a, krohn, bohn - 1972 - electrodeposition and surface treatment

7/27/2019 A, Krohn, Bohn - 1972 - Electrodeposition and Surface Treatment

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200 A. KROHN, C. W. BOHN

Fig. 1. Binary alloys which have been electrodeposited from aqueous solution: I indicates alloysreported up to 1960, l indicates alloys electrodeposited for the first time between 1961 and 1964,and A indicates alloys reported since 1964.bearings, electrical rotary switches and fretting corrosion-resistant coatings.Sodium molybdate can be substituted for the perrhenate to obtain a silver-molyb-denum deposit, but the silver-rhenium alloy was found to be superior to othersilver or gold alloys in wear life and lubrication propertieslO.

Considerable interest has been shown in various ruthenium alloys. Wear-resistant nickel-ruthenium and cobalt-ruthenium alloys may be deposited fromacid chloride solutionsll-13. Sulfate or sulfamate baths have been used to producebright coatings of electrodeposited alloys of ruthenium with indium14,15. Ruthe-nium also has been codeposited with palladium and platinum. Deposits of platinumwith 5-80% ruthenium are reported to have very high chemical resistancenj. Theyare almost insoluble in acids and bases during anodic polarization or in aquaregia on boiling.

Platinum alloys with copper, mercury, iron, tin, zinc, cadmium, cobalt ornickel electrodeposited from HCl solutions on titanium or titanium alloy cathodescan be used in the electrolysis of aqueous alkali metal chloride electrolytes for thepreparation of chlorine, hypochlorites or chlorates. They were found to have lowand constant chlorine overvoltage characteristics17.El ectrodepos. Surf ace Treat., 1 (1972/73)


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ELECTRODEPOSITION OF ALLOYS 201Nickel-selenium alloys are used for composite nickel coatings with improved

corrosion resitancels. By using selenic acid tagged with %e, the codeposition ofselenium from various electrolytes was studied lg. Acid electrolytes produced alloyswith chromium, nickel or zinc, and alkaline-cyanide solutions formed alloys withcopper or gold. Nitric acid solutions yield uniform coatings of a selenium- bismuthalloy20, while selenium-antimony alloys were obtained from tartrate-citrate baths21.Thin layers of cadmium-selenium deposits22 and selenium-tellurium layers werefound to have semiconductor properties23.REFERENCE SOURCES

Brenner accurately predicted that the blank spaces in his 1964 chart wouldbe filled largely by Russian scientists. Of the 65 added alloys in Fig. 1, 38 werefirst reported by Russian investigators. The United States was a poor second with9, Germany produced 5 and Great Britain 4. The remainder came from Indian orCzechoslovakian sources. Of the over 1000 abstracts dealing with alloy electro-deposition reported in Chemical Abstracts from January, 1964 to May, 1972, abouthalf were Russian in origin. Again, the U.S. was second with about 200 publica-tions or patents and the Japanese were third with 82. German, French and Indiansources had 40 to 50 articles each, and the remainder were from miscellaneoussources.

PRIOR BINARY ALLOYS

Among the binary alloys deposited prior to 1965, the greatest interest sincethat time, as indicated by the number of publications, was in iron-nickel alloys.About 120 papers and patents related to these alloys, mainly because of their usein producing magnetic coatings for various computer and recording devices.Cobalt-nickel plating ranked second with 45 listings, many dealing with electro-forming applications. Other frequently mentioned alloys and their numbers ofreports are : nickel-tin and chromium-nickel (3 I-40) ; lead-tin (26-30) ; copper-tin,copper-zinc, cobalt-tungsten and nickel-zinc (21-25); gold-copper, gold-nickel,cadmium-zinc, tin-zinc, iron-zinc and nickel-tungsten (16-20). All others werementioned 15 or less times.

Recent developments for those of present or potential practical value will bediscussed in the following sections under their fields of application.Protective and decorati ve coatings

In the field of commercial alloy plating, brass probably accounts for asmuch volume as all other alloys combined. The use of a layer of brass deposit,higher in copper content than previously used, between the copper and nickel layersgives automobile bumpers exceptional durability2*. A number of changes in plat-El ectrodepos. Surf ace Tr eat., I (1972173)


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ELECTRODEPOSITION OF ALLOYS 203protective considerations, many of the high cobalt content alloys appear to besuperior to comparable nickel coatings.

