ieee 1149.1 jtag boundary scan standard

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IEEE 1149.1 JTAGBoundary Scan Standard

Shaahin Hessabi

Department of Computer Engineering

Sharif University of Technology

Adapted, with modifications, from lecture notes prepared by the book authors

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Outline

Bed-of-nails tester Motivation for boundary scan standard System view of boundary scan hardware Elementary scan cell Test Access Port (TAP) controller Boundary scan instructions Summary

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Bed-of-Nails Tester Concept

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Bed-of-Nails Tester

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Motivation for Standard Bed-of-nails printed circuit board tester gone

We put components on both sides of PCB & replaced DIPs with flat packs to reduce inductance

Nails would hit components

Reduced spacing between PCB wires

Nails would short the wires

PCB Tester must be replaced with built-in test delivery system -- JTAG does that

Need standard System Test Port and Bus

Integrate components from different vendors

One chip has test hardware for other chips

Test bus identical for various components

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Purpose of Standard Lets test instructions and test data be serially fed

into a CUT

Allows reading out test results

Allows RUNBIST command as an instruction

Too many shifts to shift in external tests

JTAG can operate at chip, PCB, & system levels

Allows control of tri-state signals during testing

Lets other chips collect responses from CUT

Lets system interconnect be tested separately from components

Lets components be tested separately from wires

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System Test Logic

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Instruction Register Loading with JTAG

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System View of Interconnect

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Boundary Scan Chain View

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Elementary Boundary Scan Cell

2. Scan mode: Shift DR = 1First scan FF is driven by TDI, Last scan FF drives TDO

3. Capture mode: Shift DR = 04. Update mode: Mode-control = 1

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1. Normal mode: Mode-control = 0

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Serial Board / MCM Scan

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Parallel Board / MCM Scan

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Independent Path Board / MCM Scan

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Tap Controller Signals Test Access Port (TAP) includes these signals:

Test Clock Input (TCK) -- Clock for test logic

Can run at different rate from system clock

Test Mode Select (TMS) -- Switches system from functional to test mode

Test Data Input (TDI) -- Accepts serial test data and instructions -- used to shift in vectors or one of many test instructions

Test Data Output (TDO) -- Serially shifts out test results captured in boundary scan chain (or device ID or other internal registers)

Test Reset (TRST) -- Optional asynchronous TAP controller reset

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Tap Controller State Diagram

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States of TAP Controller Test-Logic-Reset: normal mode Run-Test/Idle: wait for internal test such as BIST Select-DR-Scan: initiate a data-scan sequence Capture-DR: load test data in parallel Shift-DR: load test data in series Exit1-DR: finish phase-1 shifting of data Pause-DR: temporarily hold the scan operation (e.g., allow the

bus master to reload data) Exit2-DR: finish phase-2 shifting of data Update-DR: parallel load from associated shift registersNote: Controls for IR are similar to those for DR.

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Tap Controller Timing

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TAP Controller Power-Up Reset Logic

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Boundary Scan Instructions

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Major Modes of Operation Non-invasive mode: standard provides resources guaranteed to

be independent of system logic These resources enable asynchronous communication with the outside

world (serially read in test data and instructions or serially read out test results)

Activities are invisible to the normal IC behavior

Pin-permission modes: takes control of the IC I/O pins, thus disconnecting the system logic from the outside world. Allow testing of the system interconnect separately from component

testing, and also allow testing of components separately from system interconnect testing.

The testing activities totally disrupt the normal IC behavior.

Sharif University of Technology Lecture 28: Boundary Scan

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SAMPLE / PRELOAD Instruction-- SAMPLEPurpose:1. Get snapshot of normal chip output signals2. Put data on boundary scan chain before next instruction

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SAMPLE / PRELOAD Instruction -- PRELOAD

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EXTEST Instruction Purpose: Test off-chip circuits and board-level interconnections

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Execution of EXTEST Instruction

Phase 1:Shift-DR (Chip1)

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Phase 2:

Update-DR (Chip1)Capture-DR (Chip2)

Phase 3:

Shift-DR (Chip2)

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Execution of INTEST Instruction

Phase 1: Shift-DR

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Phase 2: Update-DR

Purpose:

1. Shifts external test patterns onto component

2. External tester shifts component responses out

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Execution of INTEST Instruction (cont’d)

Phase 3: Capture-DR

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Phase 4: Shift-DR

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RUNBIST Instruction Purpose: Allows you to issue BIST command to

component through JTAG hardware

Optional instruction

Lets test logic control state of output pins

1. Can be determined by pin boundary scan cell

2. Can be forced into high impedance state

BIST result (success or failure) can be left in boundary scan cell or internal cell

Shift out through boundary scan chain

May leave chip pins in an indeterminate state (reset required before normal operation resumes)

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CLAMP Instruction

Purpose: Forces component output signals to be driven by boundary-scan register

Bypasses the boundary scan chain by using the one-bit Bypass Register

Optional instruction

May have to add RESET hardware to control on-chip logic so that it does not get damaged (by shorting 0’s and 1’s onto an internal bus, etc.)

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IDCODE Instruction

Purpose: Connects the component device identification register serially between TDI and TDO In the Shift-DR TAP controller state

Allows board-level test controller or external tester to read out component ID

Required whenever a JEDEC identification register is included in the design

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Device ID Register --JEDEC Code

27 12Part

Number(16 bits)

11 1Manufacturer

Identity(11 bits)

0‘1’

(1 bit)

31 28 Version(4 bits)

MSB LSB

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USERCODE Instruction

Purpose: Intended for user-programmable components (FPGA’s, EEPROMs, etc.) Allows external tester to determine user programming of component

Selects the device identification register as serially connected between TDI and TDO

User-programmable ID code loaded into device identification register On rising TCK edge

Required when Device ID register included on user-programmable component

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HIGHZ Instruction Purpose: Puts all component output pin signals into high-

impedance state

Control chip logic to avoid damage in this mode

May have to reset component after HIGHZ runs

Optional instruction

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BYPASS Instruction Purpose: Bypasses scan chain with 1-bit register

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Optional / Required Instructions

InstructionBYPASSCLAMPEXTESTHIGHZ

IDCODEINTEST

RUNBISTSAMPLE / PRELOAD

USERCODE

StatusMandatoryOptional

MandatoryOptionalOptionalOptionalOptional

MandatoryOptional

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Summary Boundary Scan Standard has become absolutely

essential; No longer possible to test printed circuit boards with

bed-of-nails tester

Not possible to test multi-chip modules at all without it

Supports BIST, external testing with ATE, and boundary scan chain reconfiguration as BIST pattern generator and response compacter

Now getting widespread usage

Use scanedu for practicing with JTAG concepts