3 video ampop -tda6107q
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D T SHEET
Product specificationSupersedes data of 1999 Jun 18File under Integrated Circuits, IC02
1999 Oct 26
INTEGRATED CIRCUITS
TDA6107QTriple video output amplifier
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Philips Semiconductors Product specification
Triple video output amplifier TDA6107Q
FEATURES
Typical bandwidth of 5.5 MHz for an output signal of60 V (p-p)
High slew rate of 900 V/s
No external components required
Very simple application
Single supply voltage of 200 V
Internal reference voltage of 2.5 V
Fixed gain of 50
Black-Current Stabilization (BCS) circuit
Thermal protection.
GENERAL DESCRIPTION
The TDA6107Q includes three video output amplifiers inoneplastic DIL-bent-SIL9-pin mediumpower (DBS9MPF)package (SOT111-1), using high-voltage DMOStechnology, and is intended to drive the three cathodes ofa colour CRT directly. To obtain maximum performance,the amplifier should be used with black-current control.
ORDERING INFORMATION
BLOCK DIAGRAM
TYPE
NUMBER
PACKAGE
NAME DESCRIPTION VERSION
TDA6107Q DBS9MPF plastic DIL-bent-SIL medium power package with fin; 9 leads SOT111-1
handbook, full pagewidth
MGK278
TDA6107Q
VDD
6
1, 2, 3
4
9, 8, 7Voc(3),Voc(2),Voc(1)
5Io(m)
Rf
MIRROR 5
DIFFERENTIAL
STAGE
VIP
REFERENCE
CURRENT
SOURCE
Ri
Vi(1),
Vi(2),
Vi(3)
Ra
3
3
CASCODE 1
CASCODE 2
MIRROR 2
1
MIRROR 4
MIRROR 3
MIRROR 1
THERMAL
PROTECTION
CIRCUIT
1
Fig.1 Block diagram (one amplifier shown).
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Philips Semiconductors Product specification
Triple video output amplifier TDA6107Q
PINNING
SYMBOL PIN DESCRIPTION
Vi(1) 1 inverting input 1
Vi(2) 2 inverting input 2
Vi(3) 3 inverting input 3
GND 4 ground (fin)
Iom 5 black-current measurement output
VDD 6 supply voltage
Voc(3) 7 cathode output 3
Voc(2) 8 cathode output 2
Voc(1) 9 cathode output 1
handbook, halfpageVi(1)
Vi(2)
Vi(3)
GND
Iom
VDD
Voc(3)
Voc(2)
Voc(1)
1
2
3
4
5
6
7
8
9
TDA6107Q
MGK277
Fig.2 Pin configuration.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); voltages measured with respect to pin 4 (ground);currents as specified in Fig.1; unless otherwise specified.
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it isdesirable to take normal precautions appropriate to handling MOS devices (see Handling MOS Devices).
QUALITY SPECIFICATION
Quality specification SNW-FQ-611 part Dis applicable and can be found in the Quality reference Handbook.The handbook can be ordered using the code 9397 750 00192.
SYMBOL PARAMETER MIN. MAX. UNIT
VDD supply voltage 0 250 V
Vi input voltage at pins 1 to 3 0 12 V
Vo(m) measurement output voltage 0 6 V
Vo(c) cathode output voltage 0 VDD V
Tstg storage temperature 55 +150 C
Tj junction temperature 20 +150 C
Ves electrostatic handling
Human Body Model (HBM) 2000 V
Machine Model (MM) 300 V
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Philips Semiconductors Product specification
Triple video output amplifier TDA6107Q
THERMAL CHARACTERISTICS
Note
1. An external heatsink is necessary.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth(j-a) thermal resistance from junction to ambient 56 K/W
Rth(j-fin) thermal resistance from junction to fin note 1 11 K/W
Rth(h-a) thermal resistance from heatsink to ambient 18 K/W
Thermal protection
The internal thermal protection circuit gives a decrease of
the slew rate at high temperatures: 10% decrease at130C and 30% decrease at 145C (typical values on thespot of the thermal protection circuit).
handbook, halfpage
40
Ptot
(W)
0
8
6
2
0
4
40 80 160120Tamb(C)
MBH989
(1)
(2)
Fig.3 Power derating curves.
(1) Infinite heatsink.
(2) No heatsink.
handbook, halfpage
MGK279
5 K/W
outputs
fin
thermal protection circuit
6 K/W
Fig.4 Equivalent thermal resistance network.
