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10 MEMS Products & Case Histories

•Ken Gilleo PhD•ET-Trends LLC

92%

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Newer

OLD

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Silicon Load Cell for Loads up to 1000 kg

Silicon Load Cell for Loads up to 1000 kg

An array of capacitors is used instead of a single capacitor to compensate for nonhomogeneous force distributions.

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Micro fluid handling systems

By sensing the pressure drop over a fixed hydraulic resistance with use of pressure sensors, the flow through the shunt resistor can be obtained.

The monolithic sensor consists of two capacitive read-out pressure sensors, connected by a resistance channel.

Because two pressure sensors are used (relative to atmospheric pressure) the sensor can be used both to measure flow-rate as well as pressure

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20020102004 - Knowles

From variousKnowles articles on web

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InfineonInfineon

The microphone consists of two chips, the MEMS chip and an application-specific integrated circuit (ASIC), both of which share the same package on a surface-mounted device. The MEMS consists of a rigid, perforated back electrode and a flexible silicon membrane that serves as a capacitor, transforming acoustic pressure waves into capacitive variations. The ASIC detects these variations, converts them into electrical signals and passes them to the appropriate processing devices, such as a baseband processor or amplifier.

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MEMS MicrophonesMEMS Microphones

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QFN Package

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Session SummarySession Summary• MEMS Mfgs. pioneered packaging

Inertial sensors

Pressure sensors

Ink jets

Microphones

• Most attempt to stay within infrastructure

• MEMS packing vendors are emerging

• No clear trend for packaging outsourcing

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12 Summary & Future

•Ken Gilleo PhD•ET-Trends LLC

98%

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MarketsMarkets

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Top MEMS Co’sTop MEMS Co’s

Much of HP’s MEMS is simple ink jet chips with no moving parts.

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MOEMSMkt.

MOEMSMkt.

By region

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TrendsTrends• New MEMS startups will be fabless

• More MEMS good fab services

• More reuse MUMPS standards

Existing libraries

• Packaging Still custom designed by MEMS device designer

Some use of MEMS-specific packagers

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Final SummaryFinal Summary

• Adding motion to chips is a very big deal

• MEMS: a top technology for 21st century

• MEMS: long lifetime (beyond silicon electronics)

• MEMS and Nano are compatible, synergistic

• MEMS: greatest packaging challenge

• MEMS packaging should work for nano