project transmitter (car)-2012

7/29/2019 Project Transmitter (CAR)-2012

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BHARAT

ELECTRONICS

PROJECT

REPORT

SUBMITTED BY:DIVANSHU SHARMA

ROLL NO: 1050731003

R.D. FOUNDATION GROUP OF INSTITUTIONS, KADRABAD,

MODINAGAR (U.P.)


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CONTENTS

1 : CERTIFICATE

2 : ACKNOWLEDGEMENT

3 : PREFACE

4 : BHARAT ELECTRONICS INDUSTRY5 : B E: SALES ANS SERVICES

6 : FORMATION OF UNIT

7 : PROJECT : ROTATION8 : PROJECT : RADAR

9 : TRANSMITTER


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TO WHOM SO EVER IT MAY CONCERN

I certify that DIVANSHU SHARMA, student of B. Tech (Electronics and

Communication), R.D. FOUNDATION GROUP OF INSTITUTIONS,

KADRABAD, MODINAGAR (U.P.) has joined BEL, Ghaziabad for six weeks

industrial training and she has been constantly working under my acknowledgement on

the project assigned to her. She has worked on project RADAR TRANSMITTER. Her

contribution was in Study & Testing of Transmitter.

This report accounts her experience and knowledge of the field she worked in. I have

verified the report and sanction it.


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ACKNOWLEDGEMENT

I take this opportunity to express my sincere gratitude towards Training and placementofficer of my college for forwarding my training letter to Bharat Electronics, Ghaziabad

and also to Mr.B.K.Pant (Mgr.) HRD, Bharat Electronics, Ghaziabad for accepting my

letter and allowing me to complete my training in Bharat Electronics Limited.

I am extremely grateful to Mr. Jagdish Chand, (AGM, RADAR SBU), Mr. Dhyan Singh,

(Sr.DGM, RADAR SBU), Bharat Electronics, for permitting me to join CAR- RADAR

SBU.Further I would like to thank Ms Laxmi Chauhan, Mr. Ankur kumar for their timeto time guidance and help extended during each stage our project.

I am grateful to Mr. R.N. Tyagi, HRD to guide and help me throughout my project. It isnot without his help I could have been able to complete my training here. I would like to

express my deep satisfaction and gratitude for their support for their kind help extended

during the entire period of training.

Finally, I would like to thanks each and every member of BEL family for making me feel

comfortable and helping me in every possible manner.


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PREFACE

The six month training is a part of our B.Tech, Electronics and Communication. PracticalIndustrial Training mainly aims at making one aware of industrial environment; which

means that one gets to know the limitation, constraint and freedom under which an

engineer works. One also gets an opportunity to watch from close quarter that indicates

manager relation. This training mainly involves industrial and complete knowledge aboutdesigning, assembling and manufacturing process of various equipments manufactured

by an industry.

During this six month period, as a student, there is a great opportunity of understanding

Industrial practices. Most of the theoretical knowledge that has been gained during our

course is useful only if it can be applied to production and services in the industry. Thelearnt is applied, tested, verified and rectified. Apart from this the student gets an

opportunity to learn latest technology and is upgraded of the new trends immersing in the

industry of interest.

I had the opportunity to utilize my six month summer internship in BHARAT

ELECTRONICS LIMITED, GHAZIABAD [U.P.]. I was a part of the companys new

venture CAR, which provided me a great deal of learning. My sphere of knowledge wasexpanded both at technical and personal level. I not only got chance to work on Live

Project but also witnessed the related industrial processes and got acquainted to many of

the prevalent technologies.


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INTRODUCTION

OF BEL


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BHARAT ELECTRONICSLIMITED

INDUSTRY

Bharat Electronics Limited (BEL) was established in 1954 as a Public SectorEnterprise under the administrative control of Ministry of Defence as the fountain head tomanufacture and supply electronics components and equipment. BEL, with a noteworthy

history of pioneering achievements, has met the requirement of state-of-art professional

electronic equipment for Defence, broadcasting, civil Defence and telecommunications as

well as the component requirement of entertainment and medical X-ray industry. Overthe years, BEL has grown to a multi-product, multi-unit, and technology driven company

with track record of a profit earning PSU.

The company has a unique position in India of having dealt with all the generations

of electronic component and equipment. Having started with a HF receiver incollaboration with T-CSF of France, the company's equipment designs have had a long

voyage through the hybrid, solid state discrete component to the state of art integrated

circuit technology. In the component arena also, the company established its own electronvalve manufacturing facility. It moved on to semiconductors with the manufacture of

germanium and silicon devices and then to the manufacture of Integrated circuits. To

keep in pace with the component and equipment technology, its manufacturing andproduct assurance facilities have also undergone sea change. The design groups have

CADDs facility, the manufacturing has CNC machines and a Mass Manufacture Facility,

and Quality Control (QC) checks are preformed with multi-dimensional profilemeasurement machines, Automatic testing machines, environmental labs to check

extreme weather and other operational conditions. All these facilities have been

established to meet the stringent requirements of MIL grade systems.

Today BEL's infrastructure is spread over nine locations with 29 productiondivisions having ISO-9001/9002 accreditation. Product mix of the company is spread

over the entire Electro-magnetic (EM) spectrum ranging from tiny audio frequency

semiconductor to huge radar systems and X-ray tubes on the upper edge of the spectrum.

Its manufacturing units have special focus towards the product ranges like DefenceCommunication, Radar's, Optical & Opto-electronics, Telecommunications, Sound and

Vision Broadcasting, Electronic Components, etc.Besides manufacturing and supply of a wide variety of products, BEL offers a

variety of services like Telecom and Radar Systems Consultancy, ContractManufacturing, Calibration of Test & Measuring Instruments, etc. At the moment, the

company is installing MSSR radar at important airports under the modernization of

airports plan of National Airport Authority (NAA).


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BEL has nurtured and built a strong in-house R&D base by absorbing technologies

from more than 50 leading companies worldwide and DRDO Labs for a wide range ofproducts. A team of more than 800 engineers is working in R&D. Each unit has its own

R&D Division to bring out new products to the production lines. Central Research

Laboratory (CRL) at Bangalore and Ghaziabad works as independent agency toundertake contemporary design work on state-of-art and futuristic technologies. About

70% of BEL's products are of in-house design.

BEL was among the first Indian companies to manufacture computer parts and

peripherals under arrangement with International Computers India Limited (ICIL) in1970s. BEL assembled a limited number of 1901 systems under the arrangement with

ICIL. However, following Government's decision to restrict the computer manufacture to

ECIL, BEL could not progress in its computer manufacturing plans. As many of itsequipment were microprocessor based, the company continued to develop computers

based application, both hardware and software. Most of its software requirements are in

real time. EMCCA, software intensive naval ships control and command system is

probably one of the first projects of its nature in India and Asia.

BEL has won a number of national and international awards for Import Substitution,

Productivity, Quality, Safety Standardization etc. BEL was ranked no.1 in the field ofElectronics and 46th overall among the top 1000 private and public sector undertakings in

India by the Business Standard in its special supplement "The BS 1000 (1997-98)". BELwas listed 3rd among the Mini Ratanas (category II) by the Government of India, 49 th

among Asia's top 100 Electronic Companies by the Electronic Business Asia and within

the top 100 worldwide Defence Companies by the Defence News, USA.

BEL has production units established at different parts of the country. The year of

establishment and location are as follows:

Serialno. Year of establishment Location

1.

2.

3.

4.

5.

6.

7.

8.

9.

1954

1972

1979

1979

1984

1984

1985

19851986

Bangalore

Ghaziabad

Pune

Taloja (Maharashtra)

Hyderabad

Panchkula (Haryana)

Chennai

Machhilipathnam(A.P.)

Kotdwara (U.K.)


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Motto Mission and Objectives

The passionate pursuit of excellence at BEL is reflected in a reputation with itscustomers that can be described in its motto, mission and objectives:

CORPORATE MOTTO

"Quality, Technology and Innovation."

CORPORATE MISSION

To be the market leader in Defence Electronics and in other chosen fields and

products.

CORPORATE OBJECTIVES

To become a customer-driven company supplying quality products at

competitive prices at the expected time and providing excellent customersupport.

To achieve growth in the operations commensurate with the growth of

professional electronics industry in the country.

To generate internal resources for financing the investments required for

modernization, expansion and growth for ensuring a fair return to theinvestor.

In order to meet the nation's strategic needs, to strive for self-reliance by

indigenization of materials and components.

