additive manufacturing for high tech systems
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Additive Manufacturing for high tech systems
Denis Loncke
4/12/2013| Veldhoven
Co-author Sjoerd Donders
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Additive Manufacturing for high tech systems
December 4, 2013
Slide 2
Public
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Key to Moore’s Law: Making smaller transistors
December 4, 2013
Slide 3
Public
The first integrated circuit on
silicon, on a wafer the size of
a fingernail (Fairchild Semiconductor, 1959)
Today: More than a
billion transistors on
the same area (Intel, 2012)
Transistor length has
shrunk by a million
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Like a photo enlarger of old,
lithography forms the image of
chip patterns on a wafer
Lithography is critical for shrinking transistors
December 4, 2013
Slide 4
Public
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Photolithography – how an ASML system works
December 4, 2013
Slide 5
Public
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How does a modern chip look like A modern chip has more than just one layer
December 4, 2013
Slide 7
Public
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The manufacturing loop
December 4, 2013
Slide 8
Public
Exposure
Developing
Etching
Ion implantation Stripping
Deposition
Photoresist coating
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Keeping up with Moore’s Law requires constant
technology upgrades: Continuous shrink December 4, 2013
Slide 9
Public
* Note: Process development 1.5 ~ 2 years in advance
Trick:
10
100
Reso
luti
on /
half
pitc
h, "S
hrin
k" [n
m]
6
2002 2004 2006 2008 2010 2012 2014 2016 2018 2020
Year of Production start *
DRAM 13.9%
200
XT:1400
XT:1700i
AT:1200
XT:1900i
NXT:1950i
20
30
40
50 60
80
NXE:3100
NXE:3300B
NXT:1960Bi
Feb-2012
2
3 4
NXT:1970Ci
Reso
luti
on
/ h
alf
pit
ch
, “S
hri
nk” [
nm
]
NAND 17% Logic 14.1%
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Keeping up with Moore’s Law requires constant
technology upgrades: Improved productivity December 4, 2013
Slide 10
Public
Year of introduction
0
40
80
120
160
200
Th
roughput
[WP
H]
1985 1990 1995 2000 2005 2010 2015
300mm
200 150
450mm?
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Drivers in semiconductor Litho industry Pushing the ASML system to the limit
December 4, 2013
Slide 11
Public
• Shrink – reduces lithography costs
• Productivity – increases efficiency of lithography systems
precision, thermal stability, dynamics
lightweight, increased design & functionality density
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Impact on system design Public
December 4, 2013
Slide 12
Actuation
Position
measurement
Position
control 𝑓𝐵𝑊
Mass (m)
T stability
Stiffness (k)
Point of
interest POI
(𝑒𝑟𝑟𝑜𝑟𝑃𝐶)
Thermal
disturbance
Td
Mechanical
disturbance
Fd
𝑓𝐵𝑊~ 𝑓𝑛 =1
2𝜋
𝑘
𝑚
𝑒𝑟𝑟𝑜𝑟𝑃𝐶
𝐹𝑑=
1
0.5. 𝑚. (2𝜋𝑓𝐵𝑊)2 s,v,a,j
𝐹𝑎𝑐𝑡 = 𝑚. 𝑎
Fd
Td
System drivers:
• Precision
• Productivity
Influenced by:
• Disturbance forces
• Dynamics
• Temperature variations
Requiring:
• Reduction of disturbances
• Light & stiff design
• Thermal control
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Contribution of AM: reduction of disturbances Freedom of design and manufacturing to eliminate flow induced disturbance
forces
Public
December 4, 2013
Slide 13
PEEK Conventional
machined part Titanium
Additive manufactured part
90% disturbance
force reduction by
flow optimization
Sharp corners
and transitions
Smooth corners
and transitions
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Public
December 4, 2013
Slide 14
Contribution of AM : improved thermal control Freedom of design and manufacturing to integrate cooling for improved
thermal control
Efficient cooling
• Cooling channels close to heat source
• Maximal contact area of coolant
Additional benefit
• Integration of parts
• Increased robustness
• Reduced lead-time and cost
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Contribution of AM : lightweight & stiff design Freedom of design and manufacturing to optimise weight and functionality Public
December 4, 2013
Slide 15
AM design Flow optimized
Conventional
design
Ti 35x21x21 6g
Ti 170x170x15
200g
Ti 52,3x18,3x13 11g
PC 223,5x116,5x40
Ti 170x170x15
100g
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Public
December 4, 2013
Slide 16