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Philips Semiconductors Product specification
Triple video output amplifier TDA6107Q
CHARACTERISTICS
Operating range: Tj =20 to +150C; VDD = 180 to 210 V. Test conditions: Tamb = 25C; VDD = 200 V;
Vo(c1) = Vo(c2) = Vo(c3) = 12VDD; CL = 10 pF (CLconsists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W(measured in test circuit of Fig.8); unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Iq quiescent supply current 5.9 6.9 7.9 mA
Vref(int) internal reference voltage(input stage)
2.5 V
Ri input resistance 3.6 k
G gain of amplifier 47.5 51.0 55.0
G gain difference 2.5 0 +2.5
VO(c) nominal output voltage atpins 7, 8 and 9 (DC value)
Ii = 0A 116 129 142 V
VO(c)(offset) differential nominal outputoffset voltage betweenpins 7 and 8, 8 and 9 and9 and 7 (DC value)
Ii = 0A 0 5 V
Vo(c)(T) output voltage temperaturedrift at pins 7, 8 and 9
10 mV/K
Vo(c)(T)(offset) differential output offsetvoltage temperature driftbetween pins 7 and 8,8 and 9 and 7 and 9
0 mV/K
Io(m)(offset) offset current of measurementoutput
Io(c) = 0A;1 . 5 V < Vi < 5.5 V;3 V < Vo(m) < 6 V
50 +50 A
Io(m)/Io(c) linearity of current transfer 100A < Io(c) < 100A;1 . 5 V < Vi < 5.5 V;3 V < Vo(m) < 6 V
0.9 1.0 1.1
at CRT discharge;Io(c) =1mA;1 . 5 V < Vi < 5.5 V;3 V < Vo(m)
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Philips Semiconductors Product specification
Triple video output amplifier TDA6107Q
handbook, halfpage
0
Vo(c)
(V)
2 2.5 4 6Vi(V)
200
0
160
120129
80
40
MBH988
Fig.5 Typical DC-to-DC transfer of VI to VO(c).
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Philips Semiconductors Product specification
Triple video output amplifier TDA6107Q
150140
100
6050
151
149
tst
Ov(in %)
t
t
3.08
4.04
2.12
to(r)
tPco
Vo(c)(V)
Vi(V)
MGK280
Fig.6 Output voltage (pins 7, 8 and 9) rising edge as a function of the AC input signal.
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Philips Semiconductors Product specification
Triple video output amplifier TDA6107Q
51
49
Ov(in %)
t
t
MGK281
150140
100
6050
3.08
4.04
2.12
Vo(c)(V)
Vi(V)
tst
to(f)
tPco
Fig.7 Output voltage (pins 7, 8 and 9) falling edge as a function of the AC input signal.
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Philips Semiconductors Product specification
Triple video output amplifier TDA6107Q
External flashover protection
For sufficient flashover protection it is necessary to applyan external diode and 100resistor for each channel.See application note Application and Product descriptionof TDA6107Q/N1(report number AN96072).
To limit the diode current an external 1 kcarbonhigh-voltage resistor in series with the external diode anda 2 kV spark gap are needed (for this resistor value, theCRT has to be connected to the main PCB).
VDDmust be decoupled to GND:
1. With a capacitor >20 nF with good HF behaviour
(e.g. foil); this capacitor must be placed as close aspossible to pins 6 and 4, but definitely within 5 mm.
2. With a capacitor >3.3F on the picture tube baseprint.
Switch-off behaviour
The switch-off behaviour of the TDA6107Q is controllable.This is due to the fact that the output pins of theTDA6107Q are still under control of the input pins for lowpower supply voltages (approximately 30 V and higher).
Bandwidth
The addition of the flash resistor produces a decreasedbandwidth and increases rise and fall times.
Dissipation
Regarding dissipation, distinction must first be madebetween static dissipation (independent of frequency) anddynamic dissipation (proportional to frequency).
The static dissipation of the TDA6107Q is due to voltagesupply currents and load currents in the feedback networkand CRT.
The static dissipation Pstatequals:
Where:
VDD = supply voltageIDD = supply current
VO(c) = DC value of cathode voltage
IO(c) = DC value of cathode current.
The dynamic dissipation Pdynequals:
Where:
CL = load capacitance
Cint = internal load capacitance (4 pF)
fi = input frequency
Vo(c)(p-p) = output voltage (peak-to-peak value)
= non-blanking duty cycle.
The IC must be mounted on the picture tube base print tominimize the load capacitance CL.
