会社案内 表1 英訳 · 2015. 9. 25. · diamond core drill others tools with sintered diamond...
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TOMEI DIAMONDCorporate Guidance
TOMEI DIAMOND
While it is a jewel of irresistible brilliance, Diamond reigns over every earthly substance with the fruit of 4.6 billion year-long dynamism: excellent properties in hardness, heat conductivity, electrical insulation and corrosion resistance.Such properties present many possibilities and offer great roles that diamond can play in various sectors of the industry: a new material for the 21st century indispensable to the industry, for machining ceramic and carbide materials and for electronic device material.Ever since we succeeded in the commercial production of diamond for the first time in Japan in 1961 we have been searching possibilities for a greater future we prospect in these tiny but pretty particles of diamond.
Prospecting Future Technology in Diamonds ...
Tomei Diamond for a Global ServiceOyama Plant, our production site for the diamond products
The Oyama plant is situated in Oyama, Tochigi (Japan), a city that is located about 80 km off from Tokyo and is accessed by a 45-minutes ride in Shinkansen. The city has grown and long has been flourishing as a hub in a northern Tokyo suburb at an important position for traffic where two major national highways intersect, one running south to north (Route 4) and the other west to east (Route 50). This is a very good place for us to steadily supply our customers in Japan and worldwide our diamond, indispensable material to the support nowadays advanced technology industry. Our researches are going on night and day with up to date equipment in order to supply quality diamond of various kinds and grades that customers need.
New Crystallization
model of graphite crystal structure
model of diamond crystal structure
mesh sizes diamond
You may know that diamond and graphite both are carbon crystals, so you may have wondered why diamond is colorless and transparent with the highest hardness in all the substance, while graphite is black and soft, even to be good for making pencil leads.It is because the crystals have different structures. The model of graphite crystal structure on the right (top) shows that carbon atoms are arranged in a layer of planar hexagonal honeycomb lattice. Since the bond between adjacent carbon atoms in each lattice is very strong, so much than that between neighboring planes that the stack, when a thrust is given in the direction of the planes causes a slippage between them, resulting in a deformation or chipping.The layer boundaries also block the passage of visible light to give a black appearance.Diamond, on the other hand, has a three-dimensional structure, in which adjacent carbon atoms are firmly bonded to each other with four hands to form a tetragonal arrangement with each atom at the center of gravity. The strong bonds give extreme resistance to deformation or high hardness.The diamond crystal does not absorb visible light waves and so develops no color.The hardest substance on the earth means that you can cut or grind every other substance with it, and gives expansive possibilities of applications to the industry.To give a few familiar examples diamond is used as or in a cutter for glasses, pavement and ceramic tiles, and dentist’s drills. Diamond has been and is working to the support of your everyday life by processing various materials including stones, plastics, ceramics and nonferrous metals, as a hidden hero at various occasions from work sites through the processing of IC materials sites, although you may not notice it in the everyday life.Diamond was for the first time synthesized by human in 1955, creating a high pressure and high temperature condition within a reaction cell that is close to that deep in the ground.Synthetic diamond consumption is increasing every year with the technology development and as applications expand, and accounts for the most part of diamond consumption in the industry these days.
