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Apple 3G iPhoneQuad-band GSM/Tri-band W-CDMA with EDGE/HSDPA
Report #11000-080711-BCfwww.teardown.cominfo@teardown.com
1.512.338.3600
DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks,trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Anycost analyses presented in this material are estimates prepared by Portelligent from generally available data. While Portelligent believes that these estimatesreflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore,Portelligent extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.
© 2008 by Portelligent Inc. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, orotherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of Portelligent, Inc.
Report Contents:
• Detailed external & internal photos• Detailed step-by-step disassembly• Power measurements• Block Diagram• Circuit board & packaging metrics• Complete parts list & component count• Manufacturing cost analysis• Description of most interesting electronic
features & packaging concepts
Product Description:
Weight: 134.8 grams measured(1.8 grams more than spec)
Accompanied by media frenzy, the July 2008 releaseof the Apple 3G iPhone proved to be an event ofworldwide significance. Retaining the sleek glass-faced bar form and touchscreen interface of itspredecessor, the new iPhone builds on anestablished platform by doubling available memoryand adding functionality. Of particular interest is theaddition of W-CDMA/HSDPA capability and AssistedGPS, improvements that propel the 3G iPhone intothe "World Phone" arena. Both the 8GB and 16GBmodels were examined for this report. With theexception of memory capacity, the two areessentially identical. The now-familiar feature set,including orientation-sensitive display, 2.0MPcamera, 802.11b/g WiFi, Bluetooth, music and videoplayer, and games, is again integrated into a highlyintuitive user environment.
© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 2
Table of Contents
Page Content Page Content
3 Executive Summary 82 Earpiece/Sensor Board
4 Phone Features 83 Docking Board
5 Product Overview 84 User Interface Board
6 Product Outer Packaging 85 Main Board (IC Identification)
7 Package Contents 92 WiFi/Bluetooth Board (IC Identification)
8 Supporting Materials 93 Earpiece/Sensor Board (IC Identification)
9 AC Adapter 94 Main Board (Die Photos)
12 External Dimensions/Features 115 WiFi/Bluetooth Board (Die Photos)
13 User Interface 117 Main Board (Module Identification)
16 Backlights 118 WiFi/Bluetooth Board (Module Identification)
17 Camera Test Photos 119 Main Board (Module Photos)
28 Battery Removed 121 Main Board (Functional Areas)
29 Battery Module 123 WiFi/Bluetooth Board (Functional Areas)
30 Battery Disassembled (IC Identification) 124 Earpiece/Sensor Board (Functional Areas)
31 Estimated Battery Cost 125 Docking Board (Functional Areas)
32 Power Measurements 126 User Interface Board (Functional Areas)
43 Block Diagram 127 Substrate Data
45 Major Components 132 Main Board Cross-Section
47 Component Weights 133 Integrated Circuit Components
48 Component Arrangement 134 Subsystem IC Components
49 Teardown Photos 135 Modular Components
63 Main Antenna Detail 136 Active Discrete Components
64 GPS/WiFi/BT Antenna Detail 137 Passive Discrete Components
65 Camera Module Details 139 Connectors
66 Camera Module Disassembly (IC Identification) 140 Electronic Assembly Metrics
67 Camera Module Estimated Cost 147 Electronic Costs Breakdown
68 Display Module 148 Vendor IC Cost Distribution
69 Touchscreen/Display Module 149 Non-Electronic Cost Estimate
70 Display Module (IC Identification) 150 Final Assembly Labor Cost Estimate
71 Touchscreen Panel Detail 151 Cost Summary
72 Estimated Display Cost 152 Cost Estimation Process (Overview & Discussion)
73 Main Board 153 Metrics (Overview & Discussion)
79 WiFi/Bluetooth Board
© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 3
Executive SummaryThe July 11th, 2008 release of Apple's 3G iPhone was greeted worldwide by lines of motivated customers
and the predictable news coverage. By the end of that day, a detailed report of the 8GB 3G iPhone‟sstructure and supply chain was published (see Portelligent “Apple 3G iPhone: Quick Turn Teardown071108”) and the similarities and differences between the new and previous-generation models becameclear. The three major differentiators are the addition of W-CDMA/HSDPA cellular protocols, standaloneGPS, and up to twice the NAND Flash memory of the original design. The flat back metal/plastic shell of the2G design has also been replaced with a plastic-only rear casing which is more contoured, perhaps toimprove RF performance for the device‟s more complex array of radio functions. Another welcome change isthe elimination of the docking cradle, along with a new, highly compact AC adapter. Major similaritiesremain, including the touchscreen user interface, sleek form factor, orientation-sensitive display, and highlyintuitive operating system. For this report, three units were examined: two 8GB units and one 16GB,confirming the use of multiple vendors for the Main PCB, Battery, and Display Module.