Cast and wrought nickel-chromium alloys give excellent wear resistance,corrosion resistance, electrical resistance and high hot strength. Electrodepositedalloy coatings probably have similar properties and would allow a cheap substrateto be used, thus eliminating the need for more expensive cast or wrought alloys,so numerous attempts have been made to develop a suitable commercial platingprocess. Reviews by Arrowsmithal and Chisholms2 indicate that no such processhas been perfected. However, good quality deposits were recently reported from abath containing potassium chromium sulfate, nickel formate, trisodium citrate,boric acid, sodium fluoride and glycine 64. The current efficiency of the process isnot high. A patent on a bath containing dipolar organic compounds claims thatchromium-nickel coatings can be electrodeposited over a wide range of currentdensities at adequate current efficiencies 65. Studies on the outdoor corrosion resis-tance66p67 and the behavior of Ni-Cr electrodeposits in industrial, marine andurban environments68 indicate the value of such plates when used for decorativepurposes.

A case history of the electrodeposition of heavy tin-bismuth deposits onthe inside diameter of oil well pipe couplings reviews the operation of a commercialinstallation for ten years. The tin serves as a lubricant during make up of the jointand assures a leak-proof joint throughout repeated cycles of high temperatureand pressure. It also protects the threads from corrosion in storage6g.

Electrodeposited lead-tin alloys have three major applications, namely theprotection of steel from corrosion, running surfaces for sleeve bearings (both inthe range of 610% tin) and solderable coatings (50-70% tin)O. Fluoroboratebaths usually are employed with peptone or animal glue73 as addition agents.Still in a preliminary stage is a method for producing bright tin-lead solder platingfor printed circuit boards74. Low cost, corrosion-resistant, very bright and easilysoldered tin-lead coatings may be deposited in both rack- and barrel-platingdirectly on steel, copper, brass or other copper alloys75. Copper wire may besimilarly coated76.

The jewelry industry uses alloys of rhodium and palladium77 and patentshave been obtained for the electrochemical production of bright, high carat alloysof gold with cobalt7s, nickel 7g--81and silvers2. Bright white cadmium-silver-nickelalloys electroplated on surfaces of jewelry, instruments, automobile trim, etc.provide adherent coatings resembling those of rhodiums3. They are reported toresist ordinary wear, abrasion, scuffing and tarnishing even in sodium sulfide at50 C for 30 minutes.Magnetic alloys

The electrodeposition of nickel-iron alloys has received considerable atten-tion during the past decade from the computer industry. Particular emphasis hasElectrodepos. Surface Treat., I (1972173)


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ELECTRODEPOSITION OF ALLOYS 205obtained which could be considered for industrial applications12*. The cobalt-rhenium alloys exhibit a significant increase in microhardness after heat treatmentat 315C. The nickel-rhenium system was found to be less satisfactory. However,heat-treated nickel-tungsten alloy plates showed abrasion resistance nearly thesame as that of hard chromium platinglz6.Electrolytic tin-manganese126 and lead-manganese alloys12 possess goodantifriction properties and are resistant to corrosion by sulfuric acid or sea water.The abrasion resistance of chromium-molybdenum alloys is reported to be 2-3times that of hard chrome plating128, while metal surfaces with good slidingcharacteristics are obtained by electrodepositing a gold-copper, indium-copper orcadmium-copper alloy on steel or aluminium and then heat treating to obtainphase segregation in the electrodeposited layer12g.DISPERSION STRENGTHENED AND COMPOSITE ELECTROCHEMICAL MATERIAL-S

With the burgeoning interest in electroforming and printed circuitry, dis-persion strengthened alloys for these applications have been formed by codeposi-tion of metals with fine particulate matter such as alumina, titania, silica, zirconia,barium sulfate, silicon carbide, titanium carbide, kaolin, glass powder or graph-itel30-134

Patents have been obtained for the electrodeposition of composite coatingsof metals from an electrolyte containing dispersed particles of dry lubricantmaterials such as MoS, or WS, encapsulated in metal coatings about 0.0001 inchthick136, and for incorporating particles of zirconium diboride in a chromium orchromium alloy matrix136. Gold-copper composite surfaces are used for platedwire memory substrates13, and a composite electromagnetic shielding materialdescribed for making printed circuits138.TERNARY ALLOYS

The electrodeposition of ternary alloys has been reviewed by Rama Charand coworkers13g.140. Emphasis of new work is on the improvement of magneticproperties of nickel-iron and nickel-cobalt alloys by codeposition with a thirdelement such as iron141* 42,molybdenum 143*** or phosphorus145. Other areas ofcurrent interest involve precious metal plating, such as alloys of goldcopper-cad-mium14s, gold-silver-copper147* l**, gold-silver-indium14g~ 150and gold-silver-anti-mony151. Recent publications include reviews and experimental studies on thedeposition of nickel-chromium-iron alloys from aqueous electrolytes162*153.Theelectrolytic production of these stainless-steel type alloys would offer the possibilityof economic advantages where a thin alloy coating could be deposited on a cheapsubstrate. The most promising bath for future commercial development involvesadditions of EDTA and its sodium salt to chloride baths.Electrodepos. Surf ace Treat., 1 (1972173)


