2019 impact-iaac program...2019 packaging session pcb session poster session plenary session special...
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2019
Packaging Session
PCB Session
Poster Session
Plenary Session
Special Session
Joint Session
Day1- Wednesday October 23, 2019
Room 505 a+b+c
10:00-10:20 IMPACT-IAAC 2019 & ICFPE 2019 Joint Opening & Award Ceremony
10:20-11:00 Joint Plenary Speech I: The Past, Present, and Future of OLED Displays Dr. Ching W. Tang, Hong Kong University of Science and Technology, Hong Kong
11:00-11:40 Joint Plenary Speech II: Electronics Manufacturing Challenges and Opportuni�es: Closing the Gaps via Collabora�ve Innova�on Dr. Marc Benowitz, the iNEMI CEO, USA
11:40-12:20 Joint Plenary Speech III: The Drama�c Past, Present, and Future of Flexible Electrophore�c Display Technology Dr. Michael D. McCreary, Chief Innova�on Officer, E Ink Corpora�on, USA
12:20-13:10 Lunch, The Banquet Hall, 3F
Room 505 a 505 b 505 c 506
13:10-15:10 【J1�S1】Joint Session:Wearable 【S2】Form Factor(SPIL) 【S3】5G (Atotech) 【S4】Advanced
Packaging-1
15:00-16:00 <Packaging> Poster Interac�ve Presentaion � Coffee break (15:10-15:40)
15:40-17:40 【J2�S5】Joint Session: Heterogeneous I 【S6】iNemi 【S7】JIEP Session 【S8】3D integra�on & SiP
18:00-20:00 2019 TPCA Show, IMPACT-IAAC 2019 Joint Recep�on (Standing Buffet), 3F, Hall 1
Day2- Thursday October 24, 2019
Room 505 a+b
09:00-09:40 Joint Plenary Speech IV: 3D Chip Stacking Technologies for the FutureTeruo Hirayama, Execu�ve Chief Engineer, Sony Corpora�on, Japan
Room 505 a 505 b 505 c 506 504c
10:10-12:10【S9】5G Innova�ve
Technology (Nanya Plas�cs)
【S10】ICEP Session【S11】
Interconnec�on & Nanotechnology
【S12】 Machine learning Applica�ons
【S13】Advanced and Green Materials
and Process
12:10-13:10 Lunch, The Banquet Hall, 3F
13:10-15:10 【S14】AIOT (ASE) 【S15】Market Trend 【S16】Advanced Packaging-2
【S17】Fan-out Packaging Technology
【S18】HDI and Embedded
Technology
15:00-16:00 <PCB> Poster Interac�ve Presentaion � Coffee break (15:10-15:40)
15:40-17:40 【S19】IAAC 【S20】Heterogeneous II
【S21】Pla�ng & Electroless Process
【S22】Thermal Management
【J3�S23】Organic and
Printed Electronics Associa�on
18:00-20:30 IMPACT-IAAC 2019 & ICFPE 2019 Joint Interna�onal Welcome Dinner & 2018 Best Paper Award Ceremony (by invited)
Day3- Friday October 25, 2019
Room 505 a+b
08:50-09:30 Joint Plenary Speech V: Co-Design of Advanced Packaging and Process Technology for 5G Evolu�onDr. Yujun Li, Director, TSMC, Taiwan
09:30-10:10 Joint Plenary Speech VI: New Package Developments for 5G: From Infrastructure to Mobile Dr. Jan Vardaman, President, TechSearch, USA
Room 505 a 505 b 505 c 506 504 b
10:30-12:30 【S24】Embedded Session
【S25】Technical Solu�ons for Future
5G Mega Trend (AT&S)
【S26】5G Communica�on &
Solu�on【S27】Power
Electronics�Devices【J4�S28】Flexible Hybrid Electronics
12:30-13:30 Lunch, The Banquet Hall, 3F
13:30-15:30 【S29】 Advanced Packaging-3
【S30】DMT(Design, Modeling &
Test)
*The organizer reserves the right to modify the agenda.
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Floor Plan
Conference Room Dining Room(Conference Attendees Only)
Coffee Break WiFi
@
5F
3F
IMPACT-IAAC 2019
1F
TPCA Show & IMPACT Reception Party
(Banquet)
@WIFI for 5F
Poster Poster Poster
PosterPoster
VIP Lounge
RegistrationSpeaker Review Room
Room 0534
2019
TPCA Show & IMPACT Joint Reception
Room504c
Room504a
Room504b
Room505c
Room506
Room505a
Room505b
Organizer’s Office
Conference Agenda . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Inside Cover
Organizer, Co-Organizer and Sponsor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Greeting of ChairWelcome Message from Chih-I Wu, Conference General Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Welcome Message from Kuo-Ning Chiang, Conference Honorary Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Welcome Message from Shen-Li Fu, Conference Co-Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Welcome Message from Ming-Yi Tsai, Conference Co-Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Welcome Message from Maurice Lee, Conference Co-Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Committee Member . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
General InformationAbout Conference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
TPCA Show & Welcome Reception / International Welcome Dinner & Best paper Award Ceremony
/ IMPACT Best Paper 2018 / Identification Badge / Registration Desk / VIP Room / Organizer's Office
/ Poster Session / Internet Access / Excursion Tour / Hotel Information / Inquiries . . . . . . . . . . . . . . . . . . 12-17
ConferencePlenary Speeches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Packaging Poster Interactive Presentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
PCB Poster Interactive Presentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
IMPACT SponsorAmkor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
ASE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Atotech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
AT&S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
GHS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Nanya Plastics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Tango . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
SPIL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Trillion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
AMAT / Unimicron . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Note . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Pre-Announcement- IMPACT 2020 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Inside Back Cover
Index
2019
Organizer
TAIWAN PRINTED CIRCUIT ASSOCIATION (TPCA)
Surface Mount Technology Association (SMTA)
TAIWAN THERMAL MANAGEMENT ASSOCIATION (TTMA)
Co-Organizer
INTERNATIONAL ELECTRONICS MANUFACTURING INITIATIVE (iNEMI)
2019 InternationalConference onElectronicsPackaging
International Conference on Electronics Packaging (ICEP)
Communication Research Center, (NTU)
Special Session
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TAIWAN (ITRI)
INTERNATIONAL MICROELECTRONICS AND PACKAING SOCIETY TAIWAN (IMAPS Taiwan)
IEEE ELECTRONICS PACKAGING SOCIETY
SILICONWARE PRECISION INDUSTRIES CO., LTD.(SPIL)
NAN YA PLASTICS CORPORATION
ADVANCED SEMICONDUCTOR ENGINEERING INC. (ASE)
Austria Technologie & Systemtechnik Aktiengesellschaft
Atotech Taiwan Limited
I-SHOU University (ISU) Korea Advanced Institute of Science and Technology
The Korean Microelectronics and Packaging Society (KMEPS)
National Tsing Hua University (NTHU)
1 ▲
Goverment Sponsor
Industrial Development Bureau,Ministry of Economic Affairs
Engineering & TechnologyPromotion Center
Department of Information and Tourism, Taipei City Government
Ministry of Education
2019 Sponsor
Media Partner
Yole Developpement
Unimicron Technology Corporation Unitech Printed Circuit Board Corp.
Amkor Technology Applied Materials Taiwan, LTD. DuPont Electronics & Imaging
TRIALLIAN CORP. Taiwan Semiconductor Manufacturing Company Limited (tsmc)
Underwriters Laboratories (UL)
JSR Corporation MacDermid Performance Solutions Taiwan Ltd.
Performance Solutions Taiwan Ltd.Tango Systems Inc.
Eternal Materials Co.,Ltd. Goal Searchers Co., LTD Taiwan Branch Ichia Technologies., INC.
▲
2
2019
Chih-I Wu, Ph.D.Chair of IMPACT-IAAC 2019Vice President & General Director, ITRI
Welcome Message from Chih-I Wu, Conference General Chair
Chih-I Wu, Ph.D.Chair of IMPACT-IAAC 2019Vice President & General Director, ITRI
On behalf of the IMPACT committee, it is my great pleasure to deliver you a warm welcome to the 2019 International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) from October 23-25 in Taipei, Taiwan .
The theme of this year is "IMPACT-IAAC on 5G-Evolution& Revolution"exploring packaging and PCB technology for 5G generations and material processing applications . To prepare this 3-day conference, our Technical Program Committee and the dedicated team of IEEE EPS-Taipei, iMAPS-Taiwan, TPCA and ITRI have worked tirelessly to arrange rich and varied programs with plenary speeches, special sessions, invited talks, sponsored industrial sessions, posters and outstanding paper presentations .
Moreover, in conjunction with the ICFPE (International Conference on Flexible and Printed Electronics), IMPACT anticipates to not only bring worldwide leading experts and engineers together in sharing state-of-the-art advanced microelectronic packaging and PCB technology but also bring informative programs and network to all the participants this years.
It is again our great honor and pleasure to welcome you to participate in this conference . We cordially hope that you will enjoy the insightful and inspiring technical discussions along with the warm hospitality here in Taiwan .
Sincerely,
3 ▲
Greeting
Welcome Message from Kuo-Ning Chiang, Conference Honorary Chair
Kuo-Ning Chiang, Ph.D.NTHU Chair Professor Academician, International Academy of Engineering (IAE) - Russia Fellow, IEEE / STAM / ASME / iMAPS Editor-in-Chief, Journal of MechanicsSenior Area Editor, IEEE Transactions on CPMT Topical Editor, IEEE AccessChairman, Society of Theoretical and Applied Mechanics
As the conference honorary chair of IMPACT-IAAC 2019, it is my great pleasure and privilege to welcome the participants from all over the world who came here to share/exchange experience and work together a few days on the microsystem/circuits/packaging/PCB annual event here in Taipei. IMPACT is one of the world leading electronic packaging conference and has more than 600 attendees, 200 papers presented and with a large exhibition, TPCA show, each year . IMPACT will cover a wide range of important topics related to future and current trends in electronic packaging and PCB technologies, the agenda of the IMPACT-IAAC 2019 includes Heterogeneous integration, Form Factor, 5G, AIOT, Embedded and Wearable related technologies, etc . I expect this conference to be an excellent platform for you to share knowledge, catch packaging trends and exchange research/development ideas .
I sincerely hope you will enjoy the program and networking environmentat these few days,I wish you every success with this important conference. Thank you for your participation.