Outside the communications platform, semiconductor content of the 3G iPhone is fairly similar to that ofits predecessor, with a central Samsung ARM Processor (Samsung #S5L8900B02) supported by a Package-on-Package (PoP) Samsung 128MB Mobile DDR SDRAM Memory (#K4X1G163PC). For the units weanalyzed, the 8GB model used Toshiba NAND Flash Memory (#TH58NVG6D1D, 8GB), while the 16GB modelcontained a two-TSSOP stacked-package Samsung MLC NAND Flash (#K9MDG08U5M, 16GB total). With theaddition of W-CDMA functionality, the RF section becomes heavily reliant on Infineon. The Digital BasebandProcessor is a two-chip affair (assumed to be the #PMB8878) which combines a legacy #PMB8877 2Gprocessor and a new device for WCDMA functionality. Similarly, the Infineon RF transceiver - assumed tobe the #PMB6952 - combines a 2G and 3G radio chip (#PMB6272/#PMB5701 - both seen previously inPortelligent teardowns) into a single package, Other Infineon silicon in the cellular radio includes the Tri-band HSDPA LNA (#BGA736L16), and Power Management Unit (#PMB6820). TriQuint makes their iPhonedebut with a trio of W-CDMA power amplifiers (#TQM676031, #TQM666032, and #TQM616035), whileSkyworks returns with the Quad-band GSM Power Amplifier (#SKY77340). Infineon is also behind theiPhone's newly added GPS capability, supplying both the A-GPS Baseband Processor (#PMB2525) and theGPS LNA (#BGA615L7). Also of note are upgraded repeat-vendor components in familiar iPhone sockets,such as the Wolfson Audio CODEC (strongly suspected as the #WM8991 based on die mark and uniquepackage) and the 3-axis Accelerometer from STMicroelectronics (#LIS331DL). The touchscreen capability isagain enabled by Broadcom, using the #BCM5974 which first appeared in the iPod Touch and a line driverfrom TI (#CD3239), shrunk in size compared to the similar device found in the 2G iPhone and iPod Touch.National Semiconductor‟s serial Mobile Panel link part remains as the LCD interface. Aptina‟s 2MP CMOSimager and an identical NXP Power Management Unit (#PCF50633?) remain. An upgraded BlueCore6Bluetooth chip and the same Marvell #88W8686 single-chip WiFi solution are co-located on a dense modulemanufactured by Murata, one of the few components found on the back of the Main PCB.
With substantial build quality and use of several new-on-the-market components, estimated hardwarecost-of-goods-sold (COGS) for the 16GB 3G iPhone is $182.89 with $4.55 in supporting materials for the16GB unit bringing total COGS to $187.43. Assuming $15 for 8GB of MLC NAND, a total COGS for the 8GBsister-product of $172.43 is implied with supporting materials. Note that all cost estimates are sensitive toour assumption for NAND flash and to a similar extent, our estimate for the Touchscreen Glass assembly($13.50). This touchscreen is now separate from the LCD panel, an approach first used in the iPod Touch.
With a $199 (8GB) or $299.00 (16GB) price from AT&T (exclusive U.S. agent at the time of thiswriting), cost-of-goods-sold represents about 87% to 63% of the retail price, with higher profits stemmingfrom the 16GB variant. It is widely speculated that the margin here – and then some - belongs to Apple,with AT&T benefiting from the sale of service plans (with an increased data plan fee) but subsidizing theiPhone cost to the consumer. Assuming brisk first-day and early follow-on sales continue withoutinterruption, Apple seems to have (another) potential winner on its hands. Of course one does not have towait for the expected competitors to launch a response - they have already begun to arrive.
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 4
Phone Features
Cellular Protocols GSM 850/900/1800/1900, WCDMA 850/1900/2100
GeneralBar Format, Internal Antennae, Touchscreen, Display Reorientation, 2.0MPixel Camera, Multiple Languages,
Vibrator Alert
Audio Built-in Speaker, Included Stereo Headset
Data Communications EDGE, HSDPA, Bluetooth 2.0, WiFi 802.11b/g
Email & Messaging Email Client, Attachments, POP and IMAP Support
Entertainment iTunes Interface, Video Player, Music Player, Games
Image Mgmt Photo Geotagging, Picture and Video Index
Internet Access Over WiFi and Cellular Data Protocols
OS & Applications Support Proprietary OS, Downloadable Applications
Personal Info Mgmt Alarm, Calculator,Calendar, Clock, Address Book, Dictionary, PC Sync (Wired)
Security Phone Lock
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 9
AC Adapter
28.01mm
25.64mm
26.20mm
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 10
AC Adapter (Internal Components)
Top, Bottom, and Isometric views show two PCBs, each populated on both sides.
Top View
Bottom View
Isometric View
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 21
Camera Test Photos (3200 Lux)
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Camera Test Photos (3200 Lux)
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Battery Removed
For details of Battery location, see Teardown Photos
Battery found inphone as shown.
Battery found in a second 3G iPhone:Multiple battery vendors were used.
Unlike the soldered-terminal battery of the original 2G iPhone, the 3G modeluses a flex pigtail mated to pressure contacts to affect battery connection.The battery assembly is held to the case floor with an adhesive-backed die-cut plastic frame.