Diamond Abrasives Production
SteelsDiamond Powder Carbide Substrate
Cutting
Polishing
Reaction Assembly Machining
Die
Hard AlloyMaterials
CeramicsMaterials Graphite Metal
Forming
Mixing
Firing
Reaction Assembly
Firing
Punch
Conversion to Diamond
HP, HT Reaction(6GPa, 1400℃)
Chemical Treatment
Density Separation
Sieving
Sieving
ShapeSeparation
Metal Coating
Elutriation
Micron-Sized DiamondSintered Diamond Tips Coated Diamond Mesh-Sized Diamond
Diamond Synthesis ProcessDiamond Sintering Process
Diamond ParticlesSintered Diamond (Polycrystalline Diamond(PCD))
IMG IRM
IRV-3CPS
IMS-15
IMS
IRV-3
IRV-3NEP
IRV
IRV-NP
Thermal
ThermalProperties
Properties
ThermalProperties
AcousticProperties
Optical
Optical
Properties
Properties
Optical
PropertiesElectronic
Electronic
Properties
Properties
High EnergyHigh EnergyBeamBeam
ResistivityResistivity
Electronic
Properties
Chemical
Chemical
Properties
Properties
BiocompatibilityBiocompatibilitySurgical knife,Surgical knife,dentistdentist’’s tool materialss tool materials
CorrosionCorrosionResistanceResistanceEnvironment-resistantEnvironment-resistantsensors,sensors,container, pipescontainer, pipes
ChemicalChemicalResistanceResistanceChemical-resistantChemical-resistantsensors,sensors,container, pipescontainer, pipes
Chemical
Properties
Mechanical
Properties
TransparencyTransparencyOptical windowsOptical windowsLens protective filmLens protective filmLight Emitting DiodeLight Emitting DiodeLaserLaser
PhotoresistorPhotoresistorPhotoelectric sensorsPhotoelectric sensors
Color CenterColor Centervariable wavelengthvariable wavelengthsolid- state laserssolid- state lasersOptical memory elementOptical memory element
TransparencyOptical windowsLens protective filmLight Emitting DiodeLaser
Nuclear RadiationNuclear RadiationResistivityResistivity
Light ElementLight ElementConstructionConstructionX-ray permeable windowX-ray permeable windowX-ray maskX-ray mask
Nuclear RadiationResistivitySensor arrays for X-,γ-rays and Sensor arrays for X-,γ-rays and particle beamparticle beamRadiation ‒resistant elementRadiation ‒resistant elementRadiation sensorRadiation sensor
Sensor arrays for X-,γ-rays and particle beamRadiation ‒resistant elementRadiation sensor
Light ElementConstructionX-ray permeable windowX-ray mask
PiezoresistancePiezoresistanceHigh-temperature pressure sensorHigh-temperature pressure sensorUltrasound diaphragmUltrasound diaphragm
Wide Band GapWide Band GapHigh dielectric voltage diodeHigh dielectric voltage diodeHeat-resistant elementHeat-resistant element
PiezoresistanceHigh-temperature pressure sensorUltrasound diaphragm
Low DielectricityLow DielectricityLow DielectricityHigh electron mobilityHigh electron mobilitysemiconductorsemiconductorHF elementHF element
High electron mobilitysemiconductorHF element
BiocompatibilitySurgical knife,dentist’s tool materials
High RigidityHigh RigidityDiamond toolsDiamond tools
Wear ResistanceWear ResistanceProtective coating forProtective coating formagnetic storage mediummagnetic storage medium
Low Friction coefficientLow Friction coefficientParts of high-precision machineryParts of high-precision machinery
High RigidityDiamond tools
Wear ResistanceProtective coating formagnetic storage medium
Low Friction coefficientParts of high-precision machinery
CorrosionResistanceEnvironment-resistantsensors,container, pipes
ChemicalResistanceChemical-resistantsensors,container, pipes
Wide Band GapHigh dielectric voltage diodeHeat-resistant element
PhotoresistorPhotoelectric sensors
High ThermalHigh ThermalConductivityConductivityVLSI substratesVLSI substrates
Low ExpansibilityLow ExpansibilityShort wavelength radiationShort wavelength radiationoptical elementsoptical elements
Heat ResistanceHeat ResistanceVery heat resistant materialVery heat resistant materialin inert atmospherein inert atmosphere
High ThermalConductivityVLSI substrates
Low ExpansibilityShort wavelength radiationoptical elements
Heat ResistanceVery heat resistant materialin inert atmosphere
HF TransmissibilityHF Transmissibilitysurface acoustic-wavesurface acoustic-waveelement for mobileelement for mobilewireless communicatorwireless communicator
High Speed of SoundHigh Speed of SoundUltrasound generator/Ultrasound generator/transmitter elementtransmitter elementUltrasound diaphragmUltrasound diaphragm
HF Transmissibilitysurface acoustic-waveelement for mobilewireless communicator
High Speed of SoundUltrasound generator/transmitter elementUltrasound diaphragm
Color Centervariable wavelengthsolid- state lasersOptical memory element
Diamond provides various possibilities with its outstanding properties
Profile of Tomei's Diamond Abrasives for Wide-Ranging Tool ApplicationsWe are ready to serve our customers with a lot of grades of synthetic diamond by shapes, colors, coatings, etc. to meet their highest demands to satisfaction.
