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iNEMI Connector Reliability Test Recommendations Project
Presenter: Vince Pascucci, TE Connectivity
December 18, 2019
Agenda
• Background
• Introduction
• Phase 1 Review
• Phase 2 Review
• Project Current State
• Potential Benefits of the Proposed Framework
• Summary of Gaps
• Conclusions
2
Background
• One of the issues identified by the 2013 iNEMI connector survey
was that test methods for socket reliability (such as temperature
cycling, shock and failure analysis) are different across
socket/connector manufacturers
• Another issue was the associated criterion for 'passing' is not
consistent.
• An interest identified by the survey was Standard Reliability
Qualification, the need to drive standard reliability test conditions
and equipment capabilities across the industry
Background
Two phases of work have been completed to begin the
process of addressing these issues
Phase 1 and 2 Participants
(Phase 2) (Phase 1) (Phase 2) (Phase 1, 2)
(Phase 2) (Phase 1) (Phase 1) (Phase 1, 2) (Phase 1)
(Phase 2) (Phase 1) (Phase 1, 2) (Phase 2)
Introduction
• The increasing number of system interconnections and increasingly
diverse range of applications and use conditions present challenges for
aligning connector reliability requirements between Connector Suppliers
and Original Equipment Manufacturers.
5
1985 Corvette fuel injection
wiring harness
More than one connector
Since Late 20th
Century
• More Connectors in
Existing Devices
• More Devices
• Higher Densities ►
Smaller Size ►
Lower Force1980 Corvette carburetor
wiring “harness”
One connector
Increased Accuracy of Reliability Estimates is Necessary to:
• Ensure connectors are still reliable
• Avoid cost of excessive reliability
Introduction
The existing connector reliability testing standards do not
address the full range of connector applications nor have the
necessary detailed, defined test conditions and sequences.
6
E.g. It is estimated 1 watt out of every 50 watts produced
globally is used in data information centers
Large amounts of
airflow to remove
waste heat
Locations often
have high pollutant
gas and dust levels
Phase 1
7
Company Name* Member Role
IEEC Binghamton Univ. Benson Chan Team Member
Dell Phil Conde Team Member
Rosenberger Christian Dandl Team Member
Intel Ife Hsu Team Member
Lotes Bob Martinson Team Member
TE Connectivity Vince Pascucci Chair
Lucent-Alcatel / Nokia Anne Ryan Team Member
Phase 1 Overview
The iNEMI Phase I project1
• Surveyed connector manufacturers’ and users’
reliability concerns
• Proposed a standardized connector reliability test
protocol
• Proposed a standard listing of Levels of Interconnect
• Proposed the use of the test protocol and levels of
interconnect in combination as a framework for
developing standardized reliability tests
8
1 SMTAI 2016, pp 518-528.
A recommended testing protocol was developed through review of existing
industry standards
Basis of Review
• Use of defined application classes
• Use of specified test conditions in a defined test sequence
• Physics-of-failure approach for Reliability- Subjecting individual test groups to multiple stresses allowing interaction of potential degradation mechanismswhich cause contact resistance failures
• Guidance on performance data evaluation and lifetime simulated
9
Specification / Standard
Criteria EIA 364F 1 EAI 364-1000 2 ISO/TR 29016 3 IEC 61586-TS 4
Application Classes Y Y Y N
Specified Test Conditions Y Y N N
Physics-of-Failure Approach for Reliability
N Y N Y
Guidance on Performance Data Interpretation
N N N Y
Phase 1 – Standardized Test Protocol
1. EIA 364F: Electrical Connector/Socket Test Procedures Including Environmental Classifications
2. EIA 364-1000: Environmental test methodology for assessing the performance of electrical
connectors and sockets in controlled environments
3. ISO/IEC TR 29106: Introduction to MICE environmental classification
4. IEC 61586-TS: Estimation of the reliability of electrical connectors
Standardize List Adopted
• Tier 1: On-Chip
• Tier 2: Chip-to-Package
• Tier 3: Package-to-Board/PCB
Mount
• Tier 4: Board-to-Board*
• Tier 5: Input-Output / Chassis-to-
Chassis
• Tier 6: Intersystem Cabling
• Tier 7: Long Haul
Telecom/Datacom
Phase 1 – Standardized Levels of Interconnect
