2019 impact-iaac program...2019 packaging session pcb session poster session plenary session special...

2019

Packaging Session

PCB Session

Poster Session

Plenary Session

Special Session

Joint Session

Day1- Wednesday October 23, 2019

Room 505 a+b+c

10:00-10:20 IMPACT-IAAC 2019 & ICFPE 2019 Joint Opening & Award Ceremony

10:20-11:00 Joint Plenary Speech I: The Past, Present, and Future of OLED Displays Dr. Ching W. Tang, Hong Kong University of Science and Technology, Hong Kong

11:00-11:40 Joint Plenary Speech II: Electronics Manufacturing Challenges and Opportuni�es: Closing the Gaps via Collabora�ve Innova�on Dr. Marc Benowitz, the iNEMI CEO, USA

11:40-12:20 Joint Plenary Speech III: The Drama�c Past, Present, and Future of Flexible Electrophore�c Display Technology Dr. Michael D. McCreary, Chief Innova�on Officer, E Ink Corpora�on, USA

12:20-13:10 Lunch, The Banquet Hall, 3F

Room 505 a 505 b 505 c 506

13:10-15:10 【J1�S1】Joint Session:Wearable 【S2】Form Factor(SPIL) 【S3】5G (Atotech) 【S4】Advanced

Packaging-1

15:00-16:00 <Packaging> Poster Interac�ve Presentaion � Coffee break (15:10-15:40)

15:40-17:40 【J2�S5】Joint Session: Heterogeneous I 【S6】iNemi 【S7】JIEP Session 【S8】3D integra�on & SiP

18:00-20:00 2019 TPCA Show, IMPACT-IAAC 2019 Joint Recep�on (Standing Buffet), 3F, Hall 1

Day2- Thursday October 24, 2019

Room 505 a+b

09:00-09:40 Joint Plenary Speech IV: 3D Chip Stacking Technologies for the FutureTeruo Hirayama, Execu�ve Chief Engineer, Sony Corpora�on, Japan

Room 505 a 505 b 505 c 506 504c

10:10-12:10【S9】5G Innova�ve

Technology (Nanya Plas�cs)

【S10】ICEP Session【S11】

Interconnec�on & Nanotechnology

【S12】 Machine learning Applica�ons

【S13】Advanced and Green Materials

and Process


13:10-15:10 【S14】AIOT (ASE) 【S15】Market Trend 【S16】Advanced Packaging-2

【S17】Fan-out Packaging Technology

【S18】HDI and Embedded

Technology

15:00-16:00 <PCB> Poster Interac�ve Presentaion � Coffee break (15:10-15:40)

15:40-17:40 【S19】IAAC 【S20】Heterogeneous II

【S21】Pla�ng & Electroless Process

【S22】Thermal Management

【J3�S23】Organic and

Printed Electronics Associa�on

18:00-20:30 IMPACT-IAAC 2019 & ICFPE 2019 Joint Interna�onal Welcome Dinner & 2018 Best Paper Award Ceremony (by invited)

Day3- Friday October 25, 2019

Room 505 a+b

08:50-09:30 Joint Plenary Speech V: Co-Design of Advanced Packaging and Process Technology for 5G Evolu�onDr. Yujun Li, Director, TSMC, Taiwan

09:30-10:10 Joint Plenary Speech VI: New Package Developments for 5G: From Infrastructure to Mobile Dr. Jan Vardaman, President, TechSearch, USA

Room 505 a 505 b 505 c 506 504 b

10:30-12:30 【S24】Embedded Session

【S25】Technical Solu�ons for Future

5G Mega Trend (AT&S)

【S26】5G Communica�on &

Solu�on【S27】Power

Electronics�Devices【J4�S28】Flexible Hybrid Electronics


13:30-15:30 【S29】 Advanced Packaging-3

【S30】DMT（Design, Modeling &

Test)

*The organizer reserves the right to modify the agenda.

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Floor Plan

Conference Room Dining Room(Conference Attendees Only)

Coffee Break WiFi

@

5F

3F

IMPACT-IAAC 2019

1F

TPCA Show & IMPACT Reception Party

(Banquet)

@WIFI for 5F

Poster Poster Poster

PosterPoster

VIP Lounge

RegistrationSpeaker Review Room

Room 0534

2019

TPCA Show & IMPACT Joint Reception

Room504c

Room504a

Room504b

Room505c

Room506

Room505a

Room505b

Organizer’s Office

Conference Agenda . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Inside Cover

Organizer, Co-Organizer and Sponsor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Greeting of ChairWelcome Message from Chih-I Wu, Conference General Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Welcome Message from Kuo-Ning Chiang, Conference Honorary Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Welcome Message from Shen-Li Fu, Conference Co-Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Welcome Message from Ming-Yi Tsai, Conference Co-Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Welcome Message from Maurice Lee, Conference Co-Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Committee Member . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

General InformationAbout Conference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

TPCA Show & Welcome Reception / International Welcome Dinner & Best paper Award Ceremony

/ IMPACT Best Paper 2018 / Identification Badge / Registration Desk / VIP Room / Organizer's Office

/ Poster Session / Internet Access / Excursion Tour / Hotel Information / Inquiries . . . . . . . . . . . . . . . . . . 12-17

ConferencePlenary Speeches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Packaging Poster Interactive Presentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

PCB Poster Interactive Presentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

IMPACT SponsorAmkor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

ASE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

Atotech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

AT&S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

GHS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

Nanya Plastics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Tango . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

SPIL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Trillion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

AMAT / Unimicron . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

Note . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

Pre-Announcement- IMPACT 2020 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Inside Back Cover

Index

2019

Organizer

TAIWAN PRINTED CIRCUIT ASSOCIATION (TPCA)

Surface Mount Technology Association (SMTA)

TAIWAN THERMAL MANAGEMENT ASSOCIATION (TTMA)

Co-Organizer

INTERNATIONAL ELECTRONICS MANUFACTURING INITIATIVE (iNEMI)

2019 InternationalConference onElectronicsPackaging

International Conference on Electronics Packaging (ICEP)

Communication Research Center, (NTU)

Special Session

INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TAIWAN (ITRI)

INTERNATIONAL MICROELECTRONICS AND PACKAING SOCIETY TAIWAN (IMAPS Taiwan)

IEEE ELECTRONICS PACKAGING SOCIETY

SILICONWARE PRECISION INDUSTRIES CO., LTD.(SPIL)

NAN YA PLASTICS CORPORATION

ADVANCED SEMICONDUCTOR ENGINEERING INC. (ASE)

Austria Technologie & Systemtechnik Aktiengesellschaft

Atotech Taiwan Limited

I-SHOU University (ISU) Korea Advanced Institute of Science and Technology

The Korean Microelectronics and Packaging Society (KMEPS)

National Tsing Hua University (NTHU)

1 ▲

Goverment Sponsor

Industrial Development Bureau,Ministry of Economic Affairs

Engineering & TechnologyPromotion Center

Department of Information and Tourism, Taipei City Government

Ministry of Education

2019 Sponsor

Media Partner

Yole Developpement

Unimicron Technology Corporation Unitech Printed Circuit Board Corp.

Amkor Technology Applied Materials Taiwan, LTD. DuPont Electronics & Imaging

TRIALLIAN CORP. Taiwan Semiconductor Manufacturing Company Limited (tsmc)

Underwriters Laboratories (UL)

JSR Corporation MacDermid Performance Solutions Taiwan Ltd.

Performance Solutions Taiwan Ltd.Tango Systems Inc.

Eternal Materials Co.,Ltd. Goal Searchers Co., LTD Taiwan Branch Ichia Technologies., INC.

▲

2

2019

Chih-I Wu, Ph.D.Chair of IMPACT-IAAC 2019Vice President & General Director, ITRI

Welcome Message from Chih-I Wu, Conference General Chair

Chih-I Wu, Ph.D.Chair of IMPACT-IAAC 2019Vice President & General Director, ITRI

On behalf of the IMPACT committee, it is my great pleasure to deliver you a warm welcome to the 2019 International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) from October 23-25 in Taipei, Taiwan .

The theme of this year is "IMPACT-IAAC on 5G-Evolution& Revolution"exploring packaging and PCB technology for 5G generations and material processing applications . To prepare this 3-day conference, our Technical Program Committee and the dedicated team of IEEE EPS-Taipei, iMAPS-Taiwan, TPCA and ITRI have worked tirelessly to arrange rich and varied programs with plenary speeches, special sessions, invited talks, sponsored industrial sessions, posters and outstanding paper presentations .

Moreover, in conjunction with the ICFPE (International Conference on Flexible and Printed Electronics), IMPACT anticipates to not only bring worldwide leading experts and engineers together in sharing state-of-the-art advanced microelectronic packaging and PCB technology but also bring informative programs and network to all the participants this years.

It is again our great honor and pleasure to welcome you to participate in this conference . We cordially hope that you will enjoy the insightful and inspiring technical discussions along with the warm hospitality here in Taiwan .

Sincerely,

3 ▲

Greeting

Welcome Message from Kuo-Ning Chiang, Conference Honorary Chair

Kuo-Ning Chiang, Ph.D.NTHU Chair Professor Academician, International Academy of Engineering (IAE) - Russia Fellow, IEEE / STAM / ASME / iMAPS Editor-in-Chief, Journal of MechanicsSenior Area Editor, IEEE Transactions on CPMT Topical Editor, IEEE AccessChairman, Society of Theoretical and Applied Mechanics

As the conference honorary chair of IMPACT-IAAC 2019, it is my great pleasure and privilege to welcome the participants from all over the world who came here to share/exchange experience and work together a few days on the microsystem/circuits/packaging/PCB annual event here in Taipei. IMPACT is one of the world leading electronic packaging conference and has more than 600 attendees, 200 papers presented and with a large exhibition, TPCA show, each year . IMPACT will cover a wide range of important topics related to future and current trends in electronic packaging and PCB technologies, the agenda of the IMPACT-IAAC 2019 includes Heterogeneous integration, Form Factor, 5G, AIOT, Embedded and Wearable related technologies, etc . I expect this conference to be an excellent platform for you to share knowledge, catch packaging trends and exchange research/development ideas .

I sincerely hope you will enjoy the program and networking environmentat these few days,I wish you every success with this important conference. Thank you for your participation.

