acrich application note for mjt5050acrich.tw/_upload/goods_spec/acrich application note for...3 1.2...

www.seoulsemicon.com Copyright Seoul Semiconductor Co., Ltd.

Acrich application note

for MJT5050

Acrich development

H.S.Park

2014.04.30


Legal Disclaimer

Information in this presentation is provided in connection with Seoul Semiconductor

products and/or business operation. While Seoul Semiconductor has made every attempt

to ensure that the information contained in this presentation has been obtained from

reliable sources, Seoul Semiconductor is not responsible for any errors or omissions, or

for the results obtained from the use of this information.

All information in this presentation is provided "as is" with no guarantee of completeness,

accuracy, timeliness or of the results obtained from the use of this information, and

without warranty of any kind, express or implied, including, but not limited to warranties of

merchantability, performance, and fitness for a particular purpose, or any warranty

otherwise arising out of any proposal, specification, or sample.

In no event will Seoul Semiconductor, its related corporations, or the employees thereof

be liable to you or anyone else for any decision made or action taken in reliance on the

information in this presentation or for any consequential, special or similar damages, even

if advised of the possibility of such damages.


Acrich Application Note for

MJT SAW8LH0A(Warm), SAW0LH0A(Cool)

Introduction

Acrich2 Modular Solutions Overview

Seoul Semiconductor has introduced a family of standard modules called the Acrich2.

These modules consist of the latest generation of LEDs that use the Patented Acrich die technology and

the newly developed Acrich Integrated Circuit (Acrich IC), that provides a simple off line converter solution

with multi channel current control and doesn't require temperature sensitive passive components like

electrolytic capacitors.

Using these standard modules as reference designs, it is a simple task to create custom modules to meet

a wide variety of applications. This application note describes the operation of the Acrich IC and provides

implementation details for creating custom Acrich module configurations.

Key Application

General lighting

Architectural lighting

LED Bulbs

Decorative / Pathway lighting

1


Table of contents

1. Component

1.1 MJT5050 Description ……………………………………………………………………………………………………….. 3

1.2 Acrich IC – DT3001X ………………………………………………………………………………………………………... 4

1.3 Acrich Technical Workbook for AIC ………………………………………………………………………………………... 4

1.4 Handling Precautions ………………………………………………………………………………………........................ 5

1.5 Optical Characteristics & Mechanical File support …………………………………………………….………………... 5

1.6 PCB design guide for MJT5050 ………………………………………………………………………………………........ 6

2. Acrich Module Configuration for MJT5050

2.1 Basic Schematics – 220V 8W ………………………………………………………………………………………........... 7

2.2 Light Output Characteristics VS Package quantities – 220V 8W ………………………………………………………. 8

2.3 Basic Schematics – 220V 12W …………………………………………………………………………………………….. 9

2.4 Light Output Characteristics VS Package quantities – 220V 12W …………………………………………………….. 10

2.5 Basic Schematics – 220V 16W …………………………………………………………………………………………….. 11

2.6 Light Output Characteristics VS Package quantities – 220V 16W …………………………………………………….. 12

3. Acrich Module Samples

3.1 Bulb type module – 220V 13W …………………………………………………………………………………………….. 13

3.2 Outdoor Engine module – 220V 30W ……………………………………………………………………………………... 14

2


1. Component

Parameter Symbol Value

Unit Min. Typ. Max.

Luminous Flux Φv 136 155 - lm

Correlated Color Temperature CCT 2600 - 3700 K

CRI[4] Ra 80 - - -

Forward Voltage VF 60 63 68 V

Power Dissipation Pd - 1.26 - W

Viewing Angle 2Θ1/2 - 120 - deg.