*Tier 4 modified to Board-to-Board, Board-to-Subassembly, Subassembly-Subassembly in
Phase 2
In General: Interconnect level defines stress types and reliability requirements
In General: As Level ▲, required reliability ▼, but Range of Stresses ▲
Industry Survey: Used to create a standardized levels of interconnect list
Framework Objective: Define test protocols specific to connector relevant levels
Phase 1 - Proposed Framework Basis
11
Connector Tier
Degradation Mechanism/Stress
Stress
Level
Test Conditions Reference
Standard(s)
1 Low Temp/ duration x
2 Med Temp/duration y
3 High Temp/ duration z
Stress Level Use Conditions Use Case Descriptor
1 Controlled Indoor
2 Uncontrolled Indoor
3 Outdoor
Increasing
severity
Ln
K
1/Temperature
Phase 2
12
Company Name* Member Role
Amphenol ICC Jeffrey Toran, Bob Druckenmiller Team Members
Dell Phil Conde, Vasu Vasudevan Team Members
DOW Michael Lipschutz Team Member
Keysight Jyoti Gupta Co-Chair
Keysight Yen-Han Oon Team Member
Nokia Holly-Dee Rubin Co-Chair
TE Connectivity Vince Pascucci Team Member
Wistron Cindy Han, Seven Cheng Team Members
Keysight Shane Kirkbride Former Chair
CALCE Carlos Morillo Former Co-Chair
Keysight Li-Siah Tai Former team member
*company with which member was associated at
time of participation
Phase 2 Overiew
The iNEMI Phase II project2
• Focused on Tier 4 (Board-to-Board / Board-Subassembly / Subassembly-
to-Subassembly) applications
• Populated the Phase 1 test framework with defined stress levels and
associated test conditions to evaluate the expected degradation of Tier 4
connectors in a defined set of application classes.
• Test sequences are based on EIA 364-1000B “Environmental test
methodology for assessing the performance of electrical connectors and
sockets in controlled environments”
• Expanded range of environments in 364-1000B and proposed additional
stresses such as dust exposure
13
2 IEEE/Holm 2019, pp 324-334
Test Sequence Recommendations
Recommended additions are highlighted
Test Order
Tests Required for All Connectors
Tests for Connectors
w/Noble Metal Finish
Tests for Connectors with
Tin Plate (optional for
<0.38 um Gold plate)
Tests for Connectors with surface
treatment or short wipe length (<0.127mm)
Tests for Connectors with more than 50
mate/unmate cycles
1 2 3 4 5 6 7
1Contact Resistance Contact Resistance Contact Resistance Contact Resistance
Contact Resistance Contact Resistance
Dielectric Withstanding Voltage
2
Mate/Unmate Cycles (preconditioning)
Mate/Unmate Cycles (preconditioning)
Mate/Unmate Cycles (preconditioning)
Mate/Unmate Cycles (preconditioning)
Mate/Unmate Cycles (preconditioning)
Mate/Unmate Cycles (preconditioning) Contact Resistance
3
Temperature LifeDust (preconditioning)
Temperature Life (preconditioning)
Thermal Shock (preconditioning)
Thermal Shock (preconditioning) Dust Mate/Unmate Cycles
4Contact Resistance Thermal Shock
Dust (preconditioning)
Temperature Life (preconditioning)
Temperature Life (preconditioning) Contact Resistance Contact Resistance
5 Reseating (mate/unmate) Contact Resistance Vibration Contact Resistance
Contact Resistance
Thermal Cycling (disturbance)
Dielectric Withstanding Voltage
6Contact Resistance
Temp/Humidity Cycling Mechanical Shock Mixed Flowing Gas Thermal Cycling Contact Resistance
7Contact Resistance Contact Resistance Contact Resistance
Contact Resistance
Reseating (mate/unmate)
8Reseating (mate/unmate)
Thermal Cycling (disturbance)
Reseating (mate/unmate) Contact Resistance
9Contact Resistance Contact Resistance
Contact Resistance
10Reseating (mate/unmate)
11 Contact Resistance14
E.g. Thermal Shock (pg 1 of 2)
Stress Levels: Stress levels 1, 2 and 3 are ranges expected inclusive of
shipping and normal operation. See next slide for associated recommended
test levels
Recommended Tests: Duration at temperature according to specimen
mass per EIA 364-32
Stress
LevelTemperatures Use Case
1 -55 °C to +85 °CPortable equipment; equipment mounted in
weather protected & movable enclosure;
Equipment mounted near a door/window or
other that when opened, would expose the
equipment to air of significantly different
temperature. Equipment mounted in non-
weather protected environment.
2 -65 °C to +105 °C
3 -65 °C to +125 °C
4
More severe environments requiring harsher
testing than those
above.