Kuo-Ning Chiang, Ph.D.NTHU Chair Professor Academician, International Academy of Engineering (IAE) - Russia Fellow, IEEE / STAM / ASME / iMAPS Editor-in-Chief, Journal of MechanicsSenior Area Editor, IEEE Transactions on CPMT Topical Editor, IEEE AccessChairman, Society of Theoretical and Applied Mechanics

▲

4

2019

Welcome Message from Shen-Li Fu, Conference Co-Chair

Shen-Li Fu, Ph.D.Chair, IEEE EPS – TaipeiHonorary President & Distinguished Chair Professor, I-Shou UniversityPresident, SMTA-Taiwan

Dear Colleagues,

I am delighted to welcome you to the “IMPACT-IAAC 2019 Conference” . All the participants will be benefited from various sessions organized by the Technical Program Committee and the Organizers including ITRI, IEEE EPS-Taipei, IMAPS-Taiwan, and TPCA . The organizers dedicate to develop the international conference to bring access to cutting-edge technology trends and international collaboration opportunities .

Besides the plenary speeches and the invited speakers in “Packaging”, “Thermal” and “PCB”, there are nine special and industrial forums . The special forums include: Automotive, Heterogeneous Integration, ICEP Japan, JIEP, Embedded Technology and 5G . The industrial forums include: Advanced PCB, High Speed & Frequency, and AI .

The conference brings together the world’s leading researchers, engineers, and the industrial experts . It is for sure that we will be organizing a successful conference, and the experience with IMPACT-IAAC 2019 will be fruitful and long lasting .

Best regards,

Shen-Li Fu, Ph.D.Chair, IEEE EPS - TaipeiHonorary President & Distinguished Chair Professor, I-Shou UniversityPresident, SMTA-Taiwan

5 ▲

Greeting

Welcome Message from Ming-Yi Tsai, Conference Co-Chair

Ming-Yi Tsai, Ph.D.Co-Chair of IMPACT-IAAC 2019 Chairman, IMAPS-TaiwanProfessor, Chang Gung University

Dear Colleagues and Friends,

Welcome all of you to join this great annual event, the 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT-IAAC 2019). On behalf of the Conference Co-Chair, I would like to express our gratitude to all of you for taking your time to attend this world-leading IC packaging and PCB conference and exhibition in the next three days.

The conference is gathering more and more packaging/PCB professionals from industries, research institutes, and academia to discuss about new trends, technologies, and opportunities . It also provides a great platform for all of you to build the friendships, exchange information, create new ideas, and make new contact for further collaboration. Therefore, it is expected that there will be a lot of interactions, learning and sharing activities going between you and other attendees during the conference .

We wish all of you have the wonderful meeting, gain new knowledge for future innovation and make new friendships during this conference. Hopefully, you have a fruitful and enjoyable stay in Taipei and a successful year ahead .

Best Wishes,

Ming-Yi Tsai, Ph. D.Co-Chair of IMPACT-IAAC 2019 Chairman, IMAPS-TaiwanProfessor, Chang Gung University .

▲

6

2019

Welcome Message from Maurice Lee, Conference Co-Chair

Maurice LeeCo-Chair of IMPACT-IAAC 2019Chairman, TPCAPresident, PCB SBU I,Unimicron Technology Corporation

On behalf of IMPACT organizer, it is my great pleasure to welcome you to Taipei, Taiwan, for the 14th International Microsystems, Packaging, Assembly, Circuits Technology Conference. IMPACT is celebrating its 14th anniversary of bringing worldwide leading experts and engineers together in foster discussions and hopes to inspire participants from a various themes to initiate collaborations within and across disciplines for the advancement of our field in advanced microelectronic packaging and PCB technology . Our technical program is enriched with 6 plenary speeches, 4 joint sessions, 11special sessions, 77 invited speakers and around200 technical papers. Besides, we are glad to share with the Outstanding paper Award, Student Paper Award and Best Poster Awards with you . We also expect to provide technical demonstrations, and numerous opportunities for international networking.

As TPCA Chairman, I know that the success of the conference depends ultimately on many people who have worked with us in planning and organizing both the technical program and supporting social arrangements . Recognition should go to the Program Committee and Local Organizing Committee members who have all worked extremely hard for the details of important aspects of the conference programs and social activities. The future of Taiwan PCB industries link closely with packaging, semiconductor, design houses and end-product assembly shops; therefore, we dedicate to develop the international conference to bring accesses to cutting-edge technology trends and international collaboration opportunities . This year, we believe IMPACT-IAAC 2019 will bring a great impact towards breakthrough innovation.

We invite all of our TPCA members to come to Taipei Nangang Exhibition Center and to make the IMPACT-IAAC 2019 another vibrant, highly productive, and strong event . We particularly invite close involvement and participation of scientists, leaders and pioneers to join us in this annual theme conference in Asia .

Best Regards,

Maurice LeeCo-Chair of IMPACT 2019Chairman, TPCAPresident, PCB SBU I,Unimicron Technology Corporation

7 ▲

Greeting

Chih-I WuChair of IMPACT-IAAC 2019

Kuo-Ning ChiangNTHU

Ming-Yi TsaiChairman, IMAPS-Taiwan

Shen-Li FuISU

Maurice LeeTPCA

Mike MaAmkor

General Chair Honorary Chair Executive Co-ChairCo Chair

Committee Member

Technical Program Committee

Albert LanApplied Material

CP HungASE

Andreas WippelAT&S

James TsaiAtotech Taiwan Ltd .

Joshua JiangNanya Plastic

David TsengSPIL

Executive Co-Chair

Albert YehTriallian Corp .

Shin-Puu JengTSMC

Eric FengTTMA

Ravi Mullapudi Tango Systems

Executive Co-Chair

Wei-Chung LoITRI

Albert WuNCU

Andreas OstmannFraunhofer IZM

Ben-Je LwoNational Defense University

C. Robert KaoNTU

C.Y.Huang (Lewis)Senju Metal

Sub-CommitteeChair

Chang-Chun LeeNTHU

Charles BauerTechLead

Charlie LuTSMC

Chien-Yuh YangNCU

Chih ChenNCTU

Chih Hang TungTSMC

Sub-Committee Sub-Committee

▲

8

2019

Chuan-Seng TanNTU

David TarngASE

Fan-Yi OuyangNTHU

Gengshin ShenChipMOS

Haley FuiNEMI

Hsien-Chie ChengFCU

Jason LeeBoardTek

Jeffrey LeeIST

Jenn-Ming SongNCHU

Jimmy HsuINTEL

John LiuBoardTek

Kuan-Jung ChungNCUE

Kuan-Neng ChenNCTU

Kuoming ChenUMC

Kyung W. PaikKAIST

Lih Shan ChenISU

Lin Po-YaoTSMC

M. Y. TsaiCGU

Sub-Committee

Ming-Tzer LinCHU

Shaw Fong WongINTEL

Shih-Kang LinNCKU

Tz-Cheng ChiuNCKU

Tzong-Ming LeeITRI

Wei-Keng LinNTHU

Sub-Committee

Wei-Ping DowNCHU

Wen-Hsiang HsiehTAETI

Wun-Yan ChenITRI

Yasumitsu OriiNAGASE

Yu-Hua ChenUNIMICRON

Yu-Jung HuangISU

Sub-Committee

9 ▲

Committee

Eiji HigurashiAIST

Hiroshi YamadaToshiba

Hitoshi SakamotoHuawei

Johan LiuChalmers

Jung WangFUDAN

Kanji OtsukaMeisei University

Kwang-Lung LinNCKU

Marc BenowitziNEMI

Masaru IshizukaToyama

Ning-Cheng LeeIndium Corp

Noriyuki MiyazakiGERI

Penney YangAmazon

Rolf AschenbrennerFraunhofer IZM

Rozalia BeicaDuPont

Sung Yi PSU

Takafumi FukushimaTOHOKU U .

Takeyasu SAITOOPU

Ying-Hui WangIMECAS

Yung-Yu HsuAPPLE

Yu-Po WangSPIL

Zhuo LiFUDAN

International Advisory Board

Chris BaileyU of Greenwich

Shi-Wei Ricky LeeHKUST

Andy TsengJSR

Bo-Ping WuHuawei

Cheong Kuan Yew USM

Chew Chee Hiong ON Semiconductor

Chair Co-Chair

▲

10

2019

Domestic Advisory Board

Stephen WangEternal

Wendy ChenKYE

Local Committee

C. H. HsuUnitech

Dyi-Chung HuSiPlus

George YangAtotech

Hung-Yin TsaiNTHU

Irving LeeUL

James Tsai Atotech

Chair

Shu-Feng WangITRI

Hsiang-Chen HsuISU

David LaiTPCA

Michelle HungTPCA

Chair Co-chair Sub-Committee

11 ▲

Committee

General Information of IMPACT-IAAC 2019

IMPACT-IAAC 2019 Conference, which is organized by IEEE EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, is the largest gathering of packaging and PCB professionals in Taiwan. This year will be held in conjunction with TPCA SHOW 2019 on Oct . 23rd-25th at Taipei Nangang Exhibition Center . For grasping the latest trend, the symposium highlights the theme “IMPACT-IAAC on 5G-Evolution& Revolution.” The emergence of the fifth generation of mobile communications with its emphasis on massive MIMO and channel bandwidths over 1 GHz at mmWave frequencies is set to change everything we used to know about the design, validation and operation of cellular systems.

IMPACT-IAAC 2019 looks at the technical implications of the validation of cellular systems, and in particular the necessity of moving to radiated testing of systems where beam-steered antenna arrays are used at both ends of the link in highly dynamic 3D fading environments. Credible solutions need to be found urgently for the timescales for the proposed deployment of 5G in 2020 are to be realized .IMPACT-IAAC 2019 arrange plenary speeches, special sessions, invited talks, industrial sessions, posters and outstanding paper presentations. Furthermore, IMPACT-IAAC Conference keeps collaborating with international organizations such as ICEP from Japan and iNEMI from U.S.A.

We are pleased to bring you the annual technology gala of packaging, microsystems, assembly, PCB, materials and thermal . Hope you can enjoy the over 200 papers, speeches, posters and discussions . We sincerely pledge this conference can bring you access to meet industrial best practice, to create an opportunity for networking, and to build international collaborations .