Kuo-Ning Chiang, Ph.D.NTHU Chair Professor Academician, International Academy of Engineering (IAE) - Russia Fellow, IEEE / STAM / ASME / iMAPS Editor-in-Chief, Journal of MechanicsSenior Area Editor, IEEE Transactions on CPMT Topical Editor, IEEE AccessChairman, Society of Theoretical and Applied Mechanics
▲
4
2019
Welcome Message from Shen-Li Fu, Conference Co-Chair
Shen-Li Fu, Ph.D.Chair, IEEE EPS – TaipeiHonorary President & Distinguished Chair Professor, I-Shou UniversityPresident, SMTA-Taiwan
Dear Colleagues,
I am delighted to welcome you to the “IMPACT-IAAC 2019 Conference” . All the participants will be benefited from various sessions organized by the Technical Program Committee and the Organizers including ITRI, IEEE EPS-Taipei, IMAPS-Taiwan, and TPCA . The organizers dedicate to develop the international conference to bring access to cutting-edge technology trends and international collaboration opportunities .
Besides the plenary speeches and the invited speakers in “Packaging”, “Thermal” and “PCB”, there are nine special and industrial forums . The special forums include: Automotive, Heterogeneous Integration, ICEP Japan, JIEP, Embedded Technology and 5G . The industrial forums include: Advanced PCB, High Speed & Frequency, and AI .
The conference brings together the world’s leading researchers, engineers, and the industrial experts . It is for sure that we will be organizing a successful conference, and the experience with IMPACT-IAAC 2019 will be fruitful and long lasting .
Best regards,
Shen-Li Fu, Ph.D.Chair, IEEE EPS - TaipeiHonorary President & Distinguished Chair Professor, I-Shou UniversityPresident, SMTA-Taiwan
5 ▲
Greeting
Welcome Message from Ming-Yi Tsai, Conference Co-Chair
Ming-Yi Tsai, Ph.D.Co-Chair of IMPACT-IAAC 2019 Chairman, IMAPS-TaiwanProfessor, Chang Gung University
Dear Colleagues and Friends,
Welcome all of you to join this great annual event, the 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT-IAAC 2019). On behalf of the Conference Co-Chair, I would like to express our gratitude to all of you for taking your time to attend this world-leading IC packaging and PCB conference and exhibition in the next three days.
The conference is gathering more and more packaging/PCB professionals from industries, research institutes, and academia to discuss about new trends, technologies, and opportunities . It also provides a great platform for all of you to build the friendships, exchange information, create new ideas, and make new contact for further collaboration. Therefore, it is expected that there will be a lot of interactions, learning and sharing activities going between you and other attendees during the conference .
We wish all of you have the wonderful meeting, gain new knowledge for future innovation and make new friendships during this conference. Hopefully, you have a fruitful and enjoyable stay in Taipei and a successful year ahead .
Best Wishes,
Ming-Yi Tsai, Ph. D.Co-Chair of IMPACT-IAAC 2019 Chairman, IMAPS-TaiwanProfessor, Chang Gung University .
▲
6
2019
Welcome Message from Maurice Lee, Conference Co-Chair
Maurice LeeCo-Chair of IMPACT-IAAC 2019Chairman, TPCAPresident, PCB SBU I,Unimicron Technology Corporation
On behalf of IMPACT organizer, it is my great pleasure to welcome you to Taipei, Taiwan, for the 14th International Microsystems, Packaging, Assembly, Circuits Technology Conference. IMPACT is celebrating its 14th anniversary of bringing worldwide leading experts and engineers together in foster discussions and hopes to inspire participants from a various themes to initiate collaborations within and across disciplines for the advancement of our field in advanced microelectronic packaging and PCB technology . Our technical program is enriched with 6 plenary speeches, 4 joint sessions, 11special sessions, 77 invited speakers and around200 technical papers. Besides, we are glad to share with the Outstanding paper Award, Student Paper Award and Best Poster Awards with you . We also expect to provide technical demonstrations, and numerous opportunities for international networking.
As TPCA Chairman, I know that the success of the conference depends ultimately on many people who have worked with us in planning and organizing both the technical program and supporting social arrangements . Recognition should go to the Program Committee and Local Organizing Committee members who have all worked extremely hard for the details of important aspects of the conference programs and social activities. The future of Taiwan PCB industries link closely with packaging, semiconductor, design houses and end-product assembly shops; therefore, we dedicate to develop the international conference to bring accesses to cutting-edge technology trends and international collaboration opportunities . This year, we believe IMPACT-IAAC 2019 will bring a great impact towards breakthrough innovation.
We invite all of our TPCA members to come to Taipei Nangang Exhibition Center and to make the IMPACT-IAAC 2019 another vibrant, highly productive, and strong event . We particularly invite close involvement and participation of scientists, leaders and pioneers to join us in this annual theme conference in Asia .
Best Regards,
Maurice LeeCo-Chair of IMPACT 2019Chairman, TPCAPresident, PCB SBU I,Unimicron Technology Corporation
7 ▲
Greeting
Chih-I WuChair of IMPACT-IAAC 2019
Kuo-Ning ChiangNTHU
Ming-Yi TsaiChairman, IMAPS-Taiwan
Shen-Li FuISU
Maurice LeeTPCA
Mike MaAmkor
General Chair Honorary Chair Executive Co-ChairCo Chair
Committee Member
Technical Program Committee
Albert LanApplied Material
CP HungASE
Andreas WippelAT&S
James TsaiAtotech Taiwan Ltd .
Joshua JiangNanya Plastic
David TsengSPIL
Executive Co-Chair
Albert YehTriallian Corp .
Shin-Puu JengTSMC
Eric FengTTMA
Ravi Mullapudi Tango Systems
Executive Co-Chair
Wei-Chung LoITRI
Albert WuNCU
Andreas OstmannFraunhofer IZM
Ben-Je LwoNational Defense University
C. Robert KaoNTU
C.Y.Huang (Lewis)Senju Metal
Sub-CommitteeChair
Chang-Chun LeeNTHU
Charles BauerTechLead
Charlie LuTSMC
Chien-Yuh YangNCU
Chih ChenNCTU
Chih Hang TungTSMC
Sub-Committee Sub-Committee
▲
8
2019
Chuan-Seng TanNTU
David TarngASE
Fan-Yi OuyangNTHU
Gengshin ShenChipMOS
Haley FuiNEMI
Hsien-Chie ChengFCU
Jason LeeBoardTek
Jeffrey LeeIST
Jenn-Ming SongNCHU
Jimmy HsuINTEL
John LiuBoardTek
Kuan-Jung ChungNCUE
Kuan-Neng ChenNCTU
Kuoming ChenUMC
Kyung W. PaikKAIST
Lih Shan ChenISU
Lin Po-YaoTSMC
M. Y. TsaiCGU
Sub-Committee
Ming-Tzer LinCHU
Shaw Fong WongINTEL
Shih-Kang LinNCKU
Tz-Cheng ChiuNCKU
Tzong-Ming LeeITRI
Wei-Keng LinNTHU
Sub-Committee
Wei-Ping DowNCHU
Wen-Hsiang HsiehTAETI
Wun-Yan ChenITRI
Yasumitsu OriiNAGASE
Yu-Hua ChenUNIMICRON
Yu-Jung HuangISU
Sub-Committee
9 ▲
Committee
Eiji HigurashiAIST
Hiroshi YamadaToshiba
Hitoshi SakamotoHuawei
Johan LiuChalmers
Jung WangFUDAN
Kanji OtsukaMeisei University
Kwang-Lung LinNCKU
Marc BenowitziNEMI
Masaru IshizukaToyama
Ning-Cheng LeeIndium Corp
Noriyuki MiyazakiGERI
Penney YangAmazon
Rolf AschenbrennerFraunhofer IZM
Rozalia BeicaDuPont
Sung Yi PSU
Takafumi FukushimaTOHOKU U .
Takeyasu SAITOOPU
Ying-Hui WangIMECAS
Yung-Yu HsuAPPLE
Yu-Po WangSPIL
Zhuo LiFUDAN
International Advisory Board
Chris BaileyU of Greenwich
Shi-Wei Ricky LeeHKUST
Andy TsengJSR
Bo-Ping WuHuawei
Cheong Kuan Yew USM
Chew Chee Hiong ON Semiconductor
Chair Co-Chair
▲
10
2019
Domestic Advisory Board
Stephen WangEternal
Wendy ChenKYE
Local Committee
C. H. HsuUnitech
Dyi-Chung HuSiPlus
George YangAtotech
Hung-Yin TsaiNTHU
Irving LeeUL
James Tsai Atotech
Chair
Shu-Feng WangITRI
Hsiang-Chen HsuISU
David LaiTPCA
Michelle HungTPCA
Chair Co-chair Sub-Committee
11 ▲
Committee
General Information of IMPACT-IAAC 2019
IMPACT-IAAC 2019 Conference, which is organized by IEEE EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, is the largest gathering of packaging and PCB professionals in Taiwan. This year will be held in conjunction with TPCA SHOW 2019 on Oct . 23rd-25th at Taipei Nangang Exhibition Center . For grasping the latest trend, the symposium highlights the theme “IMPACT-IAAC on 5G-Evolution& Revolution.” The emergence of the fifth generation of mobile communications with its emphasis on massive MIMO and channel bandwidths over 1 GHz at mmWave frequencies is set to change everything we used to know about the design, validation and operation of cellular systems.
IMPACT-IAAC 2019 looks at the technical implications of the validation of cellular systems, and in particular the necessity of moving to radiated testing of systems where beam-steered antenna arrays are used at both ends of the link in highly dynamic 3D fading environments. Credible solutions need to be found urgently for the timescales for the proposed deployment of 5G in 2020 are to be realized .IMPACT-IAAC 2019 arrange plenary speeches, special sessions, invited talks, industrial sessions, posters and outstanding paper presentations. Furthermore, IMPACT-IAAC Conference keeps collaborating with international organizations such as ICEP from Japan and iNEMI from U.S.A.
We are pleased to bring you the annual technology gala of packaging, microsystems, assembly, PCB, materials and thermal . Hope you can enjoy the over 200 papers, speeches, posters and discussions . We sincerely pledge this conference can bring you access to meet industrial best practice, to create an opportunity for networking, and to build international collaborations .