15
E.g. Thermal Shock (pg 2 of 2)
Recommended Test conditions (Testing per requirements of EIA 364-32)
i. Recommended test conditions for Test Group 2 reflecting shipping,
storage and normal operation temperature extremes
If thermal shock is expected to occur during operation:
• Appropriate test condition recommendations still need to be developed,
most likely with reduced ΔT but increased number of cycles
• In the interim, recommend test conditions in ii below
ii. Recommended test conditions for Test Groups 4 and 5 (preconditioning
intended to reflect shipping and storage only)
Stress
Level
Test
conditionComment
1 I -55 °C to + 85 °C temperature range, minimum 5 cycles
2 II -65 °C to +105 °C temperature range, minimum 5 cycles
3 III -65 °C to + 125 °C temperature range, minimum 5 cycles
4 To be defined in the referenced connector specification,
customer specification or industry association specification
16
17
Level
Op.
Temp.
Application
Type
Operating hrs
≤8,760
Operating hrs
>8,760 to 87,600
1 ≤ 30 oC
Typical
61 hrs, 60 oC 115 hr, 60 oCCritical
2
31 oC
to
55 oC
Typical
220 hrs, 70 oC
51 hrs, 80 oC
421 hrs, 70 oC
96 hrs, 80 oC
Critical
787 hrs, 70 oC
177 hrs, 80 oC
1527 hrs, 70 oC
337 hrs, 80 oC
3
56 oC
to
80 oC
Typical
577 hrs, 90 oC
142 hrs, 100 oC
1115 hrs, 90 oC
269 hrs, 100 oC
Critical
1920 hrs, 90 oC
456 hrs, 100 oC
3767 hrs, 90 oC
879 hrs, 100 oC
4
81 oC
to
105 oC
Typical
687 hrs, 115 oC
352 hrs, 120 oC
1331 hrs, 115 oC
676 hrs, 120 oC
Critical
2117 hrs, 115 oC
1069 hrs, 120 oC
4159 hrs, 115 oC
2082 hrs, 120 oC
E.g. Temperature Life / Heat Age
• Stress relaxation accelerated by elevated temp.
• Reduction in normal force and contact stability
• Issue: Product temperature ratings limit test
temperatures resulting in long test times to
replicate stress relaxation for lifetimes beyond
5 years
Most relaxation occurs early
Recommendations:
• 2 Life Classes• ≤ 8,760 (1 yr.) Operating Hours
• > 8,760 Op. Hr. – Basis: 17,520
Op. Hr. (2 yr. continuous) life
• Two Application Classes• Typical: Max Op. Temp. at 67th
percentile of range
• Critical: Op. at Max. of Range
Project Current State
18
Potential Benefits of the Proposed Framework
19
The Framework can Provide • A standard set of application classes with standard test
conditions for each application class
• A standard set of test sequences which better replicate the
performance of connectors subjected to multiple potentially
interacting stresses
This may then allow:• Connector manufactures can select application classes to which
they will qualify a specific product and test to industry standard
conditions for those classes
• Connector users will be better able to assess the applicability of
a given connector to their specific application conditions and
performance requirements
Summary of Gaps
• Proposed Framework/Methodology proof-of-concept
• Temperature Life recommendations for other contact alloys
• Fine dust particle effects
• Corrosive dust guidance
• Operational thermal shock test conditions and guidance
• Guidance for use of in-situ low-level contact resistance measurements during thermal shock
• Guidance/comments re consideration of Temperature Coefficient ofResistance when defining the resistance requirement/failure criteria
• Review/Update Mixed Flowing Gas test conditions & test times, acceleration factors, and test parameter control
• Recommendations for performing specialty tests
• Test conditions for other connector tiers
20
Conclusions
• With some modifications, the test sequences and report elements
recommended in EIA 364-1000:
• Can be extended for connectors intended for use in a broader
range of applications including uncontrolled environments
• Can provide a framework to standardize connector performance
evaluation within defined classes use conditions thus allowing a
more efficient and effective industry approach to connector
testing and selection
• In many cases, use condition stress levels and associated test
conditions can be based on existing test standards.
• There are gaps to address, especially in uncontrolled environments,
which should guide additional activities.
21
For further information contact:
Grace O’Malleyemail: gomalley@inemi.org
22
Join us at APEX 2020
iNEMI Sessions
@ the Intersection of International Electronics Manufacturing
Wednesday, February 5,
1.30-5.00pm
Technology Forum on PCB Challenges and Needs
for Emerging Applications
1.30 – 3.00pm: Panel + Q&A: Application Driving Needs
3.30 – 5.00pm: Panel + Q&A: Technology Challenges
Input from OEMs, EMS, Material Suppliers, Fabricators
23
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