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FUSED SALT ELECTROLYTES

In addition to the plating of alloys from aqueous solutions, some 35 recentreferences indicated the use of fused salt electrolytes and one involved the combinedelectrodeposition of gallium and cadmium from a glycerol electrolyte1j4. One ofthe most promising is a highly corrosion-resistant aluminium-manganese alloyplated on a base metal from a chloride melt at the comparatively low temperatureof 175P5. The process produces a very attractive alternative to cadmium platingin terms of corrosion resistance, cost and absence of pollution due to cyanidewastes. Chloride melts also have been used to produce an iron-aluminium alloy15j,a lead-bismuth alloy15 and alloys of refractory metals such as titanium158-1G0 andtantalum161. Most refractory metals and their alloys can be deposited in a coherentand compact form from molten alkali fluoride mixtureP.

Less conventional procedures produced a molybdenum based alloy by carry-ing out the plating process in molten sodium containing powdered Mo-Zr (1: 1)in an argon atmosphere163. Melts of SiO, and A&O, dissolved in cryolite depositedsilicon and aluminium simultaneously at high current densitieP4. Large singlecrystals of tungsten oxide bronzes can be formed in Na,WO,/WO, meltP5.Molten electrolytes also yielded alloys of samarium166 and yttrium16.CONCLUSION

Activity in alloy deposition has shown a continuing expansion in recentyears. Most of the new alloys reported apparently do not have any commercialapplication as yet, but some, such as silver-rhenium, are now in commercialproduction. Alloy plating for protective and decorative purposes continues to beprominent. The principal newer areas of interest for practical usage are magneticalloys for various computer applications nj8p jg, for electroforming diverse articlesfrom intricate electronics hardware to large parts for use in the aircraft and aero-space industries170-172 and for electroplating on plastics173. It is apparent that alloyplating will continue to fill a need of technology for special items which cannot beproduced in any other way.REFERENCES

1 A. Brenner, Electrodepositi on of Al loys, Pri nciples and Practice, Academic Press, New York,1963.2 A. Brenner, Plati ng, 52 (1965) 1249.3 N. P. Fedotev, P. M. Vyacheslavov and N. A. Grekova, Zh. Prikl . Khim., 44 (1971) 515;

Chem. Abstr., 75 (1971) 14001 m.4 A. Krohn and C. W. Bohn, Plating, 58 (1971) 237.5 N. Hall, Metal Finishing, 69 (1) (1971) 46.6 N. Hall, Metal Fi nishing, 70 (2) (1972) 34.7 E. W. Turns and R. D. Krienke, Plating, 52 (1965) 1149.

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ELECTRODEPOSITION OF ALLOYS 207

8 E. W. Turns, J. W. Head, H. C. Hoffman and A. C. Porter, U.S. Pat. 3,342,708, 1967.9 E. W. Turns, Plating, 58 (1971) 127.10 H. R. Thornton and Z. R. Wolanski, Lubri cation Eng., 23 (7) (1967) 271.11 L. I. Kadaner and R. B. Avakyan, USSR Pat. 264,096, 1970; Chem. Abstr., 73 (1970)10184j.12 R. B. Avakyan and L. I. Kadaner, Paluchenie Tverd. I znosostoiki kh Galvanichnykh Pokrytii ,1970, p. 86; Chem. Abstr., 76 (1972) 30022~.13 L. I. Kadaner and R. B. Avakyan, USSR Pat. 246,249,1969; Chem. Abstr., 71(1969) 119033u.14 R. Henzi and A. R. Mayer, Ger. Pat. Appl. 2,014,122, 1970.15 R. Henzi, S. Losi and A. Meyer, Ger. Pat. Appl. 2,114,119, 1971.16 0. A. Petrii and V. E. Kazarinov, Elektrokhim., 1 (1965) 1389; Chem. Abstr., 64 (1966) 7673a.17 D. Lee and A. Scrutton, & it. Put. 1,244,850, 1971.18 A. H. DuRose and W. J. Pierce, U.S. Pat. 3,355,263, 1967.19 E. Raub and S. Pahlke, Metalloberfiiiche, 23, (1969) 37.20 I. V. Yanitskii, E. Pacauskas and S. Riselis, USSR Pat. 314,818, 1971; Chem. Abstr., 76(1972) 9843d.21 1. Janickis, E. Pacauskas and I. Lasaviciene, USSR Pat. 310,950, 1971; Chem. Abstr., 75(1971) 147165q.22 E. Pacauskas, J. Janickis and A. Saudargaite, Li etuvos TSR Mokslu Akad. Darbai, Ser. B(4)

