a totally computerized section of PCB assembling of SMD(Surface Mounting Device). In this section the operation of PCB assembling is totally
controlled by computers. The various steps taken in computer PCB assembling of SMDs
are as follows:
1. Application of solder paste: Solder paste is applied onto the places on PCB
where the SMDs are to be soldered. This is done by computer controlledmachine. The program is loaded in the machine; it reads the program and applies
the solder paste at the required place.
2. Fixture of SMDs:a) The SMDs are fixed at the right place on PCB by another computer
controlled machine.
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b) The components (SMD) are first fed to various feeder lines that are
attached to the machine and the related software and program is loadedin computer.
c) There is a provision for a camera also so that we can monitor the entire
operation.d) The PCB is then fed to the machine.
e) When the appropriate command is given to the computer, it initiates
the machine attached to itf) The machine picks the correct SMD from the feeder line and fix it at
the right place on the PCB and within seconds all SMDs are fixed on
the PCB.
3. Thermal Baking: After the fixture of SMDs, thermal baking is done. In this
the PCB is fed to the oven and after 10 to 20 minutes PCB is taken out.
NOTE: Surface Mounting Device (SMD) does not require any hole on PCB as
they are mounted directly on the PCB. The pins of SMD components are called
legs as they have leg like structure unlike simple components that have straight
pins that are soldered in the holes on the PCB manually.
SHOP ORDER
Process Sheet (assembly)
All operations fill the work order and shop order in operators time card
(OTC). They punch the time of starting the job and its finishing time. By thisproductivity services calculates the time taken to complete the job.
Efficiency = time allotted in shop order
X 100
Actual time takenTime allotted is so called standard hours.
This deals with the assembly of common projects e.g. DMT, 2 GHz radio relay, Mobile
tropo, Static RRD etc.
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MAGNETICS
This department manufactures all types of transformers and coils that are used in
various equipments manufactured by BEL. This department basically consists of four
sections:1. Planning section
2. Mechanical section
3. Moulding section4. Inspection section
The D&E department gives the following descriptions to the magnetics department.They are as follows:
Number of layers
Number of turns
Type of winding
Gap in core
Insulation between layers
Ac/dc impedance
Dielectric strength
Electrical parameters and
Earthing
The various transformers being made are:
Open type transformer
Oil cooling type transformer
Moulding type transformer
PCB moulding type transformer
The transformer is mechanically assembled, leads are taken out and checking ofspecification is done.
Winding machines are of three types:
Heavier ones- DNR for 0.1 to 0.4 mm diameter
LC controlled machines
Torroidal machines having 32 operations from winding to mechanical assembly.
The various types of windings used are:
Hand winding
Torroidal winding
Sector winding
Pitch winding
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Variable pitch winding
Wave winding
Two main types of core used are:
E-type for 3-phase
C-type for single phase
Following procedure involved in the manufacture of the transformer is as follows:
1. Formers of glass epoxy
2. Winding
3. Core winding4. Varnishing
5. Impregnation In this process various varnished coils are heated, then
cooled, reheated and put into vacuum. Then air is blown to remove the
humidity.6. Moulding Araldite (a certain type of strong glue) mixed with black dye is
used to increase mechanical as well as electrical strength. Moulding is done
at 120 degree Celsius for 12 hours.A RDB compound is used for leakage protection. Oil is then boiled at 70 to
80 degree Celsius under vacuum condition to remove air bubbles trapped
inside during manufacturing process. After this the coils are dipped invarnish and core is attached.
7. Painting
8. Mechanical assembly9. Termination
10. Stenciling
11. Testing Dielectric testing (both ac/dc) is done at 50 KV voltage
is applied for a minimum of one minute. During inspection, the followingcharacteristics are checked:
a. Turns ratiob. DC resistance for each coil
c. Inductance
d. No load voltagee. Leakage
This section the material used for making transformer is Bakelite comprising maleand female plates which are joined alternately to form a hollow rectangular box on which
winding is done. Winding is done with different material and thickness of wire. The
winding has specified number of layers with each layer having a specified number ofturns. The distance between the two turns should be maintained constantly that is there
should be no overlapping. The plastic layer is inserted between two consecutive layers.
