2.008 design & manufacturing ii spring 2004 mems i 2.008-spring-2004 s.g. kim

2008 Design amp ManufacturingII

Spring 2004

MEMS I

2008-spring-2004 SG Kim

March 10th

Ask ldquoDaverdquo and ldquoPatrdquo1048708 Petty money up to $200 Goggles1048708 Plant tour April 21 22 sign up By 421048708 Quiz 1 on March 17th1048708 HW4 due by Mondayrsquos lecture1048708 75 minutes (45 min)1048708 MEMS 1 today


Elephant vs Ant

1048708 Shock and impact1048708 Scale and form factor1048708 Load carrying capability1048708 Spider silk vs steel


Frog Water Strider Gecko


Never try to mimic the nature eg Biomimetic researches

httproboticseecsberkeleyedu~ronfGECKOF 5 iguresHierarchy3jpg2008-spring-2004 SG Kim

Gecko adhesive system

Macro Meso Macro Nanostructures

The Scale of Things -- Nanometers and More

Transition Micro to Nano

1048708 20th Century - Microelectronics and Information Technology1048708 Semiconductors computers and telecommunication

1048708 21st Century - Limits of Microsystems Technology --- Nanotechnology1048708

Moorersquos law1048708 Hard disc drive

John Bardeen Walter Brattain and William Shockleyat Bell Laboratories ldquoFirst Transistorrdquo


Moorersquos LawThe number of transistors per chip doubles every 18 monthsndash Moorersquos Law_ Rockrsquos Law


Microelectronics Technology

To meet the Moorersquos Lawline width(12 pitch) requirement

No solution yet nanolithography


The International Technology Roadmap for Semiconductors 1999

Aerial density hard disk

Superparamagnetic Effect ldquoa point where the data bearing particles are so small that random atomic level vibrations present in all materials at room temperature can cause the bits to spontaneously flip their magnetic orientation effectively erasing the recorded data ldquo


What is Nanotechnology

A DNA molecule is 25 nm wide

Nanomanufacturing


Nano in ME

1048708 Fluidics heat transfer and energy conversion at the micro- and nanoscale1048708 Bio-micro-electromechanical systems (bio-MEMS)1048708 Optical-micro-electromechanical systems (optical- MEMS)1048708 Engineered nanomaterials1048708 Nano manufacturing

1048708 Course 2A (Nanotrack)


httpwwwmemsnetorgmemswhat-ishtml

MEMS

Optical MEMS RF MEMS Data Storage Bio MEMS Power MEMS MEMS for Consumer Electronics MEMS In Space

MEMS for Nano

1048708 Materials1048708 Processes1048708 Systems


Courtesy Sandia national laboratory

MEMS (Microelectromechanical Systems)

1048708 Intergrated systems of sensing actuation communication controlpower and computing1048708 Tiny1048708 Cheaper1048708 Less power1048708 New functions (chemical bio μ- fluidic optical hellip)


Tiny Products

1048708 DLP (Digital Micromirror Array)

106 micromirrors each 16μm2 plusmn10deg tilt(Hornbeck Texas Instruments DMD 1990)


Tiny Products

1048708 Airbag sensors Mechanical vs MEMS

Analog Devices2008-spring-2004 SG Kim

Tiny Products

1048708 Airbag sensors Mechanical vs MEMS1048708 DLP (Digital Micromirror Array)1048708 DNA chip1048708 Optical MEMS

Tiny Tech venture funding 2002


Smalltimes Vol2 no 6 2002

(Courtesy of Segway (r) Human Transporter (HT)Used with permission)

Segway

-Tilt-Rotation

D Kamen2008-spring-2004 SG Kim

Vibrating Gyroscope

CoriolisAcceleration

By Charles Stark Draper Laboratory


Electrostatic Comb Drivesensing

1048708 Paralle Plate Capacitor1048708 Capacitance=QV=ε Ad ε Dielectric permittivity of air1048708 Electrostatic Force = frac12 ε (Ad2)V2

1048708 Pull-in point 23 d


Comb Drive

1048708 C= ε Ad = 2n ε l hd1048708 ΔC = 2n ε Δl hd1048708 Electrostatic force Fel = frac12 dCdx V2 = n ε hd V2


Suspension mode failures


Comb Drive Designs

linear rotational


Grating beamsFlexuresElectrostatic comb-drives

Capacitive Accelerometer

capacitivesensor

platemass

meanderspring


Microfabrication process flow

1048708 Single-mask process

1048708 IC compatible

1048708 Negligible residual stress

1048708 Thermal budget

1048708 Not yet packagedDevice silicon layer

Buried oxide layer

Metal layer

Bulk silicon layer


SOI (Silicon on insulator)

1) Begin with a bonded SOI wafer Growand etch a thin thermal oxide layer to actas a mask for the silicon etch