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 31
Estimated Battery Cost
Grid = 1cm
ATL
616-0346
3.7
Lithium Polymer
1150
68.63 x 40.72 x 3.72
409.3
21.9
194.3
Cell(s) $3.40
Electronics $0.34
Non-electronics $0.10
Assembly $0.09
Test $0.04
Margin $0.40
$4.37
Pack Size (mm)
Vol. Energy Density (mWHrs/cc)
Battery Pack
Brand
Part Number
Voltage
Pack Weight (grams)
Wt. Energy Density (mWHrs/g)
Est'd
Costs
Estimated Pack Price
Type
Rating (mAHrs)
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 37
Game – “Tap Tap” (Flight Mode On)
Power Measurements(Page 6 of 11)
Test Parameters• Display Backlight Setting: ~50%• Audio Setting: ~50%, through built-in speaker• Mobile Network: off• Bluetooth: off• WLAN: off
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 30 60 90 120 150
Time (Seconds)
Pow
er
(Watt
s) 1
2
34
5
6
7
8
1. Navigation from Main Menu toGames menu.
2. Setup of options within game.
3. Game is played and includesbackground music along with sporadic vibrator signals.
4. Game is paused.
5. Play is resumed.
6. Game is paused.
7. Game is ended, followed by navigation to Main Menu.
8. Unit is idle at Main Menu.
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 40
Data Connection
Power Measurements(Page 9 of 11)
Test Parameters• Display Backlight Setting: ~50%• Audio Setting: ~50%• Mobile Network: on• Bluetooth: off• WLAN: off
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0 30 60 90 120 150 180 210
Time (Seconds)
Pow
er
(Watt
s)
1
2
3
4
5
7
68
9
1. Unit idling at Main Menu.
2. Safari is selected; application opens and reloads Google.
3. User enters search criteria, usingtouchscreen keypad.
4. User selects “Go”; search is active.
5. Search results are displayed.
6. A search result is selected; a webpage with graphics, photos, text, and embedded music player loads.
7. Page appears partially loaded; userscrolls displayed content.
8. User selects link to another page;that page loads.
9. Page appears fully loaded.
Source of power drop in the middle of the data loading is notclear. Perhaps a step-down in Power Amplifier level setting?
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 43
Estimated block diagram based on observation of this specific product implementation, manufacturer‟sdata sheets where available, and best engineering judgment. Certain details of the interface circuitryare not reflected in this block diagram. Partitioning and connectivity are speculative.
Block Diagram (1 of 2)
29 - Infineon#PMB8878 ?
Digital Baseband ProcessorDie#29.1- Infineon, GSM/EDGE Baseband ProcessorDie#29.2- Infineon, W-CDMA Baseband Processor
33 - Numonyx#PF38F3050M0Y0CE
Multichip MemoryDie#33.1- Intel, NOR Flash Memory - 16MBDie#33.2- Micron, p-SRAM Memory - 8MB
61 - CSR#BC63B239A
Single-Chip Bluetooth
48 - Infineon#PMB2525
A-GPS Baseband Processor + RF Front End
42 - Skyworks#SKY77340
Quad-band GSM/EDGE RF Power AmplifierDie#42.1- Skyworks, Power Amplifier Controller
Die#42.2- Skyworks, Power AmplifierDie#42.3- Skyworks, Power Amplifier
Cellular Antenna
55 - NEC#uPG2158
GaAs SPDT Switch
56 - Murata#Unknown
WiFi Power Amplifier
47 - TriQuint#TQM676031
Band I W-CDMA Power Amplifier w/ Duplexer
Die#47.1- TriQuint, Power AmplifierDie#47.2- TriQuint, Bias Control
Die#47.3- TriQuint, Power Detector
46 - TriQuint#TQM666032
Band II W-CDMA Power Amplifier w/ Duplexer
Die#46.1- TriQuint, Power AmplifierDie#46.2- TriQuint, Bias Control
Die#46.3- TriQuint, Power DetectorDie#46.4- Infineon, BAW FilterDie#46.5- Infineon, BAW Filter
45 - TriQuint#TQM616035
Band V&VI W-CDMA Power Amplifier w/ Duplexer
Die#45.1- TriQuint, Power AmplifierDie#45.2- TriQuint, Bias Control
Die#45.3- TriQuint, Power Detector
Shared Antenna
49 - Infineon#BGA615L7
GPS LNA
To Next Page
3 - Infineon#PMB6820
Power Management Unit
44 - Infineon#PMB6952 ?
RF TransceiverDie#44.1- Infineon, W-CDMA RF Transceiver
Die#44.2- Infineon, GSM/EDGE RF Transceiver
Murata#6475 ?
Front-End Module
WiFi/Bluetooth Board
57 - Murata#ST2
GaAs SPDT Switch
54 – Unknown#24LJ
2.4GHz LNA ?
6 - Maxim#MAX8836
DC/DC Converter ?
60 - Marvell#88W8686
Single-Chip WiFi
43 - Infineon#BGA736L16
Tri-band HSDPA LNA
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 49
Teardown Photos (1 of 14)
Opening the case requires removal of two screws locatedadjacent to the docking connector. Once removed theUpper Enclosure can be pried away from Enclosure Frame,a significant simplification versus the original iPhone.
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Teardown Photos (2 of 14)
Touch Panel Connector
LCD Connector
Earpiece/Sensor Assembly Connector
The two halves of the 3G iPhone can beseparated after disconnecting the LCDConnector, Touch Panel Connector, andEarpiece/Sensor Assembly Connector.