Types of Windings:
1) Layer Winding
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2) Wave Winding
3) Bank Winding
Different types of windings are done to control some parameters such as inductance andcapacitance. Varying the spacing between the two turns can vary these parameters.
Two consecutive turns act as capacitor. As gap between the turns increases the
capacitance decreases and inductance increases. Since capacitance is inversely
proportional to the gap between the plates of capacitor and inductance is directlyproportional. After winding the core is inserted between the primary and secondary.
Contact leads are taken out and molding is done for maximum heat dissipation.
Rubber solution is used to give strength to the wires, so that they cannot break. Thisis done before molding. Varnishing is done as anti fungus prevention for against
environmental hazard. After compilation of manufacturing process it is sent for
testing. Different parameters such as inductance, capacitance efficiency, turns ration,continuity are tested.
QUALITY CONTROL WORKS
According to some laid down standards, the quality control department ensuresthe quality of the product.
The raw materials and components etc. purchased are inspected according to the
specifications by the IG department. Similarly QC works department inspects all theitems manufactured in the factory.
The fabrication inspection checks all the fabricated parts and ensures that these
are made as per the part drawing. Plating, Painting and stenciling etc are done and
checked as per the BEL standards.The assembly inspection department inspects all the assembled parts such as PCB,
cable assembly, cable form, modules, racks and shelters as per latest documents and BEL
standards.The mistakes in the PCB can be categorized as:
D&E mistake
Shop mistake
Inspection mistake
A process card is attached to each PCB under inspection. Any error in the PCB is
entered into the process card by certain codes specified for each error or defect.
After mistake is detected, following actions are taken:
Observation is made.
Object code is given.
Division code is given.
Change code is prepared.
Recommended action is taken.
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RADAR ASSEMBLY
This deals with the assembly of RADARS, e.g. INDRA-I, INDRA-II, FLY
CATCHER, EMMCA, IRMA, REPORTER, CAR etc.
The main projects under construction are:
CAR
In RADAR section RADAR being tested is REPORTER, FLY CATCHER,
EMCCA, etc.
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PROJECT
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PROJECT : RADAR (RADIO DETECTION AND RANGING)
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PROJECT: AN OVERVIEW
RADAR AND ITS COMPOSITE
ENVIRONMENT
INTRODUCTIONNTRODUCTION
The two most basic functions of radar are inherent in the word, whose letters stand for
RAdio Detection And Ranging. Measurement of target angles has been included as a
basic function of most radar, and Doppler velocity is often measured directly as a fourth
basic quantity. Discrimination of the desired target from background noise and clutter is aprerequisite to detection and measurement, and resolution of surface features is essential
to mapping or imaging radar. The block diagram of typical pulsed radar is shown in
Figure. The equipment has been divided arbitrarily into seven subsystems, correspondingto the usual design specialties within the radar engineering field. The radar operation in
more complex systems is controlled by a computer with specific actions initiated by a
synchronizer, which in turn controls the time sequence of transmissions, receiver gatesand gain settings, signal processing, and display. When called for by the synchronizer,
the modulator applies a pulse of high voltage to the radio frequency (RF) amplifier,
simultaneously with an RF drive signal from the exciter. The resulting high-power RFpulse is passed through transmission line or waveguide to the duplexer, which connects it
to the antenna for radiation into space. The antenna shown is of the reflector type, steered
mechanically by a servo-driven pedestal. A stationary array may also be used, with
electrical steering of the radiated beam. After reflection from a target, the echo signalreenters the antenna, which is connected to the receiver preamplifier or mixer by the
duplexer.
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A local oscillator signal furnished by the exciter translates the echo frequency to one or
more intermediate frequencies (IFs), which can be amplified, filtered, envelope orquadrature detected, and subjected to more refined signal processing. Data to control the
antenna steering and to provide outputs to an associated computer are extracted from the
time delay and modulation on the signal. There are many variations from the diagram ofFigure that can be made in radars for specific applications, but the operating sequence
described in the foregoing forms the basis of most common radar systems. This project
provides the basics of radar and many of the relationships that are common to most formsof target-detection radar. The emphasis is on the goals established for the radar or the
system that contains the radar.