Thermal resistance (J to S) Rθj-s - 6.0 - K/W

ESD Sensitivity(HBM) - 5k - - V

Table 2. Electro – Optical Characteristics, Ta=25ºC

IF [mA] VF [V] Power [W] Φv [lm] lm/W

10 60.3 0.60 80.2 133.7

20 (Typ.) 63.8 1.28 150.2 117.3

30 66.7 2.00 212.5 106.3

40 69.3 2.77 269.3 97.2

50 71.6 3.58 321.4 89.8

60 73.6 4.42 369.7 83.6

Table 1. Characteristics, IF=20mA, Ta=25ºC

Figure1. MJT5050 Image. Warm White part no is SAW8LH0A and Cool White part no is SAW0LH0A

Warm White Cool White

Figure2. Package mechanical dimension of MJT5050

1.1 MJT5050 Description

3


Item Acrich2.5 (2nd Generation/Acrich2+)

Power Factor > 0.97

THD < 15%

EMI Performance No Filter Required (Up to 32W)

Power Adjust 1W ~ 16W

Switching Step 120Vrms 4Setp, 20 – 65V (Per step)

(Free voltage IC) 220Vrms

Dimming AC – Triac/Phase Cut Improved but still based on Dimmer

0 to 10V Analog Dimming Optional

Over Temperature Protection Tj Min. 140 ~ Max. 150 (@θJC 135) [1]

Package Type

1~16W, Max.17W

QFN. 6mmX6mm

(External Bridge Diode) Note

[1] θJC : The package thermal impedance is calculated in accordance with JESD 51-14.

1. Component

1.2 Acrich IC – DT3001X

Main Features

High Power Factor > 0.95

Rated Power : 4W/8W/12W/16W

Low Total Harmonic Distortion <15%

Over Temperature Protection

Adjustable LED Driving Current with

External Resistors

Analog Dimming Function (ADIM)

Thermally Enhanced 12 QFN (6 x 6 mm)

1.3 Acrich Technical Workbook for AIC

For more information about the Acrich operation principle and condition, marketing team provide the document. To access this information,

go to seoul semiconductor intranet. Move the mouse pointer to the “Collaboration” tab and select “Teamsite”. On the left menu of the teamsite,

click on the “SSC-Marketing “ window. And then click the menu “Acrich” of the Lighting Product.

Figure3. Package image and main features of the Acrich AIC. DT3001X performance is good with Acrich MJT series.

Table 3. DT3001X features.

4


1. Component

1.4 Handling Precautions

During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to

pierce the sealing compound.

In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can

also become scratched.

When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that

mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than

the LED’s reflector area.

Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling

of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned

previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles

cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components.

SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the

package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.

Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed

space.

Avoid leaving fingerprints on silicone resin parts.

1.5 Optical Characteristics & Mechanical Files support

Optical characteristics and mechanical file for MJT5050 are available on the Seoul-semiconductor website at www.seoulsemicon.com

5


PKG Center line

Foot Print(solder mask)

PKG Pad

PKG Body

Copper design within PKG electrode

Figure4. Recommended PCB footprint design for the MJT5050. In order to good performance for heat dissipation from the MJT5050 electrodes to the PCB, it is best to extend the top copper layer of the PCB as much as possible.

PKG Center line

Foot Print(solder mask)

PKG Pad

PKG Body

2,61,80

,8

4,4

0,6

0,4

※ Dimensions=mm

1. Component

1.6 PCB design guide for MJT5050

6


2. Acrich module configuration for MJT5050

2.1 Basic Schematics – 220V 8W

Fuse

FUSE

V1MOV

~1

~2

-3

+4

BD1

BD

12

Z1TVS

D1MJT5050

D2MJT5050

D3MJT5050

D4MJT5050

R2 91Ω

R1 91Ω

1Vac(-)

1Vac(+)

1

2

3

4 5 6

7

8

9

10

11

12

Acrich2.5

IC

U1

Rbld1kΩ

Rset 740Ω

Condition Input Voltage : 220Vrms

8W (LED Q’ty)

Array Circuit Series Parallel

Stage1 1 1

Stage2 1 1

Stage3 1 1

Stage4 1 1

No. of LED 4 pcs

Figure5. Recommended module schematic for 220V 8W using SAW80LH0A / SAW0LH0A

Index Unit Reference value

Package Flux bin : W1 (167lm)

Flux lm 740

CCT K 3000

Ra - 82

Efficacy lm/W 91.4

Power W 8.1

PF - 0.993

Table 4. Acrich MJT constructions of basic schematic for 220V 8W. And right side table shows reference experimental measured value.