Registra�on & Poster area

0534Speaker

Review Room

Organizer’s Office

VIP Lounge

504a 504b 504c 505a 505b 505c 506

電梯Elevator

陽台

About Conference■ Date: October 23(Wed) - October 25 (Fri), 2019■ Venue: Taipei Nangang Exhibition Center, Taipei■ Exhibition : TPCA Show 2019■ Theme: IMPACT-IAAC on 5G-Evolution& Revolution

Registration Desk

Reception desk is located on 5th floor of Taipei Nangang Exhibition Center . Please check in and get proceeding during the following scheduleOpen Hour: 10/23 08:30-16:30 10/24 08:30-16:30 10/25 08:10-15:00

Organizer Office & Speaker Preview Room

Organizer’s office on the 5th floor of Taipei Nangang Exhibition Center .Open Hour: 10/23 08:30-17:30 10/24 08:30-17:30 10/25 08:10-15:00

TPCA Show & IMPACT ReceptionAttendee: All IMPACT conference attendees and TPCA Show visitorsTime: Oct . 23rd, 2019 (18:00-20:00)

Venue: 3F Banquet, Taipei Nangang Exhibition Center

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12

2019

International Welcome Dinner & Best Paper Award Ceremony(By invitation only)Time: Oct . 24th, 2019 (18:30 – 20:30)Venue: Grande Luxe Banquet (3F)Address: 3F . NO . 166-A, JINGMAO 2ND RD ., NANGANG DIST., TAIPEI CITY 115, TAIWAN (R.O.C.)TEL: 02-2788-7222Invited Guest: Plenary Speakers, Invited speakers, Sponsors, VIP, IMPACT best paper awardees and Committee membersGathering Time: 5:45pmGathering Site: In front of IMPACT registration desk

Location of Poster Session

Poster session will be located on 5th floor of Taipei Nangang Exhibition Center .Time: 10/23 15:00-16:00 <Packaging> 10/24 15:00-16:00 <PCB>

Internet Access

Wireless internet is provided on 5th floor of Taipei Nangang Exhibition Center for free .

Lunch Provided

Organizer will arrange lunch vouchers for every registered attendee .Lunch Venue: Venue: The Banquet Hall, 3FSuggest Time: 10/23 12:20-13:10 10/24 12:10-13:10 10/25 12:30-13:30

Identification of Badges

Badges are required for admittance to all sessions, lunchbox and TPCA Show Reception Party . Please bring it with you all the times .

Conference Venue

Conference rooms will be located on the 5th floor of Taipei Nangang Exhibition Center .

Conference Venue Map

P6

P4

P3

P2

3

4

2010.05

5B1

1

2 P1

Nangang

Sijhih

Neihu . DonghuN

Singhua Rd

Xingzhong Rd

Lane 44

Chongyang Rd

Nanhu Bridge

NangangVocational

High School

Huimin St

Xindong Rd

Xinmin Rd

NKSP III

NKSP 、I II

Sanchong Rd

Jingmao2nd Rd

Jingmao1st Rd

TWTCNangang

TWTCNangang 2（under construction）

MainEntrance

Lane 62

Lane 88

Lane 106

Lane 157

Lane 105

Cheng-ZhengJunior

High School

Zhongnan St

Nangang Rd, Sec. 1

Dongnan St

North-south railway(Western Line)

Academia Rd, Sec. 1

Huandong Blvd

Huandong Blvd

Yuanqu St Nangang Connecting Highway

MRT TWTC Nangang Station

MRT Nangang Software Park Station

Keelung River

Nangang

Park

Business

Zhongxiao E. Rd, Sec. 7

TWTC Nangang Exhibition Hall Transport & Parking Information

6

21

3

56

4

Parking Lots：

Transport Information：

TWTC Nangang／620 Parking spaces

Taiwan Fertilizer C2 Parking Lot／352 Parking spaces



MRT Neihu Depot Parking Lot／584 Parking spaces／During Exhibition Periods

Xingzhong Parking Tower／647 Parking spaces／

NT$30 (per hour)／24HR

Shuttle Bus Stop (Pick-up / Drop-off)

Bus StopTaxi Drop-offSmall Vehicle Drop-offB1 Taxi Pick-upUnderground Parking Entrance

Underground Parking

Parking Lot

Entrance / Exit

Directions to TWTC Nangang The parking fee above is for reference only

P5P5

7

7 MRT Shuttle Bus Stop (to MRT Nangang Station)

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Information

IMPACT Best Paper 2018

IMPACT 2018 received over 180 papers, and we have conducted the 3 stage paper review process including abstract, full paper and onsite oral presentation.Thanks to the IMPACT Technical Program Committees, paper reviewers, and session chairs’ great support, we are delighted to announce thosepapers which have been selected as the IMPACT 2018 Paper Award .

Award Category

Paper Code

Paper Title Affiliation Author List

Packaging-Best Paper Award

EU001-1 Adhesive bonding methodologies for M(O)EMS packaging

CTR Carinthian Tech Research AG

Ali Roshanghias, Ying Ma, Eric Gaumont and Alfred Binder

AS007-1 Improving Throughput of Zero-Kerf Singulation for Ultra-Thin Wafers using Stealth Dicing

Tokyo Institute of Technology

Natsuki Suzuki, Kazuhiro Atsumi, Naoki Uchiyama, and Takayuki Ohba

US001-1 ELECTROPLATING PROCESSES FOR IC SUBSTRATES–EMBEDDED TRACE PLATE, VIA FILL AND THROUGH HOLE FILL

MacDermid Enthone

Saminda Dharmarathna, Maddux Sy, Benjamin Chao, Ivan Li, William Bowerman, Jim Watkowski, Kesheng Feng

Packaging-Best student Award

AS010-1 Development of 2D-Graphene-Based Highly Sensitive Flexible Strain Sensor Using Fine Columnar Concentration Structures

Tohoku University Zhi Wang, Ken Suzuki, and Hideo Miura

TW069-1 Evaluation of Suhir Theory for Predicting Thermally-Induced Warpage of Flip-Chip Packages

Chang Gung University

Y . W . Wang, and M . Y . Tsai*

TW097-1 Power Loss Estimation and Thermal Performance of Power MOSFET Package Using Coupled Electric-Thermal Analysis

National Tsing Hua University

Y .-S . Liao, Y .-H . Shen, C .-H . Wu, H .-C . Hsu, H .-C . Cheng, W .-H . Chen

PCB-Best Paper Award

TW045-1 Dependence of substrate warpage on the Cu microstructure transition

Kinsus Interconnect Technology Corp

Shu-Ping Yang, Cheng-Hsien Yang, Bau-Chin Huang, Hung-Cheng Liu and Cheng-En Ho

EU003-1 Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook

Atotech Mustafa Özkök, Sven Lamprecht, Akif Özkök, Simon Chien, Henning Hübner, Christian Ohde

PCB-Best Student Award

TW084-1 Chip-to-chip copper direct bonding in no-vacuum ambient with (111) oriented nanotwinned copper

National Chiao Tung University

Jing Ye Juang, Kai Cheng Shie, Yu Jin Li, K N Tu, and Chih Chen

TW092-1 Toward A Better Understanding of Working Mechanism of Flexible Ni(P)

Yuan Ze University Wei-Ling Chou, Yu-Hsuan Huang, Hsin-Ya Sung, Cheng-Yu Lee, Cheng-Sam Peng, and Cheng-En Ho

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2019

Excursion Tour

Time: 2019 Oct 26th (SAT) 07:50-18:00

Time Agenda

07:50-08:00 Meet up at The Place Taipei(No.196, Jingmao 2nd Road, Taipei)

08:00-09:30 Tour bus heading to des�na�on

09:30-11:30 Na�onal Center of Tradi�onal Arts (宜蘭傳藝中心)Hands-on Ac�vi�es - Artworks DIY (DIY活動)

11:50-13:30 Lunch - Taiwanese cusine

14:00-15:30 Spring Onions Farm (蔥仔寮體驗農場)DIY - Spring onions harves�ng (拔蔥)DIY - Spring onions pie (蔥油餅DIY)

16:00-17:00 Kavalan Dis�llery - Whiskey Factory (噶瑪蘭金車威士忌酒廠)Whiskey Tas�ng

17:00-18:00 Heading back to The Place Taipei

Note: (1) The Tour has a minimum number of 25 people. FEE: $90 USD (NTD$2,700)

Note: (2) The tour fee includes insurance, lunch, access to destination, tips for driver and guide

YilanYilan is located in northeast Taiwan . Its vast Lanyang Plain was created by erosion from the Lanyang River, and is surrounded by mountains on three sides, with the ocean on the east side . This unique geography has given rise to the unique culture of Yilan . Gazing across the plain, one can see buildings tall and short standing among green fields, and Freeway No. 5 wandering its way through the gentle county.(Source: Taiwan Tourism Bureau)

National Center for Traditional ArtsWalking into the park at the Center for Traditional Arts makes you feel like falling into a time tunnel. The streets decorated with red walls and black tiles are blended with the architectural styles of the old streets everywhere in Taiwan . All sorts of special stores, such as workshops and early Taiwanese variety stores, stand along the streets. Here, you may see things that trigger the fun memories of your childhood, such as dough figurine sculptures, sugar onion, traditional toys, glove puppetry, etc.(Source: Taiwan Tourism Bureau)

Spring Onions FarmLooking out across lush spring onion fields in spring, you’ll see a sea of little white flowers dancing as the wind blows, like a magical carpet laid down for a bride. Taste Yilan’s famous Sanxing spring onions, admire the beautiful fields, and let them stay with you through your journey in Yilan .

As you walk amid the streets in Yilan, you'll often hear a sizzling sound coming from a

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Information

fry pan; golden crispy dough is being fried, giving off the aromatic smell of spring onion.The delicious pancake made with Yilan's famous Sanxing spring onion always attracts a long queue of people, waiting to have their bite.(Source: Taiwan Tourism Bureau)

Kavalan DistilleryEstablished in 2005, Kavalan is Taiwan’s first whiskymaker and the nation’s only family-owned whisky distillery. Kavalan takes the old name of Yilan county where the distillery is located in northeastern Taiwan . The pure water and fresh air make this part of the subtropical island the ideal environment for the production of whisky.(Source: Taiwanese hand puppet theatre)

Signing up for the Excursion TourReply the application by September 15th, 2019Qualification: all participants of IMPACT Contact: Ms . Cindy Lee / Tel: +886-3-3815659#407 / Email: cindy@tpca .org .tw

Hotel Information

To enjoy the discount for IMPACT conference attendees, please book your hotel right away and make further follow-up confirmation with the hotel.