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SYSTEM
DEFINITION
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CENTRAL ACQUISITION
RADAR
INTRODUCTION
The designed Radar would be a stand-alone all weather 3D surveillance radar. The radar
operates in S-band and is capable of Track-While-Scan [TWS] of airborne targets up to130 Kms, subject to line-of-sight clearance and radar horizon. The radar employs
Multibeam coverage in the receive mode to provide for necessary discrimination in
elevation data. It employs 8 beams to achieve elevation coverage of prescribed margin
and a height ceiling of prescribed margin. The antenna is mechanically rotated in azimuthto provide 360 coverage. To get an optimum detection performance against various class
of targets, different Antenna Rotation Rate [ARR] RPM modes are implemented and
these can be selected by the operator.
The unique feature of the radar is, its operation is fully automated and controlled from a
Radar Console with sufficient menus, keys and Hot keys. The designed Radar is anoffshoot of the fully and successfully developed and demonstrated radar called as 3D
Central Acquisition Radar (3D-CAR).
3D-CAR is designed to play the role of medium range surveillance radar mounted on a
mobile platform. The radar carries out detection, tracking and interception of targets withan RCS of 2m2 upto 130 Kms in range.
The antenna can be manually positioned at different look angles in steps. In the receivemode the eight beams cater for a height coverage of required margin. The IFF antenna is
placed atop the main antenna and it integrates the IFF for including of IFF data with the
Primary Radar Data.
The RDP (Radar Data Processor) is implemented on a SBC and is fully software-based
system with adequate memory and external interfaces to handle upto 150 target tracks.Robust algorithms for filtering are used to lock on to maneuvering target upto 6g without
loss of tracking.
LAN interfaces are used to communicate with external systems. High-speed data transfer
of target parameters can be done. This helps in data remoting upto a distance of 500 mtrs
that can be extended with suitable repeaters. Facility for manual track indication for low
speed targets and targets in heavy clutter zones are available to the console operator.
The color display has features for monitoring of radar performance, the radar output
selection for radar modes of operation. Interfaces to radar control signals are built-in. The
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Radar generates different videos viz., Analog and Digital videos at the Receiver and
Signal Processor. These are interfaced to the display over dedicated lines and displayedIn addition to providing real time data on screen for viewing, the consoles will provide
facility for training controllers/operators/ technical crew. The system is capable of
creating targets and assigns values for range, azimuth, height and speed as defined byoperator. It will enable the operator to control the motion of these targets for gaining/
loosing height, turning left/right, cruising, and rolling out. The software running on
console will provide an online handy aid, for target interception. The training part of thesoftware will be active as an offline facility or with tracked targets in real time. The
offline mode will be capable of using recorded data.
Salient features Radar are:
1. 3D Surveillance Radar2. S-BAND
3. Capable of Track While Scan (TWS) of airborne Targets upto 150 Kms
4. Coherent TWT based Transmitter
5. Planar Array Antenna with low side lobes6. Multiple beams in the receive mode.
7. ECCM (Side lobe blanking, Frequency Agility, Jammer analysis)8. Integrated IFF
9. System operation is controlled from Radar Console in Data centre.
10. Redundant Power supply unit with UPS backup.
I have been working in Transmitter section of CAR developed by BEL, Ghaziabad.
Before explaining the technical details of Transmitter of Radar, it is necessity to
understand the general working of Radar.
This designed Radar has the following subsystems:
1. Multi-beam Antenna system
2. Transmitter
3. Receiver
4. Signal Processor5. Radar Console
6. Data centre
7. Mobile Power Source8. IFF System
The Multi beam antenna system for Radar is planned to be realized to have 360Coverage in Azimuth and prescribed coverage in elevation. The antenna will have a widebeam in transmit mode and eight simultaneous narrow beams in receive mode to give
prescribed coverage in elevation.
The requirement of Transmitter is to amplify the pulsed RF signal from few watts to high
power RF signal while maintaining the phase noise (additive noise) to its minimal as
demanded by the system.