Registra�on & Poster area
0534Speaker
Review Room
Organizer’s Office
VIP Lounge
504a 504b 504c 505a 505b 505c 506
電梯Elevator
陽台
About Conference■ Date: October 23(Wed) - October 25 (Fri), 2019■ Venue: Taipei Nangang Exhibition Center, Taipei■ Exhibition : TPCA Show 2019■ Theme: IMPACT-IAAC on 5G-Evolution& Revolution
Registration Desk
Reception desk is located on 5th floor of Taipei Nangang Exhibition Center . Please check in and get proceeding during the following scheduleOpen Hour: 10/23 08:30-16:30 10/24 08:30-16:30 10/25 08:10-15:00
Organizer Office & Speaker Preview Room
Organizer’s office on the 5th floor of Taipei Nangang Exhibition Center .Open Hour: 10/23 08:30-17:30 10/24 08:30-17:30 10/25 08:10-15:00
TPCA Show & IMPACT ReceptionAttendee: All IMPACT conference attendees and TPCA Show visitorsTime: Oct . 23rd, 2019 (18:00-20:00)
Venue: 3F Banquet, Taipei Nangang Exhibition Center
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12
2019
International Welcome Dinner & Best Paper Award Ceremony(By invitation only)Time: Oct . 24th, 2019 (18:30 – 20:30)Venue: Grande Luxe Banquet (3F)Address: 3F . NO . 166-A, JINGMAO 2ND RD ., NANGANG DIST., TAIPEI CITY 115, TAIWAN (R.O.C.)TEL: 02-2788-7222Invited Guest: Plenary Speakers, Invited speakers, Sponsors, VIP, IMPACT best paper awardees and Committee membersGathering Time: 5:45pmGathering Site: In front of IMPACT registration desk
Location of Poster Session
Poster session will be located on 5th floor of Taipei Nangang Exhibition Center .Time: 10/23 15:00-16:00 <Packaging> 10/24 15:00-16:00 <PCB>
Internet Access
Wireless internet is provided on 5th floor of Taipei Nangang Exhibition Center for free .
Lunch Provided
Organizer will arrange lunch vouchers for every registered attendee .Lunch Venue: Venue: The Banquet Hall, 3FSuggest Time: 10/23 12:20-13:10 10/24 12:10-13:10 10/25 12:30-13:30
Identification of Badges
Badges are required for admittance to all sessions, lunchbox and TPCA Show Reception Party . Please bring it with you all the times .
Conference Venue
Conference rooms will be located on the 5th floor of Taipei Nangang Exhibition Center .
Conference Venue Map
P6
P4
P3
P2
3
4
2010.05
5B1
1
2 P1
Nangang
Sijhih
Neihu . DonghuN
Singhua Rd
Xingzhong Rd
Lane 44
Chongyang Rd
Nanhu Bridge
NangangVocational
High School
Huimin St
Xindong Rd
Xinmin Rd
NKSP III
NKSP 、I II
Sanchong Rd
Jingmao2nd Rd
Jingmao1st Rd
TWTCNangang
TWTCNangang 2(under construction)
MainEntrance
Lane 62
Lane 88
Lane 106
Lane 157
Lane 105
Cheng-ZhengJunior
High School
Zhongnan St
Nangang Rd, Sec. 1
Dongnan St
North-south railway(Western Line)
Academia Rd, Sec. 1
Huandong Blvd
Huandong Blvd
Yuanqu St Nangang Connecting Highway
MRT TWTC Nangang Station
MRT Nangang Software Park Station
Keelung River
Nangang
Park
Business
Zhongxiao E. Rd, Sec. 7
TWTC Nangang Exhibition Hall Transport & Parking Information
6
21
3
56
4
Parking Lots:
Transport Information:
TWTC Nangang/620 Parking spaces
Taiwan Fertilizer C2 Parking Lot/352 Parking spaces
Taiwan Fertilizer C3 Parking Lot/768 Parking spaces
Taiwan Fertilizer C4 Parking Lot/82 Parking spaces
MRT Neihu Depot Parking Lot/584 Parking spaces/During Exhibition Periods
Xingzhong Parking Tower/647 Parking spaces/
NT$30 (per hour)/24HR
Shuttle Bus Stop (Pick-up / Drop-off)
Bus StopTaxi Drop-offSmall Vehicle Drop-offB1 Taxi Pick-upUnderground Parking Entrance
Underground Parking
Parking Lot
Entrance / Exit
Directions to TWTC Nangang The parking fee above is for reference only
P5P5
7
7 MRT Shuttle Bus Stop (to MRT Nangang Station)
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Information
IMPACT Best Paper 2018
IMPACT 2018 received over 180 papers, and we have conducted the 3 stage paper review process including abstract, full paper and onsite oral presentation.Thanks to the IMPACT Technical Program Committees, paper reviewers, and session chairs’ great support, we are delighted to announce thosepapers which have been selected as the IMPACT 2018 Paper Award .
Award Category
Paper Code
Paper Title Affiliation Author List
Packaging-Best Paper Award
EU001-1 Adhesive bonding methodologies for M(O)EMS packaging
CTR Carinthian Tech Research AG
Ali Roshanghias, Ying Ma, Eric Gaumont and Alfred Binder
AS007-1 Improving Throughput of Zero-Kerf Singulation for Ultra-Thin Wafers using Stealth Dicing
Tokyo Institute of Technology
Natsuki Suzuki, Kazuhiro Atsumi, Naoki Uchiyama, and Takayuki Ohba
US001-1 ELECTROPLATING PROCESSES FOR IC SUBSTRATES–EMBEDDED TRACE PLATE, VIA FILL AND THROUGH HOLE FILL
MacDermid Enthone
Saminda Dharmarathna, Maddux Sy, Benjamin Chao, Ivan Li, William Bowerman, Jim Watkowski, Kesheng Feng
Packaging-Best student Award
AS010-1 Development of 2D-Graphene-Based Highly Sensitive Flexible Strain Sensor Using Fine Columnar Concentration Structures
Tohoku University Zhi Wang, Ken Suzuki, and Hideo Miura
TW069-1 Evaluation of Suhir Theory for Predicting Thermally-Induced Warpage of Flip-Chip Packages
Chang Gung University
Y . W . Wang, and M . Y . Tsai*
TW097-1 Power Loss Estimation and Thermal Performance of Power MOSFET Package Using Coupled Electric-Thermal Analysis
National Tsing Hua University
Y .-S . Liao, Y .-H . Shen, C .-H . Wu, H .-C . Hsu, H .-C . Cheng, W .-H . Chen
PCB-Best Paper Award
TW045-1 Dependence of substrate warpage on the Cu microstructure transition
Kinsus Interconnect Technology Corp
Shu-Ping Yang, Cheng-Hsien Yang, Bau-Chin Huang, Hung-Cheng Liu and Cheng-En Ho
EU003-1 Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
Atotech Mustafa Özkök, Sven Lamprecht, Akif Özkök, Simon Chien, Henning Hübner, Christian Ohde
PCB-Best Student Award
TW084-1 Chip-to-chip copper direct bonding in no-vacuum ambient with (111) oriented nanotwinned copper
National Chiao Tung University
Jing Ye Juang, Kai Cheng Shie, Yu Jin Li, K N Tu, and Chih Chen
TW092-1 Toward A Better Understanding of Working Mechanism of Flexible Ni(P)
Yuan Ze University Wei-Ling Chou, Yu-Hsuan Huang, Hsin-Ya Sung, Cheng-Yu Lee, Cheng-Sam Peng, and Cheng-En Ho
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2019
Excursion Tour
Time: 2019 Oct 26th (SAT) 07:50-18:00
Time Agenda
07:50-08:00 Meet up at The Place Taipei(No.196, Jingmao 2nd Road, Taipei)
08:00-09:30 Tour bus heading to des�na�on
09:30-11:30 Na�onal Center of Tradi�onal Arts (宜蘭傳藝中心)Hands-on Ac�vi�es - Artworks DIY (DIY活動)
11:50-13:30 Lunch - Taiwanese cusine
14:00-15:30 Spring Onions Farm (蔥仔寮體驗農場)DIY - Spring onions harves�ng (拔蔥)DIY - Spring onions pie (蔥油餅DIY)
16:00-17:00 Kavalan Dis�llery - Whiskey Factory (噶瑪蘭金車威士忌酒廠)Whiskey Tas�ng
17:00-18:00 Heading back to The Place Taipei
Note: (1) The Tour has a minimum number of 25 people. FEE: $90 USD (NTD$2,700)
Note: (2) The tour fee includes insurance, lunch, access to destination, tips for driver and guide
YilanYilan is located in northeast Taiwan . Its vast Lanyang Plain was created by erosion from the Lanyang River, and is surrounded by mountains on three sides, with the ocean on the east side . This unique geography has given rise to the unique culture of Yilan . Gazing across the plain, one can see buildings tall and short standing among green fields, and Freeway No. 5 wandering its way through the gentle county.(Source: Taiwan Tourism Bureau)
National Center for Traditional ArtsWalking into the park at the Center for Traditional Arts makes you feel like falling into a time tunnel. The streets decorated with red walls and black tiles are blended with the architectural styles of the old streets everywhere in Taiwan . All sorts of special stores, such as workshops and early Taiwanese variety stores, stand along the streets. Here, you may see things that trigger the fun memories of your childhood, such as dough figurine sculptures, sugar onion, traditional toys, glove puppetry, etc.(Source: Taiwan Tourism Bureau)
Spring Onions FarmLooking out across lush spring onion fields in spring, you’ll see a sea of little white flowers dancing as the wind blows, like a magical carpet laid down for a bride. Taste Yilan’s famous Sanxing spring onions, admire the beautiful fields, and let them stay with you through your journey in Yilan .
As you walk amid the streets in Yilan, you'll often hear a sizzling sound coming from a
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Information
fry pan; golden crispy dough is being fried, giving off the aromatic smell of spring onion.The delicious pancake made with Yilan's famous Sanxing spring onion always attracts a long queue of people, waiting to have their bite.(Source: Taiwan Tourism Bureau)
Kavalan DistilleryEstablished in 2005, Kavalan is Taiwan’s first whiskymaker and the nation’s only family-owned whisky distillery. Kavalan takes the old name of Yilan county where the distillery is located in northeastern Taiwan . The pure water and fresh air make this part of the subtropical island the ideal environment for the production of whisky.(Source: Taiwanese hand puppet theatre)
Signing up for the Excursion TourReply the application by September 15th, 2019Qualification: all participants of IMPACT Contact: Ms . Cindy Lee / Tel: +886-3-3815659#407 / Email: cindy@tpca .org .tw
Hotel Information
To enjoy the discount for IMPACT conference attendees, please book your hotel right away and make further follow-up confirmation with the hotel.
