1 21 august 2015 electronic and interconnect solutions division using tape & reel for high...

1April 19, 2023Electronic and Interconnect Solutions Division

Using Tape & Reel for High Volume Flip Chip Delivery: A Manufacturing Analysis

Joint Study by:

Pat Jones - Delco Electronics Corporation

Lisa Bernal Brethour - Surface Mount Taping, Inc.

Tom Becker - 3M

Presented atMCC/EIA/SEMATECH KGD Industry Workshop

September 19, 1997


Presentation Outline

• Background

• Test Plan

• Test Procedure

• Material Selection

• Wafer to Tape and Reel Results

• Transportation Test Results

• Bump Shape Analysis

• Spectral Analysis

• Pick and Place Test Results

• Conclusions and Recommendations


Statement of Need

• Need for low cost /high volume packaging

• Need to use existing SMT assembly equipment and tooling

• Need to use standardized embossed packaging media

• Need for documented research

• Need for industry standard for high volume flip chip packaging


Objective

• Determine feasibility of using standard embossed tape and reel packaging for flip chip ICs bumps down

• Determine functional “range of sizes” of flip chips in standard pockets

• Provide design model for sizing embossed pockets to flip chips

• Provide research to the semiconductor industry to assist in standardization


Experimental Scope

• Use a range of flip chip sizes

• Use a common flip chip thickness

• Develop experimental factorial design for chip size vs. pocket size

• Use common eutectic bumps with similar metallurgy

• Use of standardized FSTM shipping test method

• Use of standardized component handling equipment


3M Motorola Delco

Tape Sizing Factorial and Rotation Analysis Tape Design and Manufacture Tape Re-design and Manufacture

Wafer Bumping Wafer Processing Flip Chip Inspection Transfer to Gel Pak Transfer to Tape & Reel Wafer to Tape Analysis Sample Shipment

Wafer Fab Wafer Bumping Wafers to Motorola Transportation Test Bump Inspection Bump Measurement Spectral Analysis Pick and Place Experiment

All : Analysis & Report Generation

Joint Division of Responsibilities


Process Flow

Delco Electronics Wafers

MotorolaBump

Delco Electronics

Bump

MotorolaWafer to Tape

Delco ElectronicsTest/Assembly

3M Tape & Reel

Motorola, SPSWafers


Flip Chip Description

*Bump Metallurgy: Eutectic Sn/Pb 60/40 or 63/37

Name Size Chip Thickness Number of Bump Pattern(mm) (mm) Bumps

Small FDIZ 1.3 x 1.3 0.81 6 Array

Mid-Size MSFB-1UP 5.8 x 5.8 0.69 96 PerimeterFB250 6.35 x 6.35 0.72 48 3 Row ArrayMFDS 4.34 x 5.63 0.76 40 Array

Large MSFB-4UP 11.17 x 12.6 0.72 384 ArrayTC10 6.6 x 9.47 0.72 150 Perimeter


Flip Chip Photos

8 mm Tape

24 mm Tape 12 & 16 mm Tape

MSFB,4-UP

MFDS

MSFBFDIZ

Photos to scale


Embossed Carrier Description

• 3M™ Conductive Polycarbonate Carrier 3000BD

• 3M™ Conductive PSA Cover Tape 2666

• Precision Flat-bottom Pockets

• All pockets (except TC10) are “worst-case” for bump contact with carrier

• Bevel Edge with Raised Cross-bar pocket design

Bare Die

< 3.0 deg. Draft AngleInside Corner

Flat-bottomPocket

Bevel < 35 deg..

Bevel at50% of Ko


Bevel Edge Pocket Design

Bevel-edgepocket design for ease of use in loading!

Low Draft Anglesfor better containment!(< 5.0 degrees)

PrecisionFlat-Bottom Pocket(+/- 0.002”)

Actual Cross-Section of 3M CSP Carrier Tape

31.5°

94.9°


Pocket Sizing Factorial

Name Ao +Tol Bo +Tol Ko +Tol Factorial Max Width x (mils) (mils) (mils) % Rotation Pitch

FDIZ -1 1.00 1.00 0.00 1.00% 4.0 deg. 8 x 4

FDIZ - 2 1.00 1.00 6.00 1.00% 4.0 deg. 8 x 4

FDIZ - 3 6.00 6.00 0.00 9.90% 10.0 deg. 8 x 4

FDIZ - 4 6.00 6.00 6.00 9.90% 10.0 deg. 8 x 4

MFSB 21.00 24.00 3.00 9.60% 7.5 deg. 16 x 8

FB250 39.00 39.00 3.00 16.00% 10.0 deg. 12 x 12

MFDS 20.00 20.00 3.00 11.60% 10.0 deg. 12 x 8

MFSB, 4-UP - 1 5.00 6.00 0.00 1.00% 0.9 deg. 24 x 16

MFSB, 4-UP - 2 5.00 6.00 6.00 1.00% 0.9 deg. 24 x 16

MFSB, 4-UP - 3 59.00 67.00 0.00 13.30% 7.5 deg. 24 x 16

MFSB, 4-UP - 4 59.00 67.00 6.00 13.30% 7.5 deg 24 x 16

TC10 21.00 30.00 3.00 8.10% 7.5 deg. 24 x 12 pedestal


Wafer-to-Tape Process

• 100% visual inspection performed prior to pick manually inked damaged chips

• Bumps inspected to Delco Electronics Workmanship Standards

• Manually placed control dice in Gel-Pak®, bumps up

• Generated vibration samples versus control in tape and reel

Gel-Pak® is a product of Vichem Corporation


Wafer-to-Tape Equipment


Wafer-to-Tape

• Saw street variation from wafer-to-wafer affected system alignment

• Initial tape designs were difficult to seal, re-designed tape to resolve problem