To retain the technological leadership of the company in Defence and other

chosen fields of electronics through in-house Research and development aswell as through Collaboration/Co-operation with Defence/National Research

Laboratories, International Companies, Universities and Academic

Institutions.

To progressively increase overseas sales of its products and services.

To create an organizational culture which encourages members of the

organization to realize their full potential through continuous learning on thejob and through other HRD initiatives?


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Manufacturing Units

Bangalore (Karnataka)

BEL started its production activities in Bangalore in 1954 with 400W highfrequency (HF) transmitter and communication receiver for the Army. Since then, the

Bangalore Complex has grown to specialize in communication and Radar/Sonar Systems

for the Army, Navy and Air Force. BEL's in-house R&D and successful tie-ups withforeign Defence companies and Indian Defence Laboratories has seen the development

and production of over 300 products in Bangalore alone. The Unit has now diversified

into manufacturing of electronic products for the civilian customers such as D.O.T.,V.S.N.L., A.I.R. and Doordarshan, Meteorological Dept., I.S.R.O., Police, Civil

Aviation, and Railways. As an aid to Electorate, the unit has developed Electronic Voting

Machines that are produced at its Mass Manufacturing Facility (MMF).

Ghaziabad (Uttar Pradesh)

The second largest Unit at Ghaziabad was set up in 1974 to manufacture specialtypes of radar for the Air Defence Ground Environment Systems (Plan ADGES). The

Unit provides Communication Systems to the Defence Forces and Microwave

Communication Links to the various departments of the State and Central Govt. and otherusers. The Unit's product range included Static and Mobile Radar, Tropo scatter

equipment, professional grade Antennae and Microwave components.

Pune (Maharashtra)

This Unit was started in 1979 to manufacture Image Converter Tubes.

Subsequently, Magnesium Manganese-dioxide Batteries, Lithium Sulphur Batteries andX-ray Tubes/Cables were added to the product range. At the present the Unit

manufactures Laser Sub-unit for tank fire control systems and Laser Range Finders for

the Defence services.

Machilipatnam (Andhra Pradesh)

The Andhra Scientific Co. at Machilipatnam, manufacturing optics/Opto-

electronic equipment was integrated with BEL in 1983. The product line includes PassiveNight Vision Equipment, Binoculars, Binoculars and Goggles, Periscopes, Gun Sights,

Surgical Microscope and Optical Sights and Mussle Reference Systems for tank firecontrol systems. The Unit has successfully diversified to making the Surgical Microscope

with zoom facilities.

To cater the growing needs of Defence Communications, this Unit was

established in 1985. Professional grade Radio-communication Equipment in VHF and


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UHF ranges entirely developed by BEL and required by the Defence services are being

met from this Unit.

Chennai (Tamil Nadu)

In 1985, BEL established another Unit at Chennai to facilitate manufacture of

Gun Control Equipment required for the integration and installation in the Vijayanta

tanks. The Unit is now manufacturing Stabilizer Systems for T-72 tanks, Infantry CombatVehicles BMP-II; Commander's Panoramic Sights & Tank Laser Sights are among

others.

Kotdwar (Uttarakhand)

In 1986, BEL started a Unit at Kotdwara to manufacture Telecommunication

Equipment for both Defence and civilian

Customers Focus is being given on the requirement of the Department of

Telecommunications to manufacture Transmission and Switching Equipment.

Taloja (Maharashtra)

For the manufacture of B/W TV Glass bulbs, this plant was established in

collaboration with coming, France in 1986. The Unit is now fully mobilized to

manufacture 20" glass bulbs indigenously.

Hyderabad (Andhra Pradesh)

To coordinate with the major Defence R&D Laboratories located in Hyderabad,DLRL, DRDL and DMRL, BEL established a unit at Hyderabad in 1986. Force

Multiplier Systems are manufactured here for the Defence services.


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Joint Ventures

BE-Delft Electronics Limited

BE-Delft Electronics Limited, Pune, the first joint venture of the company with

Delft Instruments, Holland and UTI was established in the year 1990 for conductingresearch, development and manufacture of Image Intensifier Tubes and associated high

voltage power supplies for use in military, security and commercial systems. Its products

include night vision goggles and binoculars, night vision weapon sights and low lightlevel input applications.

GE BE Private Limited

GE BE Private Limited, Bangalore, a JV with General Electric Medical Systems,USA has been established in 1997-98 for manufacture of High End Rotating Anode

Medical Diagnostic X-ray tube called CT MAX, which is used in CT Scanners. The joint

venture unit will also establish a reloading facility for X-ray tubes and will also marketthe conventional X-ray tubes made at Pune Unit of BEL. South East Asia markets are

addressed by this joint venture.

BEL- Multitone Private Limited

A joint venture between Bharat Electronics and Multitone Electronics Plc, UK hasalso been established in Bangalore in 1997-98 to manufacture state-of-art Mobile

Communication for the workplace. Multitone invented paging in 1956 when it developed

the world's first system to serve the "life or death" environment of St. Thomas Hospital,

London. With the strength of Bharat Electronics in the Radio Communications field andthe technology of Multitone, in the field of Radio Paging, the joint venture company is in

a position to offer tailor made solution to the Mobile Communication needs at workplace

in various market segments.


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Customer Profile & BEL Product Range

Equipment

Components

Defence Transmitting Tubes, Microwave Tubes, Lasers, Batteries,

Defence

Army Tactical and Strategic Communication Equipment and

Systems, Secrecy Equipment, Digital Switches, Battlefield

Surveillance Radar, Air Defence and Fire Control Radar,Opto-Electronic Instruments, Tank Fire Control Systems,

Stabilizer Systems, Stimulators and Trainers.

Navy Navigational, Surveillance, Fire Control Radar, IFF,SONAR Systems, Torpedo Decoys, Display Systems, EW

Systems, Simulators, Communication Equipment and

Systems.

Air Force Surveillance and Tracking Raiders, Communication

Equipment and Systems, IFF and EW Systems.

Non-Defence

Para-Military Communication Equipment and Systems.

Space Department Precision Tracking Radar, Ground Electronics, Flight andOn-Board Sub-systems.

All India Radio MW, SW & FM Transmitters.

Doordarshan

(TV Network)

Low, Medium and High Power Transmitters, Studio

Equipment, OB Vans, Cameras, Antennae, Mobile and

Transportable Satellite Uplinks.

NCERT TV Studios on Turnkey Basis for Educational Programs.

Department of

Telecommunications

Transmission Equipment (Microwave and UHF) and PCM

Multiplex, Rural and Main Automatic Exchanges, Flyaway

Satellite Terminals, Solar Panels for Rural Exchanges.

Videsh Sanchar

Nigam and other

Corporate Bodies

MCPC VSAT, SCPC VSAT, Flyaway Earth Stations. Hub

Stations, Up/Down Converters, LNA Modems

Civil Aviation Airport Surveillance Radar, Secondary Surveillance Radar.

Meteorological

Department

Cyclone Warning and Multipurpose Meteorological Radar.

Power Sector Satellite Communication Equipment.

Oil Industry Communication Systems, Radar.

Forest Departments,

Irrigation &Electricity Boards

Communication Systems.

Medical &Health Care Clinical and Surgical Microscope with Zoom, LinearAccelerators.

Railways Communication Equipment for Metros, Microwave RadioRelays, And Digital Microwave Radio Relays.


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Semiconductors-Discrete, Hybrid and Integrated Circuits.

Non-Defence

All India Radio,

Doordarshan

(TV Network),Department of Telecommunications

And Civil Industries

Transmitting Tubes, Microwave Tubes, and Vacuum

Tubes.

Entertainment

Industry

B/W TV Tubes, Silicon Transistors, Integrated Circuits,

Bipolar and CMOS, Piezo Electric Crystals, CeramicCapacitors and SAW Filters.

Telephone Industry Integrated Circuits, Crystals.

Switching Industry Vacuum Interrupters.

Instrumentation Industry Liquid Crystal Displays.

Medical &Health Care X-ray Tubes.

Systems/Network

Identity Card Systems Software, Office AutomationSoftware, LCD On-line Public Information DisplaySystems and Communication Networks / VSAT Networks.

Financial Performance


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BEL has a unique history of profit making Public Sector Enterprise right from its

inception. There have been events of decrease in turnover and profit after Tax due toreasons beyond reasonable control of the company. But the company's strength lies in its

capability to combat the threats, for example US Embargo on exports to BEL.