Hotel Infomation
The Evergreen Laurel Hotel Taipei台北長榮桂冠酒店Tel: +886-2-2501-9988
Taiwan Taoyuan Interna�onal Airport—35mins by aiport shu�le busTaipei Songshan Airport—15mins by taxiMRT—5 mins by walk (Songjiang nanjing)*Near Xing�an Temple
The Place Taipei南港老爺行旅Tel: +886-2-7750-0588
Taiwan Taoyuan Interna�onal Airport—45mins by taxiTaipei Songshan Airport—20 mins by taxiMRT —5 mins by walk (Gangang So�ware Park)*Near Nangang Exhibi�on Center
amba Taipei Songshan 松山意舍酒店Tel: +886-2-2525-2828
Taiwan Taoyuan Interna�onal Airport—45 mins by taxiTaipei Songshan Airport—15 mins by taxiMRT —2 mins by walk (Songshan)*Near Raohe Street Night Market
Caesar Park台北凱薩大飯店Tel: +886-2-2311-5151
Taiwan Taoyuan Interna�onal Airport—40 mins by Taoyuan Airport MRTTaipei Songshan Airport—15 mins by taxiMRT —3 mins by walk (Taipei Main)*Near Taipei Main Sta�on
Courtyard Taipei六福萬怡酒店Tel:886-2-2171-6565
Taiwan Taoyuan Interna�onal Airport—45 mins by taxiTaipei Songshan Airport—20 mins by taxiMRT —2 mins by walk (Nangang)*Near Nangang Exhibi�on Center
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2019
Hotel Infomation
Ambassador Hotel Taipei台北國賓大飯店Tel:+886-2-2551-1111
Taiwan Taoyuan Interna�onal Airport—40 mins by taxiTaipei Songshan Airport—15 mins by taxiMRT —5 mins by walk (Shuanglian)*Near SPOT Taipei Film House
The Howard Hotel Plaza Taipei台北福華大飯店Tel:+886-2-2700-2323
Taiwan Taoyuan Interna�onal Airport—50 mins by aiport shu�le busTaipei Songshan Airport—10 mins by taxiMRT —10 mins by walk (Zhongxiao-Fuxing)*Near Taipei´s East District
Shera�on Grand Taipei Hotel台北喜來登大飯店Tel:+886-2-2321-5511
Taiwan Taoyuan Interna�onal Airport—45 mins by taxiTaipei Songshan Airport—15 mins by taxiMRT —2 mins by walk (Shandao Temple)*Near Huashan 1914 Crea�ve Park
Grand Hya� Taipei台北君悅酒店Tel:+886-2-2720-1234
Taiwan Taoyuan Interna�onal Airport—45 mins by taxiTaipei Songshan Airport—15 mins by taxiMRT —5 mins by walk (Taipei 101�World Trade Center)*Near Taipei 101
InquiriesRequests for information about the Conference should be directed to:Secretariat- Taiwan Printed Circuit AssociationTPCA-Chelsea KaoNo . 147, Sec . 2, Gaotie N . Rd ., Dayuan, Taoyuan 33743, TaiwanTel: +886-3-3815659 Ext . 405Fax: +886-3-3815150E-mail: service@impact .org .tw Website: www .impact .org .tw
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Information
PLENARY SPEECHWednesday, October 23rd, 10:20-11:00
Dr. Ching W. Tang
ProfessorHong Kong University of Science and Technology
Topic: The Past, Present, and Future of OLED Displays
Abstract
OLED, which was discovered more than three decades ago at Kodak Research Laboratories, has emerged as a key technology for display applications with the potential to dominate the display market. While OLED has set many of today’s display performance benchmarks, it has yet to overtake LCD in the marketplace primarily because of cost . Lurching in the horizon is micro-LED, which has often been touted as the next-generation display technology because of its many tributes, including low power consumption. This talk is an attempt to provide a fair assessment of the future of OLED displays in light of its current status amidst the competitive display landscape .
Bio
Ching W . Tang is currently the IAS Bank of East Asia Professor at Hong Kong University of Science and Technology. He is best known for the invention of the heterojunction organic light emitting diode and photovoltaic devices, for which he has been awarded various prizes, including the 2011 Wolf Prize in Chemistry and the 2019 Kyoto Prize in Advanced Technology .
Room 505
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2019
Wednesday, October 23rd, 11:00-11:40
Dr. Marc Benowitz
CEO - International Electronics Manufacturing Initiative (iNEMI), USA
Topic: Electronics Manufacturing Challenges and Opportunities: Closing the Gaps via Collaborative Innovation
Abstract
The uniqueness and IP that we all individually bring to the industry keeps pushing us collectively to new heights . Though at the same time, within each manufacturing technology segment, we have more in common than we have differences. We share many of the same challenges and opportunities. Recent findings in the iNEMI Roadmap identify needs/gaps in areas such as advanced packaging, materials development for harsh environments, inspection/test along with design, modeling and simulation capabilities . Many of these are prime candidates for collaborative innovation, whereby
leveraging the expertise across the design/supply chain with a “virtualized vertical” project team yields the best of the best in a way that none of us could replicate individually. Looking, for example, at 5G and Smart Manufacturing, which both bring tremendous challenges and opportunities, the steps to realize high volume manufacturing capability are not all evident, though we as an industry can collaboratively accelerate gap closure .
Bio
Marc Benowitz, Ph.D. is CEO of the International Electronics Manufacturing Initiative (iNEMI), a not-for-profit, highly efficient R&D consortium of leading electronics manufacturers, suppliers, associations, government agencies and universities . iNEMI roadmaps the future technology requirements of the global electronics industry, engaging experts and stakeholders from around the globe and throughout the supply chain. The organization works collaboratively with its members to identify and prioritize technology and infrastructure gaps, and address these challenges and gaps through timely, high-impact development projects . This enables leaders in the electronics manufacturing industry to work together to address common challenges and enable technology deployment for a sustainable future .
Marc joined iNEMI as CEO in January 2018, after a 38-year career at Bell Laboratories and its parent companies of AT&T, Lucent Technologies, Alcatel-Lucent and Nokia. Prior to leaving Nokia Bell Labs he was Senior Director of the Reliability, HW Test and Eco-Environmental Engineering organization . He has a breadth of experience in R&D and supply chain domains, with lead roles in product development, joint ventures, new product introduction, cost reduction programs, target costing, manufacturing research, supply chain, sustainability and managing and implementing large-scale corporate programs .
Marc was a member of the iNEMI Board of Directors from 2001-2018 and the Board Chairperson from 2013 – 2018 .
Marc holds a B.S. degree in Applied Mechanics from the State University of New York at Buffalo and M.S. and Ph .D . degrees in Engineering Mechanics from Columbia University .
Room 505
19 ▲
Plenary Speeches
Dr. Michael D. McCreary
Chief Innovation OfficerE Ink Corporation, USA
Topic: The Dramatic Past, Present, and Future of Flexible Electrophoretic Display Technology
Introduction / Outline
Electrophoretic display technology was originally envisioned as a solution for the decades old dream for flexible, low power, daylight readable ePaper. Today, the technology has been expanded to address new capabilities and form factors that are applicable to IoT, architecture, and many other uses . These advances will be described as well as projections for the future . Some of the experiences of the journey to bring a small startup with the dream of changing the way the world reads to today’s multi-hundred million dollar a year ePaper manufacturing company will also be reviewed .
Bio
Dr. Michael McCreary is responsible for expanding the portfolio of advanced technologies at E Ink which are enabling new generations of novel electronic paper and electronic paint display products . McCreary is a 45-year veteran of the imaging industry and also serves as the Chairman of the SEMI FlexTech Governing Council, an industry consortium. Prior to joining E Ink in 2000, he held a number of leadership positions with the Eastman Kodak Company, including serving as the General Manager of the Microelectronics Technology Division, which developed high performance solid-state image sensors . McCreary earned a Ph .D . in Physical Organic Chemistry from the Massachusetts Institute of Technology and completed further studies in solid state physics and device physics at the Rochester Institute of Technology and also business at the University of Pennsylvania Wharton School .
Room 505
Wednesday, October 24th, 11:40-12:20
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2019
Teruo Hirayama
Executive Chief EngineerSony Corporation, Japan
Topic: 3D Chip Stacking Technologies for the Future
Introduction / Outline
We are consciously and unconsciously benefiting from the spread of the Internet of Things (IoT). With this spread comes the strong demand for various semiconductors, especially small, multifunctional, high-performance LSIs. The system on a chip (SoC) is one solution. However, embedding various functions in different process nodes raises the cost of development and of products . Another promising solution is a system in package (SiP) such as a multi-chip 2D package or a 3D stack package. 3D chip stacking technology in particular can easily implement different function chips in a small system . We have contributed to the development of multifunctional, high-performance products with various 3D chip stacking technologies for many years . This paper introduces our past and latest achievements and shows the vision of the future that our technologies will create .
Bio
Teruo Hirayama received a bachelor’s degree in electrical engineering from Waseda University, Tokyo, Japan in 1981 and joined Sony Corporation the same year . He started in the research division of the semiconductor group, where he worked on SRAM, CMOS LSI, and then developed a stacked wide band DRAM on a LOGIC chip. He joined the image sensor division in 2002 where he developed a back-illuminated CMOS image sensor and a stacked image sensor, which were launched onto the market in 2009 and 2012, respectively . He became senior general manager of the semiconductor technology development division in 2010 and was responsible for the development of semiconductor devices . He became Corporate Executive in June 2013 and was appointed as president of the device and material R&D group on April 1, 2014, where he was responsible for R&D of displays, batteries, materials, and semiconductor devices . He is now Executive Chief Engineer in Sony Corporation .
Room 505 A+B
Thursday, October 24th, 9:00-9:40
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Plenary Speeches
Dr. Yujun Li
Director Taiwan Semiconductor Manufacturing Company, Limited, Taiwan
Topic: Co-Design of Advanced Packaging and Process Technology for 5G
Introduction/Outline
This talk will first cover the key market and technology trends driving 5G evolution. We will share our perspective of what’s new in 5G and what are the technology challenges . Then we will focus on the compelling reasons and possible solution of co-design of leading edge process technology and advanced packaging. Several examples will be given on technology and packaging co-design.
Bio
Dr . Yujun Li is a director of business development, in Taiwan Semiconductor Manufacturing Company . She leads business development of TSMC’s High Performance Computing Platform . Prior to joining TSMC in late 2015, she worked for IBM for 20+ years, in various engineering and executive management roles, in IBM’s semiconductor R&D center, systems group, and corporate strategy group . Yujun received her M .S . and Ph .D . degrees in Electrical Engineering from Yale University, and Bachelor of Science degree in Physics from University of Science and Technology of China . She has more than 20 issued patents and 30+ publications .
Room 505 A+B
Friday, October 25th, 8:50-9:30
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2019
Dr. E. Jan Vardaman
President, TechSearch International Inc., USA
Topic: New Package Developments for 5G: From Infrastructure to Mobile
Introduction/Outline
Frequency range up to mmWave, which packages are best?
Materials and packaging for 5G infrastructure
Mobile communications and new package and assembly requirements
What’s next?
Bio
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly . She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer . She is a member of SEMI, SMTA, IMAPS, and MEPTEC . She received the IMAPS GBC Partnership award in 2012 and the Daniel C . Hughes, Jr . Memorial Award in 2018 . She is an IMAPS Fellow . Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.
