flip-chip bonding : how to meet the high accuracy...

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Flip-chip bonding : how to meet the high accuracy

requirements?

Caroline AVRILLIER

Sales Engineer

Direct: +33 450 35 38 03

Mobile: +33 668 79 66 72

cavrillier@set-sas.fr

EMPC 2017 - Warsaw, POLAND

What is flip-chip ?

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Advantages

Reduce the length of interconnections

Increase the number of I/O

Reduce the size of package

Need for high accuracy

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Courtesy of Sami Vahanen – Advacam/CERN –

ESE 2010

Evolution in bumping method

EMPC 2017 - Warsaw, POLAND

Need for high accuracy

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What does it mean?

EMPC 2017 - Warsaw, POLAND

10mm

1µm1µm

Need for high accuracy

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Environment

High accuracy

Flip-chip bonder

Components

& Process

Key parameters

EMPC 2017 - Warsaw, POLAND

Need for high accuracy

Cleanliness of components

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Good alignment marks onto

the components

Shape of bumps

Choice of material

Components

Need for high accuracy

Environment

Stability of temperature

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Quartz test chips on FC300 100 N – 200°C

Need for high accuracy

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Environment

High accuracy

Flip-chip bonder

Components

& Process

Key parameters

EMPC 2017 - Warsaw, POLAND

3 steps for achieving high accuracy bonding

Alignment step

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3 steps for achieving high accuracy bonding

How to align precisely ?

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High resolution stages

XYZTheta

Alignment in live with a real

microscope

Superimposed images

High resolution optics

● Objectives

● Lighting

3 steps for achieving high accuracy bonding

Placement step

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3 steps for achieving high accuracy bonding

How to place precisely ?

Calibration method in order to make

match the bonding arm axis with the visual axis

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3 steps for achieving high accuracy bonding

Post-bond accuracy

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3 steps for achieving high accuracy bonding

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Mass ReflowAdhesives: Anisotropic Conductive

In Situ ReflowThermo-compression

Thermosonic

Adhesives: Polymer Bumps

CHIP

STAMPING PLATE

Adhesives: Isotropic Conductive

UV

Adhesives: Non-Conductive

Direct bonding

EMPC 2017 - Warsaw, POLAND

Post-bond accuracy

3 steps for achieving high accuracy bonding

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2015: 4k x 4k

pitch 10 µm

Application : Assembly of large

IR detector

Process : Room temperature

compression

Metallisation: Indium bumps

Force: 2000 N

Temperature: RT(~20°C)

Challenge

Keep accuracy under high forces

Post-bond accuracy – Key elements

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Stiff structure

Z-motion bonding arm

Control of parallelism

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Application: laser diode bonding

Process: Reflow

Metallisation: Solder

Forces: 0,6 N

Temperature: 350°C

Challenge

Keep accuracy under high

temperatures

3 steps for achieving high accuracy bonding

Limit the temperature variations

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Alignment at

room

temperature

Alignement at

350°C

EMPC 2017 - Warsaw, POLAND

Post-bond accuracy – Key elements

Application: Chip-on-flex – Probes for brain

Process: Thermosonic bonding

Metallisation: Au stud bumps/Au pads

Force: 8N

Ultrasonic power: 100W

Temperature: 280°C

Challenge

Keep accuracy under forces, temperatures and vibrations

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3 steps for achieving high accuracy bonding

Post-bond accuracy – Key elements

Handling of components

Customized design

Flatness

Choice of material

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Tool for substrate Pipette for chip

Control and record each parameters

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Post-bond accuracy – Key elements

Conclusion

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+/- 0,5 µm

EMPC 2017 - Warsaw, POLAND

A close collaboration between you and

us is the key to get good results

THANK YOU FOR YOUR

ATTENTION

-

ANY QUESTIONS ?

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Caroline AVRILLIER

Sales Engineer

Direct: +33 450 35 38 03

Mobile: +33 668 79 66 72

cavrillier@set-sas.fr