BEL hopes to generate 25 per cent increase in turnover with a 15 per cent rise in

net profit in the current fiscal year over the previous. Corrective measures against westernsanctions have been undertaken, which are likely to translate into higher turnover and

profitability. The company is putting all efforts to minimize the effect of the restrictions

by early establishments of alternative arrangements. The Defence Research Laboratoriesand Academic Institutions are also being persuaded with for indigenization of certain

special category of devices and components. The company is also opening an office in

Singapore to procure components from Asian markets. Thus in the long run therestrictions will prove as blessings resulting in self-dependence and better profit margins.

Also several R&D projects with long gestation periods will go into commercial

production during the current fiscal.


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Product Range

The product ranges today of the company are:

Radar Systems:

3-Dimensional High Power Static and Mobile Radar for the Air Force.

Low Flying Detection Radar for both the Army and the Air force.

Tactical Control Radar Systems for the Army

Battlefield Surveillance Radar for the Army

IFF Mk-X Radar systems for the Defence and Export

ASR/MSSR systems for Civil Aviation.

Radar & allied systems Data Processing Systems.

Communications: Digital Static Tropo scatter Communication Systems for the Air Force.

Digital Mobile Tropo scatter Communication System for the Air Force

and Army.

VHF, UHF & Microwave Communication Equipment.

Bulk Encryption Equipment.

Turnkey Communication Systems Projects for defence & civil users.

Static and Mobile Satellite Communication Systems for Defence

Telemetry/Tele-control Systems.

Antennae:

Antennae for Radar, Terrestrial & Satellite Communication Systems.

Antennae for TV Satellite Receive and Broadcast applications.

Antennae for Line-of-sight Microwave Communication Systems.

Microwave Component:

Active Microwave components like LNAs, Synthesizer, and Receivers

etc. Passive Microwave components like Double Balanced Mixers, etc

Most of these products and systems are the result of a harmonious combination of

technology absorbed under ToT from abroad, Defence R&D Laboratories and BEL's own

design and development efforts.


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Organization

The operations at BEL Ghaziabad are headed by General Manager with

Additional / Deputy General Manager heading various divisions as follows:

Design & Engineering Divisions :

Development and Engineering-R

Development and Engineering-C

Development and Engineering-Antenna.

1. Equipment Manufacturing Divisions :

Radar

Communication

Antenna

Systems

Microwave Components.

2. Support Divisions:

Material Management

Marketing & Customer Co-ordination

Quality Assurance & Torque

Central Services

PCB & Magnetics

Information Systems

Finance & Accounts

Personnel & Administration

Management Services.


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Design & Engineering:

The pace of development and technological obsolescence in their field of

electronics necessitates a strong Research and Development base. This is all the moreimportant in the area of Defence Electronics. BEL Ghaziabad has since its inception laid

a heavy emphasis on indigenous research and development. About 70% of its

manufacture today relate to items developed in-house. For the development and

production of the Mobile Tropo scatter System and the IFF equipment, BEL was awardedthe Gold Shield for Import Substitution.

Design facilities are also constantly being modernized and substantial computer-

aided design facilities are being introduced including installation of mini- and micro-

computers and dedicated design application. About 170 graduate and post-graduateengineers are working on research and development and indication of the importance

R&D has in BEL's growth.

Three Design and Engineering groups are product based viz. Communication,

Radar and Antenna. These divisions are further divided into different departments to lookafter products of a particular nature. Each of them has a drawing office attached to them,

which are equipped with latest drafting and engineering software. The PCB layout andPCB master making is done at CADDs Center. A central Records & Printing section takescare of the preserving the engineering documents and distribution thereof. Most of the

engineering documents are available online.

Equipment Manufacturing Divisions:

As a supplier of equipment to the Defence services and professional user, strictadherence to specifications and tolerances has to be in-built into the design and

manufacturing process. For this BEL Ghaziabad has well defined standards and processes

for as well as manufacturing and testing activities. Activities are divided into variousdepartments like Production Control, Works Assembly, and QC WORKS. The

manufacture and control of production is through a central system, BELMAC, BEL'sown homegrown ERP system.

Apart from conventional machines, BEL Ghaziabad has been equipped withseveral Computer Numerical Control (CNC) machines for ensuring repeat occurrences

and increased throughput. A separate NC programming cell has been set up to develop

the programs for execution on the CNC machines.

Microwave Component Group:

Frequencies greater than 1 GHz is termed as Microwaves. Microwaves Integrated

Circuits (MIC) used extensively in the production of subsystems for Radar andCommunication equipment constitutes a very vital part of the technology for these

systems and is generally imported. Owing to the crucial and building block nature of thetechnology involved, BEL is currently setting up a modern MIC manufacturing facility ata planned expenditure of Rs. 2 crore. When in full operation, this facility will be the main

center for the MIC requirements of all the units of the company.

The manufacturing facilities of hybrid microwave components available at BEL,

Ghaziabad includes facility for preparation of substrates, assembly of miniaturizedcomponent viz. directional couplers, low noise amplifiers, phase shiftier, synthesizers etc.


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involves scalar as well as vector measurements. For this state of the network analysis are

used.

Material Management:

Material Management division is responsible for procurement, storage handling,

issue of purchased parts as well as raw materials required to manufacture various

equipment and spares. It also takes care of disposal of unused or waste material.

The division is divided into Purchase, Component store, Raw material store,Chemical store, Inwards good store, Custom clearance Cell, Inventory management &

disposal.

Marketing and Customer Co-ordination:

This division is responsible for acquisition and execution of customer orders and

customer services. Marketing department looks after order acquisition. Commercialdepartment looks after order execution. Shipping takes care of packing and dispatch of

material to customer.

Quality Assurance & Torque:

In the area of professional Defence electronics, the importance of Quality andReliability is of utmost importance. BEL has therefore established stringent processes andmodern facilities and systems to ensure product quality- from the raw material to the

finished product. IGQA, Environmental Labs, Test Equipment Support and QA

departments are grouped under this division.

All material for consumption in the factory passes through stringent inward goodsscreening in IGQA department before being accepted for use.

Subsequent to manufacture and inspection, the end product is again put through a

rigorous cycle of performance and environmental checks in Environmental Labs.

The testing, calibration and repair facility of test Instruments used in the factory isunder the control of Test Equipment Support. All the instruments come to this department

for periodic calibration.

Quality Assurance department facilitates ISO 9000 certification of various

divisions. All production divisions of BEL Ghaziabad are ISO9000 certified. Themicrowave division is ISO9001 certified whereas the remaining three division viz. Radar,

Communication and Antennae are also ISO9002 certified.

Central Services:

Central services Division looks after plant and maintenance of the estate including

electrical distribution, captive power generation, telephones, transport etc.

PCB Fabrication & Magnetics:

PCB Fabrication, Coil and Magnetics, Technical Literature, Printing Press and

Finished Goods are the areas under this division.

Single sided PCB blanks- having circuit pattern only on one side of the board and

double sided - having circuit pattern on both sides of the board are manufactured in


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house. However, Multi-layered PCBs, having many layers of circuit, are obtained from

other sources.

Magnetic department makes all types of transformers & coils that are used in

different equipment. Coils and transformers are manufactured as per various

specifications such as number of layers, number of turns, types of windings, gap in core,

dielectric strength, insulation between layers, electrical parameters, impedance etc. laiddown in the documents released by the D&E department.

Information Systems:

IS Department is responsible for BEL's own home grown manufacturing and

control system called BELMAC. It comprises of almost all modules a modern

ERP system but is Host and dumb terminal based.

Finance & Accounts:

The F&A division is divided into Budget & Compilation, Cost and Material

Accounts, Bills Payable, Bill Receivable, Payrolls, Provident Fund, Cash Sections

Personnel & Administration:

There are at present about 2300 employees at BEL Ghaziabad, of which morethan 400 are graduate and post graduate engineers.

P&A Division is divided into various departments like Recruitment,

Establishment, HRD, Welfare, Industrial Relations, Security and MI Room.

Management Services:

This department deals with the flow of information to or from the company. It is

broadly classified into three major sub-sections - Management Information System,

Industrial engineering department and Safety.

Production Control

The main goals of the production control are:

To improve the profits of the company by better resource management

To ensure on-time delivery products

To improve the quality of product

To reduce the capital investment

To reduce working capital needs by better inventory management

Production control is responsible for producing the products, right from the stage

engineering.


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Drawings are received to the stage where it is store credited as finished product. Its

basic function is to identify the parts/operations to be made, the best way of makingthem, the time when they have to be made and to arrange the production resources to the

optimum.