Hotel Infomation

The Evergreen Laurel Hotel Taipei台北長榮桂冠酒店Tel: +886-2-2501-9988

Taiwan Taoyuan Interna�onal Airport—35mins by aiport shu�le busTaipei Songshan Airport—15mins by taxiMRT—5 mins by walk (Songjiang nanjing)*Near Xing�an Temple

The Place Taipei南港老爺行旅Tel: +886-2-7750-0588

Taiwan Taoyuan Interna�onal Airport—45mins by taxiTaipei Songshan Airport—20 mins by taxiMRT —5 mins by walk (Gangang So�ware Park)*Near Nangang Exhibi�on Center

amba Taipei Songshan 松山意舍酒店Tel: +886-2-2525-2828

Taiwan Taoyuan Interna�onal Airport—45 mins by taxiTaipei Songshan Airport—15 mins by taxiMRT —2 mins by walk (Songshan)*Near Raohe Street Night Market

Caesar Park台北凱薩大飯店Tel: +886-2-2311-5151

Taiwan Taoyuan Interna�onal Airport—40 mins by Taoyuan Airport MRTTaipei Songshan Airport—15 mins by taxiMRT —3 mins by walk (Taipei Main)*Near Taipei Main Sta�on

Courtyard Taipei六福萬怡酒店Tel:886-2-2171-6565

Taiwan Taoyuan Interna�onal Airport—45 mins by taxiTaipei Songshan Airport—20 mins by taxiMRT —2 mins by walk (Nangang)*Near Nangang Exhibi�on Center

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16

2019

Hotel Infomation

Ambassador Hotel Taipei台北國賓大飯店Tel:+886-2-2551-1111

Taiwan Taoyuan Interna�onal Airport—40 mins by taxiTaipei Songshan Airport—15 mins by taxiMRT —5 mins by walk (Shuanglian)*Near SPOT Taipei Film House

The Howard Hotel Plaza Taipei台北福華大飯店Tel:+886-2-2700-2323

Taiwan Taoyuan Interna�onal Airport—50 mins by aiport shu�le busTaipei Songshan Airport—10 mins by taxiMRT —10 mins by walk (Zhongxiao-Fuxing)*Near Taipei´s East District

Shera�on Grand Taipei Hotel台北喜來登大飯店Tel:+886-2-2321-5511

Taiwan Taoyuan Interna�onal Airport—45 mins by taxiTaipei Songshan Airport—15 mins by taxiMRT —2 mins by walk (Shandao Temple)*Near Huashan 1914 Crea�ve Park

Grand Hya� Taipei台北君悅酒店Tel:+886-2-2720-1234

Taiwan Taoyuan Interna�onal Airport—45 mins by taxiTaipei Songshan Airport—15 mins by taxiMRT —5 mins by walk (Taipei 101�World Trade Center)*Near Taipei 101

InquiriesRequests for information about the Conference should be directed to:Secretariat- Taiwan Printed Circuit AssociationTPCA-Chelsea KaoNo . 147, Sec . 2, Gaotie N . Rd ., Dayuan, Taoyuan 33743, TaiwanTel: +886-3-3815659 Ext . 405Fax: +886-3-3815150E-mail: service@impact .org .tw Website: www .impact .org .tw

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Information

PLENARY SPEECHWednesday, October 23rd, 10:20-11:00

Dr. Ching W. Tang

ProfessorHong Kong University of Science and Technology

Topic: The Past, Present, and Future of OLED Displays

Abstract

OLED, which was discovered more than three decades ago at Kodak Research Laboratories, has emerged as a key technology for display applications with the potential to dominate the display market. While OLED has set many of today’s display performance benchmarks, it has yet to overtake LCD in the marketplace primarily because of cost . Lurching in the horizon is micro-LED, which has often been touted as the next-generation display technology because of its many tributes, including low power consumption. This talk is an attempt to provide a fair assessment of the future of OLED displays in light of its current status amidst the competitive display landscape .

Bio

Ching W . Tang is currently the IAS Bank of East Asia Professor at Hong Kong University of Science and Technology. He is best known for the invention of the heterojunction organic light emitting diode and photovoltaic devices, for which he has been awarded various prizes, including the 2011 Wolf Prize in Chemistry and the 2019 Kyoto Prize in Advanced Technology .

Room 505

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2019

Wednesday, October 23rd, 11:00-11:40

Dr. Marc Benowitz

CEO - International Electronics Manufacturing Initiative (iNEMI), USA

Topic: Electronics Manufacturing Challenges and Opportunities: Closing the Gaps via Collaborative Innovation

Abstract

The uniqueness and IP that we all individually bring to the industry keeps pushing us collectively to new heights . Though at the same time, within each manufacturing technology segment, we have more in common than we have differences. We share many of the same challenges and opportunities. Recent findings in the iNEMI Roadmap identify needs/gaps in areas such as advanced packaging, materials development for harsh environments, inspection/test along with design, modeling and simulation capabilities . Many of these are prime candidates for collaborative innovation, whereby

leveraging the expertise across the design/supply chain with a “virtualized vertical” project team yields the best of the best in a way that none of us could replicate individually. Looking, for example, at 5G and Smart Manufacturing, which both bring tremendous challenges and opportunities, the steps to realize high volume manufacturing capability are not all evident, though we as an industry can collaboratively accelerate gap closure .

Bio

Marc Benowitz, Ph.D. is CEO of the International Electronics Manufacturing Initiative (iNEMI), a not-for-profit, highly efficient R&D consortium of leading electronics manufacturers, suppliers, associations, government agencies and universities . iNEMI roadmaps the future technology requirements of the global electronics industry, engaging experts and stakeholders from around the globe and throughout the supply chain. The organization works collaboratively with its members to identify and prioritize technology and infrastructure gaps, and address these challenges and gaps through timely, high-impact development projects . This enables leaders in the electronics manufacturing industry to work together to address common challenges and enable technology deployment for a sustainable future .

Marc joined iNEMI as CEO in January 2018, after a 38-year career at Bell Laboratories and its parent companies of AT&T, Lucent Technologies, Alcatel-Lucent and Nokia. Prior to leaving Nokia Bell Labs he was Senior Director of the Reliability, HW Test and Eco-Environmental Engineering organization . He has a breadth of experience in R&D and supply chain domains, with lead roles in product development, joint ventures, new product introduction, cost reduction programs, target costing, manufacturing research, supply chain, sustainability and managing and implementing large-scale corporate programs .

Marc was a member of the iNEMI Board of Directors from 2001-2018 and the Board Chairperson from 2013 – 2018 .

Marc holds a B.S. degree in Applied Mechanics from the State University of New York at Buffalo and M.S. and Ph .D . degrees in Engineering Mechanics from Columbia University .

Room 505

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Plenary Speeches

Dr. Michael D. McCreary

Chief Innovation OfficerE Ink Corporation, USA

Topic: The Dramatic Past, Present, and Future of Flexible Electrophoretic Display Technology

Introduction / Outline

Electrophoretic display technology was originally envisioned as a solution for the decades old dream for flexible, low power, daylight readable ePaper. Today, the technology has been expanded to address new capabilities and form factors that are applicable to IoT, architecture, and many other uses . These advances will be described as well as projections for the future . Some of the experiences of the journey to bring a small startup with the dream of changing the way the world reads to today’s multi-hundred million dollar a year ePaper manufacturing company will also be reviewed .

Bio

Dr. Michael McCreary is responsible for expanding the portfolio of advanced technologies at E Ink which are enabling new generations of novel electronic paper and electronic paint display products . McCreary is a 45-year veteran of the imaging industry and also serves as the Chairman of the SEMI FlexTech Governing Council, an industry consortium. Prior to joining E Ink in 2000, he held a number of leadership positions with the Eastman Kodak Company, including serving as the General Manager of the Microelectronics Technology Division, which developed high performance solid-state image sensors . McCreary earned a Ph .D . in Physical Organic Chemistry from the Massachusetts Institute of Technology and completed further studies in solid state physics and device physics at the Rochester Institute of Technology and also business at the University of Pennsylvania Wharton School .

Room 505

Wednesday, October 24th, 11:40-12:20

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20

2019

Teruo Hirayama

Executive Chief EngineerSony Corporation, Japan

Topic: 3D Chip Stacking Technologies for the Future

Introduction / Outline

We are consciously and unconsciously benefiting from the spread of the Internet of Things (IoT). With this spread comes the strong demand for various semiconductors, especially small, multifunctional, high-performance LSIs. The system on a chip (SoC) is one solution. However, embedding various functions in different process nodes raises the cost of development and of products . Another promising solution is a system in package (SiP) such as a multi-chip 2D package or a 3D stack package. 3D chip stacking technology in particular can easily implement different function chips in a small system . We have contributed to the development of multifunctional, high-performance products with various 3D chip stacking technologies for many years . This paper introduces our past and latest achievements and shows the vision of the future that our technologies will create .

Bio

Teruo Hirayama received a bachelor’s degree in electrical engineering from Waseda University, Tokyo, Japan in 1981 and joined Sony Corporation the same year . He started in the research division of the semiconductor group, where he worked on SRAM, CMOS LSI, and then developed a stacked wide band DRAM on a LOGIC chip. He joined the image sensor division in 2002 where he developed a back-illuminated CMOS image sensor and a stacked image sensor, which were launched onto the market in 2009 and 2012, respectively . He became senior general manager of the semiconductor technology development division in 2010 and was responsible for the development of semiconductor devices . He became Corporate Executive in June 2013 and was appointed as president of the device and material R&D group on April 1, 2014, where he was responsible for R&D of displays, batteries, materials, and semiconductor devices . He is now Executive Chief Engineer in Sony Corporation .

Room 505 A+B

Thursday, October 24th, 9:00-9:40

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Plenary Speeches

Dr. Yujun Li

Director Taiwan Semiconductor Manufacturing Company, Limited, Taiwan

Topic: Co-Design of Advanced Packaging and Process Technology for 5G

Introduction/Outline

This talk will first cover the key market and technology trends driving 5G evolution. We will share our perspective of what’s new in 5G and what are the technology challenges . Then we will focus on the compelling reasons and possible solution of co-design of leading edge process technology and advanced packaging. Several examples will be given on technology and packaging co-design.

Bio

Dr . Yujun Li is a director of business development, in Taiwan Semiconductor Manufacturing Company . She leads business development of TSMC’s High Performance Computing Platform . Prior to joining TSMC in late 2015, she worked for IBM for 20+ years, in various engineering and executive management roles, in IBM’s semiconductor R&D center, systems group, and corporate strategy group . Yujun received her M .S . and Ph .D . degrees in Electrical Engineering from Yale University, and Bachelor of Science degree in Physics from University of Science and Technology of China . She has more than 20 issued patents and 30+ publications .