Room 505 A+B
Friday, October 25th, 9:30-10:10
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Plenary Speeches
ORAL PRESENTATION【J1/S1】Joint Session: WearableTime: 13:10-15:10, Wednesday, Oct . 23, 2019Chair: Hung-Yin Tsai, National Tsing Hua University, Taiwan Kyung W. Paik, KAIST, South Korea
Room: 505 a
Time Topic Lead Author Affiliation
13:10-13:40 Development of High Speed FPC by Use of Advanced Hybrid Polyimide
Hirofumi Matsumoto
Nippon Mektron, Japan
13:40-14:10 SiP Structure Trend in Mobile/Wearable Application
David Wang
SPIL, Taiwan
14:10-14:40 Chip on Fabrics (COF) Interconnection Technology using ACFs
Kyung W. Paik
KAIST, South Korea
14:40-15:10 Tactile Sensing Electronic Skin for Wearable and Robotic Applications
Steve Park
Korea Advanced Institute of Science and Technology(KAIST), South Korea
SESSION INTRODUCTION
Opening CeremonyTime: 10:00-10:20, Wednesday, Oct . 23, 2019Room: R505, Taipei Nangang Exhibition CenterSymposium Chair: Shen-Li Fu, Ph .D . Chair, IEEE EPS – Taipei Honorary President & Distinguished Chair Professor, I-Shou University President, SMTA-Taiwan
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24
2019
SESSION 2: Form Factor(SPIL)Time: 13:10-15:10, Wednesday, Oct . 23, 2019Chair: Yu-Po Wang, SPIL, Taiwan Takayuki Ohba, Tokyo Institute of Technology, Japan
Room: 505 b
Time Topic Lead Author Affiliation
13:10-13:40 3D Integration for High Bandwidth Application
Takayuki Ohba
Tokyo Institute of Technology, Japan
13:40-14:10 Adaptive Processes for High Density Panel Level Packaging
Andreas Ostmann
Fraunhofer IZM, Germany
14:10-14:40 Low-Temperature, Pressureless Bonding Using Microfluidic Electroless Interconnection Process
C R Kao
NTU, Taiwan
14:40-15:10 Challenges of Low Loss Material for Advanced Packaging Techniques
Keiichi Hasebe
MITSUBISHI GAS CHEMICAL, Japan
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Sessions
SESSION 3: 5G (Atotech)Time: 13:10-15:10, Wednesday, Oct . 23, 2019Chair: Thonas Su, Intel, Taiwan Daniel Schmidt, Director of Global Marketing EL, Atotech, Germany
Room: 505 c
TimePaperCode
Topic Lead Author Affiliation
13:10-13:40 Invited The Market Trend of 5G
Emilie JOLIVET
YOLE, France
13:40-14:10 InvitedTW0024
"MPI + PEDLIM " - The best solution for Low Transmission Loss Application
Eric Tseng
Ichia, Taiwan
14:10-14:40 Invited Moving to mmWave how does effect the PCB/ IC substrate
Kuldip Johal
Atotech, USA
14:40-15:10 Invited RF front-end technology challenges from 5G
Wenchi Ting
UMC, Taiwan
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2019
SESSION 4: Advanced Packaging-1Time: 13:10-15:10, Wednesday, Oct . 23, 2019Chair: David Tarng, ASE, Taiwan Shih-Kang Lin, National Cheng Kung University, Taiwan
Room: 506
TimePaperCode
Topic Lead Author Affiliation
13:10-13:40 Invited PCB Electrical Characterization Update for IPC Standardization
Jimmy Hsu
Intel, Taiwan
13:40-14:10 Invited Instant Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned Cu
Chen Chih
National Chiao Tung University, Taiwan
14:10-14:25 EU0069 Investigation of Layer Characteristics and Reliability of Electroless Palladium and Autocatalytic Gold
Gustavo Ramos Atotech, Germany
14:25-14:40 TW0060 Anisotropic grain growth in Cu joints at low temperature by <111>-oriented nanotwinned copper films
Chang-Chih Hsieh National Chiao Tung University, Taiwan
14:40-14:55 TW0088 C4 Compatible Ultra-Thick Cu On-chip Magnetic Inductor Architecture Integrated with Advanced Polymer/Cu Planarization Process
Chien-Hsien Kuo Taiwan Semiconductor Manufacturing Company, Taiwan
14:55-15:10 TW0042 A Development of Full Time Anti-Hydrometeor Shielding Metallization Films on Tiny Hermetic Image Sensor Package
Jhih Wei Lai Tong Hsing Electronic Industries, Ltd ., Taiwan
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Sessions
【J2/S5】Joint Session: Heterogeneous ITime: 15:40-17:40, Wednesday, Oct . 23, 2019Chair: Shin-Puu Jeng, TSMC, Taiwan Wei-Chung Lo, ITRI, Taiwan
Room: 505a
Time Topic Lead Author Affiliation
15:40-16:10 Heterogeneous Integration on Organic Interposer
Po-Yao Lin
TSMC, Taiwan
16:10-16:40 Process Integration and Characterization of Hybrid Bonding
Wei-Chung Lo
ITRI, Taiwan
16:40-17:10 RF and system-level integration using fanout system in board FO-SiBTM
Markus Leitgeb
AT&S AG, Austria
17:10-17:40 Silicon Bridge using Fanout
Chung C Key
Spil, Taiwan
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2019
SESSION 6: iNemiTime: 15:40-17:40, Wednesday, Oct . 23, 2019Chair: Haley Fu, iNemi, USA Wei Keat Loh, Intel, USA
Room: 505b
Time Topic Lead Author Affiliation
15:40-16:10 The Need of Multi-physics Simulation Capabilities to Enable Electronic Packaging of the Future
Dr . Wei Keat Loh
Intel Corporation
16:10-16:40 Global Trends of IC Package Molding CAE Technology
Dr . Jim Hsu
CoreTech System (Moldex3D)
16:40-17:10 Quick decision of System in Package implementation for IoT/5G Era
Yoko Fujita
Zuken
17:10-17:40 System-level, post-layout electrical analysis for heterogeneous high-density advanced packaging (HDAP)
Dr . Dusan Petranovic Mentor, A Siemens Business
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Sessions
SESSION 7: JIEP SessionTime: 15:40-17:45, Wednesday, Oct . 23, 2019Chair: Takeyasu Saito, Osaka Prefecture University, Japan Kiyokazu Yasuda, Osaka University, Japan
Room: 505c
Time Topic Lead Author Affiliation
15:40-16:05 Development of High Heat-Resistance Liquid Encapsulated Material for Next Generation Power Devices
Yuki Ishikawa
Sanyu-rec, Japan
16:05-16:30 Fine Pitch Flexible Printed Circuit Fabrication by Silver-Seed Semi-Additive Process
Norimasa Fukazawa
DIC corp ., Japan
16:30-16:55 LED Packaging Trend & Super Strong + Ultra Tough LED
Onishi Tetsuya
Grand Junction Tech ., Japan
16:55-17:20 Flexible Electronic Device with Self-Healing Ability
Tomoya Koshi
AIST, Japan
17:20-17:45 Fabrication of flexible circuits by Printed Electronic
Takeo Minari
NIMS, Japan
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2019
SESSION 8: 3D integration & SiPTime: 15:40-17:40, Wednesday, Oct . 23, 2019Chair: Yu-hwa Chen, Unimicron, Taiwan Albert Lan, Applied Materials, USA
Room: 506
TimePaperCode
Topic Lead Author Affiliation
15:40-16:10 Invited Introduction of Wafer-Level Hybrid Bonding
Masahisa Fujino
National Institute of Advanced Industrial Science and Technology, Japan
16:10-16:25 AS0012 Divide-By-2 Injection-Locked Frequency Divider using 3-D Inductive Mutual-Coupling
Wen-Cheng Lai National Penghu University of Science and Technology, Taiwan
16:25-16:40 US0027 3D System-Level, Post-Layout Analysis & Test for High-Density Advanced Packaging
PoLin Chi Mentor Graphics Corporation, Taiwan
16:40-16:55 EU0033 Low-Temperature 3d Die-Stacking Thorough Direct Cu-Cu Thermosonic Bonding
Ali Roshanghias CTR Carinthian Tech Research AG, Austria
16:55-17:10 TW0097 Innovative System in Package Design by Laser Ablation Technology
Meng-Jie Lee SPIL, Taiwan
17:10-17:25 AS0093 EMI Shielding Solutions for RF SiP Assembly James Su SPIL, Taiwan
17:25-17:40 TW0032 Measurement of Thermally-Induced Curvatures and Warpages of 2.5D Packages by Using Strain Gauge
Ming-Yi Tsai Chang Gung University, Taiwan
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Sessions
SESSION 9: 5G Innovative Technology (Nanya Plastics Sponsored)Time: 10:10-12:15, Thursday, Oct . 24, 2019Chair: Gordon Lee, Nanya Plastics, Taiwan Cheric Yang, Nanya Plastics, Taiwan
Room: 505 a
Time Topic Lead Author Affiliation
10:10-10:35 High Frequency CCL Materials for 5G and Automotive Radar Applications
Howard Huang
Technical Engineer, Nanya Plastics, Taiwan
10:35-11:00 Advanced RTF Copper Foil for High-Speed and High-Frequency PCB Application
Ting-Yu Chou
R&D Engineer, Nanya Plastics, Taiwan
11:00-11:25 Comparative Properties of Different Types of Benzoxazine Resins used in CCL
Frank Wei
R&D Engineer, Nanya Plastics, Taiwan
11:25-11:50 To Enhance the loss Performance by New Type Copper Foil with Nanya CCL Material
Chia-Chieh Hsiao
Senior R&D Engineer, Nanya Plastics, Taiwan
11:50-12:15 The 5G Antenna and Small Cell Base Station Power Amplifier Module using Nanya CCL Material Board
Hsien-Chin Chiu
Professor, Chang Gung University, Taiwan
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32
2019
SESSION 10: ICEP SessionTime: 10:10-12:15, Thursday, Oct . 24, 2019Chair: Yasumitsu Orii, NAGASE & CO ., LTD, Japan
Room: 505 b
Time Topic Lead Author Affiliation
10:10-10:35 Surface Activated Bonding for GaN-SiC and GaN-diamond
Tadatomo Suga
Gakushikai Japan, Japan
10:35-11:00 Solution Activity of Advanced Package
Toshihisa Nonaka
Hitachi Chemical, Japan
11:00-11:25 Low Temperature Flip Chip Bonding Technology realizing 10micron Bump and Wiring Pitch on Substrates to Minimize the Die Assembly Area
Hiroshi Komatsu
