1 avpm annual meeting october 6, 2009 peter garvin rpet blisters and the impact on heatseal...

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AVPM Annual Meeting

October 6, 2009

Peter Garvin

RPET Blisters and the impact on

Heatseal Technology

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Technical Review-Heat Seals

Components

• Blister types

• Adhesive Technologies

• Current Status

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Blister Type

• Traditional PVC – Vast Majority of Market

• PET & RPET Blisters -Expanding

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Blister Type – other impacts

• Blister Flange – need a minimal size to ensure heatsealing operation adherence of the blister to the ink/board stock

• Mold Release & denesting lubricants – need minimal amounts to preclude disruption of adhesion

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Heat Seal Coating

Printing Ink

Clay Coating

Clay Coating

Chemical Sizing

Chemical Sizing

Paperboard

Clay Coating

Plastic Blister

Blister Flange

Blister Flange

BASE SHEET

FINISHEDSHEET

Visual Carded PackagingComponents & Assembly

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Adhesive Technology

• The adhesive itself is applied over wax-free inks on the blister board

• The heatsealing operation allows the molten adhesive to wet out the blister and the ink/board

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Adhesive Technology• The adhesive does not “dive in” to the board

as originally thought. (Determined by AVPM technicalcommittee analysis)

• Thus – the blister itself is vital to a proper and secure structure

• A proper seal is the result of the bond between blisterand ink/board, being strong enough so that the board ruptures in the base sheet (not clay split!!)

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Adhesive Technology (Solvent Base)• Applied off-line in second step on roll-coater over

dry inks (may require spray powder)• Able to adhere to a wide variety and “quality” of

blisters – most forgiving technology – better wetsout the flange.

• EVA and Vinyl Technologies• Solvent recovery or incineration required

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Adhesive Technology (Water – Base)

• Applied in-line over wet ink on a litho press equipped with an in-line coating unit

• Lower cost than off-line coating - 1 step process

• PUR and Acrylic Technologies

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Current Status• “Green” concerns drive the blister package to

more environmentally friendly components• Board stock is repulpable (Beloit Study)• Heatseal Adhesive – Currently water-base,

devoid oforganic solvents / and in-line which eliminates asecond operation which reduces energy and cost

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Current Status – Blisters• PVC Blisters – Issue with environment

(Chlorine)Being greatly reduced and eliminated in EU andnow in North America

• Recyclability provides for “better score” on Walmart score card as well as with the consumer/customer – Hence RPET!!!!

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Current Status – Blisters – RPET

• RPET Blisters vary in amount of “recycled” components

• This may vary the surface energy and corresponding effect on the ability of the adhesive to wet the substrate and adhere the blister to the ink/board

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Current Status – Blisters – RPET• Thus to overcome the variation – solvent base

systemsprovide the safest solution (traditional system with the ability to wet out the film when sealed)

• Solvent base (EVA) in effect “covers the sins” of the variation inherent in typical RPET blister stock

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Current Status – Blisters – RPET• Water base systems (PUR) - are being developed

to allow for their benefits (one-pass / no organic solvents)

• This will take the Blister Package to the “greenest” option

• Best bet is to test the combination of board /ink / heatseal coating / blister in the laboratory prior to approval

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Current Status – Blisters - RPET

• When completed make sure to specify each component!!!

• With the same board – ink – heatseal / and specified RPET!!! This structure should provide the optimal desired and properly sealed package!!!

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Questions??

Thank you!!!

Peter GarvinHenkel

[email protected](513) 417 - 3980

mailto:[email protected]

1 avpm annual meeting october 6, 2009 peter garvin rpet blisters and the impact on heatseal...

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