7



2.2 Light Output Characteristics VS Package quantities – 220V 8W

LED Q’ty(ea) 4 5 6 7 8 9 10 11 12 13 14 15 16

Array Circuit Series Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel

Stage1 1 1 2 2 2 2 3 3 3 3 4 4 4 4

Stage2 1 1 1 2 2 2 2 3 3 3 3 4 4 4

Stage3 1 1 1 1 2 2 2 2 3 3 3 3 4 4

Stage4 1 1 1 1 1 2 2 2 2 3 3 3 3 4

Lig

ht O

utp

ut C

ha

racte

ristics

Flu

x(l

m)

LED package quantities(ea)

0.60

0.70

0.80

0.90

1.00

1.10

1.20

1.30

4 5 6 7 8 9 10 11 12 13 14 15 16

Flux(lm) Flux(lm)

Table 5. Acrich MJT constructions of multiple schematic for 220V 8W.

Figure 6. Light output characteristics vs. LED package quantities to 220V 8W

8




Fuse

FUSE

V1MOV

~1

~2

-3

+4

BD1

BD

12

Z1TVS

D1MJT5050

D2MJT5050

D3MJT5050

D4MJT5050

R2 91Ω

R1 91Ω

1Vac(-)

1Vac(+)

1

2

3

4 5 6

7

8

9

10

11

12

Acrich2.5

IC

U1

Rbld1kΩ

Rset 1.14kΩ

D5MJT5050

D6MJT5050

D7MJT5050

D8MJT5050

Figure.7 Recommended module schematic for 220V 12W using SAW80LH0A



12W (LED Q’ty)


Stage1 1 2

Stage2 1 2

Stage3 1 2

Stage4 1 2

No. of LED 8 pcs



Flux lm 1255

CCT K 3000

Ra - 82

Efficacy lm/W 104

Power W 12

PF - 0.993

9




LED Q’ty(ea) 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Array Circuit Series Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel

Stage1 1 1 2 2 2 2 3 3 3 3 4 4 4 4 5 5 5 5

Stage2 1 1 1 2 2 2 2 3 3 3 3 4 4 4 4 5 5 5

Stage3 1 1 1 1 2 2 2 2 3 3 3 3 4 4 4 4 5 5

Stage4 1 1 1 1 1 2 2 2 2 3 3 3 3 4 4 4 4 5

0.60

0.70

0.80

0.90

1.00

1.10

1.20

1.30

4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Flux(lm)

Flux(lm)

Lig

ht O

utp

ut C

ha

racte

ristics

Flu

x(l

m)




10




Fuse

FUSE

V1MOV

~1

~2

-3

+4

BD1

BD

12

Z1TVS

D1MJT5050

D2MJT5050

D3MJT5050

D4MJT5050

R2 91Ω

R1 91Ω

1Vac(-)

1Vac(+)

1

2

3

4 5 6

7

8

9

10

11

12

Acrich2.5

IC

U1

Rbld1kΩ

Rset 1.65kΩ

D5MJT5050

D6MJT5050

D7MJT5050

D8MJT5050

D9MJT5050

D10MJT5050

D11MJT5050

D12MJT5050

Figure 9. Recommended module schematic for 220V 16W using SAW80LH0A



16W (LED Q’ty)


Stage1 1 3

Stage2 1 3

Stage3 1 3

Stage4 1 3

No. of LED 12 pcs



Flux lm 1750

CCT K 3000

Ra - 82

Efficacy lm/W 109

Power W 16.1

PF - 0.993

11




LED Q’ty(ea) 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Array Circuit Series Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel

Stage1 1 1 2 2 2 2 3 3 3 3 4 4 4 4 5 5 5 5

Stage2 1 1 1 2 2 2 2 3 3 3 3 4 4 4 4 5 5 5

Stage3 1 1 1 1 2 2 2 2 3 3 3 3 4 4 4 4 5 5

Stage4 1 1 1 1 1 2 2 2 2 3 3 3 3 4 4 4 4 5

0.60

0.70

0.80

0.90

1.00

1.10

1.20

1.30

4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Flux(lm)

Flux(lm)

Lig

ht O

utp

ut C

ha

racte

ristics

Flu

x(l

m)




12


3. Acrich module Samples

3.1 Bulb type module – 220V 13W



Flux lm 1150

CCT K 3000

Ra - 82

Efficacy lm/W 90

Power W 12.7

PF - 0.993

1

2

3

4 5 6

7

8

9

10

11

12

Acrich2.5

IC

U1

Acrich2.5 IC

RsetRES

11

-

AC PAD

11

+

AC PAD

D1LED

D5LED

D2LED

D3LED

D4LED

LED Module

Part Details Unit Q'ty

LED PKG MJT5050 EA 5.0

PCB Metal 1.0T / D=40mm / Cu=1oz / White PSR / OSP EA 1.0

Acrich2 IC DT3001B EA 1.0

Resistor Rset / R1608 / 1.3kΩ EA 1.0

Resistor Rbld / R1608 / 1.0kΩ EA 1.0

Figure 11. Sample image of Acrich 13W module using SAW8LH0A

Table 10. Reference value of 13W module. It is enough to 60W equivalent bulb for Energy star.

Table 11. Part List of 13W module.

Figure 12. Schematic of 13W sample module using DX3001X

13


3. Acrich module Samples

3.2 Outdoor Engine module – 220V 30W



Flux lm 3600

CCT K 4900

Ra - 73

Efficacy lm/W 117

Power W 31

PF - 0.995

Figure 13. Sample image of Acrich 30W module using SAW0LH0A

Table 12. Reference value of 13W module. It is enough to 60W equivalent bulb for Energy star.

LED Module

Part Details Unit Q'ty

LED PKG MJT5050 EA 16.0

PCB Metal 1.0T / D=161x67mm / Cu=1oz / White PSR / OSP EA 1.0

Acrich2 IC DT3001B EA 2.0

Resistor Rset / R1608 / 1.52kΩ EA 2.0

Resistor Rbld / R1608 / 1kΩ EA 2.0

SPC

Fuse 443 Series (250VAC 1A) EA 1.0

Varistor 8S17SM251T6 / V430CH8 EA 2.0

B.Diode MB6S EA 1.0

Resistor 6432 Size, 91옴, 5% EA 4.0

Tvs P6SMB-440A EA 2.0

Figure 14. Schematic of 30W sample module using DX3001X

Fuse

FUSE

V1MOV

~1

~2

-3

+4

BD1

BD

12

Z1TVS

D1LED

D2LED

D3LED

D4LED

D5LED

D6LED

D7LED

D8LED

R291ohm

R1

91ohm

Rs1RES

V2MOV

1Vac(-)

WAGO2060-401

1Vac(+)

WAGO2060-401

11

Tc1

AC PAD

11

Tc2

AC PAD

12

Z2TVS

D9LED

D10LED

D11LED

D12LED

D13LED

D14LED

D15LED

D16LED

Rs2RES

1

2

3

4 5 6

7

8

9

10

11

12

Acrich2.5

IC

*Acrich2.5 IC

1

2

3

4 5 6

7

8

9

10

11

12

Acrich2.5

IC

U2Acrich2.5 IC

R3

91ohmR4

91ohm

J1

RES

Table 13. Part List of 30W module.

14

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