High EnergyBeam
Resistivity
Here are a few examples of how diamond and CBN abrasives are used:Tools using diamond and CBN
metal-bond wheel
resin-bond wheel
vitrified bond wheel
segment wheel
electroplated wheel
diamond wire saw
diamond drill bit
diamond core drill
others
Tools with sintered diamond or CBN are used in/for:
grinding of non-ferrous and ferrous metals, wood, ceramics,plastics, hard-grinding materials, and as die and otherwear-resistant part materials
Diamond and CBN Tools Production in Japan (2013)
(source: "Statistics on Diamond and CBN Tools", IDAJ)
Transition in Production of Diamond and CBN Tools in Japan
as separate particlesand held in a tool body
Nanometer diamondparticles are used in/for
Tools with sintereddiamond orCBN are used in/for:
machinery, metal workinghard alloy workingcamera and watch makingglass and ceramic industrieselectronics industy
stone, ceramics and construction materials
sapphire, silicon, SiC and quartz working
mining, engineering, construction, boring, etc.
mining, engineering; glass, fire bricks and concrete working
abrasive paste preparation, hard alloy works and die polishing
jig and other tools grinding, semiconductor polishingelectronics industry and metal working
(M.Yen)
40,0002011 2012 20132010200920082007
110,000
100,000
90,000
80,000
70,000
60,000
50,000
Diamond griding Wheels 33%
Diamond Turning &Milling 12%
Diamond Segmented Tools 9%
Diamond dressers 7%
Diamond Others 7%
Diamond Slicing Blades 6%
CBN Tools Total 26%
Diamond and CBN Abrasive Products
MD500 (Avg. Size: 500 nm)
CBN Abrasive Products
cumul. freq. (%)
Particle Size (µm)
rel. freq. (%) cumul. freq. (%)
Particle Size (µm)
rel. freq. (%)100
80
60
40
20
0
20
16
12
8
4
00.1 0 10 100 1000
100
80
60
40
20
0
25
20
15
10
5
00.001 0.01 0.1 1.0 10.0
IRM 8-16 (Avg. Size: 9.2 µm)
ISBN-RISBN
ISBN-V2ISBN-V
CBN (cubic boron nitride), second hardest substance after diamond, effectively cuts and grinds ferrous materials,which erode diamond.
Diamond Particles: Micrographs and Size Distribution
Diamond and CBN Abrasive Powder Products
Uses, such as:
Diamond Powders
CBN Powders
with micron size diamond:dicing blades
with micron size diamond:pastes
with micron size diamond:diamond wires
coated mesh size:diamond wheels
mesh size diamond:electroplated mounted wheels
mesh size CBN:cup-type wheel
IRM
IRM - Fmicron sizes
submicronsizes
mesh sizes
IMM -H
HM
TED-MⅡ
IMM-HE
IMS -10
TMS
IMS -15
IMS -20
mesh sizes above, Ti coated
IMS -H
IMS
IMG
TED
TED - II
TED -S
IRV
IRV -3
IRM -NPIRM -NP30IRM -CPSIRM -Ti2
IMM -HNP30IMM -HTi2
IMG-NPIMG-NP30
IRV-NPIRV-NP30IRV-NEP
IRV-3NPIRV-3NP30IRV-3NEP
IMS -25
MD
PMISBN -Mmicron sizes
mesh sizes
ISBN -MNPISBN -MTi2
ISBN -NP
ISBN -RNP
ISBN -VNP
ISBN
ISBN -R
ISBN -V
ISBN -V2
ISBN -E
ISBN -P
mesh sizes above, Ti coated
PCD
PCBN grades
EM・EⅡM・HM・SM・GM・98FⅡM・FM・VM・WC seriesTDC grades
cut shapes (of the above grade materials)
special products with increased/decreased abrasive/overall thickness (cone and IDD grades)
E III M・HMIDC grades
cut shapes (of the above grade materials)
350・GX90・GX80・GX60・FX50・GX40TBC grades
cut shapes (of the above grade materials)
special products with increased/decreased abrasive/overall thickness
Poly Crystalline Diamond and Poly Crystalline CBN Products
Uses, such as;
TDC -HMCNGA120408
TDC -V60MCNMX120408
TDC -CONElathe center
TDC-H specialty product(workrest)
IDC - HMTipsaw for woodworking
TDC -Gdrill
TBC -GX60TPGW110304
TBC-GX40CNGA120408-2
TBC -GX90TPGN110308
Established Quality Assurance SyetemAs Japan's longest experienced diamond abrasive manufacturer we have been performing an established secure quality assurance , so that Tomei industrial diamond products meet severe and various demands in precision of every customer .