Additive Manufacturing for high tech systems
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Additive Manufacturing for high tech systems
Public
December 4, 2013
Slide 17
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Additive Manufacturing for high tech systems Roadmap alignment and CFT2.0 program
December 4, 2013
Slide 18
Public
Basic research Industrial
development
Equipment
development (B2B)
Industrial application
and supplying
TNO / ECN Additive
Industries Academia
Brainport
Industries
Kennis Kunde kassa
• Materials
• Processes
• Modelling
• Design tools
• Industrialization and
supplying to end-
customers
• Redesign
• Prototyping on
existing equipment
• Bèta equipment
• Materials
• Machines (Alfa
equipment)
• Processes
AM-SMART
STW
Polymers / Metals
/ Ceramics Addlab (AI & BI)
Shared AM facility
End
Users
(OEMs)
HT SMEs
Dem
and a
rtic
ula
tion
Source: 130703 CFT2 0 AMT oems.pptx Brainport Industries Roadmap alignment
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AM roadmap alignment for the high tech industrie Participants
December 4, 2013
Slide 19
Public
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Additive Manufacturing for high tech systems AM roadmap alignment goal and status
December 4, 2013
Slide 20
Goal:
Definition and execution of a joint research program
on additive manufacturing technology to enable the
production of future parts.
Status:
• Agreement on the consolidated AM technology
roadmap
• Definition of workgroups for the definition of
research programs
Public
OEM Topology Large
Metals Small
Metals Plastics Ceramics Hybrids
ASML x x x x x x
DAF x x x
Eesa x x
FEI x x x x
Fokker x x x x
OCE x x x x
Philips Consumer x
Philips Healthcare x x x x x
Philips Healthcare x x x x x
Philips Lighting x x x x x
Philips PiNS x x x x
Philips Research x x x x x
Sulzer x x
Thales Cryogenics x x
Research
Cranfield x x
ECN x x x
KULeuven x x x
NLR x x x
Sirris x x x
TNO x x x x x
TUD x x
VITO x x x x
Materials
BASF x
DSM/chemelot x x
Sabic x x x
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Additive Manufacturing for high tech systems ASML AM roadmaps consolidated roadmap
December 4, 2013
Slide 21
Public
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December 4, 2013
Slide 22
• Materials
Ti grade 5, 316L, Al T7075, Al T6082, Invar,
Inconel, Mo, Ta, W, T800MarM509,
Hardmetals, Cu, Au, Ag, solder
• Small parts (<5000cm3) driven by
- precision
- feature size
- freedom of design
• Large parts (>1m) driven by
- buy to fly ratio = cost
• Common drivers
- material quality consistency and surface finish
- resolution +/- 0.05 mm (large parts) to 0.02 mm (small parts)
Public
Additive Manufacturing for high tech systems Consolidated roadmap metals
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December 4, 2013
Slide 23
Public
Powder bed based (SLM)
• High level of complexity
• Low deposition rates
• Small parts
• High part costs
• Quality and flaw issues
Wire Arc based (WAAM)
• High deposition rates
• Low part costs
• Large Parts
• Hybrid products
• Low level of complexity
• Post processing
Blown powder based (3d cladding)
• Medium deposition rates
• Large parts
• Thin walls
• Hybrid products
• Medium level of complexity
Source: Vito Source: Cranfield
Additive Manufacturing for high tech systems Possibilities for metal additive manufacturing
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December 4, 2013
Slide 24
Public
Powder bed based (SLM)
• High level of complexity
• Low deposition rates
• Small parts
• High part costs
• Quality and flaw issues
Wire Arc based (WAAM)
• High deposition rates
• Low part costs
• Large Parts
• Hybrid products
• Low level of complexity
• Post processing
Blown powder based (3d cladding)
• Medium deposition rates
• Large parts
• Thin walls
• Hybrid products
• Medium level of complexity
Source: Vito Source: Cranfield
Additive Manufacturing for high tech systems Possibilities for metal additive manufacturing
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December 4, 2013
Slide 25
Public
+ =
• Reduction of machining cost for large Ti Parts reduce buy to fly ratio
• Function integration less connections reliability improvement
large Ti parts (~50 dm3)
function integration monolithic part
Additive Manufacturing for high tech systems Cost reduction and function integration in metal AM