Pstat VDD IDD 3 VO(c) IO(c)+=
Pdyn 3 VDD CL Cint+( ) fi Vo(c)(p-p) =
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Philips Semiconductors Product specification
Triple video output amplifier TDA6107Q
TEST AND APPLICATION INFORMATION
handbook, full pagewidth
MGK282
2 M
C1
19
1
J1
22 F
22 nF
C2
4
probe 1
R1
100 k
R2
6.8 pFC10
20 nFC7
10 FC8
3.2 pFC9
136 pFC11
VIP
REFERENCE
Vi(1) Vof
Iom
Voc(1)
VDD
Ri
Rf
Ra
2 M
C3
2
6
82
J2
22 F
22 nF
C4
probe 2
R3
100 k
R4
6.8 pFC13
3.2 pFC12
136 pFC14
Vi(2)Vof
Iom
Voc(2)
Ri
Rf
Ra
2 M
C5
TDA6107Q
37
5
3
J3
22 F
22 nF
C6
probe 3
R5
100 k
R6
4 V
6.8 pFC16
3.2 pFC15
136 pFC17
Vi(3)Vof
Iom
Vo(m)
Voc(3)
Ri
Rf
Ra
Fig.8 Test circuit.
Current sources J1, J2 and J3 are to be tuned so that Vo(c)of pins 9, 8 and 7 is set to 100 V.
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Philips Semiconductors Product specification
Triple video output amplifier TDA6107Q
INTERNAL CIRCUITRY
handbook, full pagewidth
7, 8, 9
MGK283
esd
6.8 Vesd
esd
GND VDD
esd
frominputcircuit
frominputcircuit
fromcontrolcircuit
from blackcurrentmeasurementcircuit
fromcontrolcircuit
to black currentmeasurement circuitto black current
measurement circuit
to black currentmeasurement circuit
to black currentmeasurement circuit
esd
TDA6107Q
(1)
esd
flash
to cascodestage
1, 2, 3
4 6
5
Vbias
(1) All pins have an energy protection for positive or negative overstress situations.
Fig.9 Internal pin configuration.
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Philips Semiconductors Product specification
Triple video output amplifier TDA6107Q
PACKAGE OUTLINE
UNIT A A3 b1 D1 2b2b c D(1) E(1) Z
(1)e L P P1 q1 q2q
REFERENCESOUTLINEVERSION
EUROPEANPROJECTION
ISSUE DATEIEC JEDEC EIAJ
mm18.517.8
8.78.0
A4
15.515.1
1.401.14
0.670.50
1.401.14
0.480.38
21.821.4
21.420.7
6.486.20
3.43.2
2.54
e
2.54 1.06555
5.95.7
4.44.2
3.93.4
15.114.9
Q
1.751.55
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2.752.50
SOT111-192-11-17
95-03-11
0 5 10 mm
scale
0.25
w
D
E
A
A
c
A2
3
A4
q 1
q 2
L
e2
Q
w M
b
b1b2
D1
P
q
1
Z e
1 9
P
seatin
g
plane
pin 1 index
o
o
DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads SOT111-1
Amax. max.
2
3.7
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Philips Semiconductors Product specification
Triple video output amplifier TDA6107Q
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manualsoldering. A more in-depth account of soldering ICscanbefound in our Data Handbook IC26; Integrated CircuitPackages(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting ofthrough-hole mount IC packages on a printed-circuitboard.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is260C; solder at this temperature must not be in contactwith the joints for more than 5 seconds.
Thetotal contact time of successive solderwaves must notexceed 5 seconds.
The device may be mounted up to the seating plane, butthe temperature of the plastic body must not exceed thespecified maximum storage temperature (Tstg(max)). If theprinted-circuit board has been pre-heated, forced coolingmay be necessary immediately after soldering to keep thetemperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of thepackage, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bitis less than 300C it may remain in contact for up to10 seconds. If the bit temperature is between300 and 400C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of theseproducts can reasonably be expected to result in personal injury. Philips customers using or selling these products foruse in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from suchimproper use or sale.
PACKAGESOLDERING METHOD
DIPPING WAVE
DBS, DIP, HDIP, SDIP, SIL suitable suitable(1)
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one ormore of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specificationis not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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Philips Semiconductors Product specification
Triple video output amplifier TDA6107Q
NOTES
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Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changedwithout notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any licenseunder patent- or other industrial or intellectual property rights.
Internet:http://www.semiconductors.philips.com
1999 68
Philips Semiconductors a worldwide company
For all other countries apply to:Philips Semiconductors,International Marketing & Sales Communications, Building BE-p, P.O. Box 218,5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
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Printed in The Netherlands 545004/200/04/pp16 Date of release: 1999 Oct 26 Document order number: 9397 750 06485
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