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The Low Power Microwave Subsystem includes the major portion of Receiver RFSystem of the 3D-Radar. The Multibeam Antenna receives the reflected signals from the
target. These signals are amplified by the Low Noise Amplifier, down converted to IF
Frequency using two-stage superheterodyne receiver. The IF Output is given as finaloutput of the Low Power Microwave Subsystem to be further processed in the signal
processor.
Customization of the console for user application will be carried out in the software andhardware. The Display Console is the operator's center to initialize, remotely setup,
operate, observe, and diagnose the radar, both online and offline. The Primary and
secondary radar video, target tracks, plots, geographical map along with other diagnostic
and configuration messages are presented in 2D.The Signal Processor for Radar is realized as 8 parallel and identical channels. Each
Signal Processor accepts IF videos from the corresponding RF Receiver channel (8
beams + 1 Omni) and provides detection reports to the Radar Data Extractor (RDE)independently for these 8 channels. The detection reports for each channel must have
range and strength information in addition to the associated flags. Jammer data is also to
be reported. Configuration and mode control, diagnostics and status reporting are done
through a Radar Controller (RC).The electronic equipment cabin is provided for installation of transmitter, signal
processor, receiver, display console, IFF equipment and a working place for maintenance.The Data centre is required to provide basic functions like viewing of the air picture,
remote operation of radar, and radio communication. At the same time the cabin provides
shelter for the operators, with reasonable level of comfort and, protected against heat, rain
and dust.Mobile power source is required to provide the main supply to Radar and Data Centre for
electronic and mechanical units of Radar including air conditioning units.
The Identification Friend or Foe (IFF) system is a good example of a secondary radarsystem that is in wide use in the military environment. A great deal of valuable
information can be provided to the secondary radar by the targets transponder. Thetransponder provides an identifying code to the secondary radar that then uses the codeand an associated data base system to look up aircraft origin and destination, flight
number, aircraft type and even the numbers of personnel onboard. This type of
information is clearly not available from a primary radar system.
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TRANSMITTER
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TransmitterINTRODUCTION
The transmitter for Radar is Coherent MOPA type that operates in S Band using TWT asthe final amplifier. The transmitter is used to amplify the pulsed RF signal from low
power RF signal to High power RF signal as demanded by the system. TWT dissipates
large amount of energy, therefore it is subjected to both air and liquid cooling.
The input to the transmitter is 3 phase, 415V, 50 Hz, which is later amplified to the
optimal value for driving the TWT amplifier.A generalized diagram here briefly explains the inputs and outputs of the transmitter.
Input output diagram of Transmitter
3-phase,400V,50Hz
3-channel liq cooling in
3-channel liq cooling out
Air cooling in
SP signals
Air cooling out
Dry air
BIT0
BIT1
PRETRG
GRID PULSE
RF outROHINI
TRANSMITTER
RF input
System status
RF PULSE
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The transmitter is designed to operate in the following modes defined as adequate
controlled states
Transmitter modes
a) OFF : All subsystems switched OFF
b) Cold Standby : Only LVPSUs , TWT heater and Grid biases areswitched ON. No High Voltage applied.
c) Hot Stand By : High Voltages applied, No RF and No gridPulsing.
d) Transmission : RF power delivered to Antenna / Matched load.
i) Full Power mode : Full RF Power delivered to theAntenna
ii) Reduced Power mode : The transmitter is operated at 1/10 of
its full power based on the selection by theuser.
iii) Fail safe mode : A low power at required duty
delivered to antenna through Solid StatePower Amplifier when liquid cooling fails.
Modes are selected by the operator.
Transmitter control
a) Local : To control through control panel on the
transmitter.
b) Remote control : To control from the operator console through
control interface RS422.