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Additive Manufacturing for high tech systems Consolidated roadmap plastics
December 4, 2013
Slide 26
High tech plastics
- PEEK, PEI, POM, PA12, PFA, PC
- ABS, PBT, PMMA, Viton, teflon, ECTFE, PVDF
Driven by needed properties
- mechanical properties, porosity, flammability,
outgassing, ageing, thermal properties,
optical properties
Quality level comparable with SLA process
- surface, porosity, topology
Needed resolution - +/- 0.05 mm
Public
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Additive Manufacturing for high tech systems Restrictions for plastics
December 4, 2013
Slide 27
FDM:
+ thermoplastics, ># structural materials, flammability certified materials
- Design freedom, material cost
SLA:
+ thermoset plastics, design freedom, porosity
- Ageing, brittleness, color changing, flammability certified materials
SLS:
+ high tech plastics, design freedom
- porosity, surface quality, material cost, flammability certified materials
Public
New technology is needed that combines the
advantages of available processes and design freedom
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Additive Manufacturing for high tech systems Consolidated roadmap ceramics
December 4, 2013
Slide 28
Materials like
Al2O3, ZrO2, SiC, SiSiC, Si3N4, AlN, SiSiC,
Cordierite, Zerodur
Size:
Small parts from 4x4x8cm to large parts
from 1x1x0.2m
Needed resolution +/-0.05mm (large parts) to 0.01mm small parts
Processes are relative new and still under development
Public
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Additive Manufacturing for high tech systems Consolidated roadmap ceramics
December 4, 2013
Slide 29
• VAT polymerization
• Current printable size is still small but has freedom of design
• Lamination process
• limits the design freedom but suitable for larger parts
Public
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Additive Manufacturing for high tech systems Consolidated roadmap hybrids
December 4, 2013
Slide 30
• Functional hybrid materials
• Mechanical inserts
• Graded transitions
• Thermal and electrical isolation
• Tailored electrical conductivity/capacity & EMC shielding
• Integrated light guides and sensors
• Materials
• Polymer - Polymer, Polymer - Metal
• Ceramic - Ceramic, Ceramic – Metal
• Metal - Metal
• For the hybrid materials the sizes and resolution is the same as for the pure materials.
Public
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Additive Manufacturing for high tech systems Consolidated roadmap design & process tooling
December 4, 2013
Slide 31
File interchangeability
Public
Design optimization
tools (point cloud)
CAD/CAE tools
(parametric)
print tools
(stacked layer)
3D
design
file
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Additive Manufacturing for high tech systems Consolidated roadmap design & process tooling: optimization example
December 4, 2013
Slide 32
Public
1. Define problem:
2. Discretize and parameterize material distribution
3. Optimize material distribution for best performance
- Objective? Constraints? - Domain? Boundary conditions? - Loadcases?
4. Evaluate / fine-tune result (postprocessing, shape optimization)
Load
Maximize stiffness Use only 50% material
i
Source: Fred van Keulen (TUD)
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Additive Manufacturing for high tech systems 3D Topology optimization translated to a ASML part
December 4, 2013
Slide 33
Public
• Optimization methodology improves performance • Organic shapes can not be conventional machined • Can a human handle / improve these complex shapes?
Load case definition: • Volume claim • Actuator position • Load Cases • Optimization parameters
Optimized result Freeform Organic design
1 day Processing time
?
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Additive Manufacturing for high tech systems
Public
December 4, 2013
Slide 34
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Additive Manufacturing for high tech systems Shaping the future
December 4, 2013
Slide 35
> 30 parts in production is a good start but further attention is needed on
• Particle cleanliness
• Surface finish & porosity
• Consistency of materials & process
• Definition of quality verification
and geometric accuracy
• Part size
• Materials & processes
• Design tools
Public
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Thank you for your attention
Denis Loncke, Sjoerd Donders