ConnecTec Japan, Japan
11:25-11:50 High reliable low temperature bonding using Sn-Bi solder alloy system
Kei Murayama
Shinko, Japan
11:50-12:15 Devlopment of Materials Informatics Platform
Yasumitsu Orii
NAGASE & CO ., LTD, Japan
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Sessions
SESSION 11: Interconnection & NanotechnologyTime: 10:10-12:10, Thursday, Oct . 24, 2019Chair: Yu-Po Wang, SPIL, Taiwan Tz-Cheng Chiu, National Cheng Kung University, Taiwan
Room: 505 c
TimePaperCode
Topic Lead Author Affiliation
10:10-10:40 Invited Preparation Technology and Bonded Reliability Analysis of Ag Alloy Bonding Materials
Jun Cao
Henan Polytechnic University, China
10:40-10:55 TW0108 Understanding the Mechanism of Electromigration: The Key for Reliability in High Density and High Power Module
Kuan-Hsueh Lin National Cheng Kung University, Taiwan
10:55-11:10 TW0084 Development of Ultrasonic Cu-to-Cu Bonding I-Yu Yu National Chung Hsing University, Taiwan
11:10-11:25 TW0022 The Investigation on Currents Stress for Electromigration on Cu/Sn IMC Formation
Ming-Tzer Lin National Chung Hsing University, Taiwan
11:25-11:40 TW0103 Highly (111)-oriented Nanotwinned Cu for Redistribution Lines in InFO & 3D IC with High Electromigration Resistance
I-Hsin Tseng National Chiao Tung University, Taiwan
11:40-11:55 AS0082 Nanoporous Copper Roughening for Low Temperature Solid Phase Bonding
Kiyokazu Yasuda Osaka University, Japan
11:55-12:10 TW0043 Ultra-Miniature Saw Filter New Structure: for 5G IoT Mobile Device
Chao Wei Chung Tong Hsing Electronic Industries, Ltd, Taiwan
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34
2019
SESSION 12: Machine learning ApplicationsTime: 10:10-12:10, Thursday, Oct . 24, 2019Chair: Kuo-Ming Chen, UMC, Taiwan Kuan-Jung Chung, National Chanhua University of Education, Taiwan
Room: 506
TimePaperCode
Topic Lead Author Affiliation
10:10-10:40 Invited Computing Reimagined - quantum, AI, and IoT
Shintaro Yamamichi
IBM Japan, Japan
10:40-10:55 TW0086 Reliability Prediction of WLP using AI Recurrent Neural Network Regression Model
Yi-Chieh Tseng National Tsing Hua University, Taiwan
10:55-11:10 AS0061 Reliability Assessment of Wafer Level Packaging using Support Vector Regression Model
Sunil Kumar Panigrahy National Tsing Hua University, Taiwan
11:10-11:25 TW0002 Automatic Defects Classification from AOI Images Based on Image Processing and Deep Learning
Tsai-Yi Cheng National Tsing Hua University, Taiwan
11:25-11:40 TW0105 A Machine Learning Model for Predicting Effective Charge in Electromigration Effect
Yu-Chen Liu National Cheng Kung University, Taiwan
11:40-11:55 TW0107 A Novel Feature-spanning Machine Learning Technology for Image-based Defect Inspection
Wong-Shian Huang ASE Group, Taiwan
11:55-12:10 AS0067 The Prediction of Positioning shift for a Robot Arm Using Machine Learning Techniques
Kuan-Jung Chung National Chanhua University of Education, Taiwan
35 ▲
Sessions
SESSION 13: Advanced and Green Materials and ProcessTime: 10:10-12:10, Thursday, Oct . 24, 2019Chair: Ning-Cheng Lee,Indium Corporation, USA Jeffrey, Kuo-Chan Chiou,ITRI, Taiwan
Room: 504c
TimePaperCode
Topic Lead Author Affiliation
10:10-10:35 Invited Novel Fluxes with Decreased Viscosity After Reflow for Flip Chip and SIP Assembly
Ning-Cheng Lee
Indium Corporation, USA
10:35-10:50 TW0094 Feature Extraction and Pattern Classification of Grinding Wheel Wear Based on Acoustic Emission Signal
Chia Ling Chu Chang Gung University, Taiwan
10:50-11:05 TW0056 Design, Fabrication, and Analysis of Digitally-Manufactured High-Frequency Passive Devices by Laser Direct Exposure Platform
Shih-Ming Lin Industrial Technology Research Institute, Taiwan
11:05-11:20 TW0072 Low Temperature Reduction for Copper Oxide using Vapor or Liquid reductants
Wei Chen Huang National Chung Hsing University, Taiwan
11:20-11:35 AS0083 Analysis of Electrical Conductivity Variation of Stretchable Wires Printed with Polyurethane-based Conductive Pastes during a Uniaxial Cyclic Test
Masahiro Inoue Gunma University, Japan
11:35-11:50 TW0078 Effect of Phase Distribution on Micro-Galvanic Corrosion in Rapid Solidified and Sintered Cu-Ag Systems
Yan-Jie Li National Chung Hsing University, Taiwan
11:50-12:15 Invited 3D Printing in Digital Health
Charles E . Bauer
TechLead Corporation, USA
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36
2019
SESSION 14: AIOT, ASETime: 13:10-15:10, Thursday, Oct . 24, 2019Chair: Henry Lin, ASE David Tarng, ASE, Director, Taiwan
Room: 505 a
Time Topic Lead Author Affiliation
13:10-13:35 AI Application Processor Market & Technology Roadmap
Emilie JOLIVET
YOLE, France
13:35-14:00 Nonvolatile Memory as an Enabler of AIOT
Wenchi Ting
UMC, Taiwan
14:00-14:25 How advanced SOM (system on module) package can benefits design and cost-saving for hearable & wearable devices
Steven JL LIN ASE, Taiwan
14:25-14:50 Sensor Packaging Technology
Ryan Lai
ASE, Taiwan
14:50-16:15 Innovative Metal Deposition to Enable Advanced Packaging in 5G and A-IOT Applications
Ravi Mullapudi
Tango Systems, US
37 ▲
Sessions
SESSION 15: Market TrendTime: 13:10-15:10, Thursday, Oct . 24, 2019Chair: Shin-Puu Jeng, TSMC Kuo-ming Chen, UMC
Room: 505 b
Time Topic Lead Author Affiliation
13:10-13:40 Highlight of Packaging and Substrate Market Development Trend
Shiuh-Kao Chiang
Prismark, USA
13:40-14:10 The Market for High Performance Packaging in a 5G World
Dick James
Tech Search, USA
14:10-14:40 World PCB Trend
Hayao Nakahara
N . T . Information, Japan
14:40-15:10 Automotive Packaging Market & Technology Trends 2019
Santosh Kumar
YOLE, India
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38
2019
SESSION 16: Advanced Packaging-2Time: 13:10-15:10, Thursday, Oct . 24, 2019Chair: Ricky Shi-Wei Lee, HKUST, Hong Kong Chih-hang Tong, TSMC, Taiwan
Room: 505c
TimePaperCode
Topic Lead Author Affiliation
13:10-13:40 Invited Implementation of Mini/Micro-LED with Printed Quantum Dots
Ricky Shi-Wei Lee
HKUST, Hong Kong
13:40-13:55 TW0050 Moisture Absorption and Desorption Characterization for Plastic SiP Package
Pei-ju Chen Integrated Service Technology, Taiwan
13:55-14:10 TW0010 DFM-aware Design Flow for Sip Foundry Business and Applications
Eigen Fu Yuan Consulting Ltd, Taiwan
14:10-14:25 AS0046 The Dependence between Pad Roughness and the Growth Rate of Au-Al Formed IMC
Lin Ran Po Powertech Technology Integration, Taiwan
14:25-14:40 AS0035 The Analysis for Bump Resistance Improvement by Optimizing the Sputter Condition
Ming-Sin Su Taiwan Semiconductor Manufacturing Company, Taiwan
14:40-14:55 TW0041 Advanced VSCEL Package for 3D Sensor Application by Using Attached Ceramic-Spacer Technology
Jeffery Shih Tong Hsing Electronic Industries, Taiwan
14:55-15:10 TW0074 Instant Copper Direct Bonding Using <111>-oriented Nanotwinned Cu Microbumps
Kai-Cheng Shie National Chiao Tung University, Taiwan
39 ▲
Sessions
SESSION 17: Fan-out Packaging Technology Time: 13:10-15:10, Thursday, Oct . 24, 2019Chair: Ben-Je Lwo, National Defense University, Taiwan Po-Yao Lin, TSMC, Taiwan
Room: 506
TimePaperCode
Topic Lead Author Affiliation
13:10-13:40 Invited Proposal of New Materials and Process for WLP and Fan-Out WLP
Shinya Takyu
LINTEC Corporation, Japan
13:40-13:55 AS0087 Prediction of Panel Level Warpage Using Convolution Neural Network Model
Min-Yiu Chen National Tsing Hua University, Taiwan
13:55-14:10 TW0038 Manz's FOPLP Solution with Wet Bench Equipment for Cu RDL Formation
Richard Tsai Manz Taiwan Ltd ., Taiwan
14:10-14:25 AS0055 Study on the Assembly Technology of Die-First / Face-Down Type FO-PLP
Masaaki Takekoshi Hitachi Chemical Co ., Ltd ., Japan
14:25-14:40 TW0106 Viscoelastic Effects on Process-induced Warpage of Fan-out Wafer-level Package during Molding Process
Yan-Cheng Liu Feng Chia University, Taiwan
14:40-14:55 TW0101 Coupled Hygro-Thermo-Mechanical Analysis of Moisture Induced Interfacial Stresses in Fan-Out Package
Tz-Cheng Chiu National Cheng Kung University, Taiwan
14:55-15:10 AS0008 Warpage Simulation on a Typical Fan-out Panel Level Package (FOPLP) Process with Glass Carrier
Ben-Je Lwo National Defense University, Taiwan
▲
40
2019
SESSION 18: HDI and Embedded TechnologyTime: 13:10-15:10, Thursday, Oct . 24, 2019Chair: Jeffrey Lee, Integrated Service Technology, Taiwan Albert T . Wu, NCU, Taiwan
Room: 504 c
TimePaperCode
Topic Lead Author Affiliation
13:10-13:40 Invited Scanning Electrochemical Microscopy for Bioimaging
Tzu-En Lin
National Chiao Tung University, Taiwan
13:40-14:10 Invited If Pico laser can catch the demands for HDI progressing
Tinghao Lin
KINSUS, Taiwan
14:10-14:25 TW0077 Photonic-sintering of Copper Oxide Particles with Low Density Irradiations
Po-Hsiang Chiu National Chung Hsing University, Taiwan
