1. 2 system overview technology 3 established year 1999 factory size25,000 m2 employee1,100 capacity...
TRANSCRIPT
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System
Overview
Technology
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Established Year 1999
Factory Size 25,000 m2
Employee 1,100
Capacity 60,000 m2/month
Company Profile
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1999
Establish
2001
Nan You Plant
2002
• ISO9001
• UL E232940
2003
• Nan You Plant move to Sha Jing
• 20,000 m2/month
2004
24L Sample
2006
• SongGang Plant
• 40,000 m2/month
• TS16949• 18L MP• HDI • AL PCB
2007 2009 2010 2011
• ISO14001
• 5OZ with UL 32L Sample
• 6oz with UL, 12oz sample
• Rigid-Flex
2014
Start to Manufacture on Q3 for new plant
Milestone
He Shan Plant
2013
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JOVE Group
Jove Enterprise Limited(HK Registration)
Shenzhen Jove Enterprise Limited(Headquarter,NanYou)
Shenzhen Jove Enterprise Limited(ShaJing Plant on 2003)
Heshan Jove Enterprise Limited(HeShan Plant on 2013)
Shenzhen Jove Enterprise Limited(SongGang Plant on 2006)
Shenzhen Jove Enterprise LimitedSuzhou Branch (2011)
Group O-chart
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Director Bureau
GM
Marketing& Sales
FinanceEngineering
Vice GMQuality Vice GM
ManufactureVice GM
ProductEngineering
ManufactureEngineering
R&D Department
CustomerService
Plant QualityManagement
Quality System
ProductionDepartment
PPCDepartment
MaintenanceDepartment
HRDepartment
Material Control
Factory O-chart
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Quality Vice GM
Quality Director
CustomerService
Manager
Plant Quality Manager
Quality System Manager
CustomerService IQC
SystemManagementIPQC IPQA FQA MRB
PhysicalLab
Shipment
Quality O-chart
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◎ Meet all kinds of business types from sample to high mix low volume (HMLV) to high volume mass production.
◎ Invest the most up-to-date equipment/advanced technology to continuous
improvement on Multilayer/ Heavy copper/ HDI/ PTFE/ Ceramic/ Rigid-Flex.
R&D center look through technology trend on customer requirements and PCB industry field all the time.
◎ System automation management on Engineering review and process quality control and total factory operation.
◎ Quick turn delivery Prototype quantities: 24 hours to seven days Production quantities: 3 to 10 days
Market Strategy
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Annual Operation Plan (Year 2014)
◎ Sales’ goal to 95 millions USD
◎ Quality goal for rate of complaint
≤0.45% by batch,
≤95PPM by quantity;
◎ The rate of total internal scrap: ≤3.4%;
◎ The rate of delivery on time:
≥95% for normal PCB,
100% for VMI PCB.
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Our Customer
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Market Share
Remark: Statistic data are based on delivery location.
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Sales Turnover
M U
SD
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Marketing Segment
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Product by layer count
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R&D samples, small volume and quick turn jobs (High Mix Low Volume)
◎ Capacity: 20,000square meters/month
◎ R&D samples, small volume (below 5m2) and quick turn jobs
◎ High- mix technology up to 32 layers, HDI and heavy copper thickness boards to 12 oz
◎ 2000 projects/month
◎ Cam Engineer: 50
Capacity
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◎ Capacity: 40,000sqm/month
◎ Low/medium volume mass production high-mix technology multilayer up to 18 layers, HDI and heavy copper thickness to 6 oz
◎ 800 Part No/month
◎ Average 40 square meters/order
Capacity
Mass production
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A new factory will be established.