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 51
Teardown Photos (3 of 14)
Lower assembly shown alone. A single Main Board with two-piece shield spans much of the length of the 3GiPhone. The Power On/Off switch, Ringer On/Off switch, and Headphone Jack are to the right; the SpeakerAssembly, Microphone, and Docking Connector are to the left. The cylindrical vibrator is seen mid-lengthalong the lower edge.
SIM Slot
On/Off Button
Headphone Jack
Vibrator
Speaker Connections
Microphone
Docking Connector
Acoustic Chamber
Ringer On/Off
Main Board
Microphone Connections
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 52
Teardown Photos (4 of 14)
A total of 12 small machine screws (!) must be removed to separate Main Board from Lower Enclosure.
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 86
Main Board (Side 1 IC Identification)
6 - Maxim#MAX8836
DC/DC Converter ?
7 - Linear Technology#LT3460
Step-up DC/DC Converter
10 - NXP Semiconductor#74AUP2G126
Dual Buffer/Line Driver
12 - NXP Semiconductor#74LVC1G99
Multiple Function Gate
8 - Toko#TK68414AB1
200mA / 1.8V LDO Regulator
9 - NXP Semiconductor#74LVC2G08
Dual 2-input AND Gate
5 - STMicroelectronics#LIS331DL
3-axis Accelerometer & MEMs SensorDie#5.1- STMicro, Accelerometer Signal ProcessorDie#5.2- STMicro, MEMs Sensor - LowerDie#5.3- STMicro, MEMs Sensor - Upper
43 - Infineon#BGA736L16
Tri-band HSDPA LNA
Grid = 1cm
13 - National Semiconductor#LP3986
150mA / 3V:2.8V Dual LDO Voltage Regulator
4 - Linear Technology#LTC4088-2
Battery Charger/USB Controller
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 97
Main Board (Side 1 Die Photos)
5 - STMicro#LIS331DL
3-axis Accelerometer & MEMs SensorPkg. Size: 3.01 x 3.01 mm
Note: These die werealso present next toeach other in the#LIS302DL package(shown at right).However, now the dieare stacked in the#LIS331DL.
5.1
5.3
5.2
Grid = 1cm
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 99
Main Board (Side 1 Die Photos)
5.2 - STMicro#CSL10B
MEMs Sensor - LowerDie Size: 2.14 x 1.84 mm
5.3 - STMicro#Unknown
MEMs Sensor - UpperDie Size: 2.12 x 1.81 mm
Grid = 1cm
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 100
29 - Infineon#PMB8878 ?
Digital Baseband ProcessorPkg. Size: 13.00 x 10.00 mm
Main Board (Side 1 Die Photos)
29.1
29.2
Grid = 1cm
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 127
Main BoardArea: 42.17cm²
Substrate Data
93.67mm
53
.69
mm
Grid = 1cm
Assembly
NameManufacturer Core Material Mfg. Technology Layers
Area
(cm²)
Min.
Trace
Pitch
(mm)
Min.
Trace
Width
(mm)
ThruVia
Land Dia
(mm)
ThruVia
Hole Dia
(mm)
BlindVia
Land Dia
(mm)
BlindVia
Hole Dia
(mm)
Thickness
(mm)
Routing
Density
Estimated
Costs
Main Board Compeq FR4 BuildUp 10 42.2 0.20 0.10 0.50 0.25 0.30 0.10 0.6 60.5 3.88$
Substrates
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Integrated Circuit Components
Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.
Pkg Ref. #Pkg
QtyBrand Name Part Number Pkg Description Form Pin Count
Pitch
(mm)
Length
(mm)
Width
(mm)
Height
(mm)Die Ref # Die Qty Brand Name Part Number Description
Length
(mm)
Width
(mm)Each Total
1 1 Wolfson Microelectronics WM8991 ? Mobile Multimedia CODEC BGA (UF) 65 0.50 5.00 4.99 0.97 1.1 1 Wolfson Microelectronics WM8991 ? Mobile Multimedia CODEC 3.45 3.22 $ 0.970 $ 0.970