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MECHANICAL DESCRIPTION
Three rack configuration of Transmitter describes complete functionality of
Transmitter
1. Control Rack
Monitoring panel
Control panel
Synoptic panel
CPC
Inverter
2. High Voltage Rack
FDM (Solid state Switching)
Cathode Assembly
Collector Assembly
Blower Unit
Heater Unit
3. Microwave Rack
TWT
RF Plumbing
RF Drive Unit
SSPA
ION Pump Controller
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GENERAL DESCRIPTION
The Transmitter amplifies the pulsed RF signal from few Watts to many KW while
maintaining the phase noise (additive noise) to prescribed margin as demanded by the
system. In addition, a Solid State Power Amplifier (SSPA) is provided, as a stand byoption, to ensure fail-safe mode, in case of failure of liquid coolant.
It employs a Traveling Wave Tube as final power amplifier. Low power amplifier stage(RF Driver) amplifies pulsed RF signal from 1mW (0 dBm) to few W which is necessary
to drive the TWT amplifier.
The RF Driver stage uses a PIN attenuator transistor followed by power amplifiers to
amplify RF signal. This is followed by an isolator. The isolator protects the transistor
power amplifiers against excessive reflections from TWT. The signal is thereafter passed
through a DC, a RF switch and an attenuator to cater for the three transmission modes.The sampled output of the DC is used for monitoring the input RF signal to the TWT.
The RF Driver output is given to the input of TWT, which amplifies the pulsed RF signal
from few Watts to a level of many kW at the TWT output. High power RF plumbingcomponents are connected at the output of TWT.
The TWT output is given to an arc detector followed by a ferrite circulator. The Ferrite
circulator is used to protect the microwave tube against failure /damage due to reflected
power in case of excessive VSWR at Antenna input port. The output of
Ferrite Circulator is given to High Power Dual Directional Coupler (DDC), which is used
for measuring the transmitted and reflected power. If reflected power exceeds the
specified limit of VSWR, a video signal is generated to cut off the RF drive throughcontrol and protection circuit.
The output of the DDC is given to Antenna. To connect all the components in therequired form, flexible sections, E-bends, H-bends and straight sections are used.
Control and Protection Circuit ensures the sequential switching ON of the transmitter,
continuous monitoring and interlocking of various parameters, detection and indication oferrors.
All these are achieved by dedicated hardware and software.
Synoptic Panel consists of LEDs, switches and LCD display. LEDs are used to show the
status of the transmitter. They also show the fault, if any, in the transmitter. The LCDdisplay, mounted on Synoptic panel, is used to show the value of cathode voltage &
current, collector voltage and current. It also displays the Filament voltage and current,
Grid + ve and -ve voltages and RF forward power.
The Inverter unit converts the incoming ac supply to DC and then converts the DC to
high frequency AC (Pulse width controlled square wave) operating at 20 kHz. The outputof the Inverter unit is given to HV rack for generation of Cathode and Collector voltages
of the TWT amplifier.
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High Voltage Power Supply unit (HVPSU) is used to supply high voltage to collector and
cathode of the TWT.
The Floating Deck Modulator (FDM) unit generates filament voltage with surge current
protection and also generates grid +ve and grid -ve voltages. Switching of grid voltage asper pulse width and PRF requirements are also provided by FDM.
Cooling Unit is used to cool the various components of the transmitter. The TWT, HighPower Ferrite Isolator, high Voltage Power supplies and RF dummy load are cooled with
de-ionized water and ethylene glycol mixture.
Forced air-cooling is employed to cool other components using ambient air which isfiltered to ensure dust free air. The Dry Air unit ensures that the wave guide is at all times
pressurized and dry.
RF DRIVER TWT
FIL., GRID, CATHODE,
COLLECTOR SUPPLY
COUPLER
FWD AND
RFLECTED
PWR MONITOR
LIQUID COOLING
TOANTENNA
SSPA
W/G
SWITCH
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DETAILED DESCRIPTION
Control Rack
Control Rack provides the protection controls and indications. As mentioned before, this
rack is divided in five sections according to their functions.
1. Monitoring Panel
The Monitoring Panel provides monitoring ports for measuring of trigger signals to the
transmitter, liquid cooling status, collector and cathode Inverter currents and bridge
voltages. It provides an emergency switch OFF button and digital displays for collectorand cathode voltages.