2) Etch the silicon device layer to exposethe buried oxide layer

3) Etch the buried oxide layer in bufferedHF to release free-standing structures


oxide mask layer

Si device layer 20 μm thick

buried oxide layer

Si handle wafer

silicon

Thermal oxide

Problems of fabrication


Surface micromachinedStructure 2 μm

Vertical stiction

DRIE micromachinedStructure 10 μm

Lateral stiction


No stiction

G Barbastathis amp S Kim

ADXL 50 accelerometer

Capacitive sensing

Comb drive


Process Flow

Wafers

Deposition Lithography

Devices

OxidationSputteringEvaporationCVDSol-gelEpitaxy

Wet isotropicWet anisotropicPlasmaRIEDRIE

Etch


Micromachining processes

bull Bulk micromachiningbull Surface micromachiningbull Bondingbull LIGA bull x-ray lithography electrodeposition and molding


LIGA process


X-rays from a synchrotron are incident on a mask patterned with high Z absorbers X-rays are used to expose a pattern in PMMA normally supported on a metallized substrate

The PMMA is chemically developed to create a high aspect ratio parallel wall mold

The PMMA is dissolved leaving a three dimensional metal micropart Individual microparts can be separted from the base plate if desired

Ametal or alloy is electroplated in the PMMA mold to create a metal micropart

Photograph of chrome mask

Bulk Surface DRIE

1048708 Bulk micromachining involves removal of the silicon wafer itself1048708 Typically wet etched1048708 Inexpensive equipments1048708 IC compatibility is not good1048708 Surface micromachining leaves the wafer untouched but addsremoves additional thin film layers above the wafer surface1048708 Typically dry etched1048708 Expensive equipments1048708 IC compatibility conditionally


Materials

1048708 Metals1048708 Al Au ITO W Ni Ti TiNihellip1048708 Insulators1048708 SiO2 - thermally grown above 800oC or vapor deposited (CVD) sputtered Large intrinsic stress1048708 SixNy ndash insulator barrier for ion diffusion high E stress controllable1048708 Polymers PR SU-8 PDMS1048708 Glass quartz1048708 Silicon1048708 stronger than steel lighter than aluminum1048708 single crystal polycrystalline or amorphous


Silicon

1048708 Atomic mass average 2808551048708 Boiling point 2628K1048708 Coefficient of linear thermal expansion 42 10-6degC1048708 Density 233gcc1048708 Youngrsquos modulus 47 GPa1048708 Hardness scale Mohsrsquo 651048708 Melting point 1683K1048708 Specific heat 071 JgK

Electronic grade silicon 9999999999 purity


Materials

1048708 Single crystal silicon1048708 Anisotropic crystal 1048708 Semiconductor great heat conductor1048708 Polycrystalline silicon ndash polysilicon1048708 Mostly isotropic material1048708 Semiconductor1048708 Semiconductor1048708 Electrical conductivity varies over ~8 orders of magnitude depending on impurity concentration (from ppb to ~1)1048708 N-type and P-type dopants both give linear conduction1048708 Two different types of doping1048708 Electrons (negative N-type) --phosphorus1048708 Holes (positive P-type) --boron


Silicon Ingot

Czochralski (CZ) method

Float Zone (FZ) method

1rdquo to 12rdquo diameter

httpwwwmsilabpsiwebcomenglishmsilhist4-ehtml


Silicon Crystal Structure


Miller indices identify crystal planes from the unit cell

Tetrahedral bonding of silicon atoms

Cubic unit cell of silicon

Miller indices plane


Crystallographic planes


Miller indices

bull [abc] in a cubic crystal is just a directional vectorbull (abc) is any plane perpendicular to the [abc] vectorbull (hellip)[hellip] indicate a specific planedirectionbull helliplthellipgt indicate equivalent set of planesdirections


Wafers of different cuts




Etching

Wet

Dry

1048708 Isotropic silicon etchants1048708 HNA (ldquopoly-etchrdquo) -wet1048708 Mix of HF nitric acid (HNO3) and acetic acids (CH3COOH)1048708 Difficult to control etch depth and surface uiformity1048708 XeF2 -dry1048708 gas phase etches silicon polysilicon1048708 Does not attack SiO2 SiNxmetals PR


Slow etching crystal plane

Etch mask

Anisotropic Isotropic

Anisotropic wet etching

Many liquid etchants demonstrate dramatic etch ratedifferences in different crystal directions1048708 lt111gt etch rate is slowest lt100gt fastest1048708 Fastest slowest can be more than 10011048708 KOH EDP TMAH most common anisotropic silicon etchants1048708 Potasium Hydroxide (KOH) Tetramethyl Ammonium Hydroxide (TMAH) and Ethylene Diamine Pyrochatecol (EDP)