The commercial department obtains orders from equipments through quotations. The

equipment stock order (ESO) is released by commercial department. Then the

management services department issues work order for the quantity of equipment to bemade. This is for the calculation for the cost of the project then D&E department

develops the equipment and releases the following engineering documents:

KS : Key Sheet

PL : Part List

GA : General Assembly Diagram

CL : Connection List

WL : Wiring Diagram

Now the production control takes the responsibility of manufacturing the equipment.

PC decides for items to be purchased from outside, for items to be manufactured by other

companies and prepares documents for items to be made inside the company.

Documents issued by the PC:

I. Process sheet (fabrication): This process sheet indicates the process and thesequence of operation to be followed in various work cells and work centers. Every

item is timed by productivity services.

II. Process sheet (Assembly): This is similar to PS (fabrication) except that it is

used in electronics assembly, PCB assemblies, cable form and cable assemblies.

III.Process sheet (coils): This indicates operation analysis for transformer and coils.

IV. Schedule for RM, fasteners and PPs: This gives the gross requirements for raw

materials, purchased parts, fasteners etc. Based on this material control department

initiates procurement action and store requisitions are released with reference to thisschedule.

Tool Planning

1. Some of the items while under fabrication require the use of some jigs and

fixtures.

2. The cost estimation, revenue and budget plans are got approved by the board of

management

3. Standard hour is approved by the department. This is the time, which is decided tocomplete the job by a worker in a stipulated time, which is decided on the

previous records of the shop, type of machine used and the nature of work.

4. Report on production value is evaluated for each unit.


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My Training in BEL, was attended in two phases. In first phase, I was given a

schedule to visit all the departments in BEL, relevant to my field of Electronics andCommunication. In this period of orientation, I visited different departments and was

introduced to the current technology used and the various industrial processes under

practice. In the second phase I was allotted a Project under Project Manager, Mr.

Chaturvedi (CAR- RADAR).

I am briefing my experience and observation about various departments of thecompany in next paragraphs.


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ROTATION


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ABOUT VARIOUS DEPARTMENTS

MICROWAVE INTEGRATED CIRCUITS

Frequencies greater than 1 GHz are termed as Microwaves. Microwave Integrated

Circuit used extensively in production of subsystems for Radar and Communicationequipment constitutes a very important part of technology for these systems are

generally imported. Owing to the crucial and building block nature of the technologyinvolved, BEL is currently setting up a modern MIC manufacturing facility at a planned

expenditure of Rs. 2 crore. When in full operation this facility will be the main center

for the MIC requirements of all the units of the company.

The manufacturing facility of hybrid microwave components available at BELGhaziabad includes facility for preparation of substrates, assembly of miniaturized

components on substrates, bonding and testing. Testing of these microwave

components viz. Directional couplers, Waveguides, low noise amplifiers, phaseshifters, synthesis etc. involve scalar as well as vector measurements. For this state of

the network, analyses are used. Various losses such as return loss, bending loss,

insertion loss are measured and testing is done in a way to minimize these losses.

MICROWAVE LAB

This section undertakes:

1. Manufacturing of films and microwave components to meet internal

requirements.

2. Testing of low power antenna for which test-site is about 100 Km from thefactory at sohna.

The main component testing in this department is:

Oscillators

Amplifiers

Mixers

Radiation elements (e.g. Feeders)

Microwave components (e.g. Isolators, circulators, waveguides etc.)

Filters (e.g. LPF, BPF, Uniplexers, and Multiplexers etc.)


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Functioning of component is listed below:

Frequency response

Noise figure

VSWR Directivity and coupling

Power measurements

Various instruments in the lab are:

Adaptor

Attenuator

Coupler

Mixer

Detector

ENVIRONMENTAL LAB

Various tests conducted in the environmental lab in BEL in order to ensure

reliability. Reliability is defined as the probability of a device performing itspurpose adequately for the period intended under the given operating conditions.

In a given system reliability is given as

R = R1 * R2 * R3

The standards available here are:

JSS55555 - Joint Services Specifications (Military Standard of India)

Mil Standards - U.S. Military standards

QM333 - Civil Aviation and Police


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TYPES OF TESTS

1. FIRST ARTICLE TEST (FAT)

These tests are performed on the prototype. If these tests are successful then the mass

production is taken up.

The tests are:

1. Vibration Test System2. High Temperature Operate and Storage

3. Low Temperature Operate and Storage

4. Damp Heat Operate and Storage

5. Altitude Chamber6. Bump Test Machine

7. Salt Fog Chamber

8. Tropical Storage9. Mould Growth Chamber

VARIOUS TESTS IN DETAIL:

1. Vibration Test SystemThe item is vibrated when kept over the plate of the machine. The frequency

Range is 1 to 2,000 Hz.

Radar PCBs are vibrated at 10 to 50 Hz at 2g (g=9.8m/s 2) for 15.

2. Humidity chamber

Used to test the product under varying humidity conditions.

For Navy instruments conditions for humidity are 95% at +45C for 16 hours.

3. Cold Heat

This chamber has a temperature of 90 to +180. This chamber program is

controlled and has an accuracy of +0.5 and has a graph plotting system.

4.Mould Growth

This chamber is used to test how immune the product is against mould growth.

5. Salt Spray

It is used to check the resistivity of the item produced against salty water.

6. Climatic Chamber

Temperature range of 65C to +200C and relative humidity is from 20%To 98%RH.

7. Walk In Chamber

This is a big chamber of size 2.6m, 2.4m, 3m Temp. range of 60C to

+100C and the humidity is from 20% to 90% RH.


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8. Bump Machine

Item is dropped from a certain height every time it receives bump fromMachine. Maximum capacity of the machine is 11.35 Kg. Drop height is

Around 1 inch.

9. Altitude Chamber

Used to test the item under different temperature and humidity conditions.

The temperature range for this chamber is from -40C to +150C and can createenvironmental conditions as per a height of 50,000 feets.

For airforce equipment the instrument is kept at a temperature of +40C for

30,000 ft and at 0C for 13,500 ft.

2. ACCEPTANCE TEST PROCEDURE

This sets on the extent to which a test is to be conducted and also decides what

tests should be conducted.

There are three types of tests:

a) Class A test: This test includes visual and dimensional checks. Allequipments of regular production go through these checks. These include

quality control and electrical tests.

b) Class B test: These are quality assurance and reliability tests. Only 10%of equipments go through these tests. They include quality control,

electrical tests and some environmental tests.

c) Class C test: These are carried out on 1% of the components. All theenvironmental tests are performed. If any failure is seen, the component

must be redesigned. Also the customer must be supplied with modified

goods. This test comes in picture for bulk production only.

FAILURE RATE GRAPH

Failure rate graph- It is the failure versus time graph.The infant morality is the critical period. It is due to:

Weak component

Manufacturing defect

This is the area where the producer tries to cover in the warranty period.

The repeated failures are detrimental to a companys reputation as these are eliminated byscreening while in manufacturing stage.


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The other screening is the stress screening method. This consists of:

a) HUMIDITY TEST: Humidity is created with the help of boilers and fans in the

chamber. Required temperature and duration of the tests are selected as per the

specified BEL standards.b) ALTITUDE TEST: The conditions such as very low temperature (created with

the help of cooling systems) and very low temperature and pressure (created with

the help of a vacuum pump) are maintained in a chamber. These conditions arecomparable to those at high altitudes where the products have to work.

c) AGEING AND THERMAL SHOCKS: One cycle of ageing is of 7 hours.

Ageing is done to relieve the stresses developed in the PCB due to blazing,

welding, riveting etc. The sample is first kept at ambient temperature (250 degreeCelsius) and then cooled to -400 degree Celsius.

d) BUMP TEST: The sample is given bumps in one direction only, with the help of

machine. The number of bumps to be given is set with the help of proper switches.The sample is operated after giving bumps. If it works properly, it is passed.

e) VIBRATION TEST:The sample is subjected to vibrations. Required frequency

and amplitude for vibrations is selected accordingly.

f) SALT SPRAY TEST: Salt solution is sprayed in a chamber. The specimens arehanged in the chamber. The test helps to decide any corrosion that takes place due

to spraying of solution.g) RAIN TEST: In this test, conditions are created such that the sample is made to

bath in heavy rain, so that if any problem arises in the sample due to rain that can

be sorted accordingly.

h) DROP TEST : The sample is made to survive in such a environment where thereis possibility of snow fall. Such conditions are created in a chamber, to sort out any

problem arises due to this.

i) ROADABILITY TEST: While doing bump test, bumps are given to the samplein unidirectional only. But in the roadability test, bumps are given to the sample in

all the directions. It means that the test is being carried, considering the device tobe moving in a zigzag manner on an uneven road. For e.g. in sand or in water etc.This test helps to make out any fault or loosening of components while moving the

specimen from one place to another.

j) BOMB TEST: This is a test conducted for special types of samples. In this the

samples are exposed to a situation like a bomb blast and it is checked whether thesample is able to bear the bomb explosion.