◎ Located on He Shan, Jiang Men city, Guang Dong province, China
◎ Factory area 100,000 square meters
◎ Total Investment: 80 Millions USD
◎ Marketing Direction:
First stage: 2-12 layers mass production
Second stage: focus on HDI, Heavy copper, PTFE, Ceramic,
Rigid-Flex PCB and industry fields
Second stage:
Investment: 50 Millions USD
Capacity: 50K SQM/month
First stage:
Investment: 30 Millions USD
Capacity: 50K SQM/month
Date: Finish factory house on Q2of 2014
Start to manufacture on Q3 of 2014
2014---2016 Developing Plan
Separate two stages to finish
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Layout Picture of New plant
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Technology
System
Overview
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Technology RoadmapItem 2014 2015 2016
MultilayerRigid PCB 34L 36L 40L
Rigid-flex PCB 12L 14L 16L
Al/Cu metal PCB 4L 8L 8L+
HDI 2+N+2 sample 2+N+2 Low volume 3+N+3 sample
Fine line 3/3mil 2.5/2.5mil 2/2mil
High Heat sink PCB FR4+Al/Cu FR4+Alloy metal FR4+other material
Buried Cu/magnetic Sample Low volume Mass production
Buried capacitor/resistor Sample Low volume Mass production
Heavy copper HDI(4-7OZ) Sample Low volume Mass production
IC substrate Sample Low volume Mass production
Low Dk /High Frequency/ high speed PCB
Sample Low volume Mass production
Mix constructionFR4+Rogers Low volume
FR4+PTFE sampleFR4+PTFE
Low volume
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◎ Material: FR-4 (Tg130-170)
ARLON
Rogers
Teflon
Aluminum Based
Polyimide
◎ High layer count (32+ layers)
◎ ROHS & Reach Compliance
◎ Min line/space: 2.5mil/3mil
◎ Min drilling bit 0.15mm, Laser drilling 0.1mm
◎ Backdrilling
Supplier Matreial Type Application
KB KB6160 SS/DS
ShengYiS1141/S1000/S1000-2 /S1600/S1155
SS/DS/Multilayer
ITEQ IT588TC/IT158TC/IT180TC SS/DS/Multilayer
Isola FR406/FR-370HR SS/DS/Multilayer
Nelco N4xxx-13RF-xx SS/DS/Multilayer
Rogers R04350B SS/DS/Multilayer
Bergquist MP06503 SS Al base
Laird T-Lam SS 1KA DS Al/Cu base
Normal material list with UL approval
Products Technology
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Products Technology
◎Surface Treatment:
◇In-house:
Lead free HAL / OSP / Immersion Ni, Au / Gold finger /
Selected hard gold
◇Subcontract:
Immersion Silver / Immersion Tin / HAL
◎ Sequential lamination
◎ Buried and blind via and HDI
◎ Heavy Copper PCB’s Up to 6oz with UL,12oz for sample
◎ Controlled Impedance
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Item Sample Standard
Layer count 32L 18L
Final board thickness 0.3-6mm 0.35-6mm
Aspect rate 12:1 8:1
Copper thickness 12oz 6oz
Impedance Single line +/-8% +/-10%
Differential line +/-8% +/-10%
Line/space Inner layer 2.5/2.5mil 3/3mil
Outer layer 3/3mil 3/3mil
Min drill bit 6mil 8mil
Hole position tolerance +/-3mil +/-3mil
PTH hole dimension tolerance +/-2mil +/-3mil
NPTH hole dimension tolerance +/-1mil +/-2mil
Solder mask Line to solder PAD 3mil 4mil
Registration tolerance +/-1.5mil +/-2mil
Production Capability
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Peel able mask thickness 5mil
Carbon ink thickness 0.3mil
HAL/LF HAL thicknessSMD:40-2000u”
GND:30-800u”
Immersion Au Au 1-5u”
Ni 80-200u”
Gold finger thickness 10-50u”
OSP thickness 0.1-0.6um
Immersion Tin 0.8-1.2um
Immersion Ag 0.15-0.45um
ProfilePunching +/-5mil
Routing +/-4mil
Lamination Type
FR4(Tg130-170)
Halogen free lamination
Rogers/Teflon/Aluminum base/Polyimide
Production Capability
Product Type---Heavy Copper
Layer: 18LInner/Outer:4ozBoard thickness: 4.0mm
Layer: 4LInner:12oz+1mm Cu baseOuter: 3ozBoard thickness: 2.5mm
Layer: 10LInner/Outer: 6ozBoard thickness: 3.2mm
Layer: 12LInner/Outer: 4ozBoard thickness: 2.85mm
Layer: 14LInner: 3ozOuter: 2ozBoard thickness: 3.3mm
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Power model LED model
Product Type---Al base PCB
27Bottom面
TOP面
Rogers +FR4
Product Type---Buried copper & Mix construction
Buried copper Mix construction
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Product Type---Rigid-flex PCB
2L Rigid-flex PCBBoard thickness: 1.6mm
4L Rigid-flex PCBBoard thickness: 1.6mm
6L Rigid-flex PCBBoard thickness: 0.7mm
Product Type---Other
16L blind hole PCB10L HDI PCB/hole size 0.1mm
Semi-flex. PCB 14L backplane PCB/size: 664x800mmBoard thickness: 5.2mm
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Backdrilling
Product Type---OtherVia plugged by copper paste Via plugged by silver paste
Via plugged by resin
