6’’ and below: small dimension wafer market trends 2020
TRANSCRIPT
© 2020
From Technologies to Markets
Sample
6’’ and Below: Small Dimension Wafer Market Trends 2020
Market and Technology
Report 2020
Sil’tronix Silicon Technologies© - Polishing process - 2020
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METRICS
6’’ and Below: Small Dimension Wafer Market Trends 2020 | Sample | www.yole.fr | ©2020
2” Wafer
50 mm
3” Wafer
76 mm
4” Wafer
100 mm
5” Wafer
130 mm
6” Wafer
150 mm
8” Wafer
200 mm
12” Wafer
300 mm
Diameter
1” Wafer ➔ 25,4 mm
AREAS OF FOCUS
Diameters are usually expressed in millimeter (mm) or inch (“).
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REPORT OBJECTIVES
Assess the wafer market up to 6 inch for More than Moore (MtM) devices
• Provide a detailed analysis and wafer forecast for each MtM application segment
• Submit a wafer-starts analysis and metrics by MtM application segment, and split by wafer size and by wafer material (2019 – 2025)
Describe the key drivers of using small wafer size as well as the ones that will shape the small wafer market’s future
• Key technology choices and technology dynamics
• What are the challenges related to higher performances and process implementation?
• Emerging technologies, roadmaps and process availability
Ecosystem and positioning of key players
• Who are the players? What are the relationships inside this ecosystem?
• What is the time to market?
• What are the potential consumer applications?
This report aims to give the entire wafer starts market up to 6 inch for More than Moore devices
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REPORT METHODOLOGY
Market
Volume (in Munits)
ASP (in $)
Revenue (in $M)
Yole’s market forecast model is based on the matching of several sources:
Information
Aggregation
Preexisting
information
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TABLE OF CONTENTS
Part 1/2
• Glossary 04
• Definition 05
• Metrics 06
• Report objectives 07
• Scope of the report 08
• Methodology & definitions 12
• About the authors 13
• Companies cited in this report 14
• Why this report? 15
• Three-page summary 16
• Executive summary 20
• Market trends 43
o Semiconductor devices at one glance
o Semiconductor devices categories
o Applications vs diameters
o Applications vs materials
o Applications vs diameters & materials
o Wafer price trends
o ASP of epi-ready wafers
o Wafer pricing analysis
o Wafer reclaim
o Wafer diameter trends
o Wafer diameter evolution
o Major Si manufacturers
o Major gallium arsenide manufacturers
o Major silicon carbide manufacturers
o Major gallium nitride manufacturers
o Major LT/LN manufacturers
o Major indium phosphide manufacturers
o Major sapphire manufacturers
o Wafer diameter drivers
o Wafer diameter drivers
o Limitations for diameter evolution
o Overcoming limitations
o Conclusion
• Technology trends 77
o Freestanding substrates used by semiconductor industry
o Substrate types and their applications
o Key drivers for small size applications
o From devices to wafer materials
o RF components
o Power components
o Laser diodes
o LEDs
o MEMS & sensors
o From devices to wafer materials
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TABLE OF CONTENTS
Part 2/2
o Growth methods
o Bulk single-crystal growth
o Growth Techniques
o Benchmarking
o Growth methods
o Physical properties
• Business model & supply chain 101
o Business model
o Supply chain
o Producers and distributors
o Reclaim wafers
o Merger & acquisitions, partnerships, licensing
o Fabs & equipment : 1’’ – 6’’ processable
o Fabs
o Equipment
o Focus on China
o Focus on Russia
• Market forecasts 134
o Overall wafer forecast
o By diameter
o By application
o By wafer material
o Observations and analysis
• Conclusions 161
• Outlook 165
• Yole Développement presentation 170
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Biographies & contacts
ABOUT THE AUTHORS
Gaël GIUSTI, Market & Technology Analyst, Equipment and Materials Manufacturing
Gaël Giusti, PhD. Is a Technology & Market Analyst specialized in Semiconductor Manufacturing as well as Equipment & Materials at Yole Développement (Yole). As part of the Semiconductor & Software division at Yole, his expertise is focused on thin film growth and related applications, equipment, materials and manufacturing processes. Gaël is daily involved in the production of technology & market reports and custom consulting projects. Prior to Yole, he served as a R&D engineer at Sil'Tronix Silicon Technologies for 5 years. Gaël was in charge of upscaling a CVD process to develop epitaxial AlN thin film on sapphire for RF applications. He also worked on transparent conducting thin films for optoelectronics applications as a post-doctoral researcher at LMGP (Grenoble, France).
Gaël holds a master’s degree from ENSICAEN (Caen, France) as well as a PhD in Materials Science from the University of Birmingham (UK).
Contact: [email protected]
Vishnu KUMARESAN, Market & Technology Analyst, Equipment and Materials Manufacturing
Vishnu Kumaresan, PhD., is a Technology & Market analyst in the Semiconductor Manufacturing Team of Yole Développement, France. He focuses on thesemiconductor manufacturing domain, covering both equipment and material segments. His scope includes mainstream microelectronic applications as well asMore-than-Moore applications. Having lived and worked in 4 countries, he has more than 11 years of experience in the electronics industry, coveringsemiconductor, display, and software technologies. Prior to joining Yole, he worked as an epitaxy engineer in an advanced startup in the micro LED display industryand has previously gained corporate experience at IMEC, CNRS, Saint-Gobain and Infosys.
Vishnu obtained his PhD in Material Physics & Chemistry from Pierre and Marie Curie University, France, and master’s in Microelectronics from National Universityof Singapore and Technical University of Munich, Germany.