WALK IN CHAMBER

A very huge used for conducting humidity and temperature tests. The size of the

chamber is such that a person can easily walk into it. It is for large sized specimens.


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PCB FABRICATION

PCB is abbreviated form of printed circuit board. As the name suggests, in a PCBthe electrical circuit is printed on a glass epoxy board. This reduces the complex writing

network whose trouble shooting in case of shorting or misconnection is not easy.

PCB fabrication is mostly done for house requirements. It also takes some external jobs.

Types of PCBs

Single Sided: Having circuit pattern only on one side of the board.

Double Sided: Having circuit pattern on both sides of the board.

Multilayered: Having many layers of circuit.

BEL Ghaziabadproduces only single-sided and double-sided PCBs.

FABRICATION OF SINGLE SIDED PCBs:

1. A copper clad sheet is taken. It is cleaned and scrubbed.2. The sheet is laminated with a photosensitive solution.

3. Positive photo paint of the required circuit is placed over the laminated sheet and

it is subjected to the UV light. As a result the transparent plate gets polymerizedand the opaque part remains unpolymerized.

4. The plate is now dipped in solution in which the non-polymerized part gets

dissolved.5. Tin plating is done on the tracks obtained.

6. Lamination of the plate is removed (stripping).

7. The unwanted copper from the plate is also removed by dipping it in the solutionthat dissolves copper but not tin (etching).

8. Now drilling is done on the paths where the components are to be mounted. Thisprocess fabricates PCB.

P C B MANUFACTURING PROCESS:

1. Copper clad

2. Drill location holes3. Drill holes for T.H.P. (Through Hole Plating)

4. Clean scrub and laminate

5. Photo print

6. Develop7. Copper electroplate

8. Tin electroplate

9. Strip film10. Etch and clean

11. Strip tin

12. L.P.I.S.M. (Liquid Photo Imageable Solder Mask)13. Photo print


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14. Develop

15. Thermal baking16. Hot air level

17. Legend marking/Reverse marking

18. Route and clean

But these PCBs have the following disadvantages:

Due to very narrow spacing between adjacent tracks, there may be a chance

of short circuit if the soldering is done by hands between the components on

opposite side.

Moisture or dust between the gaps may disrupt smooth soldering.

These disadvantages are overcome by soldered mask PCBs. in the later one an additional

film is put on the earlier fabricated PCB, leaving points where components are to be

soldered.

TEST EQUIPMENT & AUTOMATION

TEST EQUIPMENT SUPPORT (TES)

Main functions are:

Develops technical support to other departments.

Repair of equipment in case of failure.

Maintenance of equipments.

Periodic calibration of equipments.

Provide technical support to other departments. This includes:

1. Handling requests from the other department for equipments.2. Storage of rejected equipments.

3. Approval of equipments to be purchased.

This section deals with testing and the calibration of electronic equipments only the

standards of this department are calibrated byNational Physics Laboratory (NPL).

AUTOMATION TEST EQUIPMENT (ATE)

1. Component testing gives faults of various discrete components of a PCB.

2. Integrated circuits tester tests various ICs.

3. Functional testing compares output to decide whether the function is being

performed to the desired level of accuracy.


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WORKS ASSEMBLY

This department plays an important role in the production. Its main function is toassemble various components, equipments and instruments in a particular procedure. It

has two sections, namely:

1. PCB assembly2. Electronic assembly

In PCB assembly, the different types of PCB are assembled as per BEL standards. PCB isreceived from the PCB department on which soldering of component is done either by

hand soldering orwave soldering.

HAND SOLDERING: In case of hand soldering, soldering is done manually.

WAVE SOLDERING: Wave soldering is a procedure in which PCBs are fed to

the wave soldering machine from the opening on one side

and the soldering is done by machine and after the

soldering is done PCBs are collected from the anotheropening of the machine and after that cleaning is done.

The PCBs are than send to testing department for testing according to the product

Test procedure issued by the D&E department. After testing PCBs are lacquered and

Send to the planning store for storage.

In electronic assembly, the cable assemblies, cable forms modules, drawers, racks

and shelters are assembled. Every shelter (e.g. - DMT) is made of racks, racks are madeup of drawers, drawers are made up of modules and modules are made up of PCBs,

cable assembly and cable forms.

Every module or drawer before using in next assembly is sent for testingaccording to their PTP. Shop planning collects the purchase from the IG store, takes

fabricated parts, PCBs etc. from planning stores and issued to the assembly department

as per the part list of the assembly to be made.The documents issued to the assembly are:

KS : Key Sheet

PL : Parts List

CL : Connection List for cable form

WL : Wiring List for modules

WD : Wiring DiagramGA : General Assembly diagram


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This department has been broadly classified as:

1. WORK ASSEMBLY RADAR e.g. : INDRA-2 , REPORTER ,CAR

2. WORK ASSEMBLY COMMUNICATION e.g. : EMCCA , MSSR , MFC

EMCCA: EQUIPMENT MODULAR FOR COMMAND CONTROL APPLICATION

MSSR: MONOPULSE SECONDARY SURVEILLANCE RADAR

MFC: MULTI FUNCTIONAL CONSOLE

The stepwise process followed by work assembly department is:

1) Preparation of part list that is to be assembled.

2) Preparation of general assembly.3) Schematic diagram to depict all connection to be made and brief idea about all

components.

4) Writing list of all components.

METHOD OF PCB PROCESSING

1. Tinning2. Preparation

3. Mounting

4. Wave soldering5. Touch up

6. Quality control

7. Ageing8. Testing

9. lacquering (AV)10. Storing

SURFACE MOUNTING TECHNOLOGY

The works assembly has a totally computerized section of PCB assembling of SMD(Surface Mounting Device). In this section the operation of PCB assembling is totally

controlled by computers. The various steps taken in computer PCB assembling of SMDs

are as follows:

1. Application of solder paste: Solder paste is applied onto the places on PCB

where the SMDs are to be soldered. This is done by computer controlledmachine. The program is loaded in the machine; it reads the program and applies

the solder paste at the required place.

2. Fixture of SMDs:a) The SMDs are fixed at the right place on PCB by another computer

controlled machine.


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b) The components (SMD) are first fed to various feeder lines that are

attached to the machine and the related software and program is loadedin computer.

c) There is a provision for a camera also so that we can monitor the entire

operation.d) The PCB is then fed to the machine.

e) When the appropriate command is given to the computer, it initiates

the machine attached to itf) The machine picks the correct SMD from the feeder line and fix it at

the right place on the PCB and within seconds all SMDs are fixed on

the PCB.

3. Thermal Baking: After the fixture of SMDs, thermal baking is done. In this

the PCB is fed to the oven and after 10 to 20 minutes PCB is taken out.

NOTE: Surface Mounting Device (SMD) does not require any hole on PCB as

they are mounted directly on the PCB. The pins of SMD components are called

legs as they have leg like structure unlike simple components that have straight

pins that are soldered in the holes on the PCB manually.

SHOP ORDER

Process Sheet (assembly)

All operations fill the work order and shop order in operators time card

(OTC). They punch the time of starting the job and its finishing time. By thisproductivity services calculates the time taken to complete the job.

Efficiency = time allotted in shop order

X 100

Actual time takenTime allotted is so called standard hours.

This deals with the assembly of common projects e.g. DMT, 2 GHz radio relay, Mobile

tropo, Static RRD etc.


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MAGNETICS

This department manufactures all types of transformers and coils that are used in

various equipments manufactured by BEL. This department basically consists of four

sections:1. Planning section

2. Mechanical section

3. Moulding section4. Inspection section

The D&E department gives the following descriptions to the magnetics department.They are as follows:

Number of layers

Number of turns

Type of winding

Gap in core

Insulation between layers

Ac/dc impedance

Dielectric strength

Electrical parameters and

Earthing

The various transformers being made are:

Open type transformer

Oil cooling type transformer

Moulding type transformer

PCB moulding type transformer

The transformer is mechanically assembled, leads are taken out and checking ofspecification is done.

Winding machines are of three types:

Heavier ones- DNR for 0.1 to 0.4 mm diameter

LC controlled machines

Torroidal machines having 32 operations from winding to mechanical assembly.