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2. Control Panel
The control panel controls the power supplies of various units such as the fans, heater,
LVPSU, Inverter, Modulator, RF Drive Unit and SSPA. The hour meters for filament,EHT and RF are also placed on the control panel.
3. Synoptic Panel
Synoptic Panel is located above the Control and Protection Circuit (CPC). It indicates the
faults and status signals generated by CPC. Green LEDs represent status signals whileRed LEDs represent faults. Audio alarms are also provided to indicate faults.
4. Control and Protection Circuits
The CPC ensures the sequential switching ON/OFF of the transmitter, continuous
monitoring and interlocking of various parameters, detection and indication of errors.
CPC card Configuration comprises of ten different cards.
COMPARATOR CARD-I
COMPARATOR CARD-II
TO RADAR
CONTROLLER
CPC BLOCK DIAGRAM
COMPARA
TOR
CARD
S
EHT VOLSAMPLES
RF PARAMETERS
OPTICAL
LINKS&
F/V CARD
GRID VOL
SAMPLES
FIL
VOL & ISAMPLES
OPTO
ISOLATO
RCA
RD
SSPA
CTRL
CARD
COOLING
CONDITIONS
TIMING
CARD
RADARTIMINGS
SWITCH ON
COMMANDS
TO SOLID
STATE RELAYSFOR HV, MAINS ON
STATUS STATUS
FRONT
PANEL
WITH
SWITCHES,LED
& LCDDISPLAY
LCD
INTERFACE
SWITCH ON
COMMANDS
HV POWERSUPPLIES
EHT PROBES
CROW BAR
TWT
LIQUID
COOLINGUNIT
FLOATING
DECKMODULATOR
AT - 45KV
POWER
DISTRIBUTION
3 50Hz400V AC IN
RF DRIVER&
DIR COUPLERS
EHT CURRSAMPLES
BEAM CURR,COLL CURR
CATH CURR
INPUT
POWERSTATUS
CROW BAR SIGNAL
GRID
PULS
E
MICRO
-
CONT
ROLLER
CARD
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COMPARATOR CARD-III
TIMING CARD
SSPA CTRL CARD
F TO V CARD
OPTPISOLATOR CARD
MC-I CARD
MC-II CARD OPTO TRANSCEIVER CARD
5. Inverter
The Inverter is the main functional block of the (cathode/collector) HV Power supplies. A
number of indicators are placed on the front panel of the Inverter unit.
AC-DC CARD
CATHODE PROTECTION CARD
CATHODE IGBT DRIVER CARD
COLLECTOR PROTECTION CARD
COLLECTOR IGBT DRIVER CARD
SOFT START CARD
TEMPERATURE SENSOR CARD
ZENER CARD (For Cathode and Collector)
CURRENT SENSOR CARD (For Cathode and Collector)
CURRENT SENSOR (PEAK) CARD (For Cathode and Coll.)
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High Voltage Rack
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This is central block of the transmitter, where cabins for HV Cathode and Collector are
assembled. Above this is a FDM block where all the cards are installed and insulated
from the transmitter that works on HV.
As mentioned earlier, High Voltage Rack is divided in five more units. Each unit has itsdefined working.
1. FDM (Floating Deck Modulator)
Further in FDM there seven functional cards, which are as follows:
LVPS Card
Grid Bias Card Positive Grid Supply Card
Switch Card
Filament Supply & Timer Card-1 Filament Supply & Timer Card-2
V to F Card
Isol
ation
transfor
mer
230V- ph-ph
50HzFDM
FIL
GRID
CATHODE
Fil Voltage
Fil Current
Grid Positive
Grid negative
To CPCOptical links
To TWT
Grid PulseFrom CPC
Optical link
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Microwave Rack
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The functional block diagram of microwave unit is shown in the figure. The microwaveunit consists of the following functional assemblies:
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Low power amplifier [RF drive unit]
High power TWT amplifier
RF Plumbing, Wave-guide switch & dummy load
Solid state power amplifier (2 kW) for low power transmission mode
TWT ion pump supply
Resistive TWT anode divider
Microwave power measurement circuits
Air cooling components
Low Power Driver for TWT (RF Driver)
Low Power amplifier stage (RF Driver) amplifies pulsed RF signal from 1mW (0dBm) to
few Watts power, necessary to drive the TWT amplifier. This low power RF Driverconsistsof following stages:
(a) Transistor Power amplifier : Amplifies the Pulsed signal from
0dBm to 37dBm
(b) Separating isolator : Used to protect the transistor power amplifieragainst excessive reflections
from TWT.