2 1 NXP Semiconductor PCF50633 Power Management BGA 89 0.50 6.00 5.99 0.59 2.1 1 NXP Semiconductor PCF50633 Power Management 3.45 3.36 $ 1.520 $ 1.520
3 1 Infineon PMB6820 Cellular Power Management BGA (UF) 81 0.50 5.02 5.00 0.93 3.1 1 Infineon PMB6820 Cellular Power Management 3.71 3.68 $ 1.520 $ 1.520
4 1 Linear Technology LTC4088-2 Battery Charger/USB Controller DFN 14 0.50 3.98 2.98 0.89 4.1 1 Linear Technology LTC4088-2 Battery Charger/USB Controller 1.83 1.47 $ 0.290 $ 0.290
5.1 1 STMicroelectronics V507A Accelerometer Signal Processor 2.14 1.43 $ 0.390 $ 0.390
5.2 1 STMicroelectronics CSL10B MEMs Sensor - Lower 2.14 1.84 $ 0.510 $ 0.510
5.3 1 STMicroelectronics Unknown MEMs Sensor - Upper 2.12 1.81 $ 0.360 $ 0.360
6 1 Maxim MAX8836 DC/DC Converter ? Flip Chip, Solder (UF) 16 0.50 2.08 2.07 0.63 6.1 1 Maxim MAX8836 DC/DC Converter ? 2.07 2.07 $ 0.340 $ 0.340
7 1 Linear Technology LT3460 Step-up DC/DC Converter DFN 6 0.50 1.98 1.98 0.77 7.1 1 Linear Technology LT3460 Step-up DC/DC Converter 0.84 0.77 $ 0.110 $ 0.110
8 1 Toko TK68414AB1 200mA / 1.8V LDO Regulator Flip Chip, Solder (UF) 4 0.50 0.98 0.96 0.60 8.1 1 Toko TK68414AB1 200mA / 1.8V LDO Regulator 0.97 0.96 $ 0.120 $ 0.120
9 2 NXP Semiconductor 74LVC2G08 Dual 2-input AND Gate DFN 8 0.50 1.98 1.05 0.45 9.1 1 NXP Semiconductor 74LVC2G08 Dual 2-input AND Gate 0.62 0.47 $ 0.070 $ 0.140
10 1 NXP Semiconductor 74AUP2G126 Dual Buffer/Line Driver DFN 8 0.50 1.97 1.03 0.47 10.1 1 NXP Semiconductor 74AUP2G126 Dual Buffer/Line Driver 0.55 0.47 $ 0.070 $ 0.070
12 1 NXP Semiconductor 74LVC1G99 Multiple Function Gate DFN 8 0.50 1.98 1.04 0.48 12.1 1 NXP Semiconductor 74LVC1G99 Multiple Function Gate 0.61 0.35 $ 0.060 $ 0.060
13 1 National Semiconductor LP3986 150mA / 3V:2.8V Dual LDO Voltage Regulator Flip Chip, Solder (UF) 8 0.50 1.58 1.57 0.56 13.1 1 National Semiconductor LP3986 150mA / 3V:2.8V Dual LDO Voltage Regulator 1.57 1.57 $ 0.160 $ 0.160
15 1 National Semiconductor LM34902A ? LDO Regulator ? Flip Chip, Solder (UF) 6 0.40 1.22 0.82 0.43 15.1 1 National Semiconductor LM34902A ? LDO Regulator ? 1.22 0.82 $ 0.110 $ 0.110
16 2 ON Semiconductor NUF2441FC Passive Filter w/ ESD Flip Chip, Solder (UF) 6 0.50 1.74 1.25 0.55 16.1 1 ON Semiconductor NUF2441FC Passive Filter w/ ESD 1.73 1.25 $ 0.080 $ 0.160
17 1 Ricoh R1183Z ? 150mA LDO Regulator Flip Chip, Solder 4 0.50 0.78 0.78 0.49 17.1 1 Ricoh R1183Z ? 150mA LDO Regulator 0.78 0.78 $ 0.070 $ 0.070
18 1 NXP Semiconductor 74AUP2G125 Dual Buffer/Line Driver DFN 8 0.50 1.97 1.03 0.47 18.1 1 NXP Semiconductor 74AUP2G125 Dual Buffer/Line Driver 0.55 0.47 $ 0.070 $ 0.070
19 1 Intersil ISL59121 Video Line Driver Flip Chip, Solder (UF) 9 0.50 1.46 1.46 0.39 19.1 1 Intersil ISL59121 Video Line Driver 1.46 1.46 $ 0.160 $ 0.160
21 2 NXP Semiconductor 74LVC1G08 Single 2-input AND Gate DFN (UF) 6 0.35 1.00 1.00 0.43 21.1 1 NXP Semiconductor 74LVC1G08 Single 2-input AND Gate 0.46 0.31 $ 0.050 $ 0.100
22 5 NXP Semiconductor 74LVC2G34 Dual Buffer Gate DFN (UF) 6 0.35 1.00 1.00 0.43 22.1 1 NXP Semiconductor 74LVC2G34 Dual Buffer Gate 0.55 0.45 $ 0.060 $ 0.300
25 1 NXP Semiconductor 74LVC1G79 Single D-type Flip-Flop DFN 6 0.35 1.00 1.00 0.43 25.1 1 NXP Semiconductor 74LVC1G79 Single D-type Flip-Flop 0.47 0.32 $ 0.060 $ 0.060