Room 505 A+B

Friday, October 25th, 8:50-9:30

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22

2019

Dr. E. Jan Vardaman

President, TechSearch International Inc., USA

Topic: New Package Developments for 5G: From Infrastructure to Mobile

Introduction/Outline

Frequency range up to mmWave, which packages are best?

Materials and packaging for 5G infrastructure

Mobile communications and new package and assembly requirements

What’s next?

Bio

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly . She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer . She is a member of SEMI, SMTA, IMAPS, and MEPTEC . She received the IMAPS GBC Partnership award in 2012 and the Daniel C . Hughes, Jr . Memorial Award in 2018 . She is an IMAPS Fellow . Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

Room 505 A+B

Friday, October 25th, 9:30-10:10

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Plenary Speeches

ORAL PRESENTATION【J1/S1】Joint Session: WearableTime: 13:10-15:10, Wednesday, Oct . 23, 2019Chair: Hung-Yin Tsai, National Tsing Hua University, Taiwan Kyung W. Paik, KAIST, South Korea

Room: 505 a

Time Topic Lead Author Affiliation

13:10-13:40 Development of High Speed FPC by Use of Advanced Hybrid Polyimide

Hirofumi Matsumoto

Nippon Mektron, Japan

13:40-14:10 SiP Structure Trend in Mobile/Wearable Application

David Wang

SPIL, Taiwan

14:10-14:40 Chip on Fabrics (COF) Interconnection Technology using ACFs

Kyung W. Paik

KAIST, South Korea

14:40-15:10 Tactile Sensing Electronic Skin for Wearable and Robotic Applications

Steve Park

Korea Advanced Institute of Science and Technology(KAIST), South Korea

SESSION INTRODUCTION

Opening CeremonyTime: 10:00-10:20, Wednesday, Oct . 23, 2019Room: R505, Taipei Nangang Exhibition CenterSymposium Chair: Shen-Li Fu, Ph .D . Chair, IEEE EPS – Taipei Honorary President & Distinguished Chair Professor, I-Shou University President, SMTA-Taiwan

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24

2019

SESSION 2: Form Factor(SPIL)Time: 13:10-15:10, Wednesday, Oct . 23, 2019Chair: Yu-Po Wang, SPIL, Taiwan Takayuki Ohba, Tokyo Institute of Technology, Japan

Room: 505 b


13:10-13:40 3D Integration for High Bandwidth Application

Takayuki Ohba

Tokyo Institute of Technology, Japan

13:40-14:10 Adaptive Processes for High Density Panel Level Packaging

Andreas Ostmann

Fraunhofer IZM, Germany

14:10-14:40 Low-Temperature, Pressureless Bonding Using Microfluidic Electroless Interconnection Process

C R Kao

NTU, Taiwan

14:40-15:10 Challenges of Low Loss Material for Advanced Packaging Techniques

Keiichi Hasebe

MITSUBISHI GAS CHEMICAL, Japan

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Sessions

SESSION 3: 5G (Atotech)Time: 13:10-15:10, Wednesday, Oct . 23, 2019Chair: Thonas Su, Intel, Taiwan Daniel Schmidt, Director of Global Marketing EL, Atotech, Germany

Room: 505 c

TimePaperCode

Topic Lead Author Affiliation

13:10-13:40 Invited The Market Trend of 5G

Emilie JOLIVET

YOLE, France

13:40-14:10 InvitedTW0024

"MPI + PEDLIM " - The best solution for Low Transmission Loss Application

Eric Tseng

Ichia, Taiwan

14:10-14:40 Invited Moving to mmWave how does effect the PCB/ IC substrate

Kuldip Johal

Atotech, USA

14:40-15:10 Invited RF front-end technology challenges from 5G

Wenchi Ting

UMC, Taiwan

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2019

SESSION 4: Advanced Packaging-1Time: 13:10-15:10, Wednesday, Oct . 23, 2019Chair: David Tarng, ASE, Taiwan Shih-Kang Lin, National Cheng Kung University, Taiwan

Room: 506

TimePaperCode


13:10-13:40 Invited PCB Electrical Characterization Update for IPC Standardization

Jimmy Hsu

Intel, Taiwan

13:40-14:10 Invited Instant Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned Cu

Chen Chih

National Chiao Tung University, Taiwan

14:10-14:25 EU0069 Investigation of Layer Characteristics and Reliability of Electroless Palladium and Autocatalytic Gold

Gustavo Ramos Atotech, Germany

14:25-14:40 TW0060 Anisotropic grain growth in Cu joints at low temperature by <111>-oriented nanotwinned copper films

Chang-Chih Hsieh National Chiao Tung University, Taiwan

14:40-14:55 TW0088 C4 Compatible Ultra-Thick Cu On-chip Magnetic Inductor Architecture Integrated with Advanced Polymer/Cu Planarization Process

Chien-Hsien Kuo Taiwan Semiconductor Manufacturing Company, Taiwan

14:55-15:10 TW0042 A Development of Full Time Anti-Hydrometeor Shielding Metallization Films on Tiny Hermetic Image Sensor Package

Jhih Wei Lai Tong Hsing Electronic Industries, Ltd ., Taiwan

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Sessions

【J2/S5】Joint Session: Heterogeneous ITime: 15:40-17:40, Wednesday, Oct . 23, 2019Chair: Shin-Puu Jeng, TSMC, Taiwan Wei-Chung Lo, ITRI, Taiwan

Room: 505a


15:40-16:10 Heterogeneous Integration on Organic Interposer

Po-Yao Lin

TSMC, Taiwan

16:10-16:40 Process Integration and Characterization of Hybrid Bonding

Wei-Chung Lo

ITRI, Taiwan

16:40-17:10 RF and system-level integration using fanout system in board FO-SiBTM

Markus Leitgeb

AT&S AG, Austria

17:10-17:40 Silicon Bridge using Fanout

Chung C Key

Spil, Taiwan

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2019

SESSION 6: iNemiTime: 15:40-17:40, Wednesday, Oct . 23, 2019Chair: Haley Fu, iNemi, USA Wei Keat Loh, Intel, USA

Room: 505b


15:40-16:10 The Need of Multi-physics Simulation Capabilities to Enable Electronic Packaging of the Future

Dr . Wei Keat Loh

Intel Corporation

16:10-16:40 Global Trends of IC Package Molding CAE Technology

Dr . Jim Hsu

CoreTech System (Moldex3D)

16:40-17:10 Quick decision of System in Package implementation for IoT/5G Era

Yoko Fujita

Zuken

17:10-17:40 System-level, post-layout electrical analysis for heterogeneous high-density advanced packaging (HDAP)

Dr . Dusan Petranovic Mentor, A Siemens Business

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Sessions

SESSION 7: JIEP SessionTime: 15:40-17:45, Wednesday, Oct . 23, 2019Chair: Takeyasu Saito, Osaka Prefecture University, Japan Kiyokazu Yasuda, Osaka University, Japan

Room: 505c


15:40-16:05 Development of High Heat-Resistance Liquid Encapsulated Material for Next Generation Power Devices

Yuki Ishikawa

Sanyu-rec, Japan

16:05-16:30 Fine Pitch Flexible Printed Circuit Fabrication by Silver-Seed Semi-Additive Process

Norimasa Fukazawa

DIC corp ., Japan

16:30-16:55 LED Packaging Trend & Super Strong + Ultra Tough LED

Onishi Tetsuya

Grand Junction Tech ., Japan

16:55-17:20 Flexible Electronic Device with Self-Healing Ability

Tomoya Koshi

AIST, Japan

17:20-17:45 Fabrication of flexible circuits by Printed Electronic

Takeo Minari

NIMS, Japan

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2019

SESSION 8: 3D integration & SiPTime: 15:40-17:40, Wednesday, Oct . 23, 2019Chair: Yu-hwa Chen, Unimicron, Taiwan Albert Lan, Applied Materials, USA

Room: 506

TimePaperCode


15:40-16:10 Invited Introduction of Wafer-Level Hybrid Bonding

Masahisa Fujino

National Institute of Advanced Industrial Science and Technology, Japan

16:10-16:25 AS0012 Divide-By-2 Injection-Locked Frequency Divider using 3-D Inductive Mutual-Coupling

Wen-Cheng Lai National Penghu University of Science and Technology, Taiwan

16:25-16:40 US0027 3D System-Level, Post-Layout Analysis & Test for High-Density Advanced Packaging

PoLin Chi Mentor Graphics Corporation, Taiwan

16:40-16:55 EU0033 Low-Temperature 3d Die-Stacking Thorough Direct Cu-Cu Thermosonic Bonding

Ali Roshanghias CTR Carinthian Tech Research AG, Austria

16:55-17:10 TW0097 Innovative System in Package Design by Laser Ablation Technology

Meng-Jie Lee SPIL, Taiwan

17:10-17:25 AS0093 EMI Shielding Solutions for RF SiP Assembly James Su SPIL, Taiwan

17:25-17:40 TW0032 Measurement of Thermally-Induced Curvatures and Warpages of 2.5D Packages by Using Strain Gauge

Ming-Yi Tsai Chang Gung University, Taiwan

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Sessions

SESSION 9: 5G Innovative Technology (Nanya Plastics Sponsored)Time: 10:10-12:15, Thursday, Oct . 24, 2019Chair: Gordon Lee, Nanya Plastics, Taiwan Cheric Yang, Nanya Plastics, Taiwan

Room: 505 a


10:10-10:35 High Frequency CCL Materials for 5G and Automotive Radar Applications

Howard Huang

Technical Engineer, Nanya Plastics, Taiwan

10:35-11:00 Advanced RTF Copper Foil for High-Speed and High-Frequency PCB Application

Ting-Yu Chou

R&D Engineer, Nanya Plastics, Taiwan

11:00-11:25 Comparative Properties of Different Types of Benzoxazine Resins used in CCL

Frank Wei

R&D Engineer, Nanya Plastics, Taiwan

11:25-11:50 To Enhance the loss Performance by New Type Copper Foil with Nanya CCL Material

Chia-Chieh Hsiao

Senior R&D Engineer, Nanya Plastics, Taiwan

11:50-12:15 The 5G Antenna and Small Cell Base Station Power Amplifier Module using Nanya CCL Material Board

Hsien-Chin Chiu

Professor, Chang Gung University, Taiwan

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32

2019

SESSION 10: ICEP SessionTime: 10:10-12:15, Thursday, Oct . 24, 2019Chair: Yasumitsu Orii, NAGASE & CO ., LTD, Japan