(1969) 75; Chem. Abstr., 72 (1970) 85584~.23 E. Pacauskas, J. Janickis and D. Mickevicius, Li etuvos TSR Mokslu Akad. Darbai, (3)(1970) 107; Chem. Abstr., 74 (1971) 70812t.24 W. A. Donakowski and W. S. Springer, Plating, 58 (1971) 1094.25 K. Aotani, I. Kaneko, S. Takahashi and M. Oiwa, Kinzoku Hyomen Gijutsu, 22 (1971) 496;

Chem. Abstr., 76 (1972) 67318x.26 M. Kurachi and T. Suzuki, Denki Kagaku, 38 (1970) 519; Chem. Abstr., 74 (1971) 60099b.27 T. Chocianowicz-Biestkowa, Prace I nst. Mech. Precyzyjnej, 18 (4-B) (1970) 10; Chem. Abstr.,

75 (1971) 706202.28 D. R. France, U.S. Pat. 3607,683, 1971.29 V. S. Galinker, P. V. Savenko, M. V. Matsola and 0. K. Kudra, USSR Pat. 282,879, 1970;

Chem. Abstr., 74 (1971) 82556a.30 V. V. Orekhova, F. K. Andryushchenko and L. P. Komar, USSR Pat. 305,207, 1971;

Chem. Abstr., 75 (1971) 104539x.31 V. S. Galinker, M. V. Matsola, P. V. Savenko and 0. K. Kudra, Zashchit. Metal., 7 (1971)210; Chem. Abstr., 75 (1971) 29217k.32 A. I. Vitkin, 0. A. Petrova, M. N. Nikolskaya, V. I. Abrosimova, M. Kotova and A. A.Gerasimenko, USSR Pat. 312,893, 1971; Chem. Abstr., 75 (1971) 157672s.33 L. I. Logunova, I. N. Andreev and N. V. Gudin, Sb. Aspir . Rub., Kazan. Kh im.-Tekhnol. Inst.,Khim. Nauki 1970, p. 147; Chem. Abstr., 76 (1972) 80073h.

34 L. I. Logunova, N. V. Gudin and M. S. Shapnik, Zntensif ik . El ektrol it. Protsessov NaneseniyaMetallopokrytiyami, 1970, p. 118; Chem. Abstr., 75 (1971) 136480n.35 J. A. Lisowski and F. B. Lisowski, U.S. Pat. 3,620,937, 1971.

36 K. Naganathan, P. L. Annamalai and R. Srinivasan, Trans. Sot. Advan. Electrochem. Sci.Technol., 5 (1970) 31.

37 E. Z. Napukh, E. A. Nechaev, N. T. Kudryavtsev and K. M. Tyutina, I ssled.Elektroosazh-deniyu Rastvoreniyu Metal. 1971, p. 194; Chem. Abstr ., 76 (1972) 30029c.

38 E. Z. Napukh, N. T. Kudryavtsev, K. M. Tyutina and L. V. Krylova, Elektrokhim. ProtsessyElektroosazhdenii Anodnom Rastvorenii Metal. 1969, p. 146; Chem. Abstr., 73 (1970) 83086~.39 J. Bubelis, G. Svilpiene, A. Bernotas and J. Matulis, USSR Pat. 305,206,1971; Chem. Abstr.,75 (1971) 104553x.

40 L. A. Efremova, M. N. Nikolskaya and A. I. Vitkin, Elektroh t. Osazhdenie Splavov, 2 (1968)33; Chem. Abstr., 74 (1971) 18716a.41 S. A. Gintsberg and A. F. Ivanov, Elektrol it. Osazhdenie Splavov, 2 (1968) 27; Chem. Abstr.,74 (1971) 18719d.

42 K. Aotani, K. Nishimoto and I. Sakate, Kinzoku Hyomen Gijutsu, 22 (1971) 422; Chem.Abstr., 75 (1971) 147054~.Electrodepos. Surf ace Treat., I (1972173)


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43 I. P. Dezidereva and E. A. Gubaidullina, Ref. Zh., Khim. 1964, Abstr. No. 20 L 171; Chem.Abstr., 62 (1965) 10069a.44 L. Domnikov, Metal Finishing, 63 (10) (1965) 98.4.5 V. S. Galinker and A. I. Saprykin, Ukr. Khim. Zh., 34 (1968) 1305; Chem . Abstr., 70 (1969)102418e.