KOH Etching

1048708 Etches PR and Aluminum instantly1048708 (100) to (111)rarr100 to 1 etch rate1048708 V-grooves trenches1048708 Concave stop convex undercut1048708 CMOS incompatible1048708 Masks1048708 SiO2 for short period1048708 SixNy Excellent1048708 heavily doped P++ silicon etch stop


Silicon Substrate



When a (100) wafer with mask featuresOriented to lt110gt direction is placed inan anisotropic etchant

A square lt110gt oriented mask featureresults in a pyramidal pit





Dry etching

1048708 RIE (reactive ion etching)1048708 Chemical amp physical etching by RF excited reactive ions1048708 Bombardment of accelerated ions anisotropic1048708 SF6 rarr Si CHF3 rarr oxide and polymers1048708 Anisotropy selectivity etch rate surface roughness by gas concentration pressure RF power temperature control1048708 Plasma etching1048708 Purely chemical etching by reactive ions isotropic1048708 Vapor phase etching1048708 Use of reactive gases XeF21048708 No drying needed


DRIE (Deep RIE)

1048708 Alternating RIE and polymer deposition process for side wall protection and removal1048708 Etching phase SF6 Ar1048708 Polymerization process CHF3Ar forms Teflon-like layer1048708 Invented by Bosch process patent 1994

-15 to 4 μmmin-selectivity to PR 100 to 1


Scalloping and Footing issues of DRIE


Footing at the bottom ofdevice layerMilanovic et al IEEE TED Jan 2001

Deep Reactive Ion Etch

STS Alcatel Trion Oxford Instruments hellip

Most wanted by many MEMS students

High aspect ratio 130

Easily masked (PR SiO2)


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Slide 51

March 10th

Ask ldquoDaverdquo and ldquoPatrdquo1048708 Petty money up to $200 Goggles1048708 Plant tour April 21 22 sign up By 421048708 Quiz 1 on March 17th1048708 HW4 due by Mondayrsquos lecture1048708 75 minutes (45 min)1048708 MEMS 1 today


Elephant vs Ant




























Nanomanufacturing


Nano in ME





MEMS


MEMS for Nano







Tiny Products




Tiny Products



Tiny Products






Segway

-Tilt-Rotation


Vibrating Gyroscope








Comb Drive





Comb Drive Designs

linear rotational




capacitivesensor

platemass

meanderspring








Buried oxide layer

Metal layer

Bulk silicon layer







oxide mask layer


buried oxide layer

Si handle wafer

silicon

Thermal oxide




Vertical stiction


Lateral stiction


No stiction



Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

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Slide 42

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Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51

Elephant vs Ant




























Nanomanufacturing


Nano in ME





MEMS


MEMS for Nano







Tiny Products




Tiny Products



Tiny Products






Segway

-Tilt-Rotation


Vibrating Gyroscope








Comb Drive





Comb Drive Designs

linear rotational




capacitivesensor

platemass

meanderspring








Buried oxide layer

Metal layer

Bulk silicon layer







oxide mask layer


buried oxide layer

Si handle wafer

silicon

Thermal oxide




Vertical stiction


Lateral stiction


No stiction



Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

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Slide 7

Slide 8

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Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51


























Nanomanufacturing


Nano in ME





MEMS


MEMS for Nano







Tiny Products




Tiny Products



Tiny Products






Segway

-Tilt-Rotation


Vibrating Gyroscope








Comb Drive





Comb Drive Designs

linear rotational




capacitivesensor

platemass

meanderspring








Buried oxide layer

Metal layer

Bulk silicon layer







oxide mask layer


buried oxide layer

Si handle wafer

silicon

Thermal oxide




Vertical stiction


Lateral stiction


No stiction



Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

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Slide 48

Slide 49

Slide 50

Slide 51

Nano in ME





MEMS


MEMS for Nano







Tiny Products




Tiny Products



Tiny Products






Segway

-Tilt-Rotation


Vibrating Gyroscope








Comb Drive





Comb Drive Designs

linear rotational




capacitivesensor

platemass

meanderspring








Buried oxide layer

Metal layer

Bulk silicon layer







oxide mask layer


buried oxide layer

Si handle wafer

silicon

Thermal oxide




Vertical stiction


Lateral stiction


No stiction



Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

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Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51


MEMS


MEMS for Nano







Tiny Products




Tiny Products



Tiny Products






Segway

-Tilt-Rotation


Vibrating Gyroscope








Comb Drive





Comb Drive Designs

linear rotational




capacitivesensor

platemass

meanderspring








Buried oxide layer

Metal layer

Bulk silicon layer







oxide mask layer


buried oxide layer

Si handle wafer

silicon

Thermal oxide




Vertical stiction


Lateral stiction


No stiction



Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

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Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51