• Vacuum tip needed re-design to pick up bumped die reliably


Wafer-to-Tape Results

Flip-Chip Misplaced Dice UPHFDIZ - Tape 1 0.80% 1200FDIZ - Tape 2 13.20% 1200FDIZ - Tape 3 0.00% 1560FDIZ - Tape 4 1.20% 1560MFDS 0.04% 2760FB250 0.94% 3000MSFB1-UP 0.00% 2520MSFB4-UP Tape 1 2.60%MSFB4-UP Tape 2 1.30%MSFB4-UP Tape 3 2.70%MSFB4-UP Tape 4 0.00%TC10 0.06% 2220


Packaging and Shipping Method

• Partially filled 13” reels

• Anti-static bags

• Placed in primary shipping container (pizza box) with anti-static bubble wrap

• Placed in secondary shipping container with anti-static bubble wrap

• Shipped UPS Red

- Tempe, AZ to Kokomo, IN


Delco Electronics Test Flow

Tape Sample 1A50 die - Control

Tape Sample 1B450 Die - Test

Gel-Pak®

control samples

Inspect carrierpockets

Pick & Place 400 die

Collect rotation data

Collect mis-pick data

Reflow % of Die

Cold Joint Analysis

Inspect 40 Diefor Bump Damage

Measure 10 Die forFlatness

Photograph typical and atypical

damage

Spectral Analysis5 die

Reflow % of Die

Cold Joint Analysis

Shipping Test


Shipping Test

• Federal Standard Test Method 101C:

• Vibration Method 5019.1

– Vibrate on 3 sides - one hour each

– 0.5” unrestrained vertical movement

• Drop Test Method 5007.1

– Level B, procedures b, c and f

– 27” drop height


FDIZ Bump Photos

Control Gel-Pak® Control Tape & Reel Test Sample

SEM Photos


MSFB Bump Photos


SEM Photos


MSFB4UP Bump Photos


SEM Photos


FB250 Bump Photos


SEM Photos


Bump Height Statistical Analysis

• Using computerized optical measuring system

– Repeatable to 2.5 um

– Analysis of mid-size FB250 bumps

• Analyzed bump heights and flatness

• Average and sigma


Bump Heights - Average

XBAR: Bump Heights25 devices

48 bumps/device

0.06

0.065

0.07

0.075

0.08

0.085

0.09

0.095

0.1

1 3 5 7 9 11

13

15

17

19

21

23

25

CONTROL: Gel Pack

EMBOSSED: No Vibration orDrop

TEST- Vibrated/Drop Tested


Bump Heights - Sigma

SIGMA: Bump Heights25 devices

48 bumps/device

0.006

0.008

0.01

0.012

0.014

0.016

0.018

1 3 5 7 9 11

13

15

17

19

21

23

25

EMBOSSED: No Vibration orDrop

CONTROL: Gel Pack

TEST- Vibrated/Drop Tested


Bump Spectral Analysis

Uncontaminated Contaminated

Out of 50 flip chips analyzed with 48 bumps each (2, 400 bumps), only this small particulate of contamination was detected during spectral analysis.


Substrate Assembly Process

• SMD equipment with standard feeders (blind pick!)

• Data collection

– Rotation of flip chips in pockets

– Mis-pick information

• Reflow on test PCBs

• Comparison of modules with control vs. tested flip chips


Pick and Place Test ResultsFlip-Chip Pick & Place #1 Pick & Place #2FDIZ - Tape 1 6.6% 0.0%FDIZ - Tape 2 10.0% 0.0%FDIZ - Tape 3 30.0% 0.0%FDIZ - Tape 4 13.0% 0.0%MFDS N/A 3.5%MSFB1-UP 0.0% N/AMSFB4-UP Tape 1 0.0% 5.0%MSFB4-UP Tape 2 0.0% 10.0%MSFB4-UP Tape 3 25.0% 5.0%MSFB4-UP Tape 4 0.0% 5.0%TC10 N/A 6.0%

*P&P #1 vacuum chuck was not optimized for small die and had difficulty picking up the FDIZ components.

*P&P #2 vision system was not optimized for large components and had difficulty “seeing” the large components.


Conclusions and Recommendations

• Use of standardized embossed tape & reel solves high volume/low cost transportation needs

• Must limit die movement to < 10 degrees to prevent die damage

• Carrier should be cleaned prior to use

• Existing SMT placement equipment is capable of blind picking flip chips from carrier tapes


Important Notice

Important NoticeBefore using this product, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liability associated with such use.

Warranty; Limited Remedy; Limited Liability3M’s product warranty is stated in its Product Literature available upon request. 3M MAKES NO OTHER WARRANTIES INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. If this product is defective within the warranty period stated above, your exclusive remedy shall be, at 3M’s option, to replace or repair the 3M product or refund the purchase price of the 3M product. Except where prohibited by law, 3M will not be liable for any loss or damage arising from this 3M product, whether direct, indirect, special, incidental or consequential regardless of the legal theory asserted.

3M is a trademark of 3M Company.

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