14:25-14:40 US0015 Copper Electroplating Processes for Advanced HDI Applications
Kesheng Feng MacDermidAlpha Inc, USA
14:40-14:55 AS0089 Device to Remotely Track and Locate the Position of a Child for Safety
Shamendra Egodawela University of Peradeniya, Sri Lanka
14:55-15:10 TW0073 An Electrochemical/Optical Combined Strategy for Analyzing Surface Oxide Layer on Pure Copper in Microelectronics
Wei Chen Huang National Chung Hsing University, Taiwan
41 ▲
Sessions
SESSION 19: IAACTime: 15:40-17:40, Thursday, Oct . 24, 2019Chair: Ming-Yi Tsai, Chang Gung University, Taiwan Taek-Soo Kim, KAIST, South Korea
Room: 505 a
Time Topic Lead Author Affiliation
15:40-16:10 Recent Advances in Underfill for Flip-Chip Packages
Osamu Suzuki
Namics Co ., Japan
16:10-16:40 Strategies for Mechanically Reliable Thin-Film Flexible Electronics
Taek-Soo Kim
KAIST, South Korea
16:40-17:10 Thermally-Induced Warpage and Stresses of Flip-Chip and 2.5D Packages: Experimental, Theoretical and Numerical Analyses
Ming-Yi Tsai
Chang Gung University, Taiwan
17:10-17:40 Evolution of Embedded Technology for Active Components
Shutesh Krishnan Shastri
ON Semiconductor, Malaysia
▲
42
2019
SESSION 20: Heterogeneous IITime: 15:40-17:40, Thursday, Oct . 24, 2019Chair: Wei-Chung Lo, ITRI, Taiwan Shin-Puu Jeng, TSMC, Taiwan
Room: 505 b
Time Topic Lead Author Affiliation
15:40-16:05 Heterogeneous Integration Roadmap (HIR)
Bill Chen
ASE Group, USA
16:05-16:30 Advance in Substrate Heterogeneous Integration Technology
Dyi-Chung Hu
SiPlus Co ., Taiwan
16:30-16:55 Heterogeneous Integration Based on Low-Temperature Bonding for Mems and Sensors
Eiji Higurashi
AIST, Japan
16:55-17:20 Heterogeneous Integration Packaging Technology for AI
Albert Lan
Applied Materials, USA
17:20-17:40 Panel DiscussionDyi-Chung Hu, SiPlus Co ., TaiwanEiji Higurashi, AIST, JapanAlbert Lan, Applied Materials, USA
Moderator: Bill Chen
Senior Technical Advisor, ASE Group
43 ▲
Sessions
SESSION 21: Plating & Electroless Process IITime: 15:40-17:40, Thursday, Oct . 24, 2019Chair: Wei-Ping Dow, National Chung Hsing University, Taiwan Pohsiu Cheng,Tong Hsing, Taiwan
Room: 505 c
TimePaperCode
Topic Lead Author Affiliation
15:40-16:10 Invited Electroless Cu Deposition Using Cu2+ ion as Catalyst
Wei-Ping Dow
National Chung Hsing University, Taiwan
16:10-16:40 Invited Solutions for Next Generation IC Substrate manufacturing
Laurence Gregoriades
Atotech Deutschland GmbH, UK
16:40-16:55 EU0068 A Robust Palladium-Free Activation Process for Electroless Copper Plating
Laurence Gregoriades
Atotech Deutschland GmbH, UK
16:55-17:10 EU0120 A Novel Horizontal Copper Pattern Plating System with High Throughput
Bert Reents Atotech Deutschland GmbH, Germany
17:10-17:25 TW0047 Microstructure Modification of Electroplating Cu and Improvement of Its Etching Characteristics in the Roughening Process
Cheng Yu Lee Yuan Ze University, Taiwan
17:25-17:40 AS0104 High Strength and High Thermal Stability Nano-Twinned Cu Foil
Yu-Jin Li National Chiao Tung University, Taiwan
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44
2019
SESSION 22: Thermal ManagementTime: 15:40-17:40, Thursday, Oct . 24, 2019Chair: Allen Liu, TTMA, Taiwan Wei-Keng Lin, T-Global, Taiwan
Room: 506
TimePaperCode
Topic Lead Author Affiliation
15:40-16:10 Invited Measurement of Thermal Diffusivity of Ultra-Thin Vapor Chamber under Microgravity
Wei-Keng Lin
National Tsing-Hua University, Taiwan
16:10-16:25 AS0021 Thermal Resistance Model and Analysis for Future Smart Glasses
Atsushi Kurokawa Hirosaki University, Japan
16:25-16:40 TW0098 The Evaluation of Thermal Performance of Backside Metallurgical Lamination type on Flip Chip Package
Michael Fu SPIL, Taiwan
16:40-16:55 TW0109 Transient Thermal Damage Simulation for Novel Location-Controlled Grain Technique in Monolithic 3D IC
Pin-Jun Chen National Chiao Tung University, Taiwan
16:55-17:10 TW0013 Fabrication and Thermal Dissipation Properties of Carbon Nanofibers Derived from Electrospun Poly(amic acid) Carboxylate Salt Nanofibers
Hsun-Hao Hsu National Chiao Tung University, Taiwan
17:10-17:25 AS0085 Thermal Network Analysis for Heat Dissipation Performance of Printed Circuit Board Using JPCA Method
Tomoyuki Hatakeyama Toyama Prefectural University, Japan
45 ▲
Sessions
【J3/S23】Joint Session: Organic and Printed Electronics AssociationTime: 15:40-17:40, Thursday, Oct . 24, 2019Chair: Wolfgang Mildner, MSWtech
Room: 504 c
Time Topic Lead Author Affiliation
15:40-16:10 Ink Jet Printing of OLED Displays – the Interplay of Materials, Ink Formulation, Processing and Device Performance
Georg Bernatz
Merck KGaA, Germany
16:10-16:40 Applications of Photonic Curing to Flexible Electronic Devices
Kenji Shinozaki
Novacentrix, Japan
16:40-17:10 Human-Machine Interface in the IoT Era
Albert Lu
Interlink Electronics, Inc., Singapore
17:10-17:40 Electronics Go 3D - From Printed Electronics to 3D Structural Electronics – Status and Roadmap for New Compact 3D Functional Applications
Wolfgang Mildner
MSWtech, Germany
▲
46
2019
SESSION 24: Embedded SessionTime: 10:30-12:30, Friday, Oct . 25, 2019Chair: Yoshihisa Katoh, Fukuoka University, Japan Ray-Min Tain, Unimicron, Taiwan
Room: 505 a
Time Topic Lead Author Affiliation
10:30-11:00 Power System in PCB - Next Generation Technology for High Power Density Integration
Tao-Chih Chang ITRI, Taiwan
11:00-11:30 Fan-Out Panel-Level Packaging for Heterogeneous Integrations
Cheng-Ta Ko
Unimicron, Taiwan
11:30-12:00 Fabrication process and its reliability of 2um or less ultra-fine pattern for heterogeneous integration
Haruki Sueyoshi
Reserch Center for 3D semiconductors of Japan, Japan
12:00-12:30 System Level Co-Design Platform for 3D SiP & 3D Electronic Module
Masaomi Suzuki
Zuken, Japan
47 ▲
Sessions
SESSION 25: Technical Solutions for Future 5G Mega Trend (AT&S)Time: 10:30-12:30, Friday, Oct . 25, 2019Chair: Thomas Wu, AT&S, Taiwan
Room: 505 b
Time Topic Lead Author Affiliation
10:30-11:00 Wrap up (More than AT&S)
Rainbow Yuan
AT&S, Taiwan
11:00-11:30 SLP technology
Andy Huang
AT&S, Taiwan
11:30-12:00 Advanced Embedded DIE packaging Technology
Lio Li
AT&S, Taiwan
12:00-12:30 All in One Package
Markus Leitgeb
AT&S AG, Austria
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48
2019
SESSION 26: 5G Communication & SolutionTime: 10:35-12:30, Friday, Oct . 25, 2019Chair: Lih-Shan Chen, I-Shou University, Taiwan Irving Lee, Global Project Manager, UL, Taiwan
Room: 505 c
TimePaperCode
Topic Lead Author Affiliation
10:35-10:55 Invited New Era of MEMS Devices for the 5G Evolution and Revolution
Jun Mizuno
Waseda University, Japan
10:55-11:15 Invited 3D MIM Capacitor in TSV: A novel on-chip integrated capacitor
Chan Seng Tan
Nanyang Technological University, Singapore
11:15-11:30 AS0037 LiTaO3/Quartz Bonding with Low-Residual Al2O3 Amorphous Intermediate Layer for 5G Surface Acoustic Wave Devices
Ami Tezuka Waseda University, Japan
11:30-11:45 AS0029 A Composite Structure of Low Dielectric Substrate for 5G mmWave and the Application in Flexible Printed Circuit (FPC)
Wei-Chih Lee Kunshan Aplus Tec .Corporation, Taiwan
11:45-12:00 TW0049 Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission
Ying-Syuan Wu Yuan Ze University, Taiwan
12:00-12:15 TW0048 Roughness Effect of Cu Interconnects on Signal Transmission Performance in 5G Communication Applications
Wei-Ling Chou Yuan Ze University, Taiwan
12:15-12:30 TW0018 A Novel Fabrication Process and Measurement Results of 28GHz Glass Antenna with Single TGV for 5G Communication Applications
Yiu-Hsiang Chang ITRI, Taiwan
49 ▲
Sessions
SESSION 27: Power Electronics/DevicesTime: 10:35-12:30, Friday, Oct . 25, 2019Chair: Hsien-Chie Cheng, FCU, Taiwan Allen Liu, ITRI, Taiwan
Room: 506
TimePaperCode
Topic Lead Author Affiliation
10:35-10:55 Invited Silicon Carbide Power Module for High Power Applications
Allen Liu
ITRI, Taiwan
10:55-11:15 Invited Dry Etching Fluoride Residue Removal with Lower Metal Damage for High Reliability Power Device & TSV
Onishi Tetsuya
Grand Junction Tech ., Japan
11:15-11:30 TW0052 Enhancement of Light Extraction Efficiency and High Reliable DPC Ceramic Base against Photochemical Damage by PVD Al Film for UV-LED Application
Vito Cheng Tong Hsing Electronic, Taiwan
11:30-11:45 AS0063 Epoxy Resin Encapsulated IGBT Module Characteristics and Reliability
Yuju Chen Delta Electronics, Inc ., Taiwan
11:45-12:00 TW0025 The Comparative Characterization between SiC MOSFET and Si- IGBT for Three Phase SPWM Inverter
Heng Lee ITRI, Taiwan
12:00-12:15 TW0001 Minimizing Power Module Size with Low Stray Inductance and High Heat Dissipation
Chih-Chiang Wu ITRI, Taiwan
12:15-12:30 TW0045 Assembly Challenge and Solution for GaN on Si substrate
Hsinjou Lin SPIL, Taiwan
▲
50
2019
