mems hsinchu taiwan december 5, 2012 chair: michael gaitan (nist) co-chairs: robert tsai (tsmc) and...
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MEMSHsinchu Taiwan
December 5, 2012
Chair: Michael Gaitan (NIST)Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)
Work in progress – do not publish
Akihiro KogaArthur Morris
Asif ChowdhuryBrian Jamieson
Buzz HardyChengkuo LeeChris Apanius
Chris van HoofChristian Rembe
Chuck RichardsonDave Howard
Dimitrios PeroulisDominique Schinabeck
Don DeVoeEdward Chiu
Erik Jan LousFabio PasoliniFabrice Verjus
Fumihiko NakazawaGoro Nakatani
Hebert BennettHenne van Heeren
ToshibaWispryAnalog DevicesSB MicrosystemsMEMSCAPNational U of SingaporePromeusIMECPolyTeciNEMIJazz SemiconductorPerdueAcutronicUniversity of MDAsian Pacific MicroNXPST MicroKFM TechnologyFujitsuRohmNISTenablingMNT
Hiroshi ToshiyoshiIngrid De Wolf
Jae Sung YoonJim Spall
Jim MrvosJianmin MiaoJohn Rychcik
Joost van BeekJosh Molho
Karen LightmanKevin Chau
Koji FukumotoMarcie Weinstein
Mark CrockettMary Ann Maher
Mervi Paulasto-KröckelMichel BrillouetMonica TakacsPatric SalomonPete Loeppert
Raj GuptaRaji Baskaran
Rakesh Kumar
University of TokyoIMECKIMMDelphiLexmarkNanyang Tech UnivAcutronicNXPCaliperMEMS Industry GroupMEMStaffSonyAkusticaSEMISoftMEMSAalto UniversityLETIMEMS Industry Group4m2cKnowles AcousticsVolant TechnologiesIntelGlobal Foundries
Randall WagnerPhilippe Robert
Robert De NuccioRobert Tsai
Rob O’ReillyRon Horwath
Ron LawesSacha RevelScott Bryant
Shawn BlantonStephane Donnay
Stephen BartSteve Breit
Steve GreathouseSteve Walsh
Takashi MiharaTetsu TanakaTony Stamper
Veljko MilanovicWei-Leun Fang
Wendy ChenXiaoming Wu
Yasutaka Nakashiba
NISTLETIST MicroTSMCAnalog Devices Glimmerglass Ltd.Imperial CollegeAccutronicMANCEFCarnegie Mellon UniversityIMECMKS InstrumentsCoventorPlexusMANCEFMicromachine CenterTohoku UniversityIBMMirrorcle TechnologiesNTHUKYECLexmarkRenesas Electronics
MEMS Technology Working GroupChair: Mike Gaitan (NIST), Chair
Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)
From Yole Development at the MEMS Industry Group's M2M Workshop, May 2012
Len Sheynblat, Qualcomm, Sensors System Integration Problems, MIG M2M Workshop, Spring 2012
MEMS in Mobile Devices
DeviceManufacture
rs
Equipment and Materials SuppliersDesign HousesFoundries
SystemsIntegrators
MEMS Technology Working Group
iNEMI
MEMS TWG
ITRS MEMS Chapter Summary
• MEMS Device Technologies– Accelerometers – Gyroscopes– Inertial Measurement Units (IMUs)– Microphones– RF MEMS– Emerging MEMS
• Technology Requirements– Device Performance– Design and Simulation– Packaging and Integration– Device Testing
MEMS Inertial Sensors
• MEMS Inertial Sensors continue to incrementally increase in performance and lower in cost.
• The integration path of the Inertial Measurement Unit (IMU) has advanced to 9 degrees of freedom (DoF) in the package sooner then forecasted in the 2010 edition.
• Driving down the cost of testing of the IMU continues to be a challenge.
Example: 9 DoF IMU at Board Level
ST MicroelectronicsFeb 12, 2012
http://www.st.com/internet/com/press_release/p3273.jsp
MEMS Integration Node
MEMS Microphones• MEMS microphones are expected to continue to
increase in performance and lower in cost.
• Testing in the factory environment is an issue as MEMS microphone sensitivity advances to -68 dB.
• MEMS microphones will see advances in the ASIC to include digital output and adaptive signal processing (such as noise cancellation).
• Testing of MEMS microphones with adaptive signal processing is a challenge.
RF MEMS
• RF MEMS are intended to lower the power dissipation of the radio.
• RF MEMS are sill in the process of increasing their reliability and lowering cost before they can be adopted in mobile devices. – The biggest challenge in RF MEMS is enhancing
reliability and lifetime (# of operations)– Some of the future performance requirements have no
known solutions, (e.g., signal isolation requirements)
Critical Issues• There is little uniformity for reporting performance
characteristics in device data sheets. • A new terminology standard is in development and a
new iNEMI project is starting to standardize characterization protocols.
• MEMS manufacturers seek to lower the rising cost of testing as functionality increases.
• The volume of MEMS testing is lower than ICs but the cost of testing per device is much higher. Testing can consume 60% of the manufacturing cost.
• Potential solutions include:• Methodologies and validation for Wafer Level Testing. • Methodologies for Design for Test.
Plans for 2013• The MEMS Technology Working Group is affiliated with the
ITRS and iNEMI. • The iNEMI MEMS Chapter has been expanded to include consumer
health and automotive applications. These will be further expanded in the 2013 ITRS MEMS Chapter.
• Our TWG discussions are exploring the concept of sensor integration nodes.• We will incorporate magnetometers (electronic compass) and
pressure sensors (altimeter) in the roadmap.
• A new terminology standard for MEMS Sensors is being developed.• Driven by member companies in The MEMS Industry Group, which
include Intel, Qualcomm, ST Microelectronics, Bosch, and Freescale.
• An iNEMI project on MEMS Testing Requirements will be starting on defining testing protocols for device performance metrics in data sheets.
Conclusions
• Systems integrators play a key role in developing cooperation between the device manufacturers.
• MEMS Sensor Fusion creates challenges for testing as complexity increases while still lowering cost.
• MEMS device performance and testing requirements depend on the application (consumer electronics, automotive, medical, defense and aerospace).
• The concept of sensor integration path might facilitate longer term road mapping of MEMS and possibly other More than Moore Technologies.
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