46 V. S. Galinker and A. I. Saprykin, Zh. Prikl . Khim., 37 (1964) 342; Chem. Abstr., 61 (1964)298b.47 N. R. Kokorev and B. A. Popov, USSR Pat. 185,659, 1966; Chem. Absfr., 66 (1967)43235k.48 A. V. Ryabchenkov and N. R. Kokorev, Zashchit. M etal., 5 (1969) 90; Chem. Abstr., 70(1969) 83528x.49 K. S. Indira and H. V. K. Udupa, Metal F ini shing, 68 (4) (1970) 44 and 68 (5) (1970) 41.50 K. Takada and T. K. Kabushikikaisha, Brit. Pat. 918,904, 1963.51 S. Komura, Wir e Prod., 43 (3) (1968) 68.52 N. T. Kudryavtsev, K. M. Tyutina and S. M. Firger, Zh. Prikl . Khim., 35 (1962) 1035; Chem.

Abstr., 57 (1962) 9573e.53 N. V. Korovin, Electroplating Metal F ini shing, 17 (5) (1964) 151.54 L. Domnikov, Metal Fi nishing, 63 (3) (1965) 63.55 N. T. Kudryavtsev, Elektrolit. Osazhdenie Splavov, Mosk. Dom Nauchn.-Tekhn. Propagandy

1961, p. 110; Chem. Abstr., 57 (1962) 1968h.56 W. S. Lee and B. S. An, Chosun Kwahakwon Tongbo, 1967 (5), p. 32; Chem. Abstr., 69(1968) 56463~.57 E. J. Roehl, U.S. Pat. 3,420,754, 1969.58 N. A. Marchenko and Zh. V. Batyuk, Zh. Prikl . Khim., 37 (1964) 595; Chem. Abstr., 61(1964) 2716 g.59 M. B. Hammond and G. B. Bowman, U.S. Pat. 3,064,337, 1962.60 R. J. Clauss, R. W. Klein, R. A. Tremmel and N. C. Adamowicz, Plating, 58 (1971) 679;J. Glayman, Galvano, 36 (1970) 487.61 D. J. Arrowsmith, Rept. Pr ogr. Appl . Chem., 51 (1966) 62 and 53 (1968) 68.62 C. U. Chisholm, Plating, 55 (1968) 735 and 59 (1972) 417.63 C. U. Chisholm, Trans. I nst. Metal. Fi nishing, 46 (1968) 147.64 B. A. Shenoi and S. Gowri, Metal F ini shing, 70 (5) (1972) 96.65 N. R. Bharucha and J. J. B. Ward, Br it. Pat. 1,213,556, 1970.66 H. Brown, Proc. Conf Natl. Assoc. Cor rosion Eng. 26th, 1970, p. 86.67 C. J. A. Schilders, Ti jdschr. Oppervl akte Tech. Metal., 14 (5) (1970) 144; Chem. Abstr., 74(1971) 48907f.68 L. A. Rubio Felipe, Rev. Met. (Madrid), 6 (1970) 532; Chem. Abstr., 74 (1971) 115098h.69 J. C. Jongkind and F. B. Cargo, Plating, 57 (1970) 901.70 J. B. Mohler, Metal F ini shing, 69 (12) (1971) 45.71 N. J. Spiliotis, Ger. Pat. Appl. 1,958,220, 1970.72 M. Paunovic and R. Oechslin, Plating, 58 (1971) 599.73 E. Ivanova and V. Mateev, Elektroprom. Pri borostr., 6 (9) (1971) 344; Chem. Abstr., 76

(1972) 120701~.74 G. B. Rynne, Plating, 58 (1971) 867.75 R. Fath and F. Hasko, Koroze Ochrann Mater., 15 (5) (1971) 91; Chem. Abstr., 76 (1972)107206t.76 R. Fath, F. Hasko, A. DeBokay and A. Lafaye, Ger. Pat. Appl . 2,135,071, 1972.77 A. Pianelli, Galvano, 40 (1971) 599; Chem. Abstr., 75 (1971) 93747k.78 N. A. Smagunova and A. K. Yudina, USSR Pat. 287,483, 1970; Chem. Abstr., 75 (1971)29384n.79 D. G. Foulke, Ger. Pat. 1,621,162, 1971.80 S. Yamamoto and Y. Onota, Japan. Pat. 7,109,921, 1971; Chem. Abstr., 76 (1972) 30198g.81 K. Yamamura, Japan. Pat. 7,031,366, 1970; Chem. Abstr., 75 (1971) 14316t.a2 F. I. Nobel and B. D. Ostrow, U.S. Pat. 3,642,589, 1972.83 G. T. Viglione, U.S. Pat. 3,547,626, 1970.84 E. M. Levy, Plating, 56 (1969) 903.