Tiny Products




Tiny Products



Tiny Products






Segway

-Tilt-Rotation


Vibrating Gyroscope








Comb Drive





Comb Drive Designs

linear rotational




capacitivesensor

platemass

meanderspring








Buried oxide layer

Metal layer

Bulk silicon layer







oxide mask layer


buried oxide layer

Si handle wafer

silicon

Thermal oxide




Vertical stiction


Lateral stiction


No stiction



Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

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Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51

Tiny Products



Tiny Products






Segway

-Tilt-Rotation


Vibrating Gyroscope








Comb Drive





Comb Drive Designs

linear rotational




capacitivesensor

platemass

meanderspring








Buried oxide layer

Metal layer

Bulk silicon layer







oxide mask layer


buried oxide layer

Si handle wafer

silicon

Thermal oxide




Vertical stiction


Lateral stiction


No stiction



Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

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Slide 7

Slide 8

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Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51

Tiny Products






Segway

-Tilt-Rotation


Vibrating Gyroscope








Comb Drive





Comb Drive Designs

linear rotational




capacitivesensor

platemass

meanderspring








Buried oxide layer

Metal layer

Bulk silicon layer







oxide mask layer


buried oxide layer

Si handle wafer

silicon

Thermal oxide




Vertical stiction


Lateral stiction


No stiction



Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

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Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51


Segway

-Tilt-Rotation


Vibrating Gyroscope








Comb Drive





Comb Drive Designs

linear rotational




capacitivesensor

platemass

meanderspring








Buried oxide layer

Metal layer

Bulk silicon layer







oxide mask layer


buried oxide layer

Si handle wafer

silicon

Thermal oxide




Vertical stiction


Lateral stiction


No stiction



Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

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Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51

Vibrating Gyroscope








Comb Drive





Comb Drive Designs

linear rotational




capacitivesensor

platemass

meanderspring








Buried oxide layer

Metal layer

Bulk silicon layer







oxide mask layer


buried oxide layer

Si handle wafer

silicon

Thermal oxide




Vertical stiction


Lateral stiction


No stiction



Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

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Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51





Comb Drive





Comb Drive Designs

linear rotational




capacitivesensor

platemass

meanderspring








Buried oxide layer

Metal layer

Bulk silicon layer







oxide mask layer


buried oxide layer

Si handle wafer

silicon

Thermal oxide




Vertical stiction


Lateral stiction


No stiction



Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51



Comb Drive Designs

linear rotational




capacitivesensor

platemass

meanderspring








Buried oxide layer

Metal layer

Bulk silicon layer







oxide mask layer


buried oxide layer

Si handle wafer

silicon

Thermal oxide




Vertical stiction


Lateral stiction


No stiction



Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51


capacitivesensor

platemass

meanderspring








Buried oxide layer

Metal layer

Bulk silicon layer







oxide mask layer


buried oxide layer

Si handle wafer

silicon

Thermal oxide




Vertical stiction


Lateral stiction


No stiction



Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51







Buried oxide layer

Metal layer

Bulk silicon layer







oxide mask layer


buried oxide layer

Si handle wafer

silicon

Thermal oxide




Vertical stiction


Lateral stiction


No stiction



Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51






oxide mask layer


buried oxide layer

Si handle wafer

silicon

Thermal oxide




Vertical stiction


Lateral stiction


No stiction



Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51




Vertical stiction


Lateral stiction


No stiction



Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51


Capacitive sensing

Comb drive


Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51

Process Flow

Wafers


Devices



Etch





LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51




LIGA process







Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51

Bulk Surface DRIE



Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51

Materials



Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51

Silicon




Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51

Materials



Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51

Silicon Ingot















Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51










Miller indices







Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51





Etching

Wet

Dry




Etch mask





KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51




KOH Etching



Silicon Substrate









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51









Dry etching



DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51

DRIE (Deep RIE)













Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51










Slide 1

Slide 2

Slide 3

Slide 4

Slide 5

Slide 6

Slide 7

Slide 8

Slide 9

Slide 10

Slide 11

Slide 12

Slide 13

Slide 14

Slide 15

Slide 16

Slide 17

Slide 18

Slide 19

Slide 20

Slide 21

Slide 22

Slide 23

Slide 24

Slide 25

Slide 26

Slide 27

Slide 28

Slide 29

Slide 30

Slide 31

Slide 32

Slide 33

Slide 34

Slide 35

Slide 36

Slide 37

Slide 38

Slide 39

Slide 40

Slide 41

Slide 42

Slide 43

Slide 44

Slide 45

Slide 46

Slide 47

Slide 48

Slide 49

Slide 50

Slide 51

2.008 design & manufacturing ii spring 2004 mems i 2.008-spring-2004 s.g. kim

Documents

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space mems

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mems analog devices

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