Room: 505 b


10:10-10:35 Surface Activated Bonding for GaN-SiC and GaN-diamond

Tadatomo Suga

Gakushikai Japan, Japan

10:35-11:00 Solution Activity of Advanced Package

Toshihisa Nonaka

Hitachi Chemical, Japan

11:00-11:25 Low Temperature Flip Chip Bonding Technology realizing 10micron Bump and Wiring Pitch on Substrates to Minimize the Die Assembly Area

Hiroshi Komatsu

ConnecTec Japan, Japan

11:25-11:50 High reliable low temperature bonding using Sn-Bi solder alloy system

Kei Murayama

Shinko, Japan

11:50-12:15 Devlopment of Materials Informatics Platform

Yasumitsu Orii

NAGASE & CO ., LTD, Japan

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Sessions

SESSION 11: Interconnection & NanotechnologyTime: 10:10-12:10, Thursday, Oct . 24, 2019Chair: Yu-Po Wang, SPIL, Taiwan Tz-Cheng Chiu, National Cheng Kung University, Taiwan

Room: 505 c

TimePaperCode


10:10-10:40 Invited Preparation Technology and Bonded Reliability Analysis of Ag Alloy Bonding Materials

Jun Cao

Henan Polytechnic University, China

10:40-10:55 TW0108 Understanding the Mechanism of Electromigration: The Key for Reliability in High Density and High Power Module

Kuan-Hsueh Lin National Cheng Kung University, Taiwan

10:55-11:10 TW0084 Development of Ultrasonic Cu-to-Cu Bonding I-Yu Yu National Chung Hsing University, Taiwan

11:10-11:25 TW0022 The Investigation on Currents Stress for Electromigration on Cu/Sn IMC Formation

Ming-Tzer Lin National Chung Hsing University, Taiwan

11:25-11:40 TW0103 Highly (111)-oriented Nanotwinned Cu for Redistribution Lines in InFO & 3D IC with High Electromigration Resistance

I-Hsin Tseng National Chiao Tung University, Taiwan

11:40-11:55 AS0082 Nanoporous Copper Roughening for Low Temperature Solid Phase Bonding

Kiyokazu Yasuda Osaka University, Japan

11:55-12:10 TW0043 Ultra-Miniature Saw Filter New Structure: for 5G IoT Mobile Device

Chao Wei Chung Tong Hsing Electronic Industries, Ltd, Taiwan

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34

2019

SESSION 12: Machine learning ApplicationsTime: 10:10-12:10, Thursday, Oct . 24, 2019Chair: Kuo-Ming Chen, UMC, Taiwan Kuan-Jung Chung, National Chanhua University of Education, Taiwan

Room: 506

TimePaperCode


10:10-10:40 Invited Computing Reimagined - quantum, AI, and IoT

Shintaro Yamamichi

IBM Japan, Japan

10:40-10:55 TW0086 Reliability Prediction of WLP using AI Recurrent Neural Network Regression Model

Yi-Chieh Tseng National Tsing Hua University, Taiwan

10:55-11:10 AS0061 Reliability Assessment of Wafer Level Packaging using Support Vector Regression Model

Sunil Kumar Panigrahy National Tsing Hua University, Taiwan

11:10-11:25 TW0002 Automatic Defects Classification from AOI Images Based on Image Processing and Deep Learning

Tsai-Yi Cheng National Tsing Hua University, Taiwan

11:25-11:40 TW0105 A Machine Learning Model for Predicting Effective Charge in Electromigration Effect

Yu-Chen Liu National Cheng Kung University, Taiwan

11:40-11:55 TW0107 A Novel Feature-spanning Machine Learning Technology for Image-based Defect Inspection

Wong-Shian Huang ASE Group, Taiwan

11:55-12:10 AS0067 The Prediction of Positioning shift for a Robot Arm Using Machine Learning Techniques

Kuan-Jung Chung National Chanhua University of Education, Taiwan

35 ▲

Sessions

SESSION 13: Advanced and Green Materials and ProcessTime: 10:10-12:10, Thursday, Oct . 24, 2019Chair: Ning-Cheng Lee,Indium Corporation, USA Jeffrey, Kuo-Chan Chiou,ITRI, Taiwan

Room: 504c

TimePaperCode


10:10-10:35 Invited Novel Fluxes with Decreased Viscosity After Reflow for Flip Chip and SIP Assembly

Ning-Cheng Lee

Indium Corporation, USA

10:35-10:50 TW0094 Feature Extraction and Pattern Classification of Grinding Wheel Wear Based on Acoustic Emission Signal

Chia Ling Chu Chang Gung University, Taiwan

10:50-11:05 TW0056 Design, Fabrication, and Analysis of Digitally-Manufactured High-Frequency Passive Devices by Laser Direct Exposure Platform

Shih-Ming Lin Industrial Technology Research Institute, Taiwan

11:05-11:20 TW0072 Low Temperature Reduction for Copper Oxide using Vapor or Liquid reductants

Wei Chen Huang National Chung Hsing University, Taiwan

11:20-11:35 AS0083 Analysis of Electrical Conductivity Variation of Stretchable Wires Printed with Polyurethane-based Conductive Pastes during a Uniaxial Cyclic Test

Masahiro Inoue Gunma University, Japan

11:35-11:50 TW0078 Effect of Phase Distribution on Micro-Galvanic Corrosion in Rapid Solidified and Sintered Cu-Ag Systems

Yan-Jie Li National Chung Hsing University, Taiwan

11:50-12:15 Invited 3D Printing in Digital Health

Charles E . Bauer

TechLead Corporation, USA

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36

2019

SESSION 14: AIOT, ASETime: 13:10-15:10, Thursday, Oct . 24, 2019Chair: Henry Lin, ASE David Tarng, ASE, Director, Taiwan

Room: 505 a


13:10-13:35 AI Application Processor Market & Technology Roadmap

Emilie JOLIVET

YOLE, France

13:35-14:00 Nonvolatile Memory as an Enabler of AIOT

Wenchi Ting

UMC, Taiwan

14:00-14:25 How advanced SOM (system on module) package can benefits design and cost-saving for hearable & wearable devices

Steven JL LIN ASE, Taiwan

14:25-14:50 Sensor Packaging Technology

Ryan Lai

ASE, Taiwan

14:50-16:15 Innovative Metal Deposition to Enable Advanced Packaging in 5G and A-IOT Applications

Ravi Mullapudi

Tango Systems, US

37 ▲

Sessions

SESSION 15: Market TrendTime: 13:10-15:10, Thursday, Oct . 24, 2019Chair: Shin-Puu Jeng, TSMC Kuo-ming Chen, UMC

Room: 505 b


13:10-13:40 Highlight of Packaging and Substrate Market Development Trend

Shiuh-Kao Chiang

Prismark, USA

13:40-14:10 The Market for High Performance Packaging in a 5G World

Dick James

Tech Search, USA

14:10-14:40 World PCB Trend

Hayao Nakahara

N . T . Information, Japan

14:40-15:10 Automotive Packaging Market & Technology Trends 2019

Santosh Kumar

YOLE, India

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38

2019

SESSION 16: Advanced Packaging-2Time: 13:10-15:10, Thursday, Oct . 24, 2019Chair: Ricky Shi-Wei Lee, HKUST, Hong Kong Chih-hang Tong, TSMC, Taiwan

Room: 505c

TimePaperCode


13:10-13:40 Invited Implementation of Mini/Micro-LED with Printed Quantum Dots

Ricky Shi-Wei Lee

HKUST, Hong Kong

13:40-13:55 TW0050 Moisture Absorption and Desorption Characterization for Plastic SiP Package

Pei-ju Chen Integrated Service Technology, Taiwan

13:55-14:10 TW0010 DFM-aware Design Flow for Sip Foundry Business and Applications

Eigen Fu Yuan Consulting Ltd, Taiwan

14:10-14:25 AS0046 The Dependence between Pad Roughness and the Growth Rate of Au-Al Formed IMC

Lin Ran Po Powertech Technology Integration, Taiwan

14:25-14:40 AS0035 The Analysis for Bump Resistance Improvement by Optimizing the Sputter Condition

Ming-Sin Su Taiwan Semiconductor Manufacturing Company, Taiwan

14:40-14:55 TW0041 Advanced VSCEL Package for 3D Sensor Application by Using Attached Ceramic-Spacer Technology

Jeffery Shih Tong Hsing Electronic Industries, Taiwan

14:55-15:10 TW0074 Instant Copper Direct Bonding Using <111>-oriented Nanotwinned Cu Microbumps

Kai-Cheng Shie National Chiao Tung University, Taiwan

39 ▲

Sessions

SESSION 17: Fan-out Packaging Technology Time: 13:10-15:10, Thursday, Oct . 24, 2019Chair: Ben-Je Lwo, National Defense University, Taiwan Po-Yao Lin, TSMC, Taiwan

Room: 506

TimePaperCode


13:10-13:40 Invited Proposal of New Materials and Process for WLP and Fan-Out WLP

Shinya Takyu

LINTEC Corporation, Japan

13:40-13:55 AS0087 Prediction of Panel Level Warpage Using Convolution Neural Network Model

Min-Yiu Chen National Tsing Hua University, Taiwan

13:55-14:10 TW0038 Manz's FOPLP Solution with Wet Bench Equipment for Cu RDL Formation

Richard Tsai Manz Taiwan Ltd ., Taiwan

14:10-14:25 AS0055 Study on the Assembly Technology of Die-First / Face-Down Type FO-PLP

Masaaki Takekoshi Hitachi Chemical Co ., Ltd ., Japan

14:25-14:40 TW0106 Viscoelastic Effects on Process-induced Warpage of Fan-out Wafer-level Package during Molding Process

Yan-Cheng Liu Feng Chia University, Taiwan

14:40-14:55 TW0101 Coupled Hygro-Thermo-Mechanical Analysis of Moisture Induced Interfacial Stresses in Fan-Out Package

Tz-Cheng Chiu National Cheng Kung University, Taiwan

14:55-15:10 AS0008 Warpage Simulation on a Typical Fan-out Panel Level Package (FOPLP) Process with Glass Carrier

Ben-Je Lwo National Defense University, Taiwan

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40

2019

SESSION 18: HDI and Embedded TechnologyTime: 13:10-15:10, Thursday, Oct . 24, 2019Chair: Jeffrey Lee, Integrated Service Technology, Taiwan Albert T . Wu, NCU, Taiwan