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ELECTRODEPOSITION OF ALLOYS 20985 H. V. Venkatasetty, J. Electrochem. Sot., 117 (1970) 403.86 E. Toledo and P. Sernienko, U.S. Put. 3,616,290, 1971.87 W. G. Hespenheide, U.S. Put. 3,592,746, 1971.88 S. Schweizerhof, U.S. Pat. 3,642,602, 1972.89 S. Sakai and T. Hoshi, Japan. Pat. 70,22,001, 1970; Chem. Abstr., 74 (1971) 49085~.90 H. B. Shukovsky and T. E. Torok, U.S. Pat. 3,639,217, 1972.91 Telefunken Patentverwertungsgesellschaft m.b.H., Brit. Pat. 1,248,220, 1971.92 W. Michalke and C. Spinarke, Phys. Status Solidi, A, 2 (1970) K245.93 H. E. Austen, J. El ectrochem. Sot., 117 (1970) 845 and U.S. Pat. 3,525,677, 1970.94 F. R. Morral, Plating, 59 (1972) 131.95 V. Tutovan and N. Velican, Thin Soli d F ilms, 7 (1971) 219.96 V. Tutovan and N. Velican, Ann. Stii nt. Uni v. Al. Z. Cuza Zasi, Sect. lb, 16 (1970) 195;

Chem. Abstr., 74 (1971) 92770e.97 A Munteanu, A. Schiff, and C. Marcu, Rev. Phys. Acad. Rep. Populair e Roumaine, 15 (1970)

207; Chem. Abstr., 73 (1970) 50125x.98 V. Racinskas, L. Saurukaite and B. Radziuniene, Zashchit . Metal., 6 (1970) 609; Chem.

Abstr., 74 (1971) 8917~.99 I. I. Potapov, N. T. Kudryavtsev and M. M. Melnikova, Elektrolit. Osazhdenie Splavov,1 (1968) 65; Chem. Abstr., 74 (1971) 17295a.100 B. S. Zolotkovskii, A. M. Pishikin and M. Ya. Popereka, Uch. Zap., Ku li nin, Gos. Ped. I nst.,

79 (1970) 139; Chem. Abstr. 75 (1971) 93875a.101 G. S. Alberts and J. M. Brownlow, U.S. Pat. 3,622,469, 1971.102 J. Kulikowski, El ektroni ku, 12 (1971) 465; Chem. Abstr., 76 (1972) 10547Oa.103 Electronics Symposium, Plati ng, 54 (1967) 5, 6; and A. F. Schmeckenbecher, Plating, 58(1971) 905.104 A. I. Bogenschuetz and J. L. Jostan, Gulvanotechnik, 61 (1970) 3; 61 (1970) 279; 61 (1970) 362.

105 J. J. Mazur, U.S. Pat. 3,528,892, 1970.106 B. F. Rothschild, U.S. Pat. 3,554,878, 1971.107 C. W. Nelson and J. F. Hinchey, U.S. Pat. 3,625,837, 1971.108109110111112113114115116117118119120121122123124

V. A. Gutorov, M. I. Dmitrieva, and M. A. Zevakin, USSR Put. 320,089, 1971; Chem.Abstr., 76 (1972) 4136Oe.W. K. Lee, Plating, 58 (1971) 997.E. S. Bruk, and R. G. Kovaleva, Elektrol it. Osazhdenie Splavov, 2 (1968) 73; Chem. Abstr.,74 (1971) 8927f.U. Costa and G. Canegallo, French Put. 1,589,589, 1970.A. M. Pishikin and M. Ya. Popereka, Uch. Zap., Kal in in . Gos. Ped. Inst., 79 (1970) 132;Chem. Abstr., 75 (1971) 93864~.G. Ya. Varlamov, A. M. Pishikin and M. Ya. Popereka, Uch. Zap., Kal ini n. Gos. Ped. Inst.,79 (1971) 150; Chem. Abstr., 75 (1971) 93865x.S. L. Phillips and C. E. Johnson, J. Electrochem. Sot., 117 (1970) 827.V. P. Taranets, Tekhnol. Or gan. Proizvod. 1970, No. 3, p. 64; Chem. Abstr., 74 (1971) 1502OOg.I. D. Kudryavtseva and M. F. Skalozubov, Tr. Novocherk. Politekhn. Inst., 190 (1969) 44;Chem. Abstr., 74 (1971) 8908a.E. Schmid and K. Schnur, Ger. Pat. Appl . 1,948,734, 1971.A. G. Filatov, I. N. Klochkov and L. M. Belenkaya, USSR Put. 301,373, 1971; Chem.Abstr., 75 (1971) 83583q.P. S. Melnikov, R. S. Saifullin and G. S. Vozdvizhenskii, Zushchit. Metal., 7 (1971) 354;Chem. Abstr., 75 (1971) 44196~.S. N. Vinogradov, N. T. Kudryavtsev and N. F. Kulagina, Zushchit. Metal., 8 (1972) 92;Chem. Abstr., 76 (1972) 107201n.V. A. Ilin and L. S. Fortovova, USSR Pat. 273,614, 1970; Chem. Abstr., 74 (1971) 27534s.N. A. Grekova and P. M. Vyacheslavov, Zh. Pri kl . Khim., 44 (1971) 1975; Chem. Abstr.,76 (1972) 30050~.N. P. Fedotev, P. M. Vyacheslavov and G. K. Burkat, El ektrol it. Osazhdenie Splavov, 2(1968) 64; Chem. Abstr., 74 (1971) 18718~.V. P. Greco, Plating, 59 (1972) 115.

