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AP 5301 / 8301

Instrumental Methods of Analysis

Course Coordinator: Prof. Paul K. Chu

Electronic mail: paul.chu@cityu.edu.hk

Tel: 34427724

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• Encyclopedia of Materials Characterization, C. Richard Brundle, Charles A. Evans, Jr., and Shaun Wilson (Editors), Butterworth-Heinemann (1992)

• X-Ray Microanalysis in the Electron Microscopy (4th Edition), J. A. Chandler, North Holland (1987)

• Methods of Surface Analysis: Techniques and Applications, J. M. E. Walls (Editor), Cambridge University Press (1990)

• Secondary Ion Mass Spectrometry, Benninghoven, Rudenauer, and Werner, John Wiley & Sons (1987)

• Surface Analytical Techniques, J. C. Riviere, Oxford University Press (1990)

• Modern Techniques of Surface Science, D. P. Woodruff and T. A. Delchar, Cambridge University Press (1994)

• Analysis of Microelectronic Material Devices, M. Grasserbauer and H. W. Werner (Editors), John Wiley & Sons (1991)

• Scanning Electron Microscopy and X-Ray Analysis (3rd Edition), J. Goldstein, D. Newbury, D. Joy, C. Lyman, P. Echlin, E. Lifshin, L. Sawyer, and J. Michael, Kluwer (2003)

Reference Books

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COURSE OBJECTIVES

• Basic understanding of materials characterization

techniques

• Emphasis on applications

Course Objectives

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Classification of Characterization

Techniques

• Microscopic techniques

• Surface techniques

• Depth profiling techniques

• Spectroscopic techniques

• Electrical techniques

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• Optical Microscopy

• Scanning Electron Microscopy (SEM) / Energy-

Dispersive X-Ray Spectroscopy (EDS) /

Wavelength-Dispersive X-Ray Spectroscopy

(WDS) / X-ray Diffraction (XRD)

• Transmission Electron Microscopy (TEM) /

Scanning Transmission Electron Microscopy

(STEM) / Electron Diffraction (ED)

Microscopy and Related Techniques

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• Auger Electron Spectroscopy (AES)

• X-ray Photoelectron Spectroscopy (XPS)

• Scanning Probe Microscopy (SPM) – Scanning

Tunneling Microscopy (STM), Atomic Force

Microscopy (AFM), …

Surface Characterization Techniques

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• Auger Electron Spectroscopy (AES)

• X-Ray Photoelectron Spectroscopy XPS)

• Secondary Ion Mass Spectrometry (SIMS)

• Rutherford Backscattering Spectrometry (RBS)

• Capacitance-Voltage (CV) Measurement

Depth Profiling Techniques

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• Spectrophotometry

• Photoluminescence (PL)

• Spectroscopic ellipsometry

• Modulation spectroscopy

Optical Spectroscopic Techniques

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• Four-Point Probe

• Hall Measurement

• Capacitance-Voltage (CV) Measurement

• Thermal Probe

• Minority Carrier Lifetime Measurement

Electrical Techniques

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• Rutherford Backscattering Spectroscopy (RBS)

• Proton-Induced X-Ray Emission (PIXE)

• Channeling

Ion Beam Techniques

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• Understand via modeling and simulation which

parameters can improve product yields

• Systematically identify these parameters within

the process

• Control and eliminate these parameters by

identifying their root causes

• Monitor these parameters to assess the

effectiveness of the contamination control efforts

Product Yield Enhancement

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• Particles – Optical Microscopy, SEM/EDS, AES,

XPS, SPM

• Residues – SEM/EDS, AES, XPS, SIMS

• Stain, discoloration, haze – SPM, SEM, XPS,

AES, SEM/EDS

• General surface and near-surface contamination –

XPS, AES, SEM/EDS, SIMS, RBS, PIXE

Surface Contaminant Identification

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TiN Grains (SPM)

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Residues on Integrated Circuit (SEM)

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Integrated Circuit (SEM)

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Hard Disk Defects (AES)

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Depth Profiling

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Gate Oxide Breakdown (SIMS)