26 2 NXP Semiconductor 74AUP1T97 Configurable Gate w/ Voltage-Level Translator DFN 6 0.35 1.00 1.00 0.43 26.1 1 NXP Semiconductor 74AUP1T97 Configurable Gate w/ Voltage-Level Translator 0.55 0.41 $ 0.050 $ 0.100
27 1 NXP Semiconductor 74LVC1G157 Single 2-input Multiplexer DFN 6 0.35 1.00 1.00 0.43 27.1 1 NXP Semiconductor 74LVC1G157 Single 2-input Multiplexer 0.46 0.37 $ 0.060 $ 0.060
28 1 NXP Semiconductor 74LVC1G10 Single 3-input NAND Gate DFN 6 0.35 1.00 1.00 0.43 28.1 1 NXP Semiconductor 74LVC1G10 Single 3-input NAND Gate 0.38 0.34 $ 0.050 $ 0.050
29.1 1 Infineon PMB8877 GSM/EDGE Baseband Processor 6.62 6.61 $ 9.350 $ 9.350
29.2 1 Infineon PMB8802 ? W-CDMA Baseband Processor 5.29 5.07 $ 7.550 $ 7.550
30 1 Samsung S5L8900B02 ARM Application Processor BGA (UF) 416 0.50 13.00 12.98 0.50 30.1 1 Samsung S5L8900B02 ARM Application Processor 8.48 8.48 $ 12.850 $ 12.850
31 1 NXP Semiconductor 74LVC1G332 Single 3-input OR Gate DFN 6 0.35 1.00 1.00 0.43 31.1 1 NXP Semiconductor 74LVC1G332 Single 3-input OR Gate 0.38 0.34 $ 0.050 $ 0.050
32 1 TI SN74LVC2G66 Dual Bilateral Analog Switch Flip Chip, Solder (UF) 8 0.50 1.90 0.93 0.43 32.1 1 TI SN74LVC2G66 Dual Bilateral Analog Switch 1.90 0.89 $ 0.120 $ 0.120
33.1 1 Numonyx 28F128FM NOR Flash Memory - 16MB 4.03 3.99 $ 0.900 $ 0.900
33.2 1 Micron P25Z p-SRAM Memory - 8MB 4.97 4.96 $ 1.490 $ 1.490
34 1 Samsung K4X1G163PC Mobile DDR SDRAM Memory - 128MB BGA (UF) 72 0.70 13.00 12.98 0.41 34.1 1 Samsung K4X1G163PC Mobile DDR SDRAM Memory - 128MB 10.36 9.92 $ 3.350 $ 3.350
35 1 Silicon Storage Technology (SST) SST25VF080B Serial Flash Memory - 1MB DFN (UF) 8 1.30 5.99 4.99 0.79 35.1 1 Silicon Storage Technology (SST) SST25VF080B Serial Flash Memory - 1MB 2.95 2.63 $ 0.420 $ 0.420
36 1 NXP Semiconductor 74LVC1G157 Single 2-input Multiplexer DFN (UF) 6 0.35 1.00 1.00 0.43 36.1 1 NXP Semiconductor 74LVC1G157 Single 2-input Multiplexer 0.46 0.37 $ 0.060 $ 0.060
37 1 NXP Semiconductor 74LVC2G04 Dual Inverter DFN (UF) 6 0.35 1.00 1.00 0.43 37.1 1 NXP Semiconductor 74LVC2G04 Dual Inverter 0.54 0.46 $ 0.050 $ 0.050
38 3 NXP Semiconductor 74AUP1T97 Configurable Gate w/ Voltage-Level Translator DFN 6 0.35 1.00 1.00 0.43 38.1 1 NXP Semiconductor 74AUP1T97 Configurable Gate w/ Voltage-Level Translator 0.55 0.41 $ 0.050 $ 0.150
39 1 Broadcom BCM5974 Touchscreen Controller BGA (UF) 57 0.40 4.17 3.95 0.46 39.1 1 Broadcom BCM5974 Touchscreen Controller 3.25 3.16 $ 1.730 $ 1.730
40 1 TI CD3239 Touchscreen Line Driver Flip Chip, Solder (UF) 25 0.40 1.96 1.96 0.29 40.1 1 TI CD3239 Touchscreen Line Driver 1.96 1.96 $ 0.340 $ 0.340
41 1 National Semiconductor LM2512 Mobile Pixel Link Display Interface BGA (UF) 49 0.50 4.03 4.03 0.99 41.1 1 National Semiconductor LM2512 Mobile Pixel Link Display Interface 1.71 1.65 $ 0.640 $ 0.640
42.1 1 Skyworks 31050 Power Amplifier Controller 2.16 1.89 $ 0.320 $ 0.320
42.2 1 Skyworks 63627 Power Amplifier 1.18 0.98 $ 0.330 $ 0.330
42.3 1 Skyworks 63626 Power Amplifier 1.20 0.77 $ 0.290 $ 0.290
RF - Receive 43 1 Infineon BGA736L16 Tri-band HSDPA LNA QFN 16 0.50 2.30 2.30 0.46 43.1 1 Infineon BGA736L16 Tri-band HSDPA LNA 1.13 1.13 $ 0.260 $ 0.260
44.1 1 Infineon PMB5701 W-CDMA RF Transceiver 2.96 2.96 $ 1.880 $ 1.880
44.2 1 Infineon PMB6272 GSM/EDGE RF Transceiver 3.56 2.37 $ 1.500 $ 1.500
45.1 1 TriQuint W1583B Power Amplifier 1.19 1.10 $ 0.620 $ 0.620
45.2 1 TriQuint W1582A Bias Control 0.94 0.55 $ 0.260 $ 0.260