The various types of windings used are:

Hand winding

Torroidal winding

Sector winding

Pitch winding


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Variable pitch winding

Wave winding

Two main types of core used are:

E-type for 3-phase

C-type for single phase

Following procedure involved in the manufacture of the transformer is as follows:

1. Formers of glass epoxy

2. Winding

3. Core winding4. Varnishing

5. Impregnation In this process various varnished coils are heated, then

cooled, reheated and put into vacuum. Then air is blown to remove the

humidity.6. Moulding Araldite (a certain type of strong glue) mixed with black dye is

used to increase mechanical as well as electrical strength. Moulding is done

at 120 degree Celsius for 12 hours.A RDB compound is used for leakage protection. Oil is then boiled at 70 to

80 degree Celsius under vacuum condition to remove air bubbles trapped

inside during manufacturing process. After this the coils are dipped invarnish and core is attached.

7. Painting

8. Mechanical assembly9. Termination

10. Stenciling

11. Testing Dielectric testing (both ac/dc) is done at 50 KV voltage

is applied for a minimum of one minute. During inspection, the followingcharacteristics are checked:

a. Turns ratiob. DC resistance for each coil

c. Inductance

d. No load voltagee. Leakage

This section the material used for making transformer is Bakelite comprising maleand female plates which are joined alternately to form a hollow rectangular box on which

winding is done. Winding is done with different material and thickness of wire. The

winding has specified number of layers with each layer having a specified number ofturns. The distance between the two turns should be maintained constantly that is there

should be no overlapping. The plastic layer is inserted between two consecutive layers.

Types of Windings:

1) Layer Winding


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2) Wave Winding

3) Bank Winding

Different types of windings are done to control some parameters such as inductance andcapacitance. Varying the spacing between the two turns can vary these parameters.

Two consecutive turns act as capacitor. As gap between the turns increases the

capacitance decreases and inductance increases. Since capacitance is inversely

proportional to the gap between the plates of capacitor and inductance is directlyproportional. After winding the core is inserted between the primary and secondary.

Contact leads are taken out and molding is done for maximum heat dissipation.

Rubber solution is used to give strength to the wires, so that they cannot break. Thisis done before molding. Varnishing is done as anti fungus prevention for against

environmental hazard. After compilation of manufacturing process it is sent for

testing. Different parameters such as inductance, capacitance efficiency, turns ration,continuity are tested.

QUALITY CONTROL WORKS

According to some laid down standards, the quality control department ensuresthe quality of the product.

The raw materials and components etc. purchased are inspected according to the

specifications by the IG department. Similarly QC works department inspects all theitems manufactured in the factory.

The fabrication inspection checks all the fabricated parts and ensures that these

are made as per the part drawing. Plating, Painting and stenciling etc are done and

checked as per the BEL standards.The assembly inspection department inspects all the assembled parts such as PCB,

cable assembly, cable form, modules, racks and shelters as per latest documents and BEL

standards.The mistakes in the PCB can be categorized as:

D&E mistake

Shop mistake

Inspection mistake

A process card is attached to each PCB under inspection. Any error in the PCB is

entered into the process card by certain codes specified for each error or defect.

After mistake is detected, following actions are taken:

Observation is made.

Object code is given.

Division code is given.

Change code is prepared.

Recommended action is taken.


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RADAR ASSEMBLY

This deals with the assembly of RADARS, e.g. INDRA-I, INDRA-II, FLY

CATCHER, EMMCA, IRMA, REPORTER, CAR etc.

The main projects under construction are:

CAR

In RADAR section RADAR being tested is REPORTER, FLY CATCHER,

EMCCA, etc.


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PROJECT


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PROJECT : RADAR (RADIO DETECTION AND RANGING)


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PROJECT: AN OVERVIEW

RADAR AND ITS COMPOSITE

ENVIRONMENT

INTRODUCTIONNTRODUCTION

The two most basic functions of radar are inherent in the word, whose letters stand for

RAdio Detection And Ranging. Measurement of target angles has been included as a

basic function of most radar, and Doppler velocity is often measured directly as a fourth

basic quantity. Discrimination of the desired target from background noise and clutter is aprerequisite to detection and measurement, and resolution of surface features is essential

to mapping or imaging radar. The block diagram of typical pulsed radar is shown in

Figure. The equipment has been divided arbitrarily into seven subsystems, correspondingto the usual design specialties within the radar engineering field. The radar operation in

more complex systems is controlled by a computer with specific actions initiated by a

synchronizer, which in turn controls the time sequence of transmissions, receiver gatesand gain settings, signal processing, and display. When called for by the synchronizer,

the modulator applies a pulse of high voltage to the radio frequency (RF) amplifier,

simultaneously with an RF drive signal from the exciter. The resulting high-power RFpulse is passed through transmission line or waveguide to the duplexer, which connects it

to the antenna for radiation into space. The antenna shown is of the reflector type, steered

mechanically by a servo-driven pedestal. A stationary array may also be used, with

electrical steering of the radiated beam. After reflection from a target, the echo signalreenters the antenna, which is connected to the receiver preamplifier or mixer by the

duplexer.


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A local oscillator signal furnished by the exciter translates the echo frequency to one or

more intermediate frequencies (IFs), which can be amplified, filtered, envelope orquadrature detected, and subjected to more refined signal processing. Data to control the

antenna steering and to provide outputs to an associated computer are extracted from the

time delay and modulation on the signal. There are many variations from the diagram ofFigure that can be made in radars for specific applications, but the operating sequence

described in the foregoing forms the basis of most common radar systems. This project

provides the basics of radar and many of the relationships that are common to most formsof target-detection radar. The emphasis is on the goals established for the radar or the

system that contains the radar.


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SYSTEM

DEFINITION


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CENTRAL ACQUISITION

RADAR

INTRODUCTION

The designed Radar would be a stand-alone all weather 3D surveillance radar. The radar

operates in S-band and is capable of Track-While-Scan [TWS] of airborne targets up to130 Kms, subject to line-of-sight clearance and radar horizon. The radar employs

Multibeam coverage in the receive mode to provide for necessary discrimination in

elevation data. It employs 8 beams to achieve elevation coverage of prescribed margin

and a height ceiling of prescribed margin. The antenna is mechanically rotated in azimuthto provide 360 coverage. To get an optimum detection performance against various class

of targets, different Antenna Rotation Rate [ARR] RPM modes are implemented and

these can be selected by the operator.

The unique feature of the radar is, its operation is fully automated and controlled from a

Radar Console with sufficient menus, keys and Hot keys. The designed Radar is anoffshoot of the fully and successfully developed and demonstrated radar called as 3D

Central Acquisition Radar (3D-CAR).

3D-CAR is designed to play the role of medium range surveillance radar mounted on a

mobile platform. The radar carries out detection, tracking and interception of targets withan RCS of 2m2 upto 130 Kms in range.

The antenna can be manually positioned at different look angles in steps. In the receivemode the eight beams cater for a height coverage of required margin. The IFF antenna is

placed atop the main antenna and it integrates the IFF for including of IFF data with the

Primary Radar Data.

The RDP (Radar Data Processor) is implemented on a SBC and is fully software-based

system with adequate memory and external interfaces to handle upto 150 target tracks.Robust algorithms for filtering are used to lock on to maneuvering target upto 6g without

loss of tracking.

LAN interfaces are used to communicate with external systems. High-speed data transfer

of target parameters can be done. This helps in data remoting upto a distance of 500 mtrs

that can be extended with suitable repeaters. Facility for manual track indication for low

speed targets and targets in heavy clutter zones are available to the console operator.

The color display has features for monitoring of radar performance, the radar output

selection for radar modes of operation. Interfaces to radar control signals are built-in. The


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Radar generates different videos viz., Analog and Digital videos at the Receiver and

Signal Processor. These are interfaced to the display over dedicated lines and displayedIn addition to providing real time data on screen for viewing, the consoles will provide

facility for training controllers/operators/ technical crew. The system is capable of

creating targets and assigns values for range, azimuth, height and speed as defined byoperator. It will enable the operator to control the motion of these targets for gaining/

loosing height, turning left/right, cruising, and rolling out. The software running on

console will provide an online handy aid, for target interception. The training part of thesoftware will be active as an offline facility or with tracked targets in real time. The

offline mode will be capable of using recorded data.

