ap 5301 / 8301 instrumental methods of analysis

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AP 5301 / 8301

Instrumental Methods of Analysis

Course Coordinator: Prof. Paul K. Chu

Electronic mail: paul.chu@cityu.edu.hk

Tel: 34427724 Fax: 27889549

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• Encyclopedia of Materials Characterization, C. Richard Brundle, Charles A. Evans, Jr., and Shaun Wilson (Editors), Butterworth-Heinemann (1992)

• X-Ray Microanalysis in the Electron Microscopy (4th Edition), J. A. Chandler, North Holland (1987)

• Methods of Surface Analysis: Techniques and Applications, J. M. E. Walls (Editor), Cambridge University Press (1990)

• Secondary Ion Mass Spectrometry, Benninghoven, Rudenauer, and Werner, John Wiley & Sons (1987)

• Surface Analytical Techniques, J. C. Riviere, Oxford University Press (1990)

• Modern Techniques of Surface Science, D. P. Woodruff and T. A. Delchar, Cambridge University Press (1994)

• Analysis of Microelectronic Material Devices, M. Grasserbauer and H. W. Werner (Editors), John Wiley & Sons (1991)

• Scanning Electron Microscopy and X-Ray Analysis (3rd Edition), J. Goldstein, D. Newbury, D. Joy, C. Lyman, P. Echlin, E. Lifshin, L. Sawyer, and J. Michael, Kluwer (2003)

Reference Books

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COURSE OBJECTIVES

• Basic understanding of materials characterization

techniques

• Emphasis on applications

Course Objectives

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Classification of Techniques

• Microscopy and related techniques• Surface characterization techniques• Elemental / chemical depth profiling techniques• Non-destructive testing

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• Light Microscopy• Scanning Electron Microscopy (SEM) / Energy

Dispersive X-Ray Spectroscopy (EDS) / Wavelength Dispersive X-Ray Spectroscopy (WDS) / X-ray Diffraction (XRD) / X-Ray Fluorescence (XRF)

• Transmission electron microscopy (TEM) / Scanning Transmission Electron Microscopy (STEM) / Electron Diffraction (ED)

Microscopy and Related Techniques

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• Auger Electron Spectroscopy (AES)• X-ray Photoelectron Spectroscopy (XPS) or

Electron Spectroscopy for Chemical Analysis (ESCA)

• Scanning Probe Microscopy (SPM) – Scanning Tunneling Microscopy (STM), Atomic Force Microscopy (AFM), …

Surface Characterization Techniques

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• Auger depth profiling• XPS depth profiling• Secondary Ion Mass Spectrometry (SIMS)

Depth Profiling Techniques

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• Radiographic and Neutron Radiographic Tests• Electromagnetic & Magnetic Particle Tests• Sonic, Electrical, Mechanical, and Visual Tests• Photoelasticity Test• Liquid Penetrant Tests• Leak Tests• Acoustic Emission Tests

Non-Destructive Testing Techniques

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Principles of Analytical Techniques

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• Understand via modeling and simulation which parameters can improve product yield

• Systematically identify these parameters within the process

• Control and reduce / eliminate these parameters by identifying their root cause

• Process monitor these parameters to measure the success of contamination control efforts

Product Yield Enhancement

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• Particles – Optical Microscopy, SEM/EDS, AES, XPS, SPM

• Residues – SEM/EDS, AES, XPS, SIMS• Stains, discoloration, hazes – SPM, SEM, XPS,

AES, SEM/EDS• General surface contamination – XPS, AES,

SEM/EDS, SIMS

Surface Contaminant Identification

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Haze on Silicon Surface (SPM)

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TiN Grains (SPM)

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Imaging of Hard Disk (SPM)

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Residues on Integrated Circuits (SEM)

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Integrated Circuit (SEM)

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Hard Disk Defects (AES)

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Si Wafer Surface Contamination (XPS)

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Depth Profiling

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Gate Oxide Breakdown (SIMS)