【J4/S28】Joint Session: Flexible Hybrid ElectronicsTime: 10:30-12:30, Friday, Oct . 25, 2019Chair: Shinri Sakai, Professor, Yamagata University, Japan
Room: 504 b
Time Topic Lead Author Affiliation
10:30-11:00 Flexible, Printed and Hybrid Electronics 2019-2029: State of the Market and Opportunities
Raghu Das
IDTechEX, United Kingdom
11:00-11:30 Bio-Inspired Structures and Functions for Wearable Sensors
Hyunhyub Ko
Ulsan National Institute of Science & Technology (UNIST), Korea
11:30-12:00 Development of Power Supplies for Mini Sensor Systems Using Printing Technology
Ye Tao
National Research Council Canada, Canada
12:00-12:30 Flexible Sensors and Wearable Patches for Healthcare and Human-Machine-Interfaces
Chengkuo Lee
National University of Singapore, Singapore
51 ▲
Sessions
SESSION 29: Advanced Packaging-3Time: 13:30-15:30, Friday, Oct . 25, 2019Chair: Wun-Yan Chen, ITRI, Taiwan Sam Song, NCHU, Taiwan
Room: 505a
TimePaperCode
Topic Lead Author Affiliation
13:30-13:45 Surface Mounting Solution Suggested for SiP Package
Peter Chiang, Jeffrey Lee, Jerry Huang
CPBI Alliance, Taiwan (Chip to Package to Board Interconnection)
13:45-14:00 TW0115 Multi-layer Printed Circuit Board via LCD-based Stereolithography
Tsai Shang-Cheng National Taiwan University, Taiwan
14:00-14:15 AS0059 A Study on Temperature Effect of the Dielectric Material loss using Transmission Line Method
PO-I Wu ASE Group, Taiwan
14:15-14:30 AS0099 The Bonding Performance of Au-coated Ag Alloy wire
Huiyi Tang Chong Qing Materials Research Institute Co ., Ltd, China
14:30-14:45 TW0110 Comparison of Oxide Reduction Temperature between Highly <111>-Oriented Nanotwinned Cu and Regular Cu Films
Wei-You Hsu National Chaio Tung University, Taiwan
14:45-15:00 TW0102 Nanotwinned Copper Film Retaining High Hardness and Elongation after Low Temperature Annealing
Hsiang-Yuan Cheng National Chiao Tung University, Taiwan
15:00-15:15 TW0079 Empirical Study of Multi-Objective Parameter Optimization in Wire Bonding Process
Yun-Chia Chen National Tsing Hua University, Taiwan
15:15-15:30 TW0019 The Enhanced Copper Foil Design for High-Speed Applications in 2020 and Beyond
Norman Juan Co-tech Development, Taiwan
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52
2019
SESSION 30: DMT (Design, Modeling & Test)Time: 13:30-15:30, Friday, Oct . 25, 2019Chair: Ming-Yi Tsai, Chang Gung University, Taiwan Liu, De-Shin, National Chung Cheng University, Taiwan
Room: 505b
TimePaperCode
Topic Lead Author Affiliation
13:30-14:00 Invited High Slenderness Ratio Die Breaking Stress Testing Methods Applied to Dynamic Die Picking Process
Liu, De-Shin
National Chung Cheng University, Taiwan
14:00-14:15 TW0119 Geometrical Responses and Volumetric Displacement in Large Deflection of Simply Supported Plate with Piezoelectric Patches under Pretension
Chun-Fu Chen Chung-Hua University, Taiwan
14:15-14:30 AS0057 Statistical and Comparative Simulation Methods for High Speed Interfaces
Thonas Su Intel, Taiwan
14:30-14:45 TW0116 Ultra-thin Package Board Level Drop Reliability Modeling
Shu-Shen Yeh Taiwan Semiconductor Manufacturing Company, Ltd ., Taiwan
14:45-15:00 TW0023 Geometric Nonlinear Effect on Thin Silicon Die Strength Under Three-Point Bending
Ming-Yi Tsai Chang Gung University, Taiwan
15:00-15:15 AS0092 SERDES Transceiver for Supply-Induced Jitter Sensitivity Methodology Based on PDN Analysis
Michael Chang HTC, Taiwan
53 ▲
Sessions
Packaging Poster Interactive Presentation
Time: 15:00-16:00, Oct . 23Venue: 5F, Taipei Nangang Exhibition Center
Paper Code
Topic Lead Author Affiliation
AS0003 Optimization of Temporary Wafer Bonding Materials and Processes for 3D IC Integration
Tsung Yu Ou Yang ITRI, Taiwan
AS0036 LTD PKG. (Liquid Thermal Dissipation Package) Technology Dragon Huang Siliconware Precision Industries Co ., Ltd ./National Taiwan University, Taiwan
AS0071 Study of Thermal Characteristics of Thin Adhesive Layer using Novel RDP Method for Wafer-On-Wafer (WOW) Applications
Shinji Maetani DAICEL Corporation, Japan
AS0075 Electrical Characterization for Curing Behavior of Epoxy-based Adhesives Containing Silver Fillers Treated with Several Triazole Surfactants
Shiho Nakazawa Gunma University, Japan
AS0111 Mechanical Properties of SiC and DBC Bonding Joint using Sn-Cu Solder
Seung Jun Hwang University of Seoul, South Korea
AS0113 Transient liquid phase bonding of SiC to Cu using Sn-Ni solder for power module
Wook Sang Jeon University of Seoul, South Korea
AS0117 Enabling the Next Generation PAM4 50Gbps Signaling in Ceramic Package Substrate Application
Michael Chang HTC, Taiwan
TW0004 A Compact Broadband Dual-Polarized Antenna Array for 5G And LTE Communication System
Hu Qingyue DaYeh University, Taiwan
TW0006 New Stealth Dicing Method with WLCSP application Development
Judge Li Amkor Technology, Inc., Taiwan
TW0017 Study of Inherently Safer Design Strategy Application for IC Process Power Supply System
Chang Kuo-chi Fujian University of Technology, Taiwan
TW0020 Enabling high TDP Xeon processors through structural optimization
Jimmy Chuang Intel, Taiwan
TW0026 Study of the High-Tech Process Mechanical Integrity and Electrical Safety
Chang Kuo-chi Fujian University of Technology, Taiwan
TW0028 Improve Solder Extrusion for Large Size Stand Alone Module Hsin De Li USI, Taiwan
TW0031 Study of Improvement and Verification for Fan Wall of Network Rack Server using Six Sigma
Chang Kuo-chi Fujian University of Technology, Taiwan
TW0051 Chip Based Wide Range Planar Optical Spectrometer Chia Jung Chang ITRI, Taiwan
TW0053 Post-Layout Channel Quality Comparison (P.CQC) Signal Integrity Simulation Methodology Introduction
Denis Chen Intel, Taiwan
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54
2019
Packaging Poster Interactive Presentation
Time: 15:00-16:00, Oct . 23Venue: 5F, Taipei Nangang Exhibition Center
Paper Code
Topic Lead Author Affiliation
TW0054 Digital Lithography Technology for Fan-out Panel Level Package Application
Chang Liang-Cyuan ITRI, Taiwan
TW0058 Seed Layer Undercut Control for Fine Line RDL of FOPLP Shao-An Yen ITRI, Taiwan
TW0070 Folding Performance Study of Flexible Hybrid Electronics Systems using Fan-Out Panel Level Packaging Techniques
Shau Fei Cheng ITRI, Taiwan
TW0091 Investigation of Laser Micro-machining of Silicon Compound Ceramic Substrates
Hsiang-Chen Hsu I-Shou University, Taiwan
TW0112 Transparent Piezoelectric Ultrasonic Transducer for Optical Registered Photoacoustic Imaging
Yahan Liu National Cheng Kung University, Taiwan
TW0114 Conformal Conductive Thin Film Patterns on Curvilinear Surfaces
Lai Yi-Chin National Taiwan University, Taiwan
TW0121 Theoretical and Experimental Prediction of Switching Loss of Power MOSFET
Hsiao-Chun Hsu Feng Chia University, Taiwan
TW0122 Research on the application of flexible printing circuit board with reduced thermal resistance to automotive lighting module
Yi-Chun Liu Uniflex Technology Inc., Taiwan
55 ▲
Poster Session
PCB Poster Interactive Presentation
Time: 15:00-16:00, Oct . 24Venue: 5F, Taipei Nangang Exhibition Center
Paper Code
Topic Lead Author Affiliation
AS0030 A Composite Structure of Low Dielectric Substrate for Sub 6GHz and the Application in Flexible Printed Circuit (FPC)
Wei-Chih Lee Kunshan Aplus Tec .Corporation, Taiwan
AS0065 GALVANIC EFFECT OF ENEPIG IN PRINTED CIRCUIT BOARD (RESEARCH AND ANALYSIS WITH DOE)
Inwhein Lee Changshu Mutual-tek Co.,LTD, China
AS0066 Study on DC Electroplating Filling Technogy for High-aspect Ratio Through Holes
Inwhein Lee Changshu Mutual-tek Co.,LTD, China
TW0014 2D AOI & 3D AOI Verification Analysis on SiP Module Yu-Ren Chen Universal Global Scientific Industrial co ., Ltd, Taiwan
TW0016 Soft and Flexible Antenna On FPC Substrate for LTE And 5G Mobile Telecommunication Services System
Hu Qingyue DaYeh University, Taiwan
TW0044 Using Supervised Learning To Detect Drilling Defects Po-Yu Chang CIN PHOWN TECHNOLOGY CO ., LTD, Taiwan
TW0062 RFID Applied to SMT Feeder Management Verification KS Huang Universal Scientific Industrial Co ., Ltd . , Taiwan
TW0081 Characterizing Wideband Permittivities of 5G CCL and FCCL Using Split-Cylinder Resonators
Kuen-Fwu Fuh National United University, Taiwan
TW0090 Enhancing the Data Analysis in IC Testing by Machine Learning Techniques
Yu-Chen Lee National Central University, Taiwan
TW0095 An Experimental Investigation Into Thin Silicon Die Strength Evaluation
Hsin Chih Shih ASE, Taiwan
TW0124 Materials with Low Dielectric Constant and Good Thermal Properties Prepared by Introducing Meldrum'S Acid (Ma) Into Bismaleimide Based Thermosetting Resins
Huang Chien Ho National Tsing Hua University, Taiwan
TW0127 6-DoF Force/Torque Sensor Liang-Ju Chien ITRI, Taiwan
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56
2019
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