Salient features Radar are:

1. 3D Surveillance Radar2. S-BAND

3. Capable of Track While Scan (TWS) of airborne Targets upto 150 Kms

4. Coherent TWT based Transmitter

5. Planar Array Antenna with low side lobes6. Multiple beams in the receive mode.

7. ECCM (Side lobe blanking, Frequency Agility, Jammer analysis)8. Integrated IFF

9. System operation is controlled from Radar Console in Data centre.

10. Redundant Power supply unit with UPS backup.

I have been working in Transmitter section of CAR developed by BEL, Ghaziabad.

Before explaining the technical details of Transmitter of Radar, it is necessity to

understand the general working of Radar.

This designed Radar has the following subsystems:

1. Multi-beam Antenna system

2. Transmitter

3. Receiver

4. Signal Processor5. Radar Console

6. Data centre

7. Mobile Power Source8. IFF System

The Multi beam antenna system for Radar is planned to be realized to have 360Coverage in Azimuth and prescribed coverage in elevation. The antenna will have a widebeam in transmit mode and eight simultaneous narrow beams in receive mode to give

prescribed coverage in elevation.

The requirement of Transmitter is to amplify the pulsed RF signal from few watts to high

power RF signal while maintaining the phase noise (additive noise) to its minimal as

demanded by the system.


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The Low Power Microwave Subsystem includes the major portion of Receiver RFSystem of the 3D-Radar. The Multibeam Antenna receives the reflected signals from the

target. These signals are amplified by the Low Noise Amplifier, down converted to IF

Frequency using two-stage superheterodyne receiver. The IF Output is given as finaloutput of the Low Power Microwave Subsystem to be further processed in the signal

processor.

Customization of the console for user application will be carried out in the software andhardware. The Display Console is the operator's center to initialize, remotely setup,

operate, observe, and diagnose the radar, both online and offline. The Primary and

secondary radar video, target tracks, plots, geographical map along with other diagnostic

and configuration messages are presented in 2D.The Signal Processor for Radar is realized as 8 parallel and identical channels. Each

Signal Processor accepts IF videos from the corresponding RF Receiver channel (8

beams + 1 Omni) and provides detection reports to the Radar Data Extractor (RDE)independently for these 8 channels. The detection reports for each channel must have

range and strength information in addition to the associated flags. Jammer data is also to

be reported. Configuration and mode control, diagnostics and status reporting are done

through a Radar Controller (RC).The electronic equipment cabin is provided for installation of transmitter, signal

processor, receiver, display console, IFF equipment and a working place for maintenance.The Data centre is required to provide basic functions like viewing of the air picture,

remote operation of radar, and radio communication. At the same time the cabin provides

shelter for the operators, with reasonable level of comfort and, protected against heat, rain

and dust.Mobile power source is required to provide the main supply to Radar and Data Centre for

electronic and mechanical units of Radar including air conditioning units.

The Identification Friend or Foe (IFF) system is a good example of a secondary radarsystem that is in wide use in the military environment. A great deal of valuable

information can be provided to the secondary radar by the targets transponder. Thetransponder provides an identifying code to the secondary radar that then uses the codeand an associated data base system to look up aircraft origin and destination, flight

number, aircraft type and even the numbers of personnel onboard. This type of

information is clearly not available from a primary radar system.


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TRANSMITTER


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TransmitterINTRODUCTION

The transmitter for Radar is Coherent MOPA type that operates in S Band using TWT asthe final amplifier. The transmitter is used to amplify the pulsed RF signal from low

power RF signal to High power RF signal as demanded by the system. TWT dissipates

large amount of energy, therefore it is subjected to both air and liquid cooling.

The input to the transmitter is 3 phase, 415V, 50 Hz, which is later amplified to the

optimal value for driving the TWT amplifier.A generalized diagram here briefly explains the inputs and outputs of the transmitter.

Input output diagram of Transmitter

3-phase,400V,50Hz

3-channel liq cooling in

3-channel liq cooling out

Air cooling in

SP signals

Air cooling out

Dry air

BIT0

BIT1

PRETRG

GRID PULSE

RF outROHINI

TRANSMITTER

RF input

System status

RF PULSE


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The transmitter is designed to operate in the following modes defined as adequate

controlled states

Transmitter modes

a) OFF : All subsystems switched OFF

b) Cold Standby : Only LVPSUs , TWT heater and Grid biases areswitched ON. No High Voltage applied.

c) Hot Stand By : High Voltages applied, No RF and No gridPulsing.

d) Transmission : RF power delivered to Antenna / Matched load.

i) Full Power mode : Full RF Power delivered to theAntenna

ii) Reduced Power mode : The transmitter is operated at 1/10 of

its full power based on the selection by theuser.

iii) Fail safe mode : A low power at required duty

delivered to antenna through Solid StatePower Amplifier when liquid cooling fails.

Modes are selected by the operator.

Transmitter control

a) Local : To control through control panel on the

transmitter.

b) Remote control : To control from the operator console through

control interface RS422.


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MECHANICAL DESCRIPTION

Three rack configuration of Transmitter describes complete functionality of

Transmitter

1. Control Rack

Monitoring panel

Control panel

Synoptic panel

CPC

Inverter

2. High Voltage Rack

FDM (Solid state Switching)

Cathode Assembly

Collector Assembly

Blower Unit

Heater Unit

3. Microwave Rack

TWT

RF Plumbing

RF Drive Unit

SSPA

ION Pump Controller


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GENERAL DESCRIPTION

The Transmitter amplifies the pulsed RF signal from few Watts to many KW while

maintaining the phase noise (additive noise) to prescribed margin as demanded by the

system. In addition, a Solid State Power Amplifier (SSPA) is provided, as a stand byoption, to ensure fail-safe mode, in case of failure of liquid coolant.

It employs a Traveling Wave Tube as final power amplifier. Low power amplifier stage(RF Driver) amplifies pulsed RF signal from 1mW (0 dBm) to few W which is necessary

to drive the TWT amplifier.

The RF Driver stage uses a PIN attenuator transistor followed by power amplifiers to

amplify RF signal. This is followed by an isolator. The isolator protects the transistor

power amplifiers against excessive reflections from TWT. The signal is thereafter passed

through a DC, a RF switch and an attenuator to cater for the three transmission modes.The sampled output of the DC is used for monitoring the input RF signal to the TWT.

The RF Driver output is given to the input of TWT, which amplifies the pulsed RF signal

from few Watts to a level of many kW at the TWT output. High power RF plumbingcomponents are connected at the output of TWT.

The TWT output is given to an arc detector followed by a ferrite circulator. The Ferrite

circulator is used to protect the microwave tube against failure /damage due to reflected

power in case of excessive VSWR at Antenna input port. The output of

Ferrite Circulator is given to High Power Dual Directional Coupler (DDC), which is used

for measuring the transmitted and reflected power. If reflected power exceeds the

specified limit of VSWR, a video signal is generated to cut off the RF drive throughcontrol and protection circuit.

The output of the DDC is given to Antenna. To connect all the components in therequired form, flexible sections, E-bends, H-bends and straight sections are used.

Control and Protection Circuit ensures the sequential switching ON of the transmitter,

continuous monitoring and interlocking of various parameters, detection and indication oferrors.

All these are achieved by dedicated hardware and software.

Synoptic Panel consists of LEDs, switches and LCD display. LEDs are used to show the

status of the transmitter. They also show the fault, if any, in the transmitter. The LCDdisplay, mounted on Synoptic panel, is used to show the value of cathode voltage &

current, collector voltage and current. It also displays the Filament voltage and current,

Grid + ve and -ve voltages and RF forward power.

The Inverter unit converts the incoming ac supply to DC and then converts the DC to

high frequency AC (Pulse width controlled square wave) operating at 20 kHz. The outputof the Inverter unit is given to HV rack for generation of Cathode and Collector voltages

of the TWT amplifier.


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High Voltage Power Supply unit (HVPSU) is used to supply high voltage to collector and

cathode of the TWT.

The Floating Deck Modulator (FDM) unit generates filament voltage with surge current

protection and also generates grid +ve and grid -ve voltages. Switching of grid voltage asper pulse width and PRF requirements are also provided by FDM.

Cooling Unit is used to cool the various components of the transmitter. The TWT, HighPower Ferrite Isolator, high Voltage Power supplies and RF dummy load are cooled with

de-ionized water and ethylene glycol mixture.

Forced air-cooling is employed to cool other components using ambient air which isfiltered to ensure dust free air. The Dry Air unit ensures that the wave guide is at all times

pressurized and dry.

RF DRIVER TWT

FIL., GRID, CATHODE,

COLLECTOR SUPPLY

COUPLER

FWD AND

RFLECTED

PWR MONITOR

LIQUID COOLING

TOANTENNA

SSPA

W/G

SWITCH


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DETAILED DESCRIPTION

Control Rack

Control Rack provides the protection controls and indications. As mentioned before, this

rack is divided in five sections according to their functions.