Room: 504 c

TimePaperCode


13:10-13:40 Invited Scanning Electrochemical Microscopy for Bioimaging

Tzu-En Lin

National Chiao Tung University, Taiwan

13:40-14:10 Invited If Pico laser can catch the demands for HDI progressing

Tinghao Lin

KINSUS, Taiwan

14:10-14:25 TW0077 Photonic-sintering of Copper Oxide Particles with Low Density Irradiations

Po-Hsiang Chiu National Chung Hsing University, Taiwan

14:25-14:40 US0015 Copper Electroplating Processes for Advanced HDI Applications

Kesheng Feng MacDermidAlpha Inc, USA

14:40-14:55 AS0089 Device to Remotely Track and Locate the Position of a Child for Safety

Shamendra Egodawela University of Peradeniya, Sri Lanka

14:55-15:10 TW0073 An Electrochemical/Optical Combined Strategy for Analyzing Surface Oxide Layer on Pure Copper in Microelectronics

Wei Chen Huang National Chung Hsing University, Taiwan

41 ▲

Sessions

SESSION 19: IAACTime: 15:40-17:40, Thursday, Oct . 24, 2019Chair: Ming-Yi Tsai, Chang Gung University, Taiwan Taek-Soo Kim, KAIST, South Korea

Room: 505 a


15:40-16:10 Recent Advances in Underfill for Flip-Chip Packages

Osamu Suzuki

Namics Co ., Japan

16:10-16:40 Strategies for Mechanically Reliable Thin-Film Flexible Electronics

Taek-Soo Kim

KAIST, South Korea

16:40-17:10 Thermally-Induced Warpage and Stresses of Flip-Chip and 2.5D Packages: Experimental, Theoretical and Numerical Analyses

Ming-Yi Tsai

Chang Gung University, Taiwan

17:10-17:40 Evolution of Embedded Technology for Active Components

Shutesh Krishnan Shastri

ON Semiconductor, Malaysia

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42

2019

SESSION 20: Heterogeneous IITime: 15:40-17:40, Thursday, Oct . 24, 2019Chair: Wei-Chung Lo, ITRI, Taiwan Shin-Puu Jeng, TSMC, Taiwan

Room: 505 b


15:40-16:05 Heterogeneous Integration Roadmap (HIR)

Bill Chen

ASE Group, USA

16:05-16:30 Advance in Substrate Heterogeneous Integration Technology

Dyi-Chung Hu

SiPlus Co ., Taiwan

16:30-16:55 Heterogeneous Integration Based on Low-Temperature Bonding for Mems and Sensors

Eiji Higurashi

AIST, Japan

16:55-17:20 Heterogeneous Integration Packaging Technology for AI

Albert Lan

Applied Materials, USA

17:20-17:40 Panel DiscussionDyi-Chung Hu, SiPlus Co ., TaiwanEiji Higurashi, AIST, JapanAlbert Lan, Applied Materials, USA

Moderator: Bill Chen

Senior Technical Advisor, ASE Group

43 ▲

Sessions

SESSION 21: Plating & Electroless Process IITime: 15:40-17:40, Thursday, Oct . 24, 2019Chair: Wei-Ping Dow, National Chung Hsing University, Taiwan Pohsiu Cheng,Tong Hsing, Taiwan

Room: 505 c

TimePaperCode


15:40-16:10 Invited Electroless Cu Deposition Using Cu2+ ion as Catalyst

Wei-Ping Dow

National Chung Hsing University, Taiwan

16:10-16:40 Invited Solutions for Next Generation IC Substrate manufacturing

Laurence Gregoriades

Atotech Deutschland GmbH, UK

16:40-16:55 EU0068 A Robust Palladium-Free Activation Process for Electroless Copper Plating

Laurence Gregoriades

Atotech Deutschland GmbH, UK

16:55-17:10 EU0120 A Novel Horizontal Copper Pattern Plating System with High Throughput

Bert Reents Atotech Deutschland GmbH, Germany

17:10-17:25 TW0047 Microstructure Modification of Electroplating Cu and Improvement of Its Etching Characteristics in the Roughening Process

Cheng Yu Lee Yuan Ze University, Taiwan

17:25-17:40 AS0104 High Strength and High Thermal Stability Nano-Twinned Cu Foil

Yu-Jin Li National Chiao Tung University, Taiwan

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44

2019

SESSION 22: Thermal ManagementTime: 15:40-17:40, Thursday, Oct . 24, 2019Chair: Allen Liu, TTMA, Taiwan Wei-Keng Lin, T-Global, Taiwan

Room: 506

TimePaperCode


15:40-16:10 Invited Measurement of Thermal Diffusivity of Ultra-Thin Vapor Chamber under Microgravity

Wei-Keng Lin

National Tsing-Hua University, Taiwan

16:10-16:25 AS0021 Thermal Resistance Model and Analysis for Future Smart Glasses

Atsushi Kurokawa Hirosaki University, Japan

16:25-16:40 TW0098 The Evaluation of Thermal Performance of Backside Metallurgical Lamination type on Flip Chip Package

Michael Fu SPIL, Taiwan

16:40-16:55 TW0109 Transient Thermal Damage Simulation for Novel Location-Controlled Grain Technique in Monolithic 3D IC

Pin-Jun Chen National Chiao Tung University, Taiwan

16:55-17:10 TW0013 Fabrication and Thermal Dissipation Properties of Carbon Nanofibers Derived from Electrospun Poly(amic acid) Carboxylate Salt Nanofibers

Hsun-Hao Hsu National Chiao Tung University, Taiwan

17:10-17:25 AS0085 Thermal Network Analysis for Heat Dissipation Performance of Printed Circuit Board Using JPCA Method

Tomoyuki Hatakeyama Toyama Prefectural University, Japan

45 ▲

Sessions

【J3/S23】Joint Session: Organic and Printed Electronics AssociationTime: 15:40-17:40, Thursday, Oct . 24, 2019Chair: Wolfgang Mildner, MSWtech

Room: 504 c


15:40-16:10 Ink Jet Printing of OLED Displays – the Interplay of Materials, Ink Formulation, Processing and Device Performance

Georg Bernatz

Merck KGaA, Germany

16:10-16:40 Applications of Photonic Curing to Flexible Electronic Devices

Kenji Shinozaki

Novacentrix, Japan

16:40-17:10 Human-Machine Interface in the IoT Era

Albert Lu

Interlink Electronics, Inc., Singapore

17:10-17:40 Electronics Go 3D - From Printed Electronics to 3D Structural Electronics – Status and Roadmap for New Compact 3D Functional Applications

Wolfgang Mildner

MSWtech, Germany

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46

2019

SESSION 24: Embedded SessionTime: 10:30-12:30, Friday, Oct . 25, 2019Chair: Yoshihisa Katoh, Fukuoka University, Japan Ray-Min Tain, Unimicron, Taiwan

Room: 505 a


10:30-11:00 Power System in PCB - Next Generation Technology for High Power Density Integration

Tao-Chih Chang ITRI, Taiwan

11:00-11:30 Fan-Out Panel-Level Packaging for Heterogeneous Integrations

Cheng-Ta Ko

Unimicron, Taiwan

11:30-12:00 Fabrication process and its reliability of 2um or less ultra-fine pattern for heterogeneous integration

Haruki Sueyoshi

Reserch Center for 3D semiconductors of Japan, Japan

12:00-12:30 System Level Co-Design Platform for 3D SiP & 3D Electronic Module

Masaomi Suzuki

Zuken, Japan

47 ▲

Sessions

SESSION 25: Technical Solutions for Future 5G Mega Trend (AT&S)Time: 10:30-12:30, Friday, Oct . 25, 2019Chair: Thomas Wu, AT&S, Taiwan

Room: 505 b


10:30-11:00 Wrap up (More than AT&S)

Rainbow Yuan

AT&S, Taiwan

11:00-11:30 SLP technology

Andy Huang

AT&S, Taiwan

11:30-12:00 Advanced Embedded DIE packaging Technology

Lio Li

AT&S, Taiwan

12:00-12:30 All in One Package

Markus Leitgeb

AT&S AG, Austria

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48

2019

SESSION 26: 5G Communication & SolutionTime: 10:35-12:30, Friday, Oct . 25, 2019Chair: Lih-Shan Chen, I-Shou University, Taiwan Irving Lee, Global Project Manager, UL, Taiwan

Room: 505 c

TimePaperCode


10:35-10:55 Invited New Era of MEMS Devices for the 5G Evolution and Revolution

Jun Mizuno

Waseda University, Japan

10:55-11:15 Invited 3D MIM Capacitor in TSV: A novel on-chip integrated capacitor

Chan Seng Tan

Nanyang Technological University, Singapore

11:15-11:30 AS0037 LiTaO3/Quartz Bonding with Low-Residual Al2O3 Amorphous Intermediate Layer for 5G Surface Acoustic Wave Devices

Ami Tezuka Waseda University, Japan

11:30-11:45 AS0029 A Composite Structure of Low Dielectric Substrate for 5G mmWave and the Application in Flexible Printed Circuit (FPC)

Wei-Chih Lee Kunshan Aplus Tec .Corporation, Taiwan

11:45-12:00 TW0049 Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission

Ying-Syuan Wu Yuan Ze University, Taiwan

12:00-12:15 TW0048 Roughness Effect of Cu Interconnects on Signal Transmission Performance in 5G Communication Applications

Wei-Ling Chou Yuan Ze University, Taiwan

12:15-12:30 TW0018 A Novel Fabrication Process and Measurement Results of 28GHz Glass Antenna with Single TGV for 5G Communication Applications

Yiu-Hsiang Chang ITRI, Taiwan

49 ▲

Sessions

SESSION 27: Power Electronics/DevicesTime: 10:35-12:30, Friday, Oct . 25, 2019Chair: Hsien-Chie Cheng, FCU, Taiwan Allen Liu, ITRI, Taiwan

Room: 506

TimePaperCode


10:35-10:55 Invited Silicon Carbide Power Module for High Power Applications

Allen Liu

ITRI, Taiwan

10:55-11:15 Invited Dry Etching Fluoride Residue Removal with Lower Metal Damage for High Reliability Power Device & TSV

Onishi Tetsuya

Grand Junction Tech ., Japan

11:15-11:30 TW0052 Enhancement of Light Extraction Efficiency and High Reliable DPC Ceramic Base against Photochemical Damage by PVD Al Film for UV-LED Application

Vito Cheng Tong Hsing Electronic, Taiwan

11:30-11:45 AS0063 Epoxy Resin Encapsulated IGBT Module Characteristics and Reliability

