10 reasons to use the renesas remote io solution kit
DESCRIPTION
Designed for easy IO-Link integration into Ethernet-based fieldbuses and scalable system evaluation, including RX-based header board, two IO-Link Master modules, sensor board and evaluation IO-Link Master software stack and device tools.TRANSCRIPT
Industrial & Communications Business GroupRenesas Electronics Europe
Rev. 1.00
© 2014 Renesas Electronics Europe. All rights reserved.
Easy IO-Link Ethernet Integration10 Reasons to Use Connect-it! Remote IO Solution Kits
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Complete Package for Remote IO Design
1Complete H/W
& S/W Platform
Expandablehost controller
Scalable IO-Link reference design
Embedded pre-certified fieldbus middleware
Schematic & PCB layout files
Engineering tool for IO system
Expert partnersupport services
© 2014 Renesas Electronics Europe. All rights reserved.
Flexible Mapping to Ethernet Fieldbuses
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© 2014 Renesas Electronics Europe. All rights reserved.
Comprehensive Development Environment
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Process Data
Parameter Data
Teach-in
Diagnosis Data
IO-Link Master
OCD (On-Chip Debug)
Demonstration GUI & IO-Link Device Tool
Software Development
Programming
Host Machine
IO-Link Slaves
M12 cable
IO-Link Slaves
© 2014 Renesas Electronics Europe. All rights reserved.
Comprehensive Software Platform
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Connect-it! includes:Renesas IO-Link Device ToolTMG IO-Link Master stack firmware free of charge evaluation versionIO-Link specification V1.1 compliance • COM1, COM2, COM3 supported• Frame Types: 0, 1 and 2.X
Host library interface source codeRunning demo project including BSP for RX63N host microcontrollerIAR Embedded Workbench Kickstartversions included for 78K & RX• EW78K• EWRX
© 2014 Renesas Electronics Europe. All rights reserved.
Easy Prototyping With Pre-Certified Software
Develop on the platformFree evaluation software package from TMG GmbH including • IO-Link Master v1.1• Ethernet/IP stack• Profinet RT stack
Firmware stacks pre-flashed in the platform for out of the box demo purposes. Customisable libraries provided for host CPU and master IO-Link Master modules for freedom in developing IO-Link applications on the platform
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Fieldbus Independent Communication to Tools
Protocol stackAll necessary functions to get connected to IO-Link masters or look for accessible onesConfiguration of Master devices Reading from the master’s configuration setupWriting of output process data Diagnosis, identification, parameterization and display of the process data from IO-Link devices
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© 2014 Renesas Electronics Europe. All rights reserved.
Simplified High Performance Architecture
Integration + optimisation10% higher performance than traditional 32-bit MCU / multi-channel IO-Link PHY configurations<1ms Cycle time4% CPU loading from SPISynchronous with process cyclesOnly needs 4 tracks on PCBHighest throughput architecture with no performance or timing bottlenecks
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Simplified PCB design & no heat or EMC concerns
© 2014 Renesas Electronics Europe. All rights reserved.
On-board Interface to connect to and use other Renesas 32-bit MCU families
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Expandable 32-Bit Uplink Controller
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Scalable Modular Platform
Scalable interfacesto expand IO-Link
network…
Built on Renesas PHY,RX63N Ethernet MCU& K0R IO/Link MCU
© 2014 Renesas Electronics Europe. All rights reserved.
Scalable Master Modules
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Add-on Master moduleavailable to increase
number of ports
Pre-Flashed with TMGIO-Link Masterstack firmware
/// Order code: Y-78K0RIOLINKMADM
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Find Out More!
www.renesas.eu/io-link
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@Renesas_europe
Renesas Europe
Renesas Europe
© 2014 Renesas Electronics Europe. All rights reserved.
Renesas Electronics Europe© 2014 Renesas Electronics Europe. All rights reserved.