1. Monitoring Panel

The Monitoring Panel provides monitoring ports for measuring of trigger signals to the

transmitter, liquid cooling status, collector and cathode Inverter currents and bridge

voltages. It provides an emergency switch OFF button and digital displays for collectorand cathode voltages.


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2. Control Panel

The control panel controls the power supplies of various units such as the fans, heater,

LVPSU, Inverter, Modulator, RF Drive Unit and SSPA. The hour meters for filament,EHT and RF are also placed on the control panel.

3. Synoptic Panel

Synoptic Panel is located above the Control and Protection Circuit (CPC). It indicates the

faults and status signals generated by CPC. Green LEDs represent status signals whileRed LEDs represent faults. Audio alarms are also provided to indicate faults.

4. Control and Protection Circuits

The CPC ensures the sequential switching ON/OFF of the transmitter, continuous

monitoring and interlocking of various parameters, detection and indication of errors.

CPC card Configuration comprises of ten different cards.

COMPARATOR CARD-I

COMPARATOR CARD-II

TO RADAR

CONTROLLER

CPC BLOCK DIAGRAM

COMPARA

TOR

CARD

S

EHT VOLSAMPLES

RF PARAMETERS

OPTICAL

LINKS&

F/V CARD

GRID VOL

SAMPLES

FIL

VOL & ISAMPLES

OPTO

ISOLATO

RCA

RD

SSPA

CTRL

CARD

COOLING

CONDITIONS

TIMING

CARD

RADARTIMINGS

SWITCH ON

COMMANDS

TO SOLID

STATE RELAYSFOR HV, MAINS ON

STATUS STATUS

FRONT

PANEL

WITH

SWITCHES,LED

& LCDDISPLAY

LCD

INTERFACE

SWITCH ON

COMMANDS

HV POWERSUPPLIES

EHT PROBES

CROW BAR

TWT

LIQUID

COOLINGUNIT

FLOATING

DECKMODULATOR

AT - 45KV

POWER

DISTRIBUTION

3 50Hz400V AC IN

RF DRIVER&

DIR COUPLERS

EHT CURRSAMPLES

BEAM CURR,COLL CURR

CATH CURR

INPUT

POWERSTATUS

CROW BAR SIGNAL

GRID

PULS

E

MICRO

-

CONT

ROLLER

CARD


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COMPARATOR CARD-III

TIMING CARD

SSPA CTRL CARD

F TO V CARD

OPTPISOLATOR CARD

MC-I CARD

MC-II CARD OPTO TRANSCEIVER CARD

5. Inverter

The Inverter is the main functional block of the (cathode/collector) HV Power supplies. A

number of indicators are placed on the front panel of the Inverter unit.

AC-DC CARD

CATHODE PROTECTION CARD

CATHODE IGBT DRIVER CARD

COLLECTOR PROTECTION CARD

COLLECTOR IGBT DRIVER CARD

SOFT START CARD

TEMPERATURE SENSOR CARD

ZENER CARD (For Cathode and Collector)

CURRENT SENSOR CARD (For Cathode and Collector)

CURRENT SENSOR (PEAK) CARD (For Cathode and Coll.)


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High Voltage Rack


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This is central block of the transmitter, where cabins for HV Cathode and Collector are

assembled. Above this is a FDM block where all the cards are installed and insulated

from the transmitter that works on HV.

As mentioned earlier, High Voltage Rack is divided in five more units. Each unit has itsdefined working.

1. FDM (Floating Deck Modulator)

Further in FDM there seven functional cards, which are as follows:

LVPS Card

Grid Bias Card Positive Grid Supply Card

Switch Card

Filament Supply & Timer Card-1 Filament Supply & Timer Card-2

V to F Card

Isol

ation

transfor

mer

230V- ph-ph

50HzFDM

FIL

GRID

CATHODE

Fil Voltage

Fil Current

Grid Positive

Grid negative

To CPCOptical links

To TWT

Grid PulseFrom CPC

Optical link


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Microwave Rack


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The functional block diagram of microwave unit is shown in the figure. The microwaveunit consists of the following functional assemblies:


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Low power amplifier [RF drive unit]

High power TWT amplifier

RF Plumbing, Wave-guide switch & dummy load

Solid state power amplifier (2 kW) for low power transmission mode

TWT ion pump supply

Resistive TWT anode divider

Microwave power measurement circuits

Air cooling components

Low Power Driver for TWT (RF Driver)

Low Power amplifier stage (RF Driver) amplifies pulsed RF signal from 1mW (0dBm) to

few Watts power, necessary to drive the TWT amplifier. This low power RF Driverconsistsof following stages:

(a) Transistor Power amplifier : Amplifies the Pulsed signal from

0dBm to 37dBm

(b) Separating isolator : Used to protect the transistor power amplifieragainst excessive reflections

from TWT.

(c) Directional Coupler : To monitor the power available at the input TWT.

Figure given below shows the Input and output diagram of RF Driver

High Power Microwave Stage

High Power Microwave consists of mainly TWT, which amplifies the pulsed RF signal

received from the RF Driver of few watt power to a level of 120 -185 KW at the TWT

RF DRIVER

To SSPA i/p

To TWT i/p

To CPC for RF drive failprotection

TWT drive MONITOR

RF IN

Control i/p from

CPC


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output followed by High Power RF plumbing components. Figure given below shows

the block diagram of high power chain.

High Power RF stage consists of:

Traveling Wave Tube (TWT)

Ferrite Circulator

Dual Directional Coupler (DDC)

High Power dummy load

Wave guide channel

Wave guide switch


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Traveling Wave Tube (TWT)

TWT is available in three different constructs, these are listed here:

1. Helix TWTs

These amplify relatively to low power levels, but it provides a very wide bandwidth, both

in octave and multioctave.

2. Ring Loop / Ring Bar TWTs

These amplify at relatively high power levels, and provide a wideband, that is of 25 % ofbandwidth.

3. Coupled Cavity TWTs

This TWT in family of TWTs provides highest amplified power levels. It has relatively

narrower bandwidth that is 10% to 15 % of bandwidth.

TWT is the main power amplifier used in the transmitter. A coupled cavity TWT type is

selected for this transmitter.

The collector in the TWT is further divided as:

1. Ground collector

2. Depressed collector

Single stage depressed collector

Double depressed collector Multi stage depressed collector


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Ferrite circulator

Ferrite circulator is used to protect the microwave tube against failure / damage due to

reflected power in case of excess VSWR at Antenna input port. The Four port Ferrite

circulator type is used as an isolator.

Dual Directional Coupler

High Power Dual Directional Coupler (DDC) is used for measuring the Transmit Power

and reflected power. If reflected power exceeds the specified limit of 2:1 VSWR, video

signal is generated to cut-off the RF drive through control and protection unit.

High power dummy load

High power dummy load is used to test the transmitter with out connecting the antenna

during standalone testing.

Wave-guide Channel

To connect all the components in the required form, flexible sections, E-bends, H-bends

and straight sections are used. Standard W/G sections are being used for this purpose.Microwave Channel (High Power)

-600

+800

RF IN RF OUT

LIQUID COOLING

-45kV,5kW

33kV,18kW

3kV,ION PUMP

-10V,10A

TWT POWER SUPPLIES CONNECTION DIAGRAM


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Figure below shows the schematic diagram of the microwave channel. The microwave

channel consists of high power amplifier using TWT amplifier and high power RFplumbing components.

Schematic Diagram of microwave channel

Antenna channel matching requirements

Mismatch in the antenna channel, being the load of the transmitter, significantly decides

of VSWR as seen from the TWT output. According to the Antenna System requirements,matching of the antenna channel at the transmitter output should be equivalent to VSWR

prescribed margin in frequency range of S band in which the radar operates. It seems to

be difficult to satisfy, because the TWT should operate at VSWR


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This system is a forced liquid-to-air type, used for cooling sub systems of the F-Band

Transmitter. The primary coolant used for circulation through this transmitter heat loadsis Dematerialized water / Glycol for operation from required range of temperature. The

transmitter employs liquid cooling for TWT, high power circulator, RF dummy load and

high voltage inverter and forced air-cooling for all other sub-assemblies. Independent ofair-cooling, a dry air with low dew point and dust particles should be applied for wave-

guide pressurizing and for TWT. General design of the cooling is worked out in such a

way that the temperature rise for outlet coolant is around 10C as compared to the inletcoolant.