NamePresidentEstablishmentLocation
Line of BusinessCapitalBanks
Account closing dayNumber of employeesPlant scale
::::
:::
:::
Tomei Diamond Company, Ltd.Hiroaki IshizukaApril, 1953Head Office/Akasaka-mitsuke Kitayama Building 8th floor 9-18 Akasaka 3-chome, Minato-ku Tokyo 107-0052, JapanOyama Plant/5-1 Joto 4-chome, Oyama, Tochigi 323-0807, Japan (2 km north of Japan Railway Oyama Station on Tohoku Trunk Line and Utsunomiya Line)Production, processing and sale of diamonds for industry and gem usesJPY 200,000,000Mizuho Bank , The Bank of Yokohama , The Bank of Tokyo-Mitsubishi UFJMitsubishi UFJ Trust and Banking Corporation , The Ashikaga Bank , Sumitomo Mitsui Banking Corporation , Shoko Chukin BankMarch 31st170Land 25,500 m2 / Building sites 15,400 m2
Company Profile
1961, May:
1962, March:1966, July:
1972, March:
1984, July:
1985,January:
1988, April:
2004, April:
2009,December:
2010, April:
2012, May:
The Ishizuka Research Institute (IRI, represented by Mr. Hiroshi Ishizuka)succeeded in Japan’s first synthesis of diamond. He was also the pioneer researcher in the technology of producing high purity metal of zirconium,titanium and silicon.IRI started the mass production of its synthetic diamond.IRI succeeded in the development of a large scale diamond synthesis apparatus, in order to steadily supply economical diamonds and meet the increasing demands in Japan in the period of rapidly growing economy.Tomei Diamond Company was established; IRI licensed to produce and sell industrial diamond products.Osaka Tomei Diamond was established, in order to promote the sales of diamond to western Japan.For the promotion of production and sales business a second Tomei Diamond was established and licensed to produce diamonds and sell to the first, which was to specialize its sales.Tomei Corporation of America (TCA) was established in NJ, USA., in order specially to meet the demands in entire America.Tomei Dia International was established for export business, which was separated and transferred from the first Tomei Diamond.Tomei Diamond Company, first and second, Osaka Tomei Diamond and Tomei Dia International were merged together and inherited the name“Tomei Diamond Company, Ltd”.Tomei Diamond (2009) was merged with IRI. The whole entity was then renamed Tomei Diamond Company, Ltd. (current).We got approved by Business Innovation Plan of Tokyo Metropolitan Government.
Brief History of Group Companies
2014.04
Oyama plant
4-chome, 5-1, Joto, Oyama, Tochigi
323-0807, JAPAN
Tel.(+81)285-22-5821 Fax.(+81)285-22-5827
Sales department
Akasaka-Mitsuke KITAYAMA Bldg. 8th Fl.,
3-chome, 9-18, Akasaka, Minato-ku, Tokyo
107-0052, JAPAN
Tel.(+81)3-3585-7981 Fax.(+81)3-3585-3282
tomeidiamond@nifty.com
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