Contact: [email protected]
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II-VI Advanced Materials, Applied Materials, Atecom Technology, ATREG, Ceramic Forum, CMK, Cree-Wolfspeed, Crystaland, Cyberstar, ELMA, Freiberger, Global Wafers, Harbin Aurora, III-V Reclaim, Iljin Display, Infineon, InPact, Monocrystal,
Okmetic, Optim Wafer Services, Power Advanced Materials, PSI, Pure Wafer, ROHM -SiCrystal, Saint-Gobain LUMILOG, Shin-Etsu, Showa Denko, Siltronic, Sil'Tronix ST, Si-Mat, SK Siltron, SOITEC, ST Microelectronics, SUMCO, Sumitomo , TDG, University
Wafer, Vital Materials, Wafer Export, Wafer World and many more.
COMPANIES CITED IN THIS REPORT
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SCOPE OF THE REPORT (1/3)
Glass and quartz materials, templates, SOI, logic and memory applications will not be discussed in this report.
GaAs
SiC
Bulk GaN
InP
LT / LN
1) Applications for MtM
POWER
RFMEMS
LED
PHOTONICS
2) Substrate types used for MtM
3) Wafer diameters
2’’ and below
3’’
4’’5’’
6’’
Sapphire
Silicon
LT/LN: Lithium Niobate/Lithium Tantalate
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SCOPE OF THE REPORT (2/3)
Prime-wafers
Semiconductor substrate
growth
Semiconductor material ingot
Wafering
Polishing
Epitaxy growth process
(MOCVD, CVD, MBE)
Epiwafer
Raw wafer /
Prime wafers
(With no epitaxy)
Chips: dies-on-wafer
End-product
Testing
Back-end assembly
Front-end waferLitho, deposition, etching, metallization…
Epi-ready wafer
Tooling/Slicing
Fab level
Raw materials
Scope of the report
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SCOPE OF THE REPORT (3/3)
Reclaim Wafers
Prime-Wafers
Chips
(dies-on-wafer)
Front-end processing(litho, deposition, etching,
etc.,)
Packaging
End-products
Sort / Characterize Strip Lap
PolishCleanInspection
Wafer Reclaim ServicesTest / Qualification line
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KEY DRIVERS FOR SMALL DIMENSION WAFERS
The main driver for smalldimension wafers can besummarized in two words: « good enough ».
Low fabrication Price of small wafer size
For small industrial players and/or volumes as well as research institutes, it can be very expensive to scale-up tools
Technological crystal growth limitations make scaling-up the diameter very costly
Yield vs ROI “Good enough” : no pressure to scale-up
Process yields can drastically go down as wafer diameter increases
Small die size can justify staying on small wafer size if volumes is not expected to pick up
Less stringent specifications
Key drivers for using
small wafer size
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SEMICONDUCTOR DEVICES CATEGORIES
More Moore
Moore-Than-Moore Devices
PHOTONICS
Laser
EELS VCSELS
PIC
LED
MiniLEDs MicroLEDs IR UV
Visible
ROY Green Blue
RF
Filter PAAntennaswitch
POWER
SiC
Transistors Diodes
GaN
HEMTs
MEMS
Sensors ActuatorsMicro -fluidics
More device
Silicon
Substrate
More functionality
Silicon, GaAs, GaN, InP, SiC, Sapphire, LT/LN, SOI, POI, etc.,
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TOTAL ANNUAL SMALL DIMENSION (≤ 6’’) MARKET IN REVENUES: 2019 – 2025 FORECASTS
Total small dimension wafers-starts (breakdown by material for semiconductor devices)
InP
Si
GaAs
CAGR2019-2025: +1.8%
$1.8BCAGR: -3.3%
$5.4B2025
$0.7BCAGR: +19.5%
$0.2BCAGR: +14.4%
$0.5B
CAGR: +3.9%
$0.4BCAGR: +8%
$1.7B
CAGR:+1.1%
$2.2B$0.1B
$4.8B2019
$0.3B$0.2B
$0.4B$1.6B
SiC
Sapphire
LT/LN
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TOTAL SMALL DIMENSION MARKET (≤ 6’’) - BREAKDOWN BY DIAMETER FORECAST
CAGR: -5.3%COVID-19 impact
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TOTAL LARGE DIMENSION MARKET (≥ 8’’) - BREAKDOWN BY DIAMETER FORECAST
In units, 2019-2025 Logic & memory excluded
CAGR: 5.5 %
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NEW AND REFURBISHED EQUIPMENT VENDORS
USA
Italy
France
UK
Germany
Netherlands
China
Japan
South Korea
Singapore
Ireland
New equipment vendors Refurbished equipment vendors
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WAFER DIAMETER EVOLUTION
By material
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ASP OF EPI-READY WAFERS
Price trend with respect to wafer diameter
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SLIDE EXTRACTS
Forecasts: By diameter, material and application
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MORE SLIDE EXTRACTS
Supply chain focus: Wafer producers, equipment and fabs
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Contact our
Sales Team
for more
information
22
Contact our
Sales Team
for more
information
Status of the MEMS Industry 2020
Epitaxy Growth Equipment for More Than Moore Devices Technology and
Market Trends 2020
Thinning Equipment Technology and Market Trends for Semiconductor
Devices
Status of the Power Electronics Industry 2019
Compound Semiconductor Quarterly Market Monitor
YOLE GROUP OF COMPANIES RELATED REPORTS & MONITORS
Yole Développement
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23About Yole Développement | www.yole.fr | ©2020
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