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Base material: ShengYi and ITEQ and Isola and NelcoPTH solution: Rohm & Haas Plating solution: Rohm & Haas SM: Taiyo and GreencureSurface finish: Atotech solution on Immersion Tin Japanese SN100(Sn/Cu/Ni) on LF HASL Material
MachineMethod
•Add test coupon (Registration and Micro resistance) on production panel to control quality of critical process.•High process control on PTH and plating process. Backlight: one sample every fly bar to inspect Copper thickness: one sample every fly bar to measure
2 automatic coating machines for inner layer1 OPE punching machine before laminate5 CCD parallel exposure machines 1 CCD fuse machine5 Orbotech AOI machines, total 11 AOI.8 lamination machines, including 1 fast press 11 Schmoll drill machines/10 Mania machines, total 29 machines/154 spindles2 X- RAY CM 800 for inspection after drilling2 automatic PTH lines5 automatic plating lines( including VCP)22 CNC routing machines1 Automatic V-CUT machine37 E-testes: 12 flying probes, including 3 micro resistance testers, 18 E-testers, 3automatic E- tester, 6 Hi-pot testers, 2 automatic visual inspection machine on FQC33 automatic horizontal production lines
1 CMI 900 tester/ 2 CMI 700 testers/ 2 CMI 500 testers2 Ionic contamination testers, one is to test NaCl content, other is to test content of single ionic1 DSC TG tester/1 ROHS tester/2 Hi-pot testers2 Impedance testers/ 2 Peel strength testers1 Temperature and humidity chamber1 Salt-corrosion box1 Reflow soldering machine1 Atom absorption tester
High Reliability Products
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Laminate machineCCD fuse machine
Key Production Equipment
Automatic coating machine CCD parallel expose machine OPE Pin punching machine
X-ray drilling Tooling hole
33Automatic plating line
Automatic PTH lineSCHMOLL drilling machine
Vertical continue plating line(VCP) Acid etching line
Fast laminate machine
Key Production Equipment
34Gold finger line
Alkaline etching line CCD exposure machinePrint machine for via plug
Immersion Au line
Key Production Equipment
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AOI
Automatic E-test
Visual inspection machine(AVI)
Fly probe
Line&space tester
Key Inspection Equipment
36Reflow machine
Key Reliability Testing Equipment
Ionic contamination Impedance
DSC Tg tester ROHS tester
Temp/Humidity Chamber
Reliability Testing ◎100% E-TEST ◎100% Visual Inspection ◎Outline measurement ◎Micro section ◎Solder ability (245±5ºC; 3-5 sec) ◎Thermal shocking (288±5ºC,10 sec. 3times) ◎Solder mask peeling testing ◎Peeling intensity testing ◎Impedance testing ◎Ionic contamination testing ◎Reflow test ◎DSC Tg tester ◎ROHS ◎Temp& Humidity test
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Technology
System
Overview
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Certificate
System certificate:
◎ ISO9001:2008
◎ ISO14001:2004
◎ TS16949:2009
Product certificate:
◎ UL File NO.: E232940
ROHS+REACH Test Reports:
◎ SGS File NO.:CANEC 0905975001
◎ SGS File NO.:CANEC 0905975002
◎ SGS File NO.:CANEC 1002801201
◎ REACH File NO.:GZ1005046849/CHEM
◎ REACH File NO.:GZ1005046850/CHEM
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ISO9001:2008 certificate ISO14001:2004 certificate
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TS16949:2009 certificate UL certificate
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Environment Protection
◎ ISO 14001 Certified◎ Guangdong Environmental Protection Member◎ All control items meet Class 1 of GB SPEC on Waste Water Discharge
Test report From Government
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System Automation
Quotation
Engineering Review For Gerber File
Information System For Quality Control
Management System
Intelligent Quote
Genesis Panelizer Enginex
Quality Information
System
Paradigm
ERP
Main FunctionProcess Flow Software System
• Quotation Automation
• Quotation Track/Analysis
• Gerber File Review Automation
• Panelization Automation
• Match Automation on Plant Capability and Customer specification
• MI Automation and Standard
• Database
• Process Parameter/Production Record/Quality/Maintenance data• Traceability• Quality Data Analysis
• Manage all processes From order to WIP to delivery• Traceability• Database
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Award
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Thanks
Jove , your reliable PCB solution provider