Yuju Chen Delta Electronics, Inc ., Taiwan

11:45-12:00 TW0025 The Comparative Characterization between SiC MOSFET and Si- IGBT for Three Phase SPWM Inverter

Heng Lee ITRI, Taiwan

12:00-12:15 TW0001 Minimizing Power Module Size with Low Stray Inductance and High Heat Dissipation

Chih-Chiang Wu ITRI, Taiwan

12:15-12:30 TW0045 Assembly Challenge and Solution for GaN on Si substrate

Hsinjou Lin SPIL, Taiwan

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50

2019

【J4/S28】Joint Session: Flexible Hybrid ElectronicsTime: 10:30-12:30, Friday, Oct . 25, 2019Chair: Shinri Sakai, Professor, Yamagata University, Japan

Room: 504 b


10:30-11:00 Flexible, Printed and Hybrid Electronics 2019-2029: State of the Market and Opportunities

Raghu Das

IDTechEX, United Kingdom

11:00-11:30 Bio-Inspired Structures and Functions for Wearable Sensors

Hyunhyub Ko

Ulsan National Institute of Science & Technology (UNIST), Korea

11:30-12:00 Development of Power Supplies for Mini Sensor Systems Using Printing Technology

Ye Tao

National Research Council Canada, Canada

12:00-12:30 Flexible Sensors and Wearable Patches for Healthcare and Human-Machine-Interfaces

Chengkuo Lee

National University of Singapore, Singapore

51 ▲

Sessions

SESSION 29: Advanced Packaging-3Time: 13:30-15:30, Friday, Oct . 25, 2019Chair: Wun-Yan Chen, ITRI, Taiwan Sam Song, NCHU, Taiwan

Room: 505a

TimePaperCode


13:30-13:45 Surface Mounting Solution Suggested for SiP Package

Peter Chiang, Jeffrey Lee, Jerry Huang

CPBI Alliance, Taiwan (Chip to Package to Board Interconnection)

13:45-14:00 TW0115 Multi-layer Printed Circuit Board via LCD-based Stereolithography

Tsai Shang-Cheng National Taiwan University, Taiwan

14:00-14:15 AS0059 A Study on Temperature Effect of the Dielectric Material loss using Transmission Line Method

PO-I Wu ASE Group, Taiwan

14:15-14:30 AS0099 The Bonding Performance of Au-coated Ag Alloy wire

Huiyi Tang Chong Qing Materials Research Institute Co ., Ltd, China

14:30-14:45 TW0110 Comparison of Oxide Reduction Temperature between Highly <111>-Oriented Nanotwinned Cu and Regular Cu Films

Wei-You Hsu National Chaio Tung University, Taiwan

14:45-15:00 TW0102 Nanotwinned Copper Film Retaining High Hardness and Elongation after Low Temperature Annealing

Hsiang-Yuan Cheng National Chiao Tung University, Taiwan

15:00-15:15 TW0079 Empirical Study of Multi-Objective Parameter Optimization in Wire Bonding Process

Yun-Chia Chen National Tsing Hua University, Taiwan

15:15-15:30 TW0019 The Enhanced Copper Foil Design for High-Speed Applications in 2020 and Beyond

Norman Juan Co-tech Development, Taiwan

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52

2019

SESSION 30: DMT (Design, Modeling & Test)Time: 13:30-15:30, Friday, Oct . 25, 2019Chair: Ming-Yi Tsai, Chang Gung University, Taiwan Liu, De-Shin, National Chung Cheng University, Taiwan

Room: 505b

TimePaperCode


13:30-14:00 Invited High Slenderness Ratio Die Breaking Stress Testing Methods Applied to Dynamic Die Picking Process

Liu, De-Shin

National Chung Cheng University, Taiwan

14:00-14:15 TW0119 Geometrical Responses and Volumetric Displacement in Large Deflection of Simply Supported Plate with Piezoelectric Patches under Pretension

Chun-Fu Chen Chung-Hua University, Taiwan

14:15-14:30 AS0057 Statistical and Comparative Simulation Methods for High Speed Interfaces

Thonas Su Intel, Taiwan

14:30-14:45 TW0116 Ultra-thin Package Board Level Drop Reliability Modeling

Shu-Shen Yeh Taiwan Semiconductor Manufacturing Company, Ltd ., Taiwan

14:45-15:00 TW0023 Geometric Nonlinear Effect on Thin Silicon Die Strength Under Three-Point Bending

Ming-Yi Tsai Chang Gung University, Taiwan

15:00-15:15 AS0092 SERDES Transceiver for Supply-Induced Jitter Sensitivity Methodology Based on PDN Analysis

Michael Chang HTC, Taiwan

53 ▲

Sessions

Packaging Poster Interactive Presentation

Time: 15:00-16:00, Oct . 23Venue: 5F, Taipei Nangang Exhibition Center

Paper Code


AS0003 Optimization of Temporary Wafer Bonding Materials and Processes for 3D IC Integration

Tsung Yu Ou Yang ITRI, Taiwan

AS0036 LTD PKG. (Liquid Thermal Dissipation Package) Technology Dragon Huang Siliconware Precision Industries Co ., Ltd ./National Taiwan University, Taiwan

AS0071 Study of Thermal Characteristics of Thin Adhesive Layer using Novel RDP Method for Wafer-On-Wafer (WOW) Applications

Shinji Maetani DAICEL Corporation, Japan

AS0075 Electrical Characterization for Curing Behavior of Epoxy-based Adhesives Containing Silver Fillers Treated with Several Triazole Surfactants

Shiho Nakazawa Gunma University, Japan

AS0111 Mechanical Properties of SiC and DBC Bonding Joint using Sn-Cu Solder

Seung Jun Hwang University of Seoul, South Korea

AS0113 Transient liquid phase bonding of SiC to Cu using Sn-Ni solder for power module

Wook Sang Jeon University of Seoul, South Korea

AS0117 Enabling the Next Generation PAM4 50Gbps Signaling in Ceramic Package Substrate Application

Michael Chang HTC, Taiwan

TW0004 A Compact Broadband Dual-Polarized Antenna Array for 5G And LTE Communication System

Hu Qingyue DaYeh University, Taiwan

TW0006 New Stealth Dicing Method with WLCSP application Development

Judge Li Amkor Technology, Inc., Taiwan

TW0017 Study of Inherently Safer Design Strategy Application for IC Process Power Supply System

Chang Kuo-chi Fujian University of Technology, Taiwan

TW0020 Enabling high TDP Xeon processors through structural optimization

Jimmy Chuang Intel, Taiwan

TW0026 Study of the High-Tech Process Mechanical Integrity and Electrical Safety


TW0028 Improve Solder Extrusion for Large Size Stand Alone Module Hsin De Li USI, Taiwan

TW0031 Study of Improvement and Verification for Fan Wall of Network Rack Server using Six Sigma


TW0051 Chip Based Wide Range Planar Optical Spectrometer Chia Jung Chang ITRI, Taiwan

TW0053 Post-Layout Channel Quality Comparison (P.CQC) Signal Integrity Simulation Methodology Introduction

Denis Chen Intel, Taiwan

▲

54

2019

Packaging Poster Interactive Presentation


Paper Code


TW0054 Digital Lithography Technology for Fan-out Panel Level Package Application

Chang Liang-Cyuan ITRI, Taiwan

TW0058 Seed Layer Undercut Control for Fine Line RDL of FOPLP Shao-An Yen ITRI, Taiwan

TW0070 Folding Performance Study of Flexible Hybrid Electronics Systems using Fan-Out Panel Level Packaging Techniques

Shau Fei Cheng ITRI, Taiwan

TW0091 Investigation of Laser Micro-machining of Silicon Compound Ceramic Substrates

Hsiang-Chen Hsu I-Shou University, Taiwan

TW0112 Transparent Piezoelectric Ultrasonic Transducer for Optical Registered Photoacoustic Imaging

Yahan Liu National Cheng Kung University, Taiwan

TW0114 Conformal Conductive Thin Film Patterns on Curvilinear Surfaces

Lai Yi-Chin National Taiwan University, Taiwan

TW0121 Theoretical and Experimental Prediction of Switching Loss of Power MOSFET

Hsiao-Chun Hsu Feng Chia University, Taiwan

TW0122 Research on the application of flexible printing circuit board with reduced thermal resistance to automotive lighting module

Yi-Chun Liu Uniflex Technology Inc., Taiwan

55 ▲

Poster Session

PCB Poster Interactive Presentation


Paper Code


AS0030 A Composite Structure of Low Dielectric Substrate for Sub 6GHz and the Application in Flexible Printed Circuit (FPC)

Wei-Chih Lee Kunshan Aplus Tec .Corporation, Taiwan

AS0065 GALVANIC EFFECT OF ENEPIG IN PRINTED CIRCUIT BOARD (RESEARCH AND ANALYSIS WITH DOE)

Inwhein Lee Changshu Mutual-tek Co.,LTD, China

AS0066 Study on DC Electroplating Filling Technogy for High-aspect Ratio Through Holes

Inwhein Lee Changshu Mutual-tek Co.,LTD, China

TW0014 2D AOI & 3D AOI Verification Analysis on SiP Module Yu-Ren Chen Universal Global Scientific Industrial co ., Ltd, Taiwan

TW0016 Soft and Flexible Antenna On FPC Substrate for LTE And 5G Mobile Telecommunication Services System

Hu Qingyue DaYeh University, Taiwan

TW0044 Using Supervised Learning To Detect Drilling Defects Po-Yu Chang CIN PHOWN TECHNOLOGY CO ., LTD, Taiwan

TW0062 RFID Applied to SMT Feeder Management Verification KS Huang Universal Scientific Industrial Co ., Ltd . , Taiwan

TW0081 Characterizing Wideband Permittivities of 5G CCL and FCCL Using Split-Cylinder Resonators

Kuen-Fwu Fuh National United University, Taiwan

TW0090 Enhancing the Data Analysis in IC Testing by Machine Learning Techniques

Yu-Chen Lee National Central University, Taiwan

TW0095 An Experimental Investigation Into Thin Silicon Die Strength Evaluation

Hsin Chih Shih ASE, Taiwan

TW0124 Materials with Low Dielectric Constant and Good Thermal Properties Prepared by Introducing Meldrum'S Acid (Ma) Into Bismaleimide Based Thermosetting Resins

Huang Chien Ho National Tsing Hua University, Taiwan

TW0127 6-DoF Force/Torque Sensor Liang-Ju Chien ITRI, Taiwan

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56

2019

2019 impact-iaac program...2019 packaging session pcb session poster session plenary session special...

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