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210 A. KROHN, C. W. BOHN125 T. Miyashige and R. Suzuki, Kinzoku Hyomen Gijutsu, 22 (1971) 216; Chem. Abstr., 75 (1971)157547e.126 P. F. Kalyuzhnaya and V. B. Sobko, Ukr. Khim. Zh., 36 (1970) 403; Chem. Abstr., 13 (1970)51472~.127 P.F. Kalyuzhnaya, K. N. Pimenova and V. B. Sobko, Elektrolit. Osazhdenie Splavov, I

(1968) 72; Chem. Abstr., 74 (1971) 8933e.128 K. Aotani and K. Nishimoto, Kinzoku Hyomen Gijutsu, 21 (1970) 356; Chem. Abstr., 73(1970) 94067j.129 J. L. Polti, Ger. Pat. Appl. 2,011,374, 1970.130 W. Metzger, R. Ott, G. Pappe and H. Schmidt, Ger. Pat. 1,621,206, 1971.131 M. Viswanathan and K. S. G. Doss, Metal Finishing 70 (2) (1972) 83.132 E. Kedward, B. Kiernan, and C. L. M. Cottrell, Brit. Pat. 1,265,472, 1972.133 V. 0. Nwoko, Electroplating Metal Finishing, 24 (12) (1971) 28.134 D. S. R. Brown and K. V. Gow, Plating, 59 (1972) 437.135 B. Kiernan and E. C. Kedward, Brit. Pat. 1,220,078, 1971.136 E. C. Kedward, B. Kiernan and R. A. Duffin, Brit. Pat. 1,220,331, 1971.137 F. E. Luborsky, M. W. Breiter and B. J. Drummond, J. Electrochem. Sot., 119 (1972) 92.138 I. J. Hutkin, U.S. Pat. 3,512,946, 1970.139 M. Sarojamma and T. L. Rama Char. Electroplating Metal Finishing, 18 (2) (1965) 51.140 R. Sivakumar and T. L. Rama Char, Electroplating Metal Finishing, 24 (1) (I 971) 14.141 P. P. Semienko and E. Toledo, U.S. Pat. 3,533,922, 1970.142 Honeywell Inc., Brit. Pat. 1,249,642, 1971.143 I. Bursuc, I. Diaconu, and C. Cuciureanu, Thin Solid Films, 5 (1970) 297.144 W. L. Wade, Jr. and G. Sands, J. Electrochem. Sot., 118 (1971) 1137.145 P. E. McQuaid and A. J. Kolk, Jr., U.S. Pat. 3,573,571, 1971.146 Deutsche Gold- und Silber-Scheideanstalt vorm. Roessler, French Pat. Appl. 2,011,755,1970.147 P. S. Melnikov, Zashchit Metal., 6 (1970) 365; Chem. Abstr., 73 (1970) 514762.148 G. Bacquias, Gulvano, 40 (1971) 917.149 N. A. Smagunova, N. N. Balashova and Z. N. Marakhtanova, USSR Pat. 280,154, 1970;Chem. Abstr., 74 (1971) 490932.150 T. J. Menzel, Ger. Pat. Appl. 2,033,970, 1971.151 L. Domnikov, Metal Finishing, 68 (12) (1970) 54.152 C. U. Chisholm and R. J. G. Carnegie, Plating, 59 (1972) 28.153 S. Gowri and B. A. Shenoi, Metal Finishing, 70 (6) (1972) 30.154 Sh. Z. Khamudkhanova, V. B. Sheremeteva, A. M. Murtazaev and G. A. Tsyganov,Dokl. Akad. Nauk Uz. SSR, 27 (5), (1970) 33; Chem. Abstr., 75 (1971) 70633f.155 E. J. Smith, M. G. Vucich and L. W. Austin, U.S. Pat. 3,268,422, 1966; Chem. Eng. News,49 (6) (1971) 10.156 M. V. Myshalov and N. G. Chovnyk, USSR Pat. 281,987, 1970; Chem. Abstr., 74 (1971)106613~.157 Yu. K. Delimarskii, 0. G. Zarubitskii, V. G. Budnik and 0. A. Salabai, USSR Pat. 291,983,