45.3 1 TriQuint W1581A Power Detector 0.67 0.66 $ 0.230 $ 0.230
46.1 1 TriQuint TQM666032 Power Amplifier 1.06 0.93 $ 0.420 $ 0.420
46.2 1 TriQuint W1563A Bias Control 0.97 0.59 $ 0.210 $ 0.210
46.3 1 TriQuint W1562A Power Detector 0.69 0.58 $ 0.170 $ 0.170
46.4 1 Infineon N0022 320350 BAW Filter 1.46 0.91 $ 0.170 $ 0.170
46.5 1 Infineon N0023 300340 BAW Filter 1.30 0.73 $ 0.170 $ 0.170
47.1 1 TriQuint W1577A Power Amplifier 1.11 0.96 $ 0.570 $ 0.570
47.2 1 TriQuint W1576A Bias Control 0.95 0.55 $ 0.270 $ 0.270
47.3 1 TriQuint W1575B Power Detector 0.69 0.59 $ 0.260 $ 0.260
48 1 Infineon PMB2525 A-GPS Baseband Processor + RF Front End Flip Chip, Solder (UF) 49 0.50 3.75 3.60 0.59 48.1 1 Infineon PMB2525 A-GPS Baseband Processor + RF Front End 3.75 3.60 $ 1.920 $ 1.920
49 1 Infineon BGA615L7 GPS LNA DFN 6 0.50 2.00 1.29 0.48 49.1 1 Infineon BGA615L7 GPS LNA 0.71 0.61 $ 0.120 $ 0.120
50 1 Linear Technology LTC3459 Synchronous Boost Converter DFN 6 0.50 2.98 2.01 0.76 50.1 1 Linear Technology LTC3459 Synchronous Boost Converter 1.44 0.83 $ 0.160 $ 0.160
51 1 NXP Semiconductor 74LVC2G04 Dual Inverter DFN 6 0.35 1.00 1.00 0.43 51.1 1 NXP Semiconductor 74LVC2G04 Dual Inverter 0.54 0.46 $ 0.050 $ 0.050
52 1 Maxim MAX4826 50mA Current-Limit Switch w/ No-Load Flag DFN 6 0.50 1.51 1.03 0.59 52.1 1 Maxim MAX4826 50mA Current-Limit Switch w/ No-Load Flag 0.75 0.73 $ 0.120 $ 0.120
Memory 53 1 Samsung K9MDG08U5M Multichip Memory - 16GB MLC NAND Flash (8GB * 2) TSOP Stacked 2 (UF) 48 0.50 19.98 12.25 1.09 53.1 8 Samsung K9GAG08U0M MLC NAND Flash Memory - 2GB 15.84 10.26 $ 3.860 $ 30.880
54 1 Unknown 24LJ 2.4GHz LNA ? Flip Chip, Solder (UF) 5 0.50 0.67 0.67 0.36 54.1 1 Unknown 24LJ 2.4GHz LNA ? 0.64 0.65 $ 0.080 $ 0.080
55 1 NEC uPG2158 GaAs SPDT Switch DFN (UF) 6 0.35 1.00 1.00 0.37 55.1 1 NEC uPG2158 GaAs SPDT Switch 0.44 0.31 $ 0.120 $ 0.120
56 1 Murata Unknown WiFi Power Amplifier COB (UF) 8 0.50 1.92 1.92 0.43 56.1 1 Murata Unknown WiFi Power Amplifier 0.74 0.73 $ 0.190 $ 0.190
57 1 Murata ST2 SPDT GaAs Switch Flip Chip, Solder (UF) 5 0.50 0.67 0.67 0.36 57.1 1 Murata ST2 SPDT GaAs Switch 0.66 0.65 $ 0.130 $ 0.130
58 1 TI SN74LVC1G02 Single 2-input Positive-NOR Gate Flip Chip, Solder (UF) 5 0.50 1.40 0.90 0.46 58.1 1 TI SN74LVC1G02 Single 2-input Positive-NOR Gate 1.38 0.88 $ 0.050 $ 0.050
59 1 TI SN74AUP1T97 Voltage-Level Translator Flip Chip, Solder (UF) 6 0.50 1.40 0.90 0.46 59.1 1 TI SN74AUP1T97 Voltage-Level Translator 1.39 0.88 $ 0.060 $ 0.060
WiFi 60 1 Marvell Semiconductor 88W8686 Single-Chip 802.11g WLAN Flip Chip, Solder (UF) 67 0.50 4.62 4.08 0.48 60.1 1 Marvell Semiconductor 88W8686 Single-Chip 802.11g WLAN 4.61 4.08 $ 3.220 $ 3.220
BlueTooth 61 1 Cambridge Silicon Radio (CSR) BC63B239A Single-Chip Bluetooth Flip Chip, Solder (UF) 51 0.40 3.46 3.19 0.56 61.1 1 Cambridge Silicon Radio (CSR) BC63B239A Single-Chip Bluetooth 3.46 3.17 $ 2.020 $ 2.020
62 1 Intersil ISL2900x Ambient Light Detector COB (UF) 6 0.65 2.06 1.97 0.75 62.1 1 Intersil ISL2900x Ambient Light Detector 1.26 0.77 $ 0.160 $ 0.160
63 1 Maxim MAX4788 100mA Current-Limit Switch DFN (UF) 6 0.50 1.55 1.00 0.56 63.1 1 Maxim MAX4788 100mA Current-Limit Switch 0.80 0.77 $ 0.120 $ 0.120
68 2084 90 $94.18
LocationFunctional Area
Estimated CostsDie InfoPackage Info
BGA Stacked 2+1 16
Totals
Main Board, Side 2
WiFi/Bluetooth Board, Side 1