(c) Directional Coupler : To monitor the power available at the input TWT.
Figure given below shows the Input and output diagram of RF Driver
High Power Microwave Stage
High Power Microwave consists of mainly TWT, which amplifies the pulsed RF signal
received from the RF Driver of few watt power to a level of 120 -185 KW at the TWT
RF DRIVER
To SSPA i/p
To TWT i/p
To CPC for RF drive failprotection
TWT drive MONITOR
RF IN
Control i/p from
CPC
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output followed by High Power RF plumbing components. Figure given below shows
the block diagram of high power chain.
High Power RF stage consists of:
Traveling Wave Tube (TWT)
Ferrite Circulator
Dual Directional Coupler (DDC)
High Power dummy load
Wave guide channel
Wave guide switch
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Traveling Wave Tube (TWT)
TWT is available in three different constructs, these are listed here:
1. Helix TWTs
These amplify relatively to low power levels, but it provides a very wide bandwidth, both
in octave and multioctave.
2. Ring Loop / Ring Bar TWTs
These amplify at relatively high power levels, and provide a wideband, that is of 25 % ofbandwidth.
3. Coupled Cavity TWTs
This TWT in family of TWTs provides highest amplified power levels. It has relatively
narrower bandwidth that is 10% to 15 % of bandwidth.
TWT is the main power amplifier used in the transmitter. A coupled cavity TWT type is
selected for this transmitter.
The collector in the TWT is further divided as:
1. Ground collector
2. Depressed collector
Single stage depressed collector
Double depressed collector Multi stage depressed collector
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Ferrite circulator
Ferrite circulator is used to protect the microwave tube against failure / damage due to
reflected power in case of excess VSWR at Antenna input port. The Four port Ferrite
circulator type is used as an isolator.
Dual Directional Coupler
High Power Dual Directional Coupler (DDC) is used for measuring the Transmit Power
and reflected power. If reflected power exceeds the specified limit of 2:1 VSWR, video
signal is generated to cut-off the RF drive through control and protection unit.
High power dummy load
High power dummy load is used to test the transmitter with out connecting the antenna
during standalone testing.
Wave-guide Channel
To connect all the components in the required form, flexible sections, E-bends, H-bends
and straight sections are used. Standard W/G sections are being used for this purpose.Microwave Channel (High Power)
-600
+800
RF IN RF OUT
LIQUID COOLING
-45kV,5kW
33kV,18kW
3kV,ION PUMP
-10V,10A
TWT POWER SUPPLIES CONNECTION DIAGRAM
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Figure below shows the schematic diagram of the microwave channel. The microwave
channel consists of high power amplifier using TWT amplifier and high power RFplumbing components.
Schematic Diagram of microwave channel
Antenna channel matching requirements
Mismatch in the antenna channel, being the load of the transmitter, significantly decides
of VSWR as seen from the TWT output. According to the Antenna System requirements,matching of the antenna channel at the transmitter output should be equivalent to VSWR
prescribed margin in frequency range of S band in which the radar operates. It seems to
be difficult to satisfy, because the TWT should operate at VSWR
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This system is a forced liquid-to-air type, used for cooling sub systems of the F-Band
Transmitter. The primary coolant used for circulation through this transmitter heat loadsis Dematerialized water / Glycol for operation from required range of temperature. The
transmitter employs liquid cooling for TWT, high power circulator, RF dummy load and
high voltage inverter and forced air-cooling for all other sub-assemblies. Independent ofair-cooling, a dry air with low dew point and dust particles should be applied for wave-
guide pressurizing and for TWT. General design of the cooling is worked out in such a
way that the temperature rise for outlet coolant is around 10C as compared to the inletcoolant.
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