1971; Chem. Abstr., 75 (1971) 14320q.158 Yu. Ya. Andreev, G. A. Kolobov, B. S. Lysov and N. S. Rychova, Isv. Vysshikh Uchebn.Zavedenii Tsvetn. Met., 13 (6) (1970) 82; Chem. Abstr., 74 (1971) 93774~.159 S. Tokumoto and E. Tanaka, Ger. Pat. Appl. 2,017,204, 1970.160 Yu. G. Olesov, V. I. Cherkashin and A. N. Rubtsov, Zh. Prikl. Khim., 44 (1971) 933; Chem.Abstr., 75 (1971) 44190q.161 J. J. Rameau, Rev. Intern. Hautes Temp. Refract., 8 (1971) 59.162 R. Darras, Nucl. Sci. Abstr., 25 (1971) 29783.163 M. L. Chaevskii and M. S. Goikhmnak, USSR Pat.[298,701, 1971; Chem. Abstr., 75 (1971)120807~.164 G. Boe, K. Grjotheim, K. Matiasovsky and P. Fellner, Can. Met. Quart., 10 (1971) 281.165 R. A. Fredlein and A. Damjanovic, J. Solid State Chem., 4 (1972) 94.

166 E. Morris, Jr., J. E. Murphy and T. A. Henry, Japan. Pat. 70,17,064, 1970; Chem. Abstr., 73(1970) 68878e.Electrodepos. Surface Treat., I (1972173)


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ELECTRODEPOSITION OF ALLOYS 211

167 D. Bratland, G. H. Boll, K. Grjotheim, H. Rensvik and E. Aamland, Rev. Chim. Acad. Rep.Popul ai re Roumai ne, 17 (1972) 41; Chem. Abstr ., 16 (1972) 120714b.

168 J. S. Sallo, Pl at i ng, 54 (1967) 257.169 J. S. Mathias and G. A. Fedde, Z.E.E.E. Trans. M agn., 5 (1969) 728.170 W. H. Safranek, Plat i ng, 53 (1966) 1211.171 L. Winkler, Ober-aeche, 4 (1969) 127; 5 (1969) 175.172 F. ONeill, Pl at i ng, 57 (1970) 205.173 W. P. Innes, Pl at i ng, 54 (1967) 378.

Gal vani sierung von LegierungenDie Aktivitaten auf dem Gebiet der elektrolytischen Abscheidung von Le-

gierungen haben wahrend der letzten Jahre eine zunehmende Expansion ver-zeichnet. Nicht alle Legierungsabscheidungen, iiber die berichtet wurde, habenden Weg zu kommerziellen Anwendungen gefunden, einige jedoch, wie z. B.Silber-Rhenium-Ulberziige, sind bereits technisch eingesetzt.Legierungsabscheidungen sind sowohl fiir dekorative als such ftir schtitzendeZwecke hervorragend anzuwenden. Prinzipielle neue Anwendungsgebiete zeichnensich ab fiir magnetische Legierungsiiberziige ftir Datenverarbeitungsanlagen, fi_irdie Elektroformung diverser Teile der Elektronik und grosser Teile fur die Luft-fahrt- und Raketenindustrie und schliesslich beim Galvanisieren von Plastwerk-stoffen. Ganz offenbar nehmen die Bedarfsfalle zu, bei denen Legierungsabschei-dungen eine technologische Lticke schliessen und dort eingesetzt werden, woandere Moglichkeiten nicht bestehen.

Die neuere Literatur dieses Fachgebietes wurde kritisch analysiert. Die Dis-kussion beriicksichtigt vorwiegend Abscheidungen binarer Legierungen aus wasse-rigen Lijsungen und ihre praktischen Anwendungen, dispersionsgehartete Legie-rungen und Komposite, ternare Legierungen und Legierungsabscheidungen ausSalzschmelzen.Le d& fi t i l ect rol yt i que des a& ages

La litterature recente sur le depot Clectrolytique dalliages est examinee.La discussion Porte principalement sur les systemes binaires deposes a partir desolutions aqueuses et leurs applications pratiques mais il est Cgalement fait mentiondes alliages durcis par dispersion et des mattriaux tlectrochimiques heterogenes,des systemes ternaires et des alliages deposes a partir delectrolytes a se1 fondu. Lesdepots dalliages, qui continuent a Ctre utilises comme rev&tements decoratifs etprotecteurs, ont trouve en outre de nouvelles applications comme films en alliagemagnetique pour lindustrie des ordinateurs, dans la galvanoplastie, dans Iindus-trie electronique et dans le revCtement des plastiques.

Elect rodepos. Surface Treat ., 1 (1972173)

a, krohn, bohn - 1972 - electrodeposition and surface treatment

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