LIS331DL 3-axis Accelerometer & MEMs Sensor
Earpiece/Sensor Board, Side 1
5 1 STMicroelectronics
29 1 Infineon
Main Board, Side 1
0.50 3.01 3.01 1.01
PMB8878 ? W-CDMA / GSM Digital Baseband Processor BGA Stacked 2 (UF) 389 0.50 13.00 10.00 1.20
33 1 Numonyx PF38F3050M0Y0CE Multichip Memory - 16MB NOR Flash Memory, 8MB p-SRAM Memory BGA Stacked 2 (UF) 95 0.80 10.02 8.02 1.09
42 1 Skyworks SKY77340 Quad-band GSM/EDGE RF Power Amplifier MCP - 3 Chips 16 1.00 8.00 6.00 1.05
44 1 Infineon PMB6952 ? W-CDMA / GSM RF Transceiver BGA Stacked 2 (UF) 121 0.50 1.10
45 1 TriQuint TQM616035 Band III W-CDMA Power Amplifier MCP - 3 Chips 1.00 7.03 4.01
6.00 6.00
46 1 TriQuint TQM666032
Band I W-CDMA Power Amplifier MCP - 3 Chips
1.15
Band II W-CDMA Power Amplifier MCP - 5 Chips 16 1.00
16
47 1 TriQuint TQM676031 4.01
7.03 4.01 1.15
1.15
Analog
Logic
Memory
Display
RF - Transmit
RF - Shared
16 1.00 7.03
A-GPS
Analog
RF - Shared
Analog
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 140
NOTE: Occasional inconsistencies in totals may be present due to rounding error.
Electronic Assembly Metrics
As
sem
bly
Na
me
Su
bs
tra
te A
rea
(sq
.cm
)
Meta
l L
aye
rs
Cir
cu
it A
rea
(sq
.cm
)
Ro
uti
ng
De
ns
ity
(cm
of
rou
tin
g p
er
sq
.cm
of
su
bs
tra
te)
Nu
mb
er
of
Co
mp
on
en
ts
Nu
mb
er
of
Co
nn
ecti
on
s
Co
mp
on
en
t D
en
sit
y
(Co
mp
on
en
ts/s
q.c
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Co
nn
ecti
on
De
ns
ity
(Co
nn
ecti
on
s/s
q.c
m)
Av
g.
Pin
Co
un
t
As
sem
bly
We
igh
t
(gra
ms
)
System: Docking Board 5.6 4 22.3 31.5 31 138 5.6 24.7 4.5 5.1
System: Earpiece/Sensor Board 3.0 2 5.9 19.7 23 54 7.8 18.3 2.3 0.7
System: Main Board 42.2 10 421.7 60.5 843 3801 20.0 90.1 4.5 44.05
System: User Interface Board 6.6 2 13.2 14.4 19 54 2.9 8.2 2.8 0.8
System: WiFi/Bluetooth Board 1.0 6 5.9 104.3 65 279 65.7 281.8 4.3 0.3
Battery Pack: Battery PCB 1.3 2 2.6 31.4 10 38 7.6 28.8 3.8 0.4
Camera Module: Camera Flex 1.6 2 3.3 89.5 2 54 1.2 32.9 27.0 0
Display Module: Display Flex 4.3 2 8.6 209.5 23 695 5.3 161.3 30.2 0.5
System Totals 65.58 30 483.64 1016 5113 15.5 78.0 5.0 51.85
Electronic Assembly Metrics
by Assembly ( Includes Subsystem Assemblies)
Comments about costing?Email us at feedback@teardown.com© Copyright 2008 Portelligent Inc., All Rights Reserved. Apple 3G iPhone 11000-080711-BCf – Page 151
Cost Summary
NOTE:An Additional
Cost of$4.55for the
SupportingMaterials(Page 8)
Total Cost Notes:
• Estimated final assembly cost includes labor only.
• Total cost does not include: Non-recurring, R&D, G&A, IP licensing fees/royalties, software, sales & marketing, distribution.
• Assumes fully scaled production.
16GB vs. 8GB Total Cost Notes:
• About $15 estimated cost would come out of the BOM to adjust for the elimination of 8GB of NAND Flash (as of August 2008).
• All other system elements remain constant between the two models.
• About $168 total hardware COGS(exclusive of supporting materials) is implied for the 8GB 3G iPhone version.
$136.53
$23.80
$6.08
$10.21
$4.37
$1.90
182.89$
Total CostElectronic Assemblies
Total
Display(s)
Mechanical (Non-Electronic)
Battery Pack
Final Assembly & Test
Camera(s)
Electronic Assemblies74.7%
MechanicalNon-Electronic
5.6%
Display13.0%
Final Assembly1.0%
